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    Cypress Reflow Profile

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    flyinzesky
    The document outlines reflow temperature profiles for tin-lead eutectic and lead-free component assemblies. It provides minimum and maximum temperature and time specifications for preheat, soak, ramp up to liquidus temperature, time above liquidus, peak temperature, ramp down, and total profile time. It also defines classification temperatures for different package sizes and thicknesses for tin-lead and lead-free processes to ensure components meet moisture sensitivity level requirements.

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    Cypress Reflow Profile

    Uploaded by

    flyinzesky
    125 views2 pages
    The document outlines reflow temperature profiles for tin-lead eutectic and lead-free component assemblies. It provides minimum and maximum temperature and time specifications for preheat, soak, ramp up to liquidus temperature, time above liquidus, peak temperature, ramp down, and total profile time. It also defines classification temperatures for different package sizes and thicknesses for tin-lead and lead-free processes to ensure components meet moisture sensitivity level requirements.

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    The document outlines reflow temperature profiles for tin-lead eutectic and lead-free component assemblies. It provides minimum and maximum temperature and time specifications for preheat, soak, ramp up to liquidus temperature, time above liquidus, peak temperature, ramp down, and total profile time. It also defines classification temperatures for different package sizes and thicknesses for tin-lead and lead-free processes to ensure components meet moisture sensitivity level requirements.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    125 views2 pages

    Cypress Reflow Profile

    Uploaded by

    flyinzesky
    The document outlines reflow temperature profiles for tin-lead eutectic and lead-free component assemblies. It provides minimum and maximum temperature and time specifications for preheat, soak, ramp up to liquidus temperature, time above liquidus, peak temperature, ramp down, and total profile time. It also defines classification temperatures for different package sizes and thicknesses for tin-lead and lead-free processes to ensure components meet moisture sensitivity level requirements.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 2

    Table 2

    Reflow Profiles (per Jedec J-STD-020D.1)


    Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

    Preheat/Soak
    Temperature Min (Tsmin) 100 °C 150 °C
    Temperature Max (Tsmax) 150 °C 200 °C
    Time (ts) from (Tsmin to Tsmax) 60-120 seconds 60-120 seconds
    Ramp-up rate (TL to Tp) 3 °C/second max. 3 °C/second max.
    Liquidous temperature (TL) 183 °C 217 °C
    Time (tL) maintained above TL 60-150 seconds 60-150 seconds
    For users Tp must not exceed the For users Tp must not exceed the
    Peak package body temperature Classification temp in Table 2A. For Classification temp in Table 2B. For
    (Tp) suppliers Tp must equal or exceed the suppliers Tp must equal or exceed the
    Classification temp in Table 2A Classification temp in Table 2B
    Time (tp)* within 5 °C of the specified
    classification temperature (Tc), see
    Table 2a & 2B 20* seconds 30* seconds
    Figure 5-1. J-STD-020D.1
    Ramp-down rate (Tp to TL) 6 °C/second max. 6 °C/second max.
    Time 25 °C to peak temperature 6 minutes max. 8 minutes max.
    * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum
    .

    Table 2A
    SnPb Eutectic Process - Classification Temperatures (Tc)
    Volume mm3 Volume mm3
    Package Thickness <350 >=350
    <2.5 mm 235 °C 220 °C
    >=2.5 mm 220 °C 220 °C

    Table 2B
    Pb-Free Process -Classification Temperatures (Tc)
    Volume mm3 Volume mm3 Volume mm3
    Package Thickness <350 350 - 2000 >2000
    <1.6 mm 260 °C 260 °C 260 °C
    1.6 mm - 2.5 mm 260 °C 250 °C 245 °C
    >2.5 mm 260 °C 245 °C 245 °C

    Note:
    1. The use of a higher Tp does not change the classification temperature (Tc).
    2. All temperatures refer to topside of the package, measured on the package body surface.
    3. Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.
    4. Moisture sensitivity levels of components intended for use in a Pb-free assembly process shall be evaluated
    using the Pb-free classification temperatures and profiles defined in Tables 2 and 2B, whether or not Pb-free.
    Appendix A
    Solder Reflow Temperature Profile

    Classification Profile (Not to scale)

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