2sa0719, 2sa0720

Download as pdf or txt
Download as pdf or txt
You are on page 1of 5

Transistors

2SA0719, 2SA0720 (2SA719, 2SA720)


Silicon PNP epitaxial planar type

For low-frequency power amplification and driver amplification Unit: mm


Complementary to 2SC1317, 2SC1318 5.0±0.2 4.0±0.2

5.1±0.2
■ Features
• Complementary pair with 2SC1317 and 2SC1318

0.7±0.2
0.7±0.1
■ Absolute Maximum Ratings Ta = 25°C

12.9±0.5
Parameter Symbol Rating Unit
Collector-base voltage 2SA0719 VCBO −30 V
(Emitter open) 2SA0720 −60 0.45+0.15
–0.1 0.45+0.15
–0.1

Collector-emitter voltage 2SA0719 VCEO −25 V 2.5+0.6


–0.2 2.5+0.6
–0.2

(Base open) 2SA0720 −50


1 2 3 1: Emitter
Emitter-base voltage (Collector open) VEBO −5 V 2: Collector

2.3±0.2
3: Base
Collector current IC −500 mA EIAJ: SC-43A
Peak collector current ICP −1 A TO-92-B1 Package

Collector power dissipation PC 625 mW


Junction temperature Tj 150 °C
Storage temperature Tstg −55 to +150 °C

■ Electrical Characteristics Ta = 25°C ± 3°C


Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage 2SA0719 VCBO IC = −10 µA, IE = 0 −30 V
(Emitter open) 2SA0720 −60
Collector-emitter voltage 2SA0719 VCEO IC = −10 mA, IB = 0 −25 V
(Base open) 2SA0720 −50
Emitter-base voltage (Collector open) VEBO IE = −10 µA, IC = 0 −5 V
Collector-base cutoff current (Emitter open) ICBO VCB = −20 V, IE = 0 − 0.1 µA
Forward current transfer ratio hFE1 * VCE = −10 V, IC = −150 mA 85 340 
hFE2 VCE = −10 V, IC = −500 mA 40 
Collector-emitter saturation voltage VCE(sat) IC = −300 mA, IB = −30 mA − 0.35 − 0.60 V
Base-emitter saturation voltage VBE(sat) IC = −300 mA, IB = −30 mA −1.1 −1.5 V
Transition frequency fT VCB = −10 V, IE = 50 mA, f = 200 MHz 200 MHz
Collector output capacitance Cob VCB = −10 V, IE = 0, f = 1 MHz 6 15 pF
(Common base, input open circuited)
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank Q R S
hFE1 85 to 170 120 to 240 170 to 340

Note) The part numbers in the parenthesis show conventional part number.

Publication date: January 2003 SJC00002CED 1


2SA0719, 2SA0720

PC  Ta IC  VCE IC  I B
800 −1 200 −800
Ta = 25°C VCE = −10 V
Ta = 25°C
−700
Collector power dissipation PC (mW)

700
−1 000
−600

Collector current IC (mA)

Collector current IC (mA)


600
−800
500 IB = −1.0 mA −500
− 0.9 mA
− 0.8 mA
400 −600 − 0.7 mA −400
− 0.6 mA
− 0.5 mA
300 − 0.4 mA −300
−400
− 0.3 mA
200 −200
− 0.2 mA
−200
100 − 0.1 mA −100

0 0 0
0 20 40 60 80 100 120 140 160 0 −2 −4 −6 −8 −10 −12 0 −2 −4 −6 −8 −10
Ambient temperature Ta (°C) Collector-emitter voltage VCE (V) Base current IB (mA)

VCE(sat)  IC VBE(sat)  IC hFE  IC


−10 −100 600
IC / IB = 10 IC / IB = 10
Collector-emitter saturation voltage VCE(sat) (V)

VCE = −10 V
Base-emitter saturation voltage VBE(sat) (V)

500

Forward current transfer ratio hFE


−1 −10
400
Ta = 75°C
25°C
25°C
− 0.1 −1 Ta = −25°C 300
75°C Ta = 75°C
−25°C
200 25°C
−25°C
− 0.01 − 0.1
100

− 0.001 − 0.01 0
−1 −10 −100 −1 000 −1 −10 −100 −1 000 − 0.01 − 0.1 −1 −10
Collector current IC (mA) Collector current IC (mA) Collector current IC (A)

fT  I E Cob  VCB VCER  RBE


240 50 −120
C (pF)

VCB = −10 V IE = 0 IC = −2 mA
Ta = 25°C f = 1 MHz Ta = 25°C
(V)
(Common base, input open circuited) ob

200 Ta = 25°C −100


Transition frequency fT (MHz)

40
(Resistor between B and E) VCER

160 −80
30
Collector-emitter voltage
Collector output capacitance

120 −60
2SA0720
20
80 −40

2SA0719
10
40 −20

0 0 0
1 10 100 −1 −10 −100 1 10 100 1 000
Emitter current IE (mA) Collector-base voltage VCB (V) Base-emitter resistance RBE (kΩ)

2 SJC00002CED
2SA0719, 2SA0720

ICEO  Ta Safe operation area


104 −10
VCE = −10 V Single pulse
Ta = 25°C

ICP
−1 t = 10 ms

Collector current IC (mA)


103 IC
t=1s
ICEO (Ta = 25°C)
ICEO (Ta)

102 − 0.1

10 − 0.01

1 − 0.001
0 40 80 120 160 200 − 0.1 −1 −10 −100
Ambient temperature Ta (°C) Collector-emitter voltage VCE (V)

SJC00002CED 3
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteris-
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-
tual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
ments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.

2002 JUL
This datasheet has been download from:

www.datasheetcatalog.com

Datasheets for electronics components.

You might also like