Mtd2029je w1002
Mtd2029je w1002
Mtd2029je w1002
■Features
■Block Diagram
36 37 2 1 39 21 20 18 23 6 5 4
38 3 40 22 19 24
Vcc OUT1 OUT2 VmmA RsA RsB VmmB OUT3 OUT4 cpA cpB cpC
TSD UVLO Charge Pump
35 26
BRAKE A BRAKE B
8 13
GATE CIRCUIT
GATE CIRCUIT
PHASE A PHASE B
9 12
I0 A 2-bit digital 2-bit digital I0 B
current select current select
10 11
I1 A I1 B
Blank Blank 27
34 1/5 1/5
VrefA Vref B
Current - ONE ONE - Current
Sensor SHOT SHOT Sensor
+ +
33 - - 28
DECAY A + DECAY B
+
CR A SYNC STB PG LG SRM CR B
32 14 30 TAB 31 15 29
■Pin Assignment
<TOP VIEW>
Vmm A 1 40 Rs A
OUT2 2 39 Rs A
OUT2 3 38 OUT1
cpC 4 37 OUT1
cpB 5 36 Vcc
cpA 6 35 BRA A
NC 7 34 Vref A
PHA A 8 33 DEC A
I0 A 9 32 CR A
I1 A 10 31 LG
GND
GND
I1 B 11 30 STB
I0 B 12 29 CR B
PHA B 13 28 DEC B
SYNC 14 27 Vref B
SRM 15 26 BRA B
NC 16 25 NC
NC 17 24 OUT4
OUT3 18 23 OUT4
OUT3 19 22 Rs B
Vmm B 20 21 Rs B
■Electrical Characteristics
■Thermal resistance
Symbol Rating Unit
θja *1 43 ℃/W
∗1 2inches grass epoxy board (FR4) and a heat dissipation Cu pattern area of 250mm2
■Truth Table
H L L L L H 100
H H L L L H 70
H L H L L H 40
H H H r r r 0 (Output OFF)
H L L H H L 100
H H L H H L 70
H L H H H L 40
L r r r L L -
r : don't care
[ ]
1.0V < VCR < 3.0V ∗4 pull-up resistance built-in
All Fast Decay Mode VDEC < 0.6V
All Slow Decay Mode VDEC > 3.4V
Rs Rs
36 37 2 1 39 21 20 18 23 6 5 4
38 3 40 22 19 24
Vcc OUT1 OUT2 VmmA RsA RsB VmmB OUT3 OUT4 cpA cpB cpC
TSD UVLO Charge Pump
Vcc=5
Vcc=5V 35 26
BRAKE A BRAKE B
V
8 13
GATE CIRCUIT
GATE CIRCUIT
GATE ARRAY
GATE ARRAY
PHASE A PHASE B
CPU
CPU
or
or
9 12
I0 A 2-bit digital 2-bit digital I0 B
current select current select
10 11
I1 A I1 B
VrefA Vref B
Current - ONE ONE - Current
Sensor SHOT SHOT Sensor
+ +
Vdec 33 - - 28 Vdec
DECAY A + DECAY B
+
CR A SYNC STB PG LG SRM CR B
32 14 30 TAB 31 15 29
Rs Rs
36 37 2 1 39 21 20 18 23 6 5 4
38 3 40 22 19 24
Vcc OUT1 OUT2 VmmA RsA RsB VmmB OUT3 OUT4 cpA cpB cpC
TSD UVLO Charge Pump
35 26
BRAKE A BRAKE B
GATE ARRAY
GATE ARRAY
8 13
GATE CIRCUIT
GATE CIRCUIT
CPU
CPU
PHASE A PHASE B
or
or
9 12
I0 A 2-bit digital 2-bit digital I0 B
current select current select
10 11
I1 A I1 B
VrefA Vref B
Current - ONE ONE - Current
Sensor SHOT SHOT Sensor
+ +
Vdec 33 - - 28 Vdec
DECAY A + DECAY B
+
CR A SYNC STB PG LG SRM CR B
32 14 30 TAB 31 15 29
Vref
Ichop =
5 ×Rs
Toff = Ct×Rt
1− 0.5×10-3 Rt
tb = Ct×Rt× ln
3 − 0.5×10-3Rt
■Outline Dimension
( Unit : mm )
! Although we are constantly making every effort to improve the quality and reliability of our products, there nevertheless remains a certain
probability that the semiconductor products may occasionally fail or malfunction. Please take careful precautions against product failures or
malfunctions to avoid any injuries, fire accidents or social loss by implementing safety designs such as redundancy designs, designs for fi re
spread prevention, and designs for preventing malfunctions.
! Our semiconductor products listed in this document are not designed or manufactured to be used in devices or systems requiring
extremely high levels of quality and reliability, or the failure or malfunction of which may directly threaten human lives or cause injury.
In the cases where the products are to be used in devices or systems for special applications or devices or systems for specialized
applications shown below, always make sure to consult us in advance.
Special Applications
Transportation devices (automotive, marine, etc.), communication devices for core network, traffic signal devices, fire prevention/anticrime
devices, various safety devices, medical devices, etc.
Specialized Applications
Nuclear power control systems, aircraft and aerospace devices, submarine relay devices, and systems for preserving life, etc.
Even if it is not for a special or specialized application, when IC products are to be used for devices or systems that are desired to last for
a long period under continuous operation, please make sure to consult our sales representative in advance.
● We reserve the right to make any changes to the contents of this manual without prior notice in accordance with modifications to IC products.
● Details of specifications should be exchanged at the adoption of the IC products.
● All information included in this manual is believed to be accurate and reliable. However, our company takes no responsibility for any injury or
damage incurred when using the IC products as described in this manual. Neither do we take any responsibility for issues arising from
infringement of patent or other rights caused by using this manual.
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