HALO Electronics provides recommendations for lead-free soldering of surface mount and through-hole components. Their products are tested to withstand peak reflow temperatures up to 260°C. For reflow soldering, the peak temperature should not exceed 10 seconds and temperatures above 217°C should not exceed 90 seconds, with maximum ramp rates of 3°C up and 6°C down per second. For wave soldering, components should not dwell in the 270°C solder wave for more than 5 seconds.
HALO Electronics provides recommendations for lead-free soldering of surface mount and through-hole components. Their products are tested to withstand peak reflow temperatures up to 260°C. For reflow soldering, the peak temperature should not exceed 10 seconds and temperatures above 217°C should not exceed 90 seconds, with maximum ramp rates of 3°C up and 6°C down per second. For wave soldering, components should not dwell in the 270°C solder wave for more than 5 seconds.
HALO Electronics provides recommendations for lead-free soldering of surface mount and through-hole components. Their products are tested to withstand peak reflow temperatures up to 260°C. For reflow soldering, the peak temperature should not exceed 10 seconds and temperatures above 217°C should not exceed 90 seconds, with maximum ramp rates of 3°C up and 6°C down per second. For wave soldering, components should not dwell in the 270°C solder wave for more than 5 seconds.
HALO Electronics provides recommendations for lead-free soldering of surface mount and through-hole components. Their products are tested to withstand peak reflow temperatures up to 260°C. For reflow soldering, the peak temperature should not exceed 10 seconds and temperatures above 217°C should not exceed 90 seconds, with maximum ramp rates of 3°C up and 6°C down per second. For wave soldering, components should not dwell in the 270°C solder wave for more than 5 seconds.
HALO Electronics recommends the following reflow soldering*, IPC/JEDEC J-STD-020C
compatible, and wave soldering profiles for processing its Pb-Free surface mount and through-hole products. HALO SMT products are tested to withstand maximum peak temperature up to 260°C.
Reflow Soldering
Maximum duration of peak temperature shall not exceed 10 seconds.
Maximum duration of temperature above 217°C shall not exceed 90 seconds. Maximum ramp rate up 3°C/down 6°C per second. * Temperature shall be taken from the component leads (pins).
Wave Soldering
Maximum dwell time in the solder wave (270°C) shall not exceed 5 seconds.