Dimensions of Electronic Product Design

Size-miniature-functional elements Weight Power Supply Inter-intra module connections/communications Environmental limits-dust proof, controlled temp conditions Packaging-transport, storage, anti static bag, special packing Special cables & connectors, electro-mechanical components Thermal Design-component level, board level & system level-heat sinks-forced cooling EMC/EMI concerns
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Dimensions of Electronic Product Design

Industrial Design-look-safety-user friendly Reliability Quality Maintenance free operations Multi-functionality Product Variety

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Industrial Design
Industrial Design is known as the art and science of increasing the beauty and value of mass produced products The professional service of creating and developing concepts and specifications that optimize the function, value, and appearance of products and systems for mutual benefit of both the user and manufacturer
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Critical Goals of ID
Utility-The products human interfaces should be safe, easy to use & easy to understand the function Appearance-Form/shape/line/proportion/color are used to make the product attractive & pleasing Ease of maintenance-The product should communicate how the maintenance/repair process should be addressed Cost-Cost of product to be kept low Communication-Product design should communicate the corporate design philosophy and mission through the visual qualities of the product
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Importance of ID
ID determines the commercial success of any product All products that are used, operated or seen by customer depend on ID for product success ID determines the aesthetic appeal and the quality of the user interfaces of a product

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Need for ID
Ergonomics-Related to human interfaces Aesthetics- Deals with form & finish of the product

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ERGONOMICS NEEDS
Ergonomics or human factors engineering is the science of fitting tasks to man. Ergonomic Needs: Ease of Use-for frequently/infrequently used products Ease of Maintenance

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ERGONOMICS cont.
Number of user interactions for the product to function(More interaction means more dependency on ID) Novelty of the user interactions eg. Improvement in mouse. Safety Issues-Safety considerations are very important-Human anatomy and psychology issues need to be considered.
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Aesthetic Needs
Aesthetic needs deals with form & finish of products.-They are: (a) Product Differentiation-Visual (b) Pride of ownership -image/fashion

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Aesthetic Needs cont.

(c) Motivation of the team-A product that is aesthetically appealing can generate a sense of team pride among the design and manufacturing staff. Team pride helps to motive and unify every one associated with the project

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INDUSTRIAL DESIGN PROCESS

Investigation of Customer needs

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INDUSTRIAL DESIGN PROCESS cont

Conceptualization- Products form and user interface designed, simple sketches (Thumbnail sketches) made, concepts are matched & combined with technical solutions.

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INDUSTRIAL DESIGN PROCESS cont

Preliminary refinement Models of most promising concepts are made using foam etc

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INDUSTRIAL DESIGN PROCESS cont.

Further refinement and final concept selection -- Hard models (using wood, plastic etc) and information-intensive sketches(rendering) are made.

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INDUSTRIAL DESIGN PROCESS cont.

Control drawings It documents functionality, features, size, color, dimensions, surface finish etc

Coordination withy engineering, manufacturing and vendors

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Benefits of Using ID
Increased Product Appeal Better Features Greater customer satisfaction Strong Brand Identity Product Differentiations Price Premium and or Increased market share
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Disadvantage of ID-Because of multiple re-works on account of ergonomics & aesthetics may result in delay in the products introduction in the market which will likely to have an economic cost

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DFX
Design for
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DFx methodologies in Product Design

There will be always a conflict between needs & specifications to a specific issue. To resolve such issues many teams practice Design for X (DFX) methodologies, where X may correspond to one of dozens of quality criteria such as:-Reliability-Robustness-serviceabilityEnvironmental impact-manufacturability (DFM)

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Methodologies for achieving Xs in DFX

Carry out detail design decisions-can have substantial impact on product quality & cost Need to address multiple &conflicting goals by development teams

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Methodologies for achieving Xs in DFX

Have metrics to compare alternative designs Generate detail creative efforts early in the process A well defined method assists the decision-making process
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DFM

Design for Manufacturing

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DFM Economically successful design implies-high product quality while minimizing manufacturing cost. DFM is one method for achieving this goal Effective DFM practice leads to low manufacturing costs with out sacrificing product quality
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DFM cont.
DFM utilizes information of several types such as:-sketches, drawings, product specifications, design alternatives, detailed understanding of production & assembly process, estimates of manufacturing cost, production volumes and ramp-up timing
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DFM cont. DFM requires contributions from all members of development team as well as out side experts DFM is performed through out development Process
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DFM Process
Estimate the manufacturing cost Reduce the cost of components Reduce the costs of assembly Reduce the cost of supporting production Consider the impact of DFM decisions on other factors
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DFM Method
Proposed Design

Estimate the Manufacutring Costs

Reduce the Costs of Components

Reduce the Costs of Assembly

Reduce the Costs of Supporting Production

Consider the Impact of DFM Decisions on Other Factors

DFM iterations may continue even until pilot production begins

Recompute the Manufacturing Costs

Good enough ? Y

Once the design is frozen (or released) and any further modifications are considered formal engineering changes or Become part of next generation of the product.

Acceptable Design

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DFM Method cont. Manufacturing Costs Defined Sum of all the expenditures for the inputs of the system (i.e. purchased components, energy, raw materials, etc.) and for disposal of the wastes produced by the system

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DFM Method cont.

Estimate the Manufacturing Costs
Equipment Information Tooling

Raw Materials Labor Purchased Components

Manufacturing System

Finished Goods

Energy

Supplies
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Services

Waste

Elements of the Manufacturing Cost of a product

Manufacturing Cost

Components

Assembly

Overhead

Standard

Custom

Labor

Equipment and Tooling

Support

Indirect Allocation

Raw Material

Processing

Tooling

Elements of manufacturing cost of production

The unit manufacturing cost of a product consists of Component Cost, ,Assembly Cost and Overhead Cost (Standard cost-motors ,switches, electronic chips and screws) Custom parts are made as per manufactures design from raw materials such as sheet steel ,plastics pellets or aluminum bars
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Different Cost Heads

Component Cost-This is the cost of standard parts & custom parts Assembly Costs-Cost of goods assembled from parts, labor cost & may incur costs for equipment and tooling Over head cost- for all other costs.
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Different Cost Heads cont.

There are two types of OH costs:1) Support Cost:-material handling, QA, Purchasing, Shipping etc., 2) Indirect Allocations-cost of manufacturing that can not be directly linked to a particular product but which must be paid for to be in business (salary, bldg maintenance etc.,
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Different Cost Heads

Fixed Cost-It is a pre-determined cost regardless of how many units of the product are manufactured (cost if injunction module/setting up factory) Variable cost-These costs are incurred in direct proportion to the number of units produced. e.g., cost of raw material consumed

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DFM Method cont.

Reduce the Cost of Components Understand the Process Constraints and Cost Drivers Redesign Components to Eliminate Processing Steps Choose the Appropriate Economic Scale for the Part Process (Higher the volume of production lower the cost
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DFM Method cont.

Reduce the Cost of Components
Standardize Components and Processes Redesign costly parts with the same performance while avoiding high manufacturing costs. Work closely with design engineers raise awareness of difficult operations and high costs.
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DFM Method cont.

Reduce the Cost of Components Eliminate unnecessary steps. Use substitution steps, where applicable. Analysis Tool Process Flow Chart and Value Stream Mapping
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Bill of Material (BOM)

The BOM is a list of each individual component in the product. BOM is created using an indent format in which the cost of components & sub assemblies are considered along with different cost heads i.e., fixed/variable costs. The cost of standard components are estimated by comparing similar part to what the firm is already producing/from vendors. Cost of custom components are determined by manufacturer or by supplier Raw material cost could be estimated by computing the mass of the part, allowing for some scrap

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Indented Bill of Material

Component
Purchased material

Processing( Machine+la bor

Assembly( Total unit labour) variabl e cost

Tooling and other cost

Total unit fixed cost

Total cost

Manifold casting

12.83

5.23

18.06

1960

0.50

18.56

pipe

1.30

0.15

1.45

1.45

valve gasket
Total Direct Cost

1.35

0.14

1.49 0.18
21.18

1.49 0.18 0.50

31.68

0.05 5.23

0.13 0.42

15.53

Overhead charges Total cost

2.60

9.42

1.71
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0.75

14.48
46.16

DFM cont. Reduce the costs of Assembly

Design for assembly (DFA) is a important sub-set of DFM which involves minimizing the cost of assembly DFA helps in reducing the parts count, manufacturing complexity, and support costs and assembly cost.

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Reduce the Costs of Assembly Design for Assembly (DFA) index Integrated Parts (Advantages and Disadvantages) Maximize Ease of Assembly Consider Customer Assembly
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DFM cont. Reduce the costs of Assembly (DFA)

Yardsticks used for DFA decisions:Assembly Efficiency-it is measured as an index which is the ratio of the theoretical minimum assembly time to an estimate of the actual assembly time for the product, this gives a idea of what drives the cost of assembly. The expression for the DFA index is
(Theoretical minimum number of parts) x (3 seconds) DFA index = Estimated total assembly time

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DFM cont. (DFA)

How to Find out the Theoretical Minimum Number?. Does the part need to move relative to the rest of the assembly?. Must the part be made of a different material from the rest the assembly for fundamental physical reasons?. Does the part have to be separated from assembly for assembly access, replacement or repair
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DFM cont. (DFA)

Integrate Parts-if a part does not qualify as one of those theoretically necessary then it can be physically integrated with one or more other parts. It means that it need not be assembled & less expensive to fabricate than separate part they replace. It also allow fixing with critical geometric features to be controlled fabrication
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DFM cont. (DFA)

Maximize Ease of Assembly-Two products with an identical number of parts may differ in required assembly time by a factor of two or three

Consider Customer Assembly-But check quality

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 Part is capable of inserted from the top of the assembly Part is self aligning Part does not need to be oriented Part requires only one hand for assembly Part requires no tools Part is assembled in a single, linear motion Part is secured immediately up on insertion

Ideal characteristics of a part for Assembling(to reduce cost of assembly) DFM cont. (DFA)

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Consider Customer Assembly

Customers will tolerate some assembly Design product so that customers can easily and assemble correctly Customers will likely ignore directions
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Reducing the costs of Supporting production

A reduction in the number of parts reduces inventory cost

A reduction in assembly content reduces the number of workers required and hence the expenditure on supervision/HR cost Standardized component reduce the demands on engineering support & quality control

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Reducing the costs of Supporting production cont.

Reduce the actual production support (inventory mgmt, workers etc.,) even if overhead cost estimates do not change. In addition:-Minimize Systemic Complexity by smart design decisions & Error Proofing. Error proofing is the strategy of anticipating the possible failure modes of the production system and take appropriate corrective action early in the developing process
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Consider the Impact of DFM Decisions on Other Factors

Development Time Development Cost Product Quality External Factors Component reuse Life cycle costs
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Consider the impact of DFM Decisions on other Factors

The impact of DFM on Development TimeDFM decision must be evaluated for their impact on development time as well as for their impact on manufacturing cost.

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 The impact of DFM on Development CostBy applying good project management practice and the application of sound DFM methods one can develop products with in time and with in budget
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Consider the impact of DFM Decisions on other Factors cont.

Impact of DFM Decisions

Impact of DFM on Product Quality-

ideal conditions -action to decrease manufacturing cost would improve quality. However, reliability/robustness needs to considered.
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Impact of DFM Decisions cont.

Impact of DFM on external Factors Component reuse-using resources to create a low cost component will also help other teams designing similar products Life cycle costs-Disposal of toxic materials/service & warranty costs. They may not appear in the manufacturing cost analysis they need to be considered on DFM decisions
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Quality By Design
Quality is defined as the totality of features and characteristics of a product or service that bears on its ability to satisfy stated or implied needs Quality features can be classified into two major categories: 1.The conformance of the features designed in the product to the specifications (process dependent) 2.The designed features it self (design dependent)
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Quality By Design cont.

Product Rating for Quality of ID
1) Quality of user Interface 2) Emotional Appeal
3) Ability to Maintain and Repair the Product

4) Appropriate use of Resources

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Quality By Design cont.

5) Product Differentiation-This differentiation arises predominantly from appearance-will a customer can single out the product in the store from its appearance? ,will a customer can recollect the product from an ad?. Will it be recognized when seen on the street?. Does the product fit with or enhance the corporate identity
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Quality By Design cont.

Quality Assurance QA is broadly the prevention of quality problems through planned and systemic activities (including documentation) Major QA standards are : -

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Quality By Design cont.

1) Iso-9001ensures conformance to requirements during design and development, production, installation and servicing. Therefore, engineering and manufacturing firms who design, develop, produce, install and service their products are covered under this standard
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Quality By Design cont.

2) ISO-9002-specifies a model for QA when only production and installation conformance is required

3) ISO-9003-specifies a model for QA in final inspection

and testing. 4) ISO-9004-contains guidance on technical, administrative and human factors affecting the quality of the products and services

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Sketches & Engineering Drawing of Electronic Products

Sketches are usually line drawings showing the product in perspective with annotations of key features Where as engineering drawing is the principal medium used by manufacturing as criteria for producing the product These drawings are reflections of design engineering drawings but formatted and organized to enhance producibility and protected from mass or blanket change The drawings are generated using a sequential process of checking & approval The drawings are tested during pre production build phase and the proto type build phase Parts and materials are purchased based on the drawings On receipt of parts and materials, the same is checked and compared with the drawings The manufacturing drawings reflect the product exactly
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Drawing Release
A key action in introducing a product into manufacturing is the official drawing release phase From an engineering design point of view, there is no turning back. Official drawing release may be considered the moment when design is frozen. The BOM is prepared based on this. Therefore, changes in any of this documentation after the official drawing release will require processing through the established change notice procedure

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Inputs, Control & Display interface

Interface-the means by which we can connect/interact with the functionality of a device & user Interface Design Theory-Human & cmptr a. Design to make easier instruction for human /comptr interactions b. Design to discover the most efficient way for understandable electronic messages c. Proper diagram of menus, icons, forms as well as data display and entry norms
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Rules for Interface Design

Strive for consistency e.g., Dialogue box for same i.e., in CAD or in other applications a. same sequence of actions should be required in similar situations b. identical terminology should be used in prompts, menus and help screens

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Rules for Interface Design

c. consistent color, layout, fonts etc should be

employed throughout

Enable frequent users to use shortcuts-to increase the pace of interaction use abbreviation, special keys, hidden command etc., Offers information feed back-for every user action the s/w should respond in the same way e.g., do you want save the file?.
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Rules For Interface design

Permit easy reversal of action-back, undo Reduce short term memory load-by designing screens where options are clearly visible e.g., maximum, minimum, close all clearly visible Design user friendly sw actions & avoid tedious sequences of data entry

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Sketches & Engineering Drawing of Electronic Products

Sketches are usually line drawings showing the product in perspective with annotations of key features Where as engineering drawing is the principal medium used by manufacturing as criteria for producing the product These drawings are reflections of design engineering drawings but formatted and organized to enhance producibility and protected from mass or blanket change The drawings are generated using a sequential process of checking & approval
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Sketches & Engineering Drawing of Electronic Products

The drawings are tested during pre production build phase and the proto type build phase Parts and materials are purchased based on the drawings On receipt of parts and materials, the same is checked and compared with the drawings The manufacturing drawings reflect the product exactly

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Drawing Release
A key action in introducing a product into manufacturing is the official drawing release phase From an engineering design point of view, there is no turning back. Official drawing release may be considered the moment when design is frozen. The BOM is prepared based on this. Therefore, changes in any of this documentation after the official drawing release will require processing through the established change notice procedure

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Documents
Market Research -Ref for design team Design Documents -- Ref for Engg team Engg Design Document-Ref for purchase/production Testing & Maint document-useful for design team while designing new version of the product

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Design Documents of Electronic Products

Block Diagram Structure Diagram Product Sketches Circuit Diagram PCB routing guide lines

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Engineering Documents of Electronic Products

BOM-Bill of material-up dated every week PCB Lay out PCB/CAD file for manufacturing Mechanical drawings of enclosures and any other mechanical parts involved Assembly instructions Test Plan documents
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Test Documents
Useful for engineering team to finalize the design before production Checks confirm the production process Helps design engineers to change any design to meet production requirement Helps in validating the design specifications Test documents-Environmental Testing & EMI/EMC Compliance testing
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Environmental/EMI-EMC Testing
Temperature Cycling Humidity Test Vibration Test Bump test Conducted EMI Test Radiated EMI test

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Electronic Packaging
Electronic Packaging is the means by which system components are interconnected and integrated to create a product with a desired functionality. Electronic packaging must provide for electrical connections between components, physical support of each component, thermal management for the heat dissipated by each component, and connection of the system to the out side world
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Components of Electronic Packaging

The most common form of electronic packaging is the printed circuit assembly (PCA). The PCA consists of the Printed Circuit Board (PCB) and the various electronic components that are attached to it, including integrated circuits (ICs), discrete components, connectors and modules.

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Common Definitions
Foot Print-It is the substrate area occupied by the package components. Pitch-Is the periodic dimension that characterizes the spacing between repeating elements of a peripheral or array patterns Substrate-The substrate of an electronic assembly is the system element to which electronic components are attached and their respective I/O are connected together (It therefore consists of the bulk substrate material and one or more layers of conductive routing for the distribution of electric signals or power)
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Cont..
Module-A substrate which attaches to a larger system substrate is called a module. It is a smaller PCA that is connected to a larger PCA (mother Board) PCA-Printed circuit assembly is the most common form of electronic packaging. PCA consists of the printed circuit board (PCB) and the various electronic components that are attached to it such as ICs, discrete components, connectors and modules

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Cont..
PCB-Printed Circuit Board provides electrical interconnections as thin metal tracks on dielectric substrate, which also supports the components Discrete Components-It consists of resistors, capacitors, inductors, diodes,transistors,oscillators,and switches

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Levels of Electronic Packaging Substrate for chip Second level card assembly
chip

chip

module

First level package connector

Back panel or Mother Board

Third Level Assembly

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Functions of Packaging
To provide electrical connections between various devices To provide mechanical support to the product To facilitate assembly operations To distribute power to all component and chip circuits To protect the circuit from environmental & mechanical damage
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Cont..
Shielding from external electro-magnetic radiation and interference Preventing harmful radiation going out of box To remove heat generated from ICs and other components To allow removal and replacement of failed components To facilitate electrical and functional testing of the circuit
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Levels of packaging

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Levels of Packaging
Level 0 Packaging:
Interconnections within semiconductor IC Interconnections on a monolithic silicon die

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Chip (IC) Level Packaging (Level 1)

Chip level Packaging is first level packaging. The chip is connected to its carrier in many different ways: a. Leaded Package(single, dual,quad etc inline) b. TAB/TCP Package (Tape-automated bonding/Tape carrier package) c. COB( chip-on-board) d. Flip-chip e. BGA (Ball grid Array) f. CSP (chip scale packages)
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Flip-Chip Packaging
Flip-Chip packaging provides the highest interconnection density for a given area and a very high level of miniaturization. The bare die is mounted directly to the substrate, eliminating the need for an intermediate IC package Flip-chip can be cost-effective in very high volume applications. The electrical characteristics of a flip-chip connection are generally better than a wire-bonded device, due to the elimination of performance-sapping conductance and capacitance in leads and wire bonds
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Flip-Chip Packaging
Flip-chips is difficult to test & high mechanical stress due to thermal mismatch. Thermal stress issues are handled by under-filling the assembly with an epoxy Flip-Chips is used where a high manufacturing yield is required & extreme miniaturization is of utmost importance Assembly thickness of less than0.5 mm can be achieved with flip-flop
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Basic Flip-chip construction

Metal Bump IC Die

Under-fill

SUBSTRATE

Cross-section

Solder or conductive adhesive bond

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Ball Grid Array (BGA)

Encapsulation Flip-Chip IC IC DIE

SUBSTRATE SOLDER BALLS BGA packages utilize a small printed circuit carrier as an interposer between IC and the printed circuit substrate. The IC is wire-bonded or flip-chipped to the printed circuit carrier and is encapsulated in a manner similar to a leaded package. The printed circuit carrier routes the peripheral wire-bonds to an array pattern on the underside of the carrier. The array pattern is populated with solder balls that function as leads for surface mount attachment to the printed circuit substrate
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CSP Package
CSP Package is similar to BGA package but with smaller foot-prints than BGA Provide the miniaturization and performance as that of a flip-chip package Have better testability & reduced mechanical stress The interposer layer in a CSP can be used to transform the I/O pattern of the device from peripheral to array
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Discrete Components
All discrete components are designed to be soldered on to a PCB substrate (surface mount variety) Discrete components form a large part of any portable electronic equipment. Functionality, performance, and cost are determined by the selection of discrete components. Discrete components normally have a high tolerance levels. However, in certain systems high tolerance levels are avoided by having a adjustable discrete components

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level 2 packaging

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PCB Assembly (Level 3)

PCB assembly with single-chip packages, multi-chip modules and discrete components forms the basis of carrier level packaging alternatively known as third level packaging. The other components are connectors, sockets, power devices, mini transformers, cables etc.

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Cont..
The major parts of third level package are:1.Printed circuit carrier( rigid and flexible) 2.Connectors (signal, power, sockets) 3.Single Chip and multi chip packages 4.Discrete components 5.Power devices such as transformers & batteries 6.Special components such as crystal Oscillators, reset switches, speakers
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Connectors

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Connectors
Connectors are an essential part of electronics packing. A connector serves two purposes: a. Mechanical connection to hold the two circuits together b. Electrical connection to provide signal and power transmission from one circuit to other

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Connectors
Some examples of many uses of connectors are: 1.Insertion of adapter cards on a mother board using a card edge connector 2.Memory installation in SIMM sockets 3.Connecting power supply to various I/O device 4.HDD,FDD and CD_ROM connections to the mother board using cable connectors and pin headers 5.Key board and mouse connection to PC 6.Board-to Board connection using flat cable connector
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Connector Contacts
Gold-plated contacts are used for high reliability applications such as military, tele communications, medical & high end computers Palladium is a low cost alternative to the gold Non-noble metals such as tin-lead plating is used for low end computers, automobile applications & consumer products because of its low cost

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Connectors
The high speed circuits require signal propagation paths that are free of crosstalk and resulting electrical noise. Increased interconnect density means more cross talk. Hence need for proper selection of connectors The contact material for connectors depends on many factors such as: 1.connection density 2.component profile 3.operating environment & reliability
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Design Requirement of Connectors

Contact force Contact resistance Temperature rise Current Density Stress relaxation under temperature Ease of use Performance- High performance connectors for achieving necessary signal fidelity Design based on expected mate/demate cycles Connector intended only to facilitate the original system assembly need to be rated only for a small number of insertions
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Connectors/wires used in Portable Electronics

SMT Type -they are surface mounted to the PCB (board-to Board connection). Known as LIF/ZIF connector using polyimide/polyester flex Heat Seal connectors-Used to achieve very fine pitch (polyimide flex) or very low cost (polyester flex) used for connecting system PCB to LCD
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Connectors/wires used in Portable Electronics

Socket Connectors-used for microprocessor and multi-chip modules to interface into a system-sockets are costly and used where the system is subject to revision/upgrade/postponement (fitting the expensive component just before shipping)
Wire cables/flex circuits are often employed for electrical connection when board-to board connection is not possible Flex circuits enable a very high density of electrical connections to be routed in a compact volume, they allow distributed electronics for space-constrained applications, allow controlled electrical characteristics and physical geometry
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assignment
FIND NAMES OF ANY 10 TYPES OF CONNECTORS & ITS APPLICATION SHORT NOTE ON CABLES (COAXIAL, UTP,STP,RIBBON, OFC etc.

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Electronic Packaging Metrics

Number of connections-total number of inter connect introduced on account of solder joints, adhesive inner-connect or counter terminal interfaces Opportunity count-total number of parts plus total number of connections; the same indicate that each of these elements represent an opportunity for failure. A high count means complex & riskier electronic assembly Average Pin count (APC)MEC

Cont..
Average Pin Count-ratio of total number of component terminals to total number of parts, at system level. Gives a idea of integration level and/or digital-ness of the overall product. Low APCs reflect a high number of discretes or other low-pin count devices often characteristics of analog circuits. High APCs means a digital circuit-high pin counts
Connection density-this metric is a ratio of total number of connections to total printed circuit board assembly area in units of connections per cm

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Cont..
Part Density-This metric is a ratio of the total number of parts to total printed circuit board assembly area, in units of components per cm. High part density reflect challenges in surface mount assembly in terms of precision of placement, number of placement and engineering of part clearances. Routing Density=3x(average pin count) x (part density)1/2 part density formula is particularly useful for designer to determine the required wiring resources needed in a substrate based on the average pin count and required pin 1 density of the product

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Displays
In a portable electronic design the user interface is most affected by the selection of displays Pixel resolution determines the level of graphic detail that can be displayed in a single image frame Resolutions varies from low-resolution, monochrome, segmented, character-only display to high resolution, color displays capable of displaying millions of pixels The color range of display determines the number of variations of color that can be displayed

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Displays
Brightness indicates how much light is emitted from the surface of the display Reflective displays have no brightness and rely on reflected ambient light to reveal the contrast and color created on the display surface Emissive displays generate light at each pixel. This light creates the color and contrasts to form the intended image. Trans-missive displays use a backlight which is filtered by the display surface to create color and contrast Transflective displays reflect ambient light back through the filtering display surface to create an image.
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Display Technology
Most portable electronic devices that have a display use a flat panel display (FPD) and, in most cases the FPD is based on LCD technology .Types of FPD: Liquid Crystal Nematic Smectic Chiral Emissive Field Emission Displays Electroluminescent Light Emitting polymers Microdisplays Liquid Crystal MEMS Electroluminescent
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assignment

FIND OUT PCB FABRICATION TECHNIQUES

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