High Efficiency Thyristor: 1 Triac Three Quadrants Operation: QI - QIII
High Efficiency Thyristor: 1 Triac Three Quadrants Operation: QI - QIII
High Efficiency Thyristor: 1 Triac Three Quadrants Operation: QI - QIII
Part number
CLA60MT1200NHB
Backside: Terminal 2
Three Quadrants Operation
Positive Half Cycle
T2 + T2 2
(-) IGT 1
T1
REF -
Negative Half Cycle
Note: All Polarities are referenced to T1
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20150827d
Rectifier Ratings
Symbol Definition Conditions min. typ. max. Unit
VRSM/DSM max. non-repetitive reverse/forward blocking voltage TVJ = 25°C 1300 V
VRRM/DRM max. repetitive reverse/forward blocking voltage TVJ = 25°C 1200 V
I R/D reverse current, drain current VR/D = 1200 V TVJ = 25°C 10 µA
VR/D = 1200 V TVJ = 125°C 2 mA
VT forward voltage drop IT = 30 A TVJ = 25°C 1,28 V
IT = 60 A 1,56 V
IT = 30 A TVJ = 125 °C 1,25 V
IT = 60 A 1,61 V
I TAV average forward current TC = 120 °C T VJ = 150 °C 30 A
I RMS RMS forward current per phase 180° sine 66 A
VT0 threshold voltage TVJ = 150 °C 0,86 V
for power loss calculation only
rT slope resistance 12,5 mΩ
R thJC thermal resistance junction to case 0,55 K/W
RthCH thermal resistance case to heatsink 0,25 K/W
Ptot total power dissipation TC = 25°C 230 W
I TSM max. forward surge current t = 10 ms; (50 Hz), sine TVJ = 45°C 380 A
t = 8,3 ms; (60 Hz), sine VR = 0 V 410 A
t = 10 ms; (50 Hz), sine TVJ = 150 °C 325 A
t = 8,3 ms; (60 Hz), sine VR = 0 V 350 A
I²t value for fusing t = 10 ms; (50 Hz), sine TVJ = 45°C 720 A²s
t = 8,3 ms; (60 Hz), sine VR = 0 V 700 A²s
t = 10 ms; (50 Hz), sine TVJ = 150 °C 530 A²s
t = 8,3 ms; (60 Hz), sine VR = 0 V 510 A²s
CJ junction capacitance VR = 400 V f = 1 MHz TVJ = 25°C 25 pF
PGM max. gate power dissipation t P = 30 µs T C = 150 °C 10 W
t P = 300 µs 5 W
PGAV average gate power dissipation 0,5 W
(di/dt) cr critical rate of rise of current TVJ = 150 °C; f = 50 Hz repetitive, IT = 90 A 150 A/µs
t P = 200 µs; di G /dt = 0,3 A/µs;
IG = 0,3 A; V = ⅔ VDRM non-repet., I T = 30 A 500 A/µs
(dv/dt)cr critical rate of rise of voltage V = ⅔ VDRM TVJ = 150°C 500 V/µs
R GK = ∞; method 1 (linear voltage rise)
VGT gate trigger voltage VD = 6 V TVJ = 25 °C 1,7 V
TVJ = -40 °C 1,9 V
I GT gate trigger current VD = 6 V TVJ = 25 °C ± 60 mA
TVJ = -40 °C ± 80 mA
VGD gate non-trigger voltage VD = ⅔ VDRM TVJ = 150°C 0,2 V
I GD gate non-trigger current ±1 mA
IL latching current tp = 10 µs TVJ = 25 °C 90 mA
IG = 0,3 A; di G /dt = 0,3 A/µs
IH holding current VD = 6 V R GK = ∞ TVJ = 25 °C 60 mA
t gd gate controlled delay time VD = ½ VDRM TVJ = 25 °C 2 µs
IG = 0,3 A; di G /dt = 0,3 A/µs
tq turn-off time VR = 100 V; I T = 30 A; V = ⅔ VDRM TVJ =125 °C 150 µs
di/dt = 10 A/µs dv/dt = 20 V/µs t p = 200 µs
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20150827d
C = Thyristor (SCR)
L = High Efficiency Thyristor
A = (up to 1200V)
60 = Current Rating [A]
MT = 1~ Triac
1200 = Reverse Voltage [V]
Logo IXYS N = Three Quadrants operation: QI - QIII
Part No. XXXXXXXXX HB = TO-247AD (3)
Assembly Line Zyyww
abcd
Assembly Code
Date Code
Ordering Ordering Number Marking on Product Delivery Mode Quantity Code No.
Standard CLA60MT1200NHB CLA60MT1200NHB Tube 30 512073
I V0 R0 Thyristor
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20150827d
Outlines TO-247
A D2
E A2 ØP Ø P1
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20150827d
Thyristor
60 400 1000
VR = 0 V
50
10 TVJ = 125°C
TVJ = 150°C
TVJ = 25°C 50 Hz, 80% VRRM
0 100 100
0,0 0,5 1,0 1,5 2,0 0,01 0,1 1 1 2 3 4 5 6 7 8 910
VT [V] t [s] t [ms]
Fig. 2 Surge overload current 2
Fig. 1 Forward characteristics Fig. 3 I t versus time (1-10 s)
ITSM: crest value, t: duration
10 1000 80
1: IGD, TVJ = 150°C
2: IGT, TVJ = 25°C 70 dc =
3: IGT, TVJ = -40°C 1
TVJ = 125°C 60 0.5
100 0.4
VG 23 50 0.33
tgd IT(AV)M 0.17
1 40 0.08
[V] 1 56 [A]
[µs] 30
4 10
20
4: PGAV = 0.5 W
5: PGM = 5 W lim.
6: PGM = 10 W 10
typ.
0,1 1 0
1 10 100 1000 10000 10 100 1000 0 40 80 120 160
IG [mA] IG [mA] Tcase [°C]
Fig. 4 Gate voltage & gate current Fig. 5 Gate controlled delay time tgd Fig. 6 Max. forward current at
case temperature
60 0,6
RthHA
50 dc = 0.6
1 0.8
0.5 1.0
40 0.4 2.0 0,4
P(AV) 0.33 4.0
8.0 ZthJC
0.17
30 0.08
[W] [K/W] i Rthi (K/W) ti (s)
20 0,2 1 0.080 0.0100
2 0.060 0.0001
3 0.215 0.0200
10
4 0.060 0.2000
5 0.135 0.1100
0 0,0
0 10 20 30 40 0 50 100 150 1 10 100 1000 10000
IT(AV) [A] Tamb [°C] t [ms]
Fig. 7 Transient thermal impedance junction to case
Fig. 7a Power dissipation versus direct output current
Fig. 7b and ambient temperature
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20150827d