Reference Only: Chip Ferrite Bead BLM18 Z1D Murata Standard Reference Specification (AEC-Q200)

Download as pdf or txt
Download as pdf or txt
You are on page 1of 11

Reference Only

Spec. No. JENF243A-9122Q-01 P.1/11


Chip Ferrite Bead BLM18□□□□□□Z1D
Murata Standard Reference Specification [AEC-Q200]
1.Scope
This reference specification applies to Chip Ferrite Bead BLM18_□Z Series for Automotive Electronics based on
AEC-Q200 except for Power train and Safety.

2.Part Numbering
(ex.) BL M 18 AG 121 S Z 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (4)Characteristics (7)Category(for Automotive Electronics)
(2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit
(3)Dimension (L×W) (6)Performance (9)Packaging (D:Taping)

3.Rating
DC Resistance
Impedance () ( max.) (*1)
(at 100MHz)(*1) Rated
(refer to below
Current ESD Rank
Customer MURATA (refer to below comment)
(mA) Remark 2:2kV
Part Number Part Number comment) Initial Values
Values After
at at Testing
Typical
85℃ 125℃
BLM18PG300SZ1D 20 min. 30 1000 0.05 0.10
BLM18PG330SZ1D 33±25% 33 3000*2 1000*2 0.025 0.050
BLM18PG600SZ1D 40 min. 60 1000 0.1 0.2
BLM18PG121SZ1D 120±25% 120 2000*2 1000*2 0.05 0.10
BLM18PG181SZ1D 180±25% 180 1500*2 1000*2 0.09 0.18
BLM18PG221SZ1D 220±25% 220 1400*2 1000*2 0.10 0.14
BLM18PG331SZ1D 330±25% 330 1200*2 1000*2 0.15 0.20
BLM18PG471SZ1D 470±25% 470 1000 0.20 0.26
BLM18SP300SZ1D 30±10 30 6000*1 4000*1 0.008 0.010 For DC
BLM18SP101SZ1D 100±25% 100 3700*1 2500*1 0.022 0.026 power line
BLM18SP221SZ1D 220±25% 220 2800*1 1900*1 0.040 0.048
BLM18SP601SZ1D 600±25% 600 1500*1 1000*1 0.140 0.168 2
BLM18SP102SZ1D 1000±25% 1000 1200*1 800*1 0.185 0.222
BLM18KG221SZ1D 220±25% 220 2200*2 1500*2 0.050 0.060
BLM18KG331SZ1D 330±25% 330 1700*2 1200*2 0.080 0.095
BLM18KG471SZ1D 470±25% 470 1500*2 1000*2 0.130 0.145
BLM18KG601SZ1D 600±25% 600 1300*2 1000*2 0.150 0.165
BLM18KG102SZ1D 1000±25% 1000 1000*2 800*2 0.200 0.230
BLM18AG121SZ1D 120±25% 120 800 0.18 0.28
BLM18AG151SZ1D 150±25% 150 700 0.25 0.35
BLM18AG221SZ1D 220±25% 220 700 0.25 0.35 For
general use
BLM18AG331SZ1D 330±25% 330 600 0.30 0.40
BLM18AG471SZ1D 470±25% 470 550 0.35 0.45

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.2/11

DC Resistance
Impedance () ( max.) (*1)
(at 100MHz)(*1) Rated
(refer to below
Current ESD Rank
Customer MURATA (refer to below comment)
(mA) Remark 2:2kV
Part Number Part Number comment) Initial Values
Values After
at at Testing
Typical
85℃ 125℃
BLM18AG601SZ1D 600±25% 600 500 0.38 0.48 For
BLM18AG102SZ1D 1000±25% 1000 450 0.50 0.60 general use
BLM18BB050SZ1D 5±25% 5 800 0.05 0.10
BLM18BA050SZ1D 5±25% 5 500 0.2 0.3
BLM18BB100SZ1D 10±25% 10 700 0.10 0.20
BLM18BA100SZ1D 10±25% 10 500 0.25 0.35
BLM18BB220SZ1D 22±25% 22 700 0.20 0.30
BLM18BA220SZ1D 22±25% 22 500 0.35 0.45
BLM18BB470SZ1D 47±25% 47 600 0.25 0.35
BLM18BD470SZ1D 47±25% 47 500 0.3 0.4
BLM18BA470SZ1D 47±25% 47 300 0.55 0.65
BLM18BB600SZ1D 60±25% 60 600 0.25 0.35
BLM18BA750SZ1D 75±25% 75 300 0.70 0.80
BLM18BB750SZ1D 75±25% 75 600 0.30 0.40
BLM18BB121SZ1D 120±25% 120 550 0.30 0.40
BLM18BD121SZ1D 120±25% 120 300 0.4 0.5
BLM18BA121SZ1D 120±25% 120 200 0.9 1.0 For
BLM18BB141SZ1D 140±25% 140 500 0.35 0.45 high speed
BLM18BB151SZ1D 150±25% 150 450 0.37 0.47 signal line
BLM18BD151SZ1D 150±25% 150 300 0.4 0.5
BLM18BB221SZ1D 220±25% 220 450 0.45 0.55
BLM18BD221SZ1D 220±25% 220 250 0.45 0.55
2
BLM18BB331SZ1D 330±25% 330 400 0.58 0.68
BLM18BD331SZ1D 330±25% 330 250 0.5 0.6
BLM18BD421SZ1D 420±25% 420 250 0.55 0.65
BLM18BB471SZ1D 470±25% 470 300 0.85 0.95
BLM18BD471SZ1D 470±25% 470 250 0.55 0.65
BLM18BD601SZ1D 600±25% 600 200 0.65 0.75
BLM18BD102SZ1D 1000±25% 1000 200 0.85 0.95
BLM18BD152SZ1D 1500±25% 1500 150 1.2 1.3
BLM18BD182SZ1D 1800±25% 1800 150 1.5 1.6
BLM18BD222SZ1D 2200±25% 2200 150 1.5 1.6
BLM18BD252SZ1D 2500±25% 2500 150 1.5 1.6
BLM18SG260TZ1D 26±25% 26 6000*2 1000*2 0.007 0.012
BLM18SG700TZ1D 70±25% 70 4000*2 1000*2 0.020 0.030
BLM18SG121TZ1D 120±25% 120 3000*2 1000*2 0.025 0.035
BLM18SG221TZ1D 220±25% 220 2500*2 1000*2 0.040 0.055
BLM18SG331TZ1D 330±25% 330 1500*2 1000*2 0.070 0.085 For DC
BLM18SN220TZ1D 22±7% 22 8000*2 5000*2 0.004 0.005 power line
BLM18KG260TZ1D 26±25% 26 6000*2 4000*2 0.007 0.012 (Thin type)
BLM18KG300TZ1D 30±25% 30 5000*2 3300*2 0.010 0.015
BLM18KG700TZ1D 70±25% 70 3500*2 2200*2 0.022 0.032
BLM18KG101TZ1D 100±25% 100 3000*2 1900*2 0.030 0.040
BLM18KG121TZ1D 120±25% 120 3000*2 1900*2 0.030 0.040

 Operating Temperature : -55°C to +125°C  Storage Temperature : -55°C to +125°C

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.3/11

(*1)
Standard Testing Conditions
 Unless otherwise specified   In case of doubt 
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa

R a te d C u rre n t ( A )
Rated current
(*2)In case of Rated current is more than 1A, at 85°C
Rated Current is derated as right figure
depending on the operating temperature. Rated current
at 125°C

0
85 125

Operating Temperature (°C)

4.Style and Dimensions


1.6±0.15 0.8±0.15

■ Equivalent Circuit
0.8±0.15

0.4±0.2

: Electrode
( Resistance element becomes
dominant at high frequencies. )
(in mm) ■ Unit Mass (Typical value)
T BLM18SG***TZ1D 0.5±0.15 BLM18*****TZ1D 0.004g
BLM18KG***TZ1D
0.6±0.15 BLM18*****SZ1D 0.005g
BLM18SN***TZ1D
BLM18*****SZ1D 0.8±0.15

5.Marking
No marking.

6.Specifications
6-1.Electrical Performance
No. Item Specification Test Method
6-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
6-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter

For BLM18SN
Measuring Equipment : YOKOGAWA 755611 or the equivalent
Test Fixture : KEYSIGHT 16044A or the equivalent
*Except resistance of the Substrate and Wire

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.4/11
6-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No. Stress Test Method
3 High 1000hours at 125 deg C Meet Table A after testing.
Temperature Set for 24hours at room Table A
Exposure temperature, then measured. Appearance No damage
Impedance Within ±30%
Change (for BLM18SN
(at 100MHz) Within ±50%)
DC
Meet item 3.
Resistance
4 Temperature Cycling 1000cycles Meet Table B after testing.
-55 deg C to +125 deg C TableB
Set for 24hours at room Appearance No damage
temperature, then measured. Impedance Within ±30%
Change (for BLM18SN
(at 100MHz) Within ±50%)
(for BLM18KG
Within-10%to+50%)
DC Resistance Meet item 3.
5 Destructive Per EIA469 No defects
Physical Analysis No electrical tests
7 Biased Humidity 1000hours at 85 deg C, 85%RH Meet Table C after testing.
Apply max rated current. TableC

Appearance No damage
Impedance Within ±30%
Change (for BLM18KG/SN
(at 100MHz) Within ±50%)
DC
Meet item 3.
Resistance

8 Operational Life Apply 125 deg C 1000hours Meet Table C after testing.
Set for 24hours at room If the rated current of parts exceed 1A,
temperature, then measured the operating temperature should be 85 deg C.
9 External Visual Visual inspection No abnormalities

10 Physical Dimension Meet ITEM 4 No defects


(Style and Dimensions)
12 Resistance to Solvents Per MIL-STD-202 Not Applicable
Method 215
13 Mechanical Shock Per MIL-STD-202 Method 213 Meet Table D after testing.
Condition F Table D
1500g's (14.7N)/0.5ms/ Appearance No damage
Half sine Impedance
Change Within ±30%
(at 100MHz)
DC Resistance Meet item 3.

14 Vibration 5g's(0.049N) for 20 minutes, Meet Table D after testing.


12cycles each of 3 orientations
Test from 10-2000Hz.
15 Resistance Solder temperature Pre-heating:150C +/-10 deg,60s to 90s
to Soldering Heat 260C+/-5 deg C Meet Table C after testing.
Immersion time 10s

AEC-Q200 Murata Specification / Deviation

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.5/11
No. Stress Test Method
17 ESD Per AEC-Q200-002 Meet Table D after testing.
ESD Rank: Meet Item 3. (Rating)
18 Solderability Per J-STD-002 Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical Measured : Impedance No defects
Characterization
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm) Meet Table C after testing.
Deflection 2mm(min)
60s minimum holding tim
22 Terminal Strength Per AEC-Q200-006 No defects

30 Electrical Per ISO-7637-2 Not Applicable


Transient
Conduction

7.Specification of Packaging
7-1.Appearance and Dimensions (8mm-wide paper tape)
Part Number Type Appearance and Dimensions

1.75±0.1
2.0±0.05
4.0±0.1 +0.1
4.0±0.1  1.5 -0

3.5±0.05

8.0±0.3
1.85±0.1

BLM18PG***SZ1D
BLM18SP***SZ1D
8mm-
BLM18AG***SZ1D
wide Paper tape
BLM18B****SZ1D
4mm-pitch
BLM18SN***TZ1D
BLM18KG****Z1D 1.05±0.1 a
Direction of feed

Item Dimension “a”


BLM18*****SZ1D 1.1 max.
BLM18KG***TZ1D
0.85 max.
BLM18SN***TZ1D
1.75±0.1

2.0±0.05
+0.1
2.0±0.1 4.0±0.1
2.0±0.05  1.5 -0
3.5±0.05

8mm-
BLM18SG***TZ1D
1.85±0.1

8.0±0.3

wide Paper tape


2mm-pitch

1.05±0.1 0.9max.
Direction of Feed

(in mm)

(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.6/11
and sealed by top tape and bottom tape.
(2) The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.

7-2.Tape Strength
(1)Pull Strength
Top tape Top tape
165 to 180 degree
5N min. F
Bottom tape
(2)Peeling off force of Top tape
Bottom tape Base tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min

7-3.Taping Condition
(1)Standard quantity per reel
Type Quantity per 180mm reel
BLM18(except BLM18SG) 4000 pcs. / reel
BLM18SG 10000 pcs. / reel

(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2) , Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year/ Last digit of year
Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS discrimination(2) ,Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.7/11

7-4. Specification of Outer Case

Label
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
H (Reel)
W D H
D 186 186 93 5
W
Above Outer Case size is typical. It depends on a quantity of an order.

8. Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.

8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.

8-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.

8-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (trains,ships,etc.)
(4)Power plant control equipment (9)Data-processing equipment
(5)Medical equipment (10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above

8-5. Corrosive gas


Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration
due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.

9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.

9-1.Land pattern designing


Standard land dimensions
< For BLM18 series (except BLM18P/BLM18S/BLM18K type) >

Chip Ferrite Bead

Type Soldering a b c
c BLM18 (except18P/18S/ Flow 0.8 2.5 0.7
BLM18K type) Reflow 0.7 2.0 0.7
a Solder Resist (in mm)
b Pattern

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.8/11

< For BLM18P/BLM18S/BLM18K type >


Chip Ferrite Bead
Rated Land pad thickness
Type Current Soldering a b c and dimension d
(A) 18µm 35µm 70µm
c d 0.5 to 1.5 0.7 0.7 0.7
BLM18P
1.7 to 2.5 Flow Flow 1.2 0.7 0.7
BLM18S
3 to 4 Flow/ 0.8 2.5 2.4 1.2 0.7
BLM18K 0.7
5 to 6 Reflow Reflow Reflow 6.4 3.3 1.65
a Solder Resist
BLM18SN 8 0.7 2.0 - 6.4 3.3
b Pattern BLM18SP 1.2 to 6.0 - 6.4 -
The excessive heat by land pads may cause deterioration (in mm)
at joint of products with substrate.
9-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.

(3)soldering profile
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃

Limit Profile

150

Heating Time
Standard Profile

60s min. Time. (s)

Standard Profile Limit Profile


Pre-heating 150℃、60s min.
Heating 250℃、4~6s 265℃±3℃、5s max.
Cycle of flow 2 times 2 times

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.9/11

□Reflow soldering profile


Temp. 260℃
(℃)
245℃±3℃
230℃
220℃
Limit Profile
180

150

30s~60s Standard Profile

60s max.

90s±30s Time. (s)

Standard Profile Limit Profile


Pre-heating 150~180°C 、90s±30s
Heating above 220°C、30s~60s above 230°C、60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times

9-3.Reworking with soldering iron


Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max.  Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds.  Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.

9-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit

Recommendable

t 1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.

9-5.Attention regarding P.C.B. bending


The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a

b Products shall be located in the sideways


direction (Length:ab) to the mechanical
stress.
〈 Poor example〉 〈 Good example〉

(2)Components location on P.C.B. separation.


It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.

Contents of Measures Stress Level


(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.10/11

C
Perforation
B

D
A
Slit

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes


When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.

Screw Hole Recommended

9-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.

9-7. Operating Environment


Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

9-8. Resin coating


The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.

9-9.Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken
solder joints. Before starting your production process,
test your cleaning equipment / process to insure it does not degrade this product.

9-10. Handling of a substrate


After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.

Bending Twisting

MURATA MFG.CO., LTD.


Reference Only
Spec. No. JENF243A-9122Q-01 P.11/11

9-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
 Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

10. Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD.

You might also like