TB2946HQ

TOSHIBA Bi-CMOS Linear Integrated Circuit Silicon Monolithic

TB2946HQ
49 W × 4-ch BTL Audio Power IC

The TB2946HQ is a four-channel BTL power amplifier for car

audio applications.
This IC has a pure complementary P-ch and N-ch DMOS output
stage, offering maximum output power (POUT MAX) of 49 W.
It includes a standby switch, mute function and various
protection features.

Features
• High output power Weight: 7.7 g (typ.)
• POUT MAX (1) = 49 W (typ.)
(VCC = 15.2 V, f = 1 kHz, JEITA max, RL = 4 Ω)
• POUT MAX (2) = 43 W (typ.)
(VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 4 Ω)
• : POUT MAX (3) = 70 W (typ.)
(VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 2 Ω)
• POUT (1) = 26 W (typ.)
(VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
• POUT (2) = 23 W (typ.)
(VCC = 13.2 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
• Low THD: 0.007% (typ.) (VCC = 13.2 V, f = 1 kHz, POUT = 5 W, RL = 4 Ω)
• Low noise: VNO = 60 μVrms (typ.)
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(VCC = 13.2 V, Rg = 0 Ω, BW = 20 Hz to 20 kHz, RL = 4 Ω)

• Standby switch (pin 4)
• Mute function (pin 22)
• Output DC offset detection (pin 25)
• Various protection features
Thermal overload; overvoltage; output short-circuits to GND, VCC and across the load; speaker current limiting
• Operating supply voltage : VCC (opr) = 8.0 to 18 V (RL = 4 Ω)
: VCC (opr) = 8.0 to 16 V (RL = 2 Ω)

Note 1: Install the device correctly. Otherwise, the device or system may be degraded, damaged or even destroyed.

Note 2: The protection features are intended to avoid output short-circuits or other abnormal conditions temporarily. It
is not guaranteed that they will prevent the IC from being damaged.
Exposure to conditions beyond the guaranteed operating ranges may not activate the protection features,
resulting in an IC damage due to output short-circuits.

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 TB2946HQ

Block Diagram

+B

C5

C3
C2
10 1 6 20
Ripple TAB VCC2 VCC1

C1 IN1
11 Out1 (+)
9

PW-GND1
8 RL
Out1 (−)
7

C1 IN2
12 Out2 (+)
5

PW-GND2
2 RL

13 Pre-GND Out2 (−)

3

C1 IN3
15 Out3 (+)
17
PW-GND3
18 RL
C6
16 AC-GND Out3 (−)
19

C1 IN4
14 Out4 (+)
21
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PW-GND4
5V 24 RL

4 Stby Out4 (−)

Play 23
R1
Mute 22 Mute
C4

Offset/short 25

Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for
explanatory purposes.

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 TB2946HQ

Detailed Description
1. Standby Switch (pin 4)
The power supply can be turned on or off via
pin 4 (Stby). The threshold voltage of pin 4 is VCC
set at about 3 VBE (typ.). The power supply ON
current is about 0.01 μA (typ.) in the standby Power 10 kΩ
4 ≈ 2 VBE
state. OFF
to Bias
filter network
Standby Control Voltage (VSB): Pin 4

Standby Power VSB (V)

ON OFF 0 to 0.9
OFF ON 2.9 to VCC Figure 1 Setting Pin 4 High Turns on
Power
Check the pop levels when the time constant of
pin 4 is changed.

Benefits of the Standby Switch

(1) VCC can be directly turned on or off by a microcontroller, eliminating the need for a switching relay.

(2) Since the control current is minuscule, a low-current-rated switching relay can be used.

Relay
High-current-rated switch
Battery Battery

VCC VCC From

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microcontroller

– Conventional Method –

Low-current-rated switch From microcontroller

Battery Battery

Standby VCC Standby VCC

– Using the Standby Switch –

Figure 2 Standby Switch

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 TB2946HQ
2. Mute Function (pin 22)
The audio mute function is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the
mute function. The time constant affects pop noise generated when power or the mute function is turned on
or off; thus, it must be determined on a per-application basis. (Refer to Figures 3 and 4.)
The value of the external pull-up resistor is determined, based on pop noise value.

For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be:
3.3 V / 5 V × 47 kΩ = 31 kΩ

ATT – VMUTE
20
VCC = 13.2 V
f = 1 kHz
0
RL = 4 Ω

(dB)
VO = 20dBm
−20 BW = 400 Hz to 30 kHz

Mute attenuation ATT

−40
5V
−60

1 kΩ
22 −80
R1
C4 Mute On/Off
control −100

−120
0 0.5 1 1.5 2 2.5 3

Pin 22 control voltage: VMUTE (V)

Figure 3 Mute Function Figure 4 Mute Attenuation − VMUTE (V)

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 TB2946HQ
3. DC Offset Detection
The purpose of the integrated DC offset detector is to avoid an anomalous DC offset on the outputs,
produced by the input capacitor due to leakage current or short-circuit.

V Positive DC offset (+)

(caused by RS1)

VCC/2 (normal DC voltage)

Leakage current
Vref or short-circuit Negative DC offset (−)
(caused by RS2)
+
RS1
Elec. vol
5V
RS2

−
Vref/2 Vbias
25 LPF To a microcontroller
A B The microcontroller shuts down the
system if the output is lower than
the specified voltage.

Figure 5 DC Offset Detection Mechanism

OUT(-)

Amp output VCC/2

Offset detection
threshold voltage
OUT(+)
GND
Time
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Voltage at (A)
(pin 25)

GND
Time

Voltage at (B)
(LPF output)

GND
RS2 Time

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 TB2946HQ
4. Layer Short Detection
The TB2946HQ may be properly connected to a load such as a 4-Ω speaker, but one of the speaker lines may
be shorted to ground through a low-impedance path. The TB2946HQ can detect such a condition.

VCC

IC out

SP = 4 Ω
out

GND

The negative (−) speaker connection is shorted to ground

through a low-impedance path due to some irregularities.

Figure 6 Layer Short

As is the case with output DC offset detection, pin 25 is also activated when there is a short on one of the
speaker lines as shown above. The detection impedance is 3.3Ω (typ.).
This feature allows detection of a short-circuit through a low-impedance path other than the speaker
impedance. It helps to avoid speaker damage in case of anomalous system conditions and improve system
reliability.

Dete ction impe dance vs junction te mperature

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12 Te st co nditions
Vcc = 1 3.2 V
10 In tern al resistor
Detection impeda nce (Ω)

= 200 Ω
8 5 V-10 kΩ
Pull-u p
6

0
-50 0 50 100 150 200
Tj (℃)

Figure 7 Typical Detection Impedance vs Junction Temperature (Intended as a Guide)

Note 3: The detection impedance varies with temperature, as shown above. Experiment with actual hardware.

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 TB2946HQ
5. Pop Noise Suppression
Since the TB2946HQ uses the AC-GND pin (pin 16) as the common input reference voltage pin for all
amplifiers, the ratio of the input capacitance (C1) to the AC-to-GND capacitance (C6) should be 1:4.
Also, if power is removed before C1 and C6 are completely charged, pop noise will be generated because of
unbalanced DC currents.
To avoid this problem, it is recommended to use a larger capacitor as C2 to increase the charging times of C1
and C6. Note, however, that C2 also affects the time required from power-on to audio output.
The pop noise generated by the muting and unmuting of the audio output varies with the time constant of
C4. A larger capacitance reduces the pop noise, but increases the time from when the mute control signal is
applied to C4 to when the mute function is enabled.
Caution for use : We propose that C2 value are adjustable from 10μF to 47μF at the turn-on timing.

6. External Component Constants

Effects
Recommended
Component Purpose When lower than When higher than Notes
Value
recommended value recommended value
Pop noise is
Cut-off frequency is generated
C1 0.22 μF To eliminate DC Cut-off frequency is reduced.
increased. when VCC is
turned on.
C2 10 μF To reduce ripple Powering on/off is faster. Powering on/off is slower.
To provide
C3 0.1 μF sufficient Reduces noise and provides sufficient oscillation margin
oscillation margin
High pop noise. Duration until Low pop noise. Duration until
To reduce pop
C4 1 μF mute function is turned on/off mute function is turned on/off
noise
is short. is long.
C5 3900 μF Ripple filter Power supply humming and ripple filtering.
Pop noise is
Common
generated
C6 1 μF reference voltage Pop noise is suppressed when C1: C6 = 1:4.
when VCC is
for all input
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turned on.

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 TB2946HQ

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Peak supply voltage (0.2 s) VCC (surge) 50 V

DC supply voltage VCC (DC) 25 V
Operating supply voltage VCC (opr) 18 V
Output current (peak) IO (peak) 9 A
Power dissipation PD (Note 4) 125 W
Operating temperature Topr −40 to 85 °C
Storage temperature Tstg −55 to 150 °C

Note 4: Package thermal resistance θj-T = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must
not be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered and the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation
in other equipment. Applications using the device should be designed so that no absolute maximum rating
will ever be exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.

Electrical Characteristics
(VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, Ta = 25°C unless otherwise specified)
Test
Characteristics Symbol Test Condition Min Typ. Max Unit
Circuit
Quiescent supply current ICCQ ⎯ VIN = 0 ⎯ 160 320 mA
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POUT MAX (1) ⎯ VCC = 15.2 V, max POWER ⎯ 49 ⎯

POUT MAX (2) ⎯ VCC = 14.4 V, max POWER ⎯ 43 ⎯
VCC = 14.4 V, max POWER
Output power POUT MAX (3) ⎯ ⎯ 70 ⎯ W
RL = 2 Ω
POUT (1) ⎯ VCC = 14.4 V, THD = 10% ⎯ 26 ⎯
POUT (2) ⎯ THD = 10% 21 23 ⎯
Total harmonic distortion THD ⎯ POUT = 5 W ⎯ 0.007 0.07 %
Voltage gain GV ⎯ VOUT = 0.775 Vrms 25 26 27 dB
Channel-to-channel voltage gain ΔGV ⎯ VOUT = 0.775 Vrms −1.0 0 1.0 dB
VNO (1) ⎯ Rg = 0 Ω, DIN45405 ⎯ 60 ⎯
Output noise voltage Rg = 0 Ω, μVrms
VNO (2) ⎯ ⎯ 60 70
BW = 20 Hz to 20 kHz
frip = 100 Hz, Rg = 620 Ω
Ripple rejection ratio R.R. ⎯ 50 65 ⎯ dB
Vrip = 0.775 Vrms
Rg = 620 Ω
Crosstalk C.T. ⎯ ⎯ 80 ⎯ dB
POUT = 4 W
Output offset voltage VOFFSET ⎯ ⎯ −90 0 90 mV
Input resistance RIN ⎯ ⎯ ⎯ 90 ⎯ kΩ
Standby condition,
Standby current ISB ⎯ ⎯ 0.01 1 μA
V4 = 0, V22 = 0
VSB H ⎯ POWER: ON 2.9 ⎯ VCC
Standby control voltage V
VSB L ⎯ POWER: OFF 0 ⎯ 0.9
VM H ⎯ MUTE: OFF 2.9 ⎯ 6.0
Mute control voltage V
VM L ⎯ MUTE: ON, R1 = 47 kΩ 0 ⎯ 0.9

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 TB2946HQ
Test
Characteristics Symbol Test Condition Min Typ. Max Unit
Circuit
MUTE: ON、DIN_AUDIO
Mute attenuation ATT M ⎯ 85 100 ⎯ dB
VOUT = 7.75 Vrms → Mute: OFF
Upper cut-off frequency Fth ⎯ GV = 26dB, −3dB ⎯ 250 ⎯ kHz
Rpull-up = 10 kΩ, +V = 5.0 V
DC offset threshold voltage Voff-set ⎯ ±1.0 ±1.5 ±2.0 V
Out(+)-Out(-)
Rpull-up = 10 kΩ, +V = 5.0 V
channel (+) or (-) shorted to
Layer short detection impedance R half-short ⎯ ⎯ 3.3 ⎯ Ω
GND, when between Rs
impedance output to GND.
Pin 25 saturation voltage Rpull-up = 10 kΩ, +V = 5.0 V
P25-Sat ⎯ ⎯ 100 500 V
(at each detector ON condition) (pin 25 = low)

Test Circuit

+B
C2: 10 μF

C3: 0.1 μF
3900 μF
10 1 6 20

C5:
Ripple TAB VCC2 VCC1

C1: 0.22 μF IN1

11 Out1 (+)
9

PW-GND1
8 RL = 4 ohm
Out1 (−)
7

C1: 0.22 μF IN2

12 Out2 (+)
5
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PW-GND2
2 RL = 4 ohm
13 Pre-GND Out2 (−)
3

C1: 0.22 μF IN3

15 Out3 (+)
17
PW-GND3
18 RL = 4 ohm
C6: 1 μF
16 AC-GND Out3 (−)
19

C1: 0.22 μF IN4

14 Out4 (+)
21

PW-GND4
5V 24 RL = 4 ohm
4 Stby Out4 (−)
Play 23
R1: 47 kΩ
Mute 22 Mute
C4: 1 μF

Offset/short 25

Components in the test circuit are only used to determine the device characteristics.
It is not guaranteed that the system will work properly with these components.

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 TB2946HQ

THD – POUT (ch1) THD – POUT (ch2)

100 100
VCC = 13.2 V VCC = 13.2 V
50 RL = 4 Ω 50 RL = 4 Ω
30 Filter 30 Filter
100 Hz : to 30 kHz 100 Hz : to 30 kHz
1kHz : 400 Hz to 30 kHz 1kHz : 400 Hz to 30 kHz
10 10
10 kHz : 400 Hz to 10 kHz : 400 Hz to
5 20 kHz : 400 Hz to 5 20 kHz : 400 Hz to
Total harmonic distortion THD (%)

Total harmonic distortion THD (%)

3 3

20 kHz 20 kHz
1 1

0.5 0.5
0.3 10 kHz 0.3 10 kHz

0.1 0.1

0.05 0.05
0.03 0.03

1 kHz 1 kHz
0.01 0.01

0.005 f = 100 Hz 0.005 f = 100 Hz

0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

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THD – POUT (ch3) THD – POUT (ch4)

100 100
VCC = 13.2 V VCC = 13.2 V
50 RL = 4 Ω 50 RL = 4 Ω
30 Filter 30 Filter
100 Hz : to 30 kHz 100 Hz : to 30 kHz
1kHz : 400 Hz to 30 kHz 1kHz : 400 Hz to 30 kHz
10 10
10 kHz : 400 Hz to 10 kHz : 400 Hz to
5 20 kHz : 400 Hz to 5 20 kHz : 400 Hz to

3 3
Total harmonic distortion THD (%)

Total harmonic distortion THD (%)

20 kHz 20 kHz
1 1

0.5 0.5
0.3 10 kHz 0.3 10 kHz

0.1 0.1

0.05 0.05
0.03 0.03

1 kHz 1 kHz
0.01 0.01

0.005 f = 100 Hz 0.005 f = 100 Hz

0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

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 TB2946HQ

THD – POUT (ch1) THD – POUT (ch2)

100 100
VCC = 13.2 V VCC = 13.2 V
50 RL = 4 Ω 50 RL = 4 Ω
30 f = 1 kHz 13.2 V 30 f = 1 kHz 13.2 V
Filter Filter
400 Hz to 30 kHz 400 Hz to 30 kHz
10 10

5 5
Total harmonic distortion THD (%)

Total harmonic distortion THD (%)

3 3

VCC = 8 V 16 V VCC = 8 V 16 V
1 1

0.5 0.5
0.3 0.3

0.1 0.1

0.05 0.05
0.03 0.03

0.01 0.01

0.005 0.005
0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

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THD – POUT (ch3) THD – POUT (ch4)

100 100
VCC = 13.2 V VCC = 13.2 V
50 RL = 4 Ω 50 RL = 4 Ω
30 f = 1 kHz 13.2 V 30 f = 1 kHz 13.2 V
Filter Filter
400 Hz to 30 kHz 400 Hz to 30 kHz
10 10

5 5
Total harmonic distortion THD (%)

Total harmonic distortion THD (%)

3 3

VCC = 8 V 16 V VCC = 8 V 16 V
1 1

0.5 0.5
0.3 0.3

0.1 0.1

0.05 0.05
0.03 0.03

0.01 0.01

0.005 0.005
0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

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 TB2946HQ

muteATT – f THD – f
0 3
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω

Total harmonic distortion THD (%)

1
Mute attenuation muteATT (dB)

−20
VOUT = 7.75 Vrms (20dBm) POUT = 5 W

0.3 No filter
−40

0.1
−60
4 ch
0.03 1 ch
3 ch
−80
1 ch to 4 ch 0.01
2 ch
−100
0.003

−120 0.001
10 100 1k 10 k 100 k 10 100 1K 10K 100K

frequency f (Hz) frequency f (Hz)

GV – f R.R. – f
40 0
VCC = 13.2 V
RL = 4 Ω
Ripple rejection ratio R.R. (dB)

Vrip = 0.775 Vrms (0dBm)

30 −20
Voltage gain GV (dB)

1 ch to 4 ch

20 −40
3ch
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4ch
10 −60
2ch
VCC = 13.2 V 1ch
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
0 −80
10 100 1K 10K 100K 10 100 1K 10K 100K

frequency f (Hz) frequency f (Hz)

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 TB2946HQ

VIN – POUT (ch1) VIN – POUT (ch2)

40 40
20 kHz 10 kHz 10 kHz 1 kHz

100 Hz 100 Hz
20 kHz
1 kHz
(W)

(W)
30 30
POUT

POUT
20 20
Output power

Output power
10 10
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω
No filter No filter
0 0
0 2 4 6 8 10 0 2 4 6 8 10

Input voltage VIN (Vrms) Input voltage VIN (Vrms)

VIN – POUT (ch3) VIN – POUT (ch4)

40 40
10 kHz 1 kHz 10 kHz 1 kHz

100 Hz 20 kHz 100 Hz

20 kHz
(W)

(W)

30 30
POUT

POUT

20 20
Output power

Output power

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10 10
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω
No filter No filter
0 0
0 2 4 6 8 10 0 2 4 6 8 10

Input voltage VIN (Vrms) Input voltage VIN (Vrms)

ICCQ – VCC PDMAX – Ta

200 120
(W)

RL = ∞ (1) INFINITE HEAT SINK

RθJC = 1°C/W
VIN = 0 V
100
ICCQ (mA)

(2) HEAT SINK (RθHS = 3.5°C/W

Allowable power dissipation PDMAX

160
RθJC + RθHS = 4.5°C/W
(3) NO HEAT SINK
80 RθJA = 39°C/W
120 (1)
Quiescent Current

60

80
40

40
20 (2)
(3)
0 0
0 5 10 15 20 25 0 25 50 75 100 125 150

Supply voltage VCC (V) Ambient temperature Ta (°C)

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 TB2946HQ

C.T. – f (ch1) C.T. – f (ch2)

0 0
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω
VOUT = 0.775 Vrms (0dBm) VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω RG = 620 Ω
−20 −20

(dB)
(dB)

Cross talk C.T.

Cross talk C.T.

−40 CT (1-3) −40

CT (1-4)
CT (2-3)
−60 −60
CT (2-1)
CT (1-2)

CT (2-4)
−80 −80
10 100 1k 10 k 100 k 10 100 1k 10 k 100 k

frequency f (Hz) frequency f (Hz)

C.T. – f (ch3) C.T. – f (ch4)

0 0
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω
VOUT = 0.775 Vrms (0dBm) VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω RG = 620 Ω
−20 −20
(dB)

(dB)
Cross talk C.T.

Cross talk C.T.

−40 −40

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CT (4-1)
−60 −60 CT (4-2)
CT (3-1)
CT (3-4)

CT (3-2) CT (4-3)
−80 −80
10 100 1k 10 k 100 k 10 100 1k 10 k 100 k

frequency f (Hz) frequency f (Hz)

VNO – Rg PD – POUT
300 80
VCC = 13.2 V f = 1 kHz
Output noise voltage VNO (μVrms)

RL = 4 Ω RL = 4 Ω
Filter: 4ch drive
(W)

20 Hz to 20 kHz 60
200
Power dissipation PD

40

18 V
100
1ch to 4ch
20
13.2 V 16 V

VCC = 9.0 V
0 0
10 100 1k 10 k 100 k 0 10 20 30 40 50 60 70

Signal source resistance Rg (Ω) Output power POUT (W)

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 TB2946HQ

Test Board Layout for TOSHIBA 4-Channel Power Circuitry

The layout diagrams below illustrate the front and back sides of the test board “RP-2024” for testing Toshiba’s
4-channel power circuitry, which is housed in a HZIP25-P-1.00F (SPP25) package.

Note 5: This test board is designed to be used for several power amplifiers. Therefore, devices that are externally
connected to the power amplifier to be tested must be checked before setting up the test board.

Front Side

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Back Side

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 TB2946HQ

Package Dimensions

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Weight: 7.7 g (typ.)

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 TB2946HQ

• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the
effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or
the negative current resulting from the back electromotive force at power OFF. For details on how to connect a
protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual
IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.
• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
• Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as
input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to
a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current
can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection type IC that inputs output DC voltage to a speaker directly.
• Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current protection circuits operate against the over current, clear the over current status
immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
• Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits
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operate against the over temperature, clear the heat generation status immediately. Depending on the method of
use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to
not operate properly or IC breakdown before operation.
• Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in
IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
• Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip.
In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon
rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink
installation, refer to individual technical datasheets or IC databooks.

About solderability, following conditions were confirmed

• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux

17 2009-01-29

Datasheet pdf - http://www.DataSheet4U.net/

 TB2946HQ

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also
refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the
specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
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power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
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• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
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WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.

18 2009-01-29

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