Rs1A, Rs1B, Rs1D, Rs1G, Rs1J, Rs1K: Vishay General Semiconductor
Rs1A, Rs1B, Rs1D, Rs1G, Rs1J, Rs1K: Vishay General Semiconductor
Rs1A, Rs1B, Rs1D, Rs1G, Rs1J, Rs1K: Vishay General Semiconductor
www.vishay.com
Vishay General Semiconductor
Surface-Mount Fast Switching Rectifier
FEATURES
• Low profile package Available
MECHANICAL DATA
PRIMARY CHARACTERISTICS Case: SMA (DO-214AC)
IF(AV) 1.0 A Molding compound meets UL 94 V-0 flammability rating
VRRM 50 V, 100 V, 200 V, 400 V, 600 V, 800 V Base P/N-E3 - RoHS-compliant, commercial grade
IFSM 30 A Base P/N-M3 - halogen-free, RoHS-compliant, commercial
trr 150 ns, 250 ns, 500 ns grade
Base P/NHE3_X - RoHS-compliant and AEC-Q101 qualified
VF 1.3 V
Base P/NHM3_X - halogen-free, RoHS-compliant and
TJ max. 150 °C
AEC-Q101 qualified
Package SMA (DO-214AC) (“_X” denotes revision code e.g. A, B, .....)
Circuit configuration Single
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
E3, M3, HE3 and HM3 suffix meets JESD 201 class 2
whisker test
Polarity: color band denotes cathode end
100
0.8 TJ = 100 °C
1
0.6
0.1
0.4
TJ = 25 °C
0.01
0.2 P.C.B. Mounted on TJ = -40 °C
0.2" x 0.2" (5.0 mm x 5.0 mm)
Copper Pad Areas
0.001
0
10 20 30 40 50 60 70 80 90 100
0 20 40 60 80 100 120 140 160 180
Lead Temperature (°C)
Percent of Rated Peak Reverse Voltage (%)
Fig. 1 - Forward Current Derating Curve Fig. 4 - Typical Reverse Characteristics
50
100
TL = 90 °C TJ = 25 °C
Peak Forward Surge Current (A)
30
RS1A thru RS1G
10
20
0
1
1 10 100
1 10 100
Number of Cycles at 60 Hz Reverse Voltage (V)
Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current Fig. 5 - Typical Junction Capacitance
Axis Title
100 10000
100
Transient Thermal Impedance (°C/W)
Instantaneous Forward Current (A)
10
1000
TJ = 125 °C
2nd line
1st line
2nd line
1 10
TJ = 25 °C 100
0.1
TJ = -40 °C
Mounted on 0.2" x 0.2" (5 mm x 5 mm)
Copper Pad Area
0.01 10 1
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.01 0.1 1 10
Instantaneous Forward Voltage (V) t - Pulse Duration (s)
Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 6 - Typical Transient Thermal Impedance
Cathode Band
Mounting Pad Layout
0.177 (4.50)
0.157 (3.99)
0.060 (1.52)
0.012 (0.305)
MIN.
0.006 (0.152)
0.208 (5.28)
0.090 (2.29) REF.
0.078 (1.98)
0.060 (1.52)
0.030 (0.76) 0.008 (0.203)
0 (0)
0.208 (5.28)
0.194 (4.93)
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