TAS6584-Q1

SLOSE94A – JANUARY 2022 – REVISED MARCH 2022

TAS6584-Q1 - 45-V, 10-A Digital Input 4-Channel Automotive Class-D Audio Amplifier
with Current Sense and Real-time Load Diagnostics
– Advanced spread-spectrum
1 Features
• AEC-Q100 qualified for automotive applications
2 Applications
– Temperature grade 1: –40°C to +125°C, TA • Automotive external amplifier
• General operation • Automotive head unit
– 4.5-V to 45-V supply voltage, 50-V load dump 3 Description
– Support for 1.8-V and 3.3-V I/O’s
– I2C control with 8 address options The TAS6584-Q1 is a four-channel, digital-input, high-
– <2-W idle power loss at 14.4 V, <8-uA max voltage, Class-D audio amplifier that supports up
VBAT+PVDD shutdown loss to 45-V supply voltage. In combination with up to
• Integrated DSP processing 10-A output current, this device delivers maximum
– Class-H supply voltage control output power and high fidelity audio in high and low
– Thermal monitoring and foldback impedance loads. The device provides four channels
– Clip detection, PVDD monitoring and foldback at 118 W (45 V, 8 Ω, 1% THD, BTL) and 215 W (45 V,
• Output current sensing by channel via I2S/TDM 4 Ω, 1% THD, BTL).
– No need for external circuitry The TAS6584-Q1 integrates DC and AC load
• Real-time load diagnostics diagnostics to determine the status of the connected
– Monitor output conditions while playing audio loads before enabling the output stage. During audio
– Open load, Shorted load, Short-to-power, playback, the status can be monitored through output
Short-to-ground detection current sense which is available for each channel and
• DC and AC Standby load diagnostics reports the measurement to a host processor through
• Audio inputs TDM with minimal delay. The device monitors the
– 2-4 channel I2S or 4-16 channel TDM input output load condition while playing audio using real-
– Input sample rates: 44.1, 48, 96, 192 kHz time load diagnostics which operate independent from
– Secondary low latency path, >70% reduced host and audio input.
signal delay at 48 kHz To optimize system efficiency, the integrated DSP of
• Audio outputs the TAS6584-Q1 enables Class-H envelope tracking
– 4-channel bridge-tied load (BTL), configurable control, eliminating the need for development of
2-channel parallel BTL (PBTL) complex tracking software and making local boost
– 384-kHz to 2.1-MHz configurable output voltage control possible without the need for an
switching frequency external microcontroller.
– Up to 10-A channel output current
– 400-VA peak BTL output power The TAS6584-Q1 device features an additional low-
– 118 W (45 V, 8 Ω, 1% THD, BTL) latency signal path for each channel, providing up to
– 215 W (45 V, 4 Ω, 1% THD, BTL) 70% faster signal processing at 48 kHz which enables
• Audio Performance time-sensitive Active Noise Cancellation (ANC), Road
Noise Cancellation (RNC) applications.
– THD+N 0.03% (8 Ω, 1 W, 1 kHz)
– 111 dB SNR The device is offered in a 64-pin QFP package with
– 37 µV (14.4 V), 80 µV (45 V) output noise the exposed thermal pad up.
• Protection
Device Information
– Output short protection
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
– DC offset, undervoltage and overvoltage
TAS6584-Q1 HTQFP (64) 14.00 mm x 14.00 mm
– Configurable overtemperature warning and
individual channel shutdown (1) For all available packages, see the orderable addendum at
– I2C temperature and supply voltage readout the end of the data sheet.
• Easily meet CISPR25-L5 EMC specification

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TAS6584-Q1
SLOSE94A – JANUARY 2022 – REVISED MARCH 2022 www.ti.com

4.5 -45V 1.8V / 3.3V

PVDD / VBAT DVDD

CH1
I2C
CH2
SoC / TAS6584-Q1
DSP I2S / CH3
TDM
CH4

Simplified Diagram

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 TAS6584-Q1
www.ti.com SLOSE94A – JANUARY 2022 – REVISED MARCH 2022

Table of Contents
1 Features............................................................................1 5.3 Receiving Notification of Documentation Updates......4
2 Applications..................................................................... 1 5.4 Support Resources..................................................... 4
3 Description.......................................................................1 5.5 Trademarks................................................................. 4
4 Revision History.............................................................. 3 5.6 Electrostatic Discharge Caution..................................4
5 Device and Documentation Support..............................4 5.7 Glossary......................................................................4
5.1 Device Support........................................................... 4 6 Mechanical, Packaging, and Orderable Information.... 4
5.2 Documentation Support.............................................. 4

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision * (January 2022) to Revision A (March 2022) Page

• Changed device status from Advanced Information to Production Data ........................................................... 1

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TAS6584-Q1
SLOSE94A – JANUARY 2022 – REVISED MARCH 2022 www.ti.com

5 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
5.1 Device Support

5.2 Documentation Support

5.2.1 Related Documentation

5.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
5.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
5.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

5.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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 PACKAGE OPTION ADDENDUM

www.ti.com 6-Apr-2022

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

TAS6584QPHDRQ1 ACTIVE HTQFP PHD 64 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 TAS6584

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 GENERIC PACKAGE VIEW
PHD 64 HTQFP - 1.2 mm max height
14 x 14, 0.8 mm pitch PLASTIC QUAD FLATPACK

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4224851/B

www.ti.com
 PACKAGE OUTLINE
PHD0064B HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
14.05
13.95 B
PIN 1 NOTE 3
INDEX AREA 8.00
64 6.68 49

48
1
THERMAL PAD
NOTE 4

14.05 8.00 16.15

13.95 6.68 15.85
NOTE 3 TYP

16
33
17 32

A 60 X 0.8 64 X 0.40
0.30
4 X 12 0.2 C A B

SEE DETAIL A
C
1.2 MAX
SEATING PLANE
(0.127) TYP

17 32

16 33

0.25
GAGE PLANE
1.05
0.95
0°-7°

0.15
0.75 0.05
0.1 C
0.45

DETAIL A
TYPICAL
1 48

64 49 4224850/B 05/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed
0.15 per side.
4. See technical brief. PowerPad Thermally Enhanced Package, Texas Instruments Literature No. SLMA002
(www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004) for information regarding recommended board layout.

www.ti.com
 EXAMPLE BOARD LAYOUT
PHD0064B HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
SYMM

64 49

64 X (1.5)

1
48

64 X (0.55)

60 X (0.8)

SYMM
(15.4)

33
(R0.05) TYP 16

17 32
(15.4)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 6X

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

METAL SOLDER MASK

OPENING
EXPOSED
EXPOSED METAL
METAL
SOLDER MASK METAL UNDER
OPENING SOLDER MASK
NON SOLDER MASK SOLDER MASK
DEFINED DEFINED

SOLDER MASK DETAILS

4224850/B 05/2022

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
7. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.

www.ti.com
 EXAMPLE STENCIL DESIGN
PHD0064B HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK

SYMM

64 49

64 X (1.5)

1
48

64 X (0.55)

60 X (0.8)

SYMM
(15.4)

33
(R0.05) TYP 16

17 32
(15.4)

SOLDER PASTE EXAMPLE

SCALE: 6X

4224850/B 05/2022

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

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