LED TV

SERVICE MANUAL
CHASSIS : 2851P838

MODEL : ZL – 50SF6152 , ZL – 55SF6263

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
 CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ................................................................25

TROUBLE SHOOTING ............................................................................26

BLOCK DIAGRAM...................................................................................34

EXPLODED VIEW ..................................................................................

SVC. SHEET ...............................................................................................

 SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC Do not use a line Isolation Transformer during this check.
power line. Use a transformer of adequate power rating as this Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
protects the technician from accidents resulting in personal injury between a known good earth ground (Water Pipe, Conduit, etc.)
from electrical shocks. and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
It will also protect the receiver and it's components from being with 1000 ohms/volt or more sensitivity.
damaged by accidental shorts of the circuitry that may be Reverse plug the AC cord into the AC outlet and repeat AC voltage
inadvertently introduced during the service operation. measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
If any fuse (or Fusible Resistor) in this TV receiver is blown, 0.5mA.
replace it with the specified. In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
When replacing a high wattage resistor (Oxide Metal Film Resistor, repaired before it is returned to the customer.
over 1W), keep the resistor 10mm away from PCB.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.

AC Volt-meter
Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
shock. such as WATER PIPE,
To Instrument's CONDUIT etc.
0.15uF
Leakage Current Cold Check(Antenna Cold Check) exposed
With the instrument AC plug removed from AC source, connect an METALLIC PARTS
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone

jacks, etc. When 25A is impressed between Earth and 2nd Ground
If the exposed metallic part has a return path to the chassis, the for 1 second, Resistance must be less than 0.1 Ω
measured resistance should be between 1MΩ and 5.2MΩ.
*Base on Adjustment standard
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily m otions when handling unpac k age d
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500°F to 600°F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500°F to 600°F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500°F to 600°F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.

Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on I C
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
 SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. GENERAL DESCRIPTION

HK.T.RT2851P838X is an TV control board. That’s a digital and analog TV control board, which is
suitable for the Australia, southeast Asia, Middle East, Africa, Colombia a of DVBT/T2/C market. It is
designed to apply the V-by-one interface. which can support LED panel larger 49-55” which resolution
is up to 3840x2160.
HK.T.RT2851P838X is intended to support the analog TV signal, Digital TV, NICAM/A2, USB, HDMI(V2.0
or 1.4a), CVBS, YPbPr and Coaxial output . And audio amplifier which can support 2X8W (8Ω) speaker
output.
The program is built in Cortex A55 ARM quad core CPU main chip and Android 9.0 OS,Also supports wired
and wireless network connection, you can browse the web internet play online video.

Main Promotion Power and backlight Spec.

Power Power Output Backlight Value Backlight Connectors

12V/3.0A 55V/-- 90V-120V/800mA_max

80W(Max) 2PIN_2.0
108W
12V/3.0A 75V/-- 121V-180V/580mA_max +2PIN_2.0
80W(Max) 3PIN_2.0
12V/3.0A 55V/-- 90V-120V/800mA_max +3PIN_2.0
90W(Max)
138W
12V/3.0A 75V/-- 121V-180V/720mA_max
100W(Max)
Note: The accuracy of backlight current is 5%.
2. STANDARD CONFIGURATION
Pictures are for reference only, specific to prevail in kind.
The optional connectors and functionsare marked with “*”.

（DVB-T/T2/C）

【HK.T.RT2851P838】 COAX, HEADPHONE,YPBPR,AV,DVB-T/T2/C,

Functions
RJ45, HDMI 1(*debug), HDMI 2, HDMI 3(*ARC), USB 2.0, USB 2.0
Notes

FRONT VIEW

SIDE VIEW

3. FEATURE
3.1 FEATURE 1

Chipset
RTD2851S(1.5G Byte DDR)/ RTD2851E(2G Byte DDR)

Market
Australia, southeast Asia, Middle East, Africa and Colombia

Panel Type TFT-LED;

 (面板) Resolution Max. 3840*2160
Interface V-by-one

Receiving range: 48.25MHz-863.25MHz

Input impedance: 75Ω

Analog TV Video System PAL,SECAM

BG,DK,I,L/L’
(ATV) Sound System NICAM/A2
Teletext 1000Pages

Max Storage Channels 100CH

VHF(52.5MHz-219MHz)
Receiving Range
UHF(474MHz-862MHz)

Input impedance 75Ω

Input Signal Channel bandwidth 7MHZ/8MHZ

DVB-T COFDM 2K/8K

QPSK,16QAM,64QAM
Modulation DVB-T2 QPSK, 16QAM, 64QAM, 256QAM
Digital TV
(DVBT/T2/C) DVB-C 16QAM, 32QAM, 64QAM, 128QAM,
256QAM
Video system MPEG-2, MPEG-4, H.264, H.265,AVS
MPEG-1 layer 1/2, MPEG-2 layer 2,
Sound system
DRA
Basic function EPG, Subtitle

Max Storage Channels 1000CH(DVB-T+DVB-C, dynamic)

*5000CH(DVB-S/S2, dynamic)

3.2 FEATURE 2
Video system: PAL /NTSC /SECAM Video
AV CVBS
Level: 1.0Vp-p +/-5%

Defaullt 1.4a(*Change to 2.0 through the menu)

Version

HDMI HDCP HDCP 2.2 compliant receiver

Input Signal
480i,480P,576i,576p,720p,1080i,1080p,3
Format
840x2160@60hz
Y: 1Vp-p@75ohm
Signal
YUV UV :0.7Vp-p@75ohm
Format 480i,480P,576i,576p,720p,1080i,1080p

CVBS Audio
L/R RCA Input 0.2- 2.0 Vrms
YPBPR Audio
 100Hz-15KHz @±3dB
Fre.q Response
Output Signal (1KHz, 0dB reference signal)
Audio Output
2x8W(8Ω) THD+N<10%
AMP Max Output power
Audio Input: 1KHz @0.5Vrms
Input AC 110V~240V SUPPLY
Power Main Board Standby＜0.5W
Manage
Panel Voltage 12V
H/W auto multi-standard detection and color decoding.
High performance adaptive 3D comb filter for Y/C separation.
Video decoder
Handling of weak and noisy off-air signals.
Support 3-ch for CVBS and S-Video output.
De-interlace 3D De-interlacing with Low Angle Detection

Picture Noise Reduction MPEG De-block&De-ringing noise reduction

Digital hut,saturation,brightness and contrast adjustments .
Support DLTI/DCTI video-quality improvement.
Picture Enhance Support Black/white level extension and ACC.
Support 2D Y peaking filter and coring.
sRGB compliance and Gamma correction.
Support 4:3 / 16:9 with Non-linear scaling
Scaling
Advanced Scaling Engine
Other OSD language English.
Key definition VOL-、VOL+、CH-、CH+、MENU、SOURCE、POWER
ATV/DTV 1 IEC 75 Ω
CVBS 3 RCA terminal
YPBPR 3 RCA terminal
Input
Interface HDMI 3 HDMI terminal
USB Slot 2 USB2.0 Slot(Horizontal)
LAN 1 RJ45 terminal

Output Headphone 1 Earphone terminal(black)

COAX 1 RCA terminal(orange)

3.3 HARDWARE CONFIGURATION

OS Android 9.0（AOSP）
CPU ARM cortex –A55*4
GPU Mail 470*3
CPU Frequency 1.1GHz
GPU Frequency 600MHz
DDR SIZE Embedded 1.5G Byte (*2G Byte Optional)

eMMC flash 4GB(*Max:32GB)

150Mbps （1T1R WIFI）
WLAN
Max Data Rate 866.7Mbps （*2T2R 2.4G+5G
(WIFI)
WIFI）
 2.4GHz （1T1R WIFI）
Operating Frequency
2.4GHz/5GHz （*2T2R WIFI）
2.4G WIF: IEEE 802.11b/g/n
Communications Standard
2.4G/5G WIFI: IEEE 802.11b/g/n/ac
WIFI: 150Mbps
Max Data Rate BT: 1 Mbps for Basic Rate
*WIFI+BT 2,3 Mbps for Enhanced Data Rate
Model:RTL8723BU Operating Frequency 2.4GHz

Communications Standard WIFI: IEEE 802.11b/g/n

BT: V2.1+EDR/BT V3.0/BT V4.0
WIFI: 150Mbps
Max Data Rate BT: 1 Mbps for Basic Rate
2,3 Mbps for Enhanced Data Rate

*WIFI+BT Operating Frequency 2.4GHz

Model:RTL8723DU
WIFI: IEEE 802.11b/g/n
Communications Standard BT: Compatible with Bluetooth
V2.1,V4.2
Systems

Max Data Rate 866.7Mbps

Operating Frequency 2.4GHz/5GHz

WIFI
Communications
*WIFI + BT IEEE 802.11 a/b/g/n/ac
(2.4G+5G) Standard
Model:RTL8822BU 1 Mbps for Basic Rate
Max Data Rate 2,3 Mbps for Enhanced Data Rate
Bluetooth Operating Frequency 2.4GHz
Communications
V4.2
Standard
Max Data Rate 866.7Mbps

WIFI Operating Frequency 2.4GHz/5GHz

Communications
*WIFI + BT Standard IEEE 802.11 a/b/g/n/ac
(2.4G+5G) 1 Mbps for Basic Rate
Model:RTL8822CU Max Data Rate
2,3 Mbps for Enhanced Data Rate
Bluetooth Operating Frequency 2.4GHz
Communications
V5.0
Standard
RJ45 NETWORK 10/100M auto-identification and DHCP

Note: Licenses involved in specifications above are supposed to be obtained by customers

themselves.
4.MEDIA PLAYER FORMAT
RT2851

P/N Video Decoder Resolution Max fps Max bltrate Bit depth 支持

(Mbps)
MPEG1 1920x1080 60 50M 8 V
MPEG2 MP@HL 1920x1080 60 100M 8 V
MPEG1/2/ MPEG4 SP@HL 3.0 1920x1080 60 100M 8 V
4 MPEG4 ASP@HL 1920x1080 60 100M 8 V
4.0
H.264 BP LV 4.0 1920x1080 30 50M 8 V
H.264 MP LV4.0 2048x1080 60 160M 8 V
H.264 HP LV 4.0 2048x1080 60 160M 8 V
H.264* H.264 MP LV 5.1 4096x2160 30 250M 8 V
H.264 HP LV 5.1 4096x2160 30 250M 8 V
H.265Main profile 4.1 2048x1080 60 160M 8 V
H.265* H.265Main 10 pro.4.1 2048x1080 60 160M 8/9/10 V
H.265Main profile 5.0 4096x2160 30 250M 8 V
H.265Main 10 pro.5.0 4096x2160 30 250M 8/9/10 V
H.265Main profile 5.1 4096x2160 60 250M 8 V
H.265Main 10 pro.5.1 4096x2160 60 250M 8/9/10 V
h.265 still picture pro. 8192x4096 NA NA 8 V
Geneic Motion JPEG 1920x1080 60 60M 8 V
WMV* Windows media 1920x1080 60 100M 8 V
video v9
VC1 VC-1 1920x1080 60 100M 8 V
VP8 VP8 1920x1080 60 20M 8 V
VP9 VP9 4096x2160 60 40M 8 V
RM* RV8 1920x1080 60 20M 8 V
RV9 1920x1080 60 50M 8 V
RV10 1920x1080 60 50M 8 V
AVS* AVS Ji zhun pro.6.0 1920x1080 60 50M 8 V
AVS Plus 1920x1080 60 50M 8 V
AVS 2.0* AVS 2.0 60 150M 8/10 X
XVID XVID 1920x1080 60 50M 8 V
Sorenson Sorenson H263 1920x1080 30 20M 8 V
Motion M-JPEG 1920x1080 60 60M 8 V
JPEG
H.263 H263V- 1920x1080 60 20M 8 V
M5/FW /FOURCE/H2
63

Audio Decode List

PN Audio Decoder 支持

PCM WAV:PCM/AADPCM/A -law PCM /u-law V

PCM
ADPCM IMA4 V
AMR AMR-NB,AAMR-W B/AMR-WB+ NA
LPCM DVD LPCM NA
RA COOK:COOK(RealAudio6) NA
MPEG1/2/ MPEG1 Layer1/2 V
4 MPEG2 V
MP3 V
AAC* MPEG2 AAC V
MPEG4 AAC-LC V
MPEG4 HE-AAC V1/V2 V
Raac:MPEG4 AAC-LC V
Racp: mpeg4 he-aac v2 V
WMA* WMA V7 V
WMA V8 V
WMA V9 V
Dolby AC3 V
AC3* Dolby Digital EX,Dolby Digtal Plus,Dolby V
TrueHD
Dnet:AC3 V
Dolby Dolby Digital PLUS V
Eac3* Dolby Digital Plus,Dolby lossless V
Dolby NO-HEAAC V
MS11*
 Dolby Config-A/B/D V
MS12* Config-LC V
Dolby V
AC4* V
Dolby V
ATMOS* V
DRA DRA V
FLAC FLAC V
FLAC(96h2) V
VORBIS VORBIS V

Image Decoder
File Contalner Data Type 支持

Extension
*.jpg JPEG Baseline V
Progresslve V
*.bmp BMP V
*png PNG V
*.gif GIF Static V

.mpo MPO 3d V
.jps JPS 3d baseline V
.pns PNS 3d V
Note: Licenses involved in specifications above are supposed to be obtained by customers
themselves.

5. SUBSTITUTABLE PRIMARY MATERIALS

5.1 GENERAL MATERIALS
Including SMT capacitors, SMT resistors, diodes, transistors, MOSFET, connectors, common
inductance, electrolytic capacitor, PCB etc., and having no obvious changes in appearance or
color. Our company has two or three alternative suppliers with these materials; maybe we will
alternative use these materials for follow-up mass production due to delivery time, stock or other
reasons. We no longer notice your company the alternative materials used. If necessary, you can
apply for using related materials (mention as above) in samples stage.
(Note: The alternative materials which have been accepted by our materials Confirmation
department and PP will enter our system.)
5.2 KEY MATERIALS
The table is for reference only, the actual is the standard.
BACKUP
NAME TYPE BRAND BACKUP TYPE
BRAND
*THGBMNG5D1LBAIL TOSHIBA KLM4G1FETE-B041 Samsung
H26M41204HPR Hynix
EMMC THGBMJG6C1LBAIL TOSHIBA
KLM8G1GETF-B041 Samsung
*THGBMHG7C1LBAIL TOSHIBA KLMAG1JETD-B041 Samsung
HH1118 HH
LDO
HH1117-ADJ HH BL1117 BL
'X-27.000MHz CREC
CRYSTAL
'X-24.000MHz CREC
MPS1655 MPS
DC_DC SY8113 SILERGY JW5057C JW
SY8120 SILERGY JW5052C JW
TPA3138D2 TI
AMP AD52050B ESMT
RDA3118E
6. FUNCTION LAYOUT
6.1 THE TOP VIEW OF HK.T.RT2851P838X

6.2 ANTENNA INSTALL VIEW

It is recommended that the antenna be assembled as far as possible on the lower edge
of the TV case.
Copper tube antenna recommended pad height 5-8mm.
7. PCB DIMENSION AND CONFIGURABLE
7.1 PCB DIMENSION

PCB Height=20.00mm
PCB Length=235mm
PCB Width=200mm
PCB Screw Bore Size: Diameter is 3.5mm

7.2 CONFIGURABLE
The structure chart is for a reference only; the actual item is the standard.
Jack configuration can be adjusted according to your jack terminal, it just depends on your
board basic, and the final bracket Configuration is determined by the practical sample.
8. INTERFACE DEFINITION
Below, please see the definition and description from left PIN to right PIN or from up PIN to down
PIN.
Below, please see the definition and description from left PIN to right PIN or from up PIN to down
PIN.
◆ CN5 (14Pin / 2.0): TO IR/KEY BOARD

NO DEFINITION DESCRIPTION
1 5V 5V Power Supply
2 R Red Indicator
3 G Green Indicator
4 IR Remote Receive
5 GND GND
6 K0 SOURCE
7 K1 MENU
8 K2 P+
9 K3 P-
10 K4 V+
11 K5 V-
12 K6 POWER
13 K7 NC
14 GND Ground
◆ CN1 (4 Pin / 2.54): Audio OUT

NO DEFINITION DESCRIPTION
1 L+ Left Positive audio Out
2 L- Left Negative audio Out
3 R- Right Negative audio Out
4 R+ Right Positive audio Out
◆ CNW1 (4 Pin / 2.54): Amplifier Power

NO DEFINITION DESCRIPTION
1 12V 12V Power Supply
2 GND Ground

◆ CN13 (5 Pin / 2.0):DMIC

NO DEFINITION DESCRIPTION
1 A3V3 3.3V Power Supply
2 C1SCL IIC1 Clock
3 C1SDA IIC1 Data
4 C2SDA IIC2 Data
5 GND Ground

◆ CN9 (3 Pin / 2.0): TO DEBUG

NO DEFINITION DESCRIPTION
1 TX Serial Data Transmitter
2 RX Serial Data Receive
3 GND Ground
◆ CN11 (51 Pin /0.5FIR): TO V-by-one

NO DEFINITION NO DEFINITION
1 Vin 27 GND
2 Vin 28 RX0N
3 Vin 29 RX0P
 4 Vin 30 GND
5 Vin 31 RX1N
6 Vin 32 RX1P
7 Vin 33 GND
8 Vin 34 RX2N
9 NC 35 RX2P
10 GND 36 GND
11 GND 37 RX3N
12 GND 38 RX3P
13 GND 39 GND
14 GND 40 RX4N
15 NC 41 RX4P
16 NC 42 GND
17 NC 43 RX5N
18 SDA 44 RX5P
19 SCL 45 GND
20 NC 46 RX6N
21 NC 47 RX6P
22 LD_EN 48 GND
23 NC 49 RX7N
24 NC 50 RX7P
25 HTPDN 51 GND
26 LOCKN
◆ XW1 AC INPUT CONNECTOR

NO DEFINITION DESCRIPTION
1 L LIVE
2 N NEUTRAL
9. ELECTRICAL CHARACTERISTICS
9.1.1 AC INPUT CHARACTERISTICS

Input Minimum Nominal Maximum Unit

Voltage 90 100-240 264 V
Current --- --- 2.0 A
Frequency range 50/60±5% Hz
Efficiency(Full Load) 80%minimum at 220Vac
Standby Power Consumption ≦0.5W； 240Vac input and no load condition
Inrush Current 50Atyp peak, 100Vac ;100Atyp peak, 240Vac
Leakage Current Less Than 0.35mA, 240Vac input
Input Fuse T5AL/250Vac

9.1.2 LED INPUT CHARACTERISTICS(LED输入特性)

Parameter Symbol Min Typical Max Unit Remark

INPUT 0 0.8 V Off State

Von/off
VOLTAGE 2.5 - 3.3 V On State
ADJ Vadj=0V
Vadj 0 - 3.3 V
VOLTAGE
EFFICIENCY η 85 - - % Von/off=3.3V
Vadj=0V,RL=Panel
*Vadj：22 KHz-28KHz；
9.2 LED DRIVER POWER OUTPUT CONNECTOR
◆ CNW2/CNW3/CNW4/CNW5(3 pin 2.0):

NO. DEFINITION
1 LED-
2 LED-
3 LED+

◆ OUTPUT PROTECTION SPECIFICATION

Signal LED Short Protection LED Open Protection

Name Specification Specification
LED output Auto restart Shut down or auto restart
9.3 SHORT CIRCUIT PROTECTION
When any output is short circuited to ground, the power supply is automatically protected,
and the continuous short circuit is not damaged. The output impedance is less than 0.1 ohms,
which is defined as a short-circuit circuit.

9.4 RESET AFTER SHUTDOWN

If the power supply latches into a shutdown state because of 1 fault condition on its output,
the power supply shall return to normal operation only after the fault has been removed，or the
PS-On has been cycled off/on, or the AC INPUT has been cycled off/on with a off time of ten
second.
10. FUSE PROTECTION

The Fuse inside the power supply shall open when the AC input current is over the rated
current of fuse. This Fuse protection will cause switching power supply to fail.

10.1 SAFETY

The power supply shall compliance with the following Criterion:

1) UL60950/UL60065
2) EN60950-1/EN60065
3) IEC60950/IEC60065
4) GB4943-2011/GB8898-2011
10.2 ISOLATION

HI-POT
Input To Output 3000Vac 50Hz 1minute ≤10mA
Input To FG 3000Vac 50Hz 1minute ≤10mA
Output To FG Non Isolated
INSULATION RESISTANCE
Input To Output DC500V 50MΩmin (at room temperature)
Input To FG DC500V 50MΩmin (at room temperature)
Output To FG Non Isolated
15. NOTICE REGARDING TV MEDIA FORMAT AND INTERFACE TECHNOLOGY

Introduction
This document is used to specify media formats, interface technologies and others that may
be involved in TV products.

媒体格式 接口技术及其他

Dolby Digital Decoder MPEG2/MPEG4 HDMI Hbbtv2.0

Dolby Digital Plus Decoder AMR-NB HDCP Netflix
Dolby MS11 AMR-WB Wi-Fi Freeview Play
Dolby MS12 DRA USB NTFS
Dolby Atmos AAC/HEAAC MHL Seraphic Open Browser
Dolby Vision H.264 Bluetooth Seraphic TV Portal
DTS Sound H.265 NFC －

DTS TruSurround DivX DVB-T2 －

DTS HD RMVB DVB-S2x －

DTS 2.0+Digital Out WMA ATSC －

DTS Express 5.1 WMA Pro PlayReady －

DTS Studio Sound dbx-tv MSS －

DTS Studio Sound II － Widevine －

Notice:
In the event the LCD TV Driver Boards (“Boards” purchased or customized by your good
company include any hardware(e.g. TV master chip, output connector) and/or software that
support the above mentioned media formats, interface technologies & others which may
involve thir party technologies or intellectual properties, your company is hereby kindly
reminded as follows:

1. The product price under the sale contracts between us does not include any royalties,
licensing fees or expenses payable to the IP right holders for acquiring the right to use the
third party technologies or the license of the third party’s intellectual properties which may be
involved due to the Boards’ and relating TV sets’ supporting of the above mentioned media
formats, interface technologies & others. If the IP right holders so request, you shall obtain
valid license from the right holders and make payment at your own cost for such license.
2. If your company requests to reduce or cancel the media formats or interface
technologies
& others supported by the Boards, you shall, upon your confirmation of the Boards’
specifications, or upon payment of the contract price, whichever is earlier, notice us such
requests in writing.
3. In the event the “Boards” purchased or customized by your good company do not include
hardware and/or software that support part or entire of the above mentioned media formats
and interface technologies & others, this Notice shall not be applicable to your company with
respect to the media formats and interface technologies & others that not supported by the
Boards.
4. The hardware, software and technologies related to the media formats and interface
technologies & others that may be involved in the Boards are all provided by third parties .
We
may update this Notice from time to time. If you find any omissions, please do not hesitate to
let us know.

Regarding the TV mainboard Products (following referred as “the Mainboard”), the technical
requirements of which are wholly listed and defined under this Letter of Confirmation for
Product Technical Requirements, due to the fact that it was ultimately confirmed and
determined by the buyer regarding the software programmed to the Mainboard, and the
Mainboard’s features and functions (including patented features and functions, whether the
features and functions are realized and practiced through the chips embodied in the
Mainboard, the Mainboard itself, or through the TV sets embodying the Mainboard), the
buyer
shall be responsible for obtaining appropriate licenses from the relating intellectual property
right holders and other right holders, acquiring appropriate permissions to use the software
programmed to the Mainboard, obtaining appropriate permissions to realize and practice the
relating features and functions of the Mainboard, reporting the transaction data, arranging
the payment of royalties, and performing other duties and responsibilities which are
necessary to use, sell, offer for sale, import or otherwise to dispose of the Mainboard with
programmed software without infringing the intellectual property rights of any third party.
As our company is specialized TV mainboard supplier and unable to acquire the
performance
or specifications requirements of the TV sets embodying the Mainboard, we hereby
guarantee
that the TV mainboard products supplied by our company are in conformance with the Letter
of Confirmation for Product Technical Requirements which was confirmed in writing by both
parties, and your company shall be responsible for the testing, debugging, tuning of the TV
sets embodying the Mainboard, application for certifying the Mainboard and the TV sets
embodying the Mainboard, and performing other duties and responsibilities which are
necessary for complying with the law and regulations of the countries and regions, where the
Mainboard and the TV sets embodying the Mainboard were imported and sold.
 ADJUSTMENT INSTRUCTION

BootLogo Import/ Export/ Switch Introduction

一：LOGO import
1. Prepare the LOGO picture to be replaced, with a resolution of 1280x720 in 2K and
1920x1080 in 4K;
2. Convert picture format;
(1) Open image format conversion tool：XnView.rar -> xnview.exe；
(2) Load LOGO image file and save it as .Raw format file.
(3) Name the raw file bootfile.raw and place it in the U disk root directory.
(4) Plug the U disk onto the TV and enter the password "source 2580" to open the factory
menu；
Factory Menu  General Settings  BootLogo  LOGO ImportConfirm
(5) Operation LOGO Import option to import, after successful import, press power key long,
choose Restart to take effect;

二：LOGO Export
1.Plug the U disk onto the TV and enter the password "source 2580" to open the factory menu；
Factory Menu  General Settings  BootLogo  LOGO ExportConfirm

三：LOGO Switch
1. TV enter the password "source 2580" to open the factory menu；
Factory Menu  General Settings  BootLogo  LogoON/OFF
2.Select On, the TV has a logo, and select Off, the TV has a black screen without a logo.
TROUBLE SHOOTING
Feb., 2021