323-1851-102.2 (6500 R12.6 Electrical CPS) Issue1

6500 Packet-Optical Platform
Electrical Circuit Packs

Release 12.6
What’s inside...
New in this release and documentation roadmap
Electrical circuit packs and I/O panels
48 Channel Trans Mux (Portless) circuit pack
323-1851-102.2 - Standard Issue 1

September 2019
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6500 Packet-Optical Platform Electrical Circuit Packs

Release 12.6 323-1851-102.2 Standard Issue 1
Copyright© 2010-2019 Ciena® Corporation September 2019
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v
Contents 0
New in this release and documentation roadmap ix
Electrical circuit packs and I/O panels 1-1

63xE1 working and protection circuit packs (NTK541BAE5 and NTK541PAE5) 1-2
Overview 1-2
Supported functionality 1-5
Cross-connection types 1-5
Cross-connection rates 1-5
Performance monitoring 1-5
Alarms 1-5
Equipping rules 1-7
Technical specifications 1-12
E1 cable pinouts and assemblies 1-13
E1 I/O panel, interface circuit pack, and connector port mapping 1-14
Latency 1-21
24xDS3/EC-1 working and protection circuit packs (NTK543NAE5 and
NTK544NAE5) 1-22
Overview 1-22
Alarms 1-27
Equipping rules 1-29
DS3/E3/EC-1 cable assemblies 1-33
Latency 1-33
24xDS3/E3 working and protection circuit packs (NTK543CAE5 and
NTK544CAE5) 1-34
Overview 1-34
Alarms 1-39

vi Contents
DS3/E3/EC-1 cable assemblies 1-45

Latency 1-46
16xSTM-1e working and protection circuit packs (NTK546CAE5 and
NTK546NAE5) 1-47
Overview 1-47
Alarms 1-51
Latency 1-56
DS1 service module (DSM) shelf (NTN407AA and NTN407AC) 1-57
Overview 1-57
Alarms 1-63
DSM shelf 1-66
DSM 84xDS1 TM circuit packs 1-68
DSM connector pinouts 1-75
DS1 cable pinout and assemblies 1-77
E1 I/O panel (NTK571xxE5) 1-79
Overview 1-79
E1 I/O modules - 14-slot optical/front electrical and converged optical/front
electrical shelves 1-79
E1 I/O modules - 14-slot metro front electrical shelf 1-83
DS3/E3/EC-1 I/O panels (NTK572CAE5 and NTK572QAE5) 1-85
Overview 1-85
STM-1e I/O panel (NTK573FAE5) 1-89
Overview 1-89
I/O panels hardware locations in different shelves 1-92
Electrical circuit packs provisioning procedures 1-96
List of procedures
1-1 Provisioning a circuit pack automatically 1-99
1-2 Installing electrical I/O hardware and I/O panels in the 14-slot 6500
shelf 1-101
1-3 Routing electrical I/O cables into the electrical interface area 1-114
1-4 Routing STM-1e coaxial cables onto the 6500 shelf 1-122
1-5 Adding a facility to an equipment 1-125
1-6 Adding a path connection 1-127
1-7 Editing the DSM OAM link setting 1-131
1-8 Provisioning a DSM 84xDS1 TM automatically 1-132
1-9 Defining or editing a site address for a DSM 1-135
1-10 Changing the primary state of a facility 1-136

Contents vii
1-11 Changing the primary state of a circuit pack 1-138

1-12 Deleting a facility from an equipment 1-140
1-13 Deleting a circuit pack 1-142
Equipment and facility provisioning parameters 1-143
Equipment and facility primary and secondary states 1-143
DS1 facility parameters 1-146
OC3 facility for 84xDS1TM parameters 1-149
STM1E facility parameters 1-150
DS3 facility parameters (DS3E3EC1 equipment) 1-151
EC1 facility parameters 1-152
E1 facility parameters 1-153
E3 facility parameters (DS3E3EC1 equipment) 1-154
DSM OAM Link parameters 1-155
Path connection parameters 1-157
48 Channel Trans Mux (Portless) circuit pack 2-1

TMUX circuit pack (NTK558DAE5) 2-1
Overview 2-1
Alarms 2-6
Equipping rules 2-8
Latency 2-9
TMUX provisioning procedures 2-10
Provisioning rules summary for the 48 Channel Trans Mux (Portless) circuit
pack 2-11
List of procedures
2-1 Provisioning a circuit pack automatically 2-12
2-2 Adding a facility to a TMUX equipment 2-13
2-3 Adding a path connection 2-15
2-4 Changing the primary state of a facility 2-17
2-5 Changing the primary state of a circuit pack 2-19
2-6 Deleting a facility from an equipment 2-21
2-7 Deleting a circuit pack 2-23
Equipment and facility provisioning parameters 2-24
Equipment and facility primary and secondary states 2-24
DS3, DS1DS3, E3, and E1E3 facility parameters (TMUX equipment) 2-26
Path connection parameters 2-31

viii Contents

ix
New in this release and documentation

roadmap 0
This Technical Publication supports 6500 Packet-Optical Platform (6500)

Release 12.6 software and subsequent maintenance releases for
Release 12.6.
Issue 1
There are no new features covered in this document for this release.
6500 Packet-Optical Platform technical publications

The following two roadmaps identify the technical publications that support the
6500 D-Series and S-Series and the technical publications that support the
6500 T-Series platform for Release 12.6.

x New in this release and documentation roadmap
6500 D-Series and S-Series roadmap

Planning a Network Installing, Managing and Maintaining and Circuit Pack-Based
Commissioning and Provisioning Troubleshooting Documentation
Testing a Network a Network a Network
Documentation Installation - Administration Fault Management - Common Equipment

Roadmap General Information and Security Performance (323-1851-102.1)
(323-1851-090) (323-1851-201.0) (323-1851-301) Monitoring
(323-1851-520) Electrical
Planning - Installation - Configuration -
(323-1851-102.2)
Parts 1, 2, and 3 2-slot Shelves Provisioning &
(NTRN10EY) Operating Parts 1 & 2 Fault Management -
(323-1851-201.1) OC-n/STM-n
Data Comms (323-1851-310) Alarm Clearing
(323-1851-102.3)
Planning & User Guide Installation - 7-slot & Parts 1 and 2
(323-1851-101) 6500-7 packet-optical Configuration - (323-1851-543) WaveLogic Ai, Flex,
Shelves Protection Switching 100G+, 40G,
Ordering Information
(323-1851-201.2) (323-1851-315) Fault Management - OSIC ISS, & SLIC10
(323-1851-151)
Module (323-1851-102.4)
Manufacturing Installation - Configuration - Replacement
Discontinued Parts 14-slot Shelves Bandwidth & Data (323-1851-545)
(323-1851-155) (323-1851-201.3) Services Parts 1,2,3 Broadband/SMUX
(323-1851-320) OTN FLEX MOTR
NBI Fundamentals Installation - Fault Management - (323-1851-102.5)
(323-1851-165) 32-slot Shelves Configuration - SNMP
(323-1851-201.4) Control Plane (323-1851-740) Photonics
Latency
(323-1851-330) Equipment
Specifications Passive Chassis
(323-1851-170) Encryption and FIPS Fault Management - (323-1851-102.6)
(2150 & Photonics), Customer Visible
Pluggable Security Policy
Filters, and Modules Logs Data and Layer 2
Datasheets Overview and
(323-1851-201.5) (323-1851-840) (323-1851-102.7)
and Reference Procedures
(323-1851-180) (323-1851-340)
Licensing OTN I/F, PKT I/F, &
TL-1 Description (323-1851-210) MyCryptoTool PKT/OTN I/F
(323-1851-190) Certificate (323-1851-102.8)
Commissioning Management and
CLI Reference and Testing Quick Start
(323-1851-193) (323-1851-221) (323-1851-341)
Site Manager
Fundamentals
(323-1851-195)
SAOS-based Command Fault and MIB

Configuration Reference
Packet Services Reference Performance
(323-1851-630) (323-1851-690)
Documentation (323-1851-610) (323-1851-650)
Supporting WaveLogic Photonics 6500 Data 6500 Control Plane Submarine Networking
Documentation Coherent Select Application Guide Application Guide Application Guide
(323-1851-980) (NTRN15BA) (NTRN71AA) (NTRN72AA)
6500 Photonic Common 6500 - 5400 / 8700 Fiber Node Return 6500 AC Rectifier
Layer Guide Photonic Layer Interworking Solution Configuration (323-1851-900)
(NTRN15DA) Technical Publications (323-1851-160) (323-1851-985)

New in this release and documentation roadmap xi
6500 T-Series roadmap
Planning a Network Installing, Managing and Maintaining and

Commissioning and Provisioning Troubleshooting
Testing a Network a Network a Network
T-Series Administration Fault Management -

Installation - Performance
Shelf Guide T-Series Shelves and Security
(323-1851-103) (323-1851-301) Monitoring
(323-1851-201.6) (323-1851-520)
Data Communications Configuration -
Planning and Licensing Provisioning and Fault Management -
User Guide (323-1851-210) Operating Parts 1 & 2 Alarm Clearing
(323-1851-101) for T-Series Parts 1 and 2
T-Series Shelf (323-1851-311) for T-Series
Manufacturing Guide
(323-1851-544)
Discontinued Parts (323-1851-103) Configuration -
(323-1851-155) Protection Switching Fault Management -
(323-1851-315) Module
NBI Fundamentals
Replacement
(323-1851-165) Configuration - for T-Series
Bandwidth (323-1851-546)
TL-1 Description for T-Series
for T-Series (323-1851-321) Fault Management -
(323-1851-191) SNMP
CLI Reference Configuration - (323-1851-740)
for T-Series Control Plane
(323-1851-194) (323-1851-330) Fault Management -
Customer Visible
Site Manager Logs
Fundamentals (323-1851-840)
(323-1851-195)
SAOS-based Command Fault and MIB

Packet Services Configuration Reference
Reference Performance
Documentation (323-1851-630) (323-1851-690)
(323-1851-610) (323-1851-650)

xii New in this release and documentation roadmap

1-1
Electrical circuit packs and I/O panels 1-
This section provides an overview of the 6500 Packet-Optical Platform (6500)

electrical circuit packs and their associated procedures. See the following
table for different circuit packs covered in this section.
Note: The electrical interfaces described in this section are intended for
intra-building use only. All electrical I/O interfaces must be isolated from
external (outside) wiring through a channel bank, regenerator, repeater, or
protection equipment approved for that purpose.
Table 1-1
Electrical circuit packs, shelf, and I/O panels in this chapter
Topic
Circuit packs and shelf
“63xE1 working and protection circuit packs (NTK541BAE5 and NTK541PAE5)” on

page 1-2
“24xDS3/EC-1 working and protection circuit packs (NTK543NAE5 and

NTK544NAE5)” on page 1-22
“24xDS3/E3 working and protection circuit packs (NTK543CAE5 and

NTK544CAE5)” on page 1-34
“16xSTM-1e working and protection circuit packs (NTK546CAE5 and

NTK546NAE5)” on page 1-47
“DS1 service module (DSM) shelf (NTN407AA and NTN407AC)” on page 1-57
I/O panels
“E1 I/O panel (NTK571xxE5)” on page 1-79

“DS3/E3/EC-1 I/O panels (NTK572CAE5 and NTK572QAE5)” on page 1-85
“STM-1e I/O panel (NTK573FAE5)” on page 1-89
“I/O panels hardware locations in different shelves” on page 1-92

1-2 Electrical circuit packs and I/O panels
63xE1 working and protection circuit packs (NTK541BAE5 and

NTK541PAE5)
Overview
The 63xE1 working circuit pack supports the mapping of up to 63 E1 signals
to VT2/VC12 containers within the network element.
Figure 1-1 on page 1-2 shows the faceplate of a 63xE1 circuit pack. Figure 1-2
on page 1-3 provides a functional block diagram of the 63xE1 working circuit
pack and Figure 1-3 on page 1-4 provides a functional block diagram of the
63xE1 protection circuit pack.
Figure 1-1
63xE1 circuit pack faceplate
Red triangle (Fail)

- Used to communicate hardware or software failure state
E1
63 Ports
- Card not failed = LED off, Card failed = LED on
Fail
Ready
Green rectangle (Ready)
In Use
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
LOS
Blue diamond (In Use)

- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Yellow circle (LOS)

- Used to communicate loss of signal of any E1 input signal
R99
EEEEE99999
S/N NT030MEE9999E
NTUD99EE
Type E

Figure 1-2
63xE1 working circuit pack block diagram (NTK541BAE5)
I/O Panel E1 LIU

Backplane
E1 Framer/Mapper
XC
155M
SONET/SDH OHP
XC
Processor Power
Module Supply
Legend
OHP Overhead processor
LIU Line interface unit

Figure 1-3
63xE1 protection circuit pack block diagram (NTK541PAE5)
I/O control Protection

control
I/O Panel E1 LIU

Backplane
E1 Framer/Mapper
XC
155M
SONET/SDH OHP
XC
Processor Power
Module Supply
Legend

Supported functionality
The 63xE1 circuit packs (NTK541BAE5 and NTK541PAE5) provide the
following functionality.
• supports mapping of up to 63 E1 signals to VT2/VC12 containers for
transport
• auto and manual provisioning of working and protection circuit packs
• support for G.704 E1 framed and multi-framed signals
• terminates and inserts VT2/VC12 path overhead
• supports unprotected and 1:N equipment protection (2 banks, each bank
providing up to 1:4 equipment protection)
Cross-connection types
The 63xE1 circuit pack supports the following cross-connection types:
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
Cross-connection rates
The 63xE1 circuit pack supports only the VT2/VC12 cross-connection rate.
Performance monitoring
The 63xE1 circuit pack supports the following monitored entities:
PM collection of PDH Line (PPI—PDH Physical Interface) and PDH Path for
E1 facilities
For detailed information and procedures associated with performance

monitoring, refer to Fault Management - Performance Monitoring, 323-1851-
520.
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Cold Restart Required
• Database Not Recovered For Slot

• Equipment OOS with Subtending facilities IS

• Forced Switch Active
• Intercard Suspected
• Internal Mgmt Comms Suspected
• I/O Module Mismatch
• I/O Module Missing
• I/O Module Unknown
• I/O Panel Mismatch
• I/O Panel Missing
• I/O Panel Unknown
• Lockout of working Active
• Lockout of Protection Active
• Manual Switch Active
• Provisioning Incompatible
• Protection Exerciser Failed Working
• Protection Exerciser Failed Protection
• Protection Switch Active
• Protection Sub-module Mismatch
• Protection Sub-module Missing
• Protection Sub-module Unknown
PDH facility
• AIS
• Bipolar Violation
• Loopback Active
• Loss of Frame
• Loss of Signal
• Loss Of Multiframe
• Tx Loss Of Frame
• Tx Loss Of Multiframe
• Tx AIS

VT path
• Loopback Active - Facility
• Loopback Active - Terminal
• Test Access in Progress - Monitor E
• Test Access in Progress - Monitor F
• Test Access in Progress - Monitor EF
• Test Access in Progress - Split A
• Test Access in Progress - Split B
• Test Access in Progress - Split E
• Test Access in Progress - Split F
• Test Access in Progress - Split EF
Common
• Software Auto-Upgrade in Progress
Equipping rules
The following equipping rules apply to 63xE1 circuit packs:
• The 63xE1 circuit pack is a single slot interface.
• The 63xE1 circuit packs can be equipped in 14-slot optical/front electrical
shelf, 14-slot converged optical/front electrical shelf, or 14-slot metro front
electrical shelf type:
— 14-slot shelf supports equipment protection for the 63xE1 circuit packs
in slots 1-4 and 9-12 using 1:N protection (N=1 to 4) in two banks of
1:4. Each bank requires a 63xE1 protection circuit pack. The 63xE1
protection circuit pack in slot 13 of a 14-slot shelf type provides
protection for the 63xE1 working circuit packs in slots 1-4. The 63xE1
protection circuit pack in slot 14 of a 14-slot shelf type provides
protection for the 63xE1 working circuit packs in slots 9-12. The 1:N
protection also requires E1 I/O interface modules and protection
modules in the lower electrical interface section of the optical/front
electrical or converged optical/front electrical shelf. The I/O modules
provide input and output of electrical signals for traffic. The I/O
modules are removable and replaceable. For more information on E1
I/O interface modules, see “E1 I/O panel (NTK571xxE5)” on page
1-79). Unprotected E1 services do not require protection modules.

ATTENTION
Release 01 of the 63xE1 electrical circuit packs NTK541BA/NTK541PA are
only compatible with optical/front electrical shelf NTK503BA and are not
compatible with metro front electrical shelf (NTK503GA), and converged
optical/front electrical shelf (NTK503BDE5) (which have a split battery
return). For metro front electrical shelf (NTK503GA), and converged optical/
front electrical shelf (NTK503BDE5), you must use Release 02 or higher of
the 63xE1 electrical circuit packs NTK541BA/PA. Release 02 or higher of the
63xE1 electrical circuit packs NTK541BA/PA are also compatible with
optical/front electrical shelf NTK503BA.
• 63xE1 circuit packs are not supported in 2-slot, 7-slot, and 32-slot shelves.
• For the 63xE1 circuit packs, you must use cross-connect circuit packs and
optical interface circuit packs that support VT2/VC12 switching granularity.
• An ETSI rack can support cables for a maximum of 1008 E1 ports
(equivalent to two 14-slot optical/front electrical or converged optical/front
electrical shelves fully filled with eight 63xE1 working circuit packs).
• Due to the design of the E1 I/O panel, slots 1 to 4 of a 14-slot optical/front
electrical or converged optical/front electrical shelf cannot contain a mix of
63xE1 circuit packs with any other type of circuit pack using electrical
interfaces such as 24xDS3/EC-1, 24xDS3/E3, 16xSTM-1e, or 24x10/
100BT circuit packs. Similarly, slots 9 to 12 cannot contain a mix of 63xE1
circuit packs with any other type of circuit pack using electrical interfaces
such as 24xDS3/EC-1, 24xDS3/E3, 16xSTM-1e, or 24x10/100BT circuit
packs. However you can have 63xE1 circuit packs in slots 1 to 4 and
24xDS3/EC-1, 24xDS3/E3, 16xSTM-1e, or 24x10/100BT circuit packs
using electrical interfaces in slots 9 to 12, or vice versa.
• Additional equipping rules for 63xE1 electrical interface circuit packs when
using 14-slot optical/front electrical shelf, converged optical/front electrical
shelf, and metro front electrical shelf assemblies in a PTE2000-EEA rack:
— The PTE2000-EEA rack can support cables for a maximum of 504 E1
ports (equivalent to one optical/front electrical shelf, converged optical/
front electrical shelf, or metro front electrical shelf fully filled with eight
63xE1 working circuit packs).
— Between one or two optical/front electrical shelf, converged optical/
front electrical shelf, or metro front electrical shelf assemblies, a
maximum of four 63xE1 working circuit packs can be assigned to slots
1-4.
— Between one or two optical/front electrical shelf, converged optical/
front electrical shelf, or metro front electrical shelf assemblies, a
maximum of four 63xE1 working circuit packs can be assigned to slots
9-12.

• The 63xE1 circuit packs require the appropriate I/O interface hardware.
For this release, the I/O interface hardware can be only installed in the
electrical interface chassis of a 14-slot optical/front electrical shelf,
converged optical/front electrical shelf, or metro front electrical shelf.
— The optical/front electrical shelf or converged optical/front electrical
shelf supports two I/O panels, each supports:
– Up to 252 E1 interfaces (input/outputs) on eight connectors.
– Up to four I/O protection modules.
– Up to eight 120 ohm converter modules.
— The metro front electrical shelf supports eight I/O modules, each
supports up to 63 E1 interfaces on two connectors.
• Equipping rules for the E1 interface hardware in a 14-slot optical/front
electrical or converged optical/front electrical shelf:
— When installing a 63xE1 working circuit pack in any of slots 1 to 4, an
I/O panel is required in slots 1 and 2 (left side) of the electrical interface
chassis.
— When installing a 63xE1 working circuit pack in any of slots 9 to 12, an
I/O panel is required in slots 3 and 4 (right side) of the electrical
interface chassis.
— The default impedance of the E1 interfaces is 75 ohm. Each 63xE1
working circuit pack is associated with two connectors on the I/O
panel. If 120 ohm interfaces are required, two 120 ohm converter
modules are required for each 63xE1 working circuit pack which
connect to the associated connectors in the I/O panel.

• Equipping rules for the E1 interface hardware in a 14-slot metro front

electrical shelf:
— When installing a 63xE1 working circuit pack in slot 1, an I/O module
is required in I/O slot 1 of the electrical interface chassis.
— You must install an I/O module with the correct impedance (75 ohm or
120 ohm). Select either a 75 ohm unprotected, 120 ohm unprotected,
75 ohm 1:N protected, or 120 ohm 1:N protected I/O panel as required.
— You must install a filler I/O module (NTK505XAE5) in all unused I/O
slots.

• Each 63xE1 working circuit pack in the 1:N protection requires an I/O
protection module installed in the I/O panel in the electrical interface
chassis of the 14-slot optical/front electrical or converged optical/front
electrical shelf as follows:
— For bank 1 (left I/O panel):
– I/O protection module 1 protects the 63xE1 circuit pack in slot 1
— For bank 2 (right I/O panel):
ATTENTION
I/O protection modules are not required for the 63xE1 working circuit pack in
a metro front electrical shelf.
• E1 electrical interface cables that terminate on the I/O panel in I/O slots 1
and 2 of the 14-slot optical/front electrical shelf or converged optical/front
electrical shelf or in I/O slots 1 to 4 of the metro front electrical shelf should
be routed on the left side of the bay. E1 electrical interface cables that
terminate on the I/O panel in I/O slots 3 and 4 of the optical/front electrical
shelf or converged optical/front electrical shelf or in I/O slots 9 to 12 of the
metro front electrical shelf should be routed on the right side of the bay.
• To help manage cable routing for E1 electrical interface cables, deploy
working circuit packs and I/O cabling starting from slots 1 and 12 and
working in towards the middle of the 14-slot shelf (for left hand side, deploy
slots 1, 2, 3, and then 4; for right hand side, deploy slots 12, 11, 10, and
then 9).

Technical specifications
Table 1-2 on page 1-12 lists the weight, power consumption, transmitter, and
receiver specifications for the 63xE1 electrical interface circuit pack.
Table 1-2
Technical specifications for 63xE1 electrical interface circuit pack
Parameter 63xE1 working (NTK541BAE5) 63xE1 protection (NTK541PAE5)

Weight (estimated) Circuit packs: 1.3 kg (2.9 lb)
20 m E1 cableform (75 ohm): 18 kg (39.6 lb)
Power consumption Typical (W) Power Budget (W) Typical (W) Power Budget (W)
(Note 1) (Note 2) (Note 1) (Note 2 and Note 3)
22 22 34 34
Line rate 2048 kbit/s +/- 50 ppm
Line code HDB3
Impedance 75 ohm or 120 ohm
Output voltage (nominal) 75 ohm: 2.37 V (mark), 0 ± 0.237 V (space)

120 ohm: 3.00 V (mark), 0 ± 0.300 V (space)
Minimum output return 6 dB (51 kHz to 102 kHz), 8 dB (102 kHz to 3072 kHz)
loss
Cable loss to input 0 dB to 6 dB at 1024 kHz
Minimum input return 12 dB (51 kHz to 102 kHz), 18 dB (102 kHz to 2048 kHz),
loss 14 dB (2048 kHz to 3072 kHz)
E1 cable pinouts and See “E1 cable pinouts and assemblies” on page 1-13
assemblies
E1 I/O panel, interface See “E1 I/O panel, interface circuit pack, and connector port mapping” on
circuit pack, and page 1-14
connector port mapping
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25
(+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-
powered equipment. For practical purposes, the rounded typical power consumption of an equipment
can be used as the equipment heat dissipation when calculating facilities thermal loads (an estimate of
the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The 63xE1 protection circuit pack powers the protection sub-modules. The 37 W figure includes
the power required by one protection sub-module (9 W). A maximum of one protection sub-module is
powered at a given time.

E1 cable pinouts and assemblies

Cable assemblies
Each 63xE1 working circuit pack requires two E1 cable assemblies. The
following sections detail the pinouts and port mappings for the 75 ohm and
120 ohm cable assemblies. These cable assemblies can be ordered from
Ciena (see Planning - Ordering Information, 323-1851-151):
• Figure 1-4 on page 1-15 shows the 75 ohm cable assembly and connector
pinout.
Table 1-3 on page 1-16 shows the 75 ohm cable identification information.
The lower cable provides the receive interfaces, the upper cable provides
the transmit interfaces. For example, the coaxial cable connected to pins
75 and 100 is labeled as ‘RX-04’ (cable/port) in Table 1-3 on page 1-16.
This means that cable provides the receive interface for connector port 04.
• Figure 1-5 on page 1-17 shows the 120 ohm cable assembly and
connector pinout. The 120 ohm twisted pair cable assembly is constructed
with 26 AWG tinned copper solid conductors.
Table 1-4 on page 1-18 shows the cable identification information. The
lower cable provides the receive interfaces, the upper cable provides the
transmit interfaces. Each cable contains eight groups of four twisted pairs
identified by the wire colors as shown in Table 1-4 on page 1-18 (for
example, orange and orange/white pair are twisted pair 1). Group 1
provides the connector ports 1 to 4, group 2 provides connector ports 5 to
8,...., and group 8 provides connector ports 29 to 32.
For example, the twisted pair connected to pins 72 and 104 is labeled as
‘RX- 4’ (cable/group) and has a brown (signal +) and brown/white (signal -
) twisted pair. This means that the twisted pair provides the receive
interface contained in cable group 4 and is the twisted pair 4 in that group.
Group 4 provides connector ports 13 to 16, so twisted pair 4 in group 4 is
connector port 16.
For details on the mapping of connector ports to the ports on the 63xE1 circuit
packs, see “E1 I/O panel, interface circuit pack, and connector port mapping”
on page 1-14.
Connectors
The user must terminate the free end of the cable assemblies with appropriate
connectors. For details of the connectors available for the 75 ohm cable
assemblies, see Planning - Ordering Information, 323-1851-151.

E1 I/O panel, interface circuit pack, and connector port mapping

Table 1-5 on page 1-19 and Table 1-6 on page 1-20 provide details of the
mapping of the ports on the interface connectors of the optical/front electrical
shelf to the ports on the 63xE1 circuit packs. These tables should be read in
conjunction with Table 1-3 on page 1-16 (75 ohm) or Table 1-4 on page 1-18
(120 ohm) to determine the coaxial cable/twisted pair allocation for each port
on each cable.
For the metro front electrical shelf, each 63xE1 circuit pack has an associated
I/O panel. The upper connector on the I/O panel provides interfaces for ports
1 to 32 and the bottom connector provides interfaces for ports 33 to 63 for the
associated 63xE1 circuit pack.

Figure 1-4
E1 75 ohm cable assembly
x
40A
Various lengths
TC
NT
x
up to 100 m
40A
32 position
TC
Tx
NT
coaxial cable
(see Note)
Rx
Upper cable
(Tx)
Tx
Lower cable
x
(Rx)
40A
Rx
TC
NT
x
40A
TC
NT
Pin 71 Pin 36
Pin 106 Pin 1
Pin 140 Pin 35

Pin 105 Pin 70

Table 1-3
E1 75 ohm cable identification information
75 Ohm Cable Assembly - Cable/Wire Identification (refer to Figure 1-4 on page 1-15)
Pos Cable/ Config E1 Pos Cable/ Config E1 Pos Cable/ Config E1 Pos Cable/ Config E1
No Conn No Conn No Conn No Conn
Port # Port # Port # Port #
001 - n.c. 036 - n.c. 071 - n.c. 106 - n.c.
002 - n.c. 037 - n.c. 072 - n.c. 107 - n.c.
003 - n.c. 038 - n.c. 073 - n.c. 108 - n.c.
004 RX-01 Ground 1 039 RX-01 Signal 1 074 RX-02 Signal 2 109 RX-02 Ground 2
020 TX-01 Ground 1 055 TX-01 Signal 1 090 TX-02 Signal 2 125 TX-02 Ground 2

Figure 1-5
E1 120 ohm cable assembly
x
40B
TC
x
40B
NT
Various lengths Twisted pair
TC
NT
up to 100 m cable
Tx
(see Note)
Rx
Tx
Upper cable
Rx
(Tx)
x
40B
Lower cable
TC
x
40B
NT
(Rx) Pin 65 Pin 33

TC
NT
Pin 97 Pin 1
Pin 128 Pin 32

Pin 96 Pin 64
Note: Each twisted pair cable bundle has a
maximum outside diameter of 12.8 mm.

Table 1-4
E1 120 ohm cable identification
120 Ohm Twisted Pair Cable Assembly - Cable/Wire Identification (refer to Figure 1-5 on page 1-17)
Pin Cable- Color E1 Pin Cable- Color E1 Pin Cable- Color E1 Pin Cable- Color E1
Group Conn Group Conn Group Conn Group Conn
Port # Port # Port # Port #
001 RX-1 Or 1 033 RX-1 Or/Wh 1 065 RX-1 Gn 2 097 RX-1 Gn/Wh 2
002 RX-1 Bl 3 034 RX-1 Bl/Wh 3 066 RX-1 Bn 4 098 RX-1 Bn/Wh 4
017 TX-1 Or 1 049 TX-1 Or/Wh 1 081 TX-1 Gn 2 113 TX-1 Gn/Wh 2
018 TX-1 Bl 3 050 TX-1 Bl/Wh 3 082 TX-1 Bn 4 114 TX-1 Bn/Wh 4
Wire Identification 1 Orange (Or) Signal + Orange/White (Or/Wh) Signal -

2 Green (Gn) Signal + Green/White (Gn/Wh) Signal -
3 Blue (Blue) Signal + Blue/White (Bl/Wh) Signal -
4 Brown (Bn) Signal + Brown/White (Bn/Wh) Signal -

Table 1-5
E1 port mappings—252xE1 I/O panel in interface slots 1 and 2 (left side)
E1 Connector 1:
E1 Connector 2:
E1 Connector 3:
E1 Connector 4:
E1 Connector 5:
E1 Connector 6:
E1 Connector 7:
E1 Connector 8:
Interface Card
Interface Card
Interface Card
Interface Card
Interface Card
Interface Card
Interface Card
Interface Card
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
1 Slot 1 1 Slot 1 1 Slot 2 1 Slot 2 1 Slot 3 1 Slot 3 1 Slot 4 1 Slot 4
Port 1 Port 33 Port 1 Port 33 Port 1 Port 33 Port 1 Port 33
32 Slot 1 32 32 Slot 2 32 32 Slot 3 32 32 Slot 4 32
Port 32 Port 32 Port 32 Port 32

Table 1-6
E1 port mappings—252xE1 I/O panel in interface slots 3 and 4 (right side)
E1 Connector 1:
E1 Connector 2:
E1 Connector 3:
E1 Connector 4:
E1 Connector 5:
E1 Connector 6:
E1 Connector 7:
E1 Connector 8:
Interface Card
Interface Card
Interface Card
Interface Card
Interface Card
Interface Card
Interface Card
Interface Card
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
Port Number
32 Slot 9 32 32 Slot 10 32 32 Slot 11 32 32 Slot 12 32
Port 32 Port 32 Port 32 Port 32

Latency
Latency information is available in Latency Specifications, 323-1851-170.

24xDS3/EC-1 working and protection circuit packs (NTK543NAE5 and

NTK544NAE5)
Overview
The 24xDS3/EC-1 working circuit pack supports up to 24 DS3 or EC-1
services.
DS3 signals can be mapped to LO_VC3 or HO_VC3 containers where the

mapping is independent of shelf mode (SDH or SONET) but is defined by the
type of cross-connect circuit packs used in the shelf:
• When HO cross-connect circuit packs are used in the shelf, you must only
use HO-VC3 mapping (except in the case when using the 240G+ STS-1/
VC-3 (240/0G) (NTK557EAE5) cross-connect circuit pack, where you can
use either HO-VC3 or LO-VC3 mapping).
• When LO cross-connect circuit packs are used in the shelf, you can use
either HO-VC3 or LO-VC3 mapping.
The EC-1 signals support VT1.5 and STS-1 connections.
Figure 1-6 on page 1-23 shows the faceplate of a 24xDS3/EC-1 circuit pack.
Figure 1-7 on page 1-24 provides a functional block diagram of the 24xDS3/
EC-1 working circuit pack and Figure 1-8 on page 1-25 provides a functional
block diagram of the 24xDS3/EC-1 protection circuit pack.

Figure 1-6
24xDS3/EC-1 circuit pack faceplate
Red triangle (Fail)

DS3/EC1
24 Ports
Fail
Ready
In Use
1
2
3
4
5
6 (on->no pull, off->can be pulled)
7
8
9
10
11
12
LOS
13
14
15
16
17
18
19
20
Yellow circle (LOS) - one per input
21 - Used to communicate loss of signal of a DS3/EC1 input signal
22
23
24
R99
EEEEE99999
S/N NT030MEE9999E
NTUD99EE
Type E

Figure 1-7
24xDS3/EC-1 working circuit pack block diagram (NTK543NAE5)
DS3/EC-1 LIU
I/O Panel
DS3/EC-1 LIU
DS3/EC-1 Framer/Mapper
Backplane
XC
1.25G
SONET/SDH OHP
XC
Processor Power
Module Supply
Legend

Figure 1-8
24xDS3/EC-1 protection circuit pack block diagram (NTK544NAE5)
I/O Control Protection

control
DS3/EC-1 LIU
I/O Panel
DS3/EC-1 LIU
DS3/EC-1 Framer/Mapper
Backplane
XC
1.25G
SONET/SDH OHP
XC
Processor Power
Module Supply
Legend
OHP Overhead Processor
LIU Line Interface Unit

The 24xDS3/EC-1 circuit packs (NTK543NAE5 and NTK544NAE5) provide
the following functionality.
• supports mapping of up to 24 DS3 signals to STS1/LO_VC3/HO_VC3
containers or Interfacing of 24 EC-1 services, selectable on a per-port
basis
• VT1.5 and STS1 connections for the EC-1 signals
• support for asynchronous (M13), C-BIT, and unframed DS3 signals
• terminates/inserts section and line overhead in EC-1 signals
• terminates and inserts SONET or SDH path overhead for mapped DS3
signals
The 24xDS3/EC-1 circuit pack supports the following cross-connection types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
The 24xDS3/EC-1 circuit pack supports the following cross-connection rates:
• STS1/VC3 (for DS3)
• VT1.5 and STS1 (for EC-1)
The 24xDS3/EC-1 circuit pack supports the following monitored entities:
• PM collection of PDH Line (PPI—PDH Physical Interface) and PDH Path
for DS3 facilities
• PM collection of SONET Section (S) and SONET Line (L) for EC-1
facilities
• PM collection of STS1 PMs for an STS1 path within an EC-1 facility

520.

Alarms
Equipment alarms
• Equipment OOS with Subtending Facilities IS
• Lockout of Working Active
• Software Subsystem Failed
STS path
• AIS
• Excessive Error Rate
• Loss of Pointer
• Payload Label Mismatch

• RFI
• Signal Degrade
• Trace Identifier Mismatch
• Unequipped
PDH facility (DS3/EC-1)

• AIS
• Excessive Pointer Adjustments
• Frequency Out Of Range
• Frame format Mismatch
• Loss Of Signal
• Loss Of Frame
• Loopback Active
• RFI
• Remote alarm Indication
• Signal Fail
• Signal Degrade
• Tx Loss of Frame
• Tx Loss Of Signal
• Tx AIS
• Tx Frequency Out Of Range
• Tx Remote alarm Indication

VT path
• AIS
• Loss Of Pointer
• Unequipped
Equipping rules
The following equipping rules apply to 24xDS3/EC-1 circuit packs:
• The 24xDS3/EC-1 circuit pack is a single slot interface.
• The 24xDS3/EC-1 circuit packs can be equipped in 14-slot optical/front
electrical shelf, 14-slot converged optical/front electrical shelf, optical/rear
electrical shelf, 14-slot converged optical/rear electrical shelf, or metro
front electrical shelf:
— 14-slot shelf supports equipment protection for the 24xDS3/EC-1
circuit packs in slots 1-4 and 9-12 using 1:N protection (N=1 to 4) in
two banks of 1:4. Each bank requires a 24xDS3/EC-1 protection circuit
pack. The 24xDS3/EC-1 protection circuit pack in slot 13 of a 14-slot
shelf type provides protection for the 24xDS3/EC-1 working circuit
packs in slots 1-4. The 24xDS3/EC-1 protection circuit pack in slot 14
of a 14-slot shelf type provides protection for the 24xDS3/EC-1
working circuit packs in slots 9-12. Unprotected or 1:N protected
24xDS3/EC-1 circuit packs require 48xDS3/EC-1 I/O panels. The I/O
modules provide input and output of electrical signals for traffic. The I/
O modules are removable and replaceable. For more information on
DS3/E3/EC-1 I/O interface modules, see “DS3/E3/EC-1 I/O panels
(NTK572CAE5 and NTK572QAE5)” on page 1-85.
— The 24xDS3/EC-1 working circuit packs can be installed in slots 5 and
6 of a metro front electrical shelf. A 24xDS3/EC-1 working circuit pack
in a metro front electrical shelf does not require a protection circuit
pack as only unprotected provisioning is supported on 24xDS3/EC-1
circuit packs in slots 5 and 6.

• The 24xDS3/EC-1 circuit packs are not supported in 2-slot, 7-slot, and 32-
slot shelf types.
• To support the DS3/EC-1 circuit packs with EC1 facilities requiring VT1.5
cross-connects, the cross-connect circuits packs must support VT1.5
switching granularity.
• On 14-slot optical/front electrical or converged optical/front electrical
shelves, slots 1 to 4 cannot contain a mix of 63xE1 circuit packs with
24xDS3/EC-1 circuit packs using electrical interfaces. Similarly, slots 9 to
12 cannot contain a mix of 63xE1 circuit packs with 24xDS3/EC-1 circuit
packs using electrical interfaces. You can have 63xE1 circuit packs in slots
1 to 4 and 24xDS3/EC-1 circuit packs using electrical interfaces in slots 9
to 12, or vice versa.
• On 14-slot optical/front electrical, converged optical/front electrical
shelves, optical/rear electrical, and converged optical/rear electrical
shelves, you cannot mix DS3/EC-1 circuit packs and 10/100BT circuit
packs using the electrical interfaces in slot pairs (1 and 2, 3 and 4, 9 and
10, 11, and 12).
• Additional equipping rules for 24xDS3/EC-1 electrical interface circuit
packs when using 14-slot optical/front electrical shelf, converged optical/
front electrical shelf, and metro front electrical shelf assemblies in a
PTE2000-EEA rack:
— The PTE2000-EEA rack can support cables for a maximum of 192
DS3/EC-1 ports in optical/front electrical or converged optical/front
electrical shelves (equivalent to one optical/front electrical or
converged optical/front electrical shelf fully filled with eight 24xDS3/
EC-1 working circuit packs).
— Between one or two optical/front electrical shelf or converged optical/
front electrical shelf assemblies, a maximum of four 24xDS3/EC-1
working circuit packs can be assigned to slots 1-4. The metro front
electrical shelf assemblies cannot support 24xDS3/EC-1 circuit packs
in slots 1-4.
front electrical shelf, a maximum of four 24xDS3/EC-1 working circuit
packs can be assigned to slots 9-12. The metro front electrical shelf
assemblies cannot support 24xDS3/EC-1 circuit packs in slots 9-12.
— The metro front electrical shelf assemblies can support up to two
24xDS3/EC-1 circuit packs in slots 5 and 6.

• The 24xDS3/EC-1 circuit packs require the appropriate I/O interface

hardware. For this release, the I/O interface hardware can be installed in
the electrical interface chassis of a 14-slot optical/front electrical shelf, a
converged optical/front electrical shelf, an optical/rear electrical shelf, or a
converged optical/rear electrical shelf (different hardware is required for
each shelf). This release supports four I/O panels on each shelf, each
panel supports up to 48 DS3/EC-1 interfaces (inputs and outputs).
• Equipping rules for the DS3/EC-1 interface hardware:
— When installing a 24xDS3/EC-1 circuit pack in slot 1 or 2, an I/O panel
is required in slot 1 of the electrical interface chassis of the 14-slot
optical/front electrical shelf, converged optical/front electrical shelf,
optical/rear electrical shelf, or converged optical/rear electrical shelf.
— When installing a 24xDS3/EC-1 circuit pack in slot 3 or 4, an I/O panel
— When installing a 24xDS3/EC-1 circuit pack in slot 9 or 10, an I/O
panel is required in slot 3 of the electrical interface chassis of the 14-
slot optical/front electrical shelf, converged optical/front electrical
shelf, optical/rear electrical shelf, or converged optical/rear electrical
shelf.
— When installing a 24xDS3/EC-1 circuit pack in slot 11 or 12, an I/O
panel is required in slot 4 of the electrical interface chassis of the 14-
slot optical/front electrical shelf, converged optical/front electrical
shelf, optical/rear electrical shelf, or converged optical/rear electrical
shelf.
• DS3/E3/EC1 electrical interface cables that terminate on the I/O panels in
I/O slots 1 and 2 should be routed on the left side of the bay. DS3/E3/EC1
electrical interface cables that terminate on the I/O panels in I/O slots 3
and 4 should be routed on the right side of the bay.
• To help manage cable routing for DS3/E3/EC1 electrical interface cables,
deploy working circuit packs and I/O cabling starting from slots 1 and 12
and working in towards the middle of the 14-slot shelf (for left hand side,
deploy slots 1, 2, 3, and then 4; for right hand side, deploy slots 12, 11, 10,
and then 9).
• To support DS3 facilities with connections to LO-VC3 endpoints, only the
VT 1.5/VC-12 (NTK557NAE5, NTK557PAE5, NTK557QAE5,
NTK557TBE5, or NTK557GAE5) or the 240G+ STS-1/VC3 (240/0)
(NTK557EAE5) cross-connect circuit packs must be used.

receiver specifications for the 24xDS3/EC-1 electrical interface circuit pack.
\
Table 1-7
Technical specifications for 24xDS3/EC-1 electrical interface circuit pack
Parameter 24xDS3/EC-1 working (NTK543NAE5) and 24xDS3/EC-1 protection

(NTK544NAE5)
Weight (estimated) 0.9 kg (2.0 lb)
Power consumption Typical (W): 30 (Note 1)

Power Budget (W): 30 (Note 2)
DS3 EC-1
Line rate 44736 kbit/s +/- 20 ppm 51480 kbit/s +/- 130 ppm
Line code B3ZS B3ZS
Impedance 75 ohm ± 5%, unbalanced 75 ohm ± 5%
Pulse amplitude 0.36 V to 0.85 V peak N/A
Power level -4.7 dBm to +3.6 dBm -2.7 dBm to +4.7 dBm
Cable distances Maximum 230 ft (70 m) using 735A Maximum 200 m (655 ft)
cables (NTTC03xx)
Line build-out (LBO) Using 735A cables (recommended) (NTTC03xx):

ranges Short: 0 to 115 ft (35.0 m), Long: 115 ft (35.0 m) to 230 ft (70.1 m)
DS3/EC-1 cable See “DS3/E3/EC-1 cable assemblies” on page 1-33

assemblies
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-

DS3/E3/EC-1 cable assemblies

Two DS3/E3/EC-1 cable assemblies are required for each DS3/E3/EC-1
interface (one for DS3/E3/EC-1 in, and one for DS3/E3/EC-1 out). Cable
assemblies are available with either 1, 12, or 24 conductors with straight
connectors (see Figure 1-9 on page 1-33). These cable assemblies use 735 A
coaxial cable.
Figure 1-9
Single Conductor Cable Assembly (NTTC03Ax)
12 Conductor Cable Assembly (NTTC03Cx)
24 Conductor Cable Assembly (NTTC03Ex)
Connectors
connectors. For details of the connectors available for the DS3/E3/EC-1 cable
assemblies, see Planning - Ordering Information, 323-1851-151.
Latency

24xDS3/E3 working and protection circuit packs (NTK543CAE5 and

NTK544CAE5)
Overview
The 24xDS3/E3 working circuit pack supports up to 24 DS3, 24 E3, or 12 DS3
and 12 E3 services. The DS3/E3 signals can be mapped to LO_VC3 or
HO_VC3 containers where the mapping is independent of shelf mode (SDH
or SONET) but is defined by the type of cross-connect circuit packs used in
the shelf:
• When HO cross-connect circuit packs are used in the shelf, you must only
use HO-VC3 mapping (except in the case when using the 240G+ STS-1/
VC-3 (240/0G) (NTK557EAE5) cross-connect circuit pack, where you can
use either HO-VC3 or LO-VC3 mapping).
• When LO cross-connect circuit packs are used in the shelf, you can use
either HO-VC3 or LO-VC3 mapping.
Figure 1-10 on page 1-35 shows the faceplate of a 24xDS3/E3 circuit pack.
Figure 1-11 on page 1-36 provides a functional block diagram of the 24xDS3/
E3 working circuit pack and Figure 1-12 on page 1-37 provides a functional
block diagram of the 24xDS3/E3 protection circuit pack.

Figure 1-10
24xDS3/E3 circuit pack faceplate
Red triangle (Fail)

DS3/E3
24 Ports
Fail
Ready
In Use
1
3
4
5
7
8
9
10
11
12
LOS
13
14
15
16
17
18
19
20
21 - Used to communicate loss of signal of a DS3/E3 input signal
22
23
24
R99
EEEEE99999
S/N NT030MEE9999E
NTUD99EE
Type E

Figure 1-11
24xDS3/E3 working circuit pack block diagram (NTK543CAE5)
DS3/E3 LIU
I/O Panel
DS3/E3 LIU
DS3/E3 Framer/Mapper
Backplane
XC
1.25G
SONET/SDH OHP
XC
Processor Power
Module Supply
Legend

Figure 1-12
24xDS3/E3 protection circuit pack block diagram (NTK544CAE5)

control
DS3/E3 LIU
I/O Panel
DS3/E3 LIU
DS3/E3 Framer/Mapper
Backplane
XC
1.25G
SONET/SDH OHP
XC
Processor Power
Module Supply
Legend

The 24xDS3/E3 circuit packs (NTK543CAE5 and NTK544CAE5) provide the
• supports up to 24 DS3 (ports 1 to 24), 24 E3 (ports 1 to 24), or 12 DS3
and 12 E3 services: ports 1 to 12 as DS3 facilities and ports 13 to 24 as
E3 facilities, or ports 1 to 12 as E3 facilities and ports 13 to 24 as DS3
facilities
• mapping of DS3/E3 signals to STS1/HO_VC3 and LO_VC3 containers
• operate with both the VT1.5/VC-12 and STS-1/VC-3 cross-connect circuit
packs
• support for asynchronous (M13), C-BIT, and unframed DS3 signals
• support for framed (G751) or unframed E3 signals
• terminates and inserts path overhead
The 24xDS3/E3 circuit pack supports the following cross-connection types:
The 24xDS3/E3 circuit pack supports the following cross-connection rates:
• STS1/VC3 (for DS3)
• STS1/VC3 (for E3)
The 24xDS3/E3 circuit pack supports the following monitored entities:
for DS3 facilities
for E3 facilities

520.

Alarms
Equipment alarms
• Equipment OOS with Subtending Facilities IS
• Lockout of Working Active
STS path


PDH facility (E3)

• AIS
• Excessive Pointer Adjustments
• Loss Of Signal
• Loss Of Frame
• Loopback Active
• Remote Defect Indication
• Tx AIS
PDH facility (DS3)

• AIS
• Frequency Out Of Range
• Frame format Mismatch
• Loss Of Signal
• Loss Of Frame
• Loopback Active
• Remote alarm Indication
• Signal Degrade
• Tx Loss Of Signal
• Tx AIS
• Tx Remote alarm Indication
Common

Equipping rules
The following equipping rules apply to 24xDS3/E3 circuit packs:
• The 24xDS3/E3 circuit pack is a single slot interface.
• The 24xDS3/E3 circuit packs can be equipped in 14-slot optical/front
electrical shelf, 14-slot converged optical/front electrical shelf, optical/rear
electrical shelf, 14-slot converged optical/rear electrical shelf, or metro
front electrical shelf:
— 14-slot shelf supports equipment protection for the 24xDS3/E3 circuit
packs in slots 1-4 and 9-12 using 1:N protection (N=1 to 4) in two
banks of 1:4. Each bank requires a 24xDS3/E3 protection circuit pack.
The 24xDS3/E3 protection circuit pack in slot 13 of a 14-slot shelf type
provides protection for the 24xDS3/E3 working circuit packs in slots 1-
4. The 24xDS3/E3 protection circuit pack in slot 14 of a 14-slot shelf
type provides protection for the 24xDS3/E3 working circuit packs in
slots 9-12. Unprotected or 1:N protected 24xDS3/E3 circuit packs
require 48xDS3/E3 I/O panels. The I/O modules provide input and
output of electrical signals for traffic. The I/O modules are removable
and replaceable. For more information on DS3/E3/EC-1 I/O interface
modules, see “DS3/E3/EC-1 I/O panels (NTK572CAE5 and
NTK572QAE5)” on page 1-85.
— The 24xDS3/E3 working circuit packs can be installed in slots 5 and 6
of a metro front electrical shelf. A 24xDS3/E3 working circuit pack in a
metro front electrical shelf does not require a protection circuit pack as
only unprotected provisioning is supported on 24xDS3/E3 circuit
packs in slots 5 and 6.
• The 24xDS3/E3 circuit packs are not supported in 2-slot, 7-slot, and 32-
slot shelf types.
24xDS3/E3 circuit packs using electrical interfaces. Similarly, slots 9 to 12
cannot contain a mix of 63xE1 circuit packs with 24xDS3/E3 circuit packs
using electrical interfaces. You can have 63xE1 circuit packs in slots 1 to
4 and 24xDS3/E3 circuit packs using electrical interfaces in slots 9 to 12,
or vice versa.
• On 14-slot optical/front electrical, converged optical/front electrical
shelves, optical/rear electrical, and converged optical/rear electrical
shelves, you cannot mix DS3/E3 circuit packs and 10/100BT circuit packs
using the electrical interfaces in slot pairs (1 and 2, 3 and 4, 9 and 10, 11
and 12).

• Additional equipping rules for 24xDS3/E3 electrical interface circuit packs

when using 14-slot optical/front electrical shelf, converged optical/front
electrical shelf, and metro front electrical shelf assemblies in a PTE2000-
EEA rack:
DS3/E3 ports in optical/front electrical or converged optical/front
converged optical/front electrical shelf fully filled with eight 24xDS3/E3
working circuit packs).
front electrical shelf, a maximum of four 24xDS3/E3 working circuit
assemblies cannot support 24xDS3/E3 circuit packs in slots 1-4.
front electrical shelf, a maximum of four 24xDS3/E3 working circuit
assemblies cannot support 24xDS3/E3 circuit packs in slots 9-12.
— The metro front electrical shelf assemblies can support up to two
24xDS3/E3, circuit packs in slots 5 and 6.
• The 24xDS3/E3 circuit packs require the appropriate I/O interface
hardware. For this release, the I/O interface hardware can be installed in
the electrical interface chassis of a 14-slot optical/front electrical shelf, a
converged optical/front electrical shelf, an optical/rear electrical shelf, or a
converged optical/rear electrical shelf (different hardware is required for
each shelf). This release supports four I/O panels on each shelf, each
panel supports up to 48 DS3/E3 interfaces (inputs and outputs).
• Equipping rules for the DS3/E3 interface hardware:
— When installing a 24xDS3/E3 circuit pack in slot 1 or 2, an I/O panel is
required in slot 1 of the electrical interface chassis of the 14-slot
— When installing a 24xDS3/E3 circuit pack in slot 3 or 4, an I/O panel is
required in slot 2 of the electrical interface chassis of the 14-slot

— When installing a 24xDS3/E3 circuit pack in slot 9 or 10, an I/O panel

— When installing a 24xDS3/E3 circuit pack in slot 11 or 12, an I/O panel
• DS3/E3/EC1 electrical interface cables that terminate on the I/O panels in
I/O slots 1 and 2 should be routed on the left side of the bay. DS3/E3/EC1
electrical interface cables that terminate on the I/O panels in I/O slots 3
and 4 should be routed on the right side of the bay.
• To help manage cable routing for DS3/E3/EC1 electrical interface cables,
deploy working circuit packs and I/O cabling starting from slots 1 and 12
and working in towards the middle of the 14-slot shelf (for left hand side,
deploy slots 1, 2, 3, and then 4; for right hand side, deploy slots 12, 11, 10,
and then 9).
• To support DS3 or E3 facilities with connections to LO-VC3 endpoints,
only the VT 1.5/VC-12 (NTK557NAE5, NTK557PAE5, NTK557QAE5,
NTK557TBE5, or NTK557GAE5) or the 240G+ STS-1/VC3 (240/0)
(NTK557EAE5) cross-connect circuit packs must be used.

receiver specifications for the 24xDS3/E3 electrical interface circuit pack.
Table 1-8
Technical specifications for 24xDS3/E3 electrical interface circuit pack
Parameter 24xDS3/E3 working (NTK543CAE5) and 24xDS3/E3 protection

(NTK544CAE5)

DS3 E3
Line rate 44736 kbit/s +/- 20 ppm 34368 kbit/s +/- 20 ppm
Line code B3ZS HDB3
Impedance 75 ohm ± 5%, unbalanced 75 ohm
Pulse amplitude 0.36 V to 0.85 V peak N/A
Output voltage N/A 75 ohm: 1.0 V (mark), 0 ± 0.1 V

(nominal) (space)
Cable loss to input N/A 0 dB to 12 dB at 17184 kHz
Power level -4.7 dBm to +3.6 dBm N/A

Cable distances Maximum 230 ft (70 m) using 735A N/A
cables (NTTC03xx)
Line build-out (LBO) Using 735A cables (recommended) N/A

ranges (NTTC03xx):
Short: 0 to 115 ft (35.0 m), Long: 115
ft (35.0 m) to 230 ft (70.1 m)

Table 1-8
Technical specifications for 24xDS3/E3 electrical interface circuit pack (continued)
Parameter 24xDS3/E3 working (NTK543CAE5) and 24xDS3/E3 protection

(NTK544CAE5)
Minimum input return N/A 12 dB (860 kHz to 1720 kHz), 18 dB

loss (1720 kHz to 34368 kHz), 14 dB
(34368 kHz to 51550 kHz)
DS3/E3 cable See “DS3/E3/EC-1 cable assemblies” on page 1-33
assemblies

Two DS3/E3/EC-1 cable assemblies are required for each DS3/E3/EC-1
interface (one for DS3/E3/EC-1 in, and one for DS3/E3/EC-1 out). Cable
assemblies are available with either 1, 12, or 24 conductors with straight
connectors (see Figure 1-13 on page 1-45). These cable assembles use 735A
coaxial cable.
Figure 1-13
Single Conductor Cable Assembly (NTTC03Ax)
12 Conductor Cable Assembly (NTTC03Cx)
24 Conductor Cable Assembly (NTTC03Ex)

Connectors
connectors (see Planning - Ordering Information, 323-1851-151 for details).
For details of the connectors available for the DS3/E3/EC-1 cable assemblies,
see Planning - Ordering Information, 323-1851-151.
Latency

16xSTM-1e working and protection circuit packs (NTK546CAE5 and

NTK546NAE5)
Overview
The 16xSTM-1e working circuit pack supports up to 16 STM-1 electrical
(STM-1e) services.
Figure 1-14 on page 1-47 shows the faceplate of a 16xSTM-1e circuit pack.
Figure 1-15 on page 1-48 provides a functional block diagram of the 16xSTM-
1e working circuit pack and Figure 1-16 on page 1-49 provides a functional
block diagram of the 16xSTM-1e protection circuit pack.
Figure 1-14
16xSTM-1e circuit pack faceplate
Red triangle (Fail)

STM-1e
16 Ports
Fail
Ready
In Use
1
3
4
5
7
8
9
LOS
10
11
12
13
14
15
16

- Used to communicate loss of signal of an STM-1e input signal
R99
EEEEE99999
S/N NT030MEE9999E
NTUD99EE
Type C

Figure 1-15
16xSTM-1e working circuit pack block diagram (NTK546CAE5)
I/O Panel STM-1e LIU

Backplane
2.5G
SONET/SDH OHP
XC
VT/TU processor
XC
Processor Power
Sync Supply
Module
Legend

Figure 1-16
16xSTM-1e protection circuit pack block diagram (NTK546NAE5)

control
I/O Panel STM-1e LIU

Backplane
2.5G
SONET/SDH OHP
XC
VT/TU processor
XC
Processor Power
Sync
Module Supply
Legend

The 16xSTM-1e circuit packs (NTK546CAE5 and NTK546NAE5) provide the
• supports up to 16 STM-1e services
• support for VC12 (AU4 mapped), LO_VC3 (AU4 mapped), and VC4
connections
• support for G703 compliant STM-1e signals (75 Ω unbalanced, CMI line
code)
• terminates/generates RS and MS overhead
• terminates/generates and monitors path overhead as follows:
— for high order STM-1e traffic (VC4), monitors incoming high order
(VC4) paths
— for low order STM-1e traffic (LO_VC3 and VC12):
– terminates/generates high order paths (VC4)
– monitors incoming low order paths (LO_VC3 and VC12)
• supports manual override of the SSM output quality level on the outgoing
STM-1e interface
• supports facility/terminal/channelized loopbacks
• the 16xSTM-1e circuit pack operates with both the VT1.5/VC-12 and STS-
1/VC-3 cross-connect circuit packs. When operating with the STS-1/VC-3
cross-connect circuit packs, only VC4 connections are supported. When
operating with the VT1.5/VC-12 cross-connect circuit packs, VC4,
LO_VC3, and VC12 connections are supported. When operating with the
240G+ STS-1/VC-3 (240/0) (NTK557EAE5) cross-connect circuit packs,
VC4 and LO_VC3 connections are supported.
The 16xSTM-1e circuit pack supports the following cross-connection types:

The 16xSTM-1e circuit pack supports the following cross-connection rates:
• VT2/VC12
• STS1/VC3
• STS3c/VC4
The 16xSTM-1e circuit pack supports the following monitored entities:
• PM collection of SDH Regenerator Section (RS) for STM-1e facilities
• PM collection of SDH Multiplex Section (MS) for STM-1e facilities
• PM collection of High Order SDH Path (P) for VC4 payloads
• PM collection of Low Order SDH VC Path for VC3 payloads

520.
Alarms
Equipment alarms
• Equipment OOS with Subtending facilities IS
• Lockout of working Active


SDH HO path
• AIS
• Excessive Error Ratio
• Loss of Pointer
• RFI
• Signal Degrade
• Unequipped
PDH facility (STM1-e)

• AIS
• Loopback Active
• Loss of Frame
• Loss of Signal
• RFI
• Signal Degrade

• Signal Fail
SDH LO VC-12 path

• AIS
• Excessive Error Ratio
• Loss Of Pointer
• Payload label mismatch
• RFI
• Signal Degrade
• Unequipped
Common

Equipping rules
The following equipping rules apply to 16xSTM-1e circuit packs:
• The 16xSTM-1e circuit pack is a single slot interface.
• The 16xSTM-1e circuit packs can be equipped in 14-slot optical/front
electrical shelf or 14-slot converged optical/front electrical shelf:
— 14-slot shelf supports equipment protection for the 16xSTM-1e circuit
packs in slots 1-4 and 9-12 using 1:N protection (N=1 to 4) in two
banks of 1:4. Each bank requires a 16xSTM-1e protection circuit pack.
The 16xSTM-1e protection circuit pack in slot 13 of a 14-slot shelf type
provides protection for the 16xSTM-1e working circuit packs in slots 1-
4. The 16xSTM-1e protection circuit pack in slot 14 of a 14-slot shelf
type provides protection for the 16xSTM-1e working circuit packs in
slots 9-12. Unprotected or 1:N protected 16xSTM-1e circuit packs
require STM-1e I/O panels in the electrical interface area of the optical/
front electrical or converged optical/front electrical shelf. The I/O
modules provide input and output of electrical signals for traffic. The I/
O modules are removable and replaceable. For more information on
STM-1e I/O interface modules, see “STM-1e I/O panel
(NTK573FAE5)” on page 1-89.
• The 16xSTM-1e circuit packs are not supported in 2-slot, 7-slot, and 32-
slot shelf types.
16xSTM-1e circuit packs using electrical interfaces. Similarly, slots 9 to 12
cannot contain a mix of 63xE1 circuit packs with 16xSTM-1e circuit packs
using electrical interfaces. You can have 63xE1 circuit packs in slots 1 to
4 and 16xSTM-1e circuit packs using electrical interfaces in slots 9 to 12,
or vice versa.
shelves, you cannot mix STM-1e circuit packs and 10/100BT circuit packs
using the electrical interfaces in slot pairs (1&2, 3&4, 9&10, 11&12).

• Additional equipping rules for 16xSTM-1e electrical interface circuit packs

when using 14-slot optical/front electrical shelf or converged optical/front
electrical shelf assemblies in a PTE2000-EEA rack:
STM-1e ports in optical/front electrical or converged optical/front
converged optical/front electrical shelf fully filled with eight STM-1e
working circuit packs).
front electrical shelf assemblies, a maximum of four 16xSTM-1e
working circuit packs can be assigned to slots 1-4.
front electrical shelf assemblies, a maximum of four 16xSTM-1e
working circuit packs can be assigned to slots 9-12.
• To support STM-1e facilities with VC-12 connections, only the VT 1.5/VC-
12 cross-connect circuit packs must be used. To support STM-1e facilities
with LO VC-3 connections, only the VT 1.5/VC-12 (NTK557NAE5,
NTK557PAE5, NTK557QAE5, or NTK557GAE5) or the 240G+ STS-1/
VC3 (240/0) (NTK557EAE5) cross-connect circuit packs must be used.
• MXC circuit pack (NTK557TBE5) is not supported when using 16xSTM-
1e electrical interface circuit packs.

receiver specifications for the 16xSTM-1e electrical interface circuit pack.
Table 1-9
Technical specifications for 16xSTM-1e electrical interface circuit pack
Parameter 16xSTM-1e working 16xSTM-1e protection

(NTK546CAE5) (NTK546NAE5)
Power consumption Typical (W) Power Budget (W) Typical (W) Power Budget (W)
(Note 1) (Note 2) (Note 1) (Note 2)
33 33 35 35
Line rate 155520 kbit/s +/- 20 ppm
Line code CMI
Impedance 75 ohm
Peak output voltage 1.00 V ± 0.1 V

Minimum output return loss 15 dB (8 MHz to 240 MHz)
Cable loss to input 0 dB to 12.7 dB at 78 MHz
Minimum input return loss 15 dB (8 MHz to 240 MHz)

STM-1e cable assemblies Two coaxial, DIN cable assemblies are required for each STM-1e
interface (one for STM-1e in, and one for STM-1e out). For details of the
cables/connectors available for the STM-1e cable assemblies, see
Planning - Ordering Information, 323-1851-151.
Latency

DS1 service module (DSM) shelf (NTN407AA and NTN407AC)

Overview
The DS1 service module (DSM) is a peripheral shelf connected to a 14-slot or
32-slot network element. The DSM connects to the 6500 network element
through the OC-3 ports on a host 8xOC-3/12/STM-1/4, 16xOC-n/STM-n 5G
STS-1/HO SFP, or 16xOC-n/STM-n 5G VT1.5/LO SFP, 16xOC-n/STM-n 10G
STS-1/HO SFP, or 16xOC-n/STM-n 10G VT1.5/LO SFP circuit pack.
The DSM is a terminal DS1 multiplexer. The DSM has three I/O modules.
Each I/O module supports up to 28 DS1 facilities. The DSM has two
numbered slots for DSM 84xDS1 termination module (TM) circuit packs. The
DSM 84xDS1 TM circuit pack is an intermediate reach optical interface which
is compliant with the OC-3x4/STM-1x4 optical specifications and has been
developed for use in the DS1 service module (DSM). The DSM 84xDS1 TM
supports 84 DS1 facilities (see Figure 1-19 on page 1-60). For each DSM
84xDS1 TM, you need one OC-3 interface installed in the 14-slot or 32-slot
shelf.
The 14-slot or 32-slot shelf supports two variants of the DSM shelf kit:
• NTN407AA: This variant includes the DSM shelf (NTN407MA) and two
DSM 84xDS1 termination module (TM) circuit packs (NTN313AA) which
are adapterless. This variant is manufacture discontinued.
ATTENTION
For an unprotected DSM, you need one 84xDS1 TM circuit pack
(NTN313AA) and one DSM shelf (NTN407MA). The 84xDS1 TM circuit pack
(NTN313AA) is manufacture discontinued.
• NTN407AC: This variant includes the DSM shelf (NTN407MA) and two
DSM 84xDS1 termination module (TM) circuit packs (NTN313AC) which
have LC connectors.
ATTENTION
For an unprotected DSM, you need one 84xDS1 TM circuit pack
(NTN313AC) and one DSM shelf (NTN407MA).
Figure 1-17 on page 1-58 and Figure 1-18 on page 1-59 show the faceplate
of a DSM. Figure 1-19 on page 1-60 shows DS1 service module (front cover
open) equipped with 84xDS1 TM circuit packs. Figure 1-20 on page 1-61
provides a functional block diagram of the DSM shelf.

Figure 1-17
DS1 service module shelf
OAM adapter
module
Connector
retaining spring
Cover
lock (2)
Front cover
LEDs
DS1 1-28 in
connectors
out
in
DS1 29-56
connectors out Mounting
bracket in
19-in configuration
in
DS1 57-84
connectors out

Figure 1-18
DSM OAM with cover off
A- Return
(White/red)
A- Battery
(Red) -48V
Mate-N-Lok receptacles Power A

mate directly with breaker
BIP power cable Power B
harnesses breaker
Clip pin
A feed
B feed
B- Return
(White/blue)
A- Battery
(Red/blue) -48V
LUI RS-232
connector
Clip pin
Alarm
connectors
Note: The local user interface (LUI) is an RS-232c port with D-type nine pin connector.
The LUI is used for retrieving messages when performing low-level trouble shooting on the DSM.
Used to access the active 84 xDS1 TM circuit pack, it provides remote login to the host in the
case of an OAM fail.

Figure 1-19
DS1 service module (front cover open) equipped with 84xDS1 TM circuit packs
DSM fan module
LEDs
OAM adapter DS1 connector

module with protective cap
DSM 84xDS1
termination
module in slot 2
DSM 84xDS1
termination
module in slot 1
DS-1
DS-1
DS-1
DS-1
DS-1
DS-1
DS-1
DS-1
57
-8
4
DS-1
DS-1
DS-1
DS-1
Fiber storage
Front Front cover

attaching screws
cover Optical
connector
applicator
Note: The DSM fiber storage tray capacity is 45 ft.

Figure 1-20
DSM shelf block diagram (NTN407AA/NTN407AC)
1-28
From P
Relay
From W
PEC: NTN312AA
DS1 I/O To P DS1 LIU DS1 VT 155M
Framer/ Processor SONET OHP Optics 1
Split
Mapper
To W
1-28 P
Processor Sync Power

PEC: NTN313AC Module Supply
29-56
From P DS1 Termination Module (DS1TM)
DSM Backplane
Relay
From W
PEC: NTN312AA
DS1 I/O To P
Split
To W
29-56
57-84
From P
Relay
From W DS1 LIU DS1 VT 155M
PEC: NTN312AA Optics 1
Framer/ Processor SONET OHP
DS1 I/O To P Mapper
Split
W
To W
57-84
Processor Sync Power

PEC: NTN313AC Module Supply
DS1 Termination Module (DS1TM)
Legend
LIU Line Interface Unit
OHP Overhead Processor
VT Virtual Tributary

The DSM shelf (NTN407AA or NTN407AC) provides the following
functionality.
• connects to the OC-3 ports on the 14-slot or 32-slot shelf using either one
(unprotected) or two (1+1/MSP linear protected) OC-3 optical interfaces.
The OC-3/STM-1 ports must be configured in the SONET mode (OC3
facility) to support a DSM.
• DSM 84xDS1 termination module protection switching is 1+1 non-
revertive. If a working DSM 84xDS1 TM becomes defective, the traffic is
switched to the protection DSM 84xDS1 TM. Switching can also take
place under user control.
• DSM 84xDS1 TM circuit packs support up to 84 DS1 facilities. The two
circuit packs provide 1+1 protection.
• it is recommended to use the DS1 right-angle cable assembly with the
DSM shelf.
The DSM supports the following cross-connection types:
The DSM supports the following cross-connection rates:
• VT1.5 (low order)
• STS1 (high order)
The 14-slot shelf supports both low and high order DSM, depending on the
cross-connect circuit pack type and/or host circuit pack. Refer to Table 1-10
on page 1-63 for details.
The 32-slot shelf supports only high order DSM.

Table 1-10
Supported DSM types
Cross-connect Host 16xOC-n/STM-n DSM type supported
circuit pack type circuit pack type (Note 1)
Low order Low order Low order (Note 2)
Low order High order High order (Note 3)
High order Low order High order (Note 3)
High order High order High order (Note 3)
Note 1: Once a DSM has been provisioned as High Order or Low Order, it can only
be changed by deleting the DSM and re-adding it with different host or cross-connect
circuit packs. Reconfiguring a host or cross-connect circuit pack will not cause the
DSM type to change.
Note 2: Low order DSM circuit packs refers to the ability to provision VT1.5/VC11
connections on the DSM.
Note 3: High order DSM circuit packs refers to the ability to provision STS1/VC3
connections on the DSM.
The DSM supports the following monitored entities:
• PM collection of SONET line (L) for DS1 facilities
• PM collection of SONET path (P) for DS1 facilities
• PM collection of PDH DS1 Line (PPI) and Path (P) for DS1 facilities

520.
Alarms
Equipment alarms
• CP Loss of Host timing Ref.

• OAM Not Available

• Protection Switch complete
OC-n/STM-n
• AIS
• Loss of Frame
• Loss of Signal
• Protection Channel Match Fail
• Protection Scheme Mismatch
• Protection Mode Mismatch
• Protection Switch Byte Fail
• Protection Switch Complete
• RFI
• Signal Degrade
• Signal Fail
STS path
• AIS
• Loss of Pointer
• RFI
• Signal Degrade


• Unequipped
DSM
• Fan Failed
• Fan Missing
• Low Voltage
• Power Failure - A
• Power Failure - B
• Site Provisioning Required
DS1 facility
• AIS
• Bipolar Violations
• Frequency Out of Range
• Loopback Active
• Loss of Frame
• Loss of Signal
• Remote Alarm Indication
• Tx AIS
• Tx Frequency Out of Range
• Tx Remote Alarm Indication
VT path
• AIS
• Loss of Pointer
• RFI
• Signal Degrade


• Unequipped
Common
Equipping rules
The following equipping rules apply to DSM shelf and DSM 84xDS1 TM circuit
packs:
DSM shelf
• The DSM is an external shelf.
• The DSM shelf is supported with 14-slot and 32-slot shelf types. A 14-slot
or 32-slot shelf supports up to 20 protected or unprotected DSMs. DSM
shelf is not supported with 2-slot and 7-slot shelf type.
• Up to eight DSM shelves can be deployed in one bay as follows:
— Up to eight DSM shelves can be deployed without any 6500 shelves in
one bay.
— Up to seven DSM shelves can be deployed with one 14-slot optical or
converged optical shelf in one bay.
— Up to three DSM shelves can be deployed with two 14-slot optical or
converged optical shelves in one bay.
— Up to seven DSM shelves can be deployed with one 14-slot optical/
rear electrical or converged optical/rear electrical shelf in one bay.
— Up to five DSM shelves can be deployed with two 14-slot optical/rear
electrical or converged optical/rear electrical shelves NTK503CA in
one bay.
— Up to five DSM shelves can be deployed with one 14-slot optical/front
electrical shelf, converged optical/front electrical shelf, or metro front
electrical shelf in one bay.

• See the following figures for examples on DSM configurations:

— Figure 1-21 on page 1-69
• Equipping rules for DSM shelf assemblies in a PTE2000-EEA rack:
— A maximum of five DSM shelf assemblies can be installed in a
PTE2000-EEA rack when deploying 14-slot optical, converged optical,
optical/rear electrical, or converged optical/rear electrical shelf
assemblies in the same rack.
— A maximum of three DSM shelf assemblies can be installed in a
PTE2000-EEA rack when deploying a 14-slot optical/front electrical
shelf, converged optical/front electrical shelf, or metro front electrical
shelf assembly in the same rack due to the rules for E1, DS3/EC1/E3,
and/or 10/100BT cabling (see “Equipping rules” on page 1-7 for E1,
“Equipping rules” on page 1-29 and “Equipping rules” on page 1-41 for
DS3/EC1/E3). When deploying DSM shelf assemblies with a 14-slot
optical/front electrical shelf, converged optical/front electrical shelf, or
metro front electrical shelf assembly in a PTE2000-EEA rack, all the
DSM cabling must be routed to one side of the rack (opposite side to
E1, DS3/EC1/E3, or 10/100BT cabling).
— A maximum of three DSM shelf assemblies can be installed in a
PTE2000-EEA rack when deploying a 14-slot optical/front electrical or
converged optical/front electrical shelf assembly in the same rack due
to the rules for STM-1e cabling (see “Equipping rules” on page 1-54
for STM-1e). When deploying DSM shelf assemblies with a 14-slot
optical/front or converged optical/front shelf assembly in a PTE2000-
EEA rack, all the DSM cabling must be routed to one side of the rack
(opposite side to STM-1e cabling).
• When deploying DSMs, either:
— A separate DSM BIP is required to power the DSM shelves (you
cannot power the DSM shelves from a 6500 BIP or power the 14-slot
shelves from a DSM BIP);
or
— Or the 1U BIP/FIP (NTK599DA/NTK599EA) can be used to power up
to eight DSM shelves or one 14-slot shelf and up to seven DSM
shelves in a single bay (no access panel to BIP external alarm
functionality available).
• DSM 84xDS1 shelf is not supported in 2-slot and 7-slot shelf type.

DSM 84xDS1 TM circuit packs

DSM 84xDS1 circuit pack is equipped in a DSM shelf as follows:
• For a DSM with an unprotected DSM 84xDS1 TM circuit pack, the DSM
84xDS1 TM circuit pack must be installed in slot 1 of the DSM shelf.
• For a DSM with a protected DSM 84xDS1 TM circuit pack, the DSM
84xDS1 TM circuit packs must be installed in both slots 1 and 2 of the
DSM shelf. The DSM is automatically configured for 1+1 protection of the
84xDS1 TM circuit packs if they are installed in slots 1 and 2 of the DSM
shelf.
• For a protected DSM, the 84xDS1 TM circuit pack in the odd slot on the
DSM shelf must be provisioned on the OC-3 facility in the odd slot on the
6500 shelf. The 84xDS1 TM circuit pack in the even slot on the DSM shelf
must be provisioned on the OC-3 facility, with the same port number, in the
next higher even slot on the 6500 shelf.
• For unprotected DSM, the 84xDS1 TM circuit pack must be in the odd slot
on the DSM shelf. It can be provisioned on an OC-3 facility in either an odd
slot or an even slot on the 6500 shelf.
• In order for an OC-3 facility to have a DSM provisioned on it, it must not
have any cross-connections, synchronization references, SDCC/LDCC
provisioning or protection provisioned.

Figure 1-21
6500 and DSM bay configurations example—14-slot optical (NTK503AA/NTK503AB) and DSM
shelves (NTN407MA)
DSM BIP
2U 6500 BIP 2U 6500 BIP 2U
DSM BIP 1U DSM BIP 1U
DSM shelf assembly 4U
Cooling unit 3U Cooling unit 3U

Optical shelf assembly 10U Optical shelf assembly 10U
DSM shelf assembly 4U Cooling unit 3U

DSM shelf assembly 4U Optical shelf assembly 10U


DSM shelf assembly 4U 3U
DSM shelf assembly 4U DSM shelf assembly 4U DSM shelf assembly 4U
DSM shelf assembly 4U DSM shelf assembly 4U

DSM shelf Optical & DSM shelf Optical & DSM shelf
assemblies assemblies assemblies
These figures are based on 44U of total available rack space

Figure 1-22
6500 and DSM bay configurations example—14-slot converged optical (NTK503ADE5) and DSM
shelves (NTN407MA)
DSM BIP
2U 6500 BIP 2U 6500 BIP 2U
DSM BIP 1U DSM BIP 1U
Cooling unit Cooling unit
DSM shelf assembly 4U 13U 13U

Converged Converged
optical shelf assembly optical shelf assembly
DSM shelf assembly 4U Cooling unit


Converged 13U
DSM shelf assembly 4U optical shelf assembly

DSM shelf assembly 4U 3U

DSM shelf Converged Converged

assemblies optical & DSM shelf optical & DSM shelf
assemblies assemblies
Note 1: These figures are based on 44U of total available rack space.
Note 2: The cooling unit is integrated on converged optical shelf assembly
(NTK503ADE5).

Figure 1-23
6500 and DSM bay configurations example—14-slot optical/rear electrical (NTK503CA or
NTK503CCE5), 14-slot converged optical/rear electrical (NTK503CDE5), and DSM shelves
(NTN407MA)
6500 BIP 2U 6500 BIP 2U 6500 BIP 2U

DSM BIP 1U DSM BIP 1U DSM BIP 1U
Cooling unit 3U Cooling unit 3U Cooling unit
Optical/rear electrical
Optical/rear electrical Optical/rear electrical 11U/
8U 8U shelf assembly or
shelf assembly shelf assembly 13U
converged
optical/rear electrical
shelf assembly
Air plenum 2U
DSM shelf assembly 4U Optical/rear electrical 8U DSM shelf assembly 4U

shelf assembly

Air plenum 2U
Optical/rear electrical Optical/rear electrical Optical/rear electrical

shelf NTK503CA shelf NTK503CA shelf NTK503CCE5, converged
& DSM shelf assemblies & DSM shelf assemblies optical/rear electrical shelf NTK503CDE5
& DSM shelf assemblies
Note 2: The cooling unit is separate for optical/rear electrical shelf NTK503CA
but is integrated on optical/rear electrical shelf NTK503CCE5 and converged
optical/rear electrical shelf NTK503CDE5.
Note 3: Optical/rear electrical shelf NTK503CA and cooling unit occupies 11U,
optical/rear electrical shelf NTK503CCE5 or converged
optical/rear electrical shelf NTK503CDE5 with integrated cooling unit occupies 13U.
Note 4: A single 1U BIP/FIP (NTK599DA/EA) can be used to power one
6500 shelf and up to seven DSMs.

Figure 1-24
6500 and DSM bay configurations example—14-slot optical/front electrical (NTK503BA), 14-slot
converged optical/front electrical (NTK503BDE5), or 14-slot metro front electrical (NTK503GA)
and DSM shelves (NTN407MA)
6500 BIP 2U 6500 BIP 2U 6500 BIP 2U

DSM BIP 1U DSM BIP 1U DSM BIP 1U
Cooling unit 3U Cooling unit Cooling unit
21U
21U
Optical/front electrical 18U Converged Metro front electrical

shelf assembly optical/front electrical shelf assembly
shelf assembly
Optical/front Converged Metro front

electrical & DSM optical/front electrical & DSM
shelf assemblies electrical & DSM shelf assemblies
shelf assemblies
Note 2: The cooling unit is separate for optical/front electrical shelf NTK503BA
but is integrated on converged optical/front electrical shelf NTK503BDE5 and
metro front electrical shelf NTK503GA.

Table 1-11 on page 1-73 lists the physical specifications for DSM.
Table 1-11
Physical specifications for DSM
Equipment Physical specification

DSM shelf assembly 3.3U (148 mm / 5.83 in.)
Width 439.0 mm / 17.3 in.
Depth 327.0 mm / 12.9 in.
Table 1-12 on page 1-73 lists the weight and power consumption for the DSM.
Table 1-12
Technical specifications for DSMs
Description PEC Weight (estimated) Typical (W) Power

(Note 1) Budget (W)
(Note 2)
DSM Shelf Kit (with LC connectors NTN407AC 9.6 kg (21.2 lb) (fully 55 55
and two DS1x84TM circuit packs) equipped)
DSM shelf (without DS1x84TM) NTN407MA N/A 13 13

Table 1-13 on page 1-74 lists the optical specifications for the DSM 84xDS1
TM interfaces.
Table 1-13
Optical specifications for DSM 84xDSM TM
Classification IR1/S1.1
Transmitter
Nominal wavelength 1310 nm
Transmit output power (max) -8 dBm
Transmit output power (min) -15 dBm

Receiver
Wavelength range 1100 nm to 1600 nm
Receiver sensitivity -28 dBm

Receiver overload -8 dBm
Path penalty 1 dB
Optical path
Nominal reach (Note 2) 15 km
Note 1: All parameter values in the above table achieve an optical system BER better than 1x10-10
when used over G.652 specified SMF-28 fiber. The exception is SR0 where the values are for use over
62.5 μm core, 500 MHz-km modal bandwidth MMF as specified in ANSI T1.416.01-1999.
Note 2: Nominal reach figures are for classification purposes only, as defined in the appropriate
standards.

DSM connector pinouts

Table 1-14 on page 1-75 provides the pinout of the DB9 connector on the DSM
OAM adapter module.
Table 1-14
DSM local user interface (LIU) pinout
Pin Signal Direction Description

1 CD DSM Carrier Detect
2 RX DSM out Receive Data
3 TX DSM in Transmit Data
4 DTR DSM in Data Terminal Ready
5 GND in/out Ground
6 DSR DSM Data Set Ready
7 RTS DSM in Request To Send
8 CTS DSM Clear To Send
9 - Not connected
Table 1-15 on page 1-76 provides the pinout of the wire-wrap connector on the
DSM OAM adapter module.

Table 1-15
DSM OAM adapter module pinout
Env in
1 8
0 0 0 0 0 0 0 0 0
Environmental Ground
Environmental 0 0 0 0 0 0 0 0 0
inputs 1-16
alarm pins
Env in
16
0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0
Ground Environmental
0 0 0 0 0 0 0 0 0
output 1-4
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 Environmental
0 0 0 0 0 0 0 0 0 outputs -RET
C M m sp C M m sp
N.O. 0 0 0 0 0 0 0 0 0 BRET A
COM 0 0 0 0 0 0 0 0 0 BRET B
N.C. 0 0 0 0 0 0 0 0 0 ACO
Audible
Visual 54
1 2 3 4 5 6 7 8 9
Environmental Inputs
1 ENVIN1 ENVIN2 ENVIN3 ENVIN4 ENVIN5 ENVIN6 ENVIN7 ENVIN8 GND
2 ENVIN9 ENVIN10 ENVIN11 ENVIN12 ENVIN13 ENVIN14 ENVIN15 ENVIN16 GND
Environmental Outputs
3 GND GND GND ENVOUT ENVOUT ENVOU1 ENVOU2 ENVOU3 ENVOU4
-RET -RET
Audible/Visual Alarms
4 AUD CR AUD MJ AUD MN AUD VIS CR VIS MJ VIS MN VIS BRET A
N/O N/O N/O spare N/ N/O N/O N/O spare N/
O O
5 AUD CR AUD MJ AUD MN AUD VIS CR VIS MJ VIS MN VIS BRET B
COM COM COM spare COM COM COM spare
COM COM
6 AUD CR AUD MJ AUD MN AUD VIS CR VIS MJ VIS MN N/C ACO
N/C N/C N/C spare N/ N/C N/C N/C
C

DS1 cable pinout and assemblies

Two DS1 cable assemblies are required for every 28 DS1s (one for 28 DS1 in,
and one for 28 DS1 out), see Figure 1-25 on page 1-77 and Figure 1-26 on
page 1-77. Table 1-16 on page 1-78 shows the pinout for the connectors on
the DS1 cable assemblies. The color codes and pinout provided apply to the
suggested DS1 cables. Color codes and pinout may vary by manufacturer.
You are recommended to use ‘right-angle’ cables for the DSM.
Figure 1-25
DS1 straight cable assembly
Pin #1
33 1
64 32
655 ft (max)
Figure 1-26
DS1 right-angle cable assembly
655 ft (max)
Pin #1

Table 1-16
DS1 cable assemblies pinout
DS1 tributary Pin number Color DS1 tributary Pin number Color
1 (ring) 1 bl/w 17 (ring) 17 o/y
1 (tip) 33 w/bl 17 (tip) 49 y/o

2 (ring) 2 o/w 18 (ring) 18 gr/y
2 (tip) 34 w/o 18 (tip) 50 y/gr
3 (ring) 3 gr/w 19 (ring) 19 br/y
3 (tip) 35 w/gr 19 (tip) 51 y/br

4 (ring) 4 br/w 20 (ring) 20 sl/y
4 (tip) 36 w/br 20 (tip) 52 y/sl
5 (ring) 5 sl/w 21 (ring) 21 bl/v
5 (tip) 37 w/sl 21 (tip) 53 v/bl
6 (ring) 6 bl/r 22 (ring) 22 o/v
6 (tip) 38 r/bl 22 (tip) 54 v/o
7 (ring) 7 o/r 23 (ring) 23 gr/v
7 (tip) 39 r/o 23 (tip) 55 v/gr
8 (ring) 8 gr/r 24 (ring) 24 br/v
8 (tip) 40 r/gr 24 (tip) 56 v/br
9 (ring) 9 br/r 25 (ring) 25 sl/v
9 (tip) 41 r/br 25 (tip) 57 v/sl

10 (ring) 10 sl/r 26 (ring) 26 bl/w
10 (tip) 42 r/sl 26 (tip) 58 w/bl
11 (ring) 11 bl/bk 27 (ring) 27 o/w
11 (tip) 43 bk/bl 27 (tip) 59 w/o
12 (ring) 12 o/bk 28 (ring) 28 gr/w
12 (tip) 44 bk/o 28 (tip) 60 w/gr

13 (ring) 13 gr/bk GND 29 —
13 (tip) 45 bk/gr GND 61 —
14 (ring) 14 br/bk GND 30 —

Table 1-16
DS1 cable assemblies pinout (continued)
DS1 tributary Pin number Color DS1 tributary Pin number Color
14 (tip) 46 bk/br GND 62 —

15 (ring) 15 sl/bk GND 31 —
15 (tip) 47 bk/sl GND 63 —
16 (ring) 16 bl/y GND 32 —

16 (tip) 48 y/bl GND 64 bare (see Note)
Note: Unclad sheath drain wire. DS1grounding must be built into the cables during cable assembly.
Ensure shield (sheath) drain wire is connected to ground pin inside connector at the end of cable and
at the end of DS1 cable opposite shelf end of cable (e.g. both ends of shield drain to be grounded).
E1 I/O panel (NTK571xxE5)

Overview
The following E1 I/O panels are supported:
E1 I/O modules - 14-slot optical/front electrical and converged optical/

front electrical shelves
I/O panels in the electrical interface chassis of the 14-slot optical/front
electrical and converged optical/front electrical shelves provide the electrical
interfaces for the 63xE1 circuit packs (see Figure 1-37 on page 1-92 for
hardware locations). Each I/O panel supports 252 E1 inputs/outputs. The
electrical interface chassis contains four slots for mounting the I/O panels, two
for each I/O panel:
• The I/O panel connected to slots 1 and 2 in the electrical interface chassis
supports the 63xE1 working circuit packs in slots 1-4.
• The I/O panel connected to slots 3 and 4 in the electrical interface chassis
supports the 63xE1 working circuit packs in slots 9-12.
Alignment pins on the backplane and an insertion/ejector bar on the I/O

panels aid alignment during installation of the I/O modules.
Each I/O panel has eight 32-port 75 ohm connectors. 75 ohm cable
assemblies, each containing 2x32 coaxial cables, fit directly to the connectors
on the I/O panel. The 6500 supports the following variant of the E1 I/O module
for 14-slot optical/front electrical or converged optical/front electrical shelf:
252xE1 Front 75/120 ohm I/O Panel (1:N or unprotected); NTK571CAE5.
Figure 1-27 on page 1-80 shows the layout of an I/O panel. Figure 1-28 on
page 1-81 provides a functional block diagram of this I/O panel.

Figure 1-27
E1 I/O panel—14-slot optical/front electrical shelf and converged optical/front electrical shelf
Cable
connector
Insertion/ejector
latch
Protection
module Handle
connector
Cable
connector
cover
Protection module
connector cover

Figure 1-28
252xE1 Front 75/120 ohm I/O Panel block diagram (NTK571CAE5)
Backplane
Protection slot
Working slot
Working slot
Working slot
Working slot
1:N protection sub-module
First slot - 63 Tx
First slot - 63 Rx
Second slot - 63 Rx
Fourth slot - 63 Tx
Second slot - 63 Tx
Third slot - 63 Tx
Third slot - 63 Rx
Fourth slot - 63 Rx
120 ohm converter modules (NTK579AAE5)

For 120 ohm interfaces, 120 ohm converter modules are available which fit on
the connectors on the E1 I/O panel. One 120 ohm cable assembly, containing
2x32 twisted pairs, fits on to each converter module. Two fixing screws secure
the converter module to the E1 I/O panel. Figure 1-29 on page 1-82 shows the
layout of a 120 ohm converter module.

Figure 1-29
120 ohm converter module
Fixing screw
E1 input/output
I/O panel connector
connector
I/O protection modules (NTK579NAE5)

For 1:N equipment protection, each 63xE1 working circuit pack requires an I/
O protection module. Each I/O module supports four I/O protection modules,
one for each of the possible 63xE1 working circuit packs in the 1:N equipment
protection bank. The I/O protection module has a blue LED which, when lit,
indicates that the module is active and must not be removed. Two fixing
screws secure the I/O protection module to the I/O panel. Figure 1-30 on page
1-82 shows the layout of an I/O protection module.
Figure 1-30
I/O protection module
Blue In
Use LED
Handle for
insertion/
extraction
Fixing screw

E1 I/O modules - 14-slot metro front electrical shelf

I/O modules in the electrical interface chassis of the metro front electrical shelf
provide the electrical interfaces for the 63xE1 circuit packs (see Figure 1-38
on page 1-93 for hardware locations). Each I/O module supports 63 E1 inputs/
outputs. The electrical interface chassis contains eight slots for mounting the
I/O modules, one for each I/O module:
• The I/O module connected to slot 1 in the electrical interface chassis
supports the 63xE1 working circuit pack in slot 1.

modules aid alignment during installation of the I/O modules.
The 14-slot shelf supports the following variants of the E1 I/O module for
metro front electrical shelf (see Figure 1-31 on page 1-84):
• 63xE1 1:N protection (N=1 to 4) 75 ohm I/O module, NTK571ABE5
• 63xE1 1:N protection (N=1 to 4) 120 ohm I/O module, NTK571ACE5
• 63xE1 unprotected 75 ohm I/O module, NTK571JBE5
• 63xE1 unprotected 120 ohm I/O module, NTK571JCE5

Figure 1-31
E1 I/O module—metro front electrical shelf
Cable
connector
Fixing screw

DS3/E3/EC-1 I/O panels (NTK572CAE5 and NTK572QAE5)

Overview
electrical shelf, the converged optical/front electrical shelf, the optical/rear
electrical shelf, the converged optical/rear electrical shelf, or the metro front
electrical shelf provide the electrical interfaces for the 24xDS3/EC-1 and
24xDS3/E3 circuit packs (see Figure 1-38 on page 1-93, Figure 1-39 on page
1-94, and Figure 1-40 on page 1-95 for hardware locations). Each I/O panel
supports 48 DS3/E3/EC-1 inputs/outputs. The electrical interface chassis
contains four slots for mounting the I/O panels, one for each I/O panel:
• The I/O panel connected to slot 1 in the electrical interface chassis
supports the 24xDS3/EC-1 or and 24xDS3/E3 working circuit packs in
slots 1 and 2 (unprotected or 1:N protected)

The following variants of the DS3/E3/EC-1 I/O panel are available (see Figure
1-32 on page 1-86):
• 48xDS3/E3/EC-1 front access I/O panel, NTK572CAE5 (for unprotected
or 1:N protected configurations). Figure 1-33 on page 1-87 provides a
functional block diagram of this I/O panel.
• 48xDS3/E3/EC-1 rear access I/O panel, NTK572QAE5 (for unprotected or
1:N protected configurations). Figure 1-34 on page 1-88 provides a
functional block diagram of this I/O panel.

Figure 1-32
DS3/E3/EC-1 I/O panels

Figure 1-33
48xDS3/E3/EC-1 front access I/O panel block diagram (NTK572CAE5)
Backplane
protection slot
Even slot
Odd slot
Split Relay Split Relay
Odd slot Even slot

1-24 Rx 1-24 Rx
Odd slot Even slot

1-24 Tx 1-24 Tx

Figure 1-34
48xDS3/E3/EC-1 rear access I/O panel block diagram (NTK572QAE5)
Odd slot Even slot

1-24 Rx 1-24 Rx
Odd slot Even slot

1-24 Tx 1-24 Tx
Even slot
Odd slot
protection slot
Backplane

STM-1e I/O panel (NTK573FAE5)

Overview
electrical or converged optical/front electrical shelf provide the electrical
interfaces for the 16xSTM-1e circuit packs (see Figure 1-39 on page 1-94 for
hardware locations). Each I/O panel has 32 DIN 1.0/2.3 connectors and
supports 32 STM-1e inputs/outputs. The electrical interface chassis contains
four slots for mounting the I/O panels, one for each I/O panel:
supports the 16xSTM-1e working circuit packs in slots 1 and 2
(unprotected or 1:N protected).

This release of 6500 supports the 32xSTM-1e front access I/O panel variant,
NTK573FAE5. This panel supports both unprotected and 1:N protected
configurations (see Figure 1-35 on page 1-90). Figure 1-36 on page 1-91
provides a functional block diagram of this I/O panel.

Figure 1-35
32xSTM-1e I/O panels

Figure 1-36
32xSTM-1e front access I/O panel block diagram (NTK573FAE5)
Backplane
Protection slot
Working slot
Working slot
Relay
Odd slot Even slot

1-16 Rx 1-16 Rx
Odd slot Even slot

1-16 Tx 1-16 Tx

I/O panels hardware locations in different shelves

The following figures show hardware locations of I/O panels in different 14-slot
shelf types:
• Figure 1-37 on page 1-92 and Figure 1-38 on page 1-93 for E1 I/O
hardware locations.
• Figure 1-38 on page 1-93, Figure 1-39 on page 1-94, and Figure 1-40 on
page 1-95 for DS3/E3/EC-1 I/O hardware locations.
• Figure 1-39 on page 1-94 for STM-1e I/O hardware locations.
Figure 1-37
6500 E1 I/O hardware locations—14-slot optical/front electrical or 14-slot converged optical/front
electrical shelf
Access Panel
Power
XC or interface circuit pack
Interface circuit pack

Shelf processor
Shelf processor
MIC
Power
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
I/O slot 1 I/O slot 2 I/O slot 3 I/O slot 4 I/O connector
slot numbers
E1 Connector 7
E1 Connector 7
E1 Connector 1
E1 Connector 2
E1 Connector 3
E1 Connector 4
E1 Connector 5
E1 Connector 6
E1 Connector 8
E1 Connector 1
E1 Connector 2
E1 Connector 3
E1 Connector 4
E1 Connector 5
E1 Connector 6
E1 Connector 8
E1 port connectors
Two connectors per E1 circuit pack
32/31 ports per connector
75 ohm direct connection
120 ohm converter module required for
120 ohm signals
I/O Prot Mod 1
I/O Prot Mod 2
I/O Prot Mod 3

I/O Prot Mod 4
I/O Prot Mod 1
I/O Prot Mod 2
I/O Prot Mod 3

I/O Prot Mod 4
I/O panel
I/O panel
I/O protection modules

One module required for each E1
working circuit pack in the1:N protection
Note: For MSPP, converged MSPP/Broadband, converged MSPP/Photonic, or

converged MSPP/Broadband/Photonic services, slots 7 and 8 must be equipped with XC circuit packs.

Figure 1-38
6500 E1 or DS3/E3/EC-1 I/O hardware locations—14-slot metro front electrical shelf
Cooling Unit
Access Panel
Power

XC circuit pack
XC circuit pack
Shelf processor
Shelf processor
MIC
Power
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
E1 Connector 1
E1 Connector 1
E1 Connector 1
E1 Connector 1
E1 Connector 1
E1 Connector 1
E1 Connector 1
E1 Connector 1
Slot 5 Slot 6
E1 Connector 2
E1 Connector 2
E1 Connector 2
E1 Connector 2
E1 Connector 2
E1 Connector 2
E1 Connector 2
E1 Connector 2
DS3/E3/EC-1
Slot 1 Slot 2 Slot 3 Slot 4 I/O panel Slot 9 Slot 10 Slot 11 Slot 12

Figure 1-39
6500 DS3/E3/EC-1 or STM-1e I/O hardware locations—14-slot optical/front electrical or 14-slot
converged optical/front electrical shelf
Access Panel
Power

Shelf processor
Shelf processor
MIC
Power
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
I/O slot 1 I/O slot 2 I/O slot 3 I/O slot 4 I/O connector
slot numbers
DS3/E3/EC1 or STM-1e port

connectors.
Slot 1 Slot 2 Slot 3 Slot 4 Slot 9 Slot 10 Slot 11 Slot 12
Each I/O panel supports two DS3/EC1,
DS3/E3 or STM-1e circuit packs.
For DS3/E3/EC1, 24 Tx (upper) and

24 Rx (lower) connectors for each slot.
For STM-1e, 16 Tx (upper) and
I/O panel I/O panel I/O panel I/O panel 16 Rx (lower) connectors for each slot.
Note: For MSPP, converged MSPP/Broadband, converged MSPP/Photonic, or

converged MSPP/Broadband/Photonic services, slots 7 and 8 must be equipped with XC circuit packs.

Figure 1-40
6500 DS3/E3/EC-1 hardware locations—14-slot optical/rear electrical or 14-slot converged optical/
rear electrical shelf
I/O panel I/O panel I/O panel I/O panel I/O connector
slot numbers
DS3/E3/EC1 or 10/100BT port connectors.

Slot 12 Slot 11 Slot 10 Slot 9 Slot 4 Slot 3 Slot 2 Slot 1 Each I/O panel supports two DS3/EC1
or DS3/E3 circuit packs.
For DS3/E3/EC1, 24 Tx (upper) and

24 Rx (lower) connectors for each slot.
I/O slot 4 I/O slot 3 I/O slot 2 I/O slot 1
View from rear of shelf

Electrical circuit packs provisioning procedures

The following flowcharts provide the steps/procedures that must be performed
to have the electrical circuit packs and DSMs ready to carry traffic.
For protection switching information and procedures, refer to Configuration -

Protection Switching, 323-1851-315.


Table 1-17 on page 1-98 provides references to different procedures covered

in this section.
Table 1-17
Procedures in this section
Topic
Procedure 1-1, “Provisioning a circuit pack automatically”
Procedure 1-2, “Installing electrical I/O hardware and I/O panels in the 14-slot 6500 shelf”
Procedure 1-3, “Routing electrical I/O cables into the electrical interface area”
Procedure 1-4, “Routing STM-1e coaxial cables onto the 6500 shelf”
Procedure 1-5, “Adding a facility to an equipment”
Procedure 1-6, “Adding a path connection”
Procedure 1-7, “Editing the DSM OAM link setting”

Procedure 1-8, “Provisioning a DSM 84xDS1 TM automatically”
Procedure 1-9, “Defining or editing a site address for a DSM”
Procedure 1-10, “Changing the primary state of a facility”

Procedure 1-11, “Changing the primary state of a circuit pack”
Procedure 1-12, “Deleting a facility from an equipment”
Procedure 1-13, “Deleting a circuit pack”

Procedure 1-1
Provisioning a circuit pack automatically
When automatic equipping is enabled, an electrical circuit pack is
automatically provisioned when the circuit pack is inserted in a shelf. No
facilities are auto-created. To enable automatic equipping, refer to the
“Enabling/disabling slot-based automatic equipping” procedure in
Administration and Security, 323-1851-301.
Refer to “Equipping rules” on page 1-7 for supported shelves and slots for the
63xE1 circuit packs.
Refer to “Equipping rules” on page 1-29 for supported shelves and slots for
the 24xDS3/EC-1 circuit packs.
the 24xDS3/E3 circuit packs.
the 16xSTM-1e circuit packs.
If a circuit pack is inserted in an unsupported slot, an Autoprovisioning

Mismatch alarm is raised.
CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use anti-static protection to avoid damaging circuit
packs.

Procedure 1-1 (continued)

Prerequisites
To perform this procedure, you must:
• if provisioning equipment for an empty equipment slot, ensure the last
equipment that occupied the slot and its related facilities and cross-
connects have been deleted.
• ensure the plastic pin protector on the circuit pack has been removed.
• ensure automatic equipping is enabled.
Step Action
1 Wear an appropriate ESD personal grounding device to dissipate

electrostatic charges. If you are wearing an anti-static wrist strap, connect the
cord on the shelf installed in a grounded rack/cabinet or clip to a suitable
ground point.
2 Insert the circuit pack in the correct slot in the shelf.
If you are logged in to Site Manager when you automatically provision a circuit
pack, click Refresh in the Equipment & Facility Provisioning application to
display the circuit pack in the list of available equipment.
—end—

Procedure 1-2
Installing electrical I/O hardware and I/O panels in the
14-slot 6500 shelf
Use this procedure to install electrical I/O panels in a 6500 shelf, as follows:
• E1 I/O panels (optical/front electrical and converged optical/front electrical
shelves)
• E1 I/O protection modules (on front E1 I/O panels)
• 120-ohm converters (on front E1 I/O panels)
• 32xSTM-1e I/O panels (optical/front electrical and converged optical/front
electrical shelves)
• 48xDS3/E3/EC-1 I/O panels (optical/front electrical shelf, converged
optical/front electrical shelf, optical/rear electrical shelf, converged optical/
rear electrical shelf, or Metro front electrical shelf)
• E1 I/O modules (Metro front electrical shelf)
The interfaces described in this procedure are intended for intrabuilding use
only.
CAUTION
packs.
Step Action
DANGER
Risk of eye injury
Wear eye protection such as safety goggles or safety
glasses with side guards when you work with air filters
or in proximity to the shelf air exhaust.

ground point.


Installing electrical I/O hardware and I/O panels in the 14-slot 6500 shelf
Step Action
2 Select the equipment you are installing:

If you Then
are installing E1 I/O hardware in the 14-slot optical/front go to step 3
electrical or 14-slot converged optical/front electrical shelf
are installing 48xDS3/E3/EC-1 I/O panels, 32xSTM-1e I/O go to step 38
panels, or Front I/O panel (Multi-Service) in the 14-slot
optical/front electrical or 14-slot converged optical/front
electrical shelf
are installing 48xDS3/E3/EC-1 I/O panels in the 14-slot go to step 58
optical/rear electrical or 14-slot converged optical/rear
electrical shelf
are installing E1 I/O modules or a 48xDS3/E3/EC-1 I/O go to step 70
panel in the 14-slot metro front electrical shelf
have installed all the electrical I/O hardware and I/O panels you have
as applicable to your configuration completed the
procedure.
Installing E1 I/O hardware in the 14-slot optical/front or 14-slot converged optical/front electrical
shelf
3 In the electrical interface area, metal covers protect the electrical I/O section
of the backplane. Use the slotted screwdriver to unfasten the thumbscrews
that secure the covers.
4 Remove the covers for I/O slots 1, 2, 3, or 4, as required, and store them for
future use.
Preparing to install the E1 I/O panel (removing the drip tray, the air filter and filter tray)
5 Unfasten the thumbscrew on the top left hand side of the drip tray. See Figure
1-41 on page 1-110.
6 While gripping the thumbscrew, pull the retractable pin on the right hand side,
pull the drip tray forward, down and out. Store the tray in a safe place.
You will install the drip tray back in step 27.
7 Check the shelf product engineering code (PEC).
If Then go to
the PEC includes the suffix E5 step 8
otherwise step 9
8 Press the clips on both sides of the filter and slide the filter out. Store the filter
in a safe place (you will re-install it in step 24 and step 25). Go to step 14.
9 Open the fiber channel door by pulling the tabs on both sides.


Step Action
10 Press the black button in the middle of the fiber channel to unlock the filter
tray. The front side of the filter tray unlocks and exposes the filter.
11 Lift and remove the filter and store it in a safe place. You will install the filter
back in step 26.
12 Look into the electrical interface cage area under the filter tray and locate the
left and right retractable pins at the bottom rear of the filter tray.
13 While pulling the retractable pins on each side, pull the filter tray forward,
down and out. Store the tray in a safe place. You will install the filter tray back
in step 26.
14 Remove the E1 I/O panel from its packaging.
15 Remove the protective covers from the E1 I/O connectors (at the back of the
E1 I/O panel) you will use.
16 Hold the two E1 I/O panel handles with two hands.
17
CAUTION
Risk of connector damage
Exercise caution when you insert the panel into the
opening of the electrical interface area to avoid
damaging the backplane connector pins.
Insert the panel at an angle (see Figure 1-42 on page 1-111) into the opening
of the electrical interface cage area at the bottom of the 14-slot optical/front
electrical or 14-slot converged optical/front electrical shelf until the panel
passes the tabs on the inside walls of the shelf (on which the air intake baffle
sits). Position the panel vertically. Push the panel toward the backplane until
it engages the coarse guide pins, then the fine guide pins.
18
CAUTION
Exercise caution when you engage the panel into the
backplane connector to avoid bending connector pins.
Lift the insertion/ejection bar and while keeping the bar lifted continue to
carefully slide the E1 I/O panel horizontally into the shelf until you engage the
panel into the backplane connector.
19 Press the insertion/ejection bar down to completely engage the panel into the
backplane.
20 Tighten the five fixing thumbscrews to secure the panel in place. Torque to
1 N-m (9 lb-in.).
21 Remove the handles on the E1 I/O panel and store them for future use.


Step Action
22 Repeat step 14 to step 21 for the remaining E1 I/O panel, if required. Then,
go to step 23.
23 Check the shelf product engineering code (PEC).
If Then go to
the PEC includes the suffix E5 step 24
otherwise step 26
24 Hold the filter such that the arrows on the outside edges of the filter that
indicate the direction of the air flow are pointing upwards.
25 Slide the filter back into the shelf. Press the filter all the way in. Then, go to
step 27.
26 Re-install the filter tray and the filter by performing step 9 to step 13 in the
reverse order. Make sure that the arrows on the outside edges of the filter that
27 Re-install the drip tray by performing step 5 to step 6 in the reverse order.
Installing E1 I/O protection modules
28 Remove the E1 I/O protection module from its packaging.
29 On the protection module, remove the protective cover to expose the side that
you will insert into the corresponding connector on the E1 I/O panel.
30 Hold the module by the handle, align the module on the screws, and carefully
insert the module into the applicable connector on the E1 I/O panel (see
Figure 1-43 on page 1-112).
31 Tighten the two fixing pins to secure the module in place. Torque to 5 lb-in.
After a few seconds, the blue LED turns on, then turns off.
When you provision 1FORN protection against the associated protection
circuit pack, the protection module is put in-service and the blue LED turns
on.
Do not remove the protection module if the blue LED is on.
32 Repeat step 28 to step 31 for the remaining E1 I/O protection modules, if
required (up to four for each E1 I/O panel).
33 Select your next step.
If your application Then go to
requires 120-ohm converter modules step 34
does not require 120-ohm converter modules step 1


Step Action
Installing 120-ohm converter modules

34 Remove the 120-ohm converter module from its packaging.
35 Align the module against the pins on the applicable connector on the E1 I/O
panel and carefully insert the converter module into the connector (see
Figure 1-43 on page 1-112).
36 Torque the two fixing pins to 5 lb-in. to secure the module in place.
37 Repeat step 34 to step 36 for the remaining 120-ohm converter modules, if
required (up to eight for each E1 I/O panel). Then, go to step 1.
Installing DS3/E3/EC-1 I/O panels or 32x STM-1e I/O panels in the 14-slot optical/front electrical or
14-slot converged optical/front electrical shelf
38 In the electrical interface area, metal covers protect the electrical I/O section
of the backplane. Unfasten the thumbscrews that secure the covers.
39 Remove the covers for I/O slots 1-2, 3-4, 9-10, and 11-12 as required.
40 Unfasten the thumbscrew on the top left hand side of the drip tray.
41 While gripping the thumbscrew, pull the retractable pin on the right hand side,
pull the drip tray forward, down and out. Store the tray in a safe place.
You will install the drip tray back in step 57.
42 Open the fiber channel door by pulling the tabs on both sides.
43 Press the black button in the middle of the fiber channel to unlock the filter
tray. The front side of the filter tray unlocks and exposes the filter.
44 Lift and remove the filter and store it in a safe place.
You will install the filter back in step 56.
45 Look into the electrical interface area under the filter tray and locate the left
and right retractable pins at the bottom rear of the filter tray.
46 While pulling the retractable pins on each side, pull the filter tray forward,
down and out. Store the tray in a safe place.
You will install the filter tray back in step 56.
47 Remove the panel from its packaging.
48 Remove the cover on the connectors at the back of the panel.


Step Action
49
CAUTION
Hold the panel with two hands and insert it into the opening of the electrical
interface area at the bottom of the 14-slot converged optical/front electrical or
14-slot converged optical/front electrical shelf until the panel passes the tabs
on the inside walls of the shelf (on which the air intake baffle sits).
50 Position the panel vertically so that the coarse guide pin bushing in the middle
of the panel engages the coarse middle guide pin.
51 Push the panel toward the backplane to engage the fine guide pins.
52
CAUTION
carefully slide the panel horizontally into the shelf until you engage the panel
into the backplane connector.
backplane. Do not push the bottom of the panel when you press the bar down.
54 Tighten the three fixing thumbscrews to secure the panel in place. Torque to
1 N-m (9 lb-in.).
55 Repeat step 47 to step 54 for the remaining panels, if required. Then, go to
step 56.
56 Re-install the filter tray and the filter by performing step 42 to step 46 in the
reverse order. Make sure that the arrows on the outside edges of the filter that
57 Re-install the drip tray by performing step 40 to step 41 in the reverse order.
Then, go to step 1.


Step Action
Installing DS3/E3/EC-1 I/O panels in the 14-slot optical/rear or 14-slot converged optical/front
electrical shelf
58 To install I/O hardware in the 14-slot optical/rear or 14-slot converged optical/
front electrical shelf, you are working on the rear of the shelf. At the rear of the
shelf, metal covers protect the electrical I/O section of the backplane.
Unfasten the thumbscrews that secure the covers.
59 Remove the covers for I/O slots 1-2, 3-4, 9-10, 11-12, as required, and store
them for future use.
60 Remove the I/O panel from its packaging.
62 Carefully align the slot at the top of the panel in front of the tab at the back of
the shelf, then slide the slot over the tab.
63 Make sure that the panel vertically aligned against the guide pins.
64 Push the panel towards the shelf until it engages the fine guide pins.
65
CAUTION
Pull the insertion/ejection bar towards you and while keeping the bar pulled
carefully push the I/O panel horizontally along the guide pins until you engage
the module into the backplane connector.
66 Press the insertion/ejection bar to completely engage the panel into the
backplane.
1 Nm (9 lb-in.).
68 Repeat step 58 to step 67 for the remaining I/O panels, if required. Then, go
to step 1.


Step Action
Installing E1 I/O modules (see Figure 1-44 on page 1-113), a DS3/E3/EC-1 I/O panel in the 14-slot
metro front electrical shelf
ATTENTION
Figure 1-44 on page 1-113 also shows E1 cables installed. You will
install E1 cables in Procedure 1-3, “Routing electrical I/O cables into
the electrical interface area”.
Removing the filter

69
CAUTION
Remove the filter before removing and inserting E1 I/O
modules to avoid damaging the filter.
Press the clips on both sides of the filter and slide the filter out. Store the filter
in a safe place, you will re-install it in step 84.
If Then go to
you want to install the E1 I/O modules step 71
you want to install a DS3/E3/EC-1 I/O panel step 74
you have installed all the required equipment go to step 84 to re-
install the filter
Installing the E1 I/O modules in the 14-slot metro front electrical shelf
71 Hold the E1 I/O module by the handle and insert it at an angle inside the
electrical interface area to clear the bottom of the fiber channel.
72 Slide the module in along the guide rails, and carefully engage it into the
connector. Press the handle until the module engages into the backplane.
73 Tighten the two Phillips screws that secure the module. Torque to 0.7 Nm
(6 lb-in.).
Installing a DS3/E3/EC-1 I/O panel in the 14-slot metro front electrical shelf
74 In the electrical interface area, a metal cover protects the middle section of
the backplane, where you will install the panel. Unfasten the thumbscrews
that secure the cover.
75 Remove the cover.
76 Remove the panel from its packaging.


Step Action
78
CAUTION
Hold the panel with two hands and insert it into the opening of the electrical
interface area at the bottom of the 14-slot metro front electrical shelf.
79 Position the panel vertically so that the coarse guide pin bushing in the middle
of the panel engages the coarse middle guide pin.
80 Push the panel toward the backplane to engage the fine guide pins.
81
CAUTION
carefully slide the panel horizontally into the shelf until you engage the panel
into the backplane connector.
backplane. Do not push the bottom of the panel when you press the bar down.
1 N-m (9 lb-in.).
Re-installing the filter
84 Hold the filter such that the arrows on the outside edges of the filter that
85 Slide the filter back into the shelf. Press the filter all the way in. Then, go to
step 1.
—end—

Figure 1-41
Removing and installing the drip tray and the filter tray (example shows an optical/front electrical
shelf)

Figure 1-42
Installing the E1 I/O panel in the 14-slot optical/front electrical shelf (side panels and elements at
the top not shown for visibility)

Figure 1-43
Example of E1 hardware installed in the electrical interface area of the 14-slot optical/front
electrical shelf

Figure 1-44
E1 I/O modules installed in the electrical interface area of the 14-slot metro front electrical shelf
(example also shows E1 cables connected)

Procedure 1-3
Routing electrical I/O cables into the electrical
interface area
Use this procedure to route electrical I/O cables into the electrical interface
area where installation of electrical hardware is supported. For details, see the
information on the electrical interface area in the “Shelf and equipment
descriptions” chapter in Part 1 of Planning, NTRN10EY). This procedure does
not apply to the optical shelf.
The interfaces described in this procedure are intended for intrabuilding use
only.
For cable routing to circuit pack faceplates, see Procedure 1-4, “Routing STM-
1e coaxial cables onto the 6500 shelf”.
See the following illustrations for examples of the respective cable routing in
this procedure.
6500 shelf type
Shelf Optical/front Optical/rear 14-slot 14-slot 14-slot 7- 14-slot

electrical electrical converged converged slot or 32- metro
optical/front optical/rear slot front
electrical electrical packet- electrical
optical
Cable E1 Applicable Not applicable Applicable Not applicable Not Applicable

type (Figure 1-45 on applicable
page 1-119)
DS-3 Applicable Applicable Applicable Applicable Not Applicable

(Figure 1-46 on (Figure 1-47 on applicable
page 1-120) page 1-121)
STM-1e Applicable Not applicable Applicable Not applicable Not Not

applicable applicable


Routing electrical I/O cables into the electrical interface area
CAUTION
packs.
Prerequisites
Make sure you have:
• a torque flathead screwdriver (to secure cable headshells in place)
• a mini-BNC insertion/removal tool (A00554187) to connect DS-3 cables
• STM-1e cables are single-ended. If required, you must cut the cables at
the required length and connectorize them with the connectors ordered
• the engineering documentation package (EDP), installation
documentation package (IDP), or equivalent site/network engineering
plans, which include the cable routing information for your configuration.
Ciena provides a custom service that can deliver this documentation
(contact your Ciena representative for details of this service). If not
provided by Ciena, it is the responsibility of the user to obtain the
necessary information (for example, from a OnePlanner design file).
Guidelines
If you are installing multiple shelves and you are routing cables overhead, start
routing the cables from the bottom shelf up. If you are routing cables through
the floor, start from the top shelf down.
If you are routing cables for multiple I/O modules or panels, start with the
innermost module or panel and continue towards the side of the rack. For
each vertical pair of I/O modules, start by routing the cables from the bottom
module.
Make sure that at the front of the shelf the cables allow the shelf cover to close.
Step Action

ground point.


Step Action

If the shelf cover is Then
installed on the area of the shelf you must remove the shelf cover
access from the card cage (refer to
the applicable procedure
for installing or removing
the shelf front cover in the
Installation technical
publication specific to the
respective 6500 shelf
type).
not installed go to step 3

If you Then
are routing E1 I/O cables to the 14-slot optical/ go to step 4
front electrical or 14-slot converged optical/
front electrical shelf
are routing DS-3 I/O cables to the 14-slot go to step 11
optical/front electrical or 14-slot converged
optical/front electrical shelf
are routing STM-1e cables to the 14-slot go to step 16
optical/front electrical or 14-slot converged
optical/front electrical shelf
are routing DS-3 I/O cables to the 14-slot go to step 18
optical/rear electrical or 14-slot converged
optical/rear electrical shelf
are routing E1 I/O cables to the 14-slot metro go to step 23
are routing DS-3 I/O cables to the 14-slot metro go to step 26
have routed all the electrical I/O cables as you have completed the
applicable to your application procedure
Routing E1 I/O cables to the 14-slot optical/front electrical or 14-slot converged optical/front
electrical shelf
4 Route the cable along the side of the rack and through the side cutout into the
electrical interface area of the shelf (see Figure 1-45 on page 1-119). If the
E1 I/O panel to which you are connecting is on the right hand side, route the
cable on the right hand side. If on the left, route on the left.


Step Action
5 Check the type of cable you are installing.

If you are using Then go to
120-ohm cables step 6
75-ohm cables step 8
6 Make sure that you have installed the required 120-ohm converter module
(see Procedure 1-2, “Installing electrical I/O hardware and I/O panels in the
14-slot 6500 shelf”).
7 Unfasten and remove the protective cover to expose the connectors on the
converter module.
8 Align the cable headshell on the pins and push firmly into the required
connector on the I/O panel or the 120-ohm converter module, as required.
9 Tighten the two fixing pins to secure the headshell in place. Torque to 5 lb-in.
10 Repeat step 4 to step 9 for all remaining E1 I/O cables you must route to the
14-slot optical/front electrical shelf. Then, go to step 3.
Routing DS-3 I/O cables to the 14-slot optical/front electrical or 14-slot converged optical/front
electrical shelf
11 Route the DS-3 cables along the side of the rack and through the side cutout
into the electrical interface area of the shelf (see Figure 1-46 on page 1-120).
If you are connecting the cables to panel Then route and connect the
slots cables to the
1-2 and 3-4 left of the shelf
9-10 and 11-12 right of the shelf
13 Group and tie Rx cables together. Route the cables along the equipment rack
uprights and secure them to the rack.
14 Group and tie Tx cables together. Route the cables along the equipment rack
15 Repeat step 11 to step 14 for all remaining DS-3 I/O cables you must route
to the 14-slot optical/front electrical shelf. Then, go to step 3.
Routing STM-1e cables to the 14-slot optical/front electrical or 14-slot converged optical/front
electrical shelf
16 Route the cable along the side of the rack and through the side cutout into the
electrical interface area of the shelf. If the 32xSTM-1e I/O panel to which you
are connecting is on the right hand side, route the cable on the right hand
side. If on the left, route on the left.


Step Action
17 Repeat step 16 for all remaining STM-1e cables you must route to the 14-slot
optical/front electrical or 14-slot converged optical/front electrical shelf. Then,
go to step 3.
Routing DS-3 I/O cables to the 14-slot optical/rear electrical or 14-slot converged optical/rear
electrical shelf
18 Route the DS-3 cables along the side of the rack, inside the rack (see Figure
1-47 on page 1-121).
If you are connecting the cables to Then , as you are facing the rear of the
panel slots shelf, route and connect the cable to the
1-2 and 3-4 right-hand side
9-10 and 11-12 left-hand side
20 Group and tie Rx cables together. Route the cables along the equipment rack
21 Group and tie Tx cables together. Route the cables along the equipment rack
22 Repeat step 18 to step 21 for all remaining DS-3 I/O cables you must route
to the 14-slot optical/rear electrical shelf. Then, go to step 3.
Routing E1 I/O cables to the 14-slot metro front electrical shelf
23 Start with the cable corresponding to the innermost module in the bottom row,
then the innermost module in the top row, and continue towards the side of
the equipment rack. For each vertical pair of I/O modules, start by routing the
cables from the bottom module.
24 Route the cable through the cutout under the card cage area into the
electrical interface area of the shelf. If the E1 I/O module to which you are
connecting is on the right hand side, route the cable on the right hand side. If
on the left, route on the left.
25 Repeat step 23 and step 24 for all remaining E1 cables you must route to the
6500 shelf. Then, go to step 3.
Routing DS-3 I/O cables to the 14-slot metro front electrical shelf
26 Route the cables through the cutout under the card cage area into the
electrical interface area of the shelf. Then, go to step 3.
—end—

Figure 1-45
Installing E1 I/O cables (front E1 I/O panel)

Figure 1-46
Installing DS3 I/O cables (front DS3/E3/EC-1 I/O panels)

Figure 1-47
Installing DS-3 I/O cables (rear DS3/E3/EC-1 I/O module)

Procedure 1-4
Routing STM-1e coaxial cables onto the 6500 shelf
Use this procedure to route STM-1e coaxial cables onto the 14-slot 6500
optical, 14-slot optical/front electrical, 14-slot converged optical/front
electrical, and 14-slot metro front electrical shelves.
6500 shelf type
Optical/front Optical/rear Optical Metro front

electrical electrical electrical
Cable type STM-1e Applicable Not Applicable Applicable
applicable
CAUTION
packs.
Prerequisites
STM-1e cables are single-ended. If required, you must cut the cables at the
required length and connectorize them with the connectors ordered.
Step Action

ground point.
2 If the shelf cover is Then
installed on the card cage Remove the shelf cover from the card cage
(refer to the Installation technical publication
specific to the respective 6500 shelf type).
not installed on the card Go to step 3.
cage
3 Flip down the fiber channel door (if applicable).


Routing STM-1e coaxial cables onto the 6500 shelf
Step Action
4 Route the cables through the fiber channel. Route cables that terminate on
slots 1 to 7 of 14-slot shelf to the left side of the rack through the appropriate
channel of the fiber routing guide. Route cables that terminate on slots 8 to
14 of 14-slot shelf to the right side of the rack through the appropriate channel
of the fiber routing guide.
See Figure 1-48 on page 1-124 for an overview of cable routing on the shelf
5 Close the fiber channel door (if applicable).
6 If you have removed the shelf cover to route cables, re-install the shelf cover
(refer to the Installation technical publication specific to the respective 6500
shelf type).
—end—

Figure 1-48
Example of cable routing on the 14-slot optical shelf

Procedure 1-5
Adding a facility to an equipment
Use this procedure to:
• add a facility that was manually deleted
• add DS1, E1, DS3, EC1, E3, or STM1E facilities
Multiple add is supported on DS1, E1, DS3, EC1, E3, or STM1E facilities.
Prerequisites
To perform this procedure you must use an account with a level 3 or higher
UPC.
Step Action
1 Select the required network element in the navigation tree.

2 Select Equipment & Facility Provisioning from the Configuration drop-
down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 In the Equipment area, select the equipment that will support the facility.
5 Select the appropriate facility type from the Facility Type drop-down list if the
Facility Type drop-down list is enabled.
See Table 1-18 on page 1-126 for facilities supported on the electrical circuit
packs.
6 Click Add in the Facility area to open the Add facility dialog box.
The dialog box displays the first facility that is not provisioned and is available.
7 Select the required port from the Port drop-down list.
To add facilities to all the remaining unprovisioned DS1, E1, DS3, EC1, E3,
or STM1E ports, select ALL from the Port drop-down list.
In a DS3/EC-1 circuit pack and when at least one DS3 facility already exists,
you cannot use the ALL option to add multiple EC1 facilities (the ALL option
can still be used if you want to add more DS3 facilities). In a DS3/EC-1 circuit
pack and when at least one EC1 facility already exists, you cannot use the
ALL option to add multiple DS3 facilities (the ALL option can still be used if
you want to add more EC1 facilities).
In a DS3/E3 circuit pack which contains 24 ports, ports 1 to 12 must be
provisioned with the same facility type, either DS3 or E3. The same rule
applies to ports 13 to 24.


Adding a facility to an equipment
Step Action
8 Select the required parameters from the drop-down lists. See the following for
facility attribute descriptions:
• “DS1 facility parameters” on page 1-146
• “STM1E facility parameters” on page 1-150
• “DS3 facility parameters (DS3E3EC1 equipment)” on page 1-151
• “EC1 facility parameters” on page 1-152
• “E1 facility parameters” on page 1-153
• “E3 facility parameters (DS3E3EC1 equipment)” on page 1-154
9 If the circuit pack is in-service, the primary state of the new facility defaults to
in-service. You have the option to change the primary state from IS to OOS.
If the circuit pack is out-of-service, the primary state of the new facility can
only be out-of-service.
10 Click OK to add the facility and close the Add facility dialog box.
—end—
Table 1-18
Facilities supported on the electrical circuit packs
Circuit pack (Equipment) Facilities
84XDS1 TM (DS1TM) NTN313AA/NTN313AC DS1
63xE1 (E1) NTK541BA/NTK541PA E1
24xDS3/EC-1 (DS3E3EC1) NTK543NA/NTK544NA DS3, EC1
24xDS3/E3 (DS3E3EC1) NTK543CA/NTK544CA DS3, E3
16xSTM-1e (155ME) NTK546CAE5/NTK546NAE5 STM1E

Procedure 1-6
Adding a path connection
Use this procedure to add 1WAY, 1WAYPR, 2WAY, or 2WAYPR path cross-
connects to a network element for the following electrical circuit packs: 63xE1,
24xDS3/EC-1, 24xDS3/E3, 16xSTM-1e, and DS1 service module (DSM).
ATTENTION
This is a generic procedure to enter a path cross-connect for the electrical
circuit packs listed above. For detailed information on each connection type,
recommendations for use of connection types for support of a particular
network configuration, and example networks, refer to “Path connections
management” (Chapter 3) in Part 1 of Configuration - Bandwidth and Data
Services, 323-1851-320.
If you want to add an SDH-SONET gateway or LO-HO connection using a

240/80 cross-connect circuit pack, refer to the “VC4-mapped VC3s (SDH/
SDH-J only)” section in Chapter 3 in Part 1 of Configuration - Bandwidth and
Data Services, 323-1851-320, for usage conditions.
After creating a high order DSM cross-connect at the STS level against one
DS1 channel, all the DS1 channels existing in that specific STS group become
STS-managed VT connections.
Prerequisites
• use an account with at least a level 3 UPC
• have at least one provisioned DS1 facility on your DSM equipment if you
want to create a low order or high order DSM connection. See the
equipment and facility provisioning chapter in Part 1 of Configuration -
Provisioning and Operating, 323-1851-310, for information on how to
create DS1 facility on DSM modules.
Step Action

2 Select Cross Connections: Path Connections from the Configuration
menu.


Step Action
3 If this is the initial launch of the Path Connections application, no path

connections appear until you perform a Retrieve. Subsequent launches of
the Path Connections application display path connections based on the last
filter criteria.
4 Click Add to display the Add Cross-Connect dialog box.
5 If you Then go to
want to provision a Connection ID step 6
do not want to provision a Connection ID step 8
6 Click once in the Connection ID text field.

7 Type the connection identifier.
Refer to Table 1-30 on page 1-157 for supported options.
8 Select a signal rate from the Rate drop-down list
Refer to Table 1-30 on page 1-157 for supported rates for each electrical
facility type.
9 From the Type drop-down list, select a connection type.
Refer to Table 1-31 on page 1-158 for supported connection types for each
electrical facility type.
10 Select the required equipment, facility, AU3, and/or AU4 mapping and
payload parameters from the drop-down lists for each of the following panels:
• From
• To
• Switch Mate (applicable to 2WAYPR connections only)
Refer to Table 1-32 on page 1-158 for equipment and facility parameters for
path connections.
Site Manager automatically populates the available parameter fields after you
select the Rate and Type.
If only AU3 mapping is supported (when the port mode is SONET or an
STS3c/VC4 rate or above is selected), the AU3 and AU4 radio buttons do not
appear in the Add Cross-Connect dialog box.
If you want to bulk provision all VT1.5s/VC11s or VT2s/VC12s in an STS/
TUG-3(K), select ALL in the VTG/TUG-2(L) drop-down lists.


Step Action
If you want to bulk provision VT2/VC12 path connections for E1 facilities,

select:
E1-#-DFLT-1 to provision VT2/VC12 path connections on E1 ports 1-21
UPSR/SNCP is not supported on DS3, EC1, E1, E3, or STM-1e From
endpoints. When you provision 2WAYPR connections on DS3, EC1, E1,
E3, or STM-1e endpoints, you must set the DS3, EC1, E1, E3, or STM-
1e endpoint as the To endpoint and not the From endpoint.
If you want to bulk provision VT1.5/VC11 path connections for DS1TM
facilities on low order DSM equipment, select:
DS1-DFLT-1 to provision VT1.5/VC11 path connections on DS1 ports 1-
28
DS1-DFLT-2 to provision VT1.5/VC11 path connections on DS1 ports 29-
56
DS1-DFLT-3 to provision VT1.5/VC11 path connections in DS1 ports 57-
84
UPSR/SNCP is not supported on DS1 From endpoints. When you
provision 1WAYPR or 2WAYPR connections on DS1 endpoints, you must
set the DS1 endpoint as the To endpoint and not the From endpoint.
11 If you Then go to
want to provision multiple connections between two facilities step 12
do not want to provision multiple connections between two step 16
facilities
12 Click Advanced in the From panel to open the Multi-Channel Selector

dialog box.


Step Action
13 In the Multi-Channel Selector dialog box, under Available, select the

required channels for the path connections.
To select multiple channels, select the first channel and then:
• Hold down the Ctrl key while individually clicking once on each of the
remaining channels.
• Hold down the Shift key and select the last channel required in the list.
• Select Ctrl+A (the Ctrl and A keys together) to select all channels.
The path connections depend on the order of selection.

Multiple channels are only available for if virtual concatenation is enabled.
Refer to the equipment and facility provisioning chapter in Part 1 of
Configuration - Provisioning and Operating, 323-1851-310, for information on
how to edit facility parameters).
14 Click the arrow pointing to the right (->).
15 Perform step 13 and step 14 for each remaining channel to be in the path
connections.
16 When all the channels you require appear in the Selected column, click OK.
17 Repeat step 11 to step 16 for the To, Switch Mate (applicable to 2WAYPR
connections only) panels.
When selecting multiple channels, you must select the same number of
channels in each of the From, To, Switch Mate (if applicable), and
Destination Mate (if applicable) panels.
18 If you Then click
you want to provision other path connections for Apply
this network element
you have completed the path connection OK (Apply &
provisioning for this network element Close)
If you are adding a single path connection, the path connection is added. If
the path connection cannot be added, an error message appears. Go to step
19.
If you are adding multiple path connections, the Multiple Cross Connect
Add Confirmation dialog box appears. Check that the multiple path
connections are correct, then click Yes. If the path connections cannot be
added, an error message appears.
19 If you clicked Then
Apply in step 18 go to step 5
OK (Apply & Close) in step 18 the procedure is complete
—end—

Procedure 1-7
Editing the DSM OAM link setting
Use this procedure to edit the DSM OAM link setting (to enable or disable).
See “DSM OAM Link parameters” on page 1-155.
Prerequisites
To perform this procedure, you must use an account with a level 3 UPC or
higher.
Step Action

2 Select Comms Setting Management from the Configuration drop-down
menu to open the Comms Setting Management application.
3 Select the Interfaces tab.
5 Select DSM OAM Link from the Interface type drop-down list.
6 Select the required entry in the table.
7 Click Enable or Disable to enable or disable the DSM OAM link.
8 Click OK.
—end—

Procedure 1-8
Provisioning a DSM 84xDS1 TM automatically
Use this procedure to automatically provision a DSM DS1x84 TM.
If automatic equipping is enabled on a host OC3 facility that meets the DCC
requirements, a DSM is automatically provisioned when the optical fibers are
connected between the host OC3 port on the 6500 shelf and the OC3 port of
the 84xDS1 TM circuit pack in the DSM shelf.
CAUTION
Risk of service interruption
When the optical fibers are connected between the host OC3
port on the 6500 shelf and the OC3 port of the 84xDS1 TM
circuit pack in the DSM shelf, some of the DS1TM equipment
are not auto-provisioned during the bulk provisioning of all 32
DS1TM circuit packs. You must compare the DS1TM inventory
and equipment data and restart the DS1TM equipment that
was not auto-provisioned. It is recommended to perform the
DS1TM auto-provisioning one after another or to first provision
host OC3 facilities for DSM and then connect the DS1TMs.
To enable automatic equipping, refer to the “Enabling/disabling slot-based

automatic equipping” procedure in Administration and Security, 323-1851-
301.
No DS1 facilities are provisioned when the DSM is auto-provisioned.
A Site Provisioning Required alarm is raised when the DSM auto-provisions.

To clear the alarm, edit the DSM site address (see Procedure 1-9, “Defining
or editing a site address for a DSM”).
If provisioning:
• an unprotected DSM 84xDS1 TM, the working host OC3 facility can be in
any odd or even slot.
• 1+1 protected DSM 84xDS1 TMs, the working host OC3 facility must be
in an odd slot and the protection host OC3 facility in the adjacent even slot
(same port number) to the right of the working host OC3 facility. For
example, working host OC3 facility in slot 3 port 2 and the protection OC3
facility in slot 4 port 2.
It is recommended that the working DSM 84xDS1 TM circuit pack is auto-

provisioned before the protection DSM 84xDS1 TM circuit pack.


The host OC3 facility must:

• have the DSM OAM link enabled. Refer to “DSM OAM Link parameters”
on page 1-155 for more information.
• be on a VT1.5/low order (LO) or a STS-1/high order (HO) 8xOC-3/12/
STM-1/4 or 16xOC-n/STM-n 10G circuit pack.
The provisioned DSM will be LO DSM only if both the host circuit pack (8xOC-
3/12/STM-1/4 or 16xOC-n/STM-n 10G) and the XC circuit pack are LO. Only
VT1.5 connections are allowed on LO DSM.
The provisioned DSM will be HO DSM if the host circuit pack (8xOC-3/12/
STM-1/4 or 16xOC-n/STM-n 10G) or the XC circuit pack is HO. Only STS1
connections are allowed on HO DSM.
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step Action
1 Ensure that for the working host OC3 facility and the protection host OC3
facility (if applicable):
• The host OC3 facility is provisioned on a VT1.5/low order or STS-1/high
order 8xOC-3/12/STM-1/4 or 16xOC-n/STM-n 10G circuit pack. Refer to
the “Retrieving equipment and facility details” and “Adding a facility to an
equipment” procedures in Part 1 of Configuration - Provisioning and
Operating, 323-1851-310.
• There are no connections provisioned on the host OC3 facility. Refer to
the “Retrieving path connections” procedure in Part 1 of Configuration -
Bandwidth and Data Services, 323-1851-320.
• The host OC3 facility is not provisioned as a shelf timing reference. Refer
to the “Retrieving synchronization data for a network element” procedure
in Part 2 of Configuration - Provisioning and Operating, 323-1851-310.
• The host OC3 facility is not a member of a facility protection group pair.
Refer to the “Retrieving protection parameters” procedure in Part 2 of
Configuration - Provisioning and Operating, 323-1851-310.
• Auto-provisioning is enabled for the host OC3 slot. To enable automatic
equipping, refer to the “Enabling/disabling slot-based automatic
equipping” procedure in Administration and Security, 323-1851-301.
• The host OC3 has a DSM OAM Link enabled (correct DCC and IISIS
parameters). See Procedure 1-7, “Editing the DSM OAM link setting” and
“DSM OAM Link parameters” on page 1-155.


Step Action
• DS1TM circuit packs must be provisioned only under the host OC3
facilities with default SONET parameters;
Signal mode = SONET
Automatic laser shutdown= disabled
DUS override= disabled
All these parameters must not be edited until DS1TM circuit pack is
deprovisioned.
2 Connect the optical fibers between the host OC3 port(s) on the 6500 shelf
and the OC3 port(s) on the 84xDS1 TM(s) on the DSM as follows:
• Connect the working optical fiber between the working host OC3 facility
and the OC3 port on the working 84xDS1 TM in slot 1 of the DSM.
• For 1+1 protected 84xDS1 TMs (if applicable), connect the protection
optical fiber between the protection host OC3 facility in the even slot and
the OC3 port on the protection 84xDS1 TM in slot 2 of the DSM.
It is recommended that the working DSM 84xDS1 TM circuit pack is auto-
provisioned before the protection DSM 84xDS1 TM circuit pack.
The 84xDS1TM circuit pack(s) and the 84xDS1 TM OC3 port(s) are
automatically provisioned with the same primary state as the host circuit
pack. No DS1 facilities are created.
A Site Provisioning Required alarm is raised.
3 Wait at least 20 seconds before you perform any further auto-provisioning.
The network element requires 20 seconds to auto-provision the DSM. If you
do not wait, a temporary Circuit Pack Failed alarm will be raised.
4 Edit the DSM site address (see Procedure 1-9, “Defining or editing a site
address for a DSM”).
The Site Provisioning Required alarm is cleared.
—end—

Procedure 1-9
Defining or editing a site address for a DSM
Use this procedure to define or edit a site address for a DSM. After a working
DSM 84xDS1 TM auto-provisions, the DSM site address must be manually
provisioned. Until the site address has been defined, the DSM is not in a
working state and the Site Provisioning Required alarm is raised.
Once you define a DSM site address, you can edit it but you cannot delete it.
If a DSM is connected to a host OC3 port that is a member of a facility

protection group, the DSM will not provision. Furthermore, an
Autoprovisioning Mismatch alarm will not be raised.
Prerequisites
UPC.
Step Action

4 Select the DS1TM-1 (the working DSM 84xDS1TM in slot 1) associated with
the host OC3 port from the Equipment area.
5 Click Edit in the Equipment area to open the Edit Equipment dialog box.
6 Enter a site address, 1 to 40 characters in length.
The name can contain a maximum of 40 characters with the exception of a
double-quote (“).
7 Click OK.
The Site Provisioning Required alarm is cleared.
—end—

Procedure 1-10
Changing the primary state of a facility
Use this procedure to change the primary state of a facility.
CAUTION
If you place a facility out-of-service, you can cause a loss of
traffic.
Prerequisites
UPC.
Step Action

4 In the Equipment area of the Equipment & Facility Provisioning application,
select the circuit pack whose facility state you want to change.
5 Select the appropriate facility from the Facility Type drop-down list if more
than one facility type is supported.
packs.
6 In the Facility area, select the facility whose state you want to change.
For circuit packs that support multiple facilities (such as DS1, DS3, EC1, E1,
E3, STM-1e), you can select multiple facilities as follows:
some but not all facilities hold down the Ctrl key while clicking on each
required facility
all facilities select the first facility in the list and hold down
the Shift key while clicking once on the last
facility in the list.
or
select any facility in the list and then Ctrl+A (Ctrl
and A keys together) to select all facilities.


Step Action
7 Click Edit in the Facility area to open the Edit facility dialog box.
8 Select OOS or IS from the Primary state drop-down list.
CAUTION
If you place a facility out-of-service, you can cause a
loss of traffic.
For multiple facilities, selecting <no change> from the drop-down lists leaves
the primary state unchanged for the selected facilities.
9 Click OK.
10 If changing the primary state to OOS, click Yes in the warning dialog box.
—end—

Procedure 1-11
Changing the primary state of a circuit pack
Use this procedure to change the primary state of a circuit pack to in-service
or out-of-service.
You must change the primary state of any related facilities to out-of-service
before changing the primary state of a circuit pack to out-of-service. See
Procedure 1-10, “Changing the primary state of a facility”. The exceptions are
facilities on circuit packs with 1:N equipment protection where you can change
the primary state of the circuit pack without changing the corresponding
facilities to out-of-service (an Equipment OOS with subtending facilities IS
alarm is raised in this condition).
Prerequisites
UPC.
Step Action

4 If you are changing the primary state to Then go to
OOS step 5
IS step 7
5 If you intend to change the primary state of Then go to

a circuit pack
in a 1:N protection scheme step 7
otherwise step 6
Note: For more information on this step, refer to the procedure
introduction.


Step Action
6 Ensure the circuit pack facilities, if there are any related facilities, are out-of-
service. See Procedure 1-10, “Changing the primary state of a facility”.
CAUTION
loss of traffic.
7 Select the circuit pack in the Equipment area.

9 Select IS or OOS from the Primary state drop-down list.
10 Click OK.
11 If you are changing the primary state to OOS, click Yes in the warning dialog
box.
—end—

Procedure 1-12
Deleting a facility from an equipment
Use this procedure to delete a facility.
CAUTION
If you delete a facility, you can cause a loss of traffic.
To delete the host OC3 facility for a DSM 84xDS1 TM circuit pack, you must
first disable the DSM OAM Link parameter. See Editing the DSM OAM link
setting on page 1-131. Then delete the DSM 84xDS1 TM circuit pack. See
Procedure 1-13, “Deleting a circuit pack”.
You must delete the DS1 facilities associated with the DS1 TM in slot 1
(DSMTM-1) even if the DS1 TM in slot 2 (DSMTM-2) is the working circuit
pack. The Facility Type drop-down list is not available if the DS1 TM in slot 2
(DSMTM-2) is selected (the OC3 facility is automatically displayed).
Prerequisites
To perform this procedure, you must
• ensure the end-to-end service to be deleted is not carrying traffic
• ensure the facility to be deleted is out-of-service and is not in maintenance
state
• delete the connections of the entire path that terminates on this facility.
Refer to the “Deleting path connections” procedure in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320.
• ensure that no loopback exists on the facility. See the “Operating/releasing
a loopback” procedure in Part 1 of Configuration - Provisioning and
Operating, 323-1851-310 to release a loopback if it exists.
• ensure that the port is not reserved for test access (only for DS1, DS3, E1,
and E3 ports). See the “Test access and connection loopback
provisioning” chapter in Part 2 of Configuration - Provisioning and
Operating, 323-1851-310.
• use an account with a level 3 or higher UPC
Step Action


Step Action

select the circuit pack whose facilities you want to delete.
5 Select the appropriate facility from the Facility Type drop-down list if more
than one facility type is supported.
packs.
6 In the Facility area, select the facility you want to delete.
For circuit packs that support multiple facilities, you can select multiple
facilities as follows:
required facility
or
and A keys together) to select all facilities
7 Click Delete in the Facility area.

8 Click Yes in the warning dialog box.
—end—

Procedure 1-13
Deleting a circuit pack
Use this procedure to delete a circuit pack from the list of provisioned
equipment in the Equipment and Facility Provisioning application.
Note that you cannot delete the DSM 84xDS1 TM circuit pack in slot 1 of a
DSM until the DSM 84xDS1 TM circuit pack in slot 2 has been deleted.
Prerequisites
• use an account with a level 3 or higher UPC.
• delete all connections provisioned through the equipment. Refer to the
“Deleting path connections” procedure in Part 1 of Configuration -
Bandwidth and Data Services, 323-1851-320.
• delete all facilities on the circuit pack. See Procedure 1-12, "Deleting a
facility from an equipment" on page 1-140.
Note that you cannot delete the host OC3 facility for a DSM 84xDS1 TM
circuit pack. It can only be taken out of service before deleting the
DSM 84xDS1 TM circuit pack.
• put the circuit pack to be deleted out-of-service. See Procedure 1-11,
“Changing the primary state of a circuit pack”.
• change the E1, DS3E3EC1, or STM-1e equipment protection scheme to
unprotected if the E1, DS3E3EC1, or STM-1e equipment is 1:N protected.
See “Changing the protection scheme for electrical equipment” in
Configuration - Protection Switching, 323-1851-315.
Step Action

4 In the Equipment area, select the equipment you want to delete.
5 Click Delete in the Equipment area.
—end—

Equipment and facility provisioning parameters

Equipment and facility primary and secondary states
The table that follows provides information on equipment and facility primary
states.
Table 1-19
Equipment and facility primary states
Primary State Description
IS In-service; no failure detected
IS-ANR In-service - abnormal; failure exists but entity is still capable of performing
some of its provisioned functions (that is partial failure)
OOS-AU Out-of-service - autonomous; failure detected
OOS-MA Out-of-service - maintenance; no failure detected (OOS for maintenance

for provisioning memory administration)
OOS-AUMA Out-of-service autonomous management; failure detected

OOS-MAANR Out-of-service - maintenance - abnormal; partial failure detected
The table that follows provides information on equipment secondary states.
Table 1-20
Equipment secondary states
Secondary State Description
Active Equipment has connections established to at least one of the facilities it

supports and the connected facilities are in-service
Fault detected Equipment failure detected
Idle No connections established to facilities supported on this equipment, all

connected facilities are out-of-service, or in-service connected facilities are
not on the active traffic path in a protected connection
Mismatched eqp. attribute Mismatched or unknown equipment detected in a provisioned slot
No OAM DSM does not have an OAM link with host shelf processor
No site DSM does not have a site address provisioned
Unequipped Equipment is missing

Table 1-20
Equipment secondary states (continued)
Unknown Equipment cannot be identified

Working Circuit pack in an equipment protection scheme that is actively carrying
traffic
1:N standby Circuit pack in a 1:N configuration with no active traffic
The table that follows provides information on facility secondary states.
Table 1-21
Facility secondary states
<null> Active, working state

Disconnected Facility has no connections established.
Fault detected Facility failure detected
Supporting entity Supporting equipment:

outage • has a failure, or
• is missing, or
• is mismatched, or
• has an associated connections which is failed.
Loopback active Loopback active on facility
Unprovisioned site A provisioned DSM 84xDS1 TM is provisioned without its site address parameter.
address
OAM not available A provisioned DSM 84xDS1 TM does not have an OAM link
Host-DSM fiber Host-DSM fiber misconnected. There is a discrepancy between the provisioning
misconnected data and the actual fiber connection. Only applicable to host OC3 facility (not
applicable to OC3 facility on a 84xDS1 TM).
The working and protection host cards may have different variant types (5G MRO
LO, 5G MRO HO, 10G MRO LO, 10G MRO HO).
Test The facility acts as a test access port if “Test” is selected. For more information
about test access, refer to the “Test access and connection loopback provisioning”
chapter in Part 2 of Configuration - Provisioning and Operating, 323-1851-310.
Applies to facilities that support test access.

Table 1-21
Facility secondary states (continued)
Test deactivate Test access is disabled. This is an input parameter only. Applies to facilities that
support test access.
Auto in-service AINS is enabled. Applies to facilities that support AINS.
Maintenance State Maintenance State is enabled. When in Maintenance State, a facility continues to
carry traffic if it can, but does not raise alarms, SNMP traps or Performance
Monitoring Threshold Crossing Alerts (PM TCAs).
Applies to facilities that support maintenance state. Maintenance state is
applicable to these facilities only if they are in out-of-service state.

DS1 facility parameters

The table that follows provides information on DS1 facility parameters.
Table 1-22
DS1 facility parameters
Parameter Options Description
Unit facility-shelf-slot-port Displays the facility, shelf number, slot

Note: For DSM, the order is as follows: DS1- number, and port number for the selected
facility.
slot-port (OC3-hshelf-hslot-hport), where slot
= 1. Available ports:
(For low order DSM Ports)
• 1 to 84
• ALL
(For high order DSM Ports)
• 1 to 84
• ALL
Primary state See “Equipment and facility primary states” Sets the primary state of the facility.
on page 1-143 Default reflects primary state of
associated equipment.
Note: IS and OOS are selectable.
Secondary See “Facility secondary states” on page 1-144 Sets the operational state of the facility.
State The Test state is editable.
Note: DS1 facilities on high Order DSM
cannot be used for Test access.
The AINS state is editable. The
Maintenance state is editable.
Format • Extended Superframe Sets the frame format of the DS1 signal.
• Superframe (default)
• Superframe with TR08 extensions

Table 1-22
DS1 facility parameters (continued)
Line Code • Bipolar with 8-zero substitution, Receive Sets the line code of the DS1 signal. If the
• Bipolar with 8-zero substitution, Transmit incoming and outgoing streams are
different, select options with just Receive
• Bipolar with 8-zero substitution, Transmit or Transmit in the description (for
and Receive example, select and apply ‘Alternate
• Alternate mark inversion Receive mark inversion Receive’ and then select
• Alternate mark inversion Transmit and apply ‘Bipolar with 8-zero
substitution, Transmit’).
• Alternate mark inversion with Zero code
suppression, Transmit Note: Zero suppression is not supported
in the receive direction.
• Alternate mark inversion with Zero code
suppression, Transmit and Receive
• Alternate mark inversion, Transmit and
Receive (default)
Equalization • 0-220 ft. receive Sets the equalization for the cable length
• 0-220 ft. transmit connecting to DS1 cross-connect panel.
If the cables for the incoming and
• 0-220 ft., both directions (default) outgoing streams are different, select
• 220-430 ft. receive options with just receive or transmit in the
• 220-430 ft. transmit description (for example, select and
apply ‘0-220 ft. receive’ and then select
• 220-430 ft., both directions and apply ‘220-430 ft. transmit’).
• 430-655 ft. receive Sets the values for both transmit and
• 430-655 ft. transmit receive cables.
• 430-655 ft., both directions
Far End NE • Far-end NE supports ANSI standards Sets whether the far end NE supports
(default) ANSI standards.
• Far-end NE does not support ANSI
standards

Table 1-22
DS1 facility parameters (continued)
Fault locate • Do not check frame format Sets what checks are performed in the
mode • Frame checked for incoming and outgoing frame format:
(default) • Do not check frame format - the DS1
• Only check incoming data facility can be unframed or used as a
clear channel facility
• Only check outgoing data
• Frame checked for incoming and
outgoing - both incoming and outgoing
data streams will have the frame format,
as specified by FMT, checked
• Only check incoming data - outgoing
can be unframed
Note: Use ‘Do not check frame format’ if
DS1 data is unframed.
Mapping • Out slot (S1 to S4) signaling bits are Sets the mapping of the DS1 payloads
transported into VT1.5s.
• Robbed bit signaling bits are transported Note: The ‘Out slot (S1 to S4) signaling
• VT1.5 Bit Asynchronous mapping (default) bits are transported’ and ‘Robbed bit
signaling bits are transported’ options are
• VT1.5 Bit Synchronous mapping
only applicable to the ‘VT1.5 Byte
• VT1.5 Byte Synchronous mapping Synchronous mapping’ option. To set
these options, you must first select and
apply the ‘VT1.5 Byte Synchronous
mapping’ option and then select and
apply the ‘Out slot (S1 to S4) signaling
bits are transported’ and ‘Robbed bit
signaling bits are transported’ options as
required (both options can be active at
once).
Output • Normal (default) Sets the output stream coding.

stream • Set to an idle code
coding
• AIS code changed to all-zeros

OC3 facility for 84xDS1TM parameters

The table that follows provides information on OC3 facility for 84xDS1TM
parameters.
Table 1-23
OC3 facility for 84xDS1TM parameters

number, and port number for the selected
facility.
Primary state See “Equipment and facility Sets the primary state of the facility. Default
primary states” on page reflects primary state of associated
1-143 equipment.
Secondary State See “Facility secondary Displays the facility operational state. The
states” on page 1-144 AINS state is editable.
Port mode SONET Displays the port mode. Read-only
Signal mode SONET Displays the signal mode (SS bits). Read-
only
Signal degrade threshold • 1x10^-5 Sets the signal degrade threshold.

• 1x10^-6 (default)
• 1x10^-7
• 1x10^-8
• 1x10^-9
Excessive bit error • 1x10^-3 (default) Displays the excessive bit error threshold.
threshold • 1x10^-4 Read-only
• 1x10^-5
Automatic laser shutdown Disabled Displays the automatic laser shutdown
(ALS) feature. Read-only
Data communication No Displays whether the facility is using a data

channel communications channel (DCC). Read-
only

STM1E facility parameters

The table that follows provides information on STM1E facility parameters.
Table 1-24
STM1E facility parameters (in 16xSTM-1e circuit packs)
Unit facility-shelf-slot-port Displays the facility, shelf number, slot number, and
port number for the selected facility. Read-only
Available ports:
• 1 to 16
• All
Primary state See “Equipment and Sets the primary state of the facility. Default reflects
facility primary states” on primary state of associated STM-1e equipment.
page 1-143 Note: IS and OOS are selectable.
Secondary State See “Facility secondary Displays the facility operational state. Read-only
states” on page 1-144
Port mode SDH Displays the port mode. Only SDH port mode is
supported for STM1E facilities. Read-only
Signal mode SDH Displays the signal mode. Only SDH signal mode is
supported for STM1E facilities. Read-only
Signal degrade 1x10^-6 Displays the signal degrade threshold. Read-only

threshold
Excessive bit error 1x10^-3 Displays the excessive bit error threshold. Read-only
threshold
Used as timing No Displays whether the facility is being used as a timing

reference reference (always “No” in this release). Read-only

DS3 facility parameters (DS3E3EC1 equipment)

The table that follows provides information on DS3 (DS3E3EC1 equipment)
facility parameters.
Table 1-25
DS3 facility parameters (DS3E3EC1 equipment type)

facility.
Ports are:
• 1 to 24
• ALL
Primary state See “Equipment and facility primary Sets the primary state of the facility.
states” on page 1-143 Default reflects primary state of
associated equipment.
Secondary See “Facility secondary states” on page Sets the operational state of the facility.
State 1-144 The Test state is editable.
The AINS state is editable.
The Maintenance state is editable.
Line build out • 0 to 224 ft (default) Sets the transmitter attenuation

• 225 to 450 ft parameter for various cable lengths. The
possible values are 0 to 224 ft (short) or
225 to 450 ft (long).
Format • CBIT Sets the frame format of the DS3 signal.

• M13, Multiplex Framed (default)
• Unframed clear channel
Local RAI • Enable (default) Enables or disables RAI auto

• Disable conditioning.
• Enable: allow RAI auto conditioning on
AIS
• Disable: inhibit RAI auto conditioning on
AIS
RAI auto conditioning must be
suppressed on AIS detection particular to
DS3 line for DS3E3EC1 equipment. This
parameter is only applicable to framed
signals.

EC1 facility parameters

The table that follows provides information on EC1 facility parameters.
Table 1-26
EC1 facility parameters

Unit facility-shelf-slot-port Displays the facility, shelf number, slot number,
and port number for the selected facility.
Ports are:
• 1 to 24
• ALL
Primary state See “Equipment and Sets the primary state of the facility. Default
facility primary states” on reflects primary state of associated equipment.
page 1-143 Note: IS and OOS are selectable.
Secondary State See “Facility secondary Displays the facility operational state. The AINS
states” on page 1-144 state is editable. The Maintenance state is
editable.
Line build out • 0 to 224 ft (default) Sets the transmitter attenuation parameter for
• 225 to 450 ft various cable lengths. The possible values are 0
to 224 ft (short) or 225 to 450 ft (long).
Used as timing reference No Displays the state of the facility as a timing
reference. Read-only
Data Communication No Displays whether the facility is using a data

Channel communications channel (DCC). Read-only

E1 facility parameters
The table that follows provides information on E1 facility parameters.
Table 1-27
E1 facility parameters (E1 equipment type)

Ports are:
• 1 to 63
• ALL
Primary state See “Equipment and facility Sets the primary state of the facility. Default
primary states” on page reflects primary state of associated equipment.
1-143 Note: IS and OOS are selectable.
Secondary State See “Facility secondary Sets the operational state of the facility.
states” on page 1-144 The Test state is editable.
Frame format • Framed Sets the format of the E1 signal.

• Multi-framed
• Unframed (default)

E3 facility parameters (DS3E3EC1 equipment)

The table that follows provides information on E3 facility parameters.
Table 1-28
E3 facility parameters (DS3E3EC1 equipment type)

Available ports:
• 1 to 24
• ALL
Primary state See “Equipment and Sets the primary state of the facility. Default
facility primary states” reflects primary state of associated equipment.
on page 1-143 Note: IS and OOS are selectable.
Secondary State See “Facility Sets the operational state of the facility.
secondary states” on The Test state is editable.
page 1-144
Format • G751 (default) Sets the frame format of the E3 signal.
• Unframed clear
channel

DSM OAM Link parameters

The DSM OAM Link option has a single table. The table lists the status of the
OC-3 facilities that can host DS1TM equipment or for which DSM OAM links
can be enabled to support the hosting of DS1TM equipment.
OC-3 facilities that meet the following criteria are displayed in the table:
• have DS1TM equipment provisioned
• do not have DS1TM equipment provisioned and the lower layer DCC/GCC
is provisioned as Section DCC with LAPD and L2 frame size of 1304
• do not have DS1TM equipment provisioned and the lower layer DCC/GCC
is not provisioned
OC-3 facilities that do not meet these criteria are not displayed.
Use the Enable or Disable to set the DSM OAM link status of the selected OC-
3 facility. Setting the state to Enable provisions the lower layer DCC/GCC and
IISIS circuit to the following parameters required to host DS1TM equipment:
• lower layer DCC/GCC: Carrier = Section, Protocol = LAPD, L2 Frame Size
= 1304
• IISIS circuit: Circuit Default Metric: 6, Neighbour Protocols Supported
Override = OSI
The Enable and Disable buttons are disabled if the DSM OAM link is in use.
Table 1-29 on page 1-156 details the DSM OAM link parameters.

Table 1-29
DSM OAM Link parameters
Parameter Options Description Addable/
Editable
Unit OC-3 optical Displays OC-3 facilities that have: No

ports • DS1TM equipment provisioned
• do not have DS1TM equipment provisioned and the
lower layer DCC/GCC is provisioned with LAPD and
Section DCC
• do not have DS1TM equipment provisioned and the
lower layer DCC/GCC is not provisioned
State Disabled, Sets the status of the DSM OAM link. A facility is Yes
Enabled automatically disabled if:
• no layer DCC has been provisioned on the facility or a
lower layer DCC/GCC has been provisioned as LAPD
and the L2 frame size is not equal to 1304
• the IISIS circuit is configured and the parameters are
not:
— circuit default metric: 6
— neighbour protocols supported override: OSI
In Use Yes, No Displays whether the facility is in use for DSM OAM No
comms (DS1TM equipment provisioned on the port).

Path connection parameters

Table 1-30 on page 1-157, Table 1-31 on page 1-158, and Table 1-32 on page
1-158 The following tables detail the electrical circuit pack parameters
associated with the Path Connections Site Manager application.
Table 1-30
Path Connections application parameters for electrical circuit packs
Parameter Description
Connection ID Enter the connection identifier string is used to identify a provisioned path
connection. The path connection ID can contain a maximum of 64 characters,
with the exception of the \, “, and % characters.
Note: Support for 64 characters connection IDs is only supported from ONM
Release 6.0 onwards.
Rate Select a connection rate:

• E1: VT2 (SONET)/VC12 (SDH)
• DS1: VT1.5 (SONET) and STS1 (SONET)
• DS3: STS1 (SONET)/VC3 (SDH)
• EC-1: VT1.5 (SONET) and STS1 (SONET)
• E3: STS1 (SONET)/VC3 (SDH)
• STM-1e: VT2 (SONET)/VC12 (SDH), STS1 (SONET)/VC3 (SDH), and STS3c
(SONET)/VC4 (SDH)
Type Select the connection type:

• 2WAYPR (Bidirectional path ring)
Refer to Table 1-31 on page 1-158.
From and To panels Select the Equipment, Facility, and channels for the From and To endpoints
as required. Refer to Table 1-32 on page 1-158.
AU3 and/or AU4 For connection rates at VC11, VC12 or VC3 on SDH/SDH-J ports, select the
mapping radio buttons connection mapping as AU3 or AU4 to determine the High Order container.
Switch Mate Select the switch mate when creating 2WAYPR or 1WAYPR connections. Refer
to Table 1-31 on page 1-158.

Table 1-31
Path connection types for electrical circuit packs—supported From, To, Switch Mate, and
Destination Mate instances
Path connection From, Switch Mate To, Destination Mate
type
1WAY OC3 (on DSM) OC3 (on DSM)
1WAYPR Note 1 OC3 (on DSM)
2WAY Any compatible endpoint Any compatible endpoint
2WAYPR Note 2 DS1, DS3, EC-1, E1, E3, STM1e
Note 1: UPSR/SNCP is not supported on DS1 From endpoints. When you provision 1WAYPR or
2WAYPR connections on DS1 endpoints, you must set the DS1 endpoint as the To endpoint and not the
From endpoint.
Note 2: UPSR/SNCP is not supported on DS1, DS3, EC1, E1, E3, or STM-1e From endpoints. When
you provision 2WAYPR connections on DS1, DS3, EC1, E1, E3, or STM-1e endpoints, you must set the
DS1, DS3, EC1, E1, E3, or STM-1e endpoint as the To endpoint and not the From endpoint.
Table 1-32
Equipment and facility parameters for path connections for electrical circuit packs
Rate Equipment Facility/channel Parameter values
63xE1 circuit packs
VT2/ E1-shelf#-slot# E1-shelf#-slot#-port# shelf# = 0 to 254

VC12 E1-shelf#-slot#-DFLT-# slot# = 1 to 4 and 9 to 12 for
14-slot shelf (except 14-slot
packet-optical shelf)
port# = 1 to 63
DFLT-# = 1 to 3
(DFLT-1 = ports 1 to 21,
DFLT-2 = ports 22 to 42,
DFLT-3 = ports 43 to 63)
24xDS3/EC-1 circuit packs
VT1.5/ DS3E3EC1-shelf#-slot# EC1-shelf#-slot#-port#-sts#-vtg#-vt# shelf# = 0 to 254

VC11 slot# = 1 to 4 and 9 to 12 for
sts# = 1
port# = 1 to 24
vtg# = 1 to 7 or ALL
vt# = 1 to 4

Table 1-32
Equipment and facility parameters for path connections for electrical circuit packs (continued)
STS1/ DS3E3EC1-shelf#-slot# EC1-shelf#-slot#-port# shelf# = 0 to 254

port# = 1 to 24
DS3E3EC1-shelf#-slot# DS3-shelf#-slot#-port# shelf# = 0 to 254

slot# = 1 to 4 and 9 to 12 for
port# = 1 to 24
24xDS3/E3 circuit packs (Note)
STS1/ DS3E3EC1-shelf#-slot# E3-shelf#-slot#-port# shelf# = 0 to 254

port# = 1 to 24
STS1/ DS3E3EC1-shelf#-slot# DS3-shelf#-slot#-port# shelf# = 0 to 254

14-slot shelf
port# = 1 to 24
16xSTM-1e circuit packs
VT2/ 155ME-shelf#-slot# STM1E-shelf#-slot#-port#-J-K#-L#- shelf# = 0 to 254

VC12 M# slot# = 1 to 4 and 9 to 12 for
port# = 1 to 16
J-K# = 1-1, 1-2, or 1-3
L# = 1 to 7 or ALL
M# = 1 to 3
STS1/ 155ME-shelf#-slot# STM1E-shelf#-slot#-port#-J-K# shelf# = 0 to 254

port# = 1 to 16
J-K# = 1-1, 1-2, or 1-3

Table 1-32
Equipment and facility parameters for path connections for electrical circuit packs (continued)
STS3c/ 155ME-shelf#-slot# STM1E-shelf#-slot#-port# shelf# = 0 to 254

14-slot shelf
port# = 1 to 16
DSM DS1x84 termination module
VT1.5/ DS1TM-slot#-(OC3- DS1-slot#-port#-(OC3-shelf#-Hslot#- slot# = 1, 2 for 14-slot shelf

VC11 shelf#-Hslot#-Hport#) Hport#) port# = 1 to 84
DS1-DFLT-#(OC3-shelf#-Hslot#- shelf# = 0 to 254
Hport#)
Hslot# = 1 to 14 for 14-slot
shelf
Hslot# = 1-8, 11-18, 21-28,
and 31-38 for 32-slot shelf
Hport# = 1 to 8
DFLT-# = 1 to 3
(DFLT-1 = ports 1 to 28,
DFLT-2 = ports 29 to 56,
DFLT-3 = ports 57 to 84)
STS1/ DS1TM-slot#- (OC3- OC3-slot#-port#-(OC3-shelf#-Hslot#- slot# = 1, 2 for 14-slot shelf

VC3 shelf#-Hslot#-Hport#) Hport#) port# = 1
shelf# = 0 to 254
Hslot# = 1 to 14 for 14-slot
shelf
Hslot# = 1-8, 11-18, 21-28,
and 31-38 for 32-slot shelf
Hport# = 1 to 8
Note: You can provision any of the following mixes between DS3 and E3 ports:
• 24 DS3 ports
• 24 E3 ports
• Ports 1 to 12 can be DS3, while ports 13 to 24 can be E3.
• Ports 1 to 12 can be E3, while ports 13 to 24 can be DS3

2-1
48 Channel Trans Mux (Portless) circuit

pack 2-
TMUX circuit pack (NTK558DAE5)

Overview
This section provides an overview of the 6500 Packet-Optical Platform (6500)
TMUX circuit packs and their associated procedures.
The 48 Channel Trans Mux (Portless) circuit pack (also known as TMUX)
provides access to DS1/E1 signals within channelized DS3/E3 signals and
can be used in digital cross-connect applications to interconnect co-located
tier 2 equipment.
The 48 Channel Trans Mux (Portless) circuit pack can process up to 5G of

traffic which can be considered as 48 STS1/VC3 high speed ports and 48
VT1.5/VT2 managed STS1/VC3 low speed ports which are internally
connected. The high speed ports connect STS-1s/VC3s containing DS3/E3s
and the low speed ports connect VT1.5s/VT2s containing DS1s/E1s.
Up to 2.5G of STS1/VC3 (DS3) can be demultiplexed into DS1s and/or E1s

and sent out as VT1.5/VC11 and/or VT1.5/VC12 traffic and up to 2.5G of
VT1.5/VC11 or VT2/VC12 (DS1s and/or E1s) can be multiplexed into DS3s
and sent out as STS1/VC3 (DS3).
Up to 2.5G of STS1/VC3 (E3) can be demultiplexed into E1s and sent out as
VT2/VC12 traffic and up to 2.5G of VT2/VC12 (E1) can be multiplexed into
E3s and sent out as STS1/VC3 (E3).
The VT2s/VC12s can originate from any valid source that supports a
VT2/VC12 with embedded E1 (for example, any circuit pack with an E1 facility
or a VT2/VC12 optical interface circuit pack). The VT1.5s/VC11s can originate
from any valid source that supports a VT1.5/VC11 with embedded DS1 (for
example, any circuit pack with a DS1 facility or a VT1.5/VC11 optical interface
circuit pack). The STS1/VC3 containing the DS3/E3 can go to any valid source

2-2 48 Channel Trans Mux (Portless) circuit pack
that supports an STS1/VC3 with embedded, non-terminated DS3/E3 (for

example, any circuit pack which supports non-terminated DS3/E3 facilities or
an optical interface circuit pack).
Figure 2-1 on page 2-2 shows the faceplate of a TMUX circuit pack and
Figure 2-2 on page 2-3 provides a functional block diagram of the TMUX
circuit pack.
Figure 2-1
48 Channel Trans Mux (Portless) circuit pack faceplate
Red triangle (Fail)

Transmux 5G
DS1/DS3
Fail
Ready
In Use

(on->no pull, off->can be pulled)
R99
EEEEE99999
S/N NT030MEE9999E
NTUD99EE
Type E

Figure 2-2
TMUX block diagram (NTK558DAE5)
48xDS3/E3
XC
Backplane
DS3/E3/DS1/E1
5G
Framer/Mapper and Transmux
SONET/SDH OHP
XC
2.5G DS1/E1
Processor Power
Module Supply
Legend

Figure 2-3 shows an example of using the TMUX circuit pack.
Figure 2-3
TMUX configurations (example)
Optical Optical
circuit circuit
pack pack
VT1.5/VC-12 XC
circuit pack
STS-1 with STS-1 with

DS3 VT1.5s
DS3/DS1
Mux/Demux
Trans Mux circuit pack
Trans Mux between optical circuit packs
DS3 DS3 Optical OC-3

with circuit circuit
embedded pack pack
DS1s
VT1.5/VC-12 XC
circuit pack
STS-1 with STS-1 with

DS3 VT1.5s DSM
DS3/DS1
Mux/Demux
Trans Mux circuit pack
DS1s
Trans Mux between DS3 and DS1s on DSM

The TMUX circuit pack (NTK558DAE5) provides the following functionality.
• supports 5G of traffic which can be considered as 48 DS3/E3 high speed
ports and a combination of up to 48 x 28 DS1 or 48 x 21 E1 low speed
ports.
— a DS3 high speed port is demultiplexed into 7 DS2 timeslots, each of
which contains either 4 DS1 signals or 3 E1 signals, which are output
on the corresponding low speed port. Conversely the DS1 or E1
signals are multiplexed into the DS2 timeslots into the DS3 signal.
— an E3 high speed port is demultiplexed into 4 E2 timeslots, each of
which contains 4 E1 signals, which are output on the corresponding
low speed port. Conversely the E1 signals are multiplexed into the E2
timeslots into the E3 signal.
• auto and manual provisioning of circuit packs
• for a port that is VT managed
— multiplexing/demultiplexing between VT1.5/VC11 and STS1/VC3
ports (VT1.5/VC11 <-> DS1 <-> DS3 <-> STS1/VC3)
— multiplexing/demultiplexing between VT2/VC12 and STS1/VC3 ports
(VT2/VC12 <-> E1 <-> DS3 <-> STS1/VC3) and (VT2/VC12 <-> E1 <-
> E3 <-> STS1/VC3)
• for a port that is STS/DS3 managed
— multiplexing/demultiplexing between STS1/VC3 and VT1.5/VC11
ports (STS1/VC3 <-> DS3 <-> DS1 <-> VT1.5/VC11)
— multiplexing/demultiplexing between STS1/VC3 and VT2/VC12 ports
(STS1/VC3 <-> DS3 <-> E1 <-> VT2/VC12)
• for a port that is STS/E3 managed
— multiplexing/demultiplexing between STS1/VC3 and VT2/VC12 ports
(STS1/VC3 <-> E3 <-> E1 <-> VT2/VC12)
• support for asynchronous (M13) and C-BIT DS3 signals
• support for superframe (SF), extended superframe (ESF), superframe
with TR-08 extensions (SFTR-08), and unframed DS1 signals

• terminates and inserts SONET STS1/VT and SDH VC3/VC12/VC11 path

overhead
• supports unprotected and 1+1 equipment protection. 1+1 protection
requires two TMUX circuit packs to be provisioned adjacent to each other
(slots 1/2, 3/4, 5/6, 9/10, 11/12, and 13/14 in a 14-slot shelf). The working
TMUX circuit pack is the odd numbered slot and the protection TMUX
circuit pack is the even numbered slot to the right of the working TMUX
circuit pack.
The TMUX circuit pack supports the following cross-connection types:
The TMUX circuit pack supports the following cross-connection rates:
• STS1/AU3 mapped VC3/AU4 mapped VC3 (for high-speed side)
• VT1.5/VC11 and VT2/VC12 (for low-speed side)
The TMUX circuit pack supports the following monitored entities:
• PM collection of PDH DS1 and DS3 Path for DS1DS3 and DS3 facilities
• PM collection of PDH E1 and E3 Path for E1DS3, E1E3, and E3 facilities

520.
Alarms
Equipment alarms

• Equipment OOS with subtending facilities IS

• Protection Switch Complete
Path alarms (STS & VT)

PDH facility
• AIS
• Frame Format Mismatch
• Loopback Active
• Loss of Frame
• Loss Of Multiframe
• Remote Alarm Indication
• Remote Defect Indication
• Tx AIS
• Tx Loss Of Multiframe
• Tx Remote Alarm Indication
• Tx Remote Defect Indication
Common alarms

Equipping rules
The following equipping rules apply to TMUX circuit pack:
• The TMUX circuit pack is a portless single-slot interface.
• Can be installed in slots 1-6 and 9-14 of a 14-slot shelf type. The TMUX
circuit pack can be installed in any of these 12 slots in 14-slot shelf types
but some of these slots are required for the interface circuit packs (to
provide bandwidth).
ATTENTION
You must plan the bandwidth usage to determine the number of TMUX circuit
packs required.
ATTENTION
TMUX circuit pack is not supported on a 14-slot packet-optical shelf
(NTK503SA) since it requires the use of X-CONN 80G/80G VT-1.5/VC-12
(80/80) (NTK557NAE5), X-CONN 80G/20G VT-1.5/VC-12 (80/20)
(NTK557PAE5), or X-CONN 20G/20G VT-1.5/VC-12 (20/20)
(NTK557QAE5) circuit packs that are not supported in a 14-slot packet-
optical shelf.
• The TMUX circuit pack cannot be installed in 6500-7 packet-optical, 2-slot,

7-slot, and 32-slot shelf types.
• The TMUX circuit pack requires low-order (VT1.5/VC12) cross-connect
circuit packs as both STS-1 and VT1.5 cross-connects are required. In a
14-slot shelf type, the TMUX circuit pack is not supported when using the
MXC (NTK557TBE5) or the 240G+/80G VT1.5/VC12 (240/80) cross-
connect circuit pack.

Table 2-1 on page 2-9 lists the weight and power consumption for the TMUX
circuit pack.
Table 2-1
Technical specifications for TMUX circuit pack
Parameter TMUX (NTK558DAE5)


Latency

TMUX provisioning procedures

The following flowchart provides the steps/procedures that must be performed
to have the TMUX circuit pack ready to carry traffic.
For protection switching information and procedures, refer to Configuration -

Protection Switching, 323-1851-315.

Provisioning rules summary for the 48 Channel Trans Mux (Portless)

circuit pack
• The Trans Mux circuit pack has 48 high-speed ports and 48 low-speed
ports which are internally connected. All the DS1s or E1s on a low-speed
port connect to the corresponding high-speed port.
• The DS1, DS3, E1, and E3 facilities on the Trans Mux circuit pack are
independent from associated DS1, DS3, E1, and E3 facilities that may
exists on other circuit packs. If an associated facility exists, parameters on
the Trans Mux circuit pack and the associated facility must match. For
example, if a DS3 facility exists on a DS3/E3 circuit pack that is connected
to a high-speed port on the Trans Mux circuit pack, the user must set the
parameters the same on both facilities.
• Facilities can only be provisioned on unprotected Trans Mux circuit packs
or the working Trans Mux circuit pack in a 1+1 protected configuration. If
a 1+1 protection pair is changed to unprotected, the Trans Mux circuit pack
in the odd slot retains the provisioned facilities and cross-connects and the
Trans Mux circuit pack in the even slot becomes unprotected with no
facilities or cross-connects provisioned.
Table 2-2 provides references to different procedures covered in this section.
Table 2-2
Procedures in this section
Topic
Procedure 2-1, “Provisioning a circuit pack automatically”
Procedure 2-2, “Adding a facility to a TMUX equipment”
Procedure 2-3, “Adding a path connection”
Procedure 2-4, “Changing the primary state of a facility”
Procedure 2-5, “Changing the primary state of a circuit pack”
Procedure 2-6, “Deleting a facility from an equipment”
Procedure 2-7, “Deleting a circuit pack”

Procedure 2-1
When automatic equipping is enabled, a TMUX circuit pack is automatically
provisioned when inserted in the shelf. Facilities are not auto-created.
To enable automatic equipping, refer to the “Enabling/disabling slot-based

automatic equipping” procedure in Administration and Security, 323-1851-
301.
If a circuit pack is inserted in an unsupported slot, an Autoprovisioning

Mismatch alarm is raised.
CAUTION
packs.
Prerequisites
• if provisioning equipment for an empty equipment slot, ensure the last
equipment that occupied the slot and its related facilities and cross-
connects have been deleted.
• ensure the plastic pin protector on the circuit pack has been removed.
• ensure automatic equipping is enabled.
Step Action

ground point.
2 Insert the circuit pack in the correct slot in the shelf. See “Equipping rules” on
page 2-8 for supported slots.
If you are logged in to Site Manager when you automatically provision a circuit
pack, click Refresh in the Equipment & Facility Provisioning application to
display the circuit pack in the list of available equipment.
—end—

Procedure 2-2
Adding a facility to a TMUX equipment
Use this procedure to:
• add a facility that was manually deleted
• add DS3, DS1DS3, E1DS3, E3, or E1E3 facilities
A DS1DS3 facility is a DS1 channel within a DS3 facility. An E1DS3 facility is

an E1 channel within a DS3 facility. And an E1E3 facility is an E1 channel
within an E3 facility.
Multiple add is supported on DS3, DS1DS3, E1DS3, E3, or E1E3 facilities.
In TMUX equipment, the high speed facilities must be provisioned before low
speed facilities. You must provision the DS3 facility first, and specify whether
it is optimized for DS1’s or E1’s within it. Only then, you will be able to provision
the DS1DS3 and E1DS3 facilities.
Prerequisites
UPC.
Step Action

4 In the Equipment area, select the equipment that will support the facility.
5 Select the appropriate facility type from the Facility Type drop-down list.
6 Click Add in the Facility area to open the Add facility dialog box.
7 If you want to add a Then go to
DS3 or E3 facility to a TMUX equipment step 8
DS1DS3, E1DS3, or E1E3 facility to a TMUX equipment step 9
8 Select the required port from the Port drop-down list.

To add facilities to all the remaining unprovisioned DS3 or E3 ports, select
ALL from the Port drop-down list.
Go to step 17.
9 Select the required port from the Port drop-down list (1 to 48).


Adding a facility to a TMUX equipment
Step Action
10 For DS1DS3 facility type, select the required DS2 from the DS2 drop-down
list (1 to 7 or ALL) and the required DS1 channel from the DS1 drop-down list
(1 to 4).
If you have selected ALL option in DS2 drop-down list, DS1 drop-down list
does not appear.
11 For E1DS3 facility type, select the required DS2 from the DS2 drop-down list
(1 to 7 or ALL) and the required E1 channel from the E1 drop-down list
(1 to 3).
If you have selected ALL option in DS2 drop-down list, E1 drop-down list
does not appear.
12 For E1E3 facility type, select the required E2 from the E2 drop-down list
(1 to 4 or ALL) and the required E1 channel from the E1 drop-down list
(1 to 4).
If you have selected ALL option in E2 drop-down list, E1 drop-down list does
not appear.
13 If you Then go to
want to provision a range of DS1 or E1 channels step 14
do not want to provision a range of DS1 or E1 channels step 17
14 Click Advanced in the Add facility dialog box to open the Multi-Facility
Selector dialog box.
The Available list shows the list of available DS1/E1 channels and the
Selected list shows the list of selected DS1/E1 channels.
15 Move the required DS1/E1 channels between the Available and Selected lists
by using the arrows.
16 Click OK in the Multi-Facility Selector dialog box.
The Multi-Facility Selector dialog box closes and you have selected the
required DS1/E1 channels. The Add facility dialog box reappears without the
DS2/E2 and DS1/E1 drop-down lists (the Port drop-down list shows Advance
Criteria and selected port).
17 Select the required parameters from the drop-down lists. See Table 2-6 on
page 2-26 for facility attribute descriptions.
18 Click OK to add the facility and close the Add facility dialog box.
—end—

Procedure 2-3
Use this procedure to add 2WAY or 2WAYPR path connections to a network
element for a TMUX circuit pack.
Prerequisites
To perform this procedure you must use an account with at least a level 3 UPC.
Step Action

2 Select Cross Connections: Path Connections from the Configuration
menu.
3 If this is the initial launch of the Path Connections application, no path
connections appear until you perform a Retrieve. Subsequent launches of
the Path Connections application display path connections based on the last
filter criteria.
4 Click Add to display the Add Cross-Connect dialog box.
5 If you Then go to
want to provision a Connection ID step 6
do not want to provision a Connection ID step 8
6 Click once in the Connection ID text field

7 Type the connection identifier.
Refer to Table 2-7 on page 2-31 for supported options.
8 From the Rate drop-down list, select a signal rate.
Refer to Table 2-7 on page 2-31 for supported rates.
9 From the Type drop-down list, select a connection type.
Refer to Table 2-8 on page 2-31 for supported connection types.
10 Select the required equipment, facility, port, DS1, DS2, E1, and E2
parameters (where applicable) from the drop-down lists for each of the
following panels:
• From
• To
• Switch Mate (applicable to 2WAYPR, connections only)
Refer to Table 2-9 on page 2-32 for equipment and facility parameters for path
connections and Table 2-8 on page 2-31 for allowable path connections types
between network configurations.
Site Manager automatically populates the available parameter fields after you
select the Rate and Type.


Step Action
11 Click Advanced in the From panel to open the Multi-Facility Selector dialog
box.
12 In the Multi-Facility Selector dialog box, under Available, select the
required channels for the path connections.
To select multiple channels select the first facility, then:
• hold down the Ctrl key while individually clicking once each of the
remaining facilities.
• hold down the Shift key and select the last channel required in the list.
• select Ctrl+A (Ctrl and A keys together) to select all channels.
The path connections depend on the order of selection.
13 Click the arrow pointing to the right (->).
14 Perform step 12 and step 13 for each remaining facility to be in the path
connections.
15 When all the channels you require appear in the Selected column, click OK.
16 Repeat step 11 to step 15 for the To panel.
When selecting multiple channels, you must select the same number of
channels in each of the From and To panels.
17 If you Then click
you want to provision other path connections for Apply
this network element
you have completed the path connection OK (Apply & Close)
provisioning for this network element
If you are adding a single path connection, the path connection is added. If
the path connection cannot be added, an error message appears. Go to step
18.
If you are adding multiple path connections, the Multiple Cross Connect
Add Confirmation dialog box appears. Check that the multiple path
connections are correct, then click Yes. If the path connections cannot be
added, an error message appears.
18 If you clicked Then
Apply in step 18 go to step 5
OK (Apply & Close) in step 18 the procedure is complete
—end—

Procedure 2-4
Use this procedure to change the primary state of a facility.
CAUTION
If you place a facility out-of-service, you can cause a loss of
traffic.
Prerequisites
UPC
Step Action

select the circuit pack whose facility state you want to change.
5 Select the appropriate facility from the Facility Type drop-down list.
6 If you are editing a DS1DS3, E1DS3, or E1E3 facility of a TMUX equipment,
select the port (port number, or ALL) from the Port drop-down list.
7 In the Facility area, select the facility whose state you want to change.
For circuit packs that support multiple facilities (such as DS3, DS1DS3,
E1DS3, E3, E1E3), you can select multiple facilities as follows:
required facility
or
and A keys together) to select all facilities.
8 Click Edit in the Facility area to open the Edit facility dialog box.


Step Action
9 Select OOS or IS from the Primary state drop-down list.

CAUTION
loss of traffic.
For multiple facilities, selecting <no change> from the drop-down lists leaves
the primary state unchanged for the selected facilities.
10 Click OK.
11 If changing the primary state to OOS, click Yes in the warning dialog box.
—end—

Procedure 2-5
Use this procedure to change the primary state of a circuit pack to in-service
or out-of-service.
On 48 Channel Trans Mux (Portless) circuit packs with 1+1 equipment

protection, you can change the primary state of the circuit pack without
changing the corresponding facilities to out-of-service (an Equipment OOS
with subtending facilities IS alarm is raised in this condition).
On 48 Channel Trans Mux (Portless) circuit packs without 1+1 equipment

protection, you must change the primary state of all facilities on the circuit
pack to out-of-service before changing the primary state of the circuit pack to
out-of-service, see Procedure 2-4, “Changing the primary state of a facility”.
Prerequisites
UPC.
Step Action

4 If you are changing the primary state to Then go to
OOS step 5
IS step 7
5 If you intend to change the primary state of a Then the related facilities
48 Channel Trans Mux (Portless) circuit pack
not in a 1+1 protection scheme must be OOS. Go to step 6.
in a 1+1 protection scheme can be IS. Go to step 7.
Note: For more information on this step, refer to information in procedure
introduction.
6 Ensure the circuit pack facilities, if there are any related facilities, are out-of-
service. See Procedure 2-4, “Changing the primary state of a facility”.
7 Select the circuit pack in the Equipment area.


Step Action
9 Select IS or OOS from the Primary state drop-down list.

10 Click OK.
11 If you are changing the primary state to OOS, click Yes in the warning dialog
box.
—end—

Procedure 2-6
Use this procedure to delete a facility.
CAUTION
If you delete a facility, you can cause a loss of traffic.
Prerequisites
• ensure the end-to-end service to be deleted is not carrying traffic
• ensure the facility to be deleted is out-of-service and is not in maintenance
state
• delete the connections of the entire path that terminates on this facility.
Refer to the “Deleting path connections” procedure in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320.
• delete all the child facilities and the connections that terminates on those
child facilities before deleting the parent facility, DS3 or E3
• ensure that no loopback exists on the facility, see the “Operating/releasing
a loopback” procedure to release a loopback if it exists
Step Action

select the circuit pack whose facilities you want to delete.
5 Select the appropriate facility from the Facility Type drop-down list.
6 If you are deleting a DS1DS3, E1DS3, or E1E3 facility of a TMUX equipment,
select the port (port number, or ALL) from the Port drop-down list.


Step Action
7 In the Facility area, select the facility you want to delete.

For circuit packs that support multiple facilities, you can select multiple
facilities as follows:
required facility
or
and A keys together) to select all facilities
8 Click Delete in the Facility area.

—end—

Procedure 2-7
Deleting a circuit pack
Use this procedure to delete a circuit pack equipment from the list of
provisioned equipment in the Equipment and Facility Provisioning application.
Prerequisites
• delete all facilities on the circuit pack, see Procedure 2-6, “Deleting a facility
from an equipment”.
• put the circuit pack to be deleted out-of-service, see Procedure 2-5,
“Changing the primary state of a circuit pack”.
• change the 48 Channel Trans Mux (Portless) circuit pack protection
scheme to unprotected if the 48 Channel Trans Mux (Portless) circuit pack
is 1+1 protected. See “Changing the protection scheme for electrical
equipment” in Configuration - Protection Switching, 323-1851-315.
Step Action

4 In the Equipment area, select the equipment you want to delete.
5 Click Delete in the Equipment area.
—end—

Equipment and facility provisioning parameters

Equipment and facility primary and secondary states
The table that follows provides information on equipment and facility primary
states.
Table 2-3
Equipment and facility primary states
Primary State Description
IS In-service; no failure detected
IS-ANR In-service - abnormal; failure exists but entity is still capable of performing
some of its provisioned functions (that is partial failure)
OOS-AU Out-of-service - autonomous; failure detected
OOS-MA Out-of-service - maintenance; no failure detected (OOS for maintenance

for provisioning memory administration)
OOS-AUMA Out-of-service autonomous management; failure detected

OOS-MAANR Out-of-service - maintenance - abnormal; partial failure detected
The table that follows provides information on equipment secondary states.
Table 2-4
Equipment secondary states
Active Equipment has connections established to at least one of the facilities it

supports and the connected facilities are in-service
Fault detected Equipment failure detected
Idle No connections established to facilities supported on this equipment, all

connected facilities are out-of-service, or in-service connected facilities are
not on the active traffic path in a protected connection
Mismatched eqp. attribute Mismatched or unknown equipment detected in a provisioned slot
Protection switch inhibited Protection switching has been inhibited for the equipment
Unequipped Equipment is missing
Unknown Equipment cannot be identified
Working Circuit pack in an equipment protection scheme that is actively carrying

traffic

The table that follows provides information on facility secondary states.
Table 2-5
Facility secondary states
<null> Active, working state
Disconnected Facility has no connections established.
Fault detected Facility failure detected
Supporting entity Supporting equipment:

outage • has a failure, or
• is missing, or
• is mismatched, or
• has an associated connection which is failed.
Loopback active Loopback active on facility.
Auto in-service AINS is enabled.
Maintenance State Maintenance State is enabled. When in Maintenance State, a facility continues to
carry traffic if it can, but does not raise alarms, SNMP traps or Performance
Monitoring Threshold Crossing Alerts (PM TCAs).
Applies to facilities that support maintenance state. Maintenance state is applicable
to these facilities only if they are in out-of-service state.

DS3, DS1DS3, E3, and E1E3 facility parameters (TMUX equipment)

The table that follows provides information on DS3, DS1DS3, E1DS3, E3, and
E1E3 facility parameters.
Table 2-6
DS3, DS1DS3, E1DS3, E3, and E1E3 facility parameters (TMUX equipment type)

DS3 facilities

facility.
• port: 1 to 48
Primary state See “Equipment and facility Sets the primary state of the facility.
primary states” on page 2-24 Default reflects primary state of associated
equipment.
Secondary State See “Facility secondary Displays the facility operational state.
states” on page 2-25 The AINS state is editable. The
Format • CBIT Sets the frame format of the DS3 signal.

• M13, Multiplex Framed
(default)
Channel type • DS1 (default for SONET NE) Sets the channel type of the DS3 signal.
• E1 (default for SDH NE) DS1 means that DS1 channels within the
• T1ONLY (see Note) DS3 will have full framing and monitoring
capability, E1 channels can be provisioned
but they will not have framing and limited
monitoring capability.
E1 means that E1 channels within the DS3
will have full framing and monitoring
capability, DS1 channels can be
provisioned but they will not have framing
and limited monitoring capability.
T1ONLY means that only DS1 channels
within the DS3 will have full framing and
monitoring capability, E1 channels cannot
be provisioned within the DS3 facility.

Table 2-6
DS3, DS1DS3, E1DS3, E3, and E1E3 facility parameters (TMUX equipment type) (continued)
Note: T1ONLY is the default value for DS3 facility of a TMUX equipment when the Trans Mux circuit
pack is upgraded from pre-R4.0/4.01 to R4.0/4.01. In this case, DS1 facilities are only allowed to be
muxed within the DS3. If you want to carry a mixture of DS1 and E1 channels, you must change the
channel type parameter from T1ONLY to T1 and it results in a small hit on traffic carried by the DS3 (less
than 50 ms). T1ONLY cannot be selected when a new DS3 facility is created in R4.0/4.01 for a TMUX
equipment.
DS1DS3 facilities
Unit facility-shelf-slot-port- Displays the facility, shelf number, slot

DS2 channel#-DS1 channel# number, port number, DS2 channel
number, and DS1 channel number for the
selected facility.
• port: 1 to 48
• DS2 channel#: 1 to 7
equipment.
states” on page 2-25 secondary state can be set to “Test” or
“Test deactivate”. The facility acts as a test
access port if “Test” is selected. The
facility does not act as a test access port if
“Test deactivate” is selected.
For more information about test access,
refer to the “Test access and connection
loopback provisioning” chapter in Part 2 of
Configuration - Provisioning and
Operating, 323-1851-310.
Format • Extended Superframe Sets the frame format of the DS1DS3

• Superframe (default) signal.
• Superframe with TR-08

extensions

Table 2-6
Fault locate mode • Do not check frame format Sets what checks are performed in the
• Frame checked for incoming frame format:
and outgoing (default) • Do not check frame format - the DS1DS3
• Only check incoming data facility can be unframed or used as a
clear channel facility
• Frame checked for incoming and
outgoing - both incoming and outgoing
data streams will have the frame format,
as specified by FMT, checked
• Only check incoming data - outgoing can
be unframed
Note: Use ‘Do not check frame format’ if
DS1 data is unframed.
Mapping VT1.5 Bit Asynchronous Displays the mapping of the DS1DS3

mapping payloads into VT1.5s.
Note: The ‘Out slot (S1 to S4) signaling
bits are transported’ and ‘Robbed bit
signaling bits are transported’ options are
only applicable to the ‘VT1.5 Byte
Synchronous mapping’ option. To set
these options, you must first select and
apply the ‘VT1.5 Byte Synchronous
mapping’ option and then select and apply
the ‘Out slot (S1 to S4) signaling bits are
transported’ and ‘Robbed bit signaling bits
are transported’ options as required (both
options can be active at once).
Output stream coding • Normal (default) Sets the output stream coding of the
• Set to an idle code DS1DS3 signal.

Table 2-6
E1DS3 facilities
Unit facility-shelf-slot-port- Displays the facility, shelf number, slot
DS2 channel#-E1 channel# number, port number, DS2 channel
number, and E1 channel number for the
selected facility.
• port: 1 to 48
• E1 channel#: 1 to 3
equipment.
Operating, 323-1851-310.
Frame format • Framed (default) Sets the format of the E1DS3 signal.
• Multi-framed
• Unframed
E3 facilities

facility.
• port: 1 to 48
equipment.

Table 2-6
states” on page 2-25 AINS state is editable. The Maintenance
state is editable.
Format G751 Displays the frame format of the E3 signal.

Read-only
E1E3 facilities
Unit facility-shelf-slot-port-E2 Displays the facility, shelf number, slot

channel#-E1 channel# number, port number, E2 channel number,
and E1 channel number for the selected
facility.
• port: 1 to 48
equipment.
Operating, 323-1851-310.
Frame format • Framed (default) Sets the format of the E1E3 signal.
• Multi-framed
• Unframed

Path connection parameters

Table 2-7 on page 2-31, Table 2-8 on page 2-31, and Table 2-9 on page 2-32
detail the TMUX circuit pack parameters associated with the Path
Connections Site Manager application.
Table 2-7
Path Connections application parameters for TMUX circuit packs
Parameter Description
Connection ID The connection identifier string is used to identify a provisioned path connection.
The path connection ID can contain a maximum of 64 characters, with the
exception of the \, “, and % characters.
Rate Select a connection rate:
• SONET: VT1.5,VT2, STS1
• SDH: VC11, VC12, VC3
Type Select a connection type:

• 2WAYPR (Bidirectional path ring)
Equipment/Facility Select the Equipment, Facility for the From and To endpoints as required.
Switch Mate Select the switch mate when creating 2WAYPR connections. Refer to Table 2-8
on page 2-31.
Table 2-8
Path connection types for TMUX circuit packs—supported From, To, and Switch Mate instances
Path connection From Switch Mate To

type
2WAY DS3, E3, DS1DS3, E1DS3, E1E3 N/A DS3, E3, DS1DS3, E1DS3, E1E3
2WAYPR N/A N/A DS3, E3, DS1DS3, E1DS3, E1E3

Table 2-9
Equipment and facility parameters for path connections for TMUX circuit packs

48 Channel Trans Mux (Portless) circuit packs (Note)—high-speed side
STS1/AU3- TMUX-shelf#-slot# DS3-shelf#-slot#-port# shelf# = 0 to 254
mapped VC3 E3-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for 14-slot shelf
and (except 14-slot packet-optical shelf)
AU4-mapped port# = 1 to 48
VC3
48 Channel Trans Mux (Portless) circuit packs (Note)—low-speed side
VT1.5/VC11 TMUX-shelf#-slot# DS1DS3-shelf#-slot#-port#- shelf# = 0 to 254
and DS2channel#-DS1channel# slot# = 1 to 6 and 9 to 14 for 14-slot shelf
VT2/VC12 E1E3-shelf#-slot#-port#- (except 14-slot packet-optical shelf)

E2channel#-E1channel# port# = 1 to 48
E1DS3-shelf#-slot#-port#- DS2channel# = 1 to 7
DS2channel#-E1channel# DS1channel# = 1 to 4
E2channel# = 1 to 4
E1channel# = 1 to 4
DS2channel# = 1 to 7
E1channel# = 1 to 3
Note: The supported TMUX cross connections are as follows:
TMUX port type Cross connection rate Supported destinations
DS1 to be tmuxed into a DS3 (DS1DS3) VT1.5/VC11 • DS1 on DSM module
• DS1 on DSM module
• DS1 port on PDH gateway circuit pack
• VT 1.5/VC11 on OC-n/STM-n circuit pack
• VT1.5 on EC-1 port of DS3/EC-1 circuit pack
E1 to be tmuxed into E3 (E1E3) VT2/VC12 • E1 port on E1 circuit pack
• E1 port on PDH gateway circuit pack
• VT2/VC12 on OC-n/STM-n circuit pack
• VC12 on STM-1e circuit pack
E1 to be tmuxed into DS3 (E1DS3) VT2/VC12 • E1 port on E1 circuit pack
• E1 port on PDH Gateway circuit pack
• VT2/VC12 on OC-n/STM-n circuit pack
E3 STS1/VC3 • E3 port on DS3/E3 circuit pack
• STS1/VC3 on OC-n/STM-n circuit pack
• STS1 on EC-1 port of DS3/EC-1 circuit pack
DS3 STS1/VC3 • DS3 port on DS3/E3 circuit pack
• DS3 port on DS3/EC-1 circuit pack
• STS1/VC3 on OC-n/STM-n circuit pack
• STS1 on EC-1 port of DS3/EC-1 circuit pack

6500 Packet-Optical Platform
Electrical Circuit Packs
Copyright© 2010-2019 Ciena® Corporation. All rights reserved.
Release 12.6
Publication: 323-1851-102.2
Document status: Standard
Issue 1
Document release date: September 2019
CONTACT CIENA
For additional information, office locations, and phone numbers, please visit the Ciena
web site at www.ciena.com

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323-1851-102.2 - Standard Issue 1

6500 Packet-Optical Platform Electrical Circuit Packs

6500 Packet-Optical Platform Electrical Circuit Packs

6500 Packet-Optical Platform Electrical Circuit Packs

New in this release and documentation roadmap ix

Electrical circuit packs and I/O panels 1-1

6500 Packet-Optical Platform Electrical Circuit Packs

DS3/E3/EC-1 cable assemblies 1-45

6500 Packet-Optical Platform Electrical Circuit Packs

1-11 Changing the primary state of a circuit pack 1-138

48 Channel Trans Mux (Portless) circuit pack 2-1

6500 Packet-Optical Platform Electrical Circuit Packs

6500 Packet-Optical Platform Electrical Circuit Packs

New in this release and documentation

This Technical Publication supports 6500 Packet-Optical Platform (6500)

6500 Packet-Optical Platform technical publications

6500 Packet-Optical Platform Electrical Circuit Packs

6500 D-Series and S-Series roadmap

Documentation Installation - Administration Fault Management - Common Equipment

SAOS-based Command Fault and MIB

6500 Packet-Optical Platform Electrical Circuit Packs

6500 T-Series roadmap

Planning a Network Installing, Managing and Maintaining and

T-Series Administration Fault Management -

SAOS-based Command Fault and MIB

6500 Packet-Optical Platform Electrical Circuit Packs

6500 Packet-Optical Platform Electrical Circuit Packs

Electrical circuit packs and I/O panels 1-

This section provides an overview of the 6500 Packet-Optical Platform (6500)

Circuit packs and shelf

“63xE1 working and protection circuit packs (NTK541BAE5 and NTK541PAE5)” on

“24xDS3/EC-1 working and protection circuit packs (NTK543NAE5 and

“24xDS3/E3 working and protection circuit packs (NTK543CAE5 and

“16xSTM-1e working and protection circuit packs (NTK546CAE5 and

“E1 I/O panel (NTK571xxE5)” on page 1-79

“STM-1e I/O panel (NTK573FAE5)” on page 1-89

“I/O panels hardware locations in different shelves” on page 1-92

6500 Packet-Optical Platform Electrical Circuit Packs

63xE1 working and protection circuit packs (NTK541BAE5 and

Red triangle (Fail)

Blue diamond (In Use)

Yellow circle (LOS)

6500 Packet-Optical Platform Electrical Circuit Packs

I/O Panel E1 LIU

6500 Packet-Optical Platform Electrical Circuit Packs

I/O control Protection

I/O Panel E1 LIU

6500 Packet-Optical Platform Electrical Circuit Packs

For detailed information and procedures associated with performance

6500 Packet-Optical Platform Electrical Circuit Packs

• Equipment OOS with Subtending facilities IS

6500 Packet-Optical Platform Electrical Circuit Packs

6500 Packet-Optical Platform Electrical Circuit Packs

6500 Packet-Optical Platform Electrical Circuit Packs

6500 Packet-Optical Platform Electrical Circuit Packs

• Equipping rules for the E1 interface hardware in a 14-slot metro front

6500 Packet-Optical Platform Electrical Circuit Packs