LG L192WS-BNQ
LG L192WS-BNQ
LG L192WS-BNQ
html
COLOR MONITOR
SERVICE MANUAL
MODEL:L192WS-BNQ/SNQ. A**JQP/ A**QQP
( ) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
1
CONTENTS
SPECIFICATIONS ................................................... 2 SERVICE OSD .........................................................14
PRECAUTIONS ....................................................... 3 TROUBLESHOOTING GUIDE ............................. 15
TIMING CHART ....................................................... 7
WIRING DIAGRAM ............................................... 22
DISASSEMBLY ........................................................ 8
BLOCK DIAGRAM...................................................10 EXPLODED VIEW ................................................... 23
DISCRIPTION OF BLOCK DIAGRAM ................... 11 REPLACEMENT PARTS LIST .............................. 25
ADJUSTMENT ...................................................... 13
SCHEMATIC DIAGRAM ...........................................34
SPECIFICATIONS
1. LCD CHARACTERISTICS 5. POWER SUPPLY
Type : TFT Color LCD Module 5-1. Power: AC 90~264V, 50~60Hz , <0.8A
Active Display Area : 19 inch 5-2. Power Consumption
Pixel Pitch : 0.285 (H) x 0.285 (V) MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR
Color Depth : 16.2M colors POWER ON (TYPICAL) ON/ON ACTIVE 34 W TYPICAL GREEN
OFF/ON
Size : 427.2 (H) x 277.4 (V) x 17 (D) SLEEP MODE ON/OFF OFF Less than 1 W AMBER
Electrical Interface : LVDS OFF/OFF
POWER S/W OFF - - Less than 1 W OFF
Surface Treatment : Hard-coating(3H), Haze=25%
Anti-Glare treatment
Operating Mode : Normally White, Transmissive mode
Backlight Unit : Top/Bottom edge side 4-CCFL
(Cold Cathode Fluorescent Lamp)
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥ 10
(a) For InnoLux MT190AW01-V2 panel: Left
80°/Right 80°;Top 80° /Bottom 80° at type CR≥10 6. ENVIRONMENT
(b) For CMO M190A1-L02 panel: Left 85°/Right 85°;Top
80°/Bottom 80° at type CR≥10 6-1. Operating Temperature : 0°C~40°C
2-2. Luminance (Ambient)
(a) For InnoLux MT190AW01-V2 panel: 300cd/m2 (Typ.) 6-2. Relative Humidity : 20%~90%
220cd/m2 (Min.) (6500k); 170 cd/m2 (Min.)(9300k) (Non-condensing)
2
(b) For CMO2 M190A1-L02 panel: 300cd/m (Typ.) 6-3. MTBF : 50,000 HRS with 90% Confidence
2
220cd/m (Min.) (6500k);170 cd/m (Min.)(9300k)
2-3. Contrast Ratio Lamp Life : 50,000 Hours(Min)
(a) For InnoLux MT190AW01-V2 panel: 500:1 minimum;
700:1 Typical 7. DIMENSIONS (with TILT/SWIVEL)
(b) For CMO M190A1-L02 panel: 500:1 minimum; 850:1
Typical Width : 434.8 mm
3. SIGNAL (Refer to the Timing Chart) Depth : 180 mm
3-1. Sync Signal Type : Height : 370 mm
Separate Sync, Composite, SOG (Sync On Green)
8. WEIGHT (with TILT/SWIVEL)
3-2. Video Input Signal
1) Type : R, G, B Analog Net. Weight : 4.2±0.4 kg
2) Voltage Level : 0~0.71 V Gross Weight : 5.2±0.4 kg
a) Color 0, 0 : 0 Vp-p
b) Color 7, 0 : 0.467 Vp-p
c) Color 15, 0 : 0.714 Vp-p
3) Input Impedance : 75 Ω
4. Max. Resolution
D-sub Analog : 1440 x 900@75Hz
2
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING
• There are some special components used in LCD BE CAREFUL ELECTRIC SHOCK !
monitor that are important for safety. These parts are • If you want to replace with the new backlight (CCFL)
marked on the schematic diagram and or inverter circuit, must disconnect the AC
the replacement parts list. It is essential that these adapter because high voltage appears at inverter
critical parts should be replaced with the circuit about
manufacturer’s specified parts to prevent electric 650Vrms.
shock, fire or other hazard. • Handle with care wires or connectors of the
• Do not modify original design without obtaining written inverter circuit. If the wires are pressed cause short
permission from manufacturer or you will void the and may burn or take fire.
original parts and labor guarantee. • Be careful while tilting and rotating the monitor to
TAKE CARE DURING HANDLING THE LCD MODULE avoid pinching hand(s)
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
CAUTION
Please use only a plastic screwdriver to protect
yourself from shock hazard during service operation.
3
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this 9. Use with this receiver only the test fixtures specified in
service manual and its supplements and addenda, read this service manual.
and follow the SAFETY PRECAUTIONS on page 3 of this CAUTION: Do not connect the test fixture ground strap
publication. to any heat sink in this receiver.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the Electrostatically Sensitive (ES) Devices
safety precautions on page 3 of this publication, always Some semiconductor (solid-state) devices can be
follow the safety precautions. Remember: Safety First. damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
General Servicing Precautions Devices. Examples of typical ES devices are integrated
1. Always unplug the receiver AC power cord from the AC circuits and some field-effect transistors
power source before; and semiconductor "chip" components. The
a. Removing or reinstalling any component, circuit following techniques should be used to help reduce the
board module or any other receiver assembly. incidence of component damage caused by static by static
b. Disconnecting or reconnecting any receiver electrical electricity.
plug or other electrical connection. 1. Immediately before handling any semiconductor
c. Connecting a test substitute in parallel with an component or semiconductor-equipped assembly, drain
electrolytic capacitor in the receiver. off any electrostatic charge on your body by touching a
CAUTION: A wrong part substitution or incorrect known earth ground. Alternatively, obtain and wear a
polarity installation of electrolytic capacitors may commercially available discharging wrist strap device,
result in an explosion hazard. which should be removed to prevent potential shock
d. Discharging the picture tube anode. reasons prior to applying power to the unit under test.
2. Test high voltage only by measuring it with an 2. After removing an electrical assembly equipped with
appropriate high voltage meter or other voltage ES devices, place the assembly on a conductive
measuring device (DVM, FETVOM, etc) equipped with a surface such as aluminum foil, to prevent electrostatic
suitable high voltage probe. charge buildup or exposure of the assembly.
Do not test high voltage by "drawing an arc". 3. Use only a grounded-tip soldering iron to solder or
3. Discharge the picture tube anode only by (a) first unsolder ES devices.
connecting one end of an insulated clip lead to the 4. Use only an anti-static type solder removal device.
degaussing or kine aquadag grounding system shield Some solder removal devices not classified as "anti-
at the point where the picture tube socket ground lead is static" can generate electrical charges sufficient to
connected, and then (b) touch the other end of the damage ES devices.
insulated clip lead to the picture tube anode button, 5. Do not use freon-propelled chemicals. These can
using an insulating handle to avoid personal contact generate electrical charges sufficient to damage ES
with high voltage. devices.
4. Do not spray chemicals on or near this receiver or any of 6. Do not remove a replacement ES device from its
its assemblies. protective package until immediately before you are
5. Unless specified otherwise in this service manual, ready to install it. (Most replacement ES devices are
clean electrical contacts only by applying the following packaged with leads electrically shorted together by
mixture to the contacts with a pipe cleaner, cotton- conductive foam, aluminum foil or comparable
tipped stick or comparable non-abrasive applicator; conductive material).
10% (by volume) Acetone and 90% (by volume) 7. Immediately before removing the protective material
isopropyl alcohol (90%-99% strength) from the leads of a replacement ES device, touch the
CAUTION: This is a flammable mixture. protective material to the chassis or circuit assembly
Unless specified otherwise in this service manual, into which the device will be installed.
lubrication of contacts in not required. CAUTION: Be sure no power is applied to the chassis
6. Do not defeat any plug/socket B+ voltage interlocks or circuit, and observe all other safety precautions.
with which receivers covered by this service manual 8. Minimize bodily motions when handling unpackaged
might be equipped. replacement ES devices. (Otherwise harmless motion
7. Do not apply AC power to this instrument and/or any of such as the brushing together of your clothes fabric or
its electrical assemblies unless all solid-state device the lifting of your foot from a carpeted floor
heat sinks are correctly installed. can generate static electricity sufficient to damage an
8. Always connect the test receiver ground lead to the ES device.)
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
4
General Soldering Guidelines Replacement
1. Use a grounded-tip, low-wattage soldering iron and 1. Carefully insert the replacement IC in the circuit board.
appropriate tip size and shape that will maintain tip 2. Carefully bend each IC lead against the circuit foil pad
temperature within the range or 500。 F to 600。
F. and solder it.
2. Use an appropriate gauge of RMA resin-core solder 3. Clean the soldered areas with a small wire-bristle
composed of 60 parts tin/40 parts lead. brush. (It is not necessary to reapply acrylic coating to
3. Keep the soldering iron tip clean and well tinned. the areas).
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a "Small-Signal" Discrete Transistor
metal handle. Removal/Replacement
Do not use freon-propelled spray-on cleaners. 1. Remove the defective transistor by clipping its leads as
5. Use the following unsoldering technique close as possible to the component body.
a. Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads
temperature. remaining on the circuit board.
(500。F to 600。F) 3. Bend into a "U" shape the replacement transistor leads.
b. Heat the component lead until the solder melts. 4. Connect the replacement transistor leads to the
c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board
suction-type solder removal device or with solder and crimp the "U" with long nose pliers to insure metal
braid. to metal contact then solder each connection.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil. Power Output, Transistor Device
6. Use the following soldering technique. Removal/Replacement
a. Allow the soldering iron tip to reach a normal 1. Heat and remove all solder from around the transistor
temperature (500。 F to 600。F) leads.
b. First, hold the soldering iron tip and solder the strand 2. Remove the heat sink mounting screw (if so equipped).
against the component lead until the solder melts. 3. Carefully remove the transistor from the heat sink of the
circuit board.
c. Quickly move the soldering iron tip to the junction of 4. Insert new transistor in the circuit board.
the component lead and the printed circuit foil, and 5. Solder each transistor lead, and clip off excess lead.
hold it there only until the solder flows onto and 6. Replace heat sink.
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the Diode Removal/Replacement
circuit board printed foil. 1. Remove defective diode by clipping its leads as close
d. Closely inspect the solder area and remove any as possible to diode body.
excess or splashed solder with a small wire-bristle 2. Bend the two remaining leads perpendicular y to the
brush. circuit board.
3. Observing diode polarity, wrap each lead of the new
IC Remove/Replacement diode around the corresponding lead on the circuit
Some chassis circuit boards have slotted holes (oblong) board.
through which the IC leads are inserted and then bent flat 4. Securely crimp each connection and solder it.
against the circuit foil. When holes are the slotted type, 5. Inspect (on the circuit board copper side) the
the following technique should be used to remove and solder joints of the two "original" leads. If they are not
replace the IC. When working with boards using the shiny, reheat them and if necessary, apply additional
familiar round hole, use the standard technique as solder.
outlined in paragraphs 5 and 6 above.
Fuse and Conventional Resistor
Removal Removal/Replacement
1. Desolder and straighten each IC lead in one operation 1. Clip each fuse or resistor lead at top of the circuit board
by gently prying up on the lead with the soldering iron hollow stake.
tip as the solder melts. 2. Securely crimp the leads of replacement component
2. Draw away the melted solder with an anti-static around notch at stake top.
suction-type solder removal device (or with solder 3. Solder the connections.
braid) before removing the IC. CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component temperatures.
5
Circuit Board Foil Repair At Other Connections
Excessive heat applied to the copper foil of any printed Use the following technique to repair the defective copper
circuit board will weaken the adhesive that bonds the foil to pattern at connections other than IC Pins. This technique
the circuit board causing the foil to separate from or involves the installation of a jumper wire on the
"lift-off" the board. The following guidelines and component side of the circuit board.
procedures should be followed whenever this condition is 1. Remove the defective copper pattern with a sharp
encountered. knife.
Remove at least 1/4 inch of copper, to ensure that a
At IC Connections hazardous condition will not exist if the jumper wire
To repair a defective copper pattern at IC connections use opens.
the following procedure to install a jumper wire on the 2. Trace along the copper pattern from both sides of the
copper pattern side of the circuit board. (Use this pattern break and locate the nearest component that is
technique only on IC connections). directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
1. Carefully remove the damaged copper pattern with a of the nearest component on one side of the pattern
sharp knife. (Remove only as much copper as break to the lead of the nearest component on the
absolutely necessary). other side.
2. carefully scratch away the solder resist and acrylic Carefully crimp and solder the connections.
coating (if used) from the end of the remaining copper CAUTION: Be sure the insulated jumper wire
pattern. is dressed so the it does not touch components or
3. Bend a small "U" in one end of a small gauge jumper sharp edges.
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
6
TIMING CHART
VIDEO
A
E
D B
SYNC
C
M
7
DISASSEMBLY
#1 #2
Put a soft cushion on the desk and lay the stand on Twist the stand assy until “click” , then take out the
its side so that the base is accessible. stand assy into the product in the
correct direction as shown in picture.
#3 #4
Pry the hinge cover by flat-tip screw driver or jig and Unscrew the 4 screws on the hinge to separate the
be careful to prevent from scratching the hinge hinge neck ass’y
cover. .
#5 #6
Pull up the front cover side by side(4 sides) and take Turn over the set and pull up the cabinet to separate
away the front cover the control cable, then take away the back cover
8
#7 #8
Pull out the lamp wire. Pull out the LVDS cable
9
BLOCK DIAGRAM
L192WS consists of a main body and a stand (base). The main body contains a InnoLux (or CMO) LCD
module with 4 CCFL lamps, a power board (includes AC/DC, DC/DC, inverter and panel power source),
a control board (key pad) and an interface board. The block diagram is shown as below.
Timing
AC Socket 24C02
D-sub parameters
DDC
10
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital
video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 135MHz.
This part consists of the Scaler, ADC convertor and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1440 X 900 resolution signal and outputs
8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
14V is provided for inverter, 14V is provided for LCD panel and 5V for micom.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board. The inverter
converts from DC14V to AC 700Vrms and operates back-light lamps of module.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC which stores control data, and the Micom
which imbedded in scaler IC.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each
modes is stored in EEPROM.
11
LIPS Board Block Diagram
50~60Hz
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the circuit
included a line-filter, across line capacitor and of course the primary protection fuse.
3. Energy Transfer.
This part function is transfer the primary energy to secondary through a power transformer.
5. Photo-Coupler isolation.
This part function is to feed back the dc output changing status through a photo transistor to primary controller to achieve
the stabilized dc output voltage.
6. Signal collection.
This part function is to collect the any change from the dc output and feed back to the primary through photo transistor.
12
ADJUSTMENT
Windows EDID V1.0 User Manual 2. EDID Read & Write
1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
13
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) Auto Color : W/B balance and Automatically sets the gain and offset value.
b) NVRAM INIT : EEPROM initialize.(24C04)
c) CLEAR ETI : To initialize using time.
d) AGING : Select Aging mode(on/off).
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
i) MODULE : Show Current module Type
j)RS232: Enable/Disable Debug Mode(on/off)
Insert to
15PIN
D-SUB
Port
14
TROUBLESHOOTING GUIDE
1. No Power & Power LED Off
No power
Check pin3 of
IC802 voltage Check R801, R805,
about 1V R822, R823, R817
END
15
2. Backlight can’t be turned on
No raster?
Yes
LED Green?
Yes
Backlight can’t
be turned on.
Yes
Yes
No R526 open
Yes
No
Are connected rightly Connecting the
CN501, CN502, CN503 and output connector
CN504?
again
Yes
Yes
Is there instantaneously pulse wave on No Is Ok IC501? U501, U502 fail
pin1, pin3, pin15 of IC501 at the
moment of restart?
No
IC501 fail
Yes
No T501, T502 fail
Is ok T501, T502?
Yes
Check feedback circuit
Isen,Vsen.(D501,D502.D503,D504,D507,D508) END
16
3. DC output voltage is unstable
1. Output Voltage
Unstable
Check Vpin1-2 of
IC801 about 1V
Check R809,
R814
END
17
4.Output power is unstable
Unstable power
Change R810,
R811, R818
Change
D806, C815
END
18
5.Black Screen and backlight turn on
Black Screen
OK
NG
Check pin34, 51, 66, and 82 Check FB103
Of U105 And U102
OK
NG
Check pin32, 49, 56, and 75 Check FB106
Of U105 And U101
OK
NG
Check Reset (pin84) Check C144, R172
Of U105
OK
OK
OK OK
Check CCFL - Enable Check pin5 of
Inverter Fail
(pin85) of U105 CN101
NG
NG
MCU (imbedded in Check R167, Q106
Scaler IC) Fail R108, R110
19
6.White Screen
White Screen
LVDS Cable OK
Workmanship
Reinsert
NG
Change LVDS OK
LVDS Cable NG
Cable
NG
NG NG
Check Panel-Enable NG
Check the HW Reset Check C144
Of U105 (pin48) is High? Of U105 pin84 ,R172
OK
NG OK
END
20
7. BAD SCREEN
Bad Screen
OK
LVDS Cable Reinsert Workmanship
NG
OK
Change LVDS Cable LVDS Cable NG
NG
OK
OK
21
WIRING DIAGRAM
22
050 150
140
- 23 -
130
120
EXPLODED VIEW
110
160
170
24
REPLACEMENT PARTS LIST
10 RA 412140001390R IC EL817M-B(EVERLIGHT)RoHS
25
260 511130001200R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5/Ni0.06/Ge0
30 509112306100R SCREW,P,CROSS,T.T-3*6,ZnROHS
40 509112306100R SCREW,P,CROSS,T.T-3*6,ZnROHS
26
70 RA 411131516052R ZENER 16V 0.5W DDZ16-F,SOD123(DIODES)RoH
120 R813,R814,R815, 414908010250R RES SMD (0805) 1KΩ J,RT RoHS REV:A
140 R808,R819,R827, 414908010350R RES SMD (0805) 10KΩ J,RT RoHS REV:A
150 R514, 414916010450R RES SMD (0603) 100KΩ J,RT REV:A RoHS
160 R513,R529,R530, 414916010550R RES SMD (0603) 1MΩ J,RT RoHS REV:A
220 R818,R517,R520, 414908330110R RES SMD (0805) 3.3KΩ F,RT RoHS REV:A
350 R535, 414908075150R RES SMD (0805) 750Ω J,RT RoHS REV:A
27
460 C523,C530, 419316820070R C SMD(0805) X7R 6800PF/50V K RoHS
28
170 RA 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 20MM
29
Main PCBA Board
50 506440003800R LABEL,BLANK,YELLOW,10x4mm
30
60 RA 411020047020R DIO BAV70-LF, 70V SOT-23(FEC) ROHS
R130,R129,R114,R117,R120,
160 R125,R127,R131,R132,R101, 414916010150R RES SMD (0603) 100Ω J,RT RoHS REV:A
R167,R168,R178,R179,R124,
R157,R158,R159,R160,R161,
170 414916010250R RES SMD (0603) 1KΩ J,RT RoHS REV:A
R162,R163,
180 R106,R172,R180,R181,R191, 414916010350R RES SMD (0603) 10KΩ J,RT RoHS
190 R102, 414916010450R RES SMD (0603) 100KΩ J,RT REV:A RoHS
200 R105, 414916020350R RES SMD (0603) 20KΩ J,RT RoHS REV:A
220 R121, 414916047150R RES SMD (0603) 470Ω J,RT RoHS REV:A
R108,R110,R149,R150,R154,
230 R155,R173,R174,R166,R182, 414916047250R RES SMD (0603) 4.7KΩ J,RT RoHS
R183,R184,R185,R109,R122,
240 R169, 414916390010R RES SMD (0603) 390Ω F,RT RoHS
250 R133,R134,R135, 414916750910R RES SMD (0603) 75Ω F,RT RoHS REV:A
31
C103,C104,C106,C107,C109,
C129,C156,C131,C132,C134,
310 C135,C136,C137,C139,C141, 419311040060R C SMD(0603) X7R 0.1uF/50V K RoHS
C143,C147,C148,C149,C150,
C151,C152,C166,
320 C140, 419311054070R C SMD(0805) X7R 1uF/16V K RoHS REV:A
C112,C113,C114,C115,C116,
330 419314730060R C SMD (0603) X7R 0.047uF 50V,K RoHS
C117,C118,
340 FB101, 432002312111R BEAD CORE SMD(0805)120Ω 300mA RoHS
390 R107, 414916022150R RES SMD (0603) 220Ω J,RT RoHS REV:A
400 R113,R116,R119, 414916560910R RES SMD (0603) 56Ω F,RT RoHS REV:A
170 R157,R158,R159,R160,R161,R162,R163, 414916010250R RES SMD (0603) 1KΩ J,RT RoHS REV:A
180 R106,R172,R180,R181,R191, 414916010350R RES SMD (0603) 10KΩ J,RT RoHS
190 R102, 414916010450R RES SMD (0603) 100KΩ J,RT REV:A RoHS
200 R105, 414916020350R RES SMD (0603) 20KΩ J,RT RoHS REV:A
210 R136,R137, 414916022250R RES SMD (0603) 2.2KΩ J,RT RoHS
220 R121, 414916047150R RES SMD (0603) 470Ω J,RT RoHS REV:A
R108,R110,R149,R150,R154,R155,R173,
230 R174,R166,R182,R183,R184,R185,R109, 414916047250R RES SMD (0603) 4.7KΩ J,RT RoHS
R122,
240 R169, 414916390010R RES SMD (0603) 390Ω F,RT RoHS
250 R133,R134,R135, 414916750910R RES SMD (0603) 75Ω F,RT RoHS REV:A
260 RP102, 415751035080R RP(0612)10KΩ x4 1/16W J 8P4R RoHS
270 C158,C159,C160,C161,C162,C163,C164, 419301010560R C SMD(0603) NPO 100PF/50V J RoHS
280 C153,C154, 419302200560R C SMD(0603) NPO 22PF/50V J RoHS
290 C126, 419302210560R C SMD(0603) NPO 220PF/50V J RoHS
300 C125, 419303300560R C SMD(0603) NPO 33PF/50V J RoHS
C103,C104,C106,C107,C109,C129,C156,
C131,C132,C134,C135,C136,C137,C139,
310 419311040060R C SMD(0603) X7R 0.1uF/50V K RoHS
C141,C143,C147,C148,C149,C150,C151,
C152,C166,
320 C140, 419311054070R C SMD(0805) X7R 1uF/16V K RoHS REV:A
330 C112,C113,C114,C115,C116,C117,C118, 419314730060R C SMD (0603) X7R 0.047uF 50V,K RoHS
340 FB101, 432002312111R BEAD CORE SMD(0805)120Ω 300mA RoHS
350 FB102,FB103,FB105,FB106, 432002360012R BEAD CORE SMD(0805)60Ω 800mA GBK201209T
360 CN104, 444099030030R CON, SMD 1.0mm 30PIN RoHS AL2309-A0G1Z
370 506140005700R LABEL,BARCODE,BLANK,33x7mm, ROHS,FOR PCB
380 490831300100R PCB,I/F BOARD, LE1957-X10
390 R107, 414916022150R RES SMD (0603) 220Ω J,RT RoHS REV:A
400 R113,R116,R119, 414916560910R RES SMD (0603) 56Ω F,RT RoHS REV:A
410 FB107,FB108,FB109, 432002360140R BEAD CORE SMD(0603)60Ω 600mA, GBK160808
420 511130002203R SOLDER PASTE,Sn96.5/Ag3.0/Cu0.5(SAC305 O
420 RA 511130002200R SOLDER PASTE,Sn96.5-Ag3.0-Cu0.5 ROHS
420 RA 511130002201R SOLDER PASTE,Sn96.5%Ag3.0%Cu0.5%
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SCHEMATIC DIAGRAM
1. DC to DC
2. Input
34
3. Scaler_TSUM16AL
4. Key Pad
35
5. Inverter
6. Power
36
Nov. 2006
P/NO:MFL36713651 Printed in China
37