Quick Specs

QuickSpecs HP Pro Mini 260 G9 Desktop PC
Overview
HP Pro Mini 260 G9 Desktop PC
1. Type-C® SuperSpeed USB 10Gbps signaling rate port 4. Combo Audio Jack with CTIA and OMTP headset support
(charge support up to 5V/3A) 5. Dual-state power button
2. Type-A SuperSpeed USB 5Gbps signaling rate port 6. Hard drive activity light
3. Type-A Hi-Speed USB 480Mbps signaling rate port
(charge support up to 5V/1.5A)
Not Shown
(2) M.2 (1 as M.2 2230 socket for WLAN/BT and 1 as M.2
2280 socket for storage)
(1) 2.5" internal storage drive bay
Not all configuration components are available in all regions/countries. Page 1

c08060742 — DA 17032 — EMEA — Version 2 — June 9, 2022
Overview
HP Pro Mini 260 G9 Desktop PC
1. DisplayPort™ 1.4a (DP++) 8. Type-A SuperSpeed USB 5Gbps signaling rate port
2. HDMI 1.4b 9. Flex Port 21, choice of:
3. Type-A SuperSpeed USB 5Gbps signaling rate port • Serial • Dual Type-A Hi-Speed USB
4. Type-A Hi-Speed USB 480Mbs signaling rate port (2) • 2 External Antenna
nd 480Mbps signaling rate port
5. Cover release thumbscrew 10. RJ45 Network connector
6. Standard cable lock slot (10 mm) 11. External WLAN antenna opening
7. Serial port 12. Power connector
13. Retractable Padlock loop
1. Must be configured at time of purchase
At A Glance
• 12th Generation Intel® processors (up to Core™ i5), featuring integrated Intel® UHD Graphics
• Choice of Windows 11 Professional, Windows 11 Home, and FreeDOS Up to 64GB of DDR4 Synchronous Dynamic Random
Access Memory (SDRAM)
• Optional M.2 PCIe NVMe solid state drives (SSD) enabling faster system startup and application launches
• Support for up to two monitors via one standard HDMI 1.4b and one standard Display Port 1.4a.
• Serial port support comes standard, with ability to configure one additional for a total of two, enabling support for legacy
peripherals
• Integrated 10/100/1000 Ethernet Controller
• Optional Wi-Fi 6E, Wi-Fi 6 and Wi-Fi 5 (802.11ac) connectivity
• Trusted Platform Module (TPM) 2.0
• VESA mounting incorporated into chassis design
• Dust filter available
• High efficiency energy saving power supply
• PC chassis and all internal components and modules are manufactured with low halogen content
• Protected by HP Services, including limited warranties up to 1-1-1(terms and conditions vary by country; certain
restrictions and exclusions apply); Care Packs available with up to 5 years Next Business Day Onsite Hardware Support
• Compliance with CE (Class B) / FCC (Class B) / UL (UL60950-1 / UL62368-1) / CSA (CSA C22.2 No.60950-1-07 / CSA C22.2
No. 62368-1-14) / ICES-003 / CCC / VCCI (Class B) / KCC (Class B)
NOTE: See important legal disclosures for all listed specs in their respective features sections.

Standard Features and Configurable Modules
OPERATING SYSTEMS
Preinstalled Windows 11 Pro1
Windows 11 Pro Education1
Windows 11 Home - HP recommends Windows 11 Pro for business1
Windows 11 Home Single Language - HP recommends Windows 11 Pro for business1
Windows 11 Pro (Windows 11 Enterprise available with a Volume Licensing Agreement)1
Windows 10 Pro (available through downgrade rights from Windows 11 Pro)1,2
FreeDOS
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware,
drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled.
ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com.
2. This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and provision for
recovery software. You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall one
version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating systems to avoid
loss of your data.
NOTE: In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on products configured
with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7 drivers on http://www.support.hp.com.
PROCESSORS
Intel® 12th Generation Core™ Processors
Intel® Core™ i5-1235U Processor1
15W
1.3GHz base frequency
Up to 4.4 GHz max. Turbo frequency with Intel® Turbo Boost Technology2
12MB cache, 10 cores, 12 threads
Intel® Iris® Xe Graphics
Intel® Core™ i3-1215U Processor1

15W
1.2GHz base frequency
Intel® UHD Graphics
Intel® Pentium® Processors

Intel® Pentium® Gold 8505 Processor1
15W
1.2 GHz base frequency
Intel® Celeron® Processors

Intel® Celeron® 7305 Processor1
15W
1.1 GHz base frequency
1. Multi-core is designed to improve performance of certain software products. Not all customers or software applications will necessarily
benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and
software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance.


2. Intel® Turbo Boost technology requires a PC with a processor with Intel Turbo Boost capability. Intel Turbo Boost performance varies
depending on hardware, software and overall system configuration. See http://www.intel.com/technology/turboboost for more
information.
GRAPHICS
Integrated
Intel® UHD Graphics, Intel® Iris® Xe Graphics1
NOTE: Intel® integrated UHD Graphics varies by processor
1: Intel® Iris® Xe Graphics1 only support on Intel® Core™ i5-1245U, i5-1235U
STORAGE
2.5 inch SATA Hard Disk Drives (HDD)
500GB* 7200RPM 2.5in SATA HDD
1TB* 7200RPM 2.5in SATA HDD
M.2 PCIe NMVe Solid State Drives (SSD)

256GB* M.2 2280 PCIe NVMe SSD
512GB* M.2 2280 PCIe NVMe SSD
1TB* M.2 2280 PCIe NVMe SSD
256GB* M.2 2280 PCIe NVMe Three Layer Cell SSD
512GB* M.2 2280 PCIe NVMe Three Layer Cell SSD
1TB* M.2 2280 PCIe NVMe Three Layer Cell SSD
2TB* M.2 2280 PCIe NVMe Three Layer Cell SSD
256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD**
512GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD**
*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for
Windows) of system disk is reserved for the system recovery software.
**NOTE: Storage DriveLock does not work with Self Encrypting or Optane based storage.


MEMORY
Type
DDR4-3200(Transfer rates up to 3200MT/s)
Maximum
64GB capacity
Memory Configurations
2 SODIMMs
4GB (4GB x 1)
8GB (4GB x 2)
8GB (8GB x 1)
16GB (8GB x 2)1
16GB (16GB x 1)
32GB (16GB x 2)1
32GB (32GB x 1)
64GB (32GB x 2)
1. For Dual channel memory, due to the non-industry standard nature of some third-party memory modules, we recommend HP branded
memory to ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed
NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available due to system
resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.
NOTE: Memory modules support data transfer rates up to 3200 MT/s; actual data rate is determined by the system's configured processor. See
processor specifications for supported memory data rate.
NOTE: All memory slots are customer accessible / upgradeable.
NETWORKING/COMMUNICATIONS
Networking
Intel® I219-V Gigabit Network Connection LOM (Non-vPro)
Wireless
Realtek RTL8821CE Wi-Fi 51 (802.11ac) 1x1 with Bluetooth® M.2 Combo Card
Intel® Wi-Fi 6E2 AX211 802.11ax 2x2 with Bluetooth® M.2 Combo Card non-vPro™
Realtek 8852BE Wi-Fi 6 with Bluetooth 5.2 M.2 Combo Card
1. Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac)
is backwards compatible with prior 802.11 specs.
2. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E
is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported.
3. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 6 (802.11ax)
is backwards compatible with prior 802.11 specs
KEYBOARDS/POINTING DEVICES
Keyboard
HP 125 Wired Keyboard
HP USB Business Slim Wired SmartCard CCID Keyboard
Mouse
HP Wired Desktop 320M Mouse


HP Wired 125 Mouse
HP Wired 128 Laser Mouse
NOTE: Availability may vary by country


SECURITY
TPM 2.01 (FW: 7.85) endpoint security controller (Infineon SLB9670) shipped with Windows 10. Common Criteria EAL4+
Certified. FIPS 140-2 Level 2 Certified.
Intrusion Sensor (integrated in the system board, can be enabled/disabled through BIOS)
Support for chassis cable lock devices
Support for chassis padlocks devices
SATA port disablement (via BIOS)
Serial, USB enable/disable (via BIOS)
Removable media write/boot control
Power-on password (via BIOS)
Setup password (via BIOS)
1. In some scenarios, machines pre-configured with Windows OS might ship with TPM turned off
PORTS
Internal slots and Ports
(1) M.2 PCIe x1 2230 (for WLAN)
(1) M.2 PCIe x4 2280 (for storage)
(1) Integrated SATA storage connector
NOTE: For Desktop Mini with M.2 Storage config, there will be no SATA drive bracket. If you plan to use or upgrade the storage with any 2.5"
SATA drive, please select a DM SATA Drive Bracket (available as both factory configured and after market option).
Bays
2.5" Internal Storage Drive
Standard User Accessible Ports

Front (1) Type-C® SuperSpeed USB 10Gbps signaling rate port
(1) Type-A Hi-Speed USB 480Mbps signaling rate port
(1) Type-A SuperSpeed USB 5Gbps signaling rate port
(1) Combo Audio Jack with CTIA and OMTP headset support
Rear (2) Type-A SuperSpeed USB 5Gbps signaling rate port

(2) Type-A Hi-Speed USB 480Mbps signaling rate port
(1) Display Port 1.4a
(1) HDMI 1.4b
(1) RJ45
(1) Serial (RS-232)
Configurable Non-PCIe/PCI Slot User Accessible Ports

Rear Flexible Port, choice of Serial (RS-232), 2nd External antenna


USB SPECIFICATION AND MARKETING NAME MAPPING TABLE
Marketing Name Technical Terminology
Hi-Speed USB 480Mbps signaling rate USB 2.0
SuperSpeed USB 5Gbps signaling rate USB 3.2 Gen 1
SuperSpeed USB 10Gbps signaling rate USB 3.2 Gen 2
SuperSpeed USB 20Gbps signaling rate USB 3.2 Gen 2x2


SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
Software
HP Desktop Support Utilities
myHP
HP Notifications
HP Support Assistant1
HP QuickDrop3
HP Smart Support4
Buy Office (Sold separately)
Manageability Features
HP Cloud Recovery2
Client Security Software

McAfee LiveSafe™ (1 year subscription)5
1. HP Support Assistant requires Windows and Internet access.
2. HP Cloud Recovery is available for select HP desktops and laptops PCs with Intel® or AMD processors and requires an open, wired network
connection. Note: You must back up important files, data, photos, videos, etc. before use to avoid loss of data. Detail please refer to:
https://support.hp.com/us-en/document/c05115630.
3. HP Quick Drop requires Internet access and Windows 10 or higher PC preinstalled with HP QuickDrop app and either an Android device (phone
or tablet) running Android 7 or higher with the Android HP QuickDrop app, and /or an iOS device (phone or tablet) running iOS 12 or higher with
the iOS HP QuickDrop app.
4. HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data
and health insights and is available preinstalled on select products, thru HP Factory Configuration Services; or it can be downloaded. For more
information about how to enable HP Smart Support or for download, please visit http://www.hp.com/smart-support.
5 Availability may vary by country. McAfee LiveSafe 30-day free trial offer (Internet access required. First 30 days included. Subscription
required for live updates afterwards.)


UNIT ENVIRONMENT AND OPERATING CONDITIONS
ENERGY STAR® certified models available
ENERGY STAR® certified. EPEAT® registered where applicable. Based on US EPEAT® registration according to IEEE 1680.1-2018
EPEAT®. EPEAT® status varies by country. Visit http://www.epeat.net for more information.
Low halogen (chassis, all internal components and modules)1
TAA compliant models available
1. External power supplies, power cords, cables and peripherals are not Low Halogen. Service parts obtained after purchase may not be Low
Halogen.
General Unit Operating Guidelines

• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is
operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-
circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign
matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.
Temperature Range Operating: 50° to 95° F (10° to 35° C)2
Non-operating: -22° to 140° F(-30° to 60° C)
Relative Humidity Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 0% to 95% (non-condensing at ambient)
Maximum Altitude (unpressurized) Operating: 10,000 ft (3048 m)
Non-operating: 30,000 ft (9144 m)
2. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight.
Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.


ENVIRONMENTAL & INDUSTRY
Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may
& declarations be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT Gold registered in the United States. See http://www.epeat.net for registration
status in your country.
• TCO Certified
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label
• Commission Regulation (EC) No 617/2013 (ErP Lot 3)
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Desktop model is based on a “Typically Configured Desktop”.
Energy Consumption
(in accordance with US
115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
ENERGY STAR® test
method)
Normal Operation (Short
4.9000 W 5.0100 W 4.7000 W
idle)
Normal Operation (Long
1.3700 W 1.4500 W 1.2100 W
idle)
Sleep 1.3500 W 1.4300 W 1.1900 W
Off 0.5000 W 0.5200 W 0.4600 W
NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does
not offer ENERGY STAR® certified configurations, then energy efficiency data listed is for a typically configured
PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
Normal Operation (Short
16.7090 BTU/hr 17.0841 BTU/hr 16.0270 BTU/hr
idle)
Normal Operation (Long
4.6717 BTU/hr 4.9445 BTU/hr 4.1261 BTU/hr
idle)
Sleep 4.6035 BTU/hr 4.8763 BTU/hr 4.0579 BTU/hr
Off 1.7050 BTU/hr 1.7732 BTU/hr 1.5686 BTU/hr
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for
one hour.
Declared Noise
Sound Power Sound Pressure
Emissions
(LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured –
2.7 17
Idle
Fixed Disk – Random
2.9 17
writes


Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
• 2 SODIMM memory slots

• Interchangeable M.2 PCIe NVME SSD & 2.5” SATA HDD
Spare parts are available throughout the warranty period and or for up to 5 years after the end of
production.
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS)
directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe
Drinking Water and Toxic Enforcement Act of 1986).
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.
• This product contains 0% post-consumer recycled plastic (by wt.)
• This product is 95.1% recycle-able when properly disposed of at end of life.
Packaging Materials External: PAPER/Corrugated 450 g

PAPER/Molded Pulp 74 g
Internal: PLASTIC/Polyethylene low density - LDPE 5g
The plastic packaging material contains at least 30% recycled content.
The corrugated paper packaging materials contains at least 35% recycled content.
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer
to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently
handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has
been voluntarily removed from most applications.
• Radioactive Substances


• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest
HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers.
These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
HP Inc. For more information about HP’s commitment to the environment:
Corporate
Environmental Global Citizenship Report
Information http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K
_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
SERVICE AND SUPPORT

On-site Warranty1: Three-year (3-3-3) or one-year (1-1-1) limited warranty delivers three years or one year of on-site, next
business day2 service for parts and labor and includes free support 24 x 73. Three-year onsite and labor are not available in
all countries. Service offers terms up to 5 years by choosing an optional HP Care Pack. To choose the right level of service for
your HP product, visit HP Care Pack Central: http://www.hp.com/go/cpc.4
1. Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in your region.
2. On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not available in
certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
3. Technical telephone support applies only to HP-configured and third-party HP qualified hardware and software. Toll-free calling and 24 x 7
support may not be available in some countries.
4. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware
purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP services are governed by the applicable HP terms and
conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to
applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided
with your HP Product.

Technical Specifications – Graphics
GRAPHICS
Intel® UHD Graphics (integrated)1
Graphics Controller Integrated
HDMI Supports HDMI 1.4b features
Supports HDCP 2.2
Supports audio over HDMI
DisplayPort Supports DisplayPort 1.4a
Memory The actual amount of maximum graphics memory can be >4GB. System memory is allocated for
graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an
optimal balance between graphics and system memory use.
Maximum Color Depth up to 10 bits/color
Graphics/Video API Support HEVC 10b Enc/Dec HW
VP9 10b Dec HW
HDR
Rec. 2020
DX12
Max. Resolution (VGA) 2048 x 1536@60Hz
Max. Resolution (HDMI) 4096 x 2160@60Hz

Technical Specifications – Storage
STORAGE
500GB 7200RPM 2.5in SATA HDD
Capacity 500GB
Rotational Speed 7,200 rpm
Interface SATA 6 Gb/s
Buffer Size Up to 128MB
Logical Blocks 976,773,168
Seek Time 12 ms (Average)
Height 0.283in/7.2mm (Max)
Width 2.75in/70mm (nominal)
Operating Temperature 41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for
1TB 7200RPM 2.5in SATA HDD

Capacity 1TB
Logical Blocks 1,953,525,168
Height 0.283in/7.2 mm (Max)

Capacity 1TB
Seek Time 12ms (Average)
Height 0.283in/7.2mm (Max.)


Capacity 2TB
Buffer Size 128MB
Height 0.374in/9.5mm (Max.)
Width (nominal) 2.75in/70mm (nominal)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows)
of system disk is reserved for the system recovery software.
256GB M.2 2280 PCIe NVMe SSD

Drive Weight < 10g
Capacity 256GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIe NVMe
Maximum Sequential Read 3200MB/s ±20%
Maximum Sequential Write 2000MB/s ±20%
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features TRIM; L1.2
512GB M.2 2280 PCIe NVMe SSD

Drive Weight < 10g
Capacity 512GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIe NVMe
Features TRIM; L1.2


1TB M.2 2280 PCIe NVMe SSD
Drive Weight < 10g
Capacity 1TB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIe NVMe
Features TRIM; L1.2
256GB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 256GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIE Gen4x4
Features TRIM; L1.2; Pyrite 2.0
512GB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 512GB
Height 2.3 mm
Length 80 mm
Width 22 mm

1TB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 1TB
Height 2.3 mm
Length 80 mm
Width 22 mm
2TB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 2TB
Height 2.3 mm
Length 80 mm
Width 22 mm


256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight < 10g
Capacity 256GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Features TRIM; L1.2; TCG Opal 2.0
512GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight < 10g
Capacity 512GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Features TRIM; L1.2; TCG Opal 2.0

Technical Specifications – Networking
NETWORKING AND COMMUNICATIONS

Intel® I219v 1 Gigabit Network Connection LOM (non-vPro)
Connector RJ-45
System Interface PCI (Intel proprietary) + SMBus
Data rates supported 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10, 100 & 1000 Mbit/s
IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
IEEE 802.3i 10BASE-T
IEEE 802.3u 100BASE-TX
IEEE 802.3ab 1000BAE-T
IEEE 802.3bz 2.5GBASE-T
Performance TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode only)
Jumbo Frame 9K
Power consumption Cable Disconnetion: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power ACPI compliant – multiple power modes
Management Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Management Interface Auto MDI/MDIX Crossover cable detection
IT Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up Frame);
Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Manageability Intel® non vPro™ support with appropriate Intel® chipset components


Intel AX211 Wi-Fi 6E +BT 5.2 M.2 160MHz CNVi WW WLAN1
Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified
Frequency Band 802.11b/g/n/ax
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
• 5.955 – 6.415 GHz
• 6.435 – 6.515 GHz
• 6.535 – 6.875 GHz
• 6.895 – 7.115 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: 1733Mbps
• 802.11ax: max 2.4Gbps
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM

, 1024QAM
Security2 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models
Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power3 • 802.11b: +17dBm minimum
• 802.11g: +16dBm minimum
• 802.11a: +17dBm minimum
• 802.11n HT20(2.4GHz): +14dBm minimum


• 802.11n HT20(5GHz): +14dBm minimum
• 802.11ac VHT80(5GHz): +10dBm minimum
• 802.11ax HE40(2.4GHz): +12dBm minimum
• 802.11ax HE80(5GHz): +10dBm minimum
Power Consumption • Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 •802.11b, 1Mbps: -93.5dBm maximum
•802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11a/g, 54Mbps: -72dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11n, MCS15: -64dBm maximum
• 802.11ac, MCS0(VHT80): -84dBm maximum
• 802.11ac, MCS9(VHT80): -59dBm maximum
• 802.11ac, MCS9(VHT160): -58.5dBm maximum
•802.11ax, MCS11(HE40): -57dBm maximum
•802.11ax, MCS11(HE160): -53.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN
MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 1216: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED OFF – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Technology
Bluetooth® Specification 4.0/4.1/4.2/5.0/5.1/5.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Channels Legacy: 0~79 (1 MHz/CH)
BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels


Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth® Software Supported Microsoft Windows Bluetooth Software
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications
Low Voltage Directive IEC950
UL, CSA, and CE Mark

Bluetooth Profiles Supported BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.2
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
1. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless
router, sold separately, that supports 80MHz and higher channels. Wireless access point and Internet service required and sold separately.
Availability of public wireless access points limited. Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must
fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM
modulation).


Realtek RTL8852AE 802.11ax 2x2 Wi-Fi 6 + BT5.2 (802.11ax 2x2, supporting gigabit data rate)1
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified modules
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: max 866.7Mbps
• 802.11ax: max 1201Mbps

BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security2 • IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only
• IEEE 802.11i
• WAPI
Models
Output Power3 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum


Power Consumption • Transmit mode:2.5 W
• Receive mode:2 W
• Idle mode (PSP): 180 mW (WLAN Associated)
• Idle mode:50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW
Receiver Sensitivity4 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11n, MCS07: -67dBm maximum
802.11ac, MCS0: -84dBm maximum
2. Type 1216: 1.67 x 12.0 x 16.0 mm
2. Type 126: 1.3g
LED Activity LED Amber – Radio OFF;
LED OFF – Radio ON
Bluetooth® Specification 4.0/4.1/4.2/5.0/5.1 Compliant/5.2 Compliant
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5)
or 864 kbps symmetric (3-EV5)
transmit power of + 4 dBm for BR and EDR.
Peak (Rx): 230 mW

Bluetooth® Software Supported Link Microsoft Windows Bluetooth Software
Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications Low Voltage Directive IEC950

LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
BT5.1
ESR9/10 Compliance
2Mbps LE
LE Long Range
1. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is
backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported.
modulation).


Realtek 802.11a/b/g/n/ac (1x1) Wi-Fi 5 and Bluetooth® 4.2 Combo1
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Frequency Band 802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n/ac
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 150Mbps
• 802.11ac: max 433.3Mbps
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security2 • IEEE and Wi-Fi certified 64 / 128 bit WEP encryption for a/b/g mode only
• IEEE 802.11i
• WAPI

Models
Output Power3 • 802.11b: +14dBm minimum
• 802.11g: +12dBm minimum
• 802.11a: +12dBm minimum
Power Consumption • Transmit mode 2.0 W
• Receive mode 1.6 W


• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW

Antenna type High efficiency antenna.
One embedded dual band 2.4/5 GHz antenna is provided to the card to support WLAN
communications and Bluetooth communications
Dimensions Type 2230: 2.3 x 22.0 x 30.0 mm
Weight Type 2230: 2.8g
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetoothâ Specification 4.0/4.1/4.2 Compliant
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Transmit Power USB 2.0 compliant
Power Consumption Microsoft Windows Bluetooth Software
Bluetooth Software Supported Link Microsoft Windows ACPI, and USB Bus Support
®
Topology
Power Management FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications 4.0/4.1/4.2 Compliant

Certifications Low Voltage Directive IEC950

LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
1. Wireless access point and internet service required and sold separately. Availability of public wireless access points limited.
Wi-Fi 5 (802.11 ac) is backwards compatible with prior 802.11 specs.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).


Realtek RTL8852BE 802.11ax 2x2 Wi-Fi 6 + BT5.2 (802.11ax 2x2, supporting gigabit data rate)1
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: max 866.7Mbps
• 802.11ax: max 1201Mbps
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security2 • IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only
• IEEE 802.11i
• WAPI
Models
Output Power3 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum


Power Consumption • Transmit mode:2.5 W
• Receive mode:2 W
• Idle mode:50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW
802.11ax, MCS11(HE40): -57dBm maximum
802.11ax, MCS11(HE80): -54dBm maximum
2. Type 1216: 1.67 x 12.0 x 16.0 mm
2. Type 126: 1.3g
Bluetoothâ Specification 4.0/4.1/4.2/5.0/5.1 Compliant/5.2 Compliant
Peak (Rx): 230 mW

Electrical Interface Microsoft Windows Bluetooth Software
Bluetooth® Software Supported Microsoft Windows ACPI, and USB Bus Support
Link Topology
Power Management FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications ETS 300 328, ETS 300 826
Low Voltage Directive IEC950

Peak (Tx): 330 mW
Peak (Rx): 230 mW
Power Management Microsoft Windows Bluetooth Software
Certifications
LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
BT5.1
ESR9/10 Compliance
2Mbps LE
LE Long Range
1. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless
router, sold separately, that supports 80MHz and higher channels. Wireless access point and Internet service required and sold separately.
Availability of public wireless access points limited. Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs.
modulation).

Technical Specifications – Audio
INPUT/OUTPUT DEVICES
HP USB 125 (Antimicrobial)/128 Laser Mouse (China only)
Dimensions (H x L x W) 112 x 63 x 36.2 mm (L x W x H)
Weight 85 g
Environmental Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature -22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Electrical Operating voltage 5 VDC, +/-5%
Power consumption (typical) 100mA
Resolution 1,200 DPI
Sensor Optical/ Laser USB mouse sensor
Tracking speed 30 inch/sec (max)
Tracking acceleration 8G(max), 1G=9.8m/s2
Mechanical Connector USB
Cable length 6 ft (1.8 m)
Color Jack Black
Regulatory approvals Compliant UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC, EAC
HP Wired Desktop 320M Mouse

Keys Left/right key
Physical Characteristics Dimensions(L x W x H) 4.09 x2.50 x 1.40 in (103.8x 63.4 x 35.5 mm)
Weight 0.16 lb(72g)
Operating voltage 5 VDC, +/-0.25V
Power consumption 100 mA Max
Electrical System interface USB Port

ESD Contact Discharge: 8 KV Air Discharge: 15 KV (Class B)
European Standard EN 55022: 2006+A1: 2007, Class B.
EMI - RFI
FCC/CFR 47: Part 15 Class B
Keycaps 0.3mm key travel
Key actuation 75±20g
Mechanical
Key life 1million cycles
Key structure type Tact Switch


Key-leveling mechanisms N/A
Operating temperature 10° to 90° C
Non-operating temperature -30° C to 95° C
Operating humidity N/A
Operating shock N/A
i. Half-Sine Shock – End-Use Handling, Non-Operational
Sample size: 5pcs.
Condition: Sample power off.
Axis: X, Y, Z axis (all 6 faces) – sample normal mode of operation.
Number of shocks: 1 shock/face.
Pulse duration: < 3 ms
Velocity change: 50lps (inch-per-second)- 65lps desired.
ii. Trapezoidal Shock- Transportation Environment, Non-Operational

Non-operating shock
Sample size: 5pcs.
Condition: Sample power off.
Orientation: All six faces: Front, Rear, Left, Right, Bottom, and Top.
Configuration: As intended for shipment
Environmental Number of shocks: 1 shock/face.
Minimum faired acceleration: 30G’s. Test also at 40 and 50G’s to find
margin.
Velocity change: 266lps (inch-per-second) for product mass (m)
20<m<40lbs.
Frequency (Hz) Slope (dB/oct) PSD (g2/Hz)
5-350 0 0.0001
Operating vibration 350-500 -6 -
500 - 0.00005
(~0.21Gnms)
Total Test time: 10 minutes
Frequency (Hz) Slope (dB/oct) PSD (g2/Hz)
5.100 0 0.015
Non-operating vibration 100-137 -6 -
137-350 0 0.008
350-500 -6 -
500 - 0.0039
Drop (out of box) 76cm on carpet, six-drop sequence
Drop (in box) N/A
Approvals CB, CE, FCC, cULus, ICES, EAC, NOM-NYCE SCT, RCM, VCCI, KC, BSMI
Ergonomic compliance TUVGS


HP USB Business Slim Wired SmartCard CCID Keyboard
Physical Characteristics Keys 104, 105, 109 layout (depending upon country)
Dimensions 17.34 x 5.68 x 0.78in (440.6 x 144.5 x 1.98 cm)
(L x W x H)
Weight 1.32 lb (598g)
Electrical Operating voltage 5 VDC, +/-5%
Power consumption 100mA (All LED on)
System interface USB Type A plug connector
ESD Contact Discharge: 8 KV Air Discharge: 12.5 KV
EMI - RFI Conforms to FCC rules for a Class B computing device
Mechanical Keycaps Low-profile design
Switch actuation 60±10g nominal peak force with tactile feedback
Switch life 10 million keystrokes (Life tester)
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft (1.8 m)
Environmental Acoustics 43-dBA maximum sound pressure level
Operating temperature 50° to 122° F (10° to 50° C)
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence
Approvals CE Marking, TUV, EAC, FCC, cULus/CSAus, ICES, RCM, VCCI, KCC, BSMI
Ergonomic compliance ISO 9241-4, TUVGS


HP 125 (Antimicrobial) Wired Keyboard (China only)
Physical Characteristics Keys 104/105/107/109layout (depending upon country)
Dimensions 436 x 138 x24.7 mm
(L x W x H)
Weight 471g
Electrical Operating voltage 5V +- 5%
Power consumption 50mA
System interface USB Type A plug connector
ESD Contact Discharge: 8 KV Air Discharge: 12.5 KV
EMI - RFI Conforms to FCC rules for a Class B computing device
Mechanical Keycaps Low-profile design
Switch actuation 55±10g nominal peak force with tactile feedback
Switch life 10 million keystrokes (Life tester)
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 1.8 m
Environmental Acoustics 43-dBA maximum sound pressure level
Operating temperature 50° to 122° F (10° to 50° C)
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence
Approvals UL, cUL, FCC, CE, TUV GS, VCCI, BSMI, RCM, KCC, USB-IF, WHQL, EN/IEC 60601-1
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS


AUDIO/MULTIMEDIA
Type Integrated
HD Stereo Codec Realtek ALC3252
Audio I/O Ports Front: Headset connector supports a CTIA and OMTP style headset and is retaskable as a Line-in,
Line-out, Microphone-in or Headphone-out port
Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only. External speakers must be powered
externally
Multi-streaming Capable Playback multi-streaming allows independent audio
streams to be sent to/from the front jacks and integrated speaker.
Sampling Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1 kHz
to 192 kHz for DAC and 44.1 kHz to 96 kHz for ADC
Wavetable Syntheses Yes - Uses OS soft wavetable
Analog Audio Yes
# of Channels on Line-Out Stereo (Left & Right channels)
Internal Speaker Yes

Technical Specifications – Power
POWER SUPPLY
Operating Voltage Range 90Vac~264Vac
Rated Voltage Range 100Vac~240Vac
Rated Line Frequency 50Hz~60Hz
Operating Line Frequency 47Hz~63Hz
Rated Input Current with 65W≦ 1.6A
Energy Efficient* Power Average efficiency 88% at 115V
Supply Average efficiency 89% at 230V
DC Output +19.5V
Current Leakage (NFPA 99: Less than 500 microamps of leakage current at 264 Vac with the ground wire disconnected, as
2102) required for Non-patient Electrical Appliances and Equipment used in a patient care facility or
that contact patients in normal use. Per section 10.3.5.1.
Less than 100 microamps of leakage current at 264 Vac with the ground wire intact with normal
polarity, as required for Non-patient Electrical Appliances and Equipment used in a patient care
facility or that contact patients in normal use. Per section 10.3.5.1.
Power cord length 6.0 ft. (1.83 m)
Dimensions 90 x 51 x 28.5mm & 102 x 55 x 30mm

Technical Specifications – Weights and Dimensions
WEIGHT AND DIMENSIONS 1

System
Dimensions 6.97 x 6.89 x 1.35 in
177 x 175 x 34.2 mm
Weight2 2.74 lbs
1.25 kg
Volume 64 cu in
1.05 L
Packaging dimensions and weight

Dimensions 19.57 x 5.04 x 8.78 in
497 x 128 x 223 mm
MPP/EPE: 19.61 x 9.25 x 5.20 in
498 x 235 x 132 mm
Weight 7.36 lbs
3.34 kg
MPP/EPE: 7.50 lbs
3.40 kg
Palletization and Container
Pallet Profile 1 unit/carton
18 cartons/layer
5~6 layers per pallet max depending on details of air freight
90~108 units per pallet depending on details of air freight
MPP/EPE: 1 unit/carton
10 cartons/layer
10~19 layers per pallet max depending on details of ground/sea freight
100~190 units per pallet depending on details of ground/sea freight
Pallet Size Loaded 45.354 x 39.13 x 57.80 in
1152 x 994 x 1468 mm
MPP/EPE: 46.26 x 39.21 x 103.74 in
1175 x 996 x 2635 mm
1. Packaging material used will vary by country
2. Configured with 1 SATA Drive

After-Market Options (availability may vary by region)
Type Description Part Number

Graphics Solutions HP HDMI Standard Cable Kit T6F94AA
HP DisplayPort™ To HDMI True 4k Adapter 2JA63AA
HP DisplayPort™ Cable Kit VN567AA
HP DisplayPort™ To VGA Adapter AS615AA
HP DisplayPort™ To DVI-D Adapter FH973AA
Desktop Mini Accessories HP Desktop Mini 2.5" SATA Drive Bay kit v2 13L70AA
HP Desktop Mini LockBox V2 3EJ57AA
HP Desktop Mini DVD-Writer ODD Expansion Module K9Q83AA
HP Desktop Mini I/O Expansion Module K9Q84AA
HP Desktop Mini Security/Dual VESA Sleeve v3 13L67AA
HP Desktop Mini Security/Dual VESA Sleeve v3 With Power Supply Holder 13L68AA
HP B300 PC Mounting Bracket with Power Supply Holder 7DB37AA
HP Desktop Mini Vertical Chassis Stand G1K23AA
HP DM Power Supply Holder Kit v2 7DB38AA
HP Desktop Mini Port Cover v3 13L69AA
HP Integrated Work Center Stand 5 G1V61AA
Data Storage Drives HP PCIe NVME TLC 256GB SSD M.2 Drive 1CA51AA
HP PCIe NVME TLC 512GB SSD M.2 Drive X8U75AA
Input Devices HP Wired Desktop 320K Keyboard 9SR37AA

HP USB Business Slim SmartCard CCID Keyboard Z9H48AA
HP Wired Desktop 320MK Mouse and Keyboard 9SR36AA
HP Wired Desktop 320M Mouse 9VA80AA
HP 125 Wired Keyboard 266C9AA
HP 125 Wired Mouse 265A9AA
HP 128 Laser Wired Mouse 265D9AA
HP 225 Wired Mouse and Keyboard Combo 286J4AA
HP 225 Antimicrobial Wired Mouse and Keyboard Combo (China Only) 286K3AA
Multimedia Devices HP S101 Speaker Bar 5UU40AA

HP Stereo 3.5mm Headset G2 428K7AA
HP Stereo USB Headset G2 428K6AA
HyperX Cloud MIX – Gaming Headset (Black-Gunmetal) 4P5K9AA
HyperX Cloud Flight – Wireless Gaming Headset (Black-Red) 4P5L4AA

After-Market Options (availability may vary by region)
HyperX Cloud Stinger Core – Gaming Headset (Black) 4P4F4AA

HyperX Cloud Core + 7.1 Gaming Headset (Black) 4P4F2AA
HyperX SoloCast USB WHT Microphone (Black) 4P5P8AA
Security Devices HP Dual Head Keyed Cable Lock T1A64AA

HP Keyed Cable Lock 10mm T1A62AA
HP Master Keyed Cable Lock 10mm T1A63AA
Stands and Mounting

Accessories HP B250 PC Mounting Bracket 8RA46AA
HP B300 PC Mounting Bracket 2DW53AA
HP B500 PC Mounting Bracket 2DW52AA
HP Quick Release Bracket 2 6KD15AA

© Copyright 2022 HP Development Company, L.P.

The information contained herein is subject to change without notice. The only warranties for HP products are set forth in the
express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an
additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
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Change Log
Date of change: Version History: Description of change:
June 9, 2022 From v1 to v2 Update Environmental table certifications updated
From v2 to v3
From v3 to v4
From v4 to v5
From v5 to v6
From v6 to v7


Quick Specs

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QuickSpecs HP Pro Mini 260 G9 Desktop PC

Not all configuration components are available in all regions/countries. Page 1

Not all configuration components are available in all regions/countries. Page 2

Standard Features and Configurable Modules

Intel® Core™ i3-1215U Processor1

Intel® Pentium® Processors

Intel® Celeron® Processors

Not all configuration components are available in all regions/countries. Page 3

Standard Features and Configurable Modules

M.2 PCIe NMVe Solid State Drives (SSD)

Not all configuration components are available in all regions/countries. Page 4

Standard Features and Configurable Modules

Not all configuration components are available in all regions/countries. Page 5

Standard Features and Configurable Modules

Not all configuration components are available in all regions/countries. Page 6

Standard Features and Configurable Modules

Standard User Accessible Ports

Rear (2) Type-A SuperSpeed USB 5Gbps signaling rate port

Configurable Non-PCIe/PCI Slot User Accessible Ports

Not all configuration components are available in all regions/countries. Page 7

Standard Features and Configurable Modules

Not all configuration components are available in all regions/countries. Page 8

Standard Features and Configurable Modules

Client Security Software

Not all configuration components are available in all regions/countries. Page 9

Standard Features and Configurable Modules

General Unit Operating Guidelines

Not all configuration components are available in all regions/countries. Page 10

Standard Features and Configurable Modules

Not all configuration components are available in all regions/countries. Page 11

Standard Features and Configurable Modules

• 2 SODIMM memory slots

Packaging Materials External: PAPER/Corrugated 450 g

Not all configuration components are available in all regions/countries. Page 12

Standard Features and Configurable Modules

SERVICE AND SUPPORT

Not all configuration components are available in all regions/countries. Page 13

Technical Specifications – Graphics

Not all configuration components are available in all regions/countries. Page 14

Technical Specifications – Storage

1TB 7200RPM 2.5in SATA HDD

1TB 5400RPM 2.5in SATA HDD

Not all configuration components are available in all regions/countries. Page 15

Technical Specifications – Storage

256GB M.2 2280 PCIe NVMe SSD

512GB M.2 2280 PCIe NVMe SSD

Not all configuration components are available in all regions/countries. Page 16

Technical Specifications – Storage

256GB M.2 2280 PCIe NVMe Three Layer Cell SSD

512GB M.2 2280 PCIe NVMe Three Layer Cell SSD

Not all configuration components are available in all regions/countries. Page 17

Technical Specifications – Storage

1TB M.2 2280 PCIe NVMe Three Layer Cell SSD

2TB M.2 2280 PCIe NVMe Three Layer Cell SSD

Not all configuration components are available in all regions/countries. Page 18

Technical Specifications – Storage

Not all configuration components are available in all regions/countries. Page 19

Technical Specifications – Networking

NETWORKING AND COMMUNICATIONS