Snlu 231 S

User's Guide
SNLU231 – November 2017
DP83TC811EVM User’s Guide
This User’s Guide discusses how to properly operate and configure the DP83TC811EVM. For best layout
practices, schematic files, and Bill of Materials, see the associated support documents.
SNLU231 – November 2017 DP83TC811EVM User’s Guide 1

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Copyright © 2017, Texas Instruments Incorporated
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Contents
1 Definitions .................................................................................................................... 3
2 Introduction ................................................................................................................... 4
3 Board Setup Details ........................................................................................................ 10
4 Firmware Configuration ................................................................................................... 13
5 Schematics .................................................................................................................. 16
6 Layout ........................................................................................................................ 24
7 Bill of Materials ............................................................................................................. 35
List of Figures
1 DP83TC811EVM – Top Side............................................................................................... 5
2 DP83TC811EVM – Bottom Side .......................................................................................... 6
3 Onboard Supply Connection and Jumpers .............................................................................. 7
4 Enable and Wake Control ................................................................................................. 9
5 DP83TC811EVM Block Diagram......................................................................................... 10
6 MSP430 Launchpad Spy-Bi-Wire Connection Points ................................................................ 13
7 Jumper Positions .......................................................................................................... 13
8 DP83TC811EVM Spy-Bi-Wire Connection Points .................................................................... 14
9 LED on Both Top and Bottom of DP83TC811EVM ................................................................... 15
10 LED D14 Both Green and Red .......................................................................................... 15
11 DP83TC811 Main Block ................................................................................................... 16
12 DP83TC811 Main Power .................................................................................................. 17
13 DP83TC811 AFE ........................................................................................................... 18
14 DP83TC811 Interface...................................................................................................... 19
15 DP83TC811 COMs ........................................................................................................ 20
16 DP83TC811 COMs #1..................................................................................................... 21
17 DP83TC811 COMs #2..................................................................................................... 22
18 DP83TC811 Hardware .................................................................................................... 23
19 Top Overlay ................................................................................................................. 24
20 Top Layer Mask ............................................................................................................ 25
21 Top Layer ................................................................................................................... 26
22 Signal Layer 2 .............................................................................................................. 27
23 Signal Layer 3 .............................................................................................................. 28
24 Signal Layer 4 .............................................................................................................. 29
25 Bottom Layer................................................................................................................ 30
26 Bottom Layer Mask ........................................................................................................ 31
27 Bottom Overlay ............................................................................................................. 32
28 Top Assembly............................................................................................................... 33
29 Bottom Assembly ........................................................................................................... 33
30 Drill Drawing ................................................................................................................ 34
31 Board Dimensions .......................................................................................................... 34
List of Tables
1 Terminology .................................................................................................................. 3
2 DP83822 Bootstrap Resistor Designation and Suggested Bootstrap Resistor Values .......................... 11
3 DP83TC811 Bootstrap Resistor Designation and Suggested Bootstrap Resistor Values ....................... 11
4 Bill of Materials ............................................................................................................. 35
2 DP83TC811EVM User’s Guide SNLU231 – November 2017

www.ti.com Definitions
Trademarks
All trademarks are the property of their respective owners.
1 Definitions
Table 1. Terminology
ACRONYM DEFINITION
PHY Physical Layer Transceiver
MAC Media Access Controller
SMI Serial Management Interface
MDIO Management Data I/O
MDC Management Data Clock
RGMII Reduced Gigabit Media Independent Interface
SFD Start-of-Frame Detection
VDDA Analog Core Supply Rail
VDDIO Digital Supply Rail
PD Pulldown
PU Pullup

Introduction www.ti.com
2 Introduction
The DP83TC811EVM supports 100-Mbps speed and is EEE 802.3bw compliant. This evaluation board is
a media converter to enable bit-error rate testing, interoperability testing and PMA compliance. There is an
onboard MSP430F5529 for use with the USB-2-MDIO graphical user interface tool. A DP83822HF is
provided for copper (100BASE-TX) support.
2.1 Key Features

• Media Converter: 100BASE-T1 to 100BASE-TX
• IEEE802.3bw Compliant
• IEEE802.3u Compliant
• RGMII Back-to-Back Configuration
• Onboard MSP430F5529
– eZ-FET Debugger
– USB-2-MDIO Support
– 4-Pin Dip Switch
• Autonomous and Managed Mode Operation
• Status LEDs
– DP83TC811
• Link
• Link + Activity
– DP83822
• Link
• Milti-LED
– Power
– SMI Command
• Variable I/O Voltage Range: 1.8-V, 2.5-V, and 3.3-V
• 4-Level Bootstraps for Hardware Configuration
• 100BASE-T1 Error Free Data transfer Over 60 Meters
• 100BASE-TX Error Free Data Transfer Over 150 Meters on CAT5 Cable

www.ti.com Introduction
Figure 1. DP83TC811EVM – Top Side

Figure 2. DP83TC811EVM – Bottom Side

2.2 Operation – Quick Setup
2.2.1 Onboard Power Supply Operation

• EVM can operate from a single DC supply connected to either turret or barrel jack connector
– Wide Vin: 20-V to 5-V
• Place shunt at U8 header in ON position to enable U8 LDO
• Place shunt at U9 header in ON position to enable U9 LDO
Figure 3. Onboard Supply Connection and Jumpers
• DP83TC811 Onboard Power

– Place shunt at J20 to enable onboard VDDA
– Place shunt at J16 to enable onboard VDDIO
– When power is properly supplied, the LED’s for VDDA and VDDIO will light up
• DP83822 Onboard Power
– Place shunt at J21 to enable onboard AVD
– Place shunt at J19 to enable onboard VDDIO
– When power is properly supplied, the LEDs for AVD and VDDIO will light up
Notes:
• Only populate J25 when powering over USB
• This header has a 5-V maximum limit
2.2.2 External Power Supply Operation

• Place shunt at U8 header in OFF position to disable U8 LDO
• Place shunt at U9 header in OFF position to disable U9 LDO
• DP83TC811 External Power
– Remove shunt at J20 to disable onboard VDDA
– Remove shunt at J16 to disable onboard VDDIO
– Connect 3.3-V to AV-IN on J20
– Connect 1.8-V, 2.5-V, or 3.3-V to IO-IN on J16
– Connect ground to GND turret

• DP83822 External Power

– Remove shunt at J21 to disable onboard AVD
– Remove shunt at J19 to disable onboard VDDIO
– Connect 3.3-V to AV-IN on J21
– Connect 1.8-V, 2.5-V, or 3.3-V to IO-IN on J19
– Connect ground to GND turret
2.2.3 Master and Slave Mode Selection – DP83TC811

• Master Mode
– Place shunt across pins 1 and 2 at LED_0
• Slave Mode
2.2.4 Managed and Autonomous Mode Selection – DP83TC811

• Managed Mode
• Autonomous Mode
Notes:
• J4 is connected to LED_1. This SMB can be used for any GPIO features supported by LED_1
• Remove Shunt on LED_1 to use SMB connector
2.2.5 SMI Connection

• To connect DP83TC811 and DP83822 to the MSP430
– Place shunt across pins 1 and 2 for MDC on J9
– Place shunt across pins 3 and 4 for MDIO on J9
2.2.6 Enable Mode – DP83TC811

• PHY Enabled
– Place shunt in ‘PU’ position at EN header shown in Figure 4
– Figure 4 shows the shunt position for the PHY in ENABLED mode
• PHY Disabled
– Place shunt in ‘PD’ position at EN header shown in Figure 4
2.2.7 Sleep Mode – DP83TC811

• PHY Awake
– Place shunt in ‘PU’ position at WAKE header shown in Figure 4
– Figure 4 shows the shunt position for the PHY in WAKE mode
• PHY Asleep
– Place shunt in ‘PD’ position at WAKE header shown in Figure 4

Figure 4. Enable and Wake Control
2.2.8 Cable Assembly

• Plug a CAT5, CAT5E, or CAT6 cable into the RJ45 connector (J8)
– Connect the far-end of the Ethernet cable to a 100BASE-TX capable PHY
• Plug a MatENET cable assembly into the B-type automotive connector (J7)
– Connect the far-end of the automotive cable to a 100BASE-T1 capable PHY
2.2.9 LED Indication

• Look for LED_0 and LED_1 to illuminate when a link is successfully established
• Look for Green LED to illuminate on the RJ45 (J8) when a link is successfully established
• Look for Yellow LED to illuminate on the RJ45 (J8) when speed is at 100 Mbps
• LED_1 will blink for TX/RX activity

Board Setup Details www.ti.com
3 Board Setup Details
3.1 Block Diagram
RJ45 DP83TC811EVM
External Media Converter
Supply
VDDA 3.3 V
LDO 1.8 V AVD
VDDIO 3.3 V
DP83822
LDO 2.5 V
VDDIO
1.8 V
External
Supply
TX_CTRL / RX_CTRL
TX_CLK / RX_CLK
TX_D0 / RX_D0
TX_D1 / RX_D1
TX_D2 / RX_D2
TX_D3 / RX_D3
MDC
MSP430F5529 USB
MDIO (USB-2-MDIO)
External
Supply
VDDA 3.3 V
VDDA
LDO
LED_LINK
3.3 V LED_ACT
VDDIO DP83TC811
LDO 2.5 V DUT
CLKOUT
VDDIO
1.8 V (SMB)
External 25-MHz Ext CLK

Supply Crystal (SMB)
MatENET
Figure 5. DP83TC811EVM Block Diagram
3.2 Serial Management Interface

The DP83TC811EVM supports SMI (MDIO/MDC) through J9 and includes an onboard MSP430F5529 for
USB-2-MDIO control.
Notes:
• DP83TC811 default PHY_ID is 0
• DP83822 default PHY_ID is 1
• PHY IDs can be changed through bootstrap options found in the data sheet

www.ti.com Board Setup Details
3.3 Configuration Options
3.3.1 Bootstrap Options

Some DP83TC811 and DP83822 configurations can be done through bootstrap options. Options can be
selected with jumpers or resistor population. Refer to the data sheets for bootstrap options and the
schematic and layout sections of this User’s Guide for resistor locations.
Table 2. DP83822 Bootstrap Resistor Designation and Suggested Bootstrap Resistor Values
PU RESISTOR PU RESISTOR PD RESISTOR PD RESISTOR
PIN NAME PIN NUMBER STRAP MODE
(KΩ) DESIGNATION (KΩ) DESIGNATION
1 OPEN 1.96
2 13 1.96
RX_ER 28 R24 R26
3 6.20 1.96
4 OPEN OPEN
1 OPEN 1.96
2 13 1.96
CRS 27 R25 R28
3 6.20 1.96
4 OPEN OPEN
Table 3. DP83TC811 Bootstrap Resistor Designation and Suggested Bootstrap Resistor Values
PU RESISTOR PU RESISTOR PD RESISTOR PD RESISTOR
PIN NAME PIN NUMBER STRAP MODE
(KΩ) DESIGNATION (KΩ) DESIGNATION
1 OPEN OPEN
2 10.20 2.49
RX_D0 26 R36 R43
3 5.76 2.49
4 2.49 OPEN
1 OPEN OPEN
2 10.20 2.49
RX_D1 25 R37 R44
3 5.76 2.49
4 2.49 OPEN
1 OPEN OPEN
2 10.20 2.49
RX_D2 24 R38 R45
3 5.76 2.49
4 2.49 OPEN
1 OPEN OPEN
2 10.20 2.49
RX_ER 14 R35 R42
3 5.76 2.49
4 2.49 OPEN
1 OPEN OPEN
2 10.20 2.49
RX_DV 15 R34 R41
3 5.76 2.49
4 2.49 OPEN
1 OPEN 2.49
LED_0 35 R30 R39
4 2.49 OPEN
1 OPEN 2.49
LED_1 6 R31 R40
4 2.49 OPEN

Board Setup Details www.ti.com
3.3.2 Clock Configuration

• Onboard Clock
– The onboard clock is enabled by default
– If disabled:
• Populate Y2, R72, R73, C35, and C36 with their respective values from the schematic
• Remove R70 if populated
– By default, a 25-MHz clock output can be viewed using the CLKOUT SMA
• External Clock
– Remove R72 and R73
– Populate R70 with a 0-Ω resistor
– Use the SMA labeled EXT_CLK to input the external clock source
– By default, a 25-MHz clock output can be viewed using the CLKOUT SMA
3.3.3 JTAG
• Use J3 for JTAG access to the DP83TC811

www.ti.com Firmware Configuration
4 Firmware Configuration
4.1 eZ-FET Firmware

• MSP430F5529 Launchpad Configuration
– Remove all shunts from the Isolation Jumper Block interfacing with the eZ-FET section
– On the eZ-FET side of the Isolation Jumper Block, place Spy-Bi-Wire on the pins for RST, TST, and
GND, as highlighted in Figure 6
– Power up the MSP430 Launchpad
Figure 6. MSP430 Launchpad Spy-Bi-Wire Connection Points
• DP83TC811EVM Configuration
– Jumper Positions
• Place shunt across pins 1 and 2 on J23
• Remove shunt from J26
• Place shunt on J25
Figure 7. Jumper Positions

Firmware Configuration www.ti.com
– Power up the DP83TC811EVM to no more than 5 V

– To connect the Spy-Bi-Wire from the MSP4030 Launchpad:
• Make sure the MSP430 Launchpad is powered on
• Connect RST to pin 1 on J27
• Connect TST to pin 3 on J27
• Connect GND to either pin 2 or pin 4 on J27
Figure 8. DP83TC811EVM Spy-Bi-Wire Connection Points
• Flash the eZ-FET firmware by running the file Flash_eZ-FET_DP83TC811EVM.bat

• Remove the Spy-Bi-Wire from the DP83TC811EVM
• Remove power from the DP83TC811EVM (and the MSP430 Launchpad if desired)
4.2 MSP430F5529 Firmware

• Remove shunt from J25 and store across GND terminals on J27 (pins 2 and 4)
• Plug a USB cable into the DP83TC811EVM
• Check for the correct LED indication
– One green LED on the top of the board, as in Figure 9
– One green LED on the bottom of the board, as in Figure 9
– If either LED is not turned on or is the wrong color
• Power down the DP83TC811EVM
• Remove shunt from J27
• Place shunt on J25
• Repeat steps for eZ-FET Firmware and then try MSP430 Firmware again.

www.ti.com Firmware Configuration
Figure 9. LED on Both Top and Bottom of DP83TC811EVM
• Flash the MSP430 firmware by running the file Flash_MSP430_DP83TC811EVM.bat

• Remove power from the DP83TC811EVM
• Firmware flash is successful if LED D14 is both red and green after reboot, as in Figure 10
Figure 10. LED D14 Both Green and Red

Schematics www.ti.com
5 Schematics
5.1 Main Block Schematic
Figure 11. DP83TC811 Main Block

www.ti.com Schematics
5.2 Main Power Schematic
Figure 12. DP83TC811 Main Power

5.3 Analog Front-End Schematic
Figure 13. DP83TC811 AFE

5.4 Interface Schematic
Figure 14. DP83TC811 Interface

5.5 COMs Schematic
Figure 15. DP83TC811 COMs

5.6 COMs #1 Schematic
Figure 16. DP83TC811 COMs #1

5.7 COMs #2 Schematic
Figure 17. DP83TC811 COMs #2

5.8 Hardware Schematic
Figure 18. DP83TC811 Hardware

Layout www.ti.com
6 Layout
6.1 Top Overlay
Figure 19. Top Overlay

www.ti.com Layout
6.2 Top Layer Mask
Figure 20. Top Layer Mask

Layout www.ti.com
6.3 Top Layer
Figure 21. Top Layer

www.ti.com Layout
6.4 Signal Layer 2
Figure 22. Signal Layer 2

Layout www.ti.com
6.5 Signal Layer 3

www.ti.com Layout
6.6 Signal Layer 4

Layout www.ti.com
6.7 Bottom Layer
Figure 25. Bottom Layer

www.ti.com Layout
6.8 Bottom Layer Mask
Figure 26. Bottom Layer Mask

Layout www.ti.com
6.9 Bottom Overlay
Figure 27. Bottom Overlay

www.ti.com Layout
6.10 Board Assembly
Figure 28. Top Assembly
Figure 29. Bottom Assembly

Layout www.ti.com
Figure 30. Drill Drawing
Figure 31. Board Dimensions

www.ti.com Bill of Materials
7 Bill of Materials
Table 4. Bill of Materials

DESIGNATOR QUANTITY VALUE DESCRIPTION PART NUMBER MANUFACTURER
C2, C44, C50 3 1 µF CAP, CERM, 1 µF, 16 V, +/- 10%, X5R, 0805 GRM216R61C105KA88D MuRata
C3, C4 2 0.1 µF CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0603 GCM188R71H104KA57D MuRata
CAP, CERM, 4700 pF, 2000 V, +/- 10%, X7R,
C5 1 4700 pF C1210C472KGRACTU Kemet
1210
C6, C8, C10, C12 4 1 µF CAP, CERM, 1 µF, 10 V, +/- 10%, X7S, 0402 C1005X7S1A105K050BC TDK
C7, C9, C11, C13, C53, C56,
C57, C64, C65, C66, C73, C74, 15 0.1 µF CAP, CERM, 0.1 µF, 16 V, +/- 10%, X7R, 0402 GRM155R71C104KA88D MuRata
C84, C85, C86
CAP, CERM, 4700 pF, 2000 V, +/- 10%, X7R,
C14 1 4700 pF 1812GC472KAT1A AVX
1812
CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0,
C15, C20, C24, C29 4 100 pF CGA2B2C0G1H101J050BA TDK
AEC-Q200 Grade 1, 0402
CAP, CERM, 1000 pF, 50 V, +/- 5%, C0G/NP0,
C19, C23, C28, C32, C37 5 1000 pF CGA2B2C0G1H102J050BA TDK
C21, C30, C39, C41, C43, C47, CAP, CERM, 10 µF, 25 V, +/- 20%, X7R, AEC-
7 10 µF CGA6P1X7R1E106M250AC TDK
C49 Q200 Grade 1, 1210
CAP, CERM, 0.01 µF, 50 V, +/- 10%, X7R, AEC-
C22, C31, C38 3 0.01 µF CGA2B3X7R1H103K050BB TDK
Q200 Grade 1, 0402
CAP, CERM, 22 pF, 50 V, +/- 5%, C0G/NP0,
C33, C34, C35, C36 4 22 pF CGA3E2C0G1H220J080AA TDK
CAP, CERM, 22 µF, 16 V, +/- 20%, X7R, AEC-
C40, C42, C48 3 22 µF CGA6P1X7R1C226M250AC TDK
Q200 Grade 1, 1210
CAP, CERM, 2.2 µF, 16 V, +/- 20%, X7S, AEC-
C54 1 2.2 µF CGA3E1X7S1C225M080AC TDK
Q200 Grade 1, 0603
C55 1 4.7 µF CAP, TA, 4.7 µF, 35 V, +/- 10%, 1.3 ohm, SMD 293D475X9035D2TE3 Vishay-Sprague
CAP, CERM, 22 pF, 50 V, +/- 5%, C0G/NP0,
C58, C59, C60, C61, C62, C63 6 22 pF C1005C0G1H220J050BA TDK
0402
CAP, CERM, 33 pF, 50 V, +/- 5%, C0G/NP0,
C67, C75 2 33 pF C1005C0G1H330J050BA TDK
0402
C68, C71, C78, C82 4 0.22 µF CAP, CERM, 0.22 µF, 50 V, +/- 10%, X5R, 0603 C1608X5R1H224K080AB TDK
C69 1 0.47 µF CGA3E3X7R1H474K080AB TDK
Q200 Grade 1, 0603
CAP, CERM, 1000 pF, 50 V, +/- 5%, C0G/NP0,
C70, C80 2 1000 pF C1005NP01H102J050BA TDK
0402
C72, C83 2 10 µF CAP, TA, 10 µF, 35 V, +/- 10%, 0.125 ohm, SMD TPSD106K035R0125 AVX
CAP, CERM, 10 pF, 50 V, +/- 5%, C0G/NP0,
C76, C77, C87, C88 4 10 pF CGA3E2NP01H100D080AA TDK
0603

Bill of Materials www.ti.com
Table 4. Bill of Materials (continued)

C79 1 0.47 µF CAP, CERM, 0.47 µF, 50 V, +/- 10%, X6S, 0603 C1608X6S1H474K080AB TDK
C81 1 4.7 µF CAP, CERM, 4.7 µF, 35 V, +/- 10%, X5R, 0603 C1608X5R1V475K080AC TDK
D1, D2, D3, D4, D6, D7, D8, D9,
10 Green LED, Green, SMD QTLP630C4TR Everlight
D11, D13
D5, D10 2 60 V Diode, Schottky, 60 V, 1 A, AEC-Q101, SMA NRVBA160T3G ON Semiconductor
D12 1 Orange LED, Orange, SMD SML-P12DTT86 Rohm
D14, D15, D16 3 Rg LED, Rg, SMD HSMF-C165 Avago
F1 1 Fuse, 3 A, 32 VDC, SMD F0603E3R00FSTR AVX
J1, J27 2 Header, 100 mil, 2x2, Gold, TH TSW-102-07-G-D Samtec
J2, J9 2 Header, 100 mil, 3x2, Gold, TH TSW-103-07-G-D Samtec
J3 1 Header(shrouded), 2mm, 7x2, Tin, SMT 87832-1420 Molex
J4, J11, J12 3 JACK, SMB 50 Ohm, TH 903-499J-51P2 Amphenol RF
J5, J6, J18, J22, J23 5 Header, 100 mil, 3x1, Gold, TH TSW-103-07-G-S Samtec
J7 1 Header(shrouded), 6 Power, 2 Signal, TH 0-2290024-1 TE Connectivity
Connector, RJ-45 with integrated magnetics, 1x1,
J8 1 J3011G21DNL Pulse Engineering
Gold, R/A, SMT
J10, J16, J19, J20, J21, J25, J26 7 Header, 100 mil, 2x1, Gold, TH TSW-102-07-G-S Samtec
J13, J15, J17 3 Double Terminal, Turret, TH, Double 1502-2 Keystone
J14 1 Power Jack, 2 mm, R/A, TH TH PJ-037AH CUI Inc.
Connector, Receptacle, Micro-USB Type AB, R/A,
J24 1 0475890001 Molex
Bottom Mount SMT
Coupled inductor, 200 µH, 4.5 ohm, AEC-Q200
L1 1 200 µH DLW43MH201XK2L MuRata
Grade 2, SMD
RES, 2.21k, 0.1%, 0.1 W, AEC-Q200 Grade 0,
R1, R2, R64, R69 4 2.21k TNPW06032K21BEEA Vishay-Dale
0603
R3, R4, R5, R6, R7, R8, R9,
R12, R13, R14, R15, R16, R17,
R20, R21, R22, R23, R29, R65,
35 0 RES, 0, 5%, 0.063 W, 0402 RC0402JR-070RL Yageo America
R66, R67, R68, R71, R72, R73,
R75, R76, R77, R78, R135,
R136, R137, R138, R139, R140
R10, R11, R18, R19, R27, R30,
R31, R37, R38, R39, R40, R56, 17 2.49k RES, 2.49k, 1%, 0.063 W, 0402 CRCW04022K49FKED Vishay-Dale
R58, R125, R126, R127, R128
R24, R25 2 6.20k RES, 6.20k, 1%, 0.1 W, 0603 RC0603FR-076K2L Yageo America
R26, R28 2 1.96k RES, 1.96k, 1%, 0.1 W, 0603 CRCW06031K96FKEA Vishay-Dale

www.ti.com Bill of Materials

R32, R33, R46, R47, R55, R57,
R80, R81, R82, R83, R87, R107,
19 470 RES, 470, 5%, 0.063 W, 0402 CRCW0402470RJNED Vishay-Dale
R108, R119, R120, R121, R122,
R123, R124
R50 1 100k RES, 100k, 5%, 0.125 W, 0805 CRCW0805100KJNEA Vishay-Dale
R51, R52, R53, R54 4 49.9 RES, 49.9, 1%, 0.063 W, 0402 CRCW040249R9FKED Vishay-Dale
R59, R60, R61, R62 4 0 RES, 0, 5%, 0.125 W, 0805 ERJ-6GEY0R00V Panasonic
RES, 2.40k, 0.1%, 0.1 W, AEC-Q200 Grade 0,
R79, R85 2 2.40k ERA-3AEB242V Panasonic
0603
R86 1 10.0k RES, 10.0k, 1%, 0.063 W, 0402 CRCW040210K0FKED Vishay-Dale
R88 1 33 RES, 33, 5%, 0.063 W, 0402 CRCW040233R0JNED Vishay-Dale
R89, R101 2 1.50k RES, 1.50k, 1%, 0.063 W, 0402 CRCW04021K50FKED Vishay-Dale
R90 1 10k RES, 10k, 5%, 0.063 W, 0402 CRCW040210K0JNED Vishay-Dale
R91, R92, R93, R94, R97, R98 6 22 RES, 22, 5%, 0.063 W, 0402 CRCW040222R0JNED Vishay-Dale
R95, R96, R99, R100, R103,
8 15.0k RES, 15.0k, 1%, 0.063 W, 0402 CRCW040215K0FKED Vishay-Dale
R104, R105, R106
R102, R112, R130 3 47k RES, 47k, 5%, 0.063 W, 0402 CRCW040247K0JNED Vishay-Dale
R109 1 240k RES, 240k, 5%, 0.063 W, 0402 CRCW0402240KJNED Vishay-Dale
R110 1 150k RES, 150k, 5%, 0.063 W, 0402 CRCW0402150KJNED Vishay-Dale
R111, R129, R134 3 0 RES, 0, 5%, 0.063 W, 0402 CRCW04020000Z0ED Vishay-Dale
R113, R114 2 220k RES, 220k, 5%, 0.063 W, 0402 CRCW0402220KJNED Vishay-Dale
R115, R117, R141, R142 4 27 RES, 27, 5%, 0.063 W, 0402 CRCW040227R0JNED Vishay-Dale
R116, R131 2 1.40k RES, 1.40k, 1%, 0.063 W, 0402 CRCW04021K40FKED Vishay-Dale
R118, R133 2 1.00Meg RES, 1.00 M, 1%, 0.063 W, 0402 CRCW04021M00FKED Vishay-Dale
R132 1 100 RES, 100, 1%, 0.063 W, 0402 CRCW0402100RFKED Vishay-Dale
Rs1 1 4.87k RES, 4.87k, 1%, 0.063 W, 0402 CRCW04024K87FKED Vishay-Dale
Switch, Normally open, 2.3N force, 200k
S1, S2, S4, S5 4 KSR221GLFS C&K Components
operations, SMD
S3 1 Switch, SPST 4 Pos, Top Actuated, SMT 219-4LPST CTS Electrocomponents
SH-J1, SH-J2, SH-J3, SH-J4,
14 Shunt, 100 mil, Gold plated, Black 881545-2 TE Connectivity
SH-J13, SH-J14
T1 1 Common Mode Filter for Power Line ACM9070-701-2PL TDK


1, 4, 6 CHANNEL PROTECTION SOLUTION
U5 1 FOR SUPER-SPEED (UP TO 6 GBPS) TPD4E05U06QDQARQ1 Texas Instruments
INTERFACE, DQA0010A
U6 1 DP83TC811, RND0036A DP83TC811RWRNDRQ Texas Instruments
U7 1 10/100 Ethernet PHY, RHB0032B DP83822RHBR Texas Instruments
Single Output Fast Transient Response LDO, 1.5
A, Adjustable 1.21-V to 20-V Output, 2.1-V to 20-V
U8, U9 2 TL1963AQKTTRQ1 Texas Instruments
Input, 5-pin DDPAK (KTT), -40 to 125°C, Green
(RoHS & no Sb/Br)
Single Output Automotive LDO, 1 A, Fixed 3.3-V
Output, 2.2-V to 5.5-V Input, with Reverse Current
U10 1 TPS73733QDRBRQ1 Texas Instruments
Protection, 8-pin SON (DRB), -40 to 125°C, Green
(RoHS & no Sb/Br)
4-Port Full-Speed USB Hub, 3.3V, -40 to 85°C,
U11 1 TUSB2046BIRHBT Texas Instruments
32-Pin QFN (RHB), Green (RoHS & no Sb/Br)
25-MHz Mixed Signal Microcontroller with 128 KB
U12 1 Flash, 8192 B SRAM and 47 GPIOs, -40 to 85°C, MSP430F5528IRGCR Texas Instruments
64-pin QFN (RGC), Green (RoHS & no Sb/Br)
25-MHz Mixed Signal Microcontroller with 128 KB
U13 1 Flash, 8192 B SRAM and 63 GPIOs, -40 to 85°C, MSP430F5529IPN Texas Instruments
80-pin QFP (PN), Green (RoHS & no Sb/Br)
Y1, Y2 2 Crystal, 25 MHz, 12 pF, SMD ABM8AIG-25.000MHZ-12-2Z-T3 Abracon Corporation
Y3 1 Ceramic Resonator, 6 MHz, 15 pF, SMD PBRC6.00MR50X000 AVX
Y4, Y5 2 Resonator, 4 MHz, 39 pF SMD CSTCR4M00G15L99-R0 MuRata
C1, C18, C27, C46, C52 0 0.01 µF CGA2B3X7R1H103K050BB TDK
Q200 Grade 1, 0402
C16, C25 0 22 µF CGA6P1X7R1C226M250AC TDK
Q200 Grade 1, 1210
C17, C26 0 10 µF CGA6P1X7R1E106M250AC TDK
Q200 Grade 1, 1210
C45, C51 0 0.1 µF CAP, CERM, 0.1 µF, 16 V, +/- 10%, X7R, 0805 GRM219R71C104KA01D MuRata
R34, R35, R36, R41, R42, R43,
0 2.49k RES, 2.49k, 1%, 0.063 W, 0402 CRCW04022K49FKED Vishay-Dale
R44, R45
RES, 2.21k, 0.1%, 0.1 W, AEC-Q200 Grade 0,
R63 0 2.21k TNPW06032K21BEEA Vishay-Dale
0603
R70 0 0 RES, 0, 5%, 0.063 W, 0402 RC0402JR-070RL Yageo America

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-
compliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-
compliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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User's Guide

SNLU231 – November 2017

DP83TC811EVM User’s Guide

SNLU231 – November 2017 DP83TC811EVM User’s Guide 1

2 DP83TC811EVM User’s Guide SNLU231 – November 2017

SNLU231 – November 2017 DP83TC811EVM User’s Guide 3

2.1 Key Features

4 DP83TC811EVM User’s Guide SNLU231 – November 2017

Figure 1. DP83TC811EVM – Top Side

SNLU231 – November 2017 DP83TC811EVM User’s Guide 5

Figure 2. DP83TC811EVM – Bottom Side

6 DP83TC811EVM User’s Guide SNLU231 – November 2017

2.2 Operation – Quick Setup

2.2.1 Onboard Power Supply Operation

Figure 3. Onboard Supply Connection and Jumpers

• DP83TC811 Onboard Power

2.2.2 External Power Supply Operation

SNLU231 – November 2017 DP83TC811EVM User’s Guide 7

• DP83822 External Power

2.2.3 Master and Slave Mode Selection – DP83TC811

2.2.4 Managed and Autonomous Mode Selection – DP83TC811

2.2.5 SMI Connection

2.2.6 Enable Mode – DP83TC811

2.2.7 Sleep Mode – DP83TC811

8 DP83TC811EVM User’s Guide SNLU231 – November 2017

Figure 4. Enable and Wake Control

2.2.8 Cable Assembly

2.2.9 LED Indication

SNLU231 – November 2017 DP83TC811EVM User’s Guide 9

3 Board Setup Details

3.1 Block Diagram

External 25-MHz Ext CLK

Copyright © 2017, Texas Instruments Incorporated

Figure 5. DP83TC811EVM Block Diagram

3.2 Serial Management Interface

10 DP83TC811EVM User’s Guide SNLU231 – November 2017

3.3 Configuration Options

3.3.1 Bootstrap Options

SNLU231 – November 2017 DP83TC811EVM User’s Guide 11

3.3.2 Clock Configuration

12 DP83TC811EVM User’s Guide SNLU231 – November 2017

4.1 eZ-FET Firmware

Figure 6. MSP430 Launchpad Spy-Bi-Wire Connection Points

Figure 7. Jumper Positions

SNLU231 – November 2017 DP83TC811EVM User’s Guide 13

– Power up the DP83TC811EVM to no more than 5 V

Figure 8. DP83TC811EVM Spy-Bi-Wire Connection Points

• Flash the eZ-FET firmware by running the file Flash_eZ-FET_DP83TC811EVM.bat

4.2 MSP430F5529 Firmware

14 DP83TC811EVM User’s Guide SNLU231 – November 2017

Figure 9. LED on Both Top and Bottom of DP83TC811EVM

• Flash the MSP430 firmware by running the file Flash_MSP430_DP83TC811EVM.bat

Figure 10. LED D14 Both Green and Red

SNLU231 – November 2017 DP83TC811EVM User’s Guide 15

5.1 Main Block Schematic

Figure 11. DP83TC811 Main Block

16 DP83TC811EVM User’s Guide SNLU231 – November 2017

5.2 Main Power Schematic

Figure 12. DP83TC811 Main Power