Quickspecs: HP Pro Tower 280 G9 Pci Desktop PC

QuickSpecs HP Pro Tower 280 G9 PCI Desktop PC
Overview
HP Pro Tower 280 G9 PCI Desktop PC
1. Slim-height Bay - supporting an optical disk drive (Optional)

2. Power Button
3. Combo jack, Headphone/ Microphone
4. (2) SuperSpeed USB 5Gbps signaling rate port1
7. SD Card Reader (Optional)
Not shown
Slots Bays
(1) PCI Express 4.0 x162 (2) 3.5“
(1) PCI Express 3.0 x1 (1) 9.5mm internal optical drive bay
(1) PCI3
(1) M.2 for WLAN
(1) M.2 2242/2280 storage
1. SuperSpeed USB 10Gbps = USB 3.2 Gen2. SuperSpeed USB 5Gbps = USB 3.2 Gen1.
2. Support discrete graphic cards and storage devices only.
3. Available on select skus only.
Not all configuration components are available in all regions/countries. Page 1

c07933724 — DA 17051 — APJ — Version 5 — September 18, 2023
Overview
HP Pro Tower 280 G9 PCI Desktop PC (Intel 13th Gen)
1. Slim-height Bay - supporting an optical disk drive (Optional)

2. Power Button
3. Combo jack, Headphone/ Microphone
6. (1) USB 2.0 port 1
7. (1) USB-C 3.2 G1 (5G)
Not shown
Slots Bays
(1) PCI Express 4.0 x16 (2) 3.5“
(1) PCI Express 3.0 x1 (1) 9.5mm internal optical drive bay
(1) PCI
(1) M.2 for WLAN
(1) M.2 2242/2280 storage
1. SuperSpeed USB 10Gbps = USB 3.2 Gen2. SuperSpeed USB 5Gbps = USB 3.2 Gen1.

Overview
HP Pro Tower 280 G9 PCI Desktop PC
1. Audio Line out 7. Serial Port2

2. Audio Line in 8. Connector (2) USB 2.0 port
3. Standard lock slot 9. RJ-45 Network
4. VGA Port1 10. Serial Port (Optional)
5. HDM Port1 11. Integrated accessories cable lock
6. Connector (2) USB 2.0 port (Optional)2 12. Power Cord Connector3
13. Padlock Loop
Not shown
(1) PS/2 Port (Optional)
(1) Parallel Port (Optional via PCIex1 slot)
(1) 4 Serial Port (Optional via PCIex1 slot)4
(1) Internal Speaker (Optional)
(1) Intrusion Sensor (Optional)
1. Port will be covered up when configured with processor which is without internal graphics.
3. Power cord connector will be in different position, depends on which power supply configured.
4. Available in select countries only.

Overview
HP Pro Tower 280 G9 PCI Desktop PC (Intel 13th Gen)
1. Audio Line out 7. Serial port2

2. Audio Line in 8. Connector (2) USB 2.0 port
3. Standard lock slot 9. RJ-45 Network
4. DisplayPort1 10. Serial port (optional)
5. HDM port1 11. Integrated accessories cable lock
6. Connector (2) USB 2.0 port (optional)2 12. Power cord connector
13. Padlock loop
Not shown
Slots Bays
(1) PS/2 Port (Optional) (2) 3.5“
(1) Parallel Port (Optional via PCIex1 slot) (1) 9.5mm internal optical drive bay
(1) 4 Serial Port (Optional via PCIex1 slot)3
1. Port will be covered up when configured with processor which is without internal graphics.
2. Power cord connector will be in different position, depends on which power supply configured.
3. Available in select countries only.

Overview
AT A GLANCE
• Windows 11 Pro 64, Win 11 Home 64, Win 11 Pro 64 Downgrade (Win 10 Pro 64) or FreeDOS.
• Intel® H670 or H7701 chipset supporting Intel® 12th or 13th processors1 featuring Intel® UHD Graphics.
• Supports an optional discrete graphics card.
• Integrated 10/100/1000 Ethernet Controller or ac 2x2 +Bluetooth 5 M.2 2230 PCI-e+USB WW or 802.11ac (1x1) Wi-Fi® and
Bluetooth® 4.2 Combo or Realtek 8852BE Wi-Fi 6 +Bluetooth® 5.2 Screw WLAN
• Up to 64GB DDR4- 3200 Unbuffered Memory (UDIMM).
• Independent monitor support via VGA and HDMI interfaces.
• TPM2.0 support (PCI version support dTPM, and the non-PCI version support fTPM)1.
• Supports both Hard Disk Drives and PCIe® NVMe™ M.2 SSD or PCIe® NVMe™ TLC M.2 SSD.
• Up to 10 USB Ports (including native 4 SuperSpeed USB 5Gbps signaling rate ports and 2 SuperSpeed USB 10Gbps signaling
rate ports and 2 USB 2.0 ports).
• 180W/350W/500W 90% HE power supply and 260W 92% HE power supply.
• Security cable lock supported (sold separately).
• Intrusion sensor supported (Optional).
• Optional HP Services available2; terms and conditions vary by country; certain restrictions and exclusions apply.

2. HP Services are optional. Service levels and response times for HP Care Services may vary depending on your geographic location. Service starts
on date of hardware purchase. Restrictions and limitations apply. For details, visit http://www.hp.com/go/cpc. HP services are governed by the
applicable HP terms and conditions of service provided or indicated to customer at the time of purchase. Customer may have additional statutory
rights according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited
Warranty provided with your HP Product.
NOTE: See important legal disclosures for all listed specs in their respective features sections.
PRODUCT NAME
HP Pro Tower 280 G9/G9 PCI/G9 E PCI Desktop PC
OPERATING SYSTEM
Preinstalled Windows 11 Pro1
Windows 11 Home - HP recommends Windows 11 Pro for Business1
Windows 11 Home Single Language - HP recommends Windows 11 Pro for Business1
Windows 11 Pro (preinstalled with Windows 10 Pro Downgrade)1,2
FreeDOS
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware,
drivers, software or BIOS update to take full advantage of Windows functionality. Windows is automatically updated and enabled. High speed
internet and Microsoft account required. ISP fees may apply and additional requirements may apply over time for updates. See
http://www.windows.com.
2. This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and provision for
recovery software. You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall
one version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating systems to
avoid loss of your data.

Standard Features and Configurable Modules
PROCESSORS
Intel® Celeron® Processors1,2
CPU Intel Celeron G6900 Dual Core 3.4GHz 3200MHz 46W (3.4GHz, 4MB cache, 2 cores)
Intel® Pentium® Processors1,2
CPU Intel Pentium Gold G7400 Dual Core 3.7GHz 3200MHz 46W (3.7GHz, 6MB cache, 2 cores)
Intel 12th Processors

Intel® Core™ i31
CPU Intel Core i3-12100 4C 3.3GHz 3200MHz 60W (3.3GHz, turbo up to 4.3GHz, 12MB cache, 4 cores)
Intel® Core™ i51

Intel® Core™ i71

CPU Intel Core i7-12700 12C 2.1GHz 3200MHz 65W (2.1GHz, Up to 4.8GHz with Intel® Turbo Boost2, 25MB cache, 12 cores)
Intel 13th Processors

Intel® Core™ i31
Intel® Core™ i51

Intel® Core™ i71

CPU Intel Core i7-13700 16C 2.1GHz 3200MHz 65W (2.1GHz, Up to 5.2GHz with Intel® Turbo Boost2, 30MB cache, 16 cores)
1. Multi-Core is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit
from use of this technology. 64-bit computing system required. Performance and clock frequency will vary depending on application workload
and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance.
2. Intel® Turbo Boost technology requires a PC with a processor with Intel Turbo Boost capability. Intel Turbo Boost performance varies depending
on hardware, software and overall system. See http://www.intel.com/technology/turboboost for more information.


CHIPSET
Intel® H670/H770 Chipset
GRAPHICS
Integrated1,2
Intel® UHD
Graphics 770
Graphics 730
Graphics 710
Discrete Graphics
Intel Arc A380 graphic (6GB GDDR6)
AMD Radeon™ RX 6600XT Graphics (8GB GDDR6)
AMD Radeon™ RX 6400 Graphics (4GB GDDR6)
AMD Radeon™ RX 6300 Graphics (2GB GDDR6)
NVIDIA® Quadro® T400 (4GB GDDR6 dedicated)
NVIDIA® GeForce RTX 3050 Graphics (8GB GDDR6)
NVIDIA® GeForce RTX 4060 Graphics (8GB GDDR6)
1. HD content required to view HD images.
2. Integrated Intel software is available on select models only and requires separately purchased projector, tv or computer monitor with an
integrated or external receiver. External receivers connect to the projector, tv or computer monitor via a standard VGA, HDMI cable, also sold
separately.
*NOTE: Available in select countries only.
MEMORY
Form Factor Type Maximum # of Slots
Tower DDR4 3200 64 GB capacity 2 DIMM1
4GB DDR4-3200 UDIMM NECC (1x4GB)
8GB DDR4-3200 UDIMM NECC (2x4GB)2
1. Memory modules support data transfer rates up to 2933 MT/s; actual data rate is determined by the system’s configured processor. See
processor specifications for supported memory data rate.
2. Memory speed 3200 MT/s can be achieved via two UDIMMs per channel (2DPC) when populated with the same part number.
NOTE: DDR4-2933 UDIMM is only available for 10th Gen i7 processor.


STORAGE
NOTE: Starting from November 1st, 2023, all shipments will require Windows to be installed when selecting a SSD.
HDD can only be configured as additional data drives and not as the boot drive.
SATA3 - 3.5" or 2.5” 6Gb/s HDDs

2TB 7200 RPM SATA Hard Disk Drive
1TB 7200 RPM SATA Hard Disk Drive
500GB 7200 RPM SATA Hard Disk Drive
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows)
of system disk is reserved for the system recovery software.
Solid State Drives

256GB* M.2 NVMe
512GB* M.2 NVMe
1TB* M.2 NVMe
128GB* M.2 2230 PCIe NVMe*
128GB* M.2 2280 PCIe NVMe Three Layer Cell SSD
1TB* M.2 2280 PCIe NVMe Three Layer Cell SSD
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows)
of system disk is reserved for the system recovery software.
*NOTE: Available in select countries only.
SD Card Reader1
SD/SDHC/SDXC SD Card Reader
1. Optional per configuration and available in select countries only.
OPTICAL DISC DRIVES

DVD-ROM 9.5mm
DVD-Writer1 9.5mm
1. HD-DVD disks cannot be played on this drive. No support for DVD-RAM. Actual speeds may vary. Don’t copy copyright-protected materials.
Double Layer discs can store more data than single layer discs. Discs burned with this drive may not be compatible with many existing single-
layer DVD drives and players.


NETWORKING1
Ethernet (RJ-45)
Integrated 10/100/1000M GbE LAN
Wi-Fi® and Bluetooth®

Realtek RTL8852BE Wi-Fi6+ Bluetooth® 5.2
Realtek RTL8822CE-CG 802.11a/b/g/n/ac (2x2) with Bluetooth® M.2 PCIe®
Realtek RTL8821CE-CG 802.11a/b/g/n/ac (1x1) with Bluetooth® M.2 PCIe®
1. Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac)
is backwards compatible with prior 802.11 specs.
NOTE: Wireless cards are optional or add-on features and requires separately purchased wireless access point and internet service. Availability of
public wireless access points limited.
AUDIO / MULTIMEDIA
Realtek ALC3867-CG
Integrated Hi-Definition Audio
Combo Jack, Headphone / Microphone
Line-in / Line-out (3.5mm)
KEYBOARDS AND POINTING DEVICES 1

Keyboard
HP USB 320K Keyboard
HP 125 BLK Wired Keyboard
HP 125 Antimicrobial Wired Keyboard (china only)
HP PS/2 Business Slim Keyboard (for machine configured with PS/2 port)
Mouse
HP PS/2 mouse (for machine configured with PS/2 port)
HP Wired Desktop 320M mouse
HP 125 Wired Mouse
HP 128 Laser Wired Mouse
HP 125 Antimicrobial Wired Mouse (china only)
1. Keyboards and mouse are optional or add-on features. A keyboard and mouse are required for this device. If you do not already have a
keyboard and mouse, please refer to a list of compatible keyboards on the “Recommended Accessories” page.
PORTS
Front
Slim-height Bay - supporting an optical disk drive (Optional)
Power Button
Combo jack, Headphone / Microphone
SD Card Reader (Optional)
(2) SuperSpeed USB 10Gbps signaling rate port*
(4) SuperSpeed USB 5Gbps port* or (2) SuperSpeed USB 5Gbps signaling rate port
(1) USB 2.0*


(1) USB-C©*
Not shown
(1) PCI Express 4.0 x16
(1) PCI Express 3.0 x1
(1) Full-height PCI (Available on selected sku)
(1) M.2 for WLAN
(1) M.2 2230/2280 storage
Rear
Audio Line out
Audio Line in
HDMI Port
VGA Port or Displayport*
Serial Port (Optional on selected sku)
2nd Serial Port (Optional)
Standard Lock Slot
(4) USB 2.0 port (Optional on selected sku)
(2) USB 2.0 port (Optional on selected sku)
RJ-45 Network connector
Power cord connector
Padlock loop
Integrated accessories cable lock
Not shown
(1) PS/2 Port (Optional on selected sku)
(1) Parallel Port (Optional via PCIex1 slot)
(1) 4x Serial port (Optional via PCIex1 slot)*
NOTE*: Available in select countries only.
NOTE**: SuperSpeed USB 10Gbps = USB 3.2 Gen2. SuperSpeed USB 5Gbps = USB 3.2 Gen1
BAYS
(1) 9.5mm external slimline ODD bay (Optional)
(1) 3.5" internal HDD or bay
(1) 3.5” internal HDD bay (share bay with caddy)


SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
Security and Protection
McAfee* LiveSafe™1
Productivity
Microsoft 3652
Xerox® DocuShare® (90 days free trial offer)3
ODD Playback
sMedio True DVD for HP
Movies
Netflix4
App Stores and Content Purchasing

Amazon4
HP Utilities and Support

HP Documentation
HP Audio Switch5
HP Support Assistant
myHP
BTB
HP Setup Integrated OOBE
Hardware Enabling Drivers or software utility

HP System Event Utility
1. Free 1-year subscription of McAfee LiveSafe service included. Internet access required and not included. Subscription required after expiration
2. Sold separately and requires Internet access for activation.
3. Simply sign up and start using Xerox® DocuShare® Go. No credit card. No obligation. Data will become unavailable unless a subscription is
entered before the end of the 90 day free trial period. See visit https://http://www.xerox.com/docusharego for details.
4. Internet access required and not included.
5. Easily switch between speaker and microphone sources with intuitive controls and a consistent app experience.
*NOTE: Available in Latin America countries only.
POWER SUPPLY 1
180 W
EPA90 (Gold) +12V
260W
EPA92 +12V
350 W
EPA90 (Gold) Power Supply
500 W
EPA90 (Gold) Full range 115V/230V
1. All power supplies are not available in every region.


DIMENSIONS AND WEIGHT
Dimensions
6.12 x 11.93 x 13.28 in
(155 x 303 x 337 mm)
Weight
10.4 lbs / 4.7 kg
UNIT ENVIRONMENT AND OPERATING CONDITIONS

General Unit Operating Guidelines
• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit
is operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's
re-circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign
matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.
Temperature Range Operating: 5° to 35° C1

Non-operating: -30° to 60° C1
Relative Humidity Operating: 5% to 90% (non-condensing at ambient)
Non-operating: 5% to 90% (non-condensing at ambient)
Maximum Altitude (unpressurized) Operating: 5000 m
Non-operating: 50000ft (15240 m)
1. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum
rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.
Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be
& declarations labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT Gold* or EPEAT Silver** registered in the United States. See http://www.epeat.net for
registration status in your country.
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Commission Regulation (EC) No 617/2013 (ErP Lot 3)
Note*: Only available on 13th Gen CPU Legacy SKU, except Japan.
Note**: Available on all 12th Gen CPU SKUs, 13th Gen non-legacy SKUs, and 13th Gen legacy SKUs for Japan.
Sustainable Impact • Product Carbon Footprint (hp.com)
Specifications • 30% post-consumer recycled plastic
• Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable.
• Bulk packaging available

System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Desktop model is based on a “Typically Configured Desktop”.
Energy Consumption
(in accordance with US
115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
ENERGY STAR® test
method)
Normal Operation (Short
16.34 W 17.06 W 16.41 W
idle)
Normal Operation (Long
16.31 W 16.04 W 16.15 W
idle)
Sleep 1.74 W 1.73 W 1.76 W
Off 0.32 W 0.33 W 0.32 W
NOTE: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not
offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically configured PC
featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Short
55.72 BTU/hr 58.17 BTU/hr 55.96 BTU/hr
idle)
Normal Operation (Long
55.62 BTU/hr 54.70 BTU/hr 55.07 BTU/hr
idle)
Sleep 5.93 BTU/hr 5.90 BTU/hr 6.00 BTU/hr
Off 1.09 BTU/hr 1.13 BTU/hr 1.09 BTU/hr
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one
hour.
Declared Noise
Emissions Sound Power Sound Pressure
(in accordance with (LWAd, bels) (LpAm, decibels)
ISO 7779 and ISO 9296)
Typically Configured –
3.6 25
Idle
Fixed Disk – Random
3.7 26
writes
Optical Drive –
3.8 26
Sequential reads
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)

Battery type: Lithium

Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)
Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680.1 (EPEAT) standard at the Gold level, see
http://www.epeat.net.
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains 28.2% post-consumer recycled plastic (by wt.)
• This product is 92.9% recycle-able when properly disposed of at end of life.
Packaging Materials External: PAPER/Paperboard 1220 g
Internal: PAPER/Molded Pulp 580 g
PLASTIC/Polyethylene low density - LDPE 40 g
The plastic packaging material contains at least 0.0% recycled content.
The corrugated paper packaging materials contains at least 35.0% recycled content.
RoHS Compliance HP Inc. complies fully with materials regulations. We were among the first companies to extend the
restrictions in the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive to our
products worldwide through the HP GSE. HP has contributed to the development of related
legislation in Europe, as well as China, India, and Vietnam.
We believe the RoHS directive and similar laws play an important role in promoting industry-wide
elimination of substances of concern. We have supported the inclusion of additional substances—
including PVC, BFRs, and certain phthalates—in future RoHS legislation that pertains to electrical
and electronics products.
We met our voluntary objective to achieve worldwide compliance with the new EU RoHS
requirements for virtually all relevant products by July 2013, and we will continue to extend the
scope of the commitment to include further restricted substances as regulations continue to evolve.
To obtain a copy of the HP RoHS Compliance Statement, see HP RoHS position statement.
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer to
the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)


• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
Management and recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP
Recycling sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly instructions)
is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions
may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who
integrate and re-sell HP equipment.
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:

http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
SERVICE AND SUPPORT

On-site Warranty1: Available three-year (3-3-3) or one-year (1-1-1) limited warranty (varies by country) delivers on-site, next
business day2 service for parts and labor and complimentary limited technical support3. Three-year onsite and labor are not
available in all countries. Service offers terms up to 5 years by choosing an optional HP Care Pack4 To choose the right level of
service for your HP product, visit HP Care Pack Central: http://www.hp.com/go/cpc.
1: Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in your region.
2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not available in
certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
3: Technical support applies only to HP-configured and third-party HP qualified hardware and software.
4: Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware
purchase. Restrictions and limitations apply. For details, visit http://www.hp.com/go/cpc. HP services are governed by the applicable HP terms
and conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to
applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided
with your HP Product.

Technical Specifications - Graphics

GRAPHICS
Intel® UHD Graphics (integrated)
Graphics Controller Integrated
DisplayPort™ Multimode capable; supports HDCP, Display Port Audio (2 streams), HBR2 link rates and
Multi-Stream Technology for a maximum of 4 displays connected to any output controlled
by Intel® Graphics
HDMI Supports HDMI 2.0a features

Supports HDCP 2.2
Supports audio over HDMI
VGA VGA output
Memory The actual amount of maximum graphics memory can be >4GB. System memory is allocated
for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide
an optimal balance between graphics and system memory use.
Maximum Color Depth up to 10 bits/color
Graphics/Video API Support HEVC 10b Enc/Dec HW

VP9 10b Dec HW
HDR
Rec. 2020
DX12
Supported Display Resolutions Max. Resolution (VGA) 2048 x 1536 @60Hz
and Refresh Rates Max. Resolution (HDMI) 7680 x 4320 @60Hz
Note: The actual amount of maximum graphics memory can be less than the amounts listed above depending upon your computer’s
configuration.
Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP
Only supported on displays connected to the external DisplayPort™ connector.
AMD Radeon™ RX 6300 4GB Graphics Card

Engine Clock 1512MHz (Game) 2040MHz (Boost)
Memory Clock 2000 MHz
Memory Size(width) 2GB (64-bit)
Memory Type 512M x 32 GDDR6
Max. Resolution (HDMI) 7680 x 4320x 36bpp@60Hz
Max. Resolution (DP) 7680 x 4320 x 24bpp@120Hz
Multi Display Support 2 displays
HDCP Compliance Yes
Rear I/O connectors (bracket) HDMI+DP
Cooling (active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption (W) 32W
PCB form-factor with bracket LP PCB with FH/LP bracket

Intel® Arc A380 6 GB Graphics Card

Engine Clock 2150MHz
Frame Buffer Size / Width 6GB/96bit
Graphic Memory Type / Clock GDDR6 ,3 pcs/15.5Gbps
Max. Resolution (HDMI) 4090x2160 @ 60Hz
Max. Resolution (DP) 7680x4300 @60Hz
HDCP Compliance Yes
Rear I/O connectors (bracket) HDMI x3 +DPx3
Cooling (active/passive) Active
AMD Radeon™ RX 6400 4GB Graphics Card

Memory Clock 2000MHz
Max. Resolution (HDMI) 7680 x 4320@60Hz
Max. Resolution (DP) 7680 x 4320@60Hz
HDCP Compliance yes
Rear I/O connectors (bracket) HDMI+DP
PCB form-factor with bracket LP PCB with FH/LP bracket
AMD® Radeon™ RX6600XT 8 GB Graphics Card

Max. Resolution (HDMI) 7680 x 4320@60Hz
HDCP Compliance Yes
Rear I/O connectors (bracket) HDMI+DPx3
Total power consumption (W) 162.5W
PCB form-factor with bracket FH PCB with FH bracket

NVIDIA® Quadro T400 Graphics Card

Memory Size (width) 4GB (64-bit)
HDCP Compliance Yes
Rear I/O connectors (bracket) mDPx3
PCB form-factor with bracket LP PCB with LP bracket
NVIDIA® GeForce RTX 3050 8GB Graphics Card

Multi Display Support 7680x4320@60Hz (DSC)
HDCP Compliance Up to 4 displays
Rear I/O connectors (bracket) Yes
Cooling (active/passive) DPx3+ HDMIx1
Total power consumption (W) Active fansink with 4 pin fan control
PCB form-factor with bracket 120W

NVIDIA® GeForce RTX 4060 8GB Graphics Card

Engine Clock 1830Mhz
Memory Clock 17Gbps
Multi Display Support 7680 x 4320@60Hz
HDCP Compliance Up to 4 displays
Rear I/O connectors (bracket) Yes
Cooling (active/passive) DPx3+ HDMIx1
Total power consumption (W) Active fansink
PCB form-factor with bracket 115W

Technical Specifications – Optical Drives
STORAGE*
NOTE: Starting from November 1st, 2023, all shipments will require Windows to be installed when selecting a SSD.
HDD can only be configured as additional data drives and not as the boot drive.
HP 2TB 7.2K rpm SATA 6.0Gb/s 3.5" Hard Disk Drive

Capacity 2TB
Rotational Speed 7,200 rpm
Interface SATA 6Gb/s NCQ
Buffer Size 64MB
Logical Blocks 3,907,029,168
Seek Time Read: <8.5 ms
Write: <9.5 ms
Height 1.028 in/26.11 mm
Width 4.0 in/101.6 mm
Operating Temperature 32° to 140° F (0° to 60° C)
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
1TB 7.2K rpm SATA 6.0Gb/s 3.5” Hard Disk Drive

Capacity 1TB
Interface Serial ATA 3.0 (6.0 Gb/s)
Buffer Size 32MB
Seek Time Single Track: 2.0 ms
Average: 11 ms
Full-Stroke: 21 ms
Height 1 in/2.54 cm
Width Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm
500GB 7.2K rpm SATA 6.0Gb/s 3.5” Hard Disk Drive

Capacity 500GB
Interface Serial ATA 3.0 (6.0 Gb/s)
Buffer Size 32MB
Seek Time Single Track: 2.0 ms
Average: 11 ms
Full-Stroke: 21 ms


Height 1 in/2.54 cm
Width Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm
128GB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 128GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3x4
Maximum Sequential Read Up to 2800MB/s
Maximum Sequential Write Up to 600MB/s
Logical Blocks 250,069,680
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features APST; ASPM L1.2; NVME spec 1.2

Drive Weight < 10g
Capacity 256GB
Height 2.38mm
Length 80mm
Width 22mm


Drive Weight < 10g
Capacity 512GB
Height 2.38mm
Length 80mm
Width 22mm
256GB M.2 2280 PCIe NVMe SSD

Drive Weight < 10g
Capacity 256GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3

Drive Weight < 10g
Capacity 512GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3


500GB 7200RPM 2.5in SATA HDD

Capacity 500GB
Interface SATA 6 Gb/s
Buffer Size 32MB
Seek Time 12 ms (Average)
Height 0.267 in/6.8 mm (nominal)
Width (nominal) 2.75 in/70 mm (nominal)
1TB 7200RPM 2.5in SATA HDD

Capacity 1TB
Interface SATA 6 Gb/s
Buffer Size 32MB
Seek Time 12 ms (Average)
Height 0.374 in/9.5 mm (nominal)
Width (nominal) 2.75 in/70 mm (nominal)

Drive Weight < 10g
Capacity 128GB
Height 2.3mm
Length 30mm
Width 22mm
Interface PCIE NVMe
Features Pyrite


OPTICAL DISC DRIVES
HP 9.5mm Desktop G2 Slim DVD Writer Drive

Height 9.5 mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max) 0.31 lb (140 g)
Read Speeds DVD-R DL Up to 6X
DVD+R Up to 8X
DVD+RW Up to 8X
DVD+R DL Up to 6X
DVD-R Up to 8X
DVD-RW Up to 6X
CD-R Up to 24X
CD-RW Up to 10X
DVD-RW, DVD+RW Up to 8X
DVD-R DL, DVD+R DL Up to 8X
DVD+R, DVD-R Up to 8X
DVD-ROM DL, DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Access time Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling) Stop Time 6 seconds (typical)
Power Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions Temperature 41° to 122° F (5° to 50° C)
(operating - non-condensing) Relative Humidity 10% to 80%
Maximum Wet Bulb Temperature 84° F (29° C)


HP 9.5mm Desktop G2 Slim DVD-ROM Drive
Height 9.5 mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max) 0.31 lb (140 g)
Read Speeds DVD-R DL Up to 6X
DVD+R Up to 8X
DVD+RW Up to 8X
DVD+R DL Up to 6X
DVD-R Up to 8X
DVD-RW Up to 6X
CD-R Up to 24X
CD-RW Up to 10X
DVD-RW, DVD+RW Up to 8X
DVD-R DL, DVD+R DL Up to 8X
DVD+R, DVD-R Up to 8X
DVD-ROM DL, DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Access time Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling) Stop Time 6 seconds (typical)
Power Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions Temperature 41° to 122° F (5° to 50° C)
(operating - non-condensing) Relative Humidity 10% to 80%
Maximum Wet Bulb Temperature 84° F (29° C)

Technical Specifications – Networking
NETWORKING
10/100/1000 NIC Ethernet Features 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
Power ACPI compliant – multiple power modes
Management Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Performance TCP/IP/UDP Checksum Offload (configurable)
Features Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
Jumbo Frame 9K
Manageability Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up
Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause
30)
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Interface PCIe + SMBus
NIC Device Driver Name PCIe GBE Ethernet Family Controller
Realtek 802.11ac (1x1) Wi-Fi 5 and Bluetooth® 4.2 Combo

Wireless LAN Standards1 IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
1. Wireless access point and internet service required and sold separately. Availability of public wireless
access points limited. Wi-Fi 5 (802.11 ac) is backwards compatible with prior 802.11 specs.
Interoperability Wi-Fi® certified modules
Frequency Bands 802.11b/g/n • 2.402 – 2.482 GHz

•
• NOTE: The FCC has declared products that utilize passive scanning on channel
12/13 and are capable of transmitting must fully comply with requirements of
15.247 & 15.249 or otherwise disable those channels.
802.11a/n • 4.9 – 4.95 GHz (Japan)

• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz

Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps

• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation Direct Sequence Spread Spectrum

BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security2 • IEEE and 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
•
2 Check latest software/driver release for updates on supported security features.
Network Architecture Ad-hoc (Peer to Peer)

Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power3 • 802.11b: +14dBm minimum

• 802.11g: +12dBm minimum
• 802.11a: +12dBm minimum
• 802.11n HT20(2.4GHz): +12dBm minimum
• 802.11n HT40(2.4GHz): +12dBm minimum
• 802.11n HT20(5GHz): +10dBm minimum
• 802.11n HT40(5GHz): +10dBm minimum
• 802.11ac VHT80(5GHz): +10dBm minimum
3. Maximum output power may vary by country according to local regulations.
Power Consumption • •Transmit mode2.0 W

• •Receive mode1.6 W
• •Idle mode (PSP)180 mW(WLAN Associated)
• •Idle mode50 mW(WLAN unassociated)
• •Connected Standby 10mW
• •Radio disabled8 mW
Power Management ACPI and PCI Express compliant power management

802.11 compliant power saving mode

Receiver Sensitivity4 • 802.11b, 1Mbps: -93.5dBm maximum

• 802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11a/g, 54Mbps: -72dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11n, MCS15: -64dBm maximum
• 802.11ac, MCS0: -84dBm maximum
• 802.11ac, MCS9: -59dBm maximum
4 Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet
error rate of 10% for 802.11a/g (OFDM modulation).
Antenna type High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO
communications and Bluetoothâ communications
Form Factors PCI-Express M.2 MiniCard
Dimensions Type 2230: 2.3 x 22.0 x 30.0 mm
Weight Type 2230: 2.8g
Operating Voltage 3.3v +/- 9%
Temperature Operating: 14° to 158° F (-10° to 70° C)

Non-operating: -40° to 176° F (-40° to 80° C)
Humidity Operating: 10% to 90% (non-condensing)

Non-operating: 5% to 95% (non-condensing)
Altitude Operating: 0 to 10,000 ft (3,048 m)

Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
HP Integrated Module with Bluetooth® 4.0/4.1/4.2 Wireless Card Technology
Bluetoothâ Specification 4.0/4.1/4.2 Wireless Card Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Channels Legacy: 0~79 (1 MHz/CH)

BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps

Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth® component shall operate as a Class II Bluetooth® device with a maximum
transmit power of + 4 dBm for BR and EDR.

Receiver Sensitivity Legacy
Power Consumption Peak (Tx) 330 mW

Peak (Rx) 230 mW
Selective Suspend 17 mW
Range Legacy: 0~79 (1 MHz/CH)

Electrical Interface USB 2.0 compliant
Bluetooth® Software Supported Microsoft Windows Bluetooth® Software

Link Topology
Power Management ETS 300 328, ETS 300 826

Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Bluetoothâ Profiles Supported
Power Management Microsoft Windows ACPI, and USB Bus Support

Certifications
Certifications BT4.1-ESR 5/6/7 Compliance

Bluetooth® Profiles Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)

Realtek RTL8822CE 802.11ac 2x2 Wi-Fi® + Bluetooth® 5

Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi® certified

Frequency Band 802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n/ac
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz & 80MHz)

Security1 • IEEE and Wi-Fi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• IEEE 802.11i
• WAPI
Network Architecture Models Ad-hoc (Peer to Peer)

Infrastructure (Access Point Required)


Output Power2 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
Power Consumption • Transmit mode:2.0 W
• Receive mode:1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode:50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW

Receiver Sensitivity3 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11n, MCS07: -67dBm maximum
802.11ac, MCS0: -84dBm maximum
3 Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a
packet error rate of 10% for 802.11a/g (OFDM modulation).
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN
MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard with CNVi Interface

Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Temperature Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
LED Activity LED Amber – Radio OFF;
LED OFF – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Card Technology


Bluetooth Specification 4.0/4.1/4.2/5.0 Wireless Card Compliant
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth Software Supported Microsoft Windows Bluetooth Software
Link Topology
Low Voltage Directive IEC60950-1/IEC62368-1
Certifications UL, CSA, and CE Mark
Bluetooth® Profiles Supported BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)

Realtek RTL8852BE Wi-Fi6 + Bluetooth® 5.2

Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified

Frequency Band 802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n/ac
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz & 80MHz)

Security1 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• IEEE 802.11i
• WAPI
Network Architecture Models Ad-hoc (Peer to Peer)

Infrastructure (Access Point Required)


Output Power2 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
Power Consumption • Transmit mode:2.0 W
• Receive mode:1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode:50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW

Receiver Sensitivity3 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
3 Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a
packet error rate of 10% for 802.11a/g (OFDM modulation).
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN
MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard with CNVi Interface

Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Temperature Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
LED Activity LED Amber – Radio OFF;
LED OFF – Radio ON


HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Card Technology
Bluetooth Specification 4.0/4.1/4.2/5.0 Wireless Card Compliant
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth Software Supported Microsoft Windows Bluetooth Software
Link Topology
Low Voltage Directive IEC60950-1/IEC62368-1
Certifications UL, CSA, and CE Mark
Bluetooth® Profiles Supported BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)

Technical Specifications - Audio
HIGH DEFINITION AUDIO

Type Integrated
HD Stereo Codec Realtek ALC3867-CG
Audio I/O Ports Front side Combo jack for supporting CTIA, Rear side Line-in/ Line-out/ Mic-in jacks
Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only. External speakers must be powered
externally.
Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the front and rear jacks or integrated speaker.
HD Audio Codec Realtek ALC3601
Sampling Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1K/
48 K/96K / 192K Hz for DAC and 44.1K/ 48K/ 96K/ 192K Hz Hz for ADC
Wavetable Syntheses Yes
Analog Audio Yes
# of Channels on Line-Out Stereo
Internal Speaker Yes
External Speaker Jack* 2W class D mono amplifier for the internal speaker only. External speakers must be powered
externally.
NOTE*: Optional

Technical Specifications - Power
POWER SUPPLY
Operating Voltage Range 90 – 264 VAC
Rated Voltage Range 100-240V AC
Rated Line Frequency 50/60 HZ
Operating Line Frequency 47 – 63 Hz
Rated Input Current 180 W: <2.3A
260 W: ≦3.1A
350 W: <4A
500 W: <6A
Rated Input Current with 180 W active PFC
Energy Efficient* Power 87/90/87% efficient at 20/50/100% load (115 V)
Supply 88/92/88% efficient at 20/50/100% load (230 V);
350 W active PFC
87/90/87% efficient at 20/50/100% load (115 V)
500W active PFC
DC Output +12 V
Current Leakage (NFPA 99: Less than 500 microamps of leakage current at 120 Vac with the ground wire disconnected, as
2102) required for Non-patient Electrical Appliances and Equipment used in a patient care facility or
that contact patients in normal use. Per section 10.3.5.1.
Less than 100 microamps of leakage current at 120 Vac with the ground wire intact with normal
polarity, as required for Non-patient Electrical Appliances and Equipment used in a patient care
facility or that contact patients in normal use. Per section 10.3.5.1.
Power Supply Fan 180 W/350 W: 70*25mm (linear type)
500 W: 70x25mm (PWM type)

Technical Specifications – Weights and Dimensions
WEIGHT AND DIMENSIONS

Chassis (W x D x H) 6.12 x 11.93 x 13.28 in (155 x 303 x 337 mm) (w/ bezel)
System Volume 15.1 L
System Weight* 10.4 lb / 4.7 kg
Packaged 11.3 x 15.75 x 19.65 in
(H x W x D) 287 x 400 x 499 mm
Shipping Weight 17.64lb / 8 kg
Palletization 6 units per layer
Profile 7layer max
42 per pallet
Footprint
-85.31x39.37x47.24 in (2167 x 1000 x1200 mm)

After-Market Options (availability may vary by region)
AFTERMARKET OPTIONS
Type Description Part #
Memory HP 4GB DDR4-3200 DIMM 13L78AA
HP 8GB DDR4-3200 DIMM 13L76AA
Storage HP PCIe NVME TLC 256GB SSD M.2 Drive 1CA51AA

HP PCIe NVME TLC 512GB SSD M.2 Drive X8U75AA
HP PCIe Gen 4 NVME TLC M.2 512GB SSD 406L8AA
HP PCIe Gen 4 NVME TLC M.2 1TB SSD 406L7AA
HP 500GB 7200PRM SATA 6.0Gb/s 3.5” Hard Drive QK554AA
HP 1TB 7200rpm SATA 6Gb/s 3.5” Hard Drive QK555AA
Graphics NVIDIA T400 4GB GDDR6 3mDP 5Z7E0AA
Security HP Business PC Security Lock V3 Kit 3XJ17AA

HP Keyed Cable Lock 10mm kit T1A62AA
Cables/Adapters HP HDMI Standard Cable Kit T6F94AA

HP USB to Serial Port Adapter J7B60AA
HP PCIe x1 Parallel Port Card N1M40AA
Networking Intel Ethernet I225-T1 GbE NIC Card 406L9AA
Input HP Wired Desktop 320K Keyboard 9SR37AA

HP Wired Desktop 320M Mouse 9VA80AA
HP 125 Wired Keyboard 266C9AA
HP 125 Wired Mouse 265A9AA
HP 128 Laser Wired Mouse 265D9AA
HP Wired Desktop 320MK Mouse and Keyboard Combo 9SR36AA
HP 225 Wired Mouse and Keyboard Combo 286J4AA
HP 225 Antimicrobial Wired Mouse and Keyboard Combo 286K3AA
Others HP S101 Speaker bar 5UU40AA

Change Log
© Copyright 2023 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein
should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions
contained herein. Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or
other countries. Intel, Celeron®, Core, Pentium are registered trademarks or trademarks of Intel Corporation in the U.S. and/or
other countries. Bluetooth is a trademark of its proprietor, used by HP Inc. under license. NVIDIA, GeForce, Kepler and NVS are
trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. AMD and Radeon are trademarks
of Advanced Micro Devices, Inc. ENERGY STAR is a registered trademark owned by the U.S. Environmental Protection Agency.
Date of change: Version Change Description of change:

History:
June 13, 2023 From v1 to v2 Removal Disclaimer from call outs front image, page 1
June 14, 2023 From V2 to V3 Removal Call outs section, page 4
August 8, 2023 From V3 to V4 Update Environmental section updated
September 18, 2023 From V4 to V5 Addition Intel Arc A380 graphic(6GB GDDR6) added to Graphics card sections
From V5 to V6
From V6 to V7
From V7 to V8
From V8 to V9
From V9 to V10
From v10 to v11
From v11 to v12
From v12 to v13
From v13 to v14


Quickspecs: HP Pro Tower 280 G9 Pci Desktop PC

Uploaded by

Copyright:

Available Formats

Quickspecs: HP Pro Tower 280 G9 Pci Desktop PC

Uploaded by

Document Information

Original Description:

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Quickspecs: HP Pro Tower 280 G9 Pci Desktop PC

Uploaded by

Copyright:

Available Formats

QuickSpecs HP Pro Tower 280 G9 PCI Desktop PC

1. Slim-height Bay - supporting an optical disk drive (Optional)

Not all configuration components are available in all regions/countries. Page 1

1. Slim-height Bay - supporting an optical disk drive (Optional)

Not all configuration components are available in all regions/countries. Page 2

1. Audio Line out 7. Serial Port2

Not all configuration components are available in all regions/countries. Page 3

1. Audio Line out 7. Serial port2

Not all configuration components are available in all regions/countries. Page 4

1. Available on select skus only.

Not all configuration components are available in all regions/countries. Page 5

Standard Features and Configurable Modules

Intel 12th Processors

Intel® Core™ i51

Intel® Core™ i71

Intel 13th Processors

Intel® Core™ i51

Intel® Core™ i71

Not all configuration components are available in all regions/countries. Page 6

Standard Features and Configurable Modules

Not all configuration components are available in all regions/countries. Page 7

Standard Features and Configurable Modules

SATA3 - 3.5" or 2.5” 6Gb/s HDDs

Solid State Drives

OPTICAL DISC DRIVES

Not all configuration components are available in all regions/countries. Page 8

Standard Features and Configurable Modules

Wi-Fi® and Bluetooth®

KEYBOARDS AND POINTING DEVICES 1

Not all configuration components are available in all regions/countries. Page 9

Standard Features and Configurable Modules

Not all configuration components are available in all regions/countries. Page 10

Standard Features and Configurable Modules

App Stores and Content Purchasing

HP Utilities and Support

Hardware Enabling Drivers or software utility

Not all configuration components are available in all regions/countries. Page 11

Standard Features and Configurable Modules

UNIT ENVIRONMENT AND OPERATING CONDITIONS

Temperature Range Operating: 5° to 35° C1

Not all configuration components are available in all regions/countries. Page 12

Standard Features and Configurable Modules

Batteries used in the product do not contain:

Battery size: CR2032 (coin cell)

Not all configuration components are available in all regions/countries. Page 13

Standard Features and Configurable Modules

Not all configuration components are available in all regions/countries. Page 14

Standard Features and Configurable Modules

ISO 14001 certificates:

SERVICE AND SUPPORT

Not all configuration components are available in all regions/countries. Page 15

Technical Specifications - Graphics

HDMI Supports HDMI 2.0a features

VGA VGA output

Maximum Color Depth up to 10 bits/color

Graphics/Video API Support HEVC 10b Enc/Dec HW

AMD Radeon™ RX 6300 4GB Graphics Card

Not all configuration components are available in all regions/countries. Page 16