EMTB82A8D-32768K Roma

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ECLIPTEK

PART NUMBER DATA SHEET R

EMTB82A8D-32.768K CORPORATION
REGULATORY COMPLIANCE (Data Sheet downloaded on Nov 13, 2016)

2011/65 +
2015/863
169 SVHC

ITEM DESCRIPTION
Temperature Compensated MEMS Clock Oscillators TCMO LVCMOS (CMOS) 2.5Vdc 4 Pad 0.8mm x 1.5mm Chip Scale
Package (CSP) 32.768KHz -40°C to +85°C

ELECTRICAL SPECIFICATIONS
Nominal Frequency 32.768KHz
Frequency Stability ±5.0ppm Maximum (Inclusive of Operating Temperature Range, Output Load Change (±20%), and Reflow, at
Vdd=2.5Vdc)
Frequency Stability vs. Frequency ±5.0ppm Maximum (Measured at 25°C ±2°C, at Vdd=2.5Vdc, Post Reflow)
Tolerance
Frequency Stability vs. Input Voltage ±0.75ppm Maximum (±10%)
Frequency Stability vs. Aging ±1ppm/Year Maximum (at 25°C)
Operating Temperature Range -40°C to +85°C
Supply Voltage 2.5Vdc ±10%
Core Operating Current 0.99µA Typical (at 25°C), 1.52µA Maximum
Output Stage Operating Current 0.065µA/Vpp Typical, 0.125µA/Vpp Maximum
Input Current 1.2µA Typical (at 25°C), 1.9µA Maximum (No Load, Nominal Vdd)
Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH = -10µA)
Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL = +10µA)
Rise/Fall Time 100nSec Typical, 200nSec Maximum (Measured at 10% to 90% of waveform)
Duty Cycle 50 ±2(%) (Measured at 50% of waveform)
Load Drive Capability 15pF Maximum
Output Logic Type CMOS
Peak to Peak Jitter (tPK) 2.5µSec Maximum
Period Jitter (RMS) 33nSec Typical (Measured at 25°C)
Power Supply Ramp 100mSec Maximum (Measured at 0Vdc to 90% of Vdd)
Start Up Time 180mSec Typical, 380mSec Maximum (Measured at Nominal Vdd)
Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS


ESD Susceptibility JESD22-A114, HBM, 3000V
Flammability UL94-V0
Mechanical Shock MIL-STD-883, Method 2002, Condition E, 10,000G
Moisture Sensitivity J-STD-020, MSL 1
Solderability MIL-STD-883, Method 2003
Temperature Cycling JESD22-A104, Condition G
Vibration MIL-STD-883, Method 2007, Condition C, 70G

www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 07/14/2016 | Page 1 of 6


Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET R

EMTB82A8D-32.768K CORPORATION
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1 Ground
2 Output
0.84 0.60 0.315 3 Supply Voltage
±0.02 MAX ±0.015 (X4) 4 Ground
ORIENTATION

2 3 LINE MARKING
MARKING

1 XX
1.54 1.00 XX=Ecliptek Manufacturing
±0.02 ±0.05 Identifier

1 4 2 XXX
XXX=Ecliptek
Manufacturing Identifier
0.41 ±0.05 (continued)

Suggested Solder Pad Layout


All Dimensions in Millimeters

0.41 (X2)

DIA 0.25 (X4)


1.00 (X2)

Solder Land
(X4)

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 07/14/2016 | Page 2 of 6


Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET R

EMTB82A8D-32.768K CORPORATION
OUTPUT WAVEFORM

VOH
CLOCK OUTPUT

90% of Waveform

50% of Waveform

10% of Waveform
VOL

Fall Rise
TW
Time Time

T
Duty Cycle (%) = TW/T x 100

www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 07/14/2016 | Page 3 of 6


Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET R

EMTB82A8D-32.768K CORPORATION

Test Circuit for CMOS Output

Oscilloscope Frequency
Counter

Probe
Supply (Note 2)
Voltage
_ (VDD) Output
+ Current
Meter
+ +
0.01µF 0.1µF
Power Voltage (Note 1) (Note 1) CL
Supply Meter (Note 3)
_ _ Ground Ground

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is recommended.
Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and
High bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet
for ‘Load Drive Capability’.

www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 07/14/2016 | Page 4 of 6


Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET R

EMTB82A8D-32.768K CORPORATION
Recommended Solder Reflow Methods

High Temperature Infrared/Convection


TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP) 3°C/Second Maximum
Time Maintained Above:
- Temperature (TL) 217°C
- Time (tL) 60 - 150 Seconds
Peak Temperature (TP) 260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp) 20 - 40 Seconds
Ramp-down Rate 6°C/Second Maximum
Time 25°C to Peak Temperature (t) 8 Minutes Maximum
Moisture Sensitivity Level Level 1
Additional Notes Temperature shown are applied to body of device.

www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 07/14/2016 | Page 5 of 6


Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET R

EMTB82A8D-32.768K CORPORATION
Recommended Solder Reflow Methods

Low Temperature Infrared/Convection 240°C


TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP) 5°C/Second Maximum
Time Maintained Above:
- Temperature (TL) 150°C
- Time (tL) 200 Seconds Maximum
Peak Temperature (TP) 240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate 5°C/Second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperature shown are applied to body of device.

Low Temperature Manual Soldering


185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.)

www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 07/14/2016 | Page 6 of 6


Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
Mouser Electronics

Authorized Distributor

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Ecliptek:
EMTB82A8D-32.768K

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