Thermoelectric Cooler (Gr.1)

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Thermoelectric Cooler

Presented by Group 1
Thermoelectric cooling
 Thermoelectric cooling is described as a solid-state method of heat transfer
generated primarily through the use of dissimilar semiconductor materials.
 This technology is far less commonly applied to refrigeration than vapour-
compression refrigeration is due to high cost and less efficiency.
 Many researchers and companies are trying to develop Peltier coolers that
are cheap and efficient.
The Peltier Effect
 Thermoelectric coolers operate by the Peltier effect (which also goes by the more
general name thermoelectric effect).

 The device has two sides, and when a DC electric current flows through the device,
it brings heat from one side to the other, so that one side gets cooler while the other
gets hotter.

 The "hot" side is attached to a heat sink so that it remains at ambient temperature,
while the cool side goes below room temperature.
History of Peltier Devices
 The Peltier effect is named after Jean
Charles Peltier (1785-1845) who
first observed it in 1834.

 The Peltier effect had no practical use


for over 100 years until dissimilar
metal devices were replaced with
semiconductor Peltiers which could
produce much larger thermal
gradients.
Construction
 A series of thermo-electric cells in a horizontal array which is encased
in plates made of an electrical insulator (Ceramics).

 Each thermo-electric cell consists of a pair of dissimilar semi-conductors


(one n-type and one p-type).

 The semiconductors are placed thermally in parallel to each other and


electrically in series and then joined with a thermally conducting plate
on each side.

 When a voltage is applied to the free ends of the two semiconductors


there is a flow of DC current across the junction of the semiconductors
causing a temperature difference.
Construction(Contd.)
Performance
 Efficiency is 1/4th of Conventional Means.
 Coefficient of Performance = Rate of heat
extraction divided by Electrical Power
input.
 Critical materials parameters to ensure a
high COP are:
• A high thermo-electric coefficient (Peltier
Coefficient) to generate the cooling effect.
• A high electrical conductivity to suppress
Ohmic heating.
• A low thermal conductivity to prevent much
heat being conducted from the hot side of the
module to the cold side of the module.
Advantages & Disadvantages
 Advantages:
• Weight per unit refrigeration is low.

• No moving parts so maintenance is required less frequently.

• Ability to Heat and Cool With the Same module.

• Long life, High Reliability and Environment Friendly.


 Disadvantages:
• Relegated to applications with low heat flux.

• Not as Efficient, in terms of COP.

• Cost is very high.


Uses
 Consumer Products:
• Camping
• Portable Coolers
• Cooling of electronic components
and small instruments.
• It can also be used to extract
water from the air in
dehumidifiers.
• Used to augment heat sinks for
microprocessors.
• They are also used for wine
coolers.
Uses(Contd.)
 Industrial:
• Laser equipment

• Thermoelectric air conditioners or coolers

• industrial electronics and telecommunications

• Automotive

• Mini refrigerators or incubators

• Military cabinets

• IT enclosures
Uses(Contd.)
 Science and Imaging:
• They are a common component in thermal cyclers, used for the
synthesis of DNA.
• This effect is used in satellites and spacecraft to reduce temperature
differences caused by direct sunlight on one side of a craft.
• Photon detectors such as CCDs in astronomical telescopes,
spectrometers, or very high-end digital cameras are often cooled by
Peltier elements.
Alternative Modern Use
 Instead of utilizing a full-fledged thermoelectric cooling system, it is
possible to use a thermoelectric heat pump to improve the performance of an
existing vapour compression system, so called “hybrid system”.

 For example, a hybrid vapour compression – thermoelectric cooler systems


could use thermoelectric heat pumps to enhance the outlet sub cooling of a
condenser, in which thermoelectric heat pumps operate at small ΔT and high
COP.
Thermoelectric Materials
 These are the materials that can be used to convert thermal energy into electrical
energy or provide refrigeration directly from electrical energy.
 Semiconductors are the optimum choice of material to sandwich between two
metal conductors because of the ability to control the semiconductors’ charge
carriers, as well as, increase the heat pumping ability.
 E.g.: Bismuth Chalcogenides, Lead telluride etc.
Alternatives:
• Lead telluride and its alloys.
• Materials based on Nanotechnology.
• Silicon Germanium.
• Bi2Te3 (Most commonly used)

Bismuth–antimony telluride Crystals


Thermoelectric Cooling Vs
Traditional Refrigeration
 Solid state design
• No moving parts
• Integrated chip design
• No hazardous gases
 Compact and lightweight
• Sizes to match your component footprint
• No bulky compressor units
 Precise temperature stability
• Tolerances of better than +/- 0.1°C
• Accurate and reproducible ramp and dwell times
 Cooling/heating mode options
• Fully reversible with switch in polarity
 Dehumidification
• Efficient condensation of atmospheric water vapour
Conclusion
 The conclusion that we now can draw is that the TER system is a
novel refrigeration system which will be a better alternative for
conventional refrigeration system in the near future.

 With recent development taking place in field of thermoelectric and


nanoscience different thermoelectric material are to be explored and
this will further help to reduce the temperature.
Thank
You

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