LM 4889

LM4889
www.ti.com SNAS157H – APRIL 2002 – REVISED MAY 2013
LM4889 1 Watt Audio Power Amplifier

Check for Samples: LM4889
1FEATURES DESCRIPTION
23 • Available in Space-Saving VSSOP, SOIC, The LM4889 is an audio power amplifier primarily
WSON, and DSBGA Packages designed for demanding applications in mobile
phones and other portable communication device
• Ultra Low Current Shutdown Mode (3.3 to 2.6V applications. It is capable of delivering 1 watt of
- 0.01µA) continuous average power to an 8Ω BTL load with
• Can Drive Capacitive Loads up to 500 pF less than 2% distortion (THD+N) from a 5VDC power
• Improved Pop & Click Circuitry Eliminates supply.
Noises During Turn-On and Turn-Off Boomer™ audio power amplifiers were designed
Transitions specifically to provide high quality output power with a
• 2.2 - 5.5V Operation minimal amount of external components. The
LM4889 does not require output coupling capacitors
• No Output Coupling Capacitors, Snubber or bootstrap capacitors, and therefore is ideally suited
Networks or Bootstrap Capacitors Required for mobile phone and other low voltage applications
• Unity-Gain Stable where minimal power consumption is a primary
• External Gain Configuration Capability requirement.
The LM4889 features a low-power consumption
APPLICATIONS shutdown mode, which is achieved by driving the
• Mobile Phones shutdown pin with a logic low. Additionally, the
LM4889 features an internal thermal shutdown
• PDAs protection mechanism.
• Portable Electronic Devices
The LM4889 contains advanced pop & click circuitry
to eliminate noise which would otherwise occur during
KEY SPECIFICATIONS turn-on and turn-off transitions.
• Improved PSRR at 217Hz, 5 - 3.3V 75dB The LM4889 is unity-gain stable and can be
• Power Output at 5.0V & 2% THD 1.0W(typ.) configured by external gain-setting resistors.
• Power Output at 3.3V & 1% THD 400mW(typ.)
• Shutdown Current at 3.3 & 2.6V 0.01µA(typ.)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 Boomer is a trademark of Texas Instruments.
3 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2002–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM4889
SNAS157H – APRIL 2002 – REVISED MAY 2013 www.ti.com
Typical Application
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagram
Figure 2. Small Outline (SOIC) Package - Top View Figure 3. Mini Small Outline (VSSOP) Package –
See Package Number D Top View
See Package Number DGK
Figure 4. 8-Bump DSBGA - Top View Figure 5. WSON Package - Top View
See Package Number YZR0008 See Package Number NGZ
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LM4889

LM4889
Absolute Maximum Ratings (1) (2)

Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD +0.3V
Power Dissipation (3) Internally Limited
(4)
ESD Susceptibility 2000V
ESD Susceptibility (5) 200V
Junction Temperature 150°C
Thermal Resistance θJC (SOIC) 35°C/W
θJA (SOIC) 150°C/W
θJA (8 Bump DSBGA) (6) 210°C/W
θJC (VSSOP) 56°C/W
θJA (VSSOP) 190°C/W
θJA (WSON) 220°C/W
Soldering Information See the AN-1112 Application Report.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever
is lower. For the LM4889, see power derating currents for additional information.
(4) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
(5) Machine Model, 220 pF–240 pF discharged through all pins.
(6) All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The LM4889ITL demo board
(views featured in the Application Information section) has two inner layers, one for VDD and one for GND. The planes each measure
600mils x 600mils (15.24mm x 15.24mm) and aid in spreading heat due to power dissipation within the IC.
Operating Ratings
Temperature Range TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ 85°C
Supply Voltage 2.2V ≤ VDD ≤ 5.5V
Electrical Characteristics VDD = 5V (1) (2)

The following specifications apply for VDD = 5V, AV = 2, and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
LM4889 Units
Symbol Parameter Conditions
Typical (3) Limit (4) (5) (Limits)
VIN = 0V, Io = 0A, no Load 4 8 mA (max)
IDD Quiescent Power Supply Current
VIN = 0V, Io = 0A, with BTL Load 5 8 mA (max)
ISD Shutdown Current Vshutdown = GND (6) 0.1 2 µA (max)
VSDIH Shutdown Voltage Input High 1.2 V (min)
VSDIL Shutdown Voltage Input Low 0.4 V (max)
Po Output Power THD = 2% (max); f = 1 kHz 1 W
THD+N Total Harmonic Distortion+Noise Po = 0.4 Wrms; f = 1kHz 0.1 %
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(5) Datasheet min/max specification limits are specified by design, test or statistical analysis.
(6) For DSBGA only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a
maximum of 2µA.
Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
LM4889
Electrical Characteristics VDD = 5V(1)(2) (continued)

The following specifications apply for VDD = 5V, AV = 2, and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
LM4889 Units
Typical (3)
Limit (4) (5) (Limits)
Vripple = 200mV sine p-p
fripple = 217Hz 62 dB
PSRR Power Supply Rejection Ratio fripple = 1kHz 66 dB
Input Floating 75 68 dB
Electrical Characteristics VDD = 3.3V (1) (2)

The following specifications apply for VDD = 3.3V, AV = 2, and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
LM4889 Units
Typical (3)
VIN = 0V, Io = 0A, no Load 3.5 7 mA (max)
IDD Quiescent Power Supply Current
VIN = 0V, Io = 0A, with BTL Load 4.5 7 mA (max)
(6)
ISD Shutdown Current Vshutdown = GND 0.01 2 µA (max)
VSDIH Shutdown Voltage Input High 1.2 V (min)
VSDIL Shutdown Voltage Input Low 0.4 V (max)
Po Output Power THD = 1% (max); f = 1kHz 0.4 W
THD+N Total Harmonic Distortion+Noise Po = 0.25Wrms; f = 1kHz 0.1 %
PSRR Power Supply Rejection Ratio fripple = 217Hz 60 dB
fripple =1kHz 62 dB
maximum of 2µA.
Electrical Characteristics VDD = 2.6V (1) (2)

LM4889 Units
Typical (3) Limit (4) (5) (Limits)
IDD Quiescent Power Supply Current VIN = 0V, Io = 0A, no Load 2.6 6 mA (max)
VIN = 0V, Io = 0A, with BTL Load 3.0 6 mA (max)
ISD Shutdown Current Vshutdown = GND (6) 0.01 2 µA (max)
Output Power ( 8Ω ) THD = 1% (max); f = 1 kHz 0.2 W
P0
Output Power ( 4Ω ) THD = 1% (max); f = 1 kHz 0.22 W
THD+N Total Harmonic Distortion+Noise Po = 0.1Wrms; f = 1kHz 0.08 %
maximum of 2µA.

LM4889
Electrical Characteristics VDD = 2.6V(1)(2) (continued)

LM4889 Units
Typical (3)
PSRR Power Supply Rejection Ratio fripple = 217Hz 44 dB
fripple = 1kHz 44 dB
External Components Description
(Figure 1)
Components Functional Description

1. Ri Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high pass
filter with Ci at fC= 1/(2π RiCi).
2. Ci Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a highpass filter with
Ri at fc = 1/(2π RiCi). Refer to the section, PROPER SELECTION OF EXTERNAL COMPONENTS, for an explanation
of how to determine the value of Ci.
3. Rf Feedback resistance which sets the closed-loop gain in conjunction with Ri. AVD = 2*(Rf/Ri).
4. CS Supply bypass capacitor which provides power supply filtering. Refer to the POWER SUPPLY BYPASSING section for
information concerning proper placement and selection of the supply bypass capacitor.
5. CB Bypass pin capacitor which provides half-supply filtering. Refer to the section, PROPER SELECTION OF EXTERNAL
COMPONENTS, for information concerning proper placement and selection of CB.

LM4889
Typical Performance Characteristics

THD+N vs Frequency THD+N vs Frequency
at VDD = 5V, 8Ω RL, and PWR = 250mW at VDD = 3.3V, 8Ω RL, and PWR = 150mW
Figure 6. Figure 7.
THD+N vs Frequency THD+N vs Frequency

at VDD = 2.6V, 8Ω RL, and PWR = 100mW at VDD = 2.6V, 4Ω RL, and PWR = 100mW
Figure 8. Figure 9.
THD+N vs Power Out THD+N vs Power Out

at VDD = 5V, 8Ω RL, 1kHz at VDD = 3.3V, 8Ω RL, 1kHz
Figure 10. Figure 11.

LM4889
Typical Performance Characteristics (continued)

THD+N vs Power Out THD+N vs Power Out
at VDD = 2.6V, 8Ω RL, 1kHz at VDD = 2.6V, 4Ω RL, 1kHz
Power Supply Rejection Ratio (PSRR) at VDD = 5V Power Supply Rejection Ratio (PSRR) at VDD = 5V
Figure 14. Input terminated with 10Ω R Figure 15. Input Floating
Power Supply Rejection Ratio (PSRR) at VDD = 2.6V Power Supply Rejection Ratio (PSRR) at VDD = 3.3V
Figure 16. Input terminated with 10Ω R Figure 17. Input terminated with 10Ω R

LM4889

Power Dissipation vs Power Dissipation vs
Output Power Output Power
VDD = 3.3V VDD = 5V
Power Dissipation vs
Output Power vs Output Power
Load Resistance VDD = 2.6V
Supply Current vs Clipping (Dropout) Voltage vs

Shutdown Voltage Supply Voltage

LM4889

Frequency Response vs
Open Loop Frequency Response Input Capacitor Size
Power Derating Curves

Noise Floor (PDMAX = 670mW)
Power Derating Curves - 8 bump µSMD Power Derating Curves - 10 Pin LD pkg
(PDMAX = 670mW) (PDMAX = 670mW)

LM4889
Application Information
BRIDGE CONFIGURATION EXPLANATION

As shown in Figure 1, the LM4889 has two operational amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in
a unity-gain, inverting configuration. The closed-loop gain of the first amplifier is set by selecting the ratio of Rf to
Ri while the second amplifier's gain is fixed by the two internal 20kΩ resistors. Figure 1 shows that the output of
amplifier one serves as the input to amplifier two which results in both amplifiers producing signals identical in
magnitude, but out of phase by 180°. Consequently, the differential gain for the IC is
AVD= 2 *(Rf/Ri) (1)
By driving the load differentially through outputs Vo1 and Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is different from the classical single-ended amplifier
configuration where one side of the load is connected to ground.
A bridge amplifier design has an advantage over the single-ended configuration, as it provides differential drive to
the load, thus doubling output swing for a specified supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same conditions. This increase in attainable output power
assumes that the amplifier is not current limited or clipped. In order to choose an amplifier's closed-loop gain
without causing excessive clipping, please refer to the AUDIO POWER AMPLIFIER DESIGN section.
A bridge configuration, such as the one used in LM4889, also creates a second advantage over single-ended
amplifiers. Since the differential outputs, Vo1 and Vo2, are biased at half-supply, no net DC voltage exists across
the load. This eliminates the need for an output coupling capacitor which is required in a single supply, single-
ended amplifier configuration. Without an output coupling capacitor, the half-supply bias across the load would
result in both increased internal IC power dissipation and also possible loudspeaker damage.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power delivered to the load by a bridge amplifier is an
increase in internal power dissipation. Since the LM4889 has two operational amplifiers in one package, the
maximum internal power dissipation is 4 times that of a single-ended amplifier. The maximum power dissipation
for a given application can be derived from the power dissipation graphs or from Equation 2.
PDMAX = 4*(VDD)2/(2π2RL) (2)
It is critical that the maximum junction temperature TJMAX of 150°C is not exceeded. TJMAX can be determined
from the power derating curves by using PDMAX and the PC board foil area. By adding additional copper foil, the
thermal resistance of the application can be reduced from a free air value of 150°C/W, resulting in higher PDMAX.
Additional copper foil can be added to any of the leads connected to the LM4889. It is especially effective when
connected to VDD, GND, and the output pins. Refer to the application information on the LM4889 reference design
board for an example of good heat sinking. If TJMAX still exceeds 150°C, then additional changes must be made.
These changes can include reduced supply voltage, higher load impedance, or reduced ambient temperature.
Internal power dissipation is a function of output power. Refer to the Typical Performance Characteristics curves
for power dissipation information for different output powers and output loading.
POWER SUPPLY BYPASSING

As with any amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. Typical applications employ a 5V regulator with 10 µF tantalum or electrolytic capacitor and a ceramic
bypass capacitor which aid in supply stability. This does not eliminate the need for bypassing the supply nodes of
the LM4889. The selection of a bypass capacitor, especially CB, is dependent upon PSRR requirements, click
and pop performance (as explained in the section, PROPER SELECTION OF EXTERNAL COMPONENTS),
system cost, and size constraints.

LM4889
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4889 contains a shutdown pin to externally turn off
the amplifier's bias circuitry. This shutdown feature turns the amplifier off when a logic low is placed on the
shutdown pin. By switching the shutdown pin to ground, the LM4889 supply current draw will be minimized in idle
mode. While the device will be disabled with shutdown pin voltages less than 0.5VDC, the idle current may be
greater than the typical value of 0.1µA. (Idle current is measured with the shutdown pin grounded).
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry to
provide a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch in
conjunction with an external pull-up resistor. When the switch is closed, the shutdown pin is connected to ground
and disables the amplifier. If the switch is open, then the external pull-up resistor will enable the LM4889. This
scheme ensures that the shutdown pin will not float thus preventing unwanted state changes.
PROPER SELECTION OF EXTERNAL COMPONENTS

Proper selection of external components in applications using integrated power amplifiers is critical to optimize
device and system performance. While the LM4889 is tolerant of external component combinations,
consideration to component values must be used to maximize overall system quality.
The LM4889 is unity-gain stable which gives the designer maximum system flexibility. The LM4889 should be
used in low gain configurations to minimize THD+N values, and maximize the signal to noise ratio. Low gain
configurations require large input signals to obtain a given output power. Input signals equal to or greater than 1
Vrms are available from sources such as audio codecs. Please refer to the section, AUDIO POWER AMPLIFIER
DESIGN, for a more complete explanation of proper gain selection.
Besides gain, one of the major considerations is the closed-loop bandwidth of the amplifier. To a large extent, the
bandwidth is dictated by the choice of external components shown in Figure 1. The input coupling capacitor, Ci,
forms a first order high pass filter which limits low frequency response. This value should be chosen based on
needed frequency response for a few reasons.
SELECTION OF INPUT CAPACITOR SIZE

Large input capacitors are both expensive and space hungry for portable designs. Clearly, a certain sized
capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the speakers
used in portable systems, whether internal or external, have little ability to reproduce signals below 100 Hz to
150 Hz. Thus, using a large input capacitor may not increase actual system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling
capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally
1/2 VDD). This charge comes from the output via the feedback and is apt to create pops upon device enable.
Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be
minimized.
Besides minimizing the input capacitor size, careful consideration should be paid to the bypass capacitor value.
Bypass capacitor, CB, is the most critical component to minimize turn-on pops since it determines how fast the
LM4889 turns on. The slower the LM4889's outputs ramp to their quiescent DC voltage (nominally 1/2 VDD), the
smaller the turn-on pop. Choosing CB equal to 1.0 µF along with a small value of Ci (in the range of 0.1 µF to
0.39 µF), should produce a virtually clickless and popless shutdown function. While the device will function
properly, (no oscillations or motorboating), with CB equal to 0.1 µF, the device will be much more susceptible to
turn-on clicks and pops. Thus, a value of CB equal to 1.0 µF is recommended in all but the most cost sensitive
designs.

LM4889
AUDIO POWER AMPLIFIER DESIGN
A 1W/8Ω Audio Amplifier

• Given:
– Power Output: 1 Wrms
– Load Impedance: 8Ω
– Input Level: 1 Vrms
– Input Impedance: 20 kΩ
– Bandwidth: 100 Hz–20 kHz ± 0.25 dB
A designer must first determine the minimum supply rail to obtain the specified output power. By extrapolating
from the Output Power vs Supply Voltage graphs in the Typical Performance Characteristics section, the supply
rail can be easily found. A second way to determine the minimum supply rail is to calculate the required Vopeak
using Equation 3 and add the output voltage. Using this method, the minimum supply voltage would be (Vopeak +
(VODTOP + VODBOT)), where VODBOT and VODTOP are extrapolated from the Dropout Voltage vs Supply Voltage curve in
the Typical Performance Characteristics section.
(3)
5V is a standard voltage in most applications, it is chosen for the supply rail. Extra supply voltage creates
headroom that allows the LM4889 to reproduce peaks in excess of 1W without producing audible distortion. At
this time, the designer must make sure that the power supply choice along with the output impedance does not
violate the conditions explained in the POWER DISSIPATION section.
Once the power dissipation equations have been addressed, the required differential gain can be determined
from Equation 4.
(4)
Rf/Ri = AVD/2 (5)
From Equation 3, the minimum AVD is 2.83; use AVD = 3.
Since the desired input impedance was 20 kΩ, and with a AVD impedance of 2, a ratio of 1.5:1 of Rf to Ri results
in an allocation of Ri = 20 kΩ and Rf = 30 kΩ. The final design step is to address the bandwidth requirements
which must be stated as a pair of −3 dB frequency points. Five times away from a −3 dB point is 0.17 dB down
from passband response which is better than the required ±0.25 dB specified.
fL = 100 Hz/5 = 20 Hz (6)
fH = 20 kHz * 5 = 100 kHz (7)
As stated in the External Components Description section, Ri in conjunction with Ci create a highpass filter.
Ci ≥ 1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF (8)
The high frequency pole is determined by the product of the desired frequency pole, fH, and the differential gain,
AVD. With a AVD = 3 and fH = 100 kHz, the resulting GBWP = 300kHz which is much smaller than the LM4889
GBWP of 2.5MHz. This calculation shows that if a designer has a need to design an amplifier with a higher
differential gain, the LM4889 can still be used without running into bandwidth limitations.

LM4889
Figure 30. Higher Gain Audio Amplifier
The LM4889 is unity-gain stable and requires no external components besides gain-setting resistors, an input
coupling capacitor, and proper supply bypassing in the typical application. However, if a closed-loop differential
gain of greater than 10 is required, a feedback capacitor (C4) may be needed as shown in Figure 30 to
bandwidth limit the amplifier. This feedback capacitor creates a low pass filter that eliminates possible high
frequency oscillations. Care should be taken when calculating the -3dB frequency in that an incorrect
combination of R3 and C4 will cause rolloff before 20kHz. A typical combination of feedback resistor and
capacitor that will not produce audio band high frequency rolloff is R3 = 20kΩ and C4 = 25pf. These components
result in a -3dB point of approximately 320kHz.

LM4889
Figure 31. Differential Amplifier Configuration for LM4889
Figure 32. Reference Design Board and Layout - DSBGA

LM4889
LM4889 DSBGA DEMO BOARD ARTWORK

Composite View Silk Screen
Top Layer Bottom Layer
Inner Layer Ground Inner Layer VDD

LM4889
REFERENCE DESIGN BOARD AND PCB LAYOUT GUIDELINES - VSSOP & SOIC BOARDS
Figure 33. Reference Design Board
LM4889 SOIC DEMO BOARD ARTWORK
Figure 34. Silk Screen

LM4889
Figure 35. Top Layer
Figure 36. Bottom Layer
LM4889 VSSOP DEMO BOARD ARTWORK
Figure 37. Silk Screen

LM4889
Figure 38. Top Layer
Figure 39. Bottom Layer

LM4889
REVISION HISTORY
Changes from Revision G (May 2013) to Revision H Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 18

PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM4889MA/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM48

89MA
LM4889MAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM48
89MA
LM4889MM/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 GA2
LM4889MMX/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 GA2
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM4889MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM4889MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM4889MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
Pack Materials-Page 1

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4889MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM4889MM/NOPB VSSOP DGK 8 1000 208.0 191.0 35.0
LM4889MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
TUBE

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM4889MA/NOPB D SOIC 8 95 495 8 4064 3.05
PACKAGE OUTLINE
DGK0008A SCALE 4.000
VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE
C
5.05
TYP
A 4.75
0.1 C
PIN 1 INDEX AREA
SEATING
PLANE
6X 0.65
8
1
2X
3.1
1.95
2.9
NOTE 3
4
5 0.38
8X
0.25
3.1 0.13 C A B
B
2.9
NOTE 4
0.23
0.13
SEE DETAIL A
0.25
GAGE PLANE
1.1 MAX
0.7 0.15
0 -8 0.4 0.05
DETAIL A
A 20
TYPICAL
4214862/A 04/2023
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187.
www.ti.com
EXAMPLE BOARD LAYOUT
TM
DGK0008A VSSOP - 1.1 mm max height
SYMM
8X (1.4) (R0.05) TYP
8X (0.45) 1 8
SYMM
6X (0.65)
5
4
SEE DETAILS
(4.4)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 15X
SOLDER MASK METAL UNDER SOLDER MASK

METAL
OPENING SOLDER MASK OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000
4214862/A 04/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
9. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
TM
DGK0008A VSSOP - 1.1 mm max height
SYMM
8X (1.4) (R0.05) TYP
8X (0.45) 1 8
SYMM
6X (0.65)
5
4
(4.4)
SOLDER PASTE EXAMPLE

SCALE: 15X
4214862/A 04/2023
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
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TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2024, Texas Instruments Incorporated

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www.ti.com SNAS157H – APRIL 2002 – REVISED MAY 2013

LM4889 1 Watt Audio Power Amplifier

Figure 1. Typical Audio Amplifier Application Circuit

2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM4889

Absolute Maximum Ratings (1) (2)

Electrical Characteristics VDD = 5V (1) (2)

Electrical Characteristics VDD = 5V(1)(2) (continued)

Electrical Characteristics VDD = 3.3V (1) (2)

Electrical Characteristics VDD = 2.6V (1) (2)

Product Folder Links: LM4889

Electrical Characteristics VDD = 2.6V(1)(2) (continued)

External Components Description

Components Functional Description

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 5

Typical Performance Characteristics

THD+N vs Frequency THD+N vs Frequency

THD+N vs Power Out THD+N vs Power Out

Figure 10. Figure 11.

6 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM4889

Typical Performance Characteristics (continued)

Figure 12. Figure 13.

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 7

Typical Performance Characteristics (continued)

Figure 18. Figure 19.

Figure 20. Figure 21.

Supply Current vs Clipping (Dropout) Voltage vs

Figure 22. Figure 23.

8 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM4889

Typical Performance Characteristics (continued)

Figure 24. Figure 25.

Power Derating Curves

Figure 26. Figure 27.

Figure 28. Figure 29.

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 9

BRIDGE CONFIGURATION EXPLANATION

POWER SUPPLY BYPASSING

10 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM4889

PROPER SELECTION OF EXTERNAL COMPONENTS

SELECTION OF INPUT CAPACITOR SIZE

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 11

AUDIO POWER AMPLIFIER DESIGN

A 1W/8Ω Audio Amplifier

12 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM4889

Figure 30. Higher Gain Audio Amplifier

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 13

Figure 31. Differential Amplifier Configuration for LM4889

Figure 32. Reference Design Board and Layout - DSBGA

14 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM4889

LM4889 DSBGA DEMO BOARD ARTWORK

Top Layer Bottom Layer

Inner Layer Ground Inner Layer VDD

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 15