VL53L3CX

Datasheet

Time-of-Flight ranging sensor with multitarget detection

Features
• Fully integrated miniature module
– Emitter: 940 nm invisible laser (VCSEL) and its analog driver
– Low-power microcontroller running advanced digital firmware
– Size: 4.4 x 2.4 x 1 mm
• Fast, accurate distance ranging
– Histogram based technology
– Up to 300 cm+ detection with full field of view (FoV)
– Immune to cover glass cross-talk and fingerprint smudge at long distance
with patented algorithms (direct ToF)
– Dynamic fingerprint smudge compensation
– Short distance, high accuracy linearity
– Multitarget detection and distance measurement
• Typical full FoV: 25°
• Easy integration
– Reflowable component
– Part-to-part or generic shape crosstalk calibration available
– Single power supply
– Works with many types of cover glass materials
– I²C interface (up to 1 MHz)
– Xshutdown (reset) and interrupt GPIO to optimize ranging operation
– C and Linux® full set of software drivers for turnkey ranging

Application
• Service robots and vacuum cleaners (wall following and fast obstacle detection)
• Sanitary (robust user detection whatever the target reflectance)
• Smart buildings and smart lighting (user detection to wake up devices)
• IoT (user and object detection)
• Laser assisted autofocus (AF): enhances the camera AF system speed and
robustness, especially in difficult scenes (low light and low contrast); ideal
companion for phase-detection autofocus (PDAF) sensors.
• Video focus tracking assistance

DS13204 - Rev 6 - June 2022 www.st.com

For further information contact your local STMicroelectronics sales office.
 VL53L3CX

Description
The VL53L3CX is the latest Time-of-Flight (ToF) product from STMicroelectronics and embeds ST’s third
generation FlightSense patented technology. It combines a high performance proximity and ranging sensor,
with multitarget distance measurements and automatic smudge correction. The miniature reflowable package
integrates a single photon avalanche diode (SPAD) array and physical infrared filters to achieve the best ranging
performance in various ambient lighting conditions, with a wide range of cover glass windows.
The VL53L3CX combines the benefits of a high-performance proximity sensor, with excellent short distance
linearity, together with ranging capability up to 3 m.
With patented algorithms and ingenious module construction, the VL53L3CX is also able to detect different
objects within the FoV with depth understanding. The ST histogram algorithms allow cover glass crosstalk
immunity beyond 80 cm, and dynamic smudge compensation.

DS13204 - Rev 6 page 2/35

 VL53L3CX
Product overview

1 Product overview

1.1 Technical specification

Table 1. Technical specification

Feature Detail

Package Optical LGA12

Size 4.4 x 2.4 x 1 mm
Operating voltage 2.6 to 3.5 V
Operating temperature -20 to 85°C
Infrared emitter 940 nm
Up to 1 MHz (Fast mode plus) serial bus
I2C
Address: 0x52

1.2 System block diagram

Figure 1. VL53L3CX block diagram

VL53L3CX module

VL53L3CX silicon

Single Photon
Avalanche Diode (SPAD)
GND Detection array AVDD

SDA ROM XSHUT

Non Volatile
Memory
RAM
SCL GPIO1
Microcontroller

Advanced
Ranging Core

VCSEL Driver

AVSSVCSEL IR+ IR- AVDDVCSEL

940nm

DS13204 - Rev 6 page 3/35

 VL53L3CX
Device pinout

1.3 Device pinout

The figure below shows the pinout of the device.

Figure 2. Device pinout (bottom view)

GND3

GPIO1 7 6 5 XSHUT

DNC 8 4 GND2

SDA 9 3 GND

SCL 10 2 AVSSVCSEL

AVDD 11 12 1 AVDDVCSEL

GND4

Table 2. Device pin description

Pin number Signal name Signal type Signal description

1 AVDDVCSEL Supply VCSEL supply, to be connected to main supply

2 AVSSVCSEL VCSEL ground, to be connected to main ground
3 GND Ground To be connected to main ground
4 GND2 To be connected to main ground
5 XSHUT Digital input Xshutdown pin, active low
6 GND3 Ground To be connected to main ground
7 GPIO1 Digital output Interrupt output. Open drain output
8 DNC Digital input Do not connect, must be left floating
9 SDA Digital input/output I2C serial data
10 SCL Digital input I2C serial clock input
11 AVDD Supply Supply, to be connected to main supply
12 GND4 Ground To be connected to main ground

Note: AVSSVCSEL and GND are ground pins and can be connected together in the application schematics.
Note: GND2, GND3, and GND4 are standard pins that are forced to the ground domain in the application schematics
to avoid possible instabilities if set to other states.

DS13204 - Rev 6 page 4/35

 VL53L3CX
Application schematic

1.4 Application schematic

The figure below shows the application schematic of the device.

Figure 3. VL53L3CX schematic

IOVDD

AVDD
5 1
XSHUT AVDDVCSEL
7 11
GPIO1 AVDD
Caps as close as possible
HOST 9 2
SDA AVSSVCSEL to VL53L3CX
Rserial 100nF 4.7µF
10 3
SCL GND
Rserial
8 4
DNC GND2
6
Recommended for GND3
hardware interrupt 12
VL53L3CX GND4

Note: Capacitors on the external supply AVDD should be placed as close as possible to the AVDDVCSEL and
AVSSVCSEL module pins.
Note: External pull-up resistor values can be found in I2C-bus specification. Pull-ups are typically fitted only once per
bus, near the host. For suggested values see tables below.
Note: XSHUT pin must always be driven to avoid leakage current. A pull-up is needed if the host state is not known.
XSHUT is needed to use hardware standby mode (no I²C communication).
Note: XSHUT and GPIO1 pull-up recommended values are 10 kOhms. GPIO1 should be left unconnected if not used.
The tables below show recommended values for pull-up and series resistors for an AVDD of 1.8 V to 2.8 V in I²C
fast mode (up to 400 kHz) and fast mode plus (up to 1 MHz).

Table 3. Suggested pull-up and series resistors for I²C fast mode

I²C load capacitance (CL) Pull-up resistor (Ohms) Series resistor (Ohms)

CL ≤ 90 pF 3.6 k 0

90 pF < CL ≤ 140 pF 2.4 k 0

140 pF < CL ≤ 270 pF 1.2 k 0

270 pF < CL ≤ 400 pF 0.8 k 0

Table 4. Suggested pull-up and series resistors for I²C fast mode plus

I²C load capacitance (CL) Pull up resistor (Ohms) Series resistor (Ohms)

CL ≤ 90 pF 1.5 k 100

90 pF < CL ≤ 140 pF 1k 50

140 pF < CL ≤ 270 pF 0.5 k 50

270 pF < CL ≤ 400 pF 0.3 k 50

Note: For each bus line, CL is measured in the application PCB by the customer.

DS13204 - Rev 6 page 5/35

 VL53L3CX
Functional description

2 Functional description

2.1 System functional description

The figure below shows the system level functional description. The host customer application controls the device
using an application programming interface (API). The API implementation is delivered to the customer as a driver
(bare C code, or Linux driver).
The driver shares with the customer application a set of high-level functions that allow control of the device
firmware like initialization, ranging start/stop, setting the system accuracy.
The driver is a turnkey solution consisting of a set of “C” functions. This enables fast development of end-user
applications without the complication of direct multiple register access. The driver is structured so that it can be
compiled on any kind of platform, through a well abstracted platform layer. The driver package allows the user to
take full advantage of the device capabilities.
A detailed description of the driver is available in the device driver user manual.
The device firmware fully manages the hardware register accesses.
Section 2.2 State machine description details the firmware state machine.

Figure 4. VL53L3CX system functional description

HOST VL53L3CX
Customer VL53L3CX
Firmware Hardware
Application API/Driver
I2C

DS13204 - Rev 6 page 6/35

 VL53L3CX
State machine description

2.2 State machine description

The figure below shows the device state machine.

Figure 5. Device state machine

Power Off
Host applies AVDD
Host removes AVDD

HW Standby
Host raises XSHUT
Host lowers XSHUT

Initial Boot
Automatic move

SW Standby
Host initiates START

Self-Calibration
Automatic move

Continuous Next range starts

Host initiates STOP Ranging automatically after Host
has cleared the interrupt
Host clears interrupt

2.3 Customer manufacturing calibration flow

Up to three calibrations are needed to guarantee the best sensor performances. Offset and RefSpad calibration
are needed in all applications. If a cover glass is used, the crosstalk calibration is needed also.
“Generic shape” crosstalk calibration is also available. In this case, part-to-part calibration is not needed and a
standard set of calibration values is loaded.
The detailed procedure is provided in the device driver user manual.

2.4 Device programming and control

The VL53L3CX physical control interface is I²C, described in Section 3 Control interface.
A software layer (driver) is provided to control the device. This avoids complex I²C register operations with turnkey
functions to start, stop, and read the ranging values.
The driver structure and functions are described in the device driver user manual.

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 VL53L3CX
Ranging mode description

2.5 Ranging mode description

The VL53L3CX dedicated operating mode (called “preset”) is “ranging mode”. In this mode, the software driver
proposes turnkey to allow fast and easy ranging in all customer applications:
Ranging mode is the configuration to get the best of the VL53L3CX functionalities.
• Ranging mode is natively immune to cover glass crosstalk and smudge beyond 80 cm. With patented
algorithms (direct ToF), a temporal filtering is possible to distinguish crosstalk from the object signal over
long distances > 80 cm. A best-in-class ranging performance of 300 cm with the cover glass in place is now
possible, and can be reached with any computation unlike other sensors on the market.
• Ranging mode can detect several objects concurrently within the FoV. Up to four ranges can be output
simultaneously by the software driver, to indicate an object's range. Check the latest software driver manual
for further details.
• Ranging operation is performed by default at 30 Hz once the driver function is called (typical ranging
operation lasts 33 ms). It includes internal housekeeping, ranging and post-processing.
Note: Ranging mode requires a handshake between the host and the VL53L3CX, at each ranging operation. This
handshake is mandatory to ensure the right result is read by the host to continue the ranging operation.
Refer to Section 2.10 Handshake management.

2.6 Digital processing

Digital processing is the final operation of the ranging sequence that computes, validates or rejects a ranging
measurement. Part of this processing is performed by the VL53L3CX internal firmware and completed on the host
processor running the software driver.
At the end of digital processing, the ranging distance is computed by the VL53L3CX itself. If the distance cannot
be measured (no target or weak signal), a corresponding status error code is generated and can be read by the
host.
A full description of the status errors is provided inside the device driver user manual.

2.7 Reading the results

The VL53L3CX software driver provides turnkey functions to read output results after the measurement:
• Signal rate per object detected
• Ranging distance per object detected
• Min. and max. distances where object is located
A full description is provided inside the device driver user manual.

DS13204 - Rev 6 page 8/35

 VL53L3CX
Power sequence

2.8 Power sequence

2.8.1 Power up and boot sequence

There are two options available for device power up/boot.
Option 1: The XSHUT pin is connected and controlled from the host.
This option optimizes power consumption as the device can be completely powered off when not used, and then
woken up through the host GPIO (using the XSHUT pin).
HW standby mode is defined as the period when AVDD is present and XSHUT is low.

Figure 6. Power up and boot sequence

Option 2: The XSHUT pin is not controlled by the host, it is tied to AVDD through the pull-up resistor.
When the XSHUT pin is not controlled, the power-up sequence is presented in the figure below. In this case, the
device goes automatically to SW STANDBY after FW BOOT, without entering HW STANDBY.

Figure 7. Power up and boot sequence with XSHUT not controlled

Note: In both cases, tBOOT is 1.2 ms max.

Note: In both cases, XSHUT has to be raised only when AVDD is tied on.
Note: The VL53L3CX must only exit reset when there is no existing I²C transaction taking place on the bus. That is, do
not raise the XSHUT when there is an existing I²C command in progress, wait until the current I²C command has
completed.

DS13204 - Rev 6 page 9/35

 VL53L3CX
Ranging sequence

2.9 Ranging sequence

Figure 8. Ranging sequence

2.10 Handshake management

Once a ranging measurement is available, an interrupt is generated. This is communicated to the host as a
physical signal on the GPIO1 pin, which is driven low, and the output of a driver function. The former operating
method is called “hardware interrupt”, and the latter is referred as “polling mode”.
Once the host reads the result, the interrupt is cleared by the driver and the ranging sequence can repeat. If the
interrupt is not cleared, the ranging operation inside the VL53L3CX is on hold. The interrupt behavior allows a
good synchronization between the VL53L3CX and the host, avoids losing results if the host is not available to
acquire or process the data.
It is strongly recommended to use the hardware interrupt pin to manage this handshake.
For more details, refer to the device driver user manual.

DS13204 - Rev 6 page 10/35

 VL53L3CX
Control interface

3 Control interface

This section describes the control interface. The I²C interface uses two signals: serial data line (SDA) and serial
clock line (SCL). Each device connected to the bus uses a unique address and a simple master/slave relationship
exists.
Both SDA and SCL lines are connected to a positive supply voltage using pull-up resistors located on the host.
Lines are only actively driven low. A high condition occurs when lines are floating and the pull-up resistors pull
lines up. When no data is transmitted, both lines are high.
Clock signal (SCL) generation is performed by the master device. The master device initiates data transfer. The
I²C bus on the product device has a maximum speed of 1 Mbits/s and uses a default device address of 0x52.

Figure 9. Data transfer protocol

Acknowledge
Start condition

SDA
MSB LSB

SCL
S 7 8 P
1 2 3 4 5 6 Ac/Am
Address or data byte
Stop condition

Information is packed in 8-bit packets (bytes) always followed by an acknowledge bit, Ac for VL53L3CX
acknowledge and Am for master acknowledge (host bus master). The internal data is produced by sampling
SDA at a rising edge of SCL. The external data must be stable during the high period of SCL. The exceptions to
this are start (S) or stop (P) conditions when SDA falls or rises respectively, while SCL is high.
A message contains a series of bytes preceded by a start condition and followed by either a stop or repeated
start (another start condition but without a preceding stop condition) followed by another message. The first byte
contains the device address (0x52) and also specifies the data direction. If the least significant bit is low (that
is, 0x52) the message is a master-write-to-the-slave. If the LSB is set (that is, 0x53) then the message is a
master-read-from-the-slave.

Figure 10. VL53L3CX I²C device address: 0x52

MSBit LSBit

0 1 0 1 0 0 1 R/W

All serial interface communications with the Time-of-Flight sensor must begin with a start condition. The
VL53L3CX module acknowledges the receipt of a valid address by driving the SDA wire low. The state of
the read/write bit (LSB of the address byte) is stored and the next byte of data, sampled from SDA, can be
interpreted. During a write sequence, the second byte received provides a 16-bit index, which points to one of the
internal 8-bit registers.

DS13204 - Rev 6 page 11/35

 VL53L3CX
Control interface

Figure 11. VL53L3CX data format (write)

VL53L3CX acknowledges Acknowledge from VL53L3CX

Start valid address

S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As DATA[7:0] As P

0x52 (write)
Stop

As data are received by the slave, they are written bit by bit to a serial/parallel register. After each data byte is
received by the slave, an acknowledge is generated. The data are then stored in the internal register addressed
by the current index.
During a read message, the contents of the register addressed by the current index is read out in the byte
following the device address byte. The contents of this register are parallel loaded into the serial/parallel register,
and clocked out of the device by the falling edge of SCL.

Figure 12. VL53L3CX data format (read)

0x52 (write)
S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As P

0x53 (read)
S ADDRESS[7:0] As DATA[7:0] Am P

At the end of each byte, in both read and write message sequences, an acknowledge is issued by the receiving
device (that is, the VL53L3CX device for a write and the host for a read).
A message can only be terminated by the bus master, either by issuing a stop condition or by a negative
acknowledge (that is, not pulling the SDA line low) after reading a complete byte during a read operation.
The interface also supports auto-increment indexing. After the first data byte is transferred, the index is
automatically incremented by 1. The master can therefore send data bytes continuously to the slave until the
slave fails to provide an acknowledge, or the master terminates the write communication with a stop condition.
If the auto-increment feature is used the master does not have to send address indexes to accompany the data
bytes.

Figure 13. VL53L3CX data format (sequential write)

DS13204 - Rev 6 page 12/35

 VL53L3CX
I²C interface - timing characteristics

Figure 14. VL53L3CX data format (sequential read)

0x52 (write)
S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As P

0x53 (read)
S ADDRESS[7:0] As DATA[7:0] Am DATA[7:0] Am

DATA[7:0] Am DATA[7:0] Am DATA[7:0] Am P

3.1 I²C interface - timing characteristics

Timing characteristics are shown in the tables below. Refer to the figure below for an explanation of the
parameters used.
Timings are given for all PVT conditions.

Table 5. I²C interface - timing characteristics for fast mode plus (1 MHz)

Symbol Parameter Minimum Typical Maximum Unit

FI2C Operating frequency 0 1000 kHz

tLOW Clock pulse width low 0.5 —

µs
tHIGH Clock pulse width high 0.26 —

tSP Pulse width of spikes that are suppressed by the input filter — 50 ns

tBUF Bus free time between transmissions 0.5 —

tHD.STA Start hold time 0.26 —

µs
tSU.STA Start setup time 0.26 —
—
tHD.DAT Data in hold time 0 0.9

tSU.DAT Data in setup time 50 —

tR SCL/SDA rise time — 120 ns

tF SCL/SDA fall time — 120

tSU.STO Stop setup time 0.26 — µs

Ci/o Input/output capacitance (SDA) — 10

Cin Input capacitance (SCL) — 4 pF
CL Load capacitance — 140 550

DS13204 - Rev 6 page 13/35

 VL53L3CX
I²C interface - timing characteristics

Table 6. I²C interface - timing characteristics for fast mode (400 kHz)

Symbol Parameter Minimum Typical Maximum Unit

FI2C Operating frequency 0 400 kHz

tLOW Clock pulse width low 1.3 —

µs
tHIGH Clock pulse width high 0.6 —

tSP Pulse width of spikes that are suppressed by the input filter — 50 ns

tBUF Bus free time between transmissions 1.3 —

tHD.STA Start hold time 0.26 —

µs
tSU.STA Start setup time 0.26 —
—
tHD.DAT Data in hold time 0 0.9

tSU.DAT Data in setup time 50 —

tR SCL/SDA rise time — 300 ns

tF SCL/SDA fall time — 300

tSU.STO Stop setup time 0.6 — µs

Ci/o Input/output capacitance (SDA) — 10

Cin Input capacitance (SCL) — 4 pF
CL Load capacitance — 125 400

Figure 15. I²C timing characteristics

stop start start stop

VIH
SDA ... VIL

tBUF tLOW tR tF tHD.STA

VIH
SCL
VIL
...

tHD.STA tHD.DAT tHIGH tSU.DAT tSU.STA tSU.STO

IL or VIH.

DS13204 - Rev 6 page 14/35

 VL53L3CX
I²C interface - reference registers

3.2 I²C interface - reference registers

The registers shown in the table below can be used to validate the user I²C interface.

Table 7. Reference registers

Register name Index Value

Model_ID 0x010F 0xEA

Module_Type 0x0110 0xAA

Note: The I²C read/writes can be 8, 16 or 32-bit. Multi-byte reads/writes are always addressed in ascending order with
MSB first as shown in the table below. The customer must use the device software driver for easy and efficient
ranging operations to match performance and accuracy criteria. Hence full register details are not exposed. The
customer should refer to the device user manual.

Table 8. 32-bit register example

Register address Byte

Address MSB
Address + 1 ..
Address + 2 ..
Address + 3 LSB

DS13204 - Rev 6 page 15/35

 VL53L3CX
Electrical characteristics

4 Electrical characteristics

4.1 Absolute maximum ratings

Table 9. Absolute maximum ratings

Parameter Min. Typ. Max. Unit

AVDD -0.5 — 3.6

SCL, SDA, XSHUT, V
-0.5 — 3.6
and GPIO1

Caution: Stresses above those listed as "Absolute maximum ratings" may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operational sections of the specification is not implied. Exposure to maximum rating conditions
for extended periods may effect device reliability.

4.2 Recommended operating conditions

Table 10. Recommended operating conditions

There are no power supply sequencing requirements. The I/Os may be high, low or floating when AVDD is applied. The I/Os are
internally failsafe with no diode connecting them to AVDD
Parameter Min. Typ. Max. Unit

Voltage (AVDD) 2.6 2.8 3.5

Standard mode 1.6 1.8 1.9 V
IO (IOVDD) (1)
2V8 mode (2) 2.6 2.8 3.5

Ambient operating temperature range without damage (3) -20 85 °C

1. XSHUT should be high level only when AVDD is on.

2. SDA, SCL, XSHUT and GPIO1 high levels have to be equal to AVDD in 2V8 mode.
3. Performances described are given at 23°C ambient temperature.

4.3 Electrostatic discharge

The device is compliant with electrostatic discharge (ESD) values presented in the table below.

Table 11. ESD performances

Parameter Specification Condition

Human body model JS-001-2012 ± 2 kV, 1500 Ohms, 100 pF

Charged device model JESD22-C101 ± 500 V

DS13204 - Rev 6 page 16/35

 VL53L3CX
Current consumption

4.4 Current consumption

Table 12. Power consumption at ambient temperature

All current consumption values include silicon process variations. Temperature and voltage are nominal conditions (23°C and
2v8). All values include AVDD and AVDDVCSEL.
Parameter Min. Typ. Max. Unit

HW STANDBY 3 5 7
µA
SW STANDBY (2V8 mode) (1) 4 6 9

Active ranging average consumption (including VCSEL) (2) (3) 16 18 mA

1. In standard mode (1v8), pullups have to be modified, then SW STANDBY consumption is increased by 0.6 µA.
2. Active ranging is an average value, measured using default driver settings. Ranging mode is with default settings.
3. Peak current (including VCSEL) can reach 40 mA.

4.5 Digital input and output

Symbol Parameter Min. Typ. Max. Unit

Interrupt pin (GPIO1)

VIL Low level input voltage — 0.3 IOVDD

VIH High level input voltage 0.7 IOVDD —

V
VOL Low level output voltage (IOUT = 4 mA) — — 0.4

VOH High level output voltage (IOUT = 4 mA) IOVDD-0.4 —

FGPIO Operating frequency (CLOAD = 20 pF) 0 108 MHz

I2C interface (SDA/SCL)

VIL Low level input voltage -0.5 0.6

VIH High level input voltage 1.12 IOVDD+0.5 V

VOL Low level output voltage (IOUT = 4 mA) — — 0.4

Leakage current (1) — 10

IIL/IH µA
Leakage current (2) — 0.15

1. AVDD = 0 V
2. AVDD = 2.85 V; I/O voltage = 1.8 V

DS13204 - Rev 6 page 17/35

 VL53L3CX
Ranging performances

5 Ranging performances

5.1 Measurement conditions

In all measurement tables of the document, it is considered that:
1. The full FoV is covered (typically 25° is covered).
2. Charts used as targets are: grey (17% reflectance, N4.74 Munsell) and white (88% reflectance N9.5
Munsell).
3. Nominal voltage (2.8 V) and temperature (23°C)
4. The device is controlled through the driver using the default settings (refer to the user manual for driver
settings description).
5. Indoor (no IR) means there is no contribution of light in the band 940 nm ± 30 nm. Outdoor overcast
conditions means an illumination level of 0.7 W/m² back on the sensor, in the band 940 nm ± 30 nm.
6. No coverglass is present.
7. Typical samples used.

5.2 Minimum ranging distance

A target can be detected down to 10 mm.

5.3 Maximum ranging distance

The table below shows the ranging specification for the typical device bare module, without cover glass, at room
temperature (23°C), with nominal voltage (2.8 V), and full FoV covered.

Table 13. Maximum ranging capabilities with 30 ms timing budget

Target reflectance level,

Indoor (detection rate %) Outdoor overcast (detection rate %)
full FoV (reflectance %)

Typical: 310 cm @ 94% min. Typical: 100 cm @ 94% min.

White target (88%)
Minimum: 310 cm @ 50% min. Minimum: 110 cm @ 50% min.
Typical: 290 cm @ 94% min. Typical: 70 cm @ 94% min.
Light gray target (54%)
Minimum: 290 cm @ 50% min. Minimum: 90 cm @ 50% min.
Typical: 170 cm @ 94% min. Typical: 70 cm @ 94% min.
Gray target (17%)
Minimum: 200 cm@ 50% min. Minimum: 90 cm @ 50% min.

Note: In the table above:

• "Indoor" corresponds to no infrared
• "Outdoor overcast" corresponds to a parasitic noise of 10 kcps/SPAD for the device module. For reference,
this corresponds to a 1.2 W/m2 at 940 nm and is equivalent to 5 kLux daylight while ranging on a grey 17%
chart at 40 cm.
• Detection rate is the worst case percentage of measurements that return a valid measurement.
• The ranging distances reported are the ones reported by the driver by the parameter called RangeMilliMeter.

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 VL53L3CX
Ranging accuracy

5.4 Ranging accuracy

Ranging accuracy is defined as follows:
RangeMilliMeter − TargetDistance
RangingAccuracy = TargetDistance × 100
The ranging accuracy is a direct evaluation of the measurement, including offset errors and output noise.
At least 94% of the ranging values are within the declared ranges. This quality indicator includes measure-to-
measure and part-to-part dispersion.

Table 14. Ranging accuracy with 30 ms timing budget

Target reflectance level, full FoV Distance (mm) Indoor (no infrared) Outdoor overcast

25-90 ±10 mm ±10 mm

White target (88%) 90-110 ±5% ±9%
>110 ±2.5% ±7%
25-90 ±9 mm ±9 mm
Light gray target (54.5%) 90-110 ±5% ±7%
>110 ±3% ±8%
25-90 ±7 mm ±7 mm
Gray target (17%) 90-110 ±5% ±8%
>110 ±5% ±10%

Measurement conditions:
• Offset correction made at 10 cm from sensor
• Indoor: no infrared
• Outdoor: eq. 5 kLux equivalent sunlight (10 kcps/SPAD)
• Nominal voltage (2v8) and temperature (23°C)
• All distances are for a complete FoV covered
• Measurement is made on typical device bare modules

5.5 Ranging drift with temperature

When the temperature increases, the ranging value is affected by an offset of 1.3 mm per degree Celsius change.
This value is an offset and not a gain, and it does not depend on the target distance.
The VL53L3CX device embeds a feature that allows the temperature variation effect to be compensated, while
ranging.
When the ranging is started, the self-calibration is performed once and this allows to remove the ranging drift.
In order to get the best accuracy performances, it is recommended to perform a self-calibration when temperature
varies. This operation is realized calling in sequence the functions “stop” and “start”.

DS13204 - Rev 6 page 19/35

 Outline drawings
VL53L3CX

page 20/35
versions are transparent for the customer, since the pad and substrate design are identical for both versions and
have no impact on customer PCB design. Ranging performances, reflow, and technical parameters are identical
ST delivers any of the two alternative dual source cap assemblies as detailed in the drawings below. Both

CONTROLLED DOCUMENT PAGE 1/4

1 2 3 4 5 6 7 8
REVISIONS
REV. DESCRIPTION DATE
ADDED: NOTE 5, SHEEET 2 - TOP VIEW DETAILS ON TWO
3.00 CAPS, NEW ISOMETRIC VIEWS ON SHEETS 3 AND 4. 23 AUG 2017
A A
DRAFT NOTED ON PAGE 1. NEW NOTE 3 ON PAGE 1.
4.00 APERTURE DEPTHS FOR CAP ASSEMBLY DM00418317 1 SEPT 2017
+ 0.05
1 - 0.10

0.31 ±0.04
NOTED ON PAGE 2.
4.40 ±0.05 5.00 DRAFT OMITTED ON PAGE 1. LINER THICKNESS UPDATED. 29 SEPT 2017
0.50

0
0.665 3 IN 12 POS.
Z
B B
11 10 7 8 9
Figure 16. Outline drawing 1/4

1.60
2.40 ±0.05

VL53L3CX A
12 6
0.80 PLLL YMM
C C
1.20
for both module designs presented in the second figure below.

1 2 3 4 5
0
0.15 ±0.10
PIN 1

0
0.08

0.80

1.60

2.40

3.20
0.35 ±0.10
3.70
D D
CONNECTION TABLE
PAD No. FUNCTION
Notes: 1 AVDDVCSEL
PWB SOLDER PATTERN 1. DIMENSIONS MARKED ARE INSPECTION DIMENSIONS CHECKED AT OQC. 2 AVSSVCSEL
2. UNSPECIFIED RADII 0.05.
3. DIMENSIONS TO EDGE OF MOUDLE ARE CORRECT AT DATUM "Z". 3 GND

0.25
2.10
4. SHEET 3 SHOWS EXCLUSION CONES TO BE KEPT FREE OF MECHANICAL ITEMS WHICH 4 GND2
WILL INTERFERE WITH MODULE OPERATION; THEY ARE NOT SYSTEM PERFORMANCE 5 XSHUT
0.80
E CONES.
0.50
6 GND3 E
5. METAL CONNECTION PADS 1-12 ARE ELECTROLYTIC PLATED 0.0003 THK GOLD OVER
0.005 THK NICKEL. 7 GPIO1
0.50 0.08 6. EITHER 8575850 OR DM00418317 CAN BE USED FOR EWOK EVO MODULE ASSEMBLY. 8 DNC
DRAWINGS ARE SHOWN WITH DM00418317 BUT THE SAME DIMENSIONS ARE 9 SDA
0.80 1.85 APPLICABLE TO 8575850, UNLESS SPECIFIED. 10 SCL
11 AVDD
Tolerances, unless otherwise stated 12 GND4
Outline drawings

Interpret drawing per BS8888, Material

3RD Angle Projection Drawn Scale
Linear ALL DIMENSIONS IN mm Do Not Scale
F 0 Place Decimals 0 ±0.05 SEE INDIVIDUAL PARTS MR LOPEZ BORBONES 25:1 F
1 Place Decimals 0.0 ±0.05 Date
2 Place Decimals 0.00 ±0.05 Finish 31 JUL 2017 STMicroelectronics - Imaging Division
Angular ±2 degrees
Diameter +0.05 Part No. Title Sheet
Position 0.10 DM00392521 VL53L3CX MODULE OUTLINE DRAWING 1 OF 4
1 2 3 6 7 8
Copyright STMicroelectronics Unauthorized reproduction and communication strictly prohibited
NOTICE: This document may havebeenrevised since it was printed. Check Document Management System for latest version before using or copying.
{pN_1}
17-Oct-2017
5.0
ACTIVE
DM00392521 ST Restricted

DS13204 - Rev 6
6
 Outline drawings
VL53L3CX

page 21/35
CONTROLLED DOCUMENT PAGE 2/4
1 2 3 4 5 6 7 8
REV 5.00
FEATURE IN 2 POS. FEATURE IN 2 POS.
A A
1.28

3.12

0.33
0.63

1.29

1.90
2.20
2.50

3.11

3.78
4.08
0

0
0
0.33
0.63
B B
Figure 17. Outline drawing 2/4

1.78
2.08
C C
0.035 DEEP
0.20 ±0.02 0.40 ±0.02 0.201 ±0.015 0.40 ±0.02 IN 6 POS
0.38 ±0.10 0.58 ±0.10
0.01 0.01 DEEP 0.01 0.01 DEEP
D D
E E
8575850 CAP ASSEMBLY DM00418317 CAP ASSEMBLY
SCALE 15:1 SCALE 15:1
Tolerances, unless otherwise stated Interpret drawing per BS8888, Material
3RD Angle Projection Drawn Scale
Linear
ALL DIMENSIONS IN mm Do Not Scale
F 0 Place Decimals 0 ±0.05 SEE INDIVIDUAL PARTS MR LOPEZ BORBONES 25:1 F
1 Place Decimals 0.0 ±0.05 Date
2 Place Decimals 0.00 ±0.05
Finish 31 JUL 2017 STMicroelectronics - Imaging Division
Angular ±2 degrees
Diameter +0.05 Part No. Title Sheet
Position 0.10 DM00392521 VL53L3CX MODULE OUTLINE DRAWING 2 OF 4
1 2 3 6 7 8
Copyright STMicroelectronics Unauthorized reproduction and communication strictly prohibited
NOTICE: This document may havebeenrevised since it was printed. Check Document Management System for latest version before using or copying.
{pN_1}
17-Oct-2017
5.0
ACTIVE
DM00392521 ST Restricted

DS13204 - Rev 6
 Outline drawings
VL53L3CX

page 22/35
CONTROLLED DOCUMENT PAGE 3/4
1 2 3 4 5 6 7 8
REV 5.00
3
A A
1.20

B B
Figure 18. Outline drawing 3/4

0.665
25° 35°
C C
SCALE 20:1
D COLLECTOR EMITTER
EXCLUSION CONE EXCLUSION CONE D
0.22 OF CONE 0.43 OF CONE
AT DATUM 'A' AT DATUM 'A'
E E
A
SCALE 20:1
Tolerances, unless otherwise stated Interpret drawing per BS8888, Material
3RD Angle Projection Drawn Scale
Linear ALL DIMENSIONS IN mm Do Not Scale
F 0 Place Decimals 0 ±0.05 SEE INDIVIDUAL PARTS MR LOPEZ BORBONES 25:1 F
1 Place Decimals 0.0 ±0.05 Date
2 Place Decimals 0.00 ±0.05 Finish 31 JULY 2017 STMicroelectronics - Imaging Division
Angular ±2 degrees
Diameter +0.05 Part No. Title Sheet
Position 0.10 DM00392521 VL53L3CX MODULE OUTLINE DRAWING 3 OF 4
1 2 3 6 7 8
Copyright STMicroelectronics Unauthorized reproduction and communication strictly prohibited
NOTICE: This document may havebeenrevised since it was printed. Check Document Management System for latest version before using or copying.
{pN_1}
17-Oct-2017
5.0
ACTIVE
DM00392521 ST Restricted

DS13204 - Rev 6
 Outline drawings
VL53L3CX

page 23/35
CONTROLLED DOCUMENT PAGE 4/4
1 2 3 4 5 6 7 8
REV 5.00
DELIVERED CONFIGURATION
A A
0.15 ±0.15

B 0.20 ±0.20 4 B
Figure 19. Outline drawing 4/4

C C
SCALE 20:1
2.92

D D
0.05
R0.20
IN 4 POS PROTECTIVE LINER 1.05
E E
SCALE 20:1
Tolerances, unless otherwise stated Interpret drawing per BS8888, Material
3RD Angle Projection Drawn Scale
Linear ALL DIMENSIONS IN mm Do Not Scale
F 0 Place Decimals 0 ±0.05 SEE INDIVIDUAL PARTS MR LOPEZ BORBONES 30:1 F
1 Place Decimals 0.0 ±0.05 Date
2 Place Decimals 0.00 ±0.05 Finish 31 JUL 2017 STMicroelectronics - Imaging Division
Angular ±2 degrees
Diameter +0.05 Part No. Title Sheet
Position 0.10 DM00392521 VL53L3CX MODULE OUTLINE DRAWING 4 OF 4
1 2 3 6 7 8
Copyright STMicroelectronics Unauthorized reproduction and communication strictly prohibited
NOTICE: This document may havebeenrevised since it was printed. Check Document Management System for latest version before using or copying.
{pN_1}
17-Oct-2017
5.0
ACTIVE
DM00392521 ST Restricted

DS13204 - Rev 6
 VL53L3CX
Laser safety considerations

7 Laser safety considerations

The device contains a laser emitter and corresponding drive circuitry. The laser output is designed to remain
within Class 1 laser safety limits under all reasonably foreseeable conditions including single faults in compliance
with IEC 60825-1:2014 (third edition).
The laser output remains within Class 1 limits as long as STMicroelectronic’s recommended device settings are
used and the operating conditions specified are respected (particularly the maximum timing budget, as described
in the product user manual).
The laser output power must not be increased by any means and no optics should be used with the intention of
focusing the laser beam.
Caution: Use of controls or adjustments or performance of procedures other than those specified herein may result in
hazardous radiation exposure.

Figure 20. Class 1 laser product label

DS13204 - Rev 6 page 24/35

 VL53L3CX
Packaging and labeling

8 Packaging and labeling

8.1 Product marking

A two-line product marking is applied on the backside of the module (i.e. on the substrate). The first line is the
silicon product code, and the second line, the internal tracking code (see figure below).

Figure 21. Example of prototype marking

8.2 Inner box labeling

The labeling follows the ST standard packing acceptance specification.
The following information is written on the inner box label:
• Assembly site
• Sales type
• Quantity
• Trace code
• Marking
• Bulk ID number

8.3 Packing
At customer/subcontractor level, it is recommended to mount the device in a clean environment to avoid foreign
material deposition.
To help avoid any foreign material contamination at phone assembly level, the modules ar shipped in a tape and
reel format, starting from production version (cut1.1). The tape is described in the Figure 22. Tape outline drawing.
The packaging is vacuum-sealed and includes a desiccant.

DS13204 - Rev 6 page 25/35

 VL53L3CX
Tape and outline drawing

8.4 Tape and outline drawing

Figure 22. Tape outline drawing

DS13204 - Rev 6 page 26/35

 VL53L3CX
Lead-free solder reflow process

8.5 Lead-free solder reflow process

The figure and table below show the recommended and maximum values for the solder profile.
Customers have to tune the reflow profile depending on the PCB, solder paste, and material used. Customers
must follow the “recommended” reflow profile, which is specifically tuned for this specific device package.
If a customer must perform a reflow profile which is different from the “recommended” one (especially peak
>240°C), this new profile is qualified by the customer at their own risk. In any case, the profile has to be within the
“maximum” profile limit described in the table below.

Table 15. Recommended solder profile

Parameters Recommended Maximum Units

Minimum temperature (TS min) 130 150 °C

Maximum temperature (TS max) 200 200 °C
Time tS (TS min to TS max) 90-110 60 - 120 s

Temperature (TL) 217 217 °C

Time (tL) 55-65 55 - 65 s
Ramp up 2 3 °C/s

Temperature (Tp-10) — 250 °C

Time (tp-10) — 10 s
Ramp up — 3 °C/s

Peak temperature (Tp) 240 260 max °C

Time to peak 300 300 s

Ramp down (peak to TL) -4 -6 °C/s

Figure 23. Solder profile

Note: The temperature mentioned in the above table is measured at the top of the device package.
Note: The component is limited to a maximum of three passes through this solder profile.
Note: As the device package is not sealed, only a dry re-flow process should be used (such as convection re-flow).
Vapor phase re-flow is not suitable for this type of optical component.
Note: The device is an optical component and as such, it should be treated carefully. This would typically include using
a ‘no-wash’ assembly process.

DS13204 - Rev 6 page 27/35

 VL53L3CX
Handling and storage precautions

8.6 Handling and storage precautions

8.6.1 Shock precaution

Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject
to excessive shock, is dropped on the floor, or a tray/reel of units is dropped on the floor, it must be rejected, even
if no apparent damage is visible.

8.6.2 Part handling

Handling must be done with non-marring ESD safe carbon, plastic, or teflon tweezers. Ranging modules are
susceptible to damage or contamination. The customer is advised to use a clean assembly process after
removing the tape from the parts, and until a protective cover glass is mounted.
The sensor apertures are protected by a liner. This liner must be removed to ensure proper performance in the
final device. The liner should be removed at the latest possible step of the assembly process to help protect the
sensor from foreign material during the assembly process.

8.6.3 Compression force

A maximum compressive load of 25 N should be applied on the module.

8.6.4 Moisture sensitivity level

Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C.

8.7 Storage temperature conditions

Table 16. Recommended storage conditions

Parameter Min. Typ. Max. Unit

Temperature (storage) -40 23 85 °C

DS13204 - Rev 6 page 28/35

 VL53L3CX
Package information

9 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

DS13204 - Rev 6 page 29/35

 VL53L3CX
Ordering information

10 Ordering information

Table 17. Order codes

Order codes Package Packing Minimum order quantity

VL53L3CXV0DH/1 Optical LGA12 with liner Tape and reel 4500 pcs

DS13204 - Rev 6 page 30/35

 VL53L3CX
Acronyms and abbreviations

11 Acronyms and abbreviations

Acronym/abbreviation Definition

AF autofocus
API application programming interface
ESD electrostatic discharge
FoV field of view
FW firmware
I2C inter-integrated circuit (serial bus)
MSB most significant bit
NVM non volatile memory
PDAF phase-detection autofocus
SCL serial clock line
SDA serial data line
SPAD single photon avalanche diode
ToF Time-of-Flight
VCSEL vertical cavity surface emitting laser

DS13204 - Rev 6 page 31/35

 VL53L3CX

Revision history
Table 18. Document revision history

Date Version Changes

20-Dec-2019 1 Initial release

Update "Application" and "Description" on first page and following sections:
07-Feb-2020 2 Section 5.2 Minimum ranging distance, Section 5.3 Maximum ranging
distance, and Section 5.4 Ranging accuracy
11-Mar-2021 3 Update Figure 21. Example of prototype marking
Section 3 Control interface: replaced “camera module” with “Time-of-Flight”
13-Oct-2021 4
sensor.
18-Mar-2022 5 Update Figure 22. Tape outline drawing
29-Jun-2022 6 Updated: Figure 13. VL53L3CX data format (sequential write).

DS13204 - Rev 6 page 32/35

 VL53L3CX
Contents

Contents
1 Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Technical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 System functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 State machine description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Customer manufacturing calibration flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4 Device programming and control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.5 Ranging mode description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.6 Digital processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.7 Reading the results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.8 Power sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.8.1 Power up and boot sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.9 Ranging sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10 Handshake management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3 Control interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.1 I²C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2 I²C interface - reference registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.1 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.3 Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.5 Digital input and output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5 Ranging performances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
5.1 Measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.2 Minimum ranging distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.3 Maximum ranging distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.4 Ranging accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.5 Ranging drift with temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6 Outline drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
7 Laser safety considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

DS13204 - Rev 6 page 33/35

 VL53L3CX
Contents

8 Packaging and labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

8.1 Product marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
8.2 Inner box labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
8.3 Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
8.4 Tape and outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8.5 Lead-free solder reflow process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.6 Handling and storage precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.6.1 Shock precaution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.6.2 Part handling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.6.3 Compression force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.6.4 Moisture sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.7 Storage temperature conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
9 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
10 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
11 Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

DS13204 - Rev 6 page 34/35

 VL53L3CX

IMPORTANT NOTICE – READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names
are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2022 STMicroelectronics – All rights reserved

DS13204 - Rev 6 page 35/35