Kryotherm Catalog
Kryotherm Catalog
Kryotherm Catalog
Company mission . . . . . . . . . . . . . . . . . . 2
Principles of thermoelectricity . . . . . . . . . 5
Special (customized)
thermoelectric coolers . . . . . . . . . . . . . 26
Company profile . . . . . . . . . . . . . . . . . 36
1
Company mission
2
Advantages and applications of thermoelectric
Аннотация devices
Thermoelectric coolers (TEC’s) are extensively used in high-
technology fields, such as telecommunications, electronics,
Space, medicine and other applications. TECs are also widely
used in consumer goods e.g. portable refrigerators, freezers,
water coolers, compact air conditioners, etc.
The use of thermoelectricity for energy Generation, for
powering stand-alone objects such as remote
telecommunication, navigation, gas and oil distributing
stations and corrosion protection of gas and oil pipes, offers
great benefits. A thermoelectric generator allows the direct
conversion of heat energy into electricity by semiconductor
thermogenerating modules.
3
Advantages and applications of thermoelectric
devices
— high accuracy of temperature maintaining up to 10-5 K (with
an appropriate controller);
— heat pumping direction for single-stage TEC is reversible by
changing the polarity of power supply;
— reliable operation in applications that are too small or too
sensitive for conventional refrigeration.
Freezing is another very common TECs application. Ability
to produce semiconductor materials with high merit-factor
allows KRYOTHERM to serially supply single-stage TECs with
∆Tmax up to 76K. Optimized construction and materials used in
multistage TEC’s allow us to achieve the best ΔT, e.g. up to 140K
using 4-stage TECs.
All these advantages make thermoelectric coolers highly
popular, confirmed by a growing demand for a wide variety of
KRYOTHERM components all over the world.
This catalogue
includes more than
250 types of produced
by KRYOTHERM
thermoelectric coolers
and assemblies
grouped according to
field of application.
4
Аннотация
Principles of thermoelectricity
Two basic thermoelectric effects were discovered in the Usually thermocouples are combined with a module
XIX century by European scientists. The first was Thomas where they are connected electrically in series and
Seebeck, who in 1821 discovered the phenomenon of thermally in parallel between two ceramic plates.
direct conversion of heat into electric power; the second Peltier phenomenon consists of the following.
one was Jean Peltier, who discovered a solid state heat A contact potential difference always appears at the
pump. In the period from 1940 through the 1950’s point of junction of two different metals
the Russian academic A.F. Ioffe and his colleagues or semiconductors. If the electric current
synthesized semiconductor alloys, which put passes through them the potential
these effects into practice and that enabled full- difference at the junction assists or
scale production of thermoelectric cooling and counteracts the flow. So as the current
power generating devices for wide use in various passes against the field of the potential
fields of human activity. difference the electrical source needs to
A basic thermoelectric unit is a thermocouple, expend additional energy to make the
which consists of p-type and n-type current pass through the junction and this
semiconductor elements, or pellets. Copper additional energy consumption results in
commutation tabs are used to interconnect pellets that heat energy output at the junction. If the
are traditionally made of Bismuth Telluride-based alloy. field of the potential difference has the same direction
as the current the field supports it and enforces the
movement of the charges. This energy is drawn from the
substance and as a result the temperature at the junction
cold side
is reduced.
dielectric
(ceramics) So, one side of the thermoelectric module is cooled and
the other is heated.
If the heat dissipation from the thermoelectric module’s
n-type
semiconductor conductor hot side is provided efficiently, for example by a heatsink,
(copper)
the temperature of the cold side could get down to tens
p-type
semiconductor of degrees below the ambient temperature. In case the
hot side
current changes its polarity the hot and cold sides would
invert.
5
Principles of thermoelectricity
In this catalogue the following abbreviations and definitions are used regarding thermoelectric cooling:
∆Tmax Maximum temperature difference of TEC between the hot and cold sides at junctions (∆Tmax = Thj max - Tcj min)
Value of maximum cooling capacity (heat pumping) of TEC. It is determined at maximum current through a
Qmax
thermoelectric cooler (Imax) and at zero temperature difference between the hot and cold sides (∆T=0)
6
Thermoelectric products review
7
Coolers for industrial applications
Designed for use in industrial systems for cooling and temperature control
General Engineering:
— electronics and telecommunications equipment cooling and
thermostabilization;
— thermoelectric cooling assemblies for electrical and
electronics cabinets;
— high speed integrated circuits cooling;
— freezers for part fixing on a worktable;
— systems for temperature control over precision machining
process equipment;
— equipment for active heat cycling for use in reliability testing
of microprocessors and microchips;
— technological liquid coolers (exchangers) for semiconductor
industry equipment;
— constant temperature baths for different technology
processes;
— climatic chambers for radio electronic components testing;
— cooling systems for industrial and medical lasers and their’s
power supply units.
8
Coolers for industrial applications
Design 1 Design 2
9
Coolers for industrial applications
Design 3 Design 4
10
Coolers for industrial applications
11
Coolers for industrial applications
TB-31-1,4-2,5 3,7 9,1 4,0 72 0,80 20,0 20,0 20,0 20,0 4,9 1
TB-48-1,4-2,5 3,6 13,5 6,0 70 1,25 35,0 20,0 35,0 20,0 4,9 3
20,0 40,0 20,0 40,0 4
TB-63-1,4-2,5 3,7 18,6 8,1 72 1,60 4,9
40,0 20,0 40,0 20,0 3
TB-71-1,4-2,5 3,7 20,9 9,1 72 1,80 30,0 30,0 30,0 30,0 4,9 1
20,0 40,0 20,0 40,0 4
TB-99-1,4-2,5 3,6 27,9 12,4 70 2,45 4,9
40,0 20,0 40,0 20,0 3
TB-123-1,4-2,5 3,6 34,6 15,4 70 3,20 40,0 40,0 40,0 40,0 4,9 1
40,0 40,0 40,0 40,0 1
TB-127-1,4-2,5 3,7 37,4 16,3 72 3,20 4,8
40,0 40,0 40,0 44,0 2
20,0 40,0 20,0 40,0 4
TB-63-1,4-2,0 4,6 22,2 7,9 70 1,25 4,4
40,0 20,0 40,0 20,0 3
40,0 40,0 40,0 40,0 1
TB-127-1,4-2,0 4,6 45,0 15,9 70 2,50 4,3
40,0 40,0 40,0 44,0 2
40,0 40,0 40,0 40,0 1
TB-161-1,4-2,0 4,6 57,0 20,1 70 3,30 4,3
40,0 40,0 40,0 44,0 2
TB-71-1,4-1,8 5,1 27,9 8,9 70 1,28 30,0 30,0 30,0 30,0 4,2
TB-7-1,4-1,5 6,1 3,3 0,9 69 0,11 10,0 10,0 10,0 10,0 4,0
1
TB-17-1,4-1,5 6,1 8,0 2,1 70 0,28 15,0 15,0 15,0 15,0 4,0
TB-31-1,4-1,5 6,1 14,6 3,9 70 0,50 20,0 20,0 20,0 20,0 4,0
15,0 30,0 15,0 30,0 4
TB-35-1,4-1,5 6,1 16,4 4,4 70 0,58 4,0
30,0 15,0 30,0 15,0 3
20,0 40,0 20,0 40,0 4
TB-63-1,4-1,5 6,1 29,7 7,9 70 1,05 4,0
40,0 20,0 40,0 20,0 3
TB-71-1,4-1,5 6,1 33,4 8,9 70 1,17 30,0 30,0 30,0 30,0 4,0 1
20,0 40,0 20,0 40,0 4
TB-99-1,4-1,5 6,1 46,0 12,4 70 1,70 4,0
40,0 20,0 40,0 20,0 3
TB-123-1,4-1,5 6,1 58,0 15,4 70 2,00 40,0 40,0 40,0 40,0 4,0 1
40,0 40,0 40,0 40,0 1
TB-127-1,4-1,5 6,1 60,0 15,9 70 2,05 3,9
40,0 40,0 40,0 44,0 2
40,0 40,0 40,0 40,0 1
TB-161-1,4-1,5 6,1 76,0 20,1 70 2,60 3,9
40,0 40,0 40,0 44,0 2
ТВ-241-1,4-1,5 6,1 113,0 30,0 70 3,85 55,0 55,0 55,0 59,0 4,0 2
40,0 40,0 40,0 40,0 1
TB-127-1,4-1,2 7,6 75,0 15,9 70 1,50 3,5
40,0 40,0 40,0 44,0 2
TB-7-1,4-1,15 7,9 4,2 0,9 69 0,085 10,0 10,0 10,0 10,0 3,6
TB-17-1,4-1,15 7,9 10,2 2,1 69 0,20 15,0 15,0 15,0 15,0 3,6 1
TB-31-1,4-1,15 7,9 18,6 3,8 69 0,36 20,0 20,0 20,0 20,0 3,6
15,0 30,0 15,0 30,0 4
TB-35-1,4-1,15 7,9 21,0 4,3 69 0,40 3,6
30,0 15,0 30,0 15,0 3
20,0 40,0 20,0 40,0 4
TB-63-1,4-1,15 7,9 37,9 7,8 69 0,75 3,6
40,0 20,0 40,0 20,0 3
TB-71-1,4-1,15 7,9 43,0 8,8 69 0,80 30,0 30,0 30,0 30,0 3,6 1
40,0 40,0 40,0 40,0 1
TB-127-1,4-1,15 7,9 76,0 15,7 69 1,50 3,4
40,0 40,0 40,0 44,0 2
12
Coolers for industrial applications
13
Coolers for industrial applications
H
HOT SIDE
B
SECTION 1
A
SECTION 2
14
Coolers for industrial applications
Design 1 Design 2
15
Coolers for industrial applications
Additional options
Description Notation (*) Note
Substrates material
Alumina Al2O3 (ВК-96) - Standard performance
Heat conductivity
Aluminium nitride (AlN) N > 180 W/mK
Operating and mounting temperatures
Operating temperature up to 80°С
Standard performance.
(standard); -
Melting point of TEC’s solder T=139°C
Mounting temperature ≤ 130 °C**
Operating temperature up to 120 °C, Melting point of TEC’s
HT(120)
max Mounting temperature ≤ 130 °C** solder T=139°C
Operating temperature up to 150 °C, Melting point of TEC’s
HT(150)***
max Mounting temperature ≤ 170 °C** solder T=183°C (Pb-Sn)***
Operating temperature up to 200 °C, Melting point of TEC’s
HT(200)
max Mounting temperature ≤ 220 °C** solder T= 232 °C
Parallelism and flatness of mounting surfaces
Flatness 0,02 mm; Standard performance.
L1
Parallelism 0,03 mm Height tolerance ± 0,05 mm
Flatness 0,015 mm;
L2 Height tolerance ± 0,025mm
Parallelism 0,02 mm
Flatness 0,01 mm;
L3 Height tolerance ± 0,015mm
Parallelism 0,01 mm
Metallization of cold and (or) hot sides
Metallization of cold (mc) and (or) hot mc95, mh95, Solder tinning (melting temperatures
side of TEC mm117 etc. 95 °C, 117 °C, 139 °C or 183 °C)
Gold plating mcAu, mhAu, mmAu 0,2-1 micron thickness
Nickel plating mcNi, mhNi, mmNi
Other standard and additional options
Sealants: epoxy, silicon, urethane,
E, S, U, Сс
conformal coating
Special performance for operation under Standard performance.
С
conditions of temperature cycling > 105 cycles +40°C /+90°C
±10% for Rac>0,15 Ohm
Tolerance of Rac value
± 15% for Rac≤ 0,15 Ohm
Tolerance of length (dimensions А, А1)
and width (dimensions В, В1) or external +0,5/–0,2mm
diameter (dimension D)
Tolerance of internal diameter
+0,2/–0,5mm
(dimension d for TECs with hole)
Lead tabs orientation for rectangular TECs - On the long side - standard
(*) - the notations shown are used to notate additional options in TECs name (please refer to System of Notation section below);
(**) - the maximum mounting temperature influence on the module must not exceed 2 minutes;
(***) - attention! This option does not meet ROHS requirements.
16
Coolers for industrial applications
System of notation:
A universal abbreviation is used to notate single-stage TECs:
ТВ-N-C-h, where:
For example: TB-161-1,4-1,5 consists of 161 thermocouples (322 thermoelectric elements), every element has the cross-section of
1,4x1,4 mm and is 1,5 mm high.
Additional index ВВ in abbreviation (ТВ-N-C-h-BB) is used only for TECs with hole or/and for TECs of round shape:
CH — for rectangular TEC with a central hole (for example ТВ-43-1,0-0,8CH);
CHR — for round TECs with a central hole (for example ТВ-19-1,0-1,3CHR);
R — for round TECs (for example TB-253-1,4-1,5R).
Each type of high efficient and two-section TECs has additional individual name.
Two-section TECs with four lead tabs also have abbreviations indicating number of thermocouples in the first and the second
sections.
Examples:
1. FROST-72 HT(150) means thermoelectric cooler FROST-72, with max operating temperature of 150°С, with substrate material of
aluminum oxide (alumina).
2. DRIFT-0,8 HT(200) mmAu N means thermoelectric cooler DRIFT-0,8 with max operating temperature 200°С, with substrate
material of aluminum nitride. Cold and hot surfaces are coated with gold.
17
Miniature coolers for radio-electronics
COLD SIDE
H
HOT SIDE
B=B1
A=A1
Design 3 Design 4
Applications:
— input stages of low-noise amplifiers and receivers;
— optical communication laser diode; Coolers could be directly
— interferometer laser diode;
— microprocessors and critical microchips; integrated into the standard
— PCBs and electronic units;
— infrared detectors; devices e.g. ТО (ТО3, ТО8 etc),
— CCD- matrix, incl. night vision equipment; HHL, DIL, Butterfly or any other
— photomultipliers, photodetectors and other
temperature sensitive elements and components of electronic devices. special enclosures.
18
Miniature coolers for radio-electronics
TB-7-0,6-1,2 1,4 0,7 0,9 69 0,51 4,3 4,3 4,3 4,3 2,95 2
TB-11-0,6-1,2 1,4 1,2 1,4 69 0,75 4,0 9,0 4,0 9,0 2,95 4
TB-17-0,6-1,2 1,4 1,8 2,1 69 1,20 6,3 6,3 6,3 6,3 2,95
2
TB-31-0,6-1,2 1,4 3,3 3,8 69 2,05 8,0 8,0 8,0 8,0 2,95
6,0 12,0 6,0 12,0 4
TB-35-0,6-1,2 1,4 3,7 4,3 69 2,40 2,95
12,0 6,0 12,0 6,0 3
TB-65-0,6-1,2 1,4 6,9 8,1 69 4,60 13,0 12,0 13,0 12,0 2,95 3
TB-7-0,6-1,0 1,7 0,9 0,9 69 0,39 4,3 4,3 4,3 4,3 2,75 2
TB-17-0,6-1,0 1,7 2,2 2,1 69 0,95 6,3 6,3 6,3 6,3 2,75
2
TB-31-0,6-1,0 1,7 3,9 3,8 69 1,70 8,0 8,0 8,0 8,0 2,75
6,0 12,0 6,0 12,0 4
TB-35-0,6-1,0 1,7 4,4 4,3 69 2,08 2,75
12,0 6,0 12,0 6,0
3
TB-65-0,6-1,0 1,7 8,3 8,1 69 4,00 13,0 12,0 13,0 12,0 2,75
TB-7-0,6-0,8 2,1 1,1 0,9 68 0,34 4,3 4,3 4,3 4,3 2,55
2
TB-17-0,6-0,8 2,1 2,6 2,1 68 0,76 6,3 6,3 6,3 6,3 2,55
TB-23-0,6-0,8 2,1 3,6 2,8 68 1,45 6,0 8,5 6,0 10,5 1,95 1
TB-31-0,6-0,8 2,1 4,8 3,8 68 1,40 8,0 8,0 8,0 8,0 2,55 2
6,0 12,0 6,0 12,0 4
TB-35-0,6-0,8 2,1 5,4 4,3 68 1,70 2,55
12,0 6,0 12,0 6,0
3
TB-65-0,6-0,8 2,1 10,1 8,0 68 3,00 13,0 12,0 13,0 12,0 2,55
TB-109-0,6-0,8 2,1 16,9 13,4 68 5,00 12,0 26,0 12,0 26,0 2,55 4
TB-17-1,0-0,7 6,6 8,4 2,1 68 0,24 8,0 8,0 8,0 8,0 2,45 2
Heat conductivity
Aluminium nitride (AlN) N
> 180 W/m.K
Operating and mounting temperatures
Operating temperature up to 120 °C (standard), Standard performance.
HT(120)
max Mounting temperature ≤ 130 °C** Melting point of TEC’s solder T=139°C
Operating temperature up to 150 °C, Melting point of TEC’s
HT(150)***
max Mounting temperature ≤ 170 °C** solder T=183°C (Pb-Sn)***
Operating temperature up to 200 °C, Melting point of TEC’s
HT(200)
max Mounting temperature ≤ 220 °C** solder T= 232 °C
Parallelism and flatness of mounting surfaces
Standard performance.
Flatness 0,10 mm; Parallelism 0,15 mm L0
Height tolerance ± 0,15 mm
Flatness 0,02 mm; Parallelism 0,03 mm L1 Height tolerance ± 0,05mm
Flatness 0,015 mm; Parallelism 0,02 mm L2 Height tolerance ± 0,015mm
19
Miniature coolers for radio-electronics
(*) - the notations shown are used to notate additional options in TEC’s name (please refer to System of Notation section below);
(**) - the maximum mounting temperature influence on the TEC must not exceed 2 minutes;
(***) - attention! This option does not meet ROHS requirements.
System of notation:
A universal abbreviation is used to notate single-stage miniature TECs:
ТВ-N-C-h, where:
For example: TB-109-0,6-0,8 HT(200) mmAu N denotes: thermoelectric battery (TEC), composed of 109 thermocouples (218
thermoelectric elements), each element has the cross-section of 0,6×0,6 mm and is of 0,8 mm high, ceramics plates material is
aluminium nitride. TEC can operate at temperatures up to 200°C, both ceramic plates have golden coating.
20
Multistage thermoelectric coolers
Multistage TECs are useful when usual one-stage TECs are not
able to provide required temperature difference. Additional
stages increase achievable ΔТ but also leads to more power
consumption and reduction of efficiency of the thermoelectric
system. KRYOTHERM produces high efficient two stages TECs
with ΔТ up to 94K and unique cooling capacity up to 95W.
Optimized thermoelectric materials are used for cascades of
three and four stage TECs. It allows reaching the maximum
value of ΔТ. KRYOTHERM produces multistage TECs with ΔТ up
to 140 К, optimal dimensions and low power consumption.
Applications:
21
Multistage thermoelectric coolers
22
Multistage thermoelectric coolers
Design 1
Design 2
23
Multistage thermoelectric coolers
(*) – the notations shown are used to notate additional options in the cooler name (please refer to System of Notation below);
(**) – the maximum mounting temperature influence on the TEC must not exceed 2 minutes;
(***) – attention! This option does not meet ROHS requirements;
(****) – to be agreed.
System of notation:
A universal abbreviation is used to notate multistage TECs:
ТВ-n-(N1-N2-N3-N4)-h, where:
For example: TB-2-(11-4)-1,0 HT (200) mmAu N denotes a two-stage thermoelectric cooler with max operating temperature 200°C,
that consists of 11 thermocouples (22 thermoelectric elements) in the base stage and 4 thermocouples in the second stage, every
element has the cross-section of 1x1 mm. The TEC is made on a aluminium nitride substrate. Cold and hot sides are metallized with
golden coating.
24
Coolers for consumer devices applications
LCB TECs
High-performance equipment
application and fine-tuned
technological process allow
KRYOTHERM to produce
the modules listed below
in unlimited quantities using
a non-stop technological
process providing high
reliability and low costs.
25
Coolers for consumer devices applications
and structural features — low TECs height (less than 1,5 mm);
— higher cooling rate >10 K/sec;
— higher cooling power density >20 W/cm2;
for TECs with special — lower temperatures operation (<-55°C);
— higher precision temperature control;
properties and design. — flux free soldering;
— operation at hard temperature cycling conditions.
Manufacturing of such TECs besides the standard Fields of applications:
technological process usually requires additional production
steps, including additional quality control of special — Space and other special techniques;
parameters. Special properties could be also obtained by using — optoelectronics and telecommunications;
materials with special parameters (special thermoelectric — medicine;
— special computers engineering;
materials, ceramic substrates, solder and others).
— scientific apparatus.
26
Software for TEC application
“Performance Graphs”
There are eight graphs for each type of TECs that are: cooling
capacity, efficiency factor, voltage of temperature difference,
volt-ampere characteristic, cooling capacity characteristic and
СОР for different values of current and voltage. Each diagram
consists of four graphs for different conditions (e.g. for 0,25
Imax; 0,5 Imax, 0,75 Imax and 1,0 Imax). The user can arbitrarily
determine the coefficients along with the temperature of the
hot side of TEC. According to entered data the program draws
graphs and calculates key parameters (Imax, Umax, Qmax,
∆Tmax) in numerical value. The results of calculations (including
intermediate) can be printed out. — type, quantity of modules and electric scheme of the
connection (that could be determined from previous parts of
“Choice of Modules” the program);
— insulation thermal resistance (the program offers the values
This section helps to select optimal parameters of the system of common materials);
for the cooling object defined by thermal characteristics of — type of cooling (Natural, Forced, Flow) on the hot and cold
assembly materials, form and dimensions of the cabinet, type sides;
of thermoinsulation, way of heat removal, heat produced by — active heat released at the object;
the object etc.) — ambient temperature value;
On the ground of calculated data the user gets an opportunity — voltage or current of the power supply.
to select the optimal type and number of thermoelectric Optional algorithms may be used for initial data calculations
coolers. This selection can be optimized by different parameters and independent thermo physical calculations (calculations of
(the efficiency, costs). heat sinks design, required insulation, etc.).
27
Thermoelectric Generating modules
produced by KRYOTHERM,
is possible to get up to p-type
semiconductor
n-type
conductor
Applications:
— utilization of waste heat from vehicles (automobiles,
ships) engines;
— autonomic supply of energy to operation control
devices of water boilers and disposal plants;
— cathodic protection of the oil and gas pipelines;
— conversion of natural heat resources — geothermal
waters, etc. into electric energy;
— power supply of stand-alone low-power electronic
devices (Energy Harvesting).
28
Thermoelectric Generating modules
29
Thermoelectric Generating modules
30
Аннотация
Thermoelectric Generating modules
Application recommendations: 3. The temperature of the hot side of the TGM should not
exceed the given in the specification temperature.
For optimum performance of TGM it is important to follow 4. The edge of the heat source should extend at least 10 or 5
several key points. mm beyond the edge of the module.
1. The surface on which TGM is to be mounted should be as flat 5. The temperature of the face of the module should be
as possible. Flatness of the surface should be not over 20 uniform at every point.
microns while 5 - 10 microns are recommended. 6. Mounting bolts should be as thin as possible, preferably
2. The module has to be properly pressed between the heat made of materials with low thermal conductivity (e.g.
source and the heat sink. To yield the best results the load stainless steel).
should be not less than 1,0 kN per one TGM of 40x40mm in 7. For better contact and thermal conductivity across the
dimensions. To optimize loading it is better to use a spring interface thermal transfer compound should be used, but
together with bolting. not too much in order to avoid preventing solid to solid
contact between the two surfaces.
Thermal expansion of
Mounting of TGM by compressive load
TGM in the simple bolted Construction of thermoelectric generator (TEG) should
guarantee that the compression force does not exceed 1,5kN
construction could damage (per one 40x40mm TGM) in the whole temperature range.
TGM in case of excessive Attention! During the exploitation of TGM with the decrease
of electric load an increase of the hot junction temperature
up to 5 % of the difference between hot and cold sides of the
screw torque or as a module can follow.
results of quick pressure For maximum power generation of the TEG the TGM should
be chosen taking into account features of other elements of
loss. To compensate construction including the heat-sinks and thermal interface
materials.
the thermal expansion of Heat resistance of TGM is one of the most important
parameters. Heat resistance of heat-sinks on the cold and hot
TGM in a wide temperature sides is determined by the following ratio:
31
Thermoelectric cooling assemblies
Аннотация
Air-to-air TEAs
Air-to-air thermoelectric assemblies allow pumping out of
extra heat from inside small, hermetically closed equipment
like telecom and remote control cabinets. They also allow
cooling down a limited area to a temperature below ambient
(air conditioning). For more efficiency heat-exchangers are
equipped with fans. Changing of polarity of power supply
allows fast changing of high efficient cooling to high efficient
heating, when to outside energy internal Joule heating would
be added (efficiency >1). In this case fans should be connected
separately. All TEAs are ready for installation by screws. Air-to-air thermoelectric assembly
Optionally assemblies could be supplied with a temperature
sensor installed for precise temperature control as well as with
a temperature controller and a power supply unit.
Applications:
— industrial and analytical instrument temperature
stabilization;
— equipment for electronic devices testing in temperature
range;
— air conditioning for automobile, railroad and water
transport;
— food and beverage cooling.
32
Аннотация
Thermoelectric cooling assemblies
Applications:
— high speed integrated circuits cooling;
— technological liquid coolers (exchangers) for semiconductor
industry equipment;
— constant temperature baths for different technology
processes;
— cooling systems for industrial and medical lasers and their
power supply units;
— heat exchanging for surgery;
— cold plates and isothermal bases for pharmacy and biology.
High efficient TECs and precision liquid heat-exchangers
mechanical parts ensure high reliability of compact and
powerful liquid-to-liquid and liquid-to-surface cooling system. Liquid-to-liquid thermoelectric assembly
33
Thermoelectric power generating sources
Specification GTG-200
Output voltage V 24
Output power W 200
Overall dimensions, mm Diameter 600,
Height 1030
Weight, kg 130
Life time, not less than, years 10
Specification TEG-30
Output voltage V 24
Output power W 30
Overall dimensions, mm 400 x 700 x 930
Weight, kg 76
Fuel consumption, m3/h 0,135
Input gas pressure, kP 3
34
Аннотация
Thermoelectric power generating sources
Specification TEG-5
Output voltage V 24
Output power W 5
Steam temperature in the from 119 to 190
installation site, °C
Overall dimensions, mm 310 x 700 x 670
Weight, kg 63
Ingress protection rating
according to DIN 400500 and EN IP65
60529
Electrical PowerOven
More than quarter of Earth population till now does not have
ability to use electric power in everyday life. KRYOTHERM
designed and established serial production of unique Electrical
PowerOven.
Electrical PowerOven provides electricity, light and heat to
consumers without powering.
Electrical Electrical
Specification PowerOwen PowerOwen
Arktur Vega
Output power W
50 25
Output voltage V 12 12
The volume of heated
100 50
space, m3
Thermal output, kW 6 4
Weight, kg 59 22
Overall dimensions, mm 572х605х790 466х300х404
The combustion chamber
Thermoelectric Universal Generator B4-M
60 30
volume, l Universal generator B4-M produces power supply 12 V when
Operating Temperature, °C от –20 до +45 от –20 до +45 installed on a upright heated surface with a temperature of 250
°C.
It has built-in thermal protection prevents failure of the
generator when mounting surface is heated up to 300 °C.
Specification B4-M
Output voltage V 12
Output power W 2
Overall dimensions, mm 162 x 100 x 93
Weight, kg 2
Temperature of the hot surface, °С 250
Ingress protection rating according IP35
to DIN 400500 and EN 60529
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Company profile
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Company profile
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Company profile Аннотация
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TEC installation instructions
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TEC installation instructions
3. Operating temperature
Two factors define reliability of TEC at different operating
temperatures. The first is acceleration of copper entry from
the connecting tabs to semiconductor material and its’ deg-
radation at temperature more than 90˚C. For prevention of
this process nickel barriers that exclude possibility of cop-
per diffusion are used. The second is correct definition of
TEC operating temperature regarding melting temperature
of TEC assembly solder. Actually assembly solders with fol-
lowing melting temperatures are used: 139˚C, 183˚C and
During TECs mounting by soldering special attention should 232˚C. Operating temperatures are up to 120˚C, up to 150˚C
be paid to proper coating of the surfaces of the TEC and and up to 200˚C, accordingly.
the heat-sink with solder. It should be aimed at reduction
of the soldering layer during soldering because its’ thermal The third factor that doesn’t influence on TECs’ reliability but
conductivity is worse than the thermal conductivity of the defines the thermoelectric systems’ efficiency is decreasing
direct contact of the ceramics and the heat-sink. of cooling capacity and maximal temperature difference at
decreased operating temperatures. E.g. if the maximal tem-
Metallized TEC Mounting Instruction perature difference at Th = 27˚С is 75˚C, then at Th = 50˚C it
Please follow this mounting instruction to attach KRYOTHERM’ would be 85˚C and at Th = 70 ˚C it would be 93˚C. In case of
metallized TECs to a thermoelectric cooling assembly, which the necessity to work at low temperatures KRYOTHERM can
consists of a heat-sink and TEC. The heat-sink surface should be supply special TECs.
adapted for soldering. The heat-sink should be made of proper
material or have proper coating, for example, of copper or nickel.
4. Soldering of lead wires
1. Prepare the surfaces of the heat-sink and plate. The surfaces
of the heat-sink should have flatness of at least 0,05 mm (50 mi- KRYOTHERM supplies TEC’s with attached lead wires to fa-
crons) on the area of the TEC installation. cilitate TEC’s installation and power supply connection. Wire
cross section and length could be specified by the customer.
2. Control over the lack of burrs on the surfaces of heat-sink. In The minimum wire length is 20 mm.
case of burrs’ availability they should be removed.
3. Thoroughly clean and degrease the thermoelectric cooler and 5. TEC Moisture Protection Sealant Options
the heat-sink.
To protect TEC’s from moisture and condensation KRYO-
4. The heat-sink surface should be covered with flux. THERM suggests sealing options when TECs are sealed
5. Heat the heat-sink surface up to the temperature exceeding along the perimeter by silicone, epoxy or urethane sealant
the temperature of assembly solder (given in the TEC specifica- that are denoted by letters S, E, U in the name of thermo-
tion) by 5-10°C. electric cooler.
6. Put the TEC onto the heat-sink surface and wait for several
Two of the most common
seconds till the solder on the TE cooler melts and the exces-
TECs perimeter sealants
sive flux evaporates. When all solder is melted the TE cooler will
are used as following.
tend to float on the solder. Slight blow-off and holding down of
Silicone (S) is an all pur-
pose sealant that exhibits
good sealing character-
istics and retains its elas-
tomeric properties over a
wide temperature range,
from -60 up to 200°C.
The sealant is non-corro-
sive to many chemicals
and exhibits good electri-
cal properties with low
thermal conductivity.
Epoxy (E) is a highly ef-
fective barrier to moisture
with working temperature
range from -40 up to 130°C.
The material exhibits a low
dielectric constant and
the TE cooler will improve its installation. In cases where more
low coefficient of thermal
than one TE cooler is used in the same assembly unit, these
expansion. Epoxy sealant
coolers should be held down with an object having the surface
is ideal for long life appli-
of the required size and the required tolerance of flatness dur-
cations.
ing the soldering.
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TEC installation instructions
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