Diagrama hk.t.rt2842p639
Diagrama hk.t.rt2842p639
Diagrama hk.t.rt2842p639
SERVICE MANUAL
CHASSIS : 2842P639
MODEL : ZL-43SF5152
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .............................................................................................. 2
SPECIFICATION ........................................................................................6
BLOCK DIAGRAM...................................................................................37
AC Volt-meter
Before returning the receiver to the customer,
jacks, etc. When 25A is impressed between Earth and 2nd Ground
If the exposed metallic part has a return path to the chassis, the for 1 second, Resistance must be less than 0.1 Ω
measured resistance should be between 1MΩ and 5.2MΩ.
*Base on Adjustment standard
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily m otions when handling unpac k age d
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500°F to 600°F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500°F to 600°F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500°F to 600°F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.
Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on I C
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
SPECIFICATION
1. GENERAL DESCRIPTION
HK.T.RT2842P639X is Android Smart control board of LED Panel which is suitable for Pan-European
UK,MIDE,Australia,Africa market. Its USB slot can be used for software upgrade, and multimedia play,
such as MP3 and JPEG. And it support HDMI 1.4a compliant, HDCP 1.4 compliant.The program is built
in Cortex A53 ARM quad core CPU main chip and Android 9.0 OS,Also supports wired and wireless
network connection, you can browse the web internet play online video.
HK.T.RT2842P639X 's power part is a high efficiency DC-line switching power supply unit. It
supports LED panel larger than 32- 43” which resolution is up to 1920x1080.
标准配置六 DVB-T2/T/C + AV
FRONT VIEW
SIDE VIEW
3. FEATURE
3.1 FEATURE 1
Chipset
RTD2841P(DDR 1G,Dolby)/ RTD2842P(DDR 1G,No Dolby)/RTD2851S(DDR 1.5G)
Market
PAN Europe, UK, Australia, MIDE, Africa
Type TFT-LED;
Resolution
Max. 1920*1080
Panel Interface
Single/Dual LVDS
FSS 33KHZ±5KHZ
66KHZ±8KHZ
Format 480i,480P,576i,576p,720p,1080i,1080p
ATV/DVB-C/T/T2 1 IEC 75 Ω
Interface Input
*DVB-S2 1 SPIRAL 75 Ω
AV 1MINI terminal
OS Android 9.0(AOSP)
CPU ARM cortex –A55*4
GPU Mali470MP*3
CPU Frequency 900MHz
GPU Frequency 600MHz
DDR SIZE Embedded 1G Byte
Max
Max Bit 2841P/2851
P/N Video Decoder Resolution bitrate
fps depth S
( Mbps )
MPEG1 1920x1080 60 50M 8 V
MPEG2 MP@HL 1920x1080 60 50M 8 V
MPEG-4 SP@HL 3.0 1920x1080 60 25M 8 V
MPEG-4 ASP@HL 4.0 1920x1080 60 25M 8 V
MPEG
MPEG-4 version3 (MP43) 1920x1080 60 25M 8 V
1/2/4
Microsoft ISO MPEG-4 version
1920x1080 60 25M 8 V
1 (MP4S)
Microsoft ISO MPEG-4 version
1920x1080 60 25M 8 V
1.1 (M4S2)
Xvid XviD 1920x1080 60 25M 8 V
H.264 BP LV 4.0 1920x1080 60 50M 8 V
H.264 MP LV 4.0 1920x1080 60 50M 8 V
H.264 HP LV 4.0 1920x1080 60 50M 8 V
H.264* H.264 MP LV 5.1 1920x1080 60 50M 8 V
H.264 HP LV 5.1 1920x1080 60 50M 8 V
H.264 HP LV 5.2 1920x1080 60 50M 8 X
H.264 MVC (version 11) 1920x1080 60 50M 8 V
H.265 Main profile @ Level
1920x1080 60 50M 8 V
4.1
H.265 Main10 profile @ Level
1920x1080 60 50M 10 V
4.1
H.265 Main profile @ Level
1920x1080 60 50M 8 V
5.0
H.265*
H.265 Main10 profile @ Level
1920x1080 60 50M 10 V
5.0
H.265 Main profile @ Level
1920x1080 60 50M 8 V
5.1
H.265 Main10 profile @ Level
1920x1080 60 50M 10 V
5.1
H.265 Still picture profile 1920x1080 NA 50M NA V
Generi
Motion JPEG 1920x1080 60 25M 8 V
c
WMV* Window Media Video v9 1920x1080 60 25M 8 V
VC1 VC-1 (SP/MP/AP) 1920x1080 30 25M 8 V
VP8 VP8 1920x1080 30 25M 8 V
VP9 VP9 1920x1080 60 25M 8/10 V
RV 8 (rv30) 1920x1080 30 25M 8 V
RM * RV 9 (rv40) 1920x1080 30 25M 8 V
RV 10 (rv40) 1920x1080 30 25M 8 V
AVS Jizhun Profile LV 6.0 1920x1080 30 25M 8 V
AVS*
AVS Plus 1920x1080 30 25M 8 V
AVS
AVS 2.0 60 150M 8/10 X
2.0*
Soren
Sorenson H.263 1920x1080 30 25M 8 V
son
Motion
M-JPEG 1920x1080 60 25M 8 V
JPEG
H.263
H.263 1920x1080 30 25M 8 V
V_MS/FW/FOURCC/H263
2. Audio Decoder list
Audio Decoder
PN 2841P/2851S
(For MM Video)
wav: PCM / ADPCM / A-law PCM
Yes
/ u-law PCM
PCM
WAV(192KHz) Yes
WMA v8 Yes
WMA*
WMA v9 Yes
WMA Pro NO
AC3 Yes
Dolby AC3 Dolby Digital EX, Dolby Digital Plus, Dolby
Yes
(DD) * TrueHD
dnet: AC3 (RealAudio3) Yes
MS10 No
MS11 Yes
MS12 Yes
Dolby*
MS12 for Dolby Atmos Yes
MS12 for MAT (Metadata-enhanced
Yes
Audio Transmission)
MPEG-H MPEG-H Yes
FLAC Yes
FLAC
FLAC (96hz) Yes
File
Container Data Type 2841P/2851S
Extension
baseline Yes
*.jpg JPEG
progressive Yes
MINI COMPONENT_IN:
6.3 ANTENNA INSTALL VIEW
It is recommended that the antenna be assembled as far as possible on the lower edge
of the TV case.
Copper tube antenna recommended pad height 5-8mm.
PCB Height=20mm
PCB Length=189.0mm
PCB Width=168.0mm
PCB Screw Bore Size: Diameter is 3.5mm and 5.0mm
8. INTERFACE DEFINITION
Below, please see the definition and description from left PIN to right PIN or from up PIN to down
PIN.
NO DEFINITION NO DEFINITION
1 VCC 2 VCC
3 VCC 4 GND
5 GND 6 NC
7 TXOM0 8 TXOP0
9 TXOM1 10 TXOP1
11 TXOM2 12 TXOP2
13 GND 14 GND
15 CLKOM 16 CLKOP
17 TXOM3 18 TXOP3
19 TXIM0 20 TXIP0
21 TXIM1 22 TXIP1
23 TXIM2 24 TXIP2
25 GND 26 GND
27 CLKIM 28 CLKIP
29 TXIM3 30 TXIP3
◆ CN15 (14 Pin / 2.0): IR & KEY
6 K0 SOURCE key
7 K1 MENU key
8 K2 CH+ (UP) key
9 K3 CH- (DOWN) key
10 K4 VOL+ (RIGHT) key
11 K5 VOL- (LEFT) key
12 K6 POWER key
13 K7 (Reserved)
14 GND Ground
NO DEFINITION DESCRIPTION
1 LOUTP Left Speak Out+
2 LOUTN Left Speak Out-
3 ROUTN Right Speak Out-
4 ROUTP Right Speak Out+
◆ CNW1 (2 Pin / 2.0): INVERTER
NO DEFINITION DESCRIPTION
1
2 12V
GND Power Supply
Ground
NO DEFINITION DESCRIPTION
1 L LIVE
2 N NEUTRAL
9.ELECTRICAL CHARACTERISTICS
9.1 AC INPUT ELECTRICAL SPECIFICATIONS
Input Minimum Nominal Maximum Unit
Voltage 130 150-240 264 V
Current --- --- 2.0 A
Frequency range 50/60±5% Hz
Efficiency(Full Load) 80%minimum at 220Vac
Standby Power Consumption ≦ 0.5W;240Vac input and no load condition
Inrush Current 80Atyp peak, 150Vac; 100Atyp peak, 240Vac
Leakage Current Less Than 0.35mA, 240Vac input
Input Fuse T3.15AL/250Vac
+12V ≤ 500mV
Note:
1) Measurements shall be made with an oscilloscope@ 20MHz bandwidth.
2) Outputs shall be bypassed at the connector with a 0.1 uF ceramic capacitor and
a 10uF electrolytic capacitor to simulate system loading.
9.2.4 DC Output Rise Time
Output Voltage
Rise Time(ms)
+12V ≤100 ms
+12V ≤10%
+12V ≤ 3S
+12V ≥5 ms
NO. DEFINITION
1 LED-
2 LED+
NO. DEFINITION
1 LED-
2 LED-
3 LED+
媒体格式 接口技术及其他
Introduction
This document is used to specify media formats, interface technologies and others that may be
involved in TV products.
媒体格式 接口技术及其他
1. The product price under the sale contracts between us does not include any royalties, licensing
fees or expenses payable to the IP right holders for acquiring the right to use the third party
technologies or the license of the third party’s intellectual properties which may be involved due to the
Boards’ and relating TV sets’ supporting of the above mentioned media formats, interface
technologies & others. If the IP right holders so request, you shall obtain valid license from the right
holders and make payment at your own cost for such license.
2. If your company requests to reduce or cancel the media formats or interface technologies
& others supported by the Boards, you shall, upon your confirmation of the Boards’
specifications, or upon payment of the contract price, whichever is earlier, notice us such requests
in writing.
3. In the event the “Boards” purchased or customized by your good company do not include
hardware and/or software that support part or entire of the above mentioned media formats and
interface technologies & others, this Notice shall not be applicable to your company with respect to the
media formats and interface technologies & others that not supported by the Boards.
4. The hardware, software and technologies related to the media formats and interface technologies
& others that may be involved in the Boards are all provided by third parties . We may update this
Notice from time to time. If you find any omissions, please do not hesitate to let us know.
Regarding the TV mainboard Products (following referred as “the Mainboard”), the technical
requirements of which are wholly listed and defined under this Letter of Confirmation for Product
Technical Requirements, due to the fact that it was ultimately confirmed and determined by the buyer
regarding the software programmed to the Mainboard, and the Mainboard’s features and functions
(including patented features and functions, whether the features and functions are realized and
practiced through the chips embodied in the Mainboard, the Mainboard itself, or through the TV sets
embodying the Mainboard), the buyer shall be responsible for obtaining appropriate licenses from the
relating intellectual property right holders and other right holders, acquiring appropriate permissions to
use the software programmed to the Mainboard, obtaining appropriate permissions to realize and
practice the relating features and functions of the Mainboard, reporting the transaction data, arranging
the payment of royalties, and performing other duties and responsibilities which are necessary to
use, sell, offer for sale, import or otherwise to dispose of the Mainboard with programmed software
without infringing the intellectual property rights of any third party.
As our company is specialized TV mainboard supplier and unable to acquire the performance or
specifications requirements of the TV sets embodying the Mainboard, we hereby guarantee that the TV
mainboard products supplied by our company are in conformance with the Letter of Confirmation for
Product Technical Requirements which was confirmed in writing by both parties, and your company
shall be responsible for the testing, debugging, tuning of the TV sets embodying the Mainboard,
application for certifying the Mainboard and the TV sets embodying the Mainboard, and performing
other duties and responsibilities which are
necessary for complying with the law and regulations of the countries and regions, where the
Mainboard and the TV sets embodying the Mainboard were imported and sold.
ADJUSTMENT INSTRUCTION
一:LOGO import
1. Prepare the LOGO picture to be replaced, with a resolution of 1280x720 in 2K and
1920x1080 in 4K;
2. Convert picture format;
(1) Open image format conversion tool:XnView.rar -> xnview.exe;
(2) Load LOGO image file and save it as .Raw format file.
(3) Name the raw file bootfile.raw and place it in the U disk root directory.
(4) Plug the U disk onto the TV and enter the password "source 2580" to open the factory
menu;
Factory Menu General Settings BootLogo LOGO ImportConfirm
(5) Operation LOGO Import option to import, after successful import, press power key long,
choose Restart to take effect;
二:LOGO Export
1.Plug the U disk onto the TV and enter the password "source 2580" to open the factory menu;
Factory Menu General Settings BootLogo LOGO ExportConfirm
三:LOGO Switch
1. TV enter the password "source 2580" to open the factory menu;
Factory Menu General Settings BootLogo LogoON/OFF
2.Select On, the TV has a logo, and select Off, the TV has a black screen without a logo.
TROUBLE SHOOTING
BLOCK DIAGRAM
EXPLODED VIEW
Feb., 2021