IPC J-STD-001HA/IPC-A-610HA

October 2021

Automotive Addendum to IPC J-STD-001H

Requirements for Soldered Electrical and
Electronic Assemblies and IPC-A-610H
Acceptability of Electronic Assemblies

Developed by

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 IPC J-STD-001HA/IPC-A-610HA

Acceptance Addendum
Automotive Requirements
forIPC
to Optical Fiber, Optical
J-STD-001H
Cable, and Hybrid
Requirements Wiring
for Soldered
Harness Assemblies
Electrical and Electronic
If a conflict occurs

Assemblies and
between the English
language and translated
versions of this document,
the English version will
take precedence.
IPC-A-610H Acceptability
of Electronic Assemblies

Developed by the J-STD-001 and IPC-A-610 Automotive Addendum Task

Group of the Product Assurance Committee (7-30) of IPC

Supersedes: Users of this publication are encouraged to participate in the

IPC J-STD-001GA/IPC-A-610GA - development of future revisions.
February 2020

Contact:

IPC

Tel 847 615.7100

Fax 847 615.7105
IPC J-STD-001HA
October 2021 IPC J-STD-001H/IPC-A-610HA

Table of Contents
The following topics are addressed in this Addendum.
0.1 Scope
0.2 Purpose
0.3 Existing or Previously Approved Designs
0.4 Use
The following reference numbers are to J-STD-001H Clauses that are modified or added in this Addendum.
1.1 Scope
1.3.1 (NEW) Inspection Personnel and Product Requirements
1.6 Process Control Requirements
1.7 Order of Precedence
1.7.2 (NEW) Conflict
1.8 Terms and Definitions
1.8.8 Manufacturer
1.8.9 Objective Evidence
1.8.17 User
1.8.20 Design Authority
1.8.21 (NEW) Solder Coverage
1.8.22 (NEW) Voiding (Percentage)
1.9 Requirements Flowdown
1.10 Personnel Proficiency
1.11 Acceptance Requirements
1.11.1 (NEW) Conditions Not Specified
1.12.1 Process Verification Inspection
1.12.1.1 (NEW) Visual, Automated Optical and Automated X-ray Inspection
1.12.2.2 (NEW) Magnification Aids
1.12.3 (NEW) Process Verification Methodologies
1.14 Electrostatic Discharge (ESD)
2.0 Applicable Documents
2.1 IPC
2.2 JEDEC
2.3 Joint Industry Standards
2.4 ASTM
2.5 EOS/ESD Association, Inc.
2.6 International Electrotechnical Commission
2.7 SAE International
2.8 Military Standards
2.10 (NEW) Automotive Electronics Council (AEC)
2.11 (NEW) Automotive Industry Action Group (AIAG)
2.12 (NEW) American National Standards Institute (ANSI)
2.13 (NEW) IATF
3.1 Materials
3.2 Solder
3.2.1 Solder – Pb-Free
3.2.2 Solder Purity Maintenance
3.6 Components
3.6.1 Component and Seal Damage
4.1 Solderability
4.5 Rework of Nonsolderable Parts

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IPC J-STD-001HA/IPC-A-610HA October 2021

4.6 Preprocessing Cleanliness Requirements

4.14.1.1.1 (NEW) Wave/Selective Soldering Machine Controls
4.14.2 Reflow Soldering
4.15.3 Partially Visible or Hidden Solder Connections
5.0.1 (NEW) Wire and Terminal Requirements
6.2.2 Through-Hole Component Lead Soldering
7.0 SURFACE MOUNTING OF COMPONENTS
7.0.1 (NEW) Voiding and Solder Coverage
7.0.1.1 (NEW) Solder Coverage Requirements for Thermal Plane Terminations
7.0.1.2 (NEW) Solder Coverage Requirements for I/O Pins of Bottom-Termination Components
7.0.1.3 (NEW) Solder Coverage Requirements for Rectangular or Square End Chip Components – 1, 2, 3 or 5 Side Termination(s)
7.0.1.4 (NEW) Voiding Requirements for Ball Grid Array Components with Collapsing Balls
7.0.1.5 (NEW) Solder Coverage Requirements for Leadless Grid Array (LGA) Components
7.1.1 Plastic Components
7.4 Installation of Surface Mount Components
7.5 Soldering Requirements
7.5.4 Rectangular or Square End Chip Components – 1, 2, 3 or 5 Side Termination(s)
7.5.5 Cylindrical End Cap Terminations
7.5.6 Castellated Terminations
7.5.7 Flat Gull Wing Leads
7.5.8 Round or Flattened (Coined) Gull Wing Leads
7.5.11 Flat Lug Leads
7.5.13 Inward Formed L-Shaped Ribbon Leads
7.5.14 Surface Mount Area Array Packages
7.5.14.1 (NEW) Ball Grid Array Components with Collapsing Balls
7.5.14.2 (NEW) Ball Grid Array Components with Noncollapsing Balls
7.5.14.3 (NEW) Column Grid Array Components
7.5.15 Bottom Termination Components (BTC)
7.5.16 Components with Bottom Thermal Plane Terminations (D-PAK)
7.5.19 Vertical Cans with Outward L-Shaped Lead Terminations
7.5.20 Wrapped Terminals
7.5.21 Flexible and Rigid-Flex Printed Circuitry with Flat Unformed Leads
7.5.22 (NEW) Odd-Shaped Components with Hidden Terminations
7.5.23 (NEW) Half-Moon Shape Ferrite Terminations-Coil Terminal
7.5.24 (NEW) Coil Terminals (Coated Wire)
7.5.25 (NEW) “L” Type (Fuses/Shunt Resistors) Terminals
7.5.26 (NEW) ‘‘C’’ Type Terminal with Thermal Plane Termination
8.4 Foreign Object Debris (FOD)
9.0.1 (NEW) Printed Circuit Board and Assembly Damage
9.3 Bow and Twist (Warpage)
12.0 Rework and Repair
12.1 Rework
12.2 Repair
12.3 Post Rework/Repair Cleaning

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0.1 Scope This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in
J-STD-001H to ensure the reliability of mission-critical soldered automotive electrical and electronic assemblies in the field under
harsh environments, considering the conditions of automated high-volume production.

0.2 Purpose When required by procurement documentation/drawings, this Addendum supplements or replaces specifically
identified requirements of J-STD-001H.

0.3 Existing or Previously Approved Designs This Addendum shall not constitute the sole cause for the redesign of previously
approved designs. When drawings for existing or previously approved designs undergo revision, they should be reviewed and
changes made that allow for conformance with the requirements of this Addendum.

0.4 Use This Addendum is not to be used as a standalone document.

Where criteria are not supplemented, the Class 3 requirements of J-STD-001H shall apply. Where J-STD-001H criteria are
supplemented or new criteria are added by this Addendum, the clause is listed in J-STD-001HA, and the entire J-STD-001H clause
is replaced by this Addendum except as specifically noted.
The clauses modified by this Addendum do not include subordinate clauses unless specifically stated, e.g., 1.4 does not
include 1.4.1. Clauses, Tables, Figures, etc., in J-STD-001H that are not listed in this Addendum are to be used as published.
J-STD-001HA must be used with J-STD-001H.
This Addendum shall be used only in conjunction with the corresponding automotive addendum pertaining to IPC-A-610H.
In the context of this Addendum, IPC-A-610 shall be used as a companion document to J-STD-001. The revisions of J-STD-001
and IPC-A-610 shall correspond, e.g., J-STD-001H and IPC-A-610H. The likelihood of criteria not aligning increases when
different revisions are used together.
If there is a conflict between the documents referenced in this section, the order of precedence is documented in
1.7 Order of Precedence.

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1.1 Scope This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic
assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the
manufacture of products. It is not the intent of this standard to exclude any procedure, such as for component placement or for
applying flux and solder used to make the electrical connection.
Use of this Addendum implies that the product belongs to Class 3.
The soldering operations, equipment, and conditions described in this document are based on electrical/electronic circuits designed
and fabricated in accordance with the specifications listed in Table 1-1HA.
Table 1-1HA Design, Fabrication and Acceptability Specifications
Board Type Design Specification Fabrication/Acceptability Specification
Generic Requirements IPC-2221 IPC-6011
Rigid Printed Boards IPC-2222 IPC-6012, IPC-6012 Automotive Addendum,
IPC-A-600

Flexible Circuits IPC-2223 IPC-6013

Rigid Flex Board IPC-2223 IPC-6013

1.3.1 Inspection Personnel and Product Requirements The inspector shall not select the Product Class for the product under
inspection. The selection of the product class shall be given by the engineering documentation. Documentation shall be available
to the inspector, i.e., inspection instructions, process build requirements, customer specification, for the product under inspection.

1.6 Process Control Requirements The primary goal of process control is to continually reduce variation in the processes, products,
or services to provide products or processes meeting or exceeding User requirements. Statistical Process Control documentations
such as IPC-9191, JESD557 or other User-approved system may be used as guidelines for implementing statistical process control.
Manufacturers of Class 3 products shall develop and implement a documented process control system.
A documented process control system, if established, shall define process control and corrective action limits. This may or may not
be a statistical process control system. The use of ‘‘statistical process control’’ (SPC) is optional and should be based on factors
such as design stability, lot size, production quantities, and the needs of the Manufacturer, see 1.6.2 Statistical Process Control.
Process control methodologies shall be used in the planning, implementation and evaluation of the manufacturing processes used
to produce soldered electrical and electronic assemblies. The philosophy, implementation strategies, tools and techniques may
be applied in different sequences depending on the specific company, operation, or variable under consideration to relate process
control and capability to end product requirements. The manufacturer shall maintain objective evidence of a current process
control/continuous improvement plan that is available for review.
When a decision or requirement is to use a documented process control system, failure to implement process corrective
action and/or the use of continually ineffective corrective actions shall be grounds for disapproval of the process and
associated documentation.

1.7 Order of Precedence The contract shall take precedence over this Addendum, referenced standards and
User-approved drawings.

1.7.2 Conflict In the event of a conflict between this Addendum and the applicable documents cited herein, this Addendum takes
precedence. Where referenced criteria of this Addendum differ from J-STD-001H, this Addendum takes precedence. In the event
of conflict between the requirements of this Addendum and the applicable assembly drawing(s)/documentation, the applicable
User approved assembly drawing(s)/documentation take precedence.
In the event of conflict between the requirements of the J-STD-001H and the applicable assembly drawing(s) and documentation,
the applicable User approved assembly drawing(s) and documentation govern. Some examples of documentation include the
contract, purchase order, technical data package, engineering specification or performance specification. In the event of conflict
between the requirements of the J-STD-001H and assembly drawing(s) and documentation that have not been User approved, the
J-STD-001H governs.
In the case of a conflict between this Addendum and IPC-A-610HA, this Addendum takes precedence. See below for a summary
of the order of precedence for using this Addendum.
User approved drawings J-STD-001HA J-STD-001H IPC-A-610HA IPC-A-610H

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Table of Contents
The following topics are addressed in this Addendum.
0.1 Scope
0.2 Use
The following reference numbers are to IPC-A-610H Clauses that are modified or added in this Addendum.

1.2 Purpose
1.3 Classification
1.4.1 Verification of Dimensions
1.5 Definition of Requirements
1.5.1.2 Defect Condition
1.5.1.4 Combined Conditions
1.5.1.5 Conditions Not Specified
1.6 Process Control Methodologies
1.7 Order of Precedence
1.7.1 Clause References
1.7.3 (NEW) Appendix A
1.8.5.1 (NEW) Minimum Electrical Clearance
1.8.5.2 (NEW) Gap Clearance
1.8.25 User
1.8.26 (NEW) Design Authority
1.8.27 (NEW) Objective Evidence
1.9 Requirements Flowdown
1.10 Personnel Proficiency
1.11 Acceptance Requirements
1.11.1 Missing Parts and Components
1.11.2 Conditions Not Specified
1.12 Inspection Methodology
1.12.1 Lighting
1.12.2 Magnification Aids
1.13.2 (NEW) Field Assembly Operations
2 Applicable Documents
2.1 IPC
2.2 Joint Industry Documents
2.3 Electrostatic Association Documents
2.4 International Electrotechnical Commission
2.5 ASTM
2.6 Military Standards
2.7 SAE International
2.8 (NEW) JEDEC
2.9 (NEW) Automotive Electronics Council (AEC)
2.10 (NEW) Automotive Industry Action Group (AIAG)
ISO International Organization for Standardization
2.11 (NEW)
IATF International Automotive Task Force
2.12 (NEW) ANSI Standards
3 Handling Electronic Assemblies
3.1 (NEW) Gloves and Finger Cots
4 Hardware

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Table of Contents (cont.)

4.1.5.4 (NEW) Threaded Fasteners and Other Threaded Hardware – Self-Tapping Fasteners
4.3.2 Connector Pins – Press Fit Pins
4.3.3 Connector Pins – Standalone Pins
5 Soldering
5.1 Soldering Acceptability Requirements
5.2 Soldering Anomalies
5.2.1 Exposed Base Metal
5.2.2 Pin Holes/Blow Holes
5.2.3 Reflow of Solder Paste
5.2.4 Nonwetting
5.2.6 Dewetting
5.2.7 Soldering Anomalies – Excess Solder
5.2.7.1 Soldering Anomalies – Excess Solder – Solder Balls and Solder Particles
5.2.7.2 Bridging
5.2.7.3 Solder Webbing/Splashes
5.2.10 Fractured Solder
5.2.11 Solder Projections
5.2.12 Pb-Free Fillet Lift
5.2.13 Pb-Free Hot Tear/Shrink Hole
5.2.14 Probe Marks and Other Similar Surface Conditions in Solder Joints
5.2.15 Partially Visible or Hidden Solder Connections
5.2.18 (NEW) Tilted or Raised Component
6 Terminal Connections
6.0.1 Wire and Terminal Connections
7 Through-Hole Technology
7.3 Supported Holes
7.3.5 Solder
7.3.5.1 Vertical Fill (A)
8 Surface Mount Assemblies
8.1 Staking Adhesive
8.1.2 Mechanical Strength
8.2 Surface Mount Assemblies – SMT Leads
8.2.1 Plastic Components
8.3 SMT Connections
8.3.2 Rectangular or Square End Chip Components – 1, 2, 3 or 5 Side Termination(s)
8.3.2.6 Minimum Fillet Height (F) End Cap Configuration
8.3.2.10 3 Side Termination(s) – Lateral Configuration – Termination Variations – Center/Lateral Termination(s)
8.3.2.10.1 Maximum Side Overhang of Termination (As) – Lateral Side Configuration(s)
8.3.2.10.2 End Overhang of Termination (Bs) – Lateral Side Configuration(s)
8.3.2.10.3 (NEW) End Joint Width of Termination (Cs) – Lateral Side Configuration(s)
8.3.2.10.4 (NEW) Minimum Fillet Height of Termination (Fs) – Lateral Side Configuration(s)
8.3.2.10.5 (NEW) Solder Thickness of Termination (Gs) – Lateral Configuration
8.3.3 Cylindrical End Cap Terminations
8.3.4 Castellated Terminations
8.3.4.6 Minimum Fillet Height (F)
8.3.5 Flat Gull Wing Leads

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Table of Contents (cont.)

8.3.5.2 Toe Overhang (B)

8.3.5.6 Minimum Heel Fillet Height (F)
8.3.5.9 (NEW) Lifted Component Body
8.3.5.9.1 (NEW) Solder Wicking
8.3.9 Flat Lug Leads
8.3.9.4 (NEW) Maximum Fillet Height (E)
8.3.11 Inward Formed L-Shaped Ribbon Leads
8.3.11.1 (NEW) Maximum Fillet Height (E)
8.3.11.2 (NEW) Minimum Fillet Height (F)
8.3.12 Surface Mount Area Array
8.3.12.2 Solder Ball Spacing
8.3.12.4 Voids
8.3.13 Bottom Termination Components (BTC)
8.3.13.1 Minimum Toe (End) Fillet Height (F)
8.3.14 Components with Bottom Thermal Plane Terminations
8.3.14.1 (NEW) Terminations of TO Components
8.3.14.1.1 (NEW) Thermal Plane Minimum End Joint Width (Ct)
8.3.14.1.2 (NEW) Thermal Plane Side Joint Length (Dt)
8.3.14.1.3 (NEW) Thermal Plane Solder Fillet Thickness (Gt)
8.3.14.2 (NEW) Terminations of QFPs and SOPs
8.3.14.2.1 (NEW) Side Overhang (At)
8.3.14.2.2 (NEW) End Toe Overhang (Bt)
8.3.14.2.3 (NEW) End Joint Width (Ct)
8.3.14.2.4 (NEW) Solder Thickness Coverage (Gt)
8.3.14.3 (NEW) Terminations of BTCs
8.3.17 Vertical Cans with Outward L-Shaped Lead Terminations
8.3.18 Flexible and Rigid Flex Printed Circuitry with Flat Unformed Leads
8.3.20 (NEW) Odd-Shaped Components with Hidden Terminations
8.3.20.1 (NEW) Maximum Side Overhang (A)
8.3.20.2 (NEW) Maximum Toe Overhang (B)
8.3.20.3 (NEW) Minimum End Joint Width (C)
8.3.20.4 (NEW) Minimum Side Joint Length (D)
8.3.20.5 (NEW) Maximum Fillet Height (E)
8.3.21 (NEW) Half-Moon Shape Ferrite Termination-Coil Terminal
8.3.21.1 (NEW) Maximum Side Overhang (A)
8.3.21.2 (NEW) End Overhang (B)
8.3.21.3 (NEW) Minimum Side Joint Length (J)
8.3.21.4 (NEW) Minimum End Joint Width (C)
8.3.21.5 (NEW) Minimum Fillet Height (F)
8.3.22 (NEW) Coil Terminals (Coated Wire)
8.3.22.1 (NEW) Maximum Side Overhang (A)
8.3.22.2 (NEW) Maximum Toe Overhang (B)
8.3.22.3 (NEW) Minimum End Joint Width (C)
8.3.22.4 (NEW) Minimum Side Joint Length (D)
8.3.22.5 (NEW) Maximum Heel Fillet Height (E)
8.3.22.6 (NEW) Minimum Heel Fillet Height (F)
8.3.22.7 (NEW) Minimum Side Joint Height (Q)

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Table of Contents (cont.)

8.3.23 (NEW) ‘‘L’’ Type (Fuses/Shunt Resistors) Terminals

8.3.23.1 (NEW) Maximum Side Overhang (A)
8.3.23.2 (NEW) Maximum Toe Overhang (B)
8.3.23.3 (NEW) Minimum End Joint Width (C)
8.3.23.4 (NEW) Minimum Side Joint Length (D)
8.3.23.5 (NEW) Maximum Fillet Height (E)
8.3.23.6 (NEW) Minimum Fillet Height (F)
8.3.23.7 (NEW) Solder Fillet Thickness (G)
8.3.24 (NEW) ‘‘C’’ Type Terminal with Thermal Plane Termination
8.3.24.1 (NEW) Maximum Side Overhang (A)
8.3.24.2 (NEW) Maximum Toe Overhang (B)
8.3.24.3 (NEW) Minimum End Joint Width (C)
8.3.24.4 (NEW) Minimum Side Joint Length (D)
8.3.24.5 (NEW) Maximum Heel Fillet Height (E)
8.3.24.6 (NEW) Minimum Heel Fillet Height (F)
8.3.24.7 (NEW) Solder Thickness (G)
10.8 Conformal Coating
10.8.2.1 Coverage
10.8.2.1.1 (NEW) Silicone Base Coatings
10.8.3 Thickness
10.9 Electrical Insulation Coating
10.9.1 Coverage
10.9.2 Thickness
10.10 Encapsulation (Potting)
Appendix AH Voiding Categories

0.1 Scope This Addendum provides a collection of visual acceptability criteria for electronic assemblies to be used in addition
to, and in some cases, in place of, those published in IPC-A-610H intended to ensure the reliability of mission-critical soldered
automotive electrical and electronic assemblies in the field under harsh environments, considering the conditions of automated
high-volume production. This Addendum does not provide criteria for cross-section evaluation or evaluation of images generated
by automated optical and/or x-ray inspection systems.
0.2 Use This Addendum is not to be used as a standalone document.
Where criteria are not supplemented, the Class 3 requirements of IPC-A-610H shall apply. Where IPC-A-610H criteria are
supplemented or new criteria are added by this Addendum, the clause is listed in IPC-A-610 Automotive Addendum Acceptability
section and the entire IPC-A-610H clause is replaced by this Addendum except as specifically noted.
The clauses modified by this Addendum do not include subordinate clauses unless specifically states, e.g., 1.4 does not
include 1.4.1. Clauses, Tables, Figures, etc., in IPC-A-610H that are not listed in this Addendum are to be used as published
IPC-A-610HA must be used with IPC-A-610H.
This Addendum shall be used only in conjunction with the corresponding automotive addendum pertaining to J-STD-001H,
J-STD-001HA.
In the context of this Addendum, IPC-A-610 shall be used as a companion document to J-STD-001. The revisions of J-STD-001
and IPC-A-610 shall correspond, e.g. J-STD-001H and IPC-A-610H. The likelihood of criteria not aligning increases when different
revisions are used together.
For the order of precedence, see clause 1.7 Order of Precedence.

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1 General
1.2 Purpose The visual acceptability criteria in this document reflect the requirements of existing IPC and other applicable
specifications. In order for the user to apply and use the content of this document, the assembly/product shall comply with
other existing IPC requirements, such as IPC-7351, IPC-2220-FAM, IPC-6010-FAM and IPC-A-600 or customer unique/
specified automotive standards, testing, reliability data, etc. If the assembly does not comply with these or with equivalent
requirements, it shall be the shared responsibility of the User and the Design Authority to define, agree to, and document specific
acceptance criteria.
In the case of a discrepancy, the description or written criteria, i.e., Tables, Notes addressing criteria, always takes precedence
over the illustrations, e.g., photos, graphics.
Standards and Addendums may be updated at any time, including with the use of amendments. The use of an amendment or
newer revision is not automatically required, unless it is agreed between customer and supplier.
Table 1-1HA is a summary of related documents.

Table 1-1HA Summary of Related Documents

Document Purpose Spec.# Definition
Design Standard IPC-2220-FAM Design requirements reflecting three levels of complexity (Levels A, B, and C)
IPC-7351 indicating finer geometries, greater densities, more process steps to produce the
IPC-CM-770 product.
Component and Assembly Process Guidelines to assist in the design of the bare
board and the assembly where the bare board processes concentrate on land
patterns for surface mount and the assembly concentrates on surface mount and
through-hole principles which are usually incorporated into the design process and
the documentation.
Printed Board IPC-6010-FAM Requirements and acceptance documentation for rigid, rigid flex, flex and other
Requirements IPC-A-600 types of substrates.
End Item Documentation IPC-D-325 Documentation depicting bare board specific end product requirements designed
by the customer or end item assembly requirements. Details may or may not
reference industry specifications or workmanship standards as well as customer’s
own preferences or internal standard requirements.

End Item Standards J-STD-001 Requirements for soldered electrical and electronic assemblies depicting minimum
end product acceptable characteristics as well as methods for evaluation
(test methods), frequency of testing and applicable ability of process control
requirements.
Acceptability Standard IPC-A-610 Pictorial interpretive document indicating various characteristics of the board and/or
assembly as appropriate relating to desirable conditions that exceed the minimum
acceptable characteristics indicated by the end item performance standard and
reflect various out-of-control (process indicator or defect) conditions to assist the
shop process evaluators in judging need for corrective action.
Training Programs Documented training requirements for teaching and learning process procedures
(Optional) and techniques for implementing acceptance requirements of either end item
standards, acceptability standards, or requirements detailed on the customer
documentation.
Rework and Repair IPC-7711/7721 Documentation providing the procedures to accomplish conformal coating and
component removal and replacement, solder resist repair, and modification/repair of
laminate material, conductors, and plated through-holes.

Automotive Industry Action AIAG-CQI-17 Special Process: Electronic Assembly Manufacturing – Soldering System
Group Standards Assessment
Automotive Electronics AEC-Q100 AEC-Q101 Automotive Electronics Council – Failure Mechanism Based Stress Test Qualification
Council Standards AEC-Q102 AEC-Q104
AEC-Q200

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IPC J-STD-001HA/IPC-A-610HA October 2021

1 General (cont.)
1.3 Classification Accept and/or reject decisions shall be based on applicable documentation such as contracts, drawings,
specifications, standards, addendums and reference documents. Criteria defined in this document reflects Class 3 visual criteria.
Class 3 will not appear after the condition [Acceptable, etc.].
1.4.1 Verification of Dimensions Actual measurement of specific component placement, quantity and dimensions of the solder
connection, and determination of percentages, shall not be used, except for referee purposes.
1.5 Definition of Requirements This document provides acceptance criteria for completed electronic assemblies. Where a
requirement is presented that cannot be defined by the acceptable, process indicator, and defect conditions, the word ‘‘shall’’ is
used to identify the requirement. Unless otherwise specified herein, the word ‘‘shall’’ in this document invokes a requirement for
manufacturers of automotive product, and failure to comply with the requirement is a noncompliance to this Addendum.

1.5.1.2 Defect Condition A defect is a condition that may be insufficient to ensure the form, fit or function of the assembly in its
end use environment. Defect conditions shall be dispositioned by the manufacturer based on design, service, and customer
requirements. In this Addendum, if the defect condition is not defined, the default condition is Defect if it affects form, fit
or function.
It is the shared responsibility of the User and the Design Authority to define complimentary, unique defect categories applicable
to the product.

1.5.1.4 Combined Conditions Cumulative conditions shall be considered in addition to the individual characteristics for product
acceptability even though they are not individually considered defective. The significant number of combinations that could occur
does not allow full definition in the content and scope of this specification but manufacturers should be vigilant for the possibility
of combined and cumulative conditions and their impact upon product performance.
Conditions of acceptability provided in this specification are individually defined and created with separate consideration for
their impact upon reliable operation for the defined production classification. Where related conditions can be combined, the
cumulative performance impact for the product may be significant, e.g., minimum solder fillet quantity when combined with
maximum side overhang and minimum end overlap may cause a significant degradation of the mechanical attachment integrity.
The Manufacturer is responsible for identification of such conditions.
It is the shared responsibility of the User and the Design Authority to identify complimentary combined conditions where there is
significant concern based upon end use environment and product performance requirements.

1.5.1.5 Conditions Not Specified See 1.11.2 Conditions Not Specified.

1.6 Process Control Methodologies Process control methodologies shall be used in the planning, implementation and
evaluation of the manufacturing processes used to produce soldered electrical and electronic assemblies. The philosophy,
implementation strategies, tools and techniques may be applied in different sequences depending on the specific company,
operation, or variable under consideration to relate process control and capability to end product requirements. The Manufacturer
shall maintain objective evidence of a current process control/continuous improvement plan that is available for review.
Also refer to 1.8.27 Objective Evidence and 1.11 Acceptance Requirements of this IPC-A-610HA Addendum for further J-STD-001
requirements.

1.7 Order of Precedence The contract shall take precedence over this Addendum, referenced standards and User-approved
drawings. Where referenced criteria of this Addendum differ from IPC-A-610H, this Addendum takes precedence. In the event
of a conflict between this Addendum and the applicable documents cited herein, this Addendum takes precedence, except for
J-STD-001HA and J-STD-001H. For the latter, J-STD-001HA takes precedence.
In the event of conflict between the requirements of this Addendum and the applicable assembly drawing(s)/documentation, the
applicable User approved assembly drawing(s)/documentation take precedence.
In the event of conflict between the requirements of the IPC-A-610H Standard and the applicable assembly drawing(s) and
documentation, the applicable User approved assembly drawing(s) and documentation govern. Some examples of documentation
include the contract, purchase order, technical data package, engineering specification or performance specification.
In the event of conflict between the requirements of the IPC-A-610H and assembly drawing(s) and documentation that has not
been User approved, IPC-A-610H governs.
In the case of a conflict between this Addendum and J-STD-001H, J-STD-001HA takes precedence.

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