HP 250 15.6 Inch G9 Notebook PC
HP 250 15.6 Inch G9 Notebook PC
HP 250 15.6 Inch G9 Notebook PC
6 inch G9 Notebook PC
Overview
HP 250 15.6 inch G9 Notebook PC
Left
Overview
Right
Overview
AT A GLANCE
NOTE: See important legal disclosures for all listed specs in their respective features sections.
Technical Specifications
PRODUCT NAME
HP 250 15.6 inch G9 Notebook PC
OPERATING SYSTEM
Preinstalled Windows 11 Pro 1
Windows 11 Pro Education1
Windows 11 Home – HP recommends Windows 11 Pro for business 1
Windows 11 Home Single Language – HP recommends Windows 11 Pro for business 1,2
Windows 11 Home Education – HP recommends Windows 11 Pro for business 1
FreeDOS
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows is
automatically updated and enabled. High speed internet and Microsoft account required. ISP fees may apply and additional
requirements may apply over time for updates. See http://www.windows.com.
2. This computer is preinstalled with Windows 11 Home Single Language.
PROCESSORS
Max Frequency
L3
Processor 3,4,5,6,7 Cores Threads Base Frequency
Cache 1-core and 2- 3-core and 4-core
core burst burst
Intel® Pentium® Silver N6000 4 4 4MB 3.3 GHz 3.1 GHz 1.1 GHz
Intel® Core™ 12 4 8 16 18MB 4.7 GHz 3.4 GHz 2.1 GHz 1.5 GHz
i7-1260P
Intel® Core™ 12 4 8 16 12MB 4.4 GHz 3.3 GHz 1.2 GHz 1.3 GHz
i5-1240P
Intel® Core™ 10 2 8 12 12MB 4.4 GHz 3.3 GHz 1.3 GHz 0.9 GHz
i5-1235U
Technical Specifications
Intel® Core™ 6 2 4 8 10MB 4.4 GHz 3.3 GHz 1.2 GHz 0.9 GHz
i3-1215U
3. Multicore is designed to improve performance of certain software products. Not all customers or software applications will
necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application
workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement
of higher performance.
4. Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.
5. Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See
http://www.intel.com/technology/turboboost for more information.
6. Max Boost clock frequency performance varies depending on hardware, software and overall system configuration.
7. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on
products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7
drivers on http://www.support.hp.com.
CHIPSET
Chipset is integrated with processor.
GRAPHICS
Integrated
Intel® UHD Graphics
Intel® Iris® Xᵉ Graphics 8
Discrete
NVIDIA® GeForce® MX550 (2 GB DDR6 dedicated) 9
Supports
Support HD decode, DX12, HDMI 1.4b 10
8. Intel® Iris® Xᵉ Graphics capabilities require system to be configured with Intel® Core™ i5 or i7 processors and dual channel
memory. Intel® Iris® Xᵉ Graphics with Intel® Core™ i5 or 7 processors and single channel memory will only function as UHD
graphics.
9. Integrated graphics depends on processor. NVIDIA® Optimus™ technology requires an Intel processor, plus an NVIDIA®
GeForce® discrete graphics configuration and is available on Windows 10 Pro OS. With NVIDIA® Optimus™ technology, full
enablement of all discrete graphics video and display features may not be supported on all systems (e.g. OpenGL applications
will run on the integrated GPU or the APU as the case may be).
10. HD content required to view HD images.
Technical Specifications
DISPLAY
Non-Touch
39.6 cm (15.6") diagonal, FHD (1920 x 1080), Low Blue Light, anti-glare, UWVA, micro-edge, 300 nits, sRGB 100% eDP
1.4+PSR2 10.11.12
39.6 cm (15.6") diagonal, FHD (1920 x 1080), anti-glare, SVA, micro-edge, 250 nits, 45% NTSC eDP 1.2 10.11.12
39.6 cm (15.6") diagonal, FHD (1920 x 1080), anti-glare, UWVA, micro-edge, 250 nits, 45% NTSC eDP 1.2 10.11.12
39.6 cm (15.6") diagonal, HD (1366x768), anti-glare, SVA, micro-edge, 250 nits, 45% NTSC eDP 1.2 10.11.12
HDMI
Port supports resolutions up to 1920 x 1080 external resolution @60 Hz
Display Size
15.6" diagonal
39.6 cm (15.6") diagonal
13. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
11) is reserved for system recovery software.
14. JSL don't support dual storage due to design limitation.
Technical Specifications
MEMORY
Maximum Memory
32 GB DDR4-3200 SDRAM15,16
Memory
8 GB DDR4-2933 SDRAM (1 x 8 GB) 15,16
4 GB DDR4-2933 SDRAM 15,16
32 GB DDR4-3200 SDRAM (2 x 16 GB) 15,16
16 GB DDR4-3200 SDRAM (1 x 16 GB) 15,16
16 GB DDR4-3200 SDRAM (2 x 8 GB) 15,16
12 GB DDR4-3200 SDRAM (1 x 8 + 1 x 4GB) 15,16
8 GB DDR4-3200 SDRAM (1 x 8 GB) 15,16
8 GB DDR4-3200 SDRAM (2 x 4 GB) 15,16
4 GB DDR4-3200 SDRAM (1 x 4 GB) 15,16
Memory Slots
1 SODIMM (Intel Pentium/Celeron speed runs up to 2933) 15,16
Support Single Channel Memory
2 SODIMM (Intel 12th Generation Intel Core processor) (Core i 3/5/7 speed runs up to 3200) 15,16
Both slots are customer non-accessible / non-upgradeable
Supports Dual Channel Memory
NETWORKING/COMMUNICATIONS
WLAN
Realtek RTL8822CE 802.11ac 2x2 Wi-Fi® + Bluetooth® 5.0 Wireless Card 17
Realtek RTL8852BE 802.11ax 2x2 Wi-Fi + Bluetooth® 5.3 Wireless Card 18
Realtek RTL8821CE 802.11a/b/g/n/ac (1x1) Wi-Fi® with Bluetooth® 4.2 Wireless Card 17
Miracast
Compatible with Miracast-certified devices (For Win11) 19
Ethernet
Realtek RTL8111HSH 10/100/1000 Integrated NIC. 20
17. Wireless access point and internet service required and sold separately. Availability of public wireless access points
limited. Wi-Fi 5 (802.11 ac) is backwards compatible with prior 802.11 specs.
18. Wireless access point and internet service required and sold separately. Availability of public wireless access points
limited. Wi-Fi 6 is backwards compatible with prior 802.11 specs.
19. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.
20. The term "10/100/1000" or "Gigabit" Ethernet indicates compatibility with IEEE standard 802.3ab for Gigabit Ethernet,
and does not connote actual operating speed of 1 Gb/s. For high-speed transmission, connection to a Gigabit Ethernet server
and network infrastructure is required.
Technical Specifications
AUDIO/MULTIMEDIA
Audio
2 Integrated stereo speakers
Integrated dual array microphone
Speaker Power
2W/4ohm
Camera
720p HD camera with Temporal Noise Reduction 11
Pointing Device
Touchpad with multi-touch gesture support (PTP certified)
Function Keys
F1 - Open " How to get help in Windows 11" webpage
F2 - Brightness Down
F3 - Brightness Up
F4 - Display Switching
F5 - Blank
F6 - Mute
F7 - Volume Down
F8 -Volume Up
F9 - Previous
F10 - Play/Pause
F11 - Next
F12 - Airplane mode
Technical Specifications
SOFTWARE AND SECURITY
Software
MYOffice
MyHP
HP QuickDrop21
HP Privacy Settings
HP SUPPORT ASSISTANT 22
HP Audio Switch
HP Connection Optimizer
HP PC Hardware Diagnostics
HP Smart Health
HP Smart23
Manageability Features
Touchpoint Customizer for Consumer
NOTE: To enhance brightness, level go to the Intel® Graphics Command Center app, click on System and turn off the Display
Power Savings function.
Security Management
McAfee Security (30 days free trial as default) 24
Express VPN (30 days free trial)
LastPass password manager
Discrete TPM 2.0 (select model) / Firmware TPM 2.0 25
Fingerprint Reader 26
21. HP Quick Drop requires Internet access and Windows 10 and higher PC preinstalled with HP QuickDrop app and either an
Android device (phone or tablet) running Android 7 or higher with the Android HP QuickDrop app, and /or an iOS device (phone
or tablet) running iOS 12 or higher with the iOS HP QuickDrop app.
22. HP Support Assistant requires Windows and Internet access.
23. HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level
configuration data and health insights and is available preinstalled on select products, thru HP Factory Configuration
Services; or it can be downloaded. For more information about how to enable HP Smart Support or for download, please visit
http://www.hp.com/smart-support.
24. 30-day McAfee® LiveSafe™ trial included. Internet access required and not included. Subscription required after
expiration. See www.McAfee.com for more details.
25. Firmware TPM is version 2.0. Hardware TPM is v1.2, which is a subset of the TPM 2.0 specification version v0.89 as
implemented by Intel Platform Trust Technology (PTT).
26. HP Fingerprint sensor is an optional feature that must be configured at purchase.
Technical Specifications
POWER
Power Supply
HP Smart 65 W External AC power adapter 27
HP Smart 65 W EM External AC power adapter 27
HP Smart 45 W External AC power adapter 27
Battery
HP Long Life 3-cell, 41 Wh Li-ion Polymer 28,29
Compliant with UL 1642 Standard
Power Cord
1M (3.28 feet) length power cord
Battery Life
Up to 8 hours 20 minutes 30
Battery Weight
0.42 Ib
0.19 kg
Technical Specifications
WEIGHTS & DIMENSIONS
Product Weight
Starting at 3.84 lb31
Starting at 1.74 kg31
Product Dimensions (W x D x H)
14.09 x 9.53 x 0.78 in
35.8 x 24.2 x 1.99 cm
31. Weight will vary by configuration. Does not include power adapter.
PORTS/SLOTS
Ports
2 SuperSpeed USB Type-A 5Gbps signaling rate (USB 3.2 Gen 1)
1 SuperSpeed USB Type-C® 5Gbps signaling rate (Supports data transfer only and does not support charging or external
monitors)
1 HDMI v1.4b 32
1 RJ-45
1 AC Power
1 Headphone/microphone combo jack
Expansion Slots
support SD/SDHC/SDXC
1 multi-format digital media reader
Technical Specifications
SERVICE AND SUPPORT
HP Services offers 1-year limited warranties and 90 day software limited warranty options depending on country. Batteries
have a default one year limited warranty except for Long Life batteries which will have same 1-year or 3-year limited
warranty as the platform. Refer to http://www.hp.com/support/batterywarranty/ for additional battery information. On-
site service and extended coverage is also available. HP Care Pack Services are optional extended service contracts that go
beyond the standard limited warranties. To choose the right level of service for your HP product, use the HP Care Pack
Services Lookup Tool at: http://www.hp.com/go/cpc. 33
33. HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your
geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit
www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or indicated to
Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and
such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with
your HP Product.
Technical Specifications
SYSTEM UNIT
Stand-Alone Power Requirements
(AC Power)
Nominal Operating Voltage 19.5 V
Average Operating Power 6.3W
Integrated graphics Yes
Discrete Graphics N/A (Switchable graphics design)
Technical Specifications
34. Configurations of the HP 250 G9 Notebook PC that are ENERGY STAR® qualified are identified as HP 250 G9 Notebook PC
ENERGY STAR on HP websites and on http://www.energystar.gov.
35. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status varies by country. Visit
http://www.epeat.net for more information.
DISPLAYS
NOTE: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may
vary either higher or lower.
1. Actual brightness will be lower with touchscreen or HP Sure View.
15.6 in FHD (1920 x 1080) Outline Dimensions (W x H) 350.66*215.34(With PCBA) typ +/- 0.5
Anti-Glare UWVA Low Blue 344.16 x 193.59 typ
Light sRGB NWBZ 300 eDP Active Area
1.4+PSR2 100 flat LCD Panel Weight 310g max
Diagonal Size 15.6"
Thickness 2.45 typ /2.6 max
Interface eDP1.4
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 1000:1 typ
Refresh Rate 60Hz
Brightness 300nits typ
Pixel Resolution 1920 x 1080 (FHD)
Format WLED
Backlight RGB
Color Gamut Coverage sRGB100% typ
Color Depth 8bits
Viewing Angle UWVA 89/89/89/89
Low Blue Light Yes
Power Consumption (W, EBL@ 2.69W max / 3.34W max
150nits max/ 200nits max)
15.6-in FHD (1920x1080) Anti- Outline Dimensions (W x H) 350.96 * 216.65 (max. w/ PCB)
Glare WLED SVA 45percent cg 344.16 x 193.59 typ
250nits eDP 1.2 w/o PSR NWBZ Active Area
ultraslim Weight 360g max
Diagonal Size 15.6"
Thickness 3.2mm max
Interface eDP1.2
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 300:1 typ
Refresh Rate 60Hz
Brightness 250nits typ
Pixel Resolution 1920 x 1080 (FHD)
Format WLED
Technical Specifications
Backlight RGB
Color Gamut Coverage NTSC45%
Color Depth 6bit
Viewing Angle SVA 45/45/15/35
Low Blue Light No
Power Consumption (W, EBL@ 2.67W max / 3.33W max
150nits max/ 200nits max)
Technical Specifications
Color Gamut Coverage NTSC45%
Color Depth 6bits
Viewing Angle SVA 45/45/15/35
Low Blue Light No
Power Consumption (W, EBL@ 2.42W max / 2.98W max
150nits max/ 200nits max)
Technical Specifications
STORAGE AND DRIVES
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows 11) is reserved
for system recovery software.
HDD 1TB 5400RPM 7mm Drive Weight 0.21 lbs (95 g)
SATA Rotation speed 5400rpm
NAND Type up to 128MB
Height 0.28 in (7 mm)
Width 2.75 in (69.85 mm)
Weight ATA-8, SATA 3.0
Interface 600MB/s (Interface)
Maximum Sequential Read Single Track: 1.5ms
Agerage: 13ms
Maximum: 32ms
Maximum Sequential Write 1,953,525,168
Logical Blocks 0° to 60°C [case temp]
Operating Temperature ATA Security
Features S.M.A.R.T., NCQ, Ultra DMA
Technical Specifications
Logical Blocks 976,773,168
Operating Temperature 0° to 60°C [case temp]
Security Features ATA Security
Features S.M.A.R.T., NCQ, Ultra DMA
Technical Specifications
SSD 256GB 2280 PCIe Form Factor M.2 2280
NVMe QLC Capacity 256GB
NAND Type QLC
Height 0.09 in (2.3 mm)
Width 0.87 in (2.2 mm)
Weight 0.02 lb (10 g)
Interface PCIe NVMe
Maximum Sequential Read up to 2300MB/s ±20%
Maximum Sequential Write up to 1280MB/s ±20%
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features Pyrite
Technical Specifications
SSD 512GB 2280 PCIe-4x4 Form Factor M.2 2280
NVMe Three Layer Cell Capacity 512GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (2.2 mm)
Weight
Interface PCIe NVMe Gen4X4
Maximum Sequential Read up to 6000MB/s ±20%
Maximum Sequential Write up to 4000MB/s ±20%
Logical Blocks 1,000,215,216
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features Pyrite
Technical Specifications
NETWORKING/COMMUNICATIONS
Realtek Wireless LAN Standards IEEE 802.11a
802.11a/b/g/n/ac (1x1) IEEE 802.11b
Wi-Fi® and Bluetooth® 4.2 IEEE 802.11g
IEEE 802.11n
Wireless Card 1
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified modules
Frequency Band •802.11b/g/n
2.402 – 2.482 GHz
•802.11a/n/ac
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 150Mbps
• 802.11ac : max 433.3Mbps
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security3 • IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• WPA3 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 • 802.11b : +14dBm minimum
• 802.11g : +12dBm minimum
• 802.11a : +12dBm minimum
• 802.11n HT20(2.4GHz) : +12dBm minimum
• 802.11n HT40(2.4GHz) : +12dBm minimum
• 802.11n HT20(5GHz) : +10dBm minimum
• 802.11n HT40(5GHz) : +10dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum
Power Consumption • Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
Technical Specifications
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
4
Receiver Sensitivity 802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type High efficiency antenna.
One embedded dual band 2.4/5 GHz antenna is provided to the card to
support WLAN communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight Type 2230 : 2.8g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)"
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF;
LED OFF – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy : 0~79 (1 MHz/CH)
Channels BLE : 0~39 (2 MHz/CH)
Data Rates and Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 4 dBm for BR and EDR.
1. Wi-Fi 5 is designed to support gigabit data rate when transferring files between two devices connected to the same router.
Requires a wireless router, sold separately, that supports 80MHz and higher channels. Wireless access point and internet service
required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac) is backwards compatible with
prior 802.11 specs.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
Technical Specifications
Realtek RTL8852BE Wireless LAN Standards IEEE 802.11a
802.11ax 2x2 Wi-Fi® + IEEE 802.11b
Bluetooth® 5.3 Wireless IEEE 802.11g
IEEE 802.11n
Card (802.11ax 2x2,
IEEE 802.11ac
supporting gigabit data IEEE 802.11ax
rate) 1 IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified modules
Frequency Band •802.11b/g/n/ax
2.402 – 2.482 GHz
•802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: max 300Mbps
•802.11ac: max 866.7Mbps
• 802.11ax: max 1201Mbps
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security3 •IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only
•AES-CCMP: 128 bit in hardware
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
•WPA2 certification
•WPA3 certification
•IEEE 802.11i
•WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT40(2.4GHz): +14.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11n HT40(5GHz): +14.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
• 802.11ax HE40(2.4GHz): +10dBm minimum
• 802.11ax HE80(5GHz): +10dBm minimum
Power Consumption •Transmit mode:2.5 W
Technical Specifications
•Receive mode:2 W
•Idle mode (PSP)180 mW(WLAN Associated)
•Idle mode:50 mW(WLAN unassociated)
•Connected Standby/Modern Standby: 10mW
•Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 •802.11b, 1Mbps : -93.5dBm maximum
•802.11b, 11Mbps : -84dBm maximum
•802.11a/g, 6Mbps : -86dBm maximum
•802.11a/g, 54Mbps : -72dBm maximum
•802.11n, MCS07 : -67dBm maximum
•802.11n, MCS15 : -64dBm maximum
•802.11ac, MCS0 : -84dBm maximum
•802.11ac, MCS9 : -59dBm maximum
•802.11ax, MCS11(HE40): -57dBm maximum
•802.11ax, MCS11(HE80): -54dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF
LED Off – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Data Rates and Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 4 dBm for BR and EDR.
1.Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router.
Requires a wireless router, sold separately, that supports 80MHz and higher channels. Wireless access point and Internet service
required and sold separately. Availability of public wireless access points limited. Wi-Fi 6 (802.11ax) is backwards compatible with
Technical Specifications
prior 802.11 specs.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
Technical Specifications
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
Power Consumption • Transmit mode :2.0 W
• Receive mode :1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode :50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions 1. Type 2230 : 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230 : 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF
LED Off – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2/5.0 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy : 0~79 (1 MHz/CH)
Channels BLE : 0~39 (2 MHz/CH)
Data Rates and Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 4 dBm for BR and EDR.
1. Wi-Fi 5 is designed to support gigabit data rate when transferring files between two devices connected to the same router.
Requires a wireless router, sold separately, that supports 80MHz and higher channels. Wireless access point and internet service
required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac) is backwards compatible with
Technical Specifications
prior 802.11 specs.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
Realtek RTK8111HSH Ethernet Features 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
10/100/1000 Integrated 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-
NIC 30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100
Mbit/s
Power Management ACPI compliant – multiple power modes
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power
consumption
Performance Features TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
Jumbo Frame 9K
Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and
Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet
only) (MSC is supported on selected model)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB
(802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Technical Specifications
POWER
1. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life, time,
usage, environment, temperature, system configuration, loaded apps, features, power management settings and other factors.
HP 65W Smart AC Dimensions (H x W x D) 90x51x28.5mm
adapter Weight 230g +/- 10g (Not including power cord. Power cord varies by country.)
Input 100 to 240 VAC
Input Efficiency 88.0 % at 115 VAC and 89.0 % at 230VAC
Input frequency range 48 ~ 63 Hz
Input AC current Max. 1.7 A at 90 VAC
Output Output power 65W
DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <11.0A Over voltage protection- 29V max
automatic shutdown
Connector 4.5mm Barrel Type, 3 pin/grounded, mates with interchangeable cords
Environmental Design Operating temperature 32°F to 95°F (0° to 35°C)
Non-operating (storage) -4°F to 185°F (-20° to 85°C)
temperature
Altitude 1 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1,
EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1,
SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.
Technical Specifications
Altitude 1 to 16,400 ft (0 to 5,000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1,
EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1,
SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.
Technical Specifications
HP 3-cell Long Life Li- Dimensions (H x W x L) 6.0 x 186.85 x 90.2 mm (0.23 x 7.29 x 3.52 inch)
Ion (41 Wh1) Weight 0.175 Kg (0.385 lb)
Cells/Type 3cell lithium-Ion Polymer cell 515974
Energy
Voltage 11.34V/11.28V
Amp-hour capacity 3.62Ah/3.635Ah
Watt-hour capacity 41Wh
Temperature
Operating (Charging) 32˚ to 113˚ F (0˚ to 45˚ C)
Operating 14˚ to 122˚ F (-10˚ to 60˚ C)
(Discharging)
Fuel Gauge LED N/A
Warranty 1-year
Optional Travel No
Battery Available
Technical Specifications
AUDIO
HD Stereo Codec Realtek ALC3247
Audio I/O Ports One Headset Combo-Jack connector support CTIA spec.
Internal Speaker Amplifier 2W class D stereo amplifier for the internal speaker only. External speakers must be powered.
Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the Combo jack or integrated speaker.
Sampling Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1
kHz to 48 kHz for DAC and ADC.
Wavetable Syntheses Yes - Uses OS soft wavetable
Analog Audio Yes.
# of Channels on Line-Out 0
Internal Speaker Yes
FINGERPRINT READER
Sensor vendor Elan eFSA80ST touch sensor
Sensor type Capacitive
DPI resolution 508 DPI
Scan area 80 x 80 pixels array
False Rejection Rate FRR (False Reject Rate) / FAR (False Acceptance Rate):
FRR ~ 2% @ 1:50K FAR
False Acceptance Rate
Mobile Voltage Operation 2.65V to 3.6V
Operating Temperature 32° to 95° F (0° to 35° C)
Current Consumption
Image 50mA peak
Low Latency Wait For
Finger <900 uA
Capture Rate 20cm/sec
ESD Resistance IEC 61000-4-2 (+15KV)
Detection Matrix 508 dpi / 4x4mm sensor area
Technical Specifications
ENVIRONMENTAL DATA
Eco-Label Certifications & This product has received or is in the process of being certified to the following approvals and may
declarations be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT ® registered where applicable. EPEAT ® registration varies by country. See
http://www.epeat.net for registration status by country.*
*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies
by country. Visit http://www.epeat.net for more information.
• TCO- N/A
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label*
Sustainable Impact • 5% post-consumer recycled plastic
Specifications • Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable
• Bulk packaging available
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Notebook model is based on a “Typically Configured Notebook”.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Sort
idle) 4.97 W 4.94 W 4.87 W
Normal Operation (Long
idle) 2.74 W 2.79 W 2.72 W
Sleep 0.42 W 0.42 W 0.44 W
Off 0.14 W 0.14 W 0.17 W
NOTE:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model
family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed
is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a
Microsoft Windows® operating system.
Technical Specifications
*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is
attained for one hour.
Spare parts are available throughout the warranty period and or for up to “5” years after the end
of production.
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS)
directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic
Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe
Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see
www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.
• This product is 94.2% recycle-able when properly disposed of at end of life.
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer
to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html
Technical Specifications
):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Bis(2-Ethylhexyl) phthalate (DEHP)
• Benzyl butyl phthalate (BBP)
• Dibutyl phthalate (DBP)
• Diisobutyl phthalate (DIBP)
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently
handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has
been voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management HP offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest
HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
Technical Specifications
HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
COUNTRY OF ORIGIN
China
Options and Accessories (sold separately and availability may vary by country)
Category Description Part Number
Audio/Video HP Wired USB-A Stereo Headset 428K6AA
HP Wired 3.5mm Stereo Headset 428K7AA
HP 500 BT Headset 53L34AA
HP 365 BT Speaker 567D3AA
Summary of Changes
Date of change Version History Description of change
March 14, 2022 V1 to V2 Added Battery Compliance in Power section; Environmental Data section
April 11, 2022 V2 to V3 Added Reference for USB ports
April 25, 2022 V3 to V4 Added MIL-STD test in At a Glance section
June 10, 2022 V4 to V5 Updated TechSpecs
June 15, 2022 V5 to V6 Added Added note in Manageability Feature
June 30, 2022 V6 to V7 Updated Intel® Pentium® Silver Processor
August 5, 2022 V7 to V8 Updated Eco-Label Certifications & declarations
August 8, 2022 V8 to V9 Updated Memory Slots
October 20, 2022 V9 to V10 Updated Bluetooth version
March 6, 2023 V10 to V11 Updated Storage and Drives section
March 22, 2023 V11 to V12 Updated USB Type C® description
V12 to V13
Copyright © 2022 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited
warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
Intel, Core, Celeron, Pentium and Iris and are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries. NVIDIA, the NVIDIA logo are trademarks and/or registered trademarks of NVIDIA Corporation in
the U.S. and other countries. Bluetooth is a trademark owned by its proprietor and used by HP Inc. under license. USB Type-C® and
USB-C® are registered trademarks of USB Implementers Forum. SDXC is a registered trademark of SD-3C in the United States,
other countries or both. ENERGY STAR is a registered trademark of the U.S. Environmental Protection Agency.