NANYA ROAD,MUGANG ZHAOQING

CITY GUANGDONG CHINA.

TEL:86-758-2875541,2870651,2877464,2876185,2877017
FAX:86-758-2878014
LEDTECH ELECTRONICS CORP. Http://www.ledtech.com.tw

SPECIFICATION

PART NO. : LA(C)2371-42B-M1 EWRN

2.3"(56.8mm)SINGLE DIGIT DISPLAY

Approved by Checked by Prepared by

Kj Lian Jie
Property of Ledtech Corporation. Unauthorized changes or alterations to the specification are prohibited.
 2.3" SINGLE DIGIT
LA(C)2371-42B-M1 DISPLAY

Dimensions

10° 31.8 10.0 0.5DIA

4.0

56.8 69.8 60.0

4.0 DIA.

47.9
MARK

3.5 MIN 2.54?9=22.86

Notes:
1. The slope angle of any PIN may be ±5.0° Max.
2. All dimensions are in mm, tolerance is ±0.25mm unless otherwise noted.

Internal Circuit Diagram

LA2371-42B-M1 PIN. 1/11

SEG. A1 A2 B C D1D2 E F G1 G2 H I J K L M DP
PIN. 17 14 13 9 7 4 3 19 2 12 18 16 15 8 6 5 10
NO CONNECTION:20
LC2371-42B-M1 PIN. 1/11

SEG. A1 A2 B C D1D2 E F G1 G2 H I J K L M DP
PIN. 17 14 13 9 7 4 3 19 2 12 18 16 15 8 6 5 10
NO CONNECTION:20

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LA(C)2371-42B-M1 DISPLAY

Description
LED Chip Face Color
Part No.
Material Emitting Color Surface Segments

LA2371-42B-M1 EWRN AlGaAs/GaAs Super Red Grey White

LC2371-42B-M1 EWRN AlGaAs/GaAs Super Red Grey White

Absolute Maximum Ratings at Ta=25 ℃

Parameter Symbol Rating Unit

SEG:A1.A2.
132
D1.D2.G1.G2

Power Dissipation Per Segment PD mW

DP 66

OTHER 264
Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.)
IFP 100 mA
Per Chip

Forward Current Per Chip IF 30 mA

Reverse (Leakage)Current Per Chip Ir 100 uA

Reverse Voltage Per Chip VR 4 V

Operating Temperature Range Topr. -25 to +85 ℃

Storage Temperature Range Tstg. -40 to +100 ℃

Dip Soldering: 260℃ for 5 sec.

Soldering Temperature. Tsol.
Hand Soldering: 350℃ for 3 sec.

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LA(C)2371-42B-M1 DISPLAY

Electrical and Optical Characteristics:

Parameter Symbol Condition Min. Typ. Max. Unit

Luminous Intensity Per Segment IV If=20mA/seg. 3.7 8.3 mcd

SEG:A1.A2.D1
3.6 4.4
.D2.G1.G2

Forward Voltage Vf DP 1.8 2.2 V

OTHER 3.6 4.4

Peak Wavelength λP If=20mA/seg. 660 nm

Dominant Wavelength λD If=20mA/seg. 643 nm

Reverse Current Per Chip

Ir Vr=4V 100 µA
(Leakage Current Per Chip)

Spectrum Line Halfwidth ∆λ If=20mA/seg. 20 nm

Response Time T ----------- 250 ns

Note: Customer’s special requirements are also welcome.

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LA(C)2371-42B-M1 DISPLAY

Typical Electrical/Optical Characteristic Curves

(25℃ Ambient Temperature Unless Otherwise Noted)

1.0 100 OPERATION IN THIS

Operating Peak Current to

REGION REOUIRES
TEMPERATURE

Derated DC Current
DERATING OF IDC

Ratio of Maximum
Relative Intensity

MAXIMUM

Temperature
0.5 10

IDC MAX
IF PEAK

10
10

1K
3K

30

0H
KH

HZ

0H
HZ

Z
1

Z
590 630 670 710
1 10 100 1000 10000
Wavelength (nm) tp - Pulse Duration - μs
Fig.1 RELATIVE INTENSITY VS. Fig.2 MAXIMUM TOLERABLE PEAK
WAVELENGTH CURRENT VS. PULSE DURATION

50
50
40
Forward Current IF(mA)

40
Forward Current IF(mA)

30
30
20 20
10
10

1.4 1.6 1.8 2.0 2.2 2.4 0 20 40 60 80 100

Forward Voltage VF(V) Ambient Temperature Ta (°C)
Fig .3 FORWARD CURRENT VS. Fig.4 FORWARD CURRENT VS.
FORWARD VOLTAGE PER CHIP DERATING CURVE

25
Relative Luminous Intensity

Relative Luminous Intensity

20 2.0
Normalized at 10mA

15 1.0

10 0.5

0.2
5
0.1
-30 -20 -10 0 10 20 30 40 50 60 70
0 10 20 30 40 Ambient Temperature Ta (°C)
Fig.6 LUMINOUS INTENSITY VS.
Forward Current (mA)
AMBIENT TEMPERATURE
Fig.5 RELATIVE LUMINOUS INTENSITY
VS. FORWARD CURRENT

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LA(C)2371-42B-M1 DISPLAY

Precautions in Use:
PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO
DEVICE TO HIGH RELIABILITY
1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip.
When bending is unavoidable, strictly follow the cautionary instruction below.
(1)Bend the leads before soldering.
(2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part.
(3) The lead bending point must be more than 1.6mm away from the edge or the resin part.
(4)When a pin is tested for its endurance, bending degree should be 45∘and repeated no more than two times.

2. Setting a product by using tool such as a holder should be avoided.

When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance,
thermal expansion, thermal contraction of holder, product and circuit board etc.

3. The hole pitch of a circuit board must fit into the lead pitch of products.

4. When soldering, care the followings:

(1)Do not heat a product under any stress (i.e.: twist) to leads.
(2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part.
(3 The lead bending point must be more than 1.6mm away from the edge or the resin part.
(4)Soldering with PC Board should be conducted with following conditions.
(a) For dip soldering
Pre-heating : 90℃ Max. for within 60 Sec.
Soldering Max. : 260±5℃(Solder Temp.) for within 5 Sec.
(b) Soldering iron : 350℃(Soldering iron tip) for within 3 Sec.

5. Flux could corrode the leads.Use flux that contains as little chlorine as possible (RA, RMA,
less than 0.2 wt%) and need not be washed way. When, however, washing is necessary, partially wash
around the leads, instead of the entire LED, by the following conditions.
Cleaning agent : Methyl Alcohol
Cleaning temp : 45℃Max.
Cleaning time : 30Sec. Max.

6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion.

7. The following may damage products or LED chips: Attachment or contact of residual flux solvent
onto the product surface or to LED chips, or invasion of the same into the product.

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