IPC 7711B-7721B Part 1

Association Connecting Electronics Industries
Cpc@
IPC-7711 B/7721 B with Change 1
Rework, Modification and Repair

of Electronic Assemblies
Developed by the Repairability Subcommittee (7-34) of the Product Assurance

Committee (7-30) of IPC
Supersedes: Users of this publication are encouraged to participate in the development of

IPC-7711A/7721A - future revisions.
October 2003
IPC-R-7000 - Contact:
January 1988
IPC
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Fax 847 615.7105
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problems for future improvement
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November 2007 IPC-7711 B/7721 B
Acknowledgment
Any document involving a complex technology draws material from a vast number of sources. While the principal members
of the IPC Repairability Subcommittee (7-34) of the Product Assurance Committee (7-30) are shown below, it is not pos-
sible to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend
their gratitude.
Product Assurance Repairability Technical Liaisons of the

Committee Subcommittee IPC Board of Directors
Chair Co-Chairs
Mel Parrish Daniel L. Foster Peter Bigelow
STI Electronics STI Electronics IMI Inc.
Peggi Blakley Sammy Yi

NSWC Crane Flextronics International
A Special Note of Appreciation

The following core group has Chism, Nancy, Flextronics Moffitt, James, Moffitt Consulting
volunteered much of their time and Ferry, Jeff, Circuit Technology Center Services
have made significant contributions Inc. Morris, Barry, Advanced Rework
to this document. Foster, Daniel, STI Electronics Technology-A.R.T
Blakley, Peggi, NSWC Crane Gonzalez, Constantino, ACME Training Rogers, Doug, Harris Corporation,
Bogert, Gerald Leslie, Bechtel Plant & Consulting GCSD
Machinery, Inc. Hurst, Greg, BAE Systems Talbot, Blen, L-3 Communications
Butman, William, AssemTech Skills Lambert, Leo, EPTAC Corporation Ventress, Sharon, U.S. Army Aviation
Training Corp. McNutt, Randy, Northrop Grumman & Missile Command
Repairability Subcommittee
Adams, David, Rockwell Collins Foster, Daniel, STI Electronics Kumar, Vijay, Lockheed Martin Missile
Alvarez, Ximena, Flextronics Freeman, Vicky (Fortunata), Flextronics & Fire Control
Amundsen, Becky, Northrop Grumman Technology Inc. Lambert, Leo, EPTAC Corporation
Corporation Fribbins, Stephen, Fribbins Training Langley, Brian, OK International
Aoki, Masamitsu, Nokia Japan Services Liu, Zhe, ZTE Corporation
Ashaolu, Peter, Cisco Systems Inc. Fritz, Dennis, MacDermid, Inc. Maciolek, Lisa, Raytheon Company
Auyeung, Gail, Celestica International Ganster, Andrew, NSWC Crane Mari Paakkonen , Nokia Networks Oyj
Inc. Gillespie, Alan, Boeing Aircraft & Mastorides, John, Honeywell Aerospace
Blakley, Peggi, NSWC Crane Missiles Electronic Systems
Boerdner, Richard, EJE Research Gonzalez, Constantino, ACME Training May, William, NSWC Crane
Bogert, Gerald Leslie, Bechtel Plant & Consulting McCain, Jack, Siemens VDO
Machinery, Inc. Green, Michael, Lockheed Martin McCormick, Becky, Benchmark
Butler, Mac, Northrop Grumman - Space Systems Company Electronics Inc.
ESSS Herrberg, Steven, Raytheon Systems McNutt, Randy, Northrop Grumman
Butman, William, AssemTech Skills Company Mier, Norman, BEST Inc.
Training Corp. Honyotski, Frank, STI Electronics Moffitt, James, Moffitt Consulting
Chism, Nancy, Flextronics Hurst, Greg, BAE Systems Services
Cirimele, Ray, BEST Inc. Icore, Bernard, Northrop Grumman - Moore, Ken, Omni Training Corp.
Clitheroe, Terry, Solder Technologies ESSS Morris, Barry, Advanced Rework
Day, Jennifer, Sanmina-SCI James, Bryan, Rockwell Collins Technology-A.R.T
Ferry, Jeff, Circuit Technology Center Kong, Jukky, PCS Technology Morris, Susan, Advanced Rework
Inc. (Suzhou) Co. Ltd Technology-A.R.T
iii
IPC-7711 B/7721 B November 2007
Moss, Norma, L-3 Communications Rogers, Doug, Harris Corporation, Vigneau, Peter, Circuit Technology
Muller, Mary, Crane Aerospace & GCSD Center Inc.
Electronics Rowe, Teresa, AAI Corporation Wade, Debbie, Advanced Rework
Norris, Wallace, NSWC Crane Scionti, Martin, Raytheon Missile Technology-A.R.T
Northam, Riley, ACI/EMPF Systems Wang, Ge, Northrop Grumman Space
Nuppola, Seppo, Nokia Networks Oyj Shibata, Akikazu, JPCA-Japan Technology
Oliver, Bruce, Raytheon Company Electronics Packaging and Wettermann, Robert, BEST Inc.
Owens, Gregg, Cherry Aerospace Spath, Sue, Flextronics Technology Inc. Winslow, Russell, Winslow Automation
Parrish, Mel, STI Electronics Steele, David, Da-Tech Corp. aka Six Sigma
Perrington, Ron, Plexus Corp. Talbot, Blen, L-3 Communications Woody, Linda, Lockheed Martin
Pitsch, Timothy, Plexus Corp. Tucker, Linda, Blackfox Training Missile & Fire Control
Price, Andrew, Circuit Technology Institute Wu, Fonda, Raytheon Company
Center Inc. Valianu, Zenaida, Celestica Youngblood, Don, Honeywell Inc.
Ringqvist, Sheila, Scanditron Sverige International Inc. Zamborsky, Edward, OK International
AB Ventress, Sharon, U.S. Army Aviation Inc.
& Missile Command
iv
Table of Contents
PART 1 General Information and Common Procedures
1 General ......................................................................... 1 1.8.7 Preheating (Auxiliary) Heating ....................... 5

1.8.8 Hand Held Drilling and Grinding Tool ........... 5
1.1 Scope ................................................................... . . 1
1.8.9 Precision Drill/Mill System .............................. 5
1.2 Purpose .................................................................... 1 1.8.10 Eyelets and Eyelet Press System ..................... 5
1.2.1 Definition of Requirements ................................. 1 1.8.11 Gold Plating System ........................................ 5
1.3 Background ......................... 1 1.8.12 Tools and Supplies ............................................ 5

1.8.13 M aterials ............................................................ 6
1.4 Terms and Definitions ............................................ 1 1.8.13.1 Solder..........................6
1.4.1 Class of Product ................................................... 1 1.8.13.2 Flux6
2 Flux ..................................................................
1.8.13 6
1.4.2 Board Types ......................................................... 2 1.8.13.3 Replacement Conductors and Lands ....... 6
1.4.3 Skill Level ............................................................ 2 1.8.13.4 Epoxy and Coloring Agents . . . . 6
1.5 Applicability,Controls and Acceptability ............. 2 1.8.13.5 Adhesives ..................................................... 6
1.5.1 Level of Conform ance ......................................... 2 1.8.13.6 General .......................................................... 6
1.5.1.1 Levels of Conformance .................................. 2 1.8.14 Process Goals and Guidelines .......................... 6
1.5.2 Compliance .......................................................... 3 1.8.14.1 Nondestructive Component Removal ............. 6
1.6 Training ............................... 3 1.8.14.1.1 Surface Mount Components ................... 6

1.8.14.1.2 Through-Hole Components .................... 7
1.7 Basic Considerations ............................................. 4
1.8.14.1.3 Component Removal Using Solder
1.8 Workstations, Tools, Materials and Fountain Method ..................................... 7
Processes .............................................................. 4 1.8.14.2 Component Installation ................................ 7
1.8.1 ESD/EOS Controls .............................................. 4 1.8.14.2.1 Land Preparation ..................................... 7
1.8.2 Vision Systems ..................................................... 4 1.8.14.2.2 Surface Mount Components ................... 7
1.8.3 Lighting ................................................................ 4 1.8.14.2.3 Through-Hole Components ........... 7
1.8.4 Fume Extraction ................................................... 4 1.8.15 Cleaning Station/System ................................... 7
1.8.5 Tools ..................................................................... 4 1.8.16 Component Removal and Installation .............. 7
1.8.6 Primary Heating Methods ................................... 4 1.8.17 Conformal Coating Area .................. 7
1.8.6.1 Conductive (by contact) Heating 1.8.18 Selecting a Process .......................................... 7
Methods ........................................................... 4 1.8.19 Time Temperature Profile (TTP) ............ 8
1.8.6.2 Convective (hot gas) and IR (radiant)
Heating M ethods ............................................. 5 1.9 Lead Free .............................................................. 8
v
Handling/Cleaning
Skill Level of
Procedure Description Board Type Level Conformance
2.1 Handling Electronic Assemblies C N/A N/A N/A
2.2 Cleaning N/A N/A N/A
Coating Removal
Skill Level of
Procedure Description Illustration Board Type Level Conformance
2.3.1 Coating Removal, Identification of R, F, W, C Advanced High
Conformal Coating
2.3.2 Coating Removal, Solvent Method R, F, W, C Advanced High
2.3.3 Coating Removal, Peeling Method R, F, W, C Advanced High
2.3.4 Coating Removal, Thermal Method K R, F, W, C Advanced High
2.3.5 Coating Removal, Grinding/Scraping R, F, W, C Advanced High

Method
2.3.6 Coating Removal, Micro Blasting R, F, W, C Advanced High

Method
Vi
Coating Replacement
Skill Level of
2.4.1 Coating Replacement, Solder Resist R, F, W, C Intermediate High
2.4.2 Coating Replacement, Conformal R, F, W, C Intermediate High

Coatings/Encapsulants
Conditioning
Skill Level of
2.5 Baking and Preheating R, F, W, C Intermediate High
Epoxy Mixing and Handling

Skill Level of
2.6 Epoxy Mixing and Handling R, F, W, C Intermediate High
Legends/Markings
Skill Level of
2.7.1 Legend/Marking, Stamping Method R, F, W, C Intermediate High
2.7.2 Legend/Marking, Hand Lettering R, F, W, C Intermediate High

Method
2.7.3 Legend/Marking, Stencil Method R, F, W, C Intermediate High
Tip Care and Maintenance

Skill Level of
2.8 Tip Care and Maintenance N/A N/A N/A
vii
Table of Contents
PART 2 Rework
3 Removal
3.1 Through-Hole Desoldering
Skill Level of
Procedure Description RonLead Board Type Level Conformance
3.1.1 Continuous Vacuum Method R,F,W Intermediate High
3.1.2 Continuous Vacuum Method - Partial Clinch R,FW Intermediate High
3.1.3 Continuous Vacuum Method - Full Clinch R,FW Intermediate High
3.1.4 Full Clinch Straightening Method R,F,W Intermediate High
3.1.5 Full Clinch Wicking Method R,FW Advanced High
3.2 PGA and Connector Removal
Skill Level of
3.2.1 Solder Fountain Method R,FW,C Expert Medium
3.3 Chip Component Removal
Skill Level of
3.3.1 Bifurcated tip R,FW,C Intermediate High
3.3.2 Tweezer Method R,F,W,C Intermediate High
3.3.3 Bottom Termination - Hot Air Method R,F,W,C Intermediate High
3.4 Leadless Component Removal
Skill Level of
3.4.1 Solder Wrap Method R,FW,C Advanced High
3.4.2 Flux Application Method R,FW,C Advanced High
3.4.3 Hot Gas (Air) Reflow Method R,FW,C Advanced High
viii
November 2011 IPC-7711 /7721B
3.5 SOT Removal
_4 Skill Level of
3.5.1 Flux Application Method R,FW,C Intermediate High
3.5.2 Flux Application Method - Tweezer R,F,W,C Intermediate High
3.5.3 Hot Air Pencil R,F,W,C Intermediate High
3.6 Gull Wing Removal (two sided)
*k i Skill Level of
3.6.1 Bridge Fill Method R,F,WC Intermediate High
3.6.2 Solder Wrap Method R,FW,C Intermediate High
3.6.3 Flux Application Method R,FW,C Intermediate High
3.6.4 Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.6.5 Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.6.6 Flux Application Method - Tweezer R,F,W,C Advanced High
3.7 Gull Wing Removal (four sided)
Skill Level of
3.7.1 Bridge Fill Method - Vacuum Cup R,F,W,C Advanced High
3.7.1.1 Bridge Fill Method - Surface Tension R,F,W,C Intermediate High
3.7.2 Solder Wrap Method - Vacuum Cup R,F,W,C Advanced High
3.7.2.1 Solder Wrap Method - Surface Tension R,FW,C Intermediate High
3.7.3 Flux Application Method - Vacuum Cup R,F,W,C Advanced High
3.7.3.1 Flux Application Method - Surface Tension R,FW,C Intermediate High
3.7.4 Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.7.6 Flux Application Method - Tweezer R,F,W,C Advanced High
3.7.7 Hot Gas Reflow Method R,F,W,C Advanced High
ix
3.8 J-Lead Removal
Skill Level of
3.8.1 Bridge Fill Method - Tweezer R,FW,C Advanced High
3.8.1.1 Bridge Fill Method - Surface Tension R,FW,C Advanced High
3.8.2.1 Solder Wrap Method - Surface Tension R,FW,C Advanced High
3.8.3 Flux Application Method - Tweezer R,FW,C Advanced High
3.8.4 Flux & Tin Tip Only R,FW,C Advanced High
3.8.5 Hot Gas Reflow System R,FW,C Advanced High
3.9 BGA/CSP Removal
Skill Level of
3.9.1 Hot Gas Reflow System R,F,W,C Advanced High
3.9.2 Vacuum Method R,FW,C Advanced Medium
3.10 PLCC Socket Removal
Skill Level of
3.10.1 Bridge Fill Method R,FW,C Advanced High
3.10.2 Solder Wrap Method R,F,WC Advanced High
3.10.3 Flux Application Method R,FW,C Advanced High
3.10.4 Hot Air Pencil Method RF,W,C Advanced Medium
3.11 Bottom Terminated Component Removal
Skill Level of
3.11.1 Hot Air Method R,FC Expert Medium
4 Pad/Land Preparation
Skill Level of
4.1.1 Surface Mount Land Preparation - Individual Method R,FW,C Intermediate High
4.1.2 Surface Mount Land Preparation - Continuous Method R,FW,C Intermediate High
4.1.3 Surface Solder Removal - Braid Method R,FW,C Intermediate High
4.2.1 Pad Releveling - Using Blade Tip R,FW,C Intermediate High
4.3.1 SMT Land Tinning - Using Blade Tip R,F,W,C Intermediate Medium
4.4.1 Cleaning SMT Lands - Using Blade Tip and Solder Braid R,FW,C Intermediate High
x
November 2011 IP-7711 B/7721 B
5 Installation
5.1 Through-Hole Installation
Procedure Description
Install following the requirements of J-STD-001 and
J-HDBK-001
5.2 PGA and Connector Installation
Skill Level of
5.2.1 Solder Fountain Method with PTH Prefilled R,F,W,C Expert Medium
5.3 Chip Installation
Skill Level of
5.3.1 Solder Paste Method/Hot Air Pencil R,F,W,C Intermediate High
5.3.2 Point-to-Point Method R,F,W,C Intermediate High
5.4 Leadless Component Installation
Skill Level of
5.4.1 Hot Gas (Air) Reflow Method R,F,W,C Advanced High
5.5 Gull Wing Installation
Skill Level of
5.5.1 Multi-Lead Method - Top of Lead R,F,W,C Advanced High
5.5.2 Multi-Lead Method - Toe Tip R,FW,C Advanced High
5.5.4 Solder Paste Method/Hot Air Pencil R,F,W,C Advanced High
5.5.5 Hook Tip w/Wire Layover R,F,W,C Intermediate High
5.5.6 Blade Tip with Wire R,F,W,C Advanced Medium
xi
5.6 J-Lead Installation
Skill Level of
5.6.1 Solder Wire Method R,FW,C Advanced High
5.6.3 Solder Paste Method/Hot Air Pencil R,FW,C Advanced High
5.6.4 Multi-Lead Method RF,W,C Intermediate High
5.7 BGA/CSP Installation
Level of
Procedure Description Board Type Skill Level Conformance
5.7.1 Using Solder Wire to Prefill Lands R,FW,C Advanced High
5.7.2 Using Solder Paste to Prefill Lands R,F,WC Advanced High
5.7.3 BGA Reballing Procedure - Fixture Method R,C Advanced High
5.7.4 BGA Reballing Procedure - Paper Carrier Method R,C Advanced High
5.7.5 BGA Reballing Procedure - Polyimide Stencil Method R,C Advanced High
5.7.6 BGA Reballing Procedure, Polyimide Solder Ball Stencil R,C Advanced High
Carrier
5.8 Bottom Terminated Device Installation
Skill Level of
5.8.1.1 Pre-Bump and Place R,FC Expert Medium
5.8.1.2 Pre-Bump and Place with Stay in Place Stencil R,FC Expert Medium
5.8.1.3 Pre-Hand Soldering Plus Centered Ground Bump R,F,C Expert Medium
6 Removing Shorts
Level of
6.1.1 J-Leads - Draw Off Method R,FW,C Intermediate High
6.1.2 J-Leads - Respread Method R,FW,C Intermediate High
6.1.2.1 J-Leads - Braid Method R,FW,C Intermediate High
6.1.3 Gull-Wing - Draw Off Method R,FW,C Intermediate High
6.1.4 Gull-Wing - Respread Method R,FW,C Intermediate High
6.1.4.1 Gull-Wing - Braid Method R,FW,C Intermediate High
xii
Table of Contents
PART 3 Modification and Repair
Blisters and Delamination

Skill Level of
3.1 Delamination/Blister Repair, Injection R Advanced High
Method
Bow & Twist

Skill Level of
3.2 Bow and Twist Repair R, W Advanced Medium
Hole Repair
Skill Level of
3.3.1 Hole Repair, Epoxy Method R, W Advanced High
3.3.2 Hole Repair,Transplant Method R. W Expert High
Key and Slot Repair

Skill Level of
3.4.1 Key and Slot Repair, Epoxy Method R, W Advanced High
3.4.2 Key and Slot Repair, Transplant / R, W Expert High

Method
xiii
Base Material Repair
Skill Level of
3.5.1 Base Material Repair, Epoxy Method R, W Advanced High
3.5.2 Base Material Repair, Area Transplant R, W Expert High

Method
3.5.3 Base Material Repair, Edge R, W Expert High

Transplant Method
Lifted Conductors
Skill Level of
4.1.1 Lifted Conductor Repair, Epoxy Seal R, F Intermediate Medium
Method
4.1.2 Lifted Conductor Repair, Film R, F Intermediate High

Adhesive Method
xiv
Conductor Repair
Skill Level of
4.2.1 Conductor Repair, Foil Jumper, Epoxy R, F, C Advanced Medium
Method
4.2.2 Conductor Repair, Foil Jumper, Film R, F, C Advanced High

Adhesive Method
4.2.3 Conductor Repair, Welding Method R, F, C Advanced High
4.2.4 Conductor Repair, Surface Wire R, F, C Intermediate Medium

Method
4.2.5 Conductor Repair, Through Board R Advanced Medium

Wire Method
4.2.6 Conductor Repair/Modification, R, F, C Expert Medium

Conductive Ink Method
4.2.7 Conductor Repair, Inner Layer R, F Expert High

Method
Conductor Cut
Skill Level of
4.3.1 Conductor Cut, Surface Conductors R, F Advanced High
4.3.2 Conductor Cut, Inner Layer R, F Advanced High

Conductors
4.3.3 Deleting Inner Layer Connection at a R, F Advanced High

Plated Hole, Drill Through Method
4.3.4 Deleting Inner Layer Connection at a R, F Advanced High

Plated Hole, Spoke Cut Method
xv
IPC-7711 B/7721 B
November 2011
Lifted Land Repair
Skill Level of
4.4.1 Lifted Land Repair, Epoxy Method R, F Advanced Medium
4.4.2 Lifted Land Repair, Film Adhesive R, F Advanced Medium

Method
Land Repair
Skill Level of
4.5.1 Land Repair, Epoxy Method R, F Advanced Medium
4.5.2 Land Repair, Film Adhesive Method R, F Advanced High
Edge Contact Repair
Skill Level of
4.6.1 Edge Contact Repair, Epoxy Method R, F, W, C Advanced Medium
4.6.2 Edge Contact Repair, Film Adhesive R, F, W, C Advanced High

Method
4.6.3 Edge Contact Repair, Plating Method R, F, W, C Advanced High
xvi
Surface Mount Pad Repair

Skill Level of
4.7.1 Surface Mount Pad Repair, Epoxy R, F, C Advanced Medium
Method
4.7.2 Surface Mount Pad Repair, Film R, F, C Advanced High

Adhesive Method
4.7.3 Surface Mount, BGA Pad Repair, R, F, C Advanced High

Film Adhesive Method
4.7.4 Surface Mount, BGA Land with R,F,C Expert Medium

Integral Via Repair Film Adhesive
Method
4.7.5 Surface Mount, BGA Land with R,F,C Expert High
Integral Via Repair Circuit Extension
Film Adhesive Method
Plated Hole Repair

Skill Level of
5.1 Plated Hole Repair, No Inner Layer - R, F, W Intermediate High
Connection
5.2 Plated Hole Repair, Double Wall R, F, W Advanced Medium

Method
5.3 Plated Hole Repair, Inner Layer R Expert Medium

Connection
5.4 Plated Hole Repair, No Inner Layer R,FW Intermediate Medium

Connection, Clinched Jumper Wire
Method
xvii
Jumpers
Skill Level of
6.1 Jumper Wires R, F, W, C Intermediate N/A
6.2.1 Jumper Wires, BGA Components, Foil R, F Expert Medium

Jumper Method
6.2.2 Jumper Wires, BGA Components, - R, F Expert High

Through Board Method
Component Additions
Skill Level of
6.3 Component Modifications and R, F, W, C Advanced N/A
Additions
Flexible Conductor Repair
Skill Level of
7.1.1 Flexible Conductor Repair F Expert Medium
8 Wires
8.1 Splicing
Level of
8.1.1 Mesh Splice N/A Intermediate Low
8.1.2 Wrap Splice N/A Intermediate Low
8.1.3 Hook Splice N/A Intermediate Low
8.1.4 Lap Splice N/A Intermediate Low
xviii
General Information and Common Procedures
1 General recognize the need for documenting commonly used

rework, repair and modification techniques. These tech-
1.1 Scope This document covers procedures for repair- niques have, in general, been proven to be acceptable for
ing and reworking printed board assemblies. It is an aggre- the class of product indicated through testing and extended
gate of information collected, integrated and assembled by field functionality. Procedures contained herein were sub-
the Repairability Subcommittee (7-34) of the Product mitted for inclusion by commercial and military organiza-
Assurance Committee of the IPC. This revision includes tions too numerous to list individually. The Repairability
expanded coverage for lead free processes, and additional Subcommittee has, where appropriate, revised procedures
inspection guidelines for operations such as repair that may to reflect improvements.
not have other published criteria.
1.4 Terms and Definitions Definitions marked with an *
This document does not limit the maximum number of are from IPC-T-50 and apply to the use of this document.
rework, modification or repair actions to a Printed Circuit PCA - Printed Circuit Assembly
Assembly.
*Rework - the act of reprocessing noncomplying articles,
1.2 Purpose This document prescribes the procedural through the use of original or equivalent processing, in a
requirements, tools, materials and methods to be used in manner that assures full compliance of the article with
the modification, rework, repair, overhaul or restoration of applicable drawings or specifications.
electronic products. Although this document is based in *Modification- the revision of the functional capability of
large part on the Product Class definitions used in IPC a product in order to satisfy new acceptance criteria. Modi-
documents such as J-STD-001 or IPC-A-610, this docu- fications are usually required to incorporate design changes
ment should be considered applicable to any type of elec- which can be controlled by drawings, change orders, etc.
tronic equipment. When invoked by contract as the control- Modifications should only be performed when specifically
ling document for the modification, rework, repair, authorized and described in detail on controlled documen-
overhaul or restoration of products, the requirements flow- tation.
down apply.
*Repair- the act of restoring the functional capability of a
IPC has identified the most common equipment and pro- efective article in a manner that does not assure compli-
cess in order to make a specific repair or rework. It is pos- ance of the article with applicable drawings or specifica-
sible that alternate equipment and processes can be used to tions.
make the same repair. If alternate equipment is used, it is
up to the user to determine that the resultant assembly is *1.4.1 Class of Product The user of the product is
good and undamaged. responsible for identifying the Class of Product. The pro-
cedure selected for action to be taken (modification,
*(1.2.1 Definition of Requirements This document is rework, repair, overhaul etc.) must be consistent with the
intended to be used as a guide and there are no specific Class identified by the user. The three Classes of Product
requirements or criteria unless separately and specifically are:
called out in a user's contractual or other documentation. Class 1 - General Electronic Products
When statements such as "must," "should" or "need to Includes products for applications where the major require-
be" are used, they are stressing an important point. If these ment is the function of the completed assembly.
strong recommendations are not followed the end result Class 2 - Dedicated Service Electronic Products
may not be satisfactory and additional damage could be
caused.Includes products where continued performance and
extended life is required, and for which uninterrupted ser-
1.3 Background Today's electronic assemblies are more vice is desired but not critical. Typically, the end use envi-
complex and smaller than ever before. Despite this, they ronment would not cause failures.
can be successfully modified, reworked or repaired if the Class 3 - High PerformanceElectronic Products
proper techniques are followed. This manual is designed to Includes products where continued performance or
help users repair, rework and modify electronic assemblies performance-on-demand is critical. Equipment downtime
with minimum impact on end use function or reliability. cannot be tolerated, end-use environment may be uncom-
The procedures in this document have been obtained from monly harsh, and the equipment must function where
assemblers, printed board manufacturers and users who required, such as life support and other critical systems.
1
1.4.2 Board Types There are a variety of printed board and guidelines of this document may be used during manu-
types that the procedures in this document apply to. When facturing of products or to products that have failed after
selecting the appropriate modification, rework or repair being placed in use.
procedure the printed board type being worked should be In general, rework or repair controls during manufacturing
considered. Select a procedure that applies to the printed are different from the controls applied to products that fail
board type as listed on the procedure. Printed board types after being placed in service.
include the following:
R. Rigid PrintedBoards and Assemblies - A printed board When a defect or functional problem is discovered during
or assembly using rigid base materials only. These may the assembly process, a decision has to be made whether to
or
be asemlysi, rdoub-sdedrmterilyese
single-sided, double-sided may rework or repair the product, use it as is, or discard it. This
or multilayered, and may deionstycaymdebaMtralRvwBad
be constructed from base laminate material that spans decision 1s typically made by a Material Review Board
all approved commercial grades of laminate and (MRB) as discussed in various assembly standards.
includes glass fabric reinforced epoxy and polyimide When a product fails after it has been placed in service, the
resin laminates. term "repair" is commonly applied to actions that restore
F Flexible Printed Boards and Assemblies - A printed operation. Unlike the manufacturing process, there is no
board or assembly using flexible or a combination of Material Review Board to disposition the failed assembly.
rigid and flexible materials only. May be partially pro- How that decision is made is beyond the scope of this
vided with electrically nonfunctional stiffeners and/or document.
cover lay. These may be single-sided, double-sided or Whether by an MRB or another process, if a decision has
multilayered. been made to perform a corrective action, and that action
W Discrete Wiring Boards and Assemblies - A printed involves removing and replacing a failed component, the
board or assembly using a discrete wiring technique to rework procedures in Part 2 - 7711 will be applicable. If a
obtain electrical interconnections. repair or modification action is needed, the procedures in
C. Ceramic Boards and Assemblies - A printed board or Part 3 - 7721 will provide guidance.
assembly using ceramic as the base material with inter-
connections separated by dielectric. The board layers 1.5.1 Level of Conformance Level of Conformance pro-
are usually formed by alternate printing or depositing vides the means for selecting an appropriate level of con-
of interconnections and dielectric. The assemblies are formance to the original electrical, mechanical, physical,
either surface mount or die attach. Usually multilay- environmental and visual product requirements. Each pro-
ered, these may be single-sided or double-sided. cedure lists a Level of Conformance that the product will
attain when successfully completed. The Level of Con-
1.4.3 Skill Level To assist in determining the skill level formance rating for each procedure is based on the skill of
needed for each procedure a Skill Level indicator is the technician. The ratings are based on long term industry
included in each process. The Skill Level recommended experience and are not necessarily backed up with testing
should be used as a guide only. Skill levels will vary data.
widely from technician to technician and from company to
company. These recommendations come from industry 1.5.1.1 Levels of Conformance
experience and are not necessarily backed up with substan- L. Lowest Level - Significant variance with the physical
tive testing. Skills are separated into three categories. character of the original and may vary with many of the
L Intermediate - Technician with skills in basic soldering electrical, functional, environmental and serviceability
and component rework but inexperienced in general factors.
repair/rework procedures. M. Medium Level - Some variance with the physical char-
A. Advanced - Technician with soldering and component acter of the original and most likely varies with some
rework skills and exposure to most repair/rework pro- of the functional, environmental and serviceability fac-
cedures but lacking extensive experience. tors.
E. Expert - Technician with advanced soldering and com- H. Highest Level - Most closely duplicates the physical
ponent rework skills and extensive experience in most characteristics of the original and most probably com-
repair/rework procedures. plies with all the functional, environmental and service-
ability factors.
1.5 Applicability, Controls and Acceptability Although Class 3 Products must use procedures rated Highest level
the terms modification, rework and repair may seem very unless it can be demonstrated that a lower level procedure
similar, applicability of such procedures may not be the will not adversely affect the product's functional character-
same due to conditions and objectives involved. Procedures istics. Class 2 and 1 Products should use procedures rated
2
November 2007 IPG-7711 B/7721 B
Highest level for assured safety and dependability but 1.6 Training The quality and reliability of modified or
Medium and Low Level procedures can be used if it has repaired printed boards and assemblies is highly dependent
been determined that they are suitable for the specific prod- upon the skill and competence of the person performing
uct's functional characteristics. these tasks. The implementation of proper methods by
unqualified personnel can result in a substandard end prod-
Procedures in this manual are given a "Level of Conform- uct. Consequently, achieving successful results with the
ance" rating which is described in Table 1. methods described herein is predicated on the use of prop-
Table 1 Level of Conformance erly trained personnel whose skills have been tested and
Level of Conformance certified to be of a sufficient level of competence.
Functional Consideration L M H 1. Soldering Skills - Many companies have considered
Electrical - Resistance No Verify Yes assembly personnel who are competent in soldering
Electrical - Inductance No Verify Yes techniques to be sufficiently trained for rework/repair
Electrical - Capacitance No Verify Yes activities. This has often proven to be erroneous, since
Electrical - Cross Talk No Verify Yes proper soldering is only one of the skills required. Also,
Electrical - High Speed No Verify Yes in order to attain comparable results, there are many
Frequency instances where component rework requires techniques
Environmental - Shock No Verify Yes that are different than those used to originally solder the
Environmental - Vibration No Verify Yes component.
Environmental - Humidity Verify Verify Yes 2. Personnel Selection - The proper selection of trainees
Environmental - Temperature Yes Yes Yes will contribute significantly toward the success in
Environmental - Altitude Verify Verify Verify developing capable repair personnel. Personnel with
Environmental - Bacteria Verify Verify Yes above average soldering abilities and sound reasoning
Environmental - Fungus Verify Verify Yes capabilities often make ideal trainees. However, per-
Serviceability - Future Repair No Yes Yes sonnel who have no soldering skills, but possess a good
or Mod. level of eye acuity, manual dexterity, and sound reason-
No Procedure may not comply with functional ing capability, can be successfully trained.
Verify Pocedure should comply with functional consideration 3. Professional Training - Companies should establish
but should be tested to verify, and maintain procedures for identifying the training
Yes Procedure will normally comply with functional needs and provide for the training of all personnel per-
consideration. forming the activities affecting product quality. Person-
nel performing specific assigned tasks shall be qualified
In principle any modification, rework or repair action taken on the basis of appropriate education, training and
on a product should reestablish the products original char- experience. Maintaining records of training is appropri-
acter, "Make it like it was." Physical changes, obvious or ate and may be specifically required to meet ISO or
otherwise, can adversely affect the products performance or other quality certification criteria.
capability factors.
Training for personnel and instructors is commercially
available and can be completed by an outside organization
1.5.2 Compliance Products that have been subjected to seilzn nteapial icpie oiiain
rework need to comply with the functional requirements specializing in the applicable discipline. Modification-
L
for the product and any other attributes that may be
required by the customer. In the absence of other defined
acceptability criteria it is appropriate to apply the accep-
rework/repair training employs concepts, techniques, pro-
cedures and a vocabulary that distinguishes it from basic
soldering training. Effective training requires the develop-
tance criteria of IPC-A-610 to rework actions. ment of high levels of comprehension and reasoning within
the trainee. This necessitates expansive teaching methods
Modification and repair, by their nature, do not have indus- and detailed demonstration under close instructor supervi-
try established requirements and acceptance criteria. These sion, to help assure the development of proficiency within
will need to be determined on a case by case basis. Prod- each trainee.
ucts that have been subjected to modification need to com-
ply with the requirements of the engineering data package Training to establish a desired level of proficiency can usu-
that defines the modification. ally be achieved after three to ten days of training, depend-
ing on the content of the training program, the complexity
Repair or modification may result in, or include, minor of the end product, and the proficiency of the trainee. Test-
changes in visual appearance that do not degrade the form, ing and certification can be provided for each trainee, as
fit, or function of the assembly. the situation warrants.
3
1.7 Basic Considerations 1.8.3 Lighting The circuit assembly needs to be illumi-
1. AppropriateApprovals - When rework, repair, or modi- nated with sufficient light to see the features and color
fication of products is conducted during manufacturing, variations. A typical minimum acceptable lighting level is
appropriate approvals may be required. Unless prohib- tat least 1000 Lm/m 2 . In selecting a light source, the color
ited by the customer, rework during manufacturing may temperature of the light is an important consideration.
usually be performed without prior approval of the cus- t Light ranges from 3000-5000 0 K enable users to differen-
tomer. Repair actions and modifications generally tiate various metal alloys and contaminants. A black light
require prior approval by the customer. assists in identifying flux residue and the presence of con-
formal coating.
2. Singular Procedures- Procedures in this book are pre-
sented as individual methods. Multiple procedures may 1.8.4 Fume Extraction Work environments can often
be necessary to complete the task. expose technicians to potentially hazardous fumes. Dis-
3. Quality - Rework, repair, or modification of printed posal and release of certain materials may have a signifi-
boards and assemblies should achieve the quality of the cant environmental impact. The use of localized fume
original product. extraction systems, environmental control devices and
other personnel protection equipment may be necessary to
4. Procedure Selection -The procedure selected should comply with MSDS requirements and applicable federal,
be on the basis of optimum end product functionality.
state and local laws.
It may be necessary to develop specific evaluation cri-
teria depending on the product's required functions and 1.8.5 Tools Precision soldering is important in today's
end use environment. modification, rework and repair operations. Technicians
5. Patience - To achieve best results, do not rush the pro- may need an assortment of special use soldering tools
cess. Keep in mind that most of the cost for fabrication/ appropriate to the variety of tasks at hand. These tools must
assembly has already been spent, but with care and be temperature controlled, ESD/EOS safe, ergonomically
patience, most of this cost can be salvaged. designed and include a selection of tips to suit each par-
ticular operation. These tools generally use conductive
6. Heat Application - Incorrect heat application may heating (by contact), convective heating (by hot gas) or
cause severe damage to board materials, conductors, infrared heating (by focused infrared lamps).
components, conformal coatings and solder connec-
tions. -X1.8.6 Primary Heating Methods Primary heating meth-
7. Removal of Coatings - Coating should be removed ods are those principally responsible for achieving solder
from affected areas prior to processing. Coatings will reflow during a component installation or removal process.
inhibit solder removal and adversely affect resoldering These are to be distinguished from methods used for pre-
operations. heating and auxiliary heating which are employed in addi-
tion to primary heating methods.
1.8 Workstations, Tools, Materials and Processes Mod- 1.8.6.1 Conductive (by contact) Heating Methods Sol-
ification, rework and repair of PC boards and assemblies is dering irons fall into one of three categories. These may
generally a highly labor intensive operation relying more employ any of several heating technologies.
on individual operator skills than automation. The use of
proper tools and supplies, many unique to repair actions, For conductive heating methods to work effectively, the
will often have a significant impact on the function and soldering iron tip must be clean and free of oxidation.
reliability of the end product. To enhance the ease of the For that reason, the final action before contacting any
task at hand and to improve the potential for a successful connection with a soldering iron is to clean the tip. See
operation, the following tools, materials, and processes Procedure 2.8.
may be required. (Fixed Temperature - Fixed temperature soldering irons
1.8.1 ESD/EOS Controls do not permit changing the tip temperature.

)Selectable Temperature - Selectable temperature solder-
1.8.2 Vision Systems The small features in electronic ing irons permit operation at a preselected temperature.
assemblies and the precision needed require use of a vision Selection of the temperature is achieved by removal/
magnification system. Appropriate vision systems that pro- replacement of an integrated part of the soldering system
vide depth perception, and working ranges of 3 to 30x (soldering iron tip, temperature control module, etc.).
magnification, resolution, field of view and working dis- Typically a selectable temperature soldering iron offers
tance are critical when performing rework, repair or modi- temperature selection in 50 or 100 degree F increments.
fications on the miniature components, circuits, and assem- OVariable Temperature - Variable temperature soldering
Sblies. Refer to IPC-OI-645 Standard for Visual Optical irons permit operation at any temperature within the con-
Inspection Aids for more information. trol range (typically 500 to 800 F degrees). Temperature
4
November 2007 IPG-7711 B/7721 B
change may be achieved by either digital or analog con- ally recommended that preheating occur at a rate of no
trol. greater than 2-4 degrees C/sec. until a given minimum tem-
perature is reached.
Additional examples of conductive tools are:
- Soldering Tweezers - Common name for a tool that Preheating/auxiliary heating is also required when the pri-
simultaneously uses two separate elements to achieve mary heating method cannot bring all of the solder joints
reflow of a solder connection. Soldering tweezers fall into completely up to proper reflow temperature at all or in an
one of two categories: acceptable period of time. This may be due to high mass
" Thermnal Tweezers - A tweezer handpiece that has components, heat sinking by nearby portions of the sub-
each tweezer tip heated to a predetermined tempera- strate, circuit elements and adjacent components. The goal
teheral tweezer
tipheae s tpaly ed trrempe- is to bring the assembly (or a portion thereof) up to a suf-
ture. Thermal tweezers are typically used for removmg ficient (yet safe) temperature at which the rate of heat sink-
SMT components from a PCB. ing is low enough that the primary heating device can
e Resistive Tweezers - A tweezer handpiece that has a effect proper solder reflow in an acceptable period of time.
different electrical potential on each tweezer tip. Heat- This process may also be used for through-hole desolder-
ing is achieved by passing a high density electrical ing on heavy multilayer boards with internal ground
current between the tips (through the item being sol- planes.
dered). Resistive tweezers are typically used for sol-
dering cup terminals and similar components that will
not be damaged by the voltage and current present in 1.8.8 Hand Held Drilling and Grinding Tool PC Board
the soldering action. modification, rework and repair procedures often require
drilling, milling or grinding operations. The best type of
- Solder Pots/Fountains - The alloy type, contamination tool for these delicate operations is preferably a light-
levels, and temperatures need to be monitored to assure weight, high quality, EOS/ESD controlled motorized rotary
they are compatible with the work being performed. tool. This tool can be used for detailed work (i.e., solder
resist and conformal coating removal, grinding out burns or
1.8.6.2 Convective (hot gas) and IR (radiant) Heating laminate defects, drilling out plated holes, cutting fine pitch
Methods Examples of convective tools are: conductors etc.).
4e Hot Air Pencil - Common name for the handpiece used
to deliver heated gas to connection elements to be sol- 1.8.9 Precision Drill/Mill System Demanding projects
dered. Typically used to reflow solder paste, but can also often require the need to make very precise holes, slots,
be used with solder wire. groves etc.. Accurate depth control and high speed may be
e Hot Air Gun - Common name for the handpiece used to required. A precision drilling/milling system with fixturing
deliver heated gas to connection elements to be soldered. to hold the printed board assembly and an attached micro-
Similar in concept to the hot air pencil but usually with scope may be advisable for those unusually demanding
greater thermal capacity. projects.
9.. Benchtop convective, IR or combination work stations.
1.8.10 Eyelets and Eyelet Press System Solder plated
1.8.7 Preheating (Auxiliary) Heating Preheating printed copper eyelets and an eyelet press/setting tool to repair
board assemblies is sometimes recommended to avoid ther- damaged plated through holes may be required.
mal shock to temperature sensitive materials and compo-
nents. Preheating also elevates the thermal mass of the 1.8.11 Gold Plating System Plating gold edge contacts
assembly to allow a rework process to proceed in an or any metal surface requires the use of materials that may
acceptable time. Preheating can be accomplished using have environmental and safety concerns and must be
either an oven, heat lamp, hot plate, infrared or convective handled properly. The power applied to the plating surfaces
style heating system. must be controlled accurately to expect reliable results.
Preheating is required when there is a risk of thermal shock Plating systems typically include; a DC power supply with
in the substrate, components or both. The goal is to ramp voltage and current meters, plating anodes sized for gold
up the assembly and/or component at an acceptably safe edge contact plating, a solution tray to collect the solution
rate until it reaches a target temperature. The assembly (or runoff, a support for the PC board and a tray to hold and
component) is then thermally soaked. This eliminates dan- store the various chemicals safely.
gerous temperature gradients which could produce imme-
diate damage, degradation over time or reduction of reli- 1.8.12 Tools and Supplies Also needed are a wide
ability. The rate of "ramp up" can be critical. For example assortment of hand tools including tweezers, various pliers,
many ceramic chip capacitor manufacturers have tradition- files, dental picks, cutting tools and other common items.
5
. 1.8.13 Materials The materials listed are "generic" in 1.8.13.6 General Any consumables such as wicking
nature. It is recommended that these materials are available braid, wipes and other items listed in the procedures need
or approved by your company. The use of certain materials to be compatible with the process.
includes some increased risk (fire, personnel safety, etc.)
and such materials should not be used unless appropriate PG
safety precautions are enforced. f.8.14 Process Goals and Guidelines The process of
component replacement involves three basic procedures.
1.8.13.1 Solder The procedures in this document are not These are component removal, land preparation and com-
specific to any alloy type and should be compatible with ponent installation. Depending on PCA configuration, con-
most commonly used tin-lead or lead-free alloys. When formal coating removal and replacement may also be
soldering on newly manufactured assemblies the same required.
alloy type needs to be used. When effecting repair of Nondestructive Process - During any assembly or
fielded assemblies, it may be impossible to determine the rework process, no damage or degradation should occur
alloy type. It is recommended that you look at drawings, to the board (both substrate and circuit elements), adja-
labeling or any available documentation for the assembly cent components, and the component to be installed or
to attempt to determine the correct alloy to use. When removed. This damage may be either mechanical,
unknown and without other direction, the standard alloy thermo/mechanical or purely thermal in nature and may
used in your facility should be used. IPC-1066 and IPC/ result in either immediate failure, degradation in perfor-
JEDEC J-STD-609 (supersedes IPC-1066) are examples of mance over time (latent failure) or a reduction in reli-
standards used to identify the solder alloys and coatings on ability. EOS/ESD damage must also be avoided by
the assembly. employing proper work procedures, work stations and
equipment controls.
1.8.13.2 Flux The type of flux used needs to be appropri- Controllable, Reliable and Repeatable Process - The
ate to the solder alloy/process being used, and compatible process can be employed, and when necessary, modi-
with the cleaning and coating processes that may be fled by a trained operator in a repetitive fashion with
required.
consistently acceptable results.
1.8.13.3 Replacement Conductors and Lands There ( Process Appropriate to ParticularApplication - The
are commercially available replacement conductors and process (or modification thereof) employed is appropri-
lands that are normally fabricated from copper foil and ate to the particular application based on the relevant
plated with solder or nickel and gold for edge contact guidelines described below.
repair. These conductors and lands are available with or Operator Friendly Process - An operator of average
without a dry film adhesive on the back. Adhesive backed ability can, with proper training and practice, become
conductors and lands are normally heat bonded to the acceptably proficient in employing, and when required,
board surface. Replacement conductors and lands are avail- modifying the process to suit any particular require-
able in various shapes, sizes and thicknesses. Compatible ments of a given task.
replacement conductors and features may also be salvaged 9 Efficient Process - The process can be done repeatedly
from scrap Printed Circuit boards, if necessary. in a production environment quickly and easily at mini-
mal costs with little or no down-time. Set-up and train-
,f.8.13.4 Epoxy and Coloring Agents Many repair opera- ing time must also be minimal.
tions require the use of high strength, high temperature
epoxies. For high temperature applications two-part 1.8.14.1 Nondestructive Component Removal Each
epoxies offer the highest strength, thermal resistance and rework-modification-repair procedure has certain advan-
durability. It may also be important to have resists or col tages and precautions. These depend on the particular
oring agents so that you can restore the cosmetic appear- operation/device/material (lead/terminations design, size,
ance of the board. It is best to cure the epoxies in an oven body material, etc.), component mounting site (adjacent
components, access, substrate type, thermal mass, etc.) and
the skill level of the operator. Some procedures depicted in
1.8.13.5 Adhesives The type of adhesive used needs to this document may not be applicable to all termination
be appropriate to the purpose of the adhesive, whether for styles.
thermal management or for attachment of a item such as a
heat sink, replacement land/conductor, jumper wires, etc.
Issues that need to be considered are shelf life of the mate- 1.8.14.1.1 Surface Mount Components
rial, mixing ratios, working life, curing, and compatibility - Pre-/auxiliary heat assembly and/or component if
with cleaning and coating processes that may be required. required.
6
* Evenly apply heat in a rapid, controllable fashion to - Pre-/auxiliary heat assembly and/or component if
achieve complete, simultaneous reflow (melt) of all solder required.
joints. - Predry applied solder paste.
)f- Avoid thermal and/or mechanical damage to component, e Reflow solder joints (individually, in groups or all
board, adjacent components and their joints, together) with concentrated "targeted" heat in a rapid,
- Immediately remove component from board before any controllable manner while maintaining lead/land align-
solder joint resolidifies. ment. Joints should remain at target temperature (above
e Prepare lands for replacement component. melting point of solder alloy) for proper time to achieve
optimal intermetallic formation.
1.8.14.1.2 Through-Hole Components Desolder com- * Avoid thermal and/or mechanical damage to component,
ponent one joint at a time using vacuum method: board, adjacent components and their joints.
* Pre-/auxiliary heat assembly and/or component if * Clean and inspect.
required.
1.8.14.2.3 Through-Hole Components
" Heat joint in a rapid, controllable fashion to achieve com-
plete solder reflow. - Insert new component into board.
e Avoid thermal and/or mechanical damage to component, e Pre-/auxiliary heat assembly and/or component if
board, adjacent components and their joints. required.
- Apply vacuum during lead movement to cool joint and QSolder joints (individually, in groups or all together) with
free lead. concentrated "targeted" heat in a rapid, controllable man-
ner. Joints should remain at target temperature (above
- Inspect barrel and land for damage. melting point of solder alloy) for proper time to achieve
optimal intermetallic formation.
1.8.14.1.3 Component Removal Using Solder Fountain
Method oAvoid thermal and/or mechanical damage to component,
" Reflow all joints in solder fountain, board, adjacent components and their joints.
- Remove old component and either immediately replace * Clean and inspect.
with new component, or clear through-holes for compo- -. 1.8.15 Cleaning Station/System Regardless of the Class
nent replacement later. of Product serviced, a cleaning system that is chemically
Note: Copper dissolution is a concern when using a solder matched to the flux system(s) in use will be essential to a
fountain and can be impacted by dwell time, temperature satisfactory repair In organizations that perform proce-
and alloy in use. dures on Class 3 Products, it may also be necessary to have
a cleanliness test system in order to periodically evaluate
1.8.14.2 Component Installation the ability of the cleaning system to meet the requirements/
expectations of the user. Interim or in-process cleaning at
1.8.14.2.1 Land Preparation Land preparation needs to the workstation should be used pending completion of the
be performed prior to the installation/replacement of a new procedure and the final cleaning. Common Procedure 2.2 in
component. Avoidance of thermal and/or mechanical dam- this document is an example.
age to the land and substrate is critical.
QRemove Old Solder - This may be performed with a sol- -.- 1 .8.16 Component Removal and Installation The vari-
dering iron and braided solder wicking material, or with ety of large and small components require an array of spe-
. cial use tools and methods for safe, efficient component
a continuous vacuum desoldering technique employing a removal. These tools generally use conductive heating (by
solder extractor and tip which allows reflow and vacuum
aspiration of the old solder to occur continuously. contact), convective heating (by hot gas) or infrared heat-
ing (by focused infrared lamps).
OClean Lands - Old flux residues leftover after the
removal of old solder are cleaned in this step prior to 1.8.17 Conformal Coating Area The cost, safety con-
adding new solder. cerns and utility services (air pressure/vacuum, power,
venting, UV illuminations, etc.) of equipment associated
1.8.14.2.2 Surface Mount Components with both the removal and application of conformal coating
- Prefill lands with solder (preforms, wire or paste). suggest to many organizations that one central conformal
e Align and place component to lands (tack if necessary).
coating and encapsulant area be installed.
- Apply solder paste to lead/land area if not applied prior to 1.8.18 Selecting a Process Selecting the process
component placement. depends on a variety of factors in addition to cost of tools
7
and training. Every process and its associated equipment - Define a cleaning procedure which will meet the end item
have advantages and precautions in a particular component cleanliness requirements of the customer.
installation or removal situation. These include: e Confirm through destructive physical examination and/or
CTy'pe of component x-ray analysis that the process defined will yield a BGA
- lead (termination) type attachment which meets any quality requirements
- body composition imposed.
* Size of component * Define, if used, an accelerated cooling system which does
e Moisture sensitivity level of component not exceed thermal gradient limits of the most sensitive
* Type of substrate (FR-4, ceramic, etc.) component of the assembly.
- Component mounting site 41.9 Lead Free The rework of circuit boards assembled
- thermal mass considerations using lead free solders is similar to common alloys excet
- adjacent components as noted below. Generally all that is needed is to under-
- accessibility of component or joints stand those differences. The procedures in this document
JWhether the component is being installed or removed are not specific to any alloy type and should be compatible
with most commonly used tin-lead or lead-free alloys. See
" Whether the component being removed must be salvaged 1.8.13.1.
e Applicable workmanship specifications
(oIt is very important to assure that any solder alloys with
©EOS/ESD control requirements Ilead or soldering iron tips that have been used with solder
1.8.19 Time Temperature Profile (TTP) To ensure containing lead are kept away from lead-free work areas.
acceptable results of the rework procedure, it is critical
to Those differences are:
establish a time temperature profile for the process.
- Lead free alloys have a higher Liquidous (or melting)
Note: The time temperature profile is dependent, in part, temperature than traditional tin-lead solder alloys. There-
on ambient relative humidity. Relative humidity variations fore lead free alloys may require different dwell times and
of greater ± 15% from those prevailing when the TTP was temperatures to create an acceptable solder connection.
established may require modification of the procedure
defined during TTP. GLead free alloys may require different fluxes and special
cleaning processes.
The following steps are suggested to achieve an acceptable . .
TTP.tin Wettmng tunes are generally extended.
- Select a preheat temperature for both the component and * Solderability indicators such as wetting angles, joint
the Assembly. (The components, whether ceramic and appearance etc., will generally be different.
plastic, need to be preheated, as does the assembly.) (Higher temperatures and longer dwell times may increase
oxidation.
NOTE: If plastic body or tape bodied components are
used, see IPC J-STD-033 Handling, Packing, Shipping e Component lead frames as well as circuit board finishes
and Use of Moisture/Reflow Sensitive Surface Mount must be compatible with the solder alloy.
Devices for information on handling of moisture sensitive - Using alternative means of attachment for rework/repair
components. (such as conductive epoxies) may be advantageous due to
- Solder paste characteristics must be identified including temperature and other considerations.
viscosity, thixotropy, rheology, deposition thickness and - For both conductive and convective assembly rework/
drying time/temperature; or if using flux cored solder repair, the use of inert atmosphere (such as nitrogen)
wire, land prefill solder quantity and prefill coplanarity should be considered to facilitate the process.
required.
8
Revision: B Number: 2.1
jPC Date: 11/07
7711/7721 Handling Electronic

Rework, Modification and
Repair of Electronic Assemblies Assemblies
GENERAL REQUIREMENTS Information in this specification is intended to be general in

Clauses 1.7 (Basic Considerations), 1.8 (Workstations, Tools, nature. Additional detailed information can be found in EIA-
Materials and Processes) and 1.9 (Lead Free) provide impor- 625, Requirements for Handling Electrostatic-Discharge-
tant information and guidance about the use of this procedure, Sensitive (ESDS) Devices, or ANSI/ESD-S20.20 ESD Associa-
including but not limited to tin-lead and lead-free alloys. This tion Standard for the Development of an Electrostatic
procedure is also applicable to lead free products. Discharge Control Program for Protection of Electrical and
Electronic Parts, Assemblies and Equipment (Excluding Elec-
OUTLINE trically Initiated Explosive Devices).
Electrostatic Discharge (ESD) is the rapid transfer of electrical
energy from one object to another of a different potential. 2.1.1 Electrical Overstress (EOS) Damage Prevention
When the electrical energy is allowed to come in contact with Electrical components can be damaged by unwanted electrical
or even close to a sensitive component it can cause damage to energy from many different sources. This unwanted electrical
the component. Electrostatic-Discharge Sensitive (ESDS) energy can be the result of ESD potentials or the result of
components are those components that are affected by these electrical spikes caused by the tools we work with, such as
high energy surges. The relative sensitivity of a component to soldering irons, soldering extractors, testing instruments or
ESD is dependent upon its construction and materials. As other electrically operated process equipment. Some devices
components become smaller and operate faster, the sensitivity are more sensitive than others. The degree of sensitivity is a
increases. function of the design of the device. Generally speaking higher
speed and smaller devices are more susceptible than their
Electrical Overstress (EOS) is the internal result of a unwanted slower, larger predecessors. The purpose or family of the
application of electrical energy that results in damaged com- device also plays an important part in component sensitivity.
ponents This damage can be from many different sources, This is because the design of the component can allow it to
such as electrically powered process equipment or ESD react to smaller electrical sources or wider frequency ranges.
occurring during handling or processing. EOS has become a serious problem and will be more critical in
ESDS components can fail to operate or change invalue as a the future.

result of improper handling or processing. These failures can When considering the susceptibility of the product it is impor-
be immediate or latent. The result of immediate failure can be tant to keep in mind the susceptibility of the most sensitive
additional testing and rework or scrap. However the conse- component in the assembly. Applied unwanted electrical en-
quences of latent failure are the most serious. Even though the ergy can be processed or conducted just as an applied signal
product may have passed inspection and functional test, it may would be during circuit performance.
fail after it has been delivered to the customer.
Before handling or processing sensitive components, tools and
It's important to build protection for ESDS components into equipment need to be carefully tested to ensure that they do
circuit designs and packaging. However, in the manufacturing not generate damaging energy, including spike voltages. Cur-
and assembly areas, we often work with unprotected elec- rent research indicates that voltages and spikes less than 0.5
tronic assemblies that are attached to the ESDS components. volt are acceptable. However, an increasing number of ex-
This section will be dedicated to safe handling of these tremely sensitive components require that soldering irons,
unprotected electronic assemblies. solder extractors, test instruments and other equipment do not
generate spikes greater than 0.3 volt.
For that purpose, the following subjects are addressed: As required by most ESD specifications such as EIA-625 or
2.1.1 Electrical Overstress (EOS) Damage Prevention ESDA 20.20, periodic testing may be warranted to preclude
2.1.2 Electrostatic Discharge (ESD) Damage Prevention damage as equipment performance may degrade with use
2.1.3 Physical Handling over time. Maintenance programs are also necessary for
Material in this manual, IPC-77117721 Rework, Modificationand Repair of Electronic Assemblies, was voluntarilyestablished
by Technical Committees of IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaimsall
liabilityof any kind as to the use, application, or adaptation of this material. Users are also wholly responsiblefor protecting
themselves against all claims or liabilitiesforpatent infringement. Equipment referenced is for the convenience of the user Page 1 of 4
and does not imply endorsement by IPC.
IPC-7711/7721
Number: 2.1 Subject: Handling Electronic Assemblies
Revision: B
Date: 11/07
process equipment to ensure the continued ability to not cause Table 1 Typical Static Charge Sources
EOS damage.
Work surfaces Waxed, painted or varnished surfaces
2.1.2 Electrostatic Discharge (ESD) Damage Prevention Untreated vinyl and piastics
Glass
The best ESD damage prevention is a combination of prevent- Floors Sealed concrete
ing static charges and eliminating static charges if they do
Waxed or finished wood
occur. All ESD protection techniques and products address Floor tile and carpeting
one or both of the twooneFoo
issues.
ore both ofateptotisues
Clothes and per- Non-ESD smocks
ESD damage is the result of electrical energy that was gener- sonnel Synthetic materials
ated from static sources either being applied or in close Non-ESD Shoes
proximity to ESDS devices. Static sources are all around us. Hair
The degree of static generated is relative to the characteristics Chairs Finished wood
of the source. To generate energy relative motion is required. Vinyl
This could be contacting, separation, or rubbing of the mate- Fiberglass
rial. Non-conductive wheels
Most of the serious offenders are insulators since they con- hPackaging and Past bags wraps, enveopes
cen ra e energy where it was generated or applied rather than
Styrofoam
allowing it to spread across the surface of the material.
Non-ESD totes, trays, boxes, parts
Common materials such as plastic bags or Styrofoam contain-
bins
ers are serious static generators and as such are not to be
Assembly tools and Pressure sprays
allowed in processing areas especially static safe areas. Peel-
materials Compressed air
ing adhesive tape from a roll can generate 20,000 volts. Even
Synthetic brushes
compressed air nozzles which move air over insulating sur-
Heat guns, blowers
faces generate charges.
Copiers, printers
Destructive static charges are often induced on nearby con-
ductors, such as human skin, and discharged into conductors. Table 2 Typical Static Voltage Generation
This can happen when a printed board assembly is touched by
a person having a static charge potential. The electronic Source 10-20% humidity 65-90% humidity
assembly can be damaged as the discharge passes through Walking on carpet 35,000 volts 1,500 volts
the conductive pattern to a static sensitive component. Static Walking on vinyl 12,000 volts 250 volts
discharges may be too low to be felt by humans (less than flooring
3500 volts), and still damage ESDS components. Typical static Worker at a bench 6,000 volts 100 volts
voltage generation is included in Table 2. Vinyl envelopes 7,000 volts 600 volts
2.1.3 Physical Handling Instructions)
Plastic bag picked 20,000 volts 1,200 volts
Care must be taken during acceptability inspections to ensure up from the bench
product integrity at all times. Table 3 provides general guid- Work chair with 18,000 volts 1,500 volts
ance. foam pad
Physical Damage
Improper handling can readily damage components and as-
semblies (e.g., cracked, chipped or broken components and
connectors, bent or broken terminals, badly scratched board
surfaces and conductor lands). Physical damage of this type
can ruin the entire assembly or attached components.
Page 2 of 4
IPC-7711/7721
Revision: B
Date: 11/07
Table 3 General Rules for When assemblies are removed from their protective wrap-
Handling Electronic Assemblies pings, handle with great care. Touch only the edges away from
any edge connector tabs. Where a firm grip on the assembly is
1. Keep work stations clean and neat. There must not be required, gloves meeting EOS/ESD requirements need to be
any eating, drinking, or use of tobacco products in the worn. These principles are especially critical when no-clean
work area. processes are employed.
2. Minimize the handling of electronic assemblies and Handling Electronic Assemblies
components to prevent damage. If no ESDS markings are on an assembly, it still needs to be
3 When gloves are used, they need to be changed as handled as if it were an ESDS assembly. However, ESDS
frequently as necessary to prevent contamination from components and electronic assemblies need to be identified
dirty gloves. by suitable EOS/ESD labels. Many sensitive assemblies will
4. Solderable surfaces are not to be handled with bare also be marked on the assembly itself, usually on an edge
hands or fingers. Body oils and salts reduce solderabil- connector. To prevent ESD and EOS damage to sensitive
ity, promote corrosion and dendritic growth. They can components, all handling, unpacking, assembly and testing
also cause poor adhesion of subsequent coatings or must be performed at a static controlled work station.
encapsulates. Avoid contaminating solderable surfaces prior to soldering.
5. Do not use hand creams or lotions containing silicone Whatever comes in contact with these surfaces must be clean.
since they can cause solderability and conformal coating When boards are removed from their protective wrappings,
adhesion problems.. handle them with great care. Touch only the edges away from
6. Never stack electronic assemblies or physical damage any edge connector tabs. Where a firm grip on the board is
may occur. Special racks need to be provided in required due to any mechanical assembly procedure, gloves
assembly areas for temporary storage. meeting EOS/ESD requirements need to be worn. These
7. Always assume the items are ESDS even if they are not principles are especially critical when no-clean processes are
marked. employed.
8. Personnel need to be trained and follow appropriate Handling After Solder
ESD practices and procedures, including use of wrist or After soldering and cleaning operations, the handling of elec-
heel straps. tronic assemblies still requires great care. Finger prints are
9. Never transport ESDS devices unless proper packaging extremely hard to remove and will often show up in conformally
is applied. coated boards after humidity or environmental testing. Gloves
or other protective handling devices need to be used to
Contamination prevent such contamination. Use mechanical racking or bas-
kets with full ESD protection when handling during cleaning
Contamination by handling with bare hands or fingers with- operations. ESD events can occur when sensitive
out some form of protection causes soldering and coating devices/assemblies are placed on any nonconductive surface,
problems; body salts and oils, and unauthorized hand creams regardless of whether or not a wrist or shoe strap is used.
are typical contaminants. Body oils and acids reduce solder-
ability, promote corrosion and dendritic growth. They can also Common Tools and Equipment
cause poor adhesion of subsequent coatings or encapsulates. Work environments require tools and equipment to conduct
Lotion formulated specifically for use insolder assembly areas electronic assembly operations. The following information is
is available. Normal cleaning procedures will not always re- provided as guidance regarding the use of common
move such contaminants. The best solution is to prevent equipment. EIA-625 and ESDA 20.20 provide more specific
contamination. information.
Page 3 of 4
IPC-7711/7721
Revision: B
Date: 11/07
NOTES
Page 4 of 4
c C Date: 11/07
7711/7721
Repair of Electronic Assemblies Cleaning
GENERAL REQUIREMENTS prior to using adhesives, coating materials or soldering. A

Clauses 1.7 (Basic Considerations), 1.8 (Workstations, Tools, cleaning step after soldering is used to ensure that surface
Materials and Processes) and 1.9 (Lead Free) provide impor- contaminants are not trapped beneath conformal coatings or
tant information and guidance about the use of this procedure, encapsulants, nor will they contribute to future functional
including but not limited to tin-lead and lead-free alloys. This assembly problems.
procedure is also applicable to lead free products.
LIMITATIONS
OUTLINE
Surface contaminants can significantly affect soldering, bond- 1. The ability of solvent based cleaning solutions to remove
ing, coating and the electrical characteristics of printed board flux residue containing polyglycols should be assessed
and assemblies. This procedure outlines the cleaning methods since not all solvent based cleaning solutions will remove
for printed wiring boards and assemblies. polyglycols.
BACKGROUND 2. A de-ionized (DI) water rinse should follow IPA/DI cleaning

except that a water rinse for double sided printed circuit
In the past few years, the Environmental Protection Agency boards with plated through holes may not be required.
(EPA) has been actively involved in reducing the production of
chlorofluorocarbons (CFC's). Through their efforts, and the 3. Potable (drinking) water should not be used as a final rinse
Montreal Protocol, the production of CFC's have been frozen due to the potential of contaminating the printed circuit
to 1986 levels with requirements to further decrease to zero board assembly with chlorine, fluorine and halides.
production by the year 2000. The London Amendments (June 4. When automated cleaning is used for assemblies that
1990) to the protocol are even more restrictive, have been conformally coated, it is important that the
cleaning process is compatible with the type of coating
Cleaning of the PCB is an important part of any rework/repair used and with any unsealed components. The coating
process. The different cleaning processes are dependent upon ue n ihayusae opnns h otn
the type of flux used in the soldering process or the type of should be checked to ensure that the coating will not be
contaminate to be removed. A general rule of thumb is "like degraded by the cleaning process.
dissolves like," which is a quick way of saying that usually TOOLS AND MATERIALS
organic/nonpolar contaminants are best removed by nonpolar
solvents and inorganic/polar contaminants are best removed Black Light De-ionized Water (DI)
by polar solvents. Brush, Soft Bristles Gloves
Cleaner, Aqueous or Isopropyl Alcohol (IPA)
A desirable cleaning medium should: Semi-Aqueous Oven
A. Not be harmful to employees or the environment. Containers Wipes, Lint Free
B. Possess excellent wetting ability.
C. Dissolve and removes both soluble and particulate con- PROCEDURE
taminants. CAUTION
D. Be compatible with the PCB assembly. Use clean gloves during this entire operation.
E. Be stable during use.
NOTE
INTRODUCTION To reduce solvent volumes, mixtures of IPA with water and IPA
If rework/repair operations are performed in a facility that has with solvent are available in pressurized containers. The pro-
an automated cleaning system (i.e., batch, in-line, aqueous, pellants are HFC's. These containers may be fitted with a
semi aqueous, or solvent), then such equipment should be bristle brush spray attachments for additional cleaning action.
used to clean the assembly. 1. Clean the board inan Aqueous or Semi-Aqueous cleaner,
If an automated system is not available, the cleaning method or pour approximately 10 ml of cleaning solution per 26
that follows should be used to reduce surface contamination square centimeters of affected area.
Material in this manual, IPC-7711/7721 Rework, Modificationand Repair of ElectronicAssemblies, was voluntarilyestablished
by Technical Committees of IPC. This material is advisory onlyand its use or adaptation is entirely voluntary. IPC disclaimsall
themselves against all claims or liabilitiesfor patent infringement. Equipment referenced is for the convenience of the user Page 1 of 2
IPC-7711/7721
Number: 2.2 Subject: Cleaning
Revision: B
Date: 11/07
2. Scrub the board vigorously with a continually wet soft

bristle brush for 10 seconds.
3. Rinse the area with 10 ml per 26 square centimeters of
clean Isopropyl Alcohol to effectively remove all potentially
harmful residues.
4. Handle the board by the edges and blot the excess
Isopropyl Alcohol with clean, lint free cloth.
5. Examine board visually for cleanliness. The use of a black
light will help detect contaminants that will fluoresce.
6. Dry boards in oven, if desired.
7. If the boards or assemblies are to be stored before use or
coating, remove them from the oven and allow to cool until
they can be handled. Place the boards or assemblies into
self sealing bags with packages of desiccant.
INSPECTION GUIDANCE
1. Flux residue
2. Particulate matter
3. Chlorides, carbonates and white residues
4. Surface appearance
NOTES
Page 2 of 2
Revision: B Number: 2.3.1
Gc pC Date: 11/07
7711/7721 Coating Removal, *je .. Board Type: R,F,W,C
C Senifi-
See1
Rework, Modification and Skill Level: Advanced
Repair of Electronic Assemblies cation of Conformal Coating Lelof Conformance: High
See 1.5.1
GENERAL REQUIREMENTS known coatings being used. Labels conforming to Standards

Clauses 1.7 (Basic Considerations), 1.8 (Workstations, Tools, such as IPC-1066 (superseded by IPC/JEDEC J-STD-609)
Materials and Processes) and 1.9 (Lead Free) provide impor- and IPC/JEDEC J-STD-609 may be present on the assembly
tant information and guidance about the use of this procedure, to identify the coating material.
including but not limited to tin-lead and lead-free alloys. This
procedure is also applicable to lead free products. When identification of the coating is not available, simple
observation and testing will help identify the coating charac-
OUTLINE teristics so that the proper removal procedure can be speci-
This procedure covers the techniques for identifying various fled.
coatings so that the appropriate coating removal method can
be selected. NOTE
The generic or commercial identification of the coating material
Conformal Coating Types IPC-CC-830 has superseded MIL- is not necessary to accomplish coating removal.
1-46058 as the primary specification for printed circuit assem-
bly conformal coatings, and covers the following types of 1. Hardness
conformal coatings: Penetration test in a non-critical area to determine relative
hardness. The harder the coating the more suitable to
1. Type AR - Acrylic resin (includes lacquers and varnishes) pure abrasive techniques. The softer and gummier the
2. Type ER - Epoxy resin coatings the more suitable to the brushing removal pro-
3. Type SR - Silicone resin cedures.
4. Type UR - Polyurethane resin 2. Transparency
5. Type XY - Paraxylylene Obviously transparent coatings are usually more suitable
for removal than the opaque type. Removal methods used
REFERENCES with opaque coatings must be far more controllable and
less sensitive to damaging the covered components and
2.1 Handling Electronic Assemblies printed board surfaces and are usually slower.
2.2 Cleaning 3. Solublity
2.5 Baking and Preheating
2.6 Epoxy Mixing and Handling Most coatings are soluble; however, the solvent required
IPC - CC-830 to dissolve a specific coating may also attack the board
and/or components. Unless directed by other mainte-
TOOLS AND MATERIALS nance actions, the solubility test and solvent use should
be limited to isopropyl alcohol. Test coat the surface in a
Abrasive Discs Heated Blade noncritical area by brushing on a small quantity and
Brush Knife
Cleaner Solvent observing the solubility action.
Cleaner Wipes Thermal Parting Tool CAUTION
Cotton Swab Wood Stick Printed board assemblies should not be immersed in
Dental Style Drill harsh solvents.
4. Thermal Removal
PROCEDURE Use a thermal parting device with controlled heating and
To determine the appropriate coating removal procedure the without a cutting edge to determine whether the coating
coating must first be identified. During original manufacture the can be thermally removed. Start with a low temperature,
specific coating is usually known. Consequently, the coating approximately 100*C, and increase the temperature until
removal methods can usually be specified and based on the the coating is removed. If the coating flows or gums up,
Material in this manual, IPC-7711/7721 Rework, Modificationand Repair of Electronic Assemblies, was voluntarily established
by Technical Committees of IPC. This material is advisory onlyand its use or adaptation is entirely voluntary IPC disclaimsall
IPC-7711/7721
Number: 2.3.1 Subject: Coating Removal, Identification of Conformal Coating
Revision: B
Date: 11/07
the temperature is too hot or the coating is not suitable for The specific coating to be removed may have one or more
thermal removal. of these characteristics and consequently the removal
5. Stripabiity method selected should consider the composite charac-
Carefully slit the coating with a sharp blade ina non-critical teristics.
area and try to peel back from the surface to determine if See Figure 1 for Conformal Coating Identification.
this method is feasible. Due to the adhesion required of See Table 1 for Conformal Coating Characteristics.
coating materials, stripable techniques without chemical See Table 2 for Conformal Coating Removal Methods.
aids is usually very limited.
6. Thickness INSPECTION GUIDANCE
Coating thickness is determined by visual inspection. Thin 1. Visual examination or UV light may be used to verify
coatings show sharp outlines of the components and removal of coating.
almost no fillet at intersection points of part leads to the 2. Visually inspect PWA for damage from removal of confor-
circuit board. Thick coatings reduce these sharp outlines mal coating.
and show fillets where part leads intersect with the board.
Coatings thinner than 0.064 cm [0.025 in] are considered NOTES
thin. Coatings thicker than 0.064 cm [0.025 in] are classed
as thick.
Page 2 of 4
IPC-7711/7721
Revision: B
Date: 11/07
CONFORMAL COATING IDENTIFICATION
START
DOES THE
NO COATING FEEL YES
SOFT/RUBBERY/
SPONGY
DOES THE
NO IS THERE A NO COATING HAVE A YES
REACTION TO NOTICEABLE
ALCOHOL REACTION
TO HEAT
YES NO IS THE COATING YES

THICK AND HAVE A POLYURETHANE
DULL SURFACE
SILICON RTV
RESIN ENCAPSULATION
ACRYLIC
LACQUER
DOES THE
COATING HAVE A YES DOES THE NO
+ NOTICEABLE REACTION FORM A
REACTION WHITE POWDER
TO HEAT
POLYURETHANE
NO YES
L IDENTIFICATION
, EPOXY COMPLETE
USE TABLE 1 FOR
CONFIRMATION
PARAXYLYLENE
Figure 1 Conformal Coating Identification
Page 3 of 4
IPC-7711/7721
Revision: B
Date: 11/07
Table 1 Conformal Coating Characteristics
Conformal Coating Type

Poly- Silicone Para-
Characteristics Epoxy Acrylic urethane Resin xylylene
Hard
Medium Hard
Soft
Heat Reaction
Surface Bond - Very Strong
Surface Bond - Strong
Surface Bond - Medium
Surface Bond - Light
Solvent Reaction
Non-porous Surface
Glossy Surface I-'
Semi-glossy Surface
Dull Surface
Rubbery Surface
Brittle
Chips
Peels and Flakes
Stretches
Scratch, Dent, Bend, Tear
Table 2 Conformal Coating Removal Methods

Removal Method
2.3.4 2.3.5 2.3.6
2.3.2 2.3.3 Thermal Grinding Scrap- Micro Blasting
Conformal Coating Solvent Method Peeling Method Method ing Method Method
Paraxylyene 1 2 3
Epoxy 1 2 3
Acrylic 1 2 3 4
Polyurethane 3 1 2 4
Silicone Thin 1 2 3 4
Silicone Thick 1 2
NOTE: The preferred order for applying removal methods to specific coatings is numerically indicated. These removal methods are listed in ascending order.
More than one method may be required.
Page 4 of 4
IPC Date: 11/07
7711/7721
Coating Removal,
Rework,
Modification
Modveatineolv ntBoard Type: R,F,W,C
See 1.4.2
and Repair of Skill Level: Advanced
See 1.4.3
Electronic Assemblies Level of Conformance: High
See 1.5.1
GENERAL REQUIREMENTS
Clauses 1.7 (Basic Considerations), 1.8 (Workstations, Tools, Materials and Pro-
cesses) and 1.9 (Lead Free) provide important information and guidance about the ' -
use of this procedure, including but not limited to tin-lead and lead-free alloys. This ..
OUTLINE
This procedure uses a solvent to remove surface coatings. This procedure can be
used for spot or overall coating removal of conformal coatings or solder resists.
Figure 1 Apply tape to outline for
Approved solvents may be used to remove specific soluble type coatings on a spot coating removal.
basis by brushing or swabbing the local area with the controlled application of sol-
vent until the area is free of the coating material.
If warranted, all the soluble type coating can be removed by immersing and brush-
ing the entire printed board or printed board assembly.
To determine the appropriate coating removal procedure the coating must first be
identified. Refer to procedure number 2.3.1.
NOTE
Coating removal may require the use of one or more methods. Figure 2 Apply solvent with foam
swab to remove coating.
CAUTION
Determine, on a module by module basis, the hazards to parts, etc., by short term
immersion in the removal solvents. If chloride based or other harsh solvents are
used, extreme care must be exercised to prevent damage to base material, compo-
nent parts, plated-through holes, and solder joints. Some solvent coating removal
methods can cause expansion or swelling of the base material which can degrade
the printed board or printed board assembly. Under no circumstances should these
solvents be used except in a closely controlled process. It is recommended that the
printed board or printed board assembly be inspected to ensure that no damage has
occurred.
Before using any solvent refer to Material Safety Data Sheets.
REFERENCES
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.3.1 Coating Removal, Identification of Conformal Coatings
2.4.1 Coating Replacement, Solder Resist
2.4.2 Coating Replacement, Conformal Coatings/Encapsulants
Material in this manual, IPC-7711/7721 Rework, Modification and Repair of ElectronicAssemblies, was voluntarilyestablished
by Technical Committees of IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaimsall
IPC-7711/7721
Number: 2.3.2 Subject: Coating Removal, Solvent Method
Revision: B
Date: 11/07
TOOLS AND MATERIALS

Brush Suitable Solvent
Cotton Swab Thermal Parting Tool
Polyimide Tape Wood Stick
Knife
PROCEDURE - LOCAL SPOT REMOVAL
1. Apply Polyimide tape to outline the area where the coating needs to be removed.
(See Figure 1.)
2. Dip the end of a foam swab in stripping solution and apply a small amount to the
area of coating to be removed. (See Figure 2.)
As an alternative, a small cotton patch can be cut to the size of the area masked
(see Figure 1), saturated with the stripping solution, and pressed into intimate
contact with the surface of the coating to be removed. The patch will retard the
evaporation of certain solvents and reduce exposure time.
NOTE
Since various substances may be used as coatings, the time required for a given
coating to dissolve or soften will vary. Reapply solvent several times as most sol-
vents evaporate rapidly.
3. Rub the treated surface carefully with a brush or wood stick to dislodge the coat-
ing. A wedge shaped applicator tip, knife, or heated blade may be effective in
removing some coatings, particularly polyurethanes.
4. Neutralize or clean the stripped area and dry.
PROCEDURE - OVERALL REMOVAL
1. A single step for removal of all the coating may be completed by providing a con-
tinuous flow of solvent. Alternately, process the board in a series of tanks con-
taining mild solvent, starting with a high contamination tank and progressing
sequentially to a final, fresh solvent tank.
2. Neutralize or clean the stripped area and dry.
INSPECTION GUIDANCE
1. Visual examination or UV light may be used to verify complete removal of coating.

2. Visually inspect PWA for damage from removal of conformal coating.
NOTES
Coating Removal Required at Outlined Areas
Page 2 of 2
1PC, Date: 11/07
C71/72
ReCoating
Removal,
Rework,
Board Type: R,F,W,C
Modification Seeleg1.th4.2
and epai ofSee 1.4.3
See 1.5.1
cesses) and 1.9 (Lead Free) provide important information and guidance about the
use of this procedure, including but not limited to tin-lead and lead-free alloys. This
OUTLINE
This peeling removal method for coating can be used only under special circum-
stances. Normally this method is used to remove RTV silicone or other thick rubbery-
like coating materials. Figure 1 Slit and peel off coating
using a knife or heated blade.
The coating material is removed using a dull knife or otherwise dull blade to slit the
coating material and to peel it off the printed board or printed board assembly.
NOTE
This method is limited to coatings that are rubbery in nature to allow the coating
material to be slit into small sections and peeled off the printed board assembly.
REFERENCES
Figure 2 Removal complete.
2.2 Cleaning
TOOLS AND MATERIALS

Heated Blade
Knife
Wood Sticks
PROCEDURE
1. Slit and peel off the coating material with a dull knife or heated dull blade. (See
Figure 1.)
2. Repeat as needed until the required material is removed.
INSPECTION GUIDANCE%

NOTE
Coating Removal Required at Outlined Area
Material in this manual, IPC-7711/7721 Rework, Modificationand Repair of Electronic Assemblies, was voluntarilyestablished
by Technical Committees of IPC. This material is advisoryonly and its use or adaptation is entirely voluntary. IPC disclaimsall
IPC-7711/7721
Number: 2.3.3 Subject: Coating Removal, Peeling Method
Revision: B
Date: 11/07
NOTES
Page 2 of 2
1PC, Date: 11/07
7711/7721
77wo772 Coating Removal,
Board Type: R, F,W, C
Modification Thermal Method -e
.4.2

See 1.4.3
See 1.5.1
OUTLINE
This coating removal procedure uses a controlled, low temperature, localized heat-
ing method for removing thick coatings by an overcuring or softening means.
Figure 1 Apply thermal tip to soften
Two methods are covered. The first method uses various shaped, temperature con- or granulate the material.
trolled tips, with dull edges to soften and remove the coating.
The second method uses a localized controlled jet of hot air or inert gas to soften
the coating material which is pushed away or removed by a non-marring tool.
These methods do not burn or char either the coating or printed board.
CAUTION
Soldering irons should not be used for coating removal as their high operating tem-
peratures will cause the coatings to char and possibly delaminate the printed board
base material.
Figure 2 Apply hot air to the work
The use of thinned down soldering iron tips or soldering iron heated thin cutting area and remove overcured coating.
blades are not recommended since they do not provide controlled heating and may
present dangerous sharp edges to the workpiece surface.
REFERENCES
2.2 Cleaning
2.3.1 Coating Removal, Identification of Coatings
2.4.1 Coating Replacement, Solder Resist Figure 3 Removal complete.
TOOLS AND MATERIALS

Brush Knife
Heated Blade or Thermal Small Cutters
Parting Tool Wood Sticks
Hot Air Tool
PROCEDURE - THERMAL PARTING METHOD
1. Select an appropriate thermal parting tip to suit the workpiece configuration. Set
the nominal tip temperature, using the manufacturer's recommended procedure.
Material in this manual, IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies, was voluntarilyestablished
by Technical Committees of IPC. This material is advisoyonly and its use or adaptation is entirely voluntary. IPC disclaimsall
liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsiblefor protecting
IPC-7711/7721
Number: 2.3.4 Subject: Coating Removal, Thermal Method
Revision: B
Date: 11/07
2. Apply the thermal parting tip to the coating, using a light pressure. The coating
material will either soften or granulate. Polyurethanes will soften and epoxies will
granulate. The tip temperature should be regulated to a point where it will effec-
tively "break down" the coating without scorching or charring. (See Figure 1.)
3. Gradually reduce the coating thickness around the component body without con-
tacting the board surface, Remove as much coating as possible from around
component leads to allow easy removal of the leads.
Clip leads of component parts that are known to be faulty, thus permitting
removal of the part body separately from leads and solder joints. Low pressure
air or a brush should be used to remove the loosened coating.
4. Once sufficient coating has been removed, leaving only a small bonded joint
between the part body and printed board, heat the component body with the
thermal parting tool or hot air jet to weaken the bond beneath the component.
5. Lift the component body free of the printed board using small pliers.
NOTE
Twist the component prior to removal to shear any remaining epoxy bond to the
printed board surface.
6. Once the component body has been removed from the board surface, the
remaining coating material can be removed by additional thermal parting. The
remaining leads and solder joints are then removed by appropriate solder extrac-
tion means.
PROCEDURE - HOT AIR METHOD

By control of the gas/air temperature, flow rates and jet shape, the hot air method
can be applied to almost any workpiece configuration on both the component and
solder side of the printed board without damage.
Extremely delicate work can be handled in this manner while permitting direct obser-
vation of the heating action.
1. Set up the hot air tool per the manufacturer's instructions. Adjust flow rate and
temperature to suit specific coating removal application.
CAUTION
Never set the gas/air temperature at a level that will cause scorching or charring
of the coating material or reflow the solder connections.
2. Apply the heated air jet to work area. Apply light pressure using a wood stick or
other non marring tool to remove the softened or overcured coating. All coating
around individual leads, solder joints and component bodies can be removed in
this manner. (See Figure 2.)
3. When the coating has been removed, use appropriate solder extraction method
to remove components if needed.
INSPECTION GUIDANCE
NOTES
Coating Removal Required at Outlined Area
Page 2 of 2
IiPC® Date: 11/07
7711/7721 _ .
Rework,
Coating Removal,
Board Type: R, F, W, C
Modification Grinding/Scraping Se 1.4.

See1.3
Electronic Assemblies
e
ethod.oLevel of Conformance: High
See 1.5.1
OUTLINE
This coating removal method uses various grinding and scraping tools, depending
on the composition of the coating material. A knife or dental style scraper is normally Figure 1 Scrape away damaged or
used when a scraping method is desired. A hand held drill is normally used when a unwanted coating.
grinding technique is desired. A wide variety of rotary abrasive materials including ball
mills may be required.
CAUTION
Abrasion operations can generate electrostatic charges.
REFERENCES
Figure 2 Rubberized abrasives used
2.1 Handling Electronic Assemblies to remove thin, hard coating.
2.2 Cleaning
TOOLS AND MATERIALS

Ball Mills Microscope
Brush Rubberized Abrasives
Cleaner Scraper
Cleaning Wipes Wood Sticks Figure 3 Rotary brushes are best
Hand Held Drill Rubber Eraser used to remove soft coating.
Knife
PROCEDURE - SCRAPING
1. Clean the area.

2. Remove the damaged or unwanted coating or solder resist using a knife or
scraper. Hold the blade perpendicular to the coating and scrape from side to side
until the desired material is removed. (See Figure 1.)
3. Remove all loose material and clean the area.
by Technical Committees of IPC. This material is advisoryonly and its use or adaptation is entirely voluntary. IPC disclaims all
liability of any kind as to the use, application, or adaptation of this material. Users are also whollyresponsible for protecting
themselves against all claims or liabilitiesforpatent infringement.Equipment referenced is for the convenience of the user Page 1 of 2
IPC-7711/7721
Number: 2.3.5 subject: Coating Removal, Grinding/Scraping Method
Revision: B
Date: 11/07
PROCEDURE - GRINDING
1. Clean the area.

2. Insert an abrasive tip into the hand held drill. Abrade away the damaged or
unwanted coating. Move the tool from side to side to prevent damage to the
printed circuit board surface. (See Figure 2.)
3. Remove all loose material and clean the area.
NOTE
Rubberized abrasives of the proper grade and grit are ideally suited for removing thin
hard coatings from flat surfaces but not for soft coatings since these would cause
the abrasive to "load up" with coating material and become ineffective.
Rotary brushes are better suited than rubberized abrasives on contoured or irregu-
lar surfaces, such as soldered connections, etc., since the bristles will conform to
surface irregularities while removing hard or soft coatings. (See Figure 3.)
NOTE
The procedure for removing thick coatings is primarily to reduce their thickness to a
thin coating and then to remove the remaining thin coating by the scraping method.
INSPECTION GUIDANCE

NOTES
Page 2 of 2
CPC. Date: 11/07
7711/7721 "
Rework,
Coating Removal,
Board Type: R, F, W,
Modification Micro BlastingSee 2
Electronic Assemblies e o Met odSee1..

Level of Conformance: High
See 1.5.1
OUTLINE .
This coating removal method uses a micro abrasive blasting system and a very fine
soft abrasive powder. The powder is propelled through a small nozzle toward the Figure 1 Apply tape to outline area for
area where the coating needs to be removed. coating removal.
CAUTION
Micro blasting will generate substantial static charges. The work area should be
flooded with ionized air and the printed circuit board assembly should be grounded
whenever possible.N
REFERENCES
Figure 2 Remove coating using micro
2.1 Handling Electronic Assemblies blasting system.
2.2 Cleaning
TOOLS AND MATERIALS

Abrasive Powder Removable Mask
Polyimide Tape Stencils
Micro Blasting System
PROCEDURE
1. Clean the area.
2. Select the appropriate abrasive blasting powder and nozzle size. Set the air pres-
sure at the desired setting per equipment manufacturer's instructions.
3. Apply polyimide tape or other masking material to protect the printed wiring board
surface as needed. (See Figure 1.) Masking materials can consist of tapes, cur-
able liquid masks or reusable stencils.
4. If the printed circuit board has static sensitive components, insert the entire
printed circuit board into a shielded bag. Only the area needing rework should be
exposed. Ground the printed circuit board to dissipate static charges if needed.
Material in this manual, IPC-7711/7721 Rework, Modificationand Repair of Electronic Assemblies, was voluntarilyestablished
by Technical Committees of IPC. This material is advisoryonly and its use or adaptation Is entirely voluntary. IPC disclaimsall
IPC-771117721
Number: 2.3.6 Subject: Coating Removal, Macro Blasting Method
Revision: B
Date: 11/07
5. Insert the printed circuit board into the blasting chamber and blast away the
damaged or unwanted coating or solder resist. Slowly move the nozzle along the
area where the coating is to be removed. (See Figure 2.)
6. Blow off the blasting dust and clean the area.
INSPECTION GUIDANCE

3. Visually inspect and verify no evidence of micro blasting material is present.
NOTES
Page 2 of 2
Revision: B Number 2.41
IPC Date: 11/07
7711/7721
Rework, Coating Replacement,

Modification Solder ResistResistBoard Type:Intermediate
R,F,W,C
See
and Repair of Skill Level:
See 1.4.3
See 1.5.1
OUTLINE
This method is used to replace solder resist or coatings on printed wiring boards.
Most replacement coatings can be applied by dipping, brushing or spraying.
Figure 1 Apply polyimlde tape if
REFERENCES needed.
2.2 Cleaning
2.5 Baking and Preheating (
2.6 Epoxy Mixing and Handling
TOOLS & MATERIALS

Cleaner Foam Swab
Cleaning Wipes Heat Lamp
Color Agent, Various Colors Microscope
Brush Oven
Epoxy or Replacement Coating Figure 2 Apply replacement coating
with a foam swab to create a texture.
PROCEDURE
1. Clean the area.

CAUTION
Surfaces to be coated must be thoroughly cleaned prior to coating to ensure
adequate adhesion, minimized corrosion, and optimized electrical properties.
2. If needed, apply Polyimide tape to outline the area where the solder resist will be
applied. (See Figure 1.)
3. Mix the epoxy or replacement coating. If desired, add color agent to the mixed
epoxy to match the printed circuit board color.
4. Apply the replacement coating to the board surface as required. A brush or foam
swab may be used to apply and spread the epoxy or replacement coating. (See
Figure 2.)
*5. Cure the replacement coating per the manufacturer's instructions.
CAUTION
Some components may be sensitive to high temperature.
by Technical Committees of IPC. This material is advisoryonly and its use or adaptation is entirely voluntary. IPC disclaims all
liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting
and does not Imply endorsement by IPC.
IPC-7711/7721
Number: 2.4.1 Subject: Coating Replacement, Solder Resist
Revision: B
Date: 11/07
INSPECTION GUIDANCE
1. Visual examination for texture, color match, adhesion and coverage.

2. Electrical tests to conductors around the repaired area as applicable.
NOTES
Page 2 of 2
Revision: B Number: 2.4.2 *
ClP C Date: 11/07
7711/7721
Rework, Replacement,
CoatingConl C atigs/Board
orm Type: R,F,W,C
Modification C n o m l atn /See 1.4.2
and Repair of Skill Level: Intermediate
A See 1.4.3
Electronic Assemblies Encapsulants Level of Conformance: High
See 1.5.1
Clauses 1.7 (Basic Considerations), 1.8 (Workstations, Tools, Materials and Pro- Co"
OUTLINE
This method is used to replace conformal coatings and encapsulants on printed cir-
cuit boards.
Figure 1 Apply replacement coating
REFERENCES with foam swab to create a texture.

2.2 Cleaning
TOOLS & MATERIALS

Cleaner Foam Swab
Cleaning Wipes Heat Lamp
Brush Microscope
Epoxy or Replacement Coating Oven Figure 2 Repair complete.
PROCEDURE
1. Clean the area.

CAUTION
Surfaces to be coated must be thoroughly cleaned prior to coating to ensure
adequate adhesion, minimized corrosion, and optimized electrical properties.
2. If needed, apply Polyimide tape to outline the area where the coating will be
applied. (See Figure 1.)
3. If required, bake the printed circuit board prior to the application of the replace-
ment coating.
4. Mix the replacement coating.
5. Apply the replacement coating to the board surface as required. A brush or foam
swab may be used to apply and spread the replacement coating. (See Figure 2.)
For large surfaces, apply the replacement coating with a foam swab to create a
texture.
6. Cure the replacement coating per the manufacturer's instructions.
CAUTION
Some components may be sensitive to high temperature.
by Technical Committees of IPC. This material is advisoryonly and its use or adaptation is entirely voluntary.IPC disclaims all
liabilityof any kind as to the use, application, or adaptation of this material, Users are also whollyresponsible forprotecting
themselves against all claims or liabilities forpatent Infringement. Equipment referenced is for the convenience of the user Page 1 of 2
IPC-7711/7721
Number: 2.4.2 Subject: Coating Replacement, Conformal Coatings/Encapsulants
Revision: B
Date: 11/07
INSPECTION GUIDANCE
1. Visual examination for texture, color match, adhesion and coverage.

2. Electrical tests to conductors around the repaired area as applicable.
3. Repair area does not exceed the original board thickness.
NOTES
Page 2 of 2
Date: 11/07
7711/7721
Rework, Baking and Preheating Board Type: R, F,W, C

Modification See 1.4.2
See 1.4.3
See 1.5.1
OUTLINE
This procedure covers baking and preheating of printed boards and printed board
assemblies to prepare the product for the subsequent operations. Included are steps
for:
A. Baking
Baking is used to eliminate absorbed moisture. Whenever possible printed circuit
boards and printed circuit board assemblies should be baked prior to soldering,
unsoldering and coating operation to prevent blistering, measling or other lami-
nate degradation.
B. Preheating
Preheating is used to promote the adhesion of subsequent materials to the
board surfaces and to raise the temperature of the printed wiring board to allow
soldering and unsoldering operations to be completed more quickly.
CAUTION
Baking and preheating procedures must be carefully selected to ensure that tem-
perature and time cycles used do not degrade the product. Environmental conditions
must also be carefully considered to ensure that vapors, gases, etc., generated dur-
ing the heating process do not contaminate the product's surfaces.
CAUTION
To prevent fluxes or other contaminates from being baked onto the board surface,
thoroughly clean the board or assembly prior to baking or preheating.
REFERENCES
2.2 Cleaning
TOOLS & MATERIALS

Cleaner
Cleaning Wipes
Oven
by Technical Committees of IPC. This material is advisoryonly and its use or adaptation is entirely voluntary.IPC disclaimsall
liability of any kind as to the use, application, or adaptation of this material. Users are also whollyresponsible forprotecting
themselves against all claims or liabilitiesfor patent infringement.Equipment referenced is for the convenience of the user Page 1 of 2
and does not Imply endorsement by IPC.
IPC-7711/7721
Number: 2.5 subject: Baking and Preheating
Revision: B
Date: 11/07
NOTES
Page 2 of 2
jjjPC® Date: 11/07
7711/7721
Rework, Epoxy Mixing T
Board Type: R, F,W, C
Modification and Hand4ng .2
Skill Level: Intermediate
and Repair of and epai ofSee 1.4.3
See 1.5.1
OUTLINE
This procedure covers epoxy mixing and handling. The epoxy covered by this pro-
cedure has multiple uses including solder resist repair, base board repair, circuitry Figure 1 Mix resin and activator
over-coating and delamination repair. inside package of prepackaged epoxy.
NOTE
For high strength or high temperature applications two part epoxies will generally
have the best properties.
REFERENCES
2.2 Cleaning
TOOLS AND MATERIALS Figure 2 Apply epoxy. Foam swab

Balance/Scale Heat Lamp may be used to add texture.
Cleaner Mixing Cup
Color Agent, Various Colors Mixing Stick
Epoxy Oven
Foam Swab Wipes
PRINTED WIRING BOARD PREPARATION

The area where the epoxy is to be applied should be prepared prior to mixing the
epoxy. This preparation may include preheating the affected area to improve absorp-
tion of the applied epoxy. The entire printed wiring board may also be heated in an
oven or with a heat lamp.
CAUTION
Some components may be sensitive to high temperatures.
CAUTION
Avoid skin contact with epoxy materials.
PROCEDURE - Prepackaged Two Part Epoxy
1. Remove the clip separating the resin and activator. Mix by squeezing both halves
together with your fingers. Mix for at least one minute to ensure a complete mix
of the resin and activator. (See Figure 1.)
by Technical Committees of IPC. This material is advisory only and its use or adaptation is entirely voluntary.IPC disclaims all
themselves against all claims or liabilitiesforpatent infringement.Equipment referenced is for the convenience of the user Page 1 of 2
IPC-771117721
Number: 2.6 Subject: Epoxy Mixing and Handling
Revision: B
Date: 11/07
2. Cut open one end of the epoxy tube and squeeze the contents into a mixing cup.
Mix again with a mixing stick to ensure a thorough mixture of the resin and
activator.
NOTE
For bubble free epoxy, remove the clip separating the resin and activator. Cut
open one end of the Epoxy tube and squeeze the contents into a mixing cup.
Slowly stir the mixture with the mixing stick. Be sure to stir the mixture for at least
2 minutes to ensure that all the resin and activator have completely mixed.
3. If needed, add color agent to the mixed epoxy. Stir slowly to prevent bubbles.
CAUTION
Be sure the color agent is compatible with the epoxy mixture.
4. Apply or use as needed. (See Figure 2.)
5. Cure the epoxy per the manufacturer's recommendations.
INSPECTION GUIDANCE
1. Visual examination of epoxy for texture and color match.

2. Verify shelf life of epoxy.
3. Visually inspect for contamination.
4. Verify mix ratio meets manufacturer's instructions.
5. Epoxy cure and coverage as needed.
NOTES
Page 2 of 2
IPC Date: 11/07
7711/7721
Rework, Legend/Marking, Board Type: R,F,W, C

Modification See 1.4.2
See 1.4.3
See 1.5.1
OUTLINE
This method can be used to add, change or replace legend and markings on printed
boards or printed board assemblies. This method uses epoxy ink and an ink stamp
to place the legends on the printed board surface in much the same manner as tak- Figure 1 Apply legend using a peg
ing a "finger print." stamp.
REFERENCES
2.2 Cleaning
TOOLS & MATERIALS

Cleaner Knife
Cleaning Wipes Microscope Figure 2 Completed legend repair.
Epoxy Ink Oven
Ink Plate Peg Stamps
Ink Roller
PROCEDURE
1. Clean the area.

2. Scrape off any remaining character or legend with a knife and clean the area.
CAUTION
3. Select the appropriate characters from the peg stamp set or have a special stamp
made up.
4. Mix the epoxy ink. White is the most common color. Spread a thin even coating
of the epoxy ink on the ink plate or on a smooth surface.
5. Gently press the peg stamp into the epoxy coating to coat the character surface.
6. Gently press the peg stamp onto the desired location on the printed wiring board
surface. (See Figure 1.)
7. Cure the epoxy ink per the manufacturer's instructions.
Material in this manual, IPC-771117721 Rework, Modification and Repair of ElectronicAssemblies, was voluntarilyestablished
by Technical Committees of IPC. This material is advisory only and its use or adaptation is entirely voluntary.IPC disclaims all
liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible forprotecting
themselves against all claims orliabilitiesfor patent infringement. Equipment referenced is for the convenience of the user Page 1 of 2
IPC-7711/7721
Number: 2.7.1 Subject: Legend/Marking, Stamping Method
Revision: B
Date: 11/07
INSPECTION GUIDANCE
1. Visual examination for proper characters, positioning and legibility.

2. Marking ink is cured and resists:
a. Smearing
b. Chipping
c. Powdering
d. Cleaning processes
NOTES
Page 2 of 2
C PC Date: 11/07
7711/7721
Rework,
Legend/Marking,'__
Board Type: R,F,W, C
Modification Hand Lettering Method See 1.4-2
See 1.4.3
See 1.5.1
OUTLINE
boards or printed board assemblies. This method uses epoxy ink and a pen to hand \
letter the legends on the printed board surface. Figure 1 Apply legend using a wood
stick dipped in epoxy ink.
REFERENCES
2.2 Cleaning
TOOLS & MATERIALS

Cleaner Knife
Cleaning Wipes Microscope
Epoxy Ink Oven Figure 2 Completed legend repair.
Ink Pen Wood Stick
PROCEDURE
1. Clean the area.

CAUTION
3. Mix the epoxy ink. White is the most common color.
4. Sharpen a wood stick and dip the pointed end into the epoxy ink. Hand letter the
legend or markings as needed. (See Figure 1.)
INSPECTION GUIDANCE
1. Visual examination for proper characters, positioning and legibility.

a. Smearing
b. Chipping
c. Powdering
IPC-7711/7721
Number: 2.7.2 Subject: Legend/Marking, Hand Lettering Method
Revision: B
Date: 11/07
NOTES
Page 2 of 2
PC 11/07 NmeDate:
7711/7721
Rework,
Legend/Marking,
Modification
Met odBoard
Stencil Method 1.4
Type: R,F,W,C
See 1.4.3
See 1.5.1
OUTLINE
boards or printed board assemblies. This method uses epoxy ink and a brush or
roller technique. A stencil is used to outline the characters. Figure 1 Replace legend using a
stencil.
REFERENCES
2.2 Cleaning
TOOLS & MATERIALS

Cleaner Knife
Cleaning Wipes Microscope
Epoxy Ink Oven Figure 2 Completed legend repair.
Ink Plate Stencil
Ink Roller
PROCEDURE
1. Clean the area.

CAUTION
3. Select the appropriate stencil or have a special stencil made up. (See Figure 1.)
4. Mix the epoxy ink. White is the most common color. Spread a thin even coating
of the epoxy ink on the ink plate or on a smooth surface.
5. Position the stencil on the printed circuit board surface and hold in place firmly.
6 Roll or brush the ink onto the stencil. Do not smudge characters or apply excess
ink.
by Technical Committees of IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all
liabilityof any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting
themselves against all claims orliabilitiesfor patent infringement.Equipment referenced is for the convenience of the user Page 1 of 2
IPC-7711/7721
Number: 2.7.3 Subject: Legend/Marking, Stencil Method
Revision: B
Date: 11/07
INSPECTION GUIDANCE
1. Visual examination for proper characters, positioning, and legibility.

a. Smearing
b. Chipping
c. Powdering
NOTES
Page 2 of 2
_PiCe Date: 11/07
7711/7721
Repair of Electronic Assemblies Tip Care and Maintenance
GENERAL REQUIREMENTS should not be used to clean or remove excess solder from
Clauses 1.7 (Basic Considerations), 1.8 (Workstations, Tools, the tip.
Materials and Processes) and 1.9 (Lead Free) provide impor- Deionized water should be used to slightly dampen the
tant information and guidance about the use of this procedure,
including but not limited to tin-lead and lead-free alloys. This sponge. Tap water may introduce chemicals and contamina-
procedure is also applicable to lead free products. tion to the tip and ultimately affect the solder connection.
OUTLINE Dirty sponges should be safely discarded as they may have

gathered chemicals, lead-bearing alloys or other substances
When hand soldering, proper tip care is essential to not only sometimes considered hazardous.
help increase the life of the tip, but to insure that the best
possible connections are being created. Improper tip care or Brass brushes and coiled brass wire maybe used to remove
practices can lead to cold solder joints, thermal shock to the excess solder and other contamination prior to wiping on a
board and components, and cause damage to the pads or damp sponge.
PCB laminate. Use as little force as possible when soldering. Friction causes
The following actions will help to form acceptable solder the tips to wear. The more a tip is used, the greater the wear.
connections and extend the life of soldering tools. Soldering systems should be turned off when not in use,
Select the lowest possible tip temperature, temperature mod- especially if there is no automatic idle-down when the hand-
ule or other control method that allows the operator to piece is placed ina holder. A good guideline is to turn soldering
successfully reflow solder inthe connection being formed. High systems off when they are not expected to be used for a period
temperatures and incorrect use reduce tip life. of at least 10 minutes.
Tips should be cleaned and tinned before replacing in the Feed solder to the connection; it should not be fed directly to
holder. the tip.
Select a tip geometry that fits the component leads and pads Tips should not be used as levers, pry bars or screwdrivers as
being soldered. The tip geometry chosen should provide the this will crack the plating, reduce life of the tip and will even
greatest amount of contact area with the land and lead to cause some kinds of tips to stop operating. Bending a tip with
reduce dwell time while forming the connection. pliers will also damage the plating and cause the tip to fail.
Quickly wiping hot solder tips on a clean, slightly damp, If the tip is a cartridge type tip remove it with the manufacturer's
sulfur-free sponge will thermally shock the tip, causing steam recommended tool. Pliers and other inappropriate tools can
generated in the wiping process to remove oxidation. This damage the internal circuitry of the tip cartridge.
Material in this manual, IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies, was voluntarilyestablished
liability ofany kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting
IPC-7711/7721
Number: 2.8 Subject: Tip Care and Maintenance
Revision: B
Date: 11/07
NOTES
Page 2 of 2

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Association Connecting Electronics Industries

Rework, Modification and Repair

Developed by the Repairability Subcommittee (7-34) of the Product Assurance

Supersedes: Users of this publication are encouraged to participate in the development of

Standards Should: Standards Should Not:

* Contain simple (simplified) language - Increase cycle time

- Focus on end product performance - Contain anything that cannot

Thank you for your continued support.

Product Assurance Repairability Technical Liaisons of the

Peggi Blakley Sammy Yi

A Special Note of Appreciation

1 General ......................................................................... 1 1.8.7 Preheating (Auxiliary) Heating ....................... 5

1.3 Background ......................... 1 1.8.12 Tools and Supplies ............................................ 5

1.6 Training ............................... 3 1.8.14.1.1 Surface Mount Components ................... 6

2.2 Cleaning N/A N/A N/A

2.3.2 Coating Removal, Solvent Method R, F, W, C Advanced High

2.3.3 Coating Removal, Peeling Method R, F, W, C Advanced High

2.3.4 Coating Removal, Thermal Method K R, F, W, C Advanced High

2.3.5 Coating Removal, Grinding/Scraping R, F, W, C Advanced High

2.3.6 Coating Removal, Micro Blasting R, F, W, C Advanced High

2.4.2 Coating Replacement, Conformal R, F, W, C Intermediate High

Epoxy Mixing and Handling

2.7.2 Legend/Marking, Hand Lettering R, F, W, C Intermediate High

2.7.3 Legend/Marking, Stencil Method R, F, W, C Intermediate High

Tip Care and Maintenance

3.1 Through-Hole Desoldering

3.2 PGA and Connector Removal

3.3 Chip Component Removal

3.4 Leadless Component Removal

3.5 SOT Removal

3.6 Gull Wing Removal (two sided)

3.7 Gull Wing Removal (four sided)

3.8 J-Lead Removal

3.9 BGA/CSP Removal

3.10 PLCC Socket Removal

3.11 Bottom Terminated Component Removal

5.1 Through-Hole Installation

5.2 PGA and Connector Installation

5.3 Chip Installation

5.4 Leadless Component Installation

5.5 Gull Wing Installation

5.6 J-Lead Installation

5.7 BGA/CSP Installation

5.8 Bottom Terminated Device Installation

Blisters and Delamination

Bow & Twist

3.3.2 Hole Repair,Transplant Method R. W Expert High

Key and Slot Repair

3.4.2 Key and Slot Repair, Transplant / R, W Expert High

Base Material Repair

3.5.2 Base Material Repair, Area Transplant R, W Expert High

3.5.3 Base Material Repair, Edge R, W Expert High

4.1.2 Lifted Conductor Repair, Film R, F Intermediate High

4.2.2 Conductor Repair, Foil Jumper, Film R, F, C Advanced High

4.2.3 Conductor Repair, Welding Method R, F, C Advanced High

4.2.4 Conductor Repair, Surface Wire R, F, C Intermediate Medium

4.2.5 Conductor Repair, Through Board R Advanced Medium

4.2.6 Conductor Repair/Modification, R, F, C Expert Medium

4.2.7 Conductor Repair, Inner Layer R, F Expert High

4.3.2 Conductor Cut, Inner Layer R, F Advanced High