1 Introduction and History of Dynamic Mechanical Analysis
1 Introduction and History of Dynamic Mechanical Analysis
1 Introduction and History of Dynamic Mechanical Analysis
2 THEORY AND OPERATING PRINCIPLES e are linearly related by E, the relationship is given by
Equation (4):
2.1 Forced Frequency Analyzers
e.t/ D e0 sin.wt/ .4/
If a constant load applied to a sample begins to
oscillate sinusoidally (Figure 1), the sample will deform where e0 is the strain at the maximum stress. This curve,
sinusoidally. This will be reproducible if the material is shown in Figure 2(a), has no phase lag (or no time
deformed within its linear viscoelastic region. For any difference from the stress curve) and is called the in-phase
one point on the curve, the stress applied is described by portion of the curve.
Equation (1): The viscous limit was expressed as the stress being
proportional to the strain rate, which is the first derivative
s D s0 sin wt .1/
of the strain. This is best modeled by a dashpot and for
where s is the stress at time t, s0 is the maximum stress, w is that element the term for the viscous response in terms
the frequency of oscillation, and t is time. The resulting of strain rate is described by Equation (5):
strain wave shape will depend on how much viscous
ds0
behavior the sample has and how much elastic behavior. e.t/ D h D hws0 cos.wt/ .5/
In addition, the rate of stress can be determined by taking dt
the derivative of the above equation in terms of time: or Equation (6):
ds p
D ws0 cos wt .2/ e.t/ D hws0 sin wt C .6/
dt 2
The two extremes of the material’s behavior, elastic where the terms are as above and h is the viscosity.
and viscous, provide the limiting extremes that will sum Substituting terms as above gives Equation (7):
to give the strain wave. The behavior can be understood
by evaluating each of the two extremes. The material at p
e.t/ D ws0 cos.wt/ D ws0 sin wt C .7/
the spring-like or Hookean limit will respond elastically 2
with the oscillating stress. The strain at any time can be This curve is shown in Figure 2(b). Now consider the
written as Equation (3): behavior of the material that lies between these two limits.
e.t/ D Es0 sin.wt/ .3/ This curve is shown in Figure 2(c) and is intermediate
between the above cases. The difference between the
where e(t) is the strain at any time t, E is the modulus, applied stress and the resultant strain is an angle, d, and
s0 is the maximum stress at the peak of the sine wave, this must be added to the equations. Hence the elastic
and w is the frequency. Since in the linear region s and response at any time can now be written as Equation (8):
Force (dynamic)
e.t/ D e0 sin.wt C d/ .8/
Applied stress, σt
Applied stress, σt
σ0 σ0
t t
Measured strain, εt
Measured strain, εt
t t
(a) (b)
Stress, σt
σ0
Static
stress
t
Phase lag δ
δ
(primary DMA output)
Strain, εt
ε0
t
(c)
Figure 2 When the material responds to the applied wave perfectly elastically, an in-phase response is seen (a), while a viscous
response gives an out-of-phase response (b). Viscoelastic materials fall in between these two lines as shown in (c). (Used with the
permission of Perkin-Elmer Corporation, Norwalk, CT.)
and Gillham..15,16/ Basically, the decay of the amplitude Free resonance analyzers normally are limited to rod or
is evaluated over as many swings as possible to reduce rectangular samples or materials that can be impregnated
error [Equation 13]: on to a braid. This last approach is how the curing studies
on epoxy and other resin systems were done in torsion
1 An and gives these instruments the name TBA.
D ln .13/
j AnCj
where j is the number of swings and An is the amplitude
of the nth swing. For one swing, where j D 1, the above 3 INSTRUMENTATION
equation becomes Equation (14):
One of the biggest choices when selecting a DMA
An is to decide whether to use stress (force) or strain
D ln .14/
AnCj (displacement) control for applying the deforming load to
if for a low value of , where An /AnC1 ³ 1, the equation the sample (Figure 4a and b). Strain-controlled analyzers,
can be rewritten as whether for simple static testing or for DMA, move the
" # probe a set distance and use a force balance transducer or
1 A2n A2nC1 load cell to measure the stress. These parts are typically
³ .15/
2 A2n located on different shafts. The simplest version of this
is a screw-driven tester, where the sample is pulled one
then from this, since the square of the amplitude is
turn. This requires very large motors so the available force
proportional to the stored energy, W/Wst , and the
always exceeds what is needed. They normally have better
stored energy can be expressed as 2p tan d, this equation
short-time response for low-viscosity materials and can
becomes Equation (16):
normally perform stress relaxation experiments easily.
1 W They also usually can measure normal forces if they
³ D p tan d .16/
2 Wst are arranged in torsion. A major disadvantage is their
transducers may drift at long times or with low signals.
which gives us the phase angle, d. The time of the
Stress-controlled analyzers are cheaper to make
oscillations, the period, T, can be found using the
because there is only one shaft, but are somewhat trickier
Equation (17):
to use. Many of the difficulties have been alleviated
s s
M 1 C 2
T D 2p .17/ Force
1 4p2
where 1 is the torque for one cycle and M is the moment Force
of inertia around the central axis. Alternatively, T can
be calculated directly from the plotted decay curve as
Equation (18):
2
TD .tn t0 / .18/
n Force is axial along Force is applied
(a) one axis of sample (b) torsionally to sample
where n is the number of cycles and t is time. From this,
the shear modulus, G, can be calculated and for a rod of
length L and radius r is given by Equation (19): Motor
Motor
2 microns
4p ML 2 mgr mN
GD 1 C .19/
NT 2 4p2 12N
Detector
where m is the mass of the sample, g the gravitational
constant and N a geometric factor. In the same sys- Detector
tem, the storage modulus, G0 , can be calculated using
Equation (20): The applied force The applied
(c) is controlled (d) deformation is controlled
0 1 8pML
G D . .20/
T2 r4 Figure 4 Types of forced resonance DMAs: (a) axial, (b) tor-
sional, (c) controlled stress and (d) controlled strain. (Reprinted
Having the storage modulus and the tangent of the with permission from K. Menard, Dynamic Mechanical Ana-
phase angle, the remaining dynamic properties can be lysis: a Practical Introduction, CRC Press, Boca Raton, FL,
calculated. 1999.)
DYNAMIC MECHANICAL ANALYSIS OF POLYMERS AND RUBBERS 5
by software and many strain-controlled analyzers on samples, as shown by the use of both types to study the cur-
the market are really stress-controlled instruments with ing of neat resins. Normally axial analyzers cannot handle
feedback loops making them act as if they were strain fluid samples below about 500 Pa s and torsional instru-
controlled. In stress control, a set force is applied to the ments will top out with the harder samples (the exact mod-
sample. As temperature, time, or frequency varies, the ulus depending on the size of the motor and/or load cell).
applied force remains the same. This may or may not be
the same stress: in extension, for example, the stretching
and necking of a sample will change the applied stress 4 APPLICATIONS
seen during the run. However, this constant stress is a
more natural situation in many cases and it may be more
4.1 Thermoplastic Solids and Cured Thermosets
sensitive to material changes. Good low-force control
means they are less likely to destroy any structure in The thermal transitions in polymers can be described in
the sample. Long relaxation times or long creep studies terms of either free volume changes.19/ or relaxation
are more easily preformed on these instruments. Their times..20/ While the latter tend to be preferred by
greatest disadvantage is that their short time responses engineers and rheologists in contrast to chemists and
are limited by inertia with low-viscosity samples. polymer physicists who lean toward the former, both
Since most DMA experiments are run at very low descriptions are equivalent. Changes in free volume, vf ,
strains (¾0.5% maximum) so as to stay well within a can be monitored as a volumetric change in the polymer,
polymer’s linear region, it has been reported that both by the absorption or release of heat associated with that
analyzers give the same results..18a/ However, when one change, the loss of stiffness, increased flow, or a change
reaches the non-linear region, the difference becomes in relaxation time.
significant as stress and strain are no longer linearly The free volume of a polymer, vf , is known to be
related. Stress control can be said to duplicate real-life related to viscoelasticity,.21,22/ aging,.23 – 26/ penetration
conditions more accurately since most applications of by solvents,.27/ and impact properties..28/ Defined as the
polymers involve resisting a load. space that a molecule has for internal movement, it is
DMA instruments are normally built to apply the shown schematically in Figure 5(a). A simple approach to
stress or strain in two ways (Figure 4c and d). One looking at free volume is the crankshaft mechanism,.29/
can apply force in a twisting motion so one is testing where the molecule is imagined as a series of jointed
the sample in torsion. This type of instrument is the segments. From this model, it is possible to describe
dynamic analog of the constant shear spinning disk simply the various transitions seen in a polymer. Other
rheometers. While mainly used for liquids and melts, solid models exist that allow for higher precision in describing
samples may also tested by twisting a bar of the material. behavior; the best seems to be the Doi – Edwards
Torsional analyzers normally also permit continuous model..30/ Aklonis and Knight.31/ give a good summary of
shear and normal force measurements. Most of these the available models, as does Rohn..32/
analyzers can also do creep– recovery, stress – relaxation, The crankshaft model treats the molecule as a collection
and stress – strain experiments. of mobile segments that have some degree of free
Axial analyzers are normally designed for solid and movement. This is a very simplistic approach, yet very
semisolid materials and apply a linear force to the sam- useful for explaining behavior. As the free volume of the
ple. These analyzers are usually associated with flexure, chain segment increases, its ability to move in various
tensile, and compression testing but they can be adapted directions also increases (Figure 5b). This increased
to do shear and liquid specimens by proper choice of mobility in either side chains or small groups of adjacent
fixtures. Sometimes the instrument’s design makes this backbone atoms results in a greater compliance (lower
inadvisable, however (e.g. working with a very fluid mat- modulus) of the molecule. These movements have been
erial in a system where the motor is underneath the sample studied and Heijboer.33/ classified b and g transitions
has the potential for damage to the instrument if the sam- by their type of motions. The specific temperature and
ple spills into the motor). These analyzers can normally frequency of this softening help drive the end-use of the
test higher modulus materials than torsional analyzers material.
and can run TMA studies in addition to creep– recovery, Moving from very low temperature, where the molecule
stress – relaxation, and stress – strain experiments. is tightly compressed, to higher temperatures, the first
Despite the traditional selection of torsional instru- changes are the solid-state transitions. This process
ments for melts and liquids and axial instruments for is shown in Figure 6. As the material warms and
solids, there is really considerable overlap between the expands, the free volume increases so that localized
types of instruments. With the proper choice of sample bond movements (bending and stretching) and side-
geometry and good fixtures, both types can handle similar chain movements can occur. This is the g transition,
6 POLYMERS AND RUBBERS
Tg
in the amorphous phase that relates to reduced viscosity.
Free These two transitions are not universally accepted. Finally
volume the melt is reached, where large-scale chain slippage
Physical
Volume
For thermosets,
Rubbery plateau is related
no Tm occurs
to Me between cross-links or Tll in some
entanglements amorphous Tm = melting (1)
polymers
Temperature (K)
Figure 6 Idealized temperature scan of a polymer. Starting at low temperature the modulus decreases as the molecules gain more
free volume, resulting in more molecular motion. This shows main curve as divided into six regions which correspond to local
motions (6), bond bending and stretching (5), movements in the side chain or adjacent atoms in the main chain (4), the region of
the Tg (3), coordinated movements in the amorphous portion of the chain (2), and the melting region (1). Transitions are marked
as described in the text. (Reprinted with permission from K. Menard, Dynamic Mechanical Analysis: a Practical Introduction, CRC
Press, Boca Raton, FL, 1999.)
0.9 Tg
0.8
4.0 sensitivity of DMA with respect to DSC or differential
3.5
0.7 thermal analysis (DTA) vary, it appears that DMA is
Tan δ
3.0
0.6 2.5 10 – 100 times more sensitive to the changes occurring at
0.5 Operating 2.0
0.4 range 1.5
Tg . The Tg in highly cross-linked materials can easily
0.3 1.0 be seen long after it has become too flat and diffuse
0.2 0.5 to be seen in the DSC (Figure 9). A highly cross-linked
0.1 0.0
0.0 molding resin used for chip encapsulation was run by both
−100.0 0.0 100.0 200.0 methods and DMA is able to detect the transition after
Temperature (°C) it is undetectable in DSC. This is also a known problem
with certain materials such as medical-grade urethanes
Figure 8 Definition of operating range based on position of Tg and very highly crystalline polyethylenes.
and Tb in an epoxy circuit board. (Reprinted with permission The method of determining Tg in DMA can be a
from K. Menard, Dynamic Mechanical Analysis: a Practical manner for disagreement as at least five ways are in
Introduction, CRC Press, Boca Raton, FL, 1999.)
current use (Figure 10a). It should be noted that DSC
also has multiple methods (Figure 10b). Depending on
23.8 the industry standards or background of the operator,
the peak or onset of the tan d curve, the onset of the E0
Heat flow (mW)
1.0 Heat flow drop, or the onset or peak of the E00 curve may be used.
1h
The values obtained from these methods can differ by up
0h 2−8 h
to 25 ° C from each other in the same run. In addition,
Tan δ
0.5
a 10 – 20 ° C difference from DSC is also seen in many
materials. In practice, it is important to specify exactly
Tan δ how the Tg should be determined. For DMA, this means
0.0
21.8 defining the heating rate, applied stresses (or strains), the
150 175 200 frequency used, and the method of determining Tg . For
Temperature (°C) example, the sample will be run at 10 ° C min 1 under
0.05% strain at 1 Hz in a nitrogen purge (20 cm3 min 1 )
Figure 9 The Tg of a chip encapsulation material was measured and the Tg determined from the peak of the tan d curve.
by DSC and DMA as a function of postcure time. (Reprinted
with permission from K. Menard, Dynamic Mechanical Ana- It is not unusual to see a peak or hump on the storage
lysis: a Practical Introduction, CRC Press, Boca Raton, FL, modulus directly preceding the drop that corresponds to
1999.) the Tg . This is shown in Figure 11. This is also seen in the
DSC and DTA and corresponds to a rearrangement in
the molecule to relieve stresses frozen in below the Tg by
degree of polymerization up to a value known as the the processing method. These stresses are trapped in the
critical Tg or the critical molecular weight. Above this material until enough mobility is obtained at the Tg to
value, Tg typically becomes independent of molecular allow the chains to move to a lower energy state. Often a
weight..69/ Tg represents a major transition for many material will be annealed by heating it above the Tg and
polymers, as the physical properties changes drastically slowly cooling it to remove this effect. For similar reasons,
as the material goes from a hard glassy to a rubbery some experimenters will run a material twice or use a
state. It defines one end of the temperature range over heat – cool – heat cycle to eliminate processing effects.
which the polymer can be used, often called the operating
range of the polymer, and an example of this range
4.1.3 The Rubbery Plateau, TŁa and Tll
is shown in Figure 8. Where strength and stiffness are
needed, it is normally the upper limit for use. In rubbers The area above the Tg and below the melt is known
and some semicrystalline materials such as polyethylene as the rubbery plateau and the length of it and
and polypropylene, it is the lower operating temperature. its viscosity are dependent on the molecular weight
Changes in Tg are commonly used to monitor changes between entanglements (Me ).70/ or cross-links. The
in the polymer such as plasticizing by environmental molecular weight between entanglements is normally
solvents and increased cross-linking from thermal or calculated during a stress – relaxation experiment but
ultraviolet (UV) aging. similar behavior is observed in DMA. The modulus in
The Tg of cured materials or thin coatings is often the plateau region is proportional to either the number
difficult to measure by other methods and more often of cross-links or the chain length between entanglements.
DYNAMIC MECHANICAL ANALYSIS OF POLYMERS AND RUBBERS 9
Peak tan δ = 140.5 °C 1.12e +9
1.00e + 9 The overshoot at the Tg
9.00e + 8 is caused by stress relief.
Modulus (Pa)
Onset E ′ = 133.1°C 8.00e + 8
7.00e + 8
6.00e + 8
Peak E ′′ = 136.7 °C 5.00e + 8
4.00e + 8
Modulus (Pa)
3.00e + 8
2.00e + 8
1.00e + 8
tan δ
100
Onset E ′′ = 127.3°C 25.4 30 35 40 45 50 55 60 65 70 75 81.8
Temperature (°C)
Tf
plateau region. This crystallization occurs when the poly-
mer chains have been quenched (quickly cooled) into a
Heat flow (mW)
6.84 3.00e + 11 75
Normalized heat flow endo up (Wg−1)
Tm 70
1.00e + 11
6.5
E′ 60
Tg
1.00e + 10
6.0 50
Modulus (Pa)
1.00e + 9
Tan δ
40
5.5
Cold crystallization 30
1.00e + 8 Heat flow
5.0
20
1.00e + 7
4.5 10
Tan δ
4.2 1.00e + 6 0
37.6 100 150 200 250 277
Temperature (°C)
Figure 12 Cold crystallization in poly(ethylene terephthalate) caused a large increase in the storage modulus, E0 , above the Tg . A
DSC scan of the same material is included. (Reprinted with permission from K. Menard, Dynamic Mechanical Analysis: a Practical
Introduction, CRC Press, Boca Raton, FL, 1999.)
the data from temperature-modulated DSC experiments Many final properties of polymeric products depend on
showing a recrystallization at the start of the melt..87 – 90/ changes induced in processing..91,92/
In both cases, some subtle changes in structure are
sometimes detected at the start of melting. Following 4.1.4 The Terminal Region
this transition, a material enters the terminal or melting
region. On continued heating, the melting point, Tm , is reached.
Depending on its strength, the heat set temperature can The melting point is where the free volume has increased
also be seen in DMA. While it is normally seen in either so the chains can slide past each other and the material
a TMA or a CGL (constant gauge length) experiment, it flows. This is also called the terminal region. In the molten
will sometimes appear as either a sharp drop in storage state, this ability to flow is dependent on the molecular
modulus (E0 ) or an abrupt change in probe position. Heat weight of the polymer (Figure 14). The melt of a polymer
set is the temperature at which some strain or distortion material will often show changes in temperature of
is induced into polymeric fibers to change its properties, melting, width of the melting peak, and enthalpy as
such as to prevent a nylon rug from feeling like fishing the material changes.93,94/ resulting from changes in the
line. Since heating above this temperature will erase the polymer molecular weight and crystallinity.
texture, and polyesters must be heated above the Tg to Degradation, polymer structure, and environmental
dye them, it is of critical importance to the fabric industry. effects all influence the changes that occur. Polymers that
degrade by cross-linking will look very different from
those that exhibit chain scission. Very highly cross-linked
3.0 4 polymers will not melt as they are unable to flow.
E′ The study of polymer melts and especially their
E ′(1010 Pa)
Figure 13 The aŁ transition, TaŁ , in polypropylene correspond- 4.1.5 Frequency Dependences in Transition Studies
ing to a crystal – crystal slip in the polymer. (Reprinted with
permission from K. Menard, Dynamic Mechanical Analysis: a The choice of a testing frequency or its effect on the
Practical Introduction, CRC Press, Boca Raton, FL, 1999.) resulting data must be addressed. A short discussion of
DYNAMIC MECHANICAL ANALYSIS OF POLYMERS AND RUBBERS 11
E′
1 Hz 1.80
7 Hz
1.60
109 7 Hz
1.40
Modulus (Pa)
1.20
tan δ (×101)
1.00
108 0.80
1 Hz
0.60
0.40
tan δ
0.20
107 0.00
−200.0 −150.0 −100.0 −50.0 0.0 50.0 100.0 150.0 200.0 250.0 300.0
Temperature (°C)
Figure 15 Effect of frequency on transitions: the dependence of the Tg in polycarbonate on frequency. (Used with the permission
of Rheometric Sciences, Piscataway, NJ.)
107
More
107 h0 / cMv1 .22/
More
liquid solid
like
Viscosity (Pa s)
106 like
E′ 106 for cases where the molecular weight, Mv , is less than the
Modulus (Pa)
103
Flow dominates Elastic dominates
103
where h0 is the viscosity of the initial Newtonian plateau,
c a material constant, and Mv the viscosity-average
10−2 10−1 100 101
molecular weight. This relationship can be written in
Log [frequency (Hz)]
general terms, replacing the exponential term with the
Figure 16 An example of a frequency scan showing the Mark – Houwink constant, a. Equation (23) can be used
change in a material’s behavior as the frequency varies. Low as a method of approximating the molecular weight of a
frequencies allow the material time to relax and respond, polymer. The value obtained is closest to the viscosity-
hence flow dominates. High frequencies do not allow relaxation average molecular weight obtained by osmometry..96/ In
and elastic behavior dominates. (Reprinted with permission
comparison with the weight-average data obtained by
from K. Menard, Dynamic Mechanical Analysis: a Practical
Introduction, CRC Press, Boca Raton, FL, 1999.) gel permeation chromatography (GPC), the viscosity-
average molecular weight would be between the number-
average and weight-average molecular weights, but closer
Starting with the viscosity curve, hŁ , a fairly flat region to the latter..97/ This was orginially developed for steady
appears at low frequency, called the zero shear plateau..95/ shear viscosity but also applies to complex viscosity.
This is where the polymer exhibits Newtonian behavior The relationship between steady shear and complex
and its viscosity is dependent on molecular weight, not the viscosity is fairly well established. Cox and Merz.98,99/
strain rate. The viscosity of this plateau has been shown found that an empirical relationship exists between
to be related experimentally to the molecular weight for complex viscosity and steady shear viscosity when the
a Newtonian fluid [Equation 22]: shear rates are the same. The Cox – Merz rule is stated as
DYNAMIC MECHANICAL ANALYSIS OF POLYMERS AND RUBBERS 13
appears like the reverse of a temperature scan. The same For example, in a tape adhesive, sufficient flow under
time – temperature equivalence as discussed above also pressure at low frequency is desired to fill the pores of
applies to modulus, in addition to compliance, tan d, and the material to obtain a good mechanical bond. When
other properties. the laminate is later subjected to peel, the material needs
The frequency scan is used for several purposes that will to be very elastic so it will not pull out of the pores
be discussed in this section. One very important use that is [this is a very simplified version of adhesion; a detailed
very straightforward is to survey the material’s response discussion can be found elsewhere..103,104/ ] The frequency
over various shear rates. This is important because scan allows the measurement of these properties in one
many materials are used under different conditions. scan, so ensuring that tuning one property does not
For example, adhesives, whether tape, Band-Aids , degrade another. This type of testing is not limited to
or hot melts, are normally applied under conditions adhesives as many materials see multiple frequencies
of low frequency and this property is referred to in actual use. Viscosity versus frequency plots are used
as tack. When they are removed, the removal often extensively to study how changes in polymer structure
occurs under conditions of high frequency called peel. or formulations affect the behavior of the melt. Often
Different properties are required in these regimes and to changes in materials, especially in uncured thermosetting
optimize one property may require chemical changes resins and molten materials, affect a limited frequency
that harm the other. Similarly, changes in polymer range and testing at a specific frequency can miss the
structure can show these kinds of differences in the problem.
frequency scan. For example, branching affects different It should be noted that since the material is scanned
frequencies..32/ across a frequency range, there are some conditions
where the material – instrument system acts like a guitar
string and begins to resonate when certain frequencies are
reached. These frequencies are either the natural reso-
Dynamic nance frequency of the sample – instrument system or one
of its harmonics. This is shown in Figure 19. Under this
G′ set of experimental conditions, the sample – instrument
Log moduli
G′
Log moduli
Resonance
η∗
1010 Harmonics 1010
Complex viscosity
Storage modulus
G ′′ E′ 109
109
108 108
107 107
106 106
(b) Log frequency
10−2 10−1 100 101 102
Figure 18 Comparison of a modulus scan taken by scanning Frequency (Hz)
at various frequencies and by varying the temperature. This
relationship is called time – temperature equivalency and is Figure 19 Free resonance occurring during a frequency scan.
discussed later. (Used with the permission of Rheometric (Used with the permission of Perkin-Elmer Corporation,
Scientific, Piscataway, NJ.) Norwalk, CT.)
DYNAMIC MECHANICAL ANALYSIS OF POLYMERS AND RUBBERS 15
4.3 Thermoset Curing of handling and sample, the composite is often easier to
work with.
The ability of DMA to give viscosity and modulus values Another special area of concern is paints and
for each point in a temperature scan allows the estimation coatings.110,111/ where the material is used in a thin layer.
of kinetic behavior as a function of viscosity. This has the This can be addressed experimentally by either a braid as
advantage of describing how fluid the material is at any above or coating the material on a thin sheet of metal. The
given time, so as to determine the best time to apply metal is often run first and its scan subtracted from the
pressure, what design of tooling to use, and when the coated sheet’s scan to leave only the scan of the coating.
material can be removed from the mold. The simplest This is also done with thin films and adhesive coatings.
way to analyze a resin system is to run a plain temperature A sample cure profile for a commercial two-part epoxy
ramp from ambient to some elevated temperature..105 – 109/ resin is shown in Figure 20. From this scan, it is possible
This ‘cure profile’ allows the collection of several vital to determine the minimum viscosity (hŁmin ), the time to
pieces of information as shown in Figure 20. hŁmin and the length of time it stays there, the onset of
cure, the point of gelation where the material changes
4.3.1 Cure Studies in the Dynamic Mechanical Analysis from a viscous liquid to a viscoelastic solid, and the
beginning of vitrification. The minimum viscosity is seen
Before analyzing the cure in Figure 20 in more detail it in the complex viscosity curve and is where the resin
should be mentioned that in curing studies, all three types viscosity is the lowest. A given resin’s minimum viscosity
of commercial DMA instruments are used. The shape is determined by the resin’s chemistry, the previous heat
of curve and the temperature of events follow the same history of the resin, the rate at which the temperature
pattern. The values for viscosity and modulus often differ is increased, and the amount for stress or stain applied.
greatly. Both types of forced resonance DMA instruments Increasing the rate of the temperature ramp is known
also use samples impregnated into fabrics in techniques to decrease the hŁmin , the time to hŁmin , and the gel time.
that are referred to as ‘torsional braid’. There are some The resin becomes softer faster, but also cures faster. The
problems with this technique as temperature increases degree of flow limits the type of mold design and when
will cause an apparent curing of nondrying oils as thermal and how much pressure can be applied to the sample.
expansion increases friction. However, the ‘soaking of The time spent at the minimum viscosity plateau is the
resin into a shoelace’, as this technique has been called, result of a competitive relationship between the material’s
allows one to handle difficult specimens under conditions softening or melting as it heats and its rate of curing. At
where the pure resin is impossible to run in bulk (owing to some point, the material begins to cure faster than it
viscosity or evolved volatiles). Composite materials such softens, and that is where the viscosity starts to increase.
as graphite – epoxy composites are sometimes studied in As the viscosity begins to climb, an inversion is seen
industrial situations as the composite rather than the of the E00 and E0 values as the material becomes more
‘neat’ or pure resin because of the concern that the solid-like. This crossover point also corresponds to where
kinetics may be significantly different. In terms of ease the tan d D 1 (since E0 D E00 at the crossover). This is
107 107
106 Pa ~ solidity
Modulus (Pa)
106 106
Possible
105 105
E ′′ vitrification point
104 104
Curing
103 E′ 103
Figure 20 The DMA cure profile of a two-part epoxy showing the typical analysis for minimum viscosity, gel time, vitrification
time, and estimation of the action energy. See discussion in text. (Reprinted with permission from K. Menard, Dynamic Mechanical
Analysis: a Practical Introduction, CRC Press, Boca Raton, FL, 1999.)
16 POLYMERS AND RUBBERS
taken to be the gel point,.112 – 164/ where the crosslinks it does not allow for as much network development, but
have progressed to forming an ‘infinitely’ long network gives a series of hard (highly cross-linked) areas among
across the specimen. At this point, the sample will no softer (lightly cross-linked) areas.
longer dissolve in solvent. Although the gel point corre- On the way to vitrification, an important value is
lates fairly often with this crossover, it does not always 106 Pa s. This is the viscosity of bitumen.121/ and is often
do so. For example, for low initiator levels in chain used as a rule of thumb for where a material is stiff enough
addition thermosets, the gel point precedes the modulus to support its own weight. This is a rather arbitrary point,
crossover..115/ A temperature dependence for the pres- but is chosen to allow the removal of materials from a
ence of the crossover has also been reported..105 – 109/ In mold and the cure is then continued as a postcure step.
some cases, where powder compacts and melts before As will be seen below, the postcure is often a vital part of
curing, there may be several crossovers..116/ Then, the the curing process.
one following the hŁmin is usually the one of interest. Some The cure profile is both a good predictor of performance
researchers.117 – 119/ believe that the true gel point is best and a sensitive probe of processing conditions. A final
detected by measuring the frequency dependence of the note on cure profiles is that a volume change occurs during
crossover point. This is done either by multiple runs the cure..122/ This shrinkage of the resin is important and
at different frequencies or by multiplexing frequencies can be studied by monitoring the probe position of some
during the cure. At the gel point, the frequency depen- DMA instruments and also by TMA and dilatometry.
dence disappears..119/ Value is usually only a few degrees
different from that obtained in a normal scan and in most 4.3.2 Photocuring
cases is not worth the additional time. During this rapid
climb of viscosity in the cure, the slope for hŁ increase A photocure in a DMA instrument is run by applying
can be used to calculate an estimated Ea (activation a UV light source to a sample that is held at a
energy)..120/ This will be discussed below, but the fact that specific temperature or subjected to a specific thermal
the slope of the curve here is a function of Ea is important. cycle..123 – 125/ Photocuring is done for dental resin, contact
Above the gel temperature, some workers estimate the adhesives, and contact lenses. UV exposure studies are
molecular weight, Mc , between crosslinks according to also run on cured and thermoplastic samples by the same
Equation (28): techniques as photocuring to study UV degradation. The
cure profile of a photocure is very similar to that of a
RTr
G0 D .28/ cake or epoxy cement. The same analysis is used and the
Mc same types of kinetics are developed as for thermal curing
where R is the gas constant, T is the temperature in studies.
kelvins, and r is the density. At some point the curve The major practical difficulty in running photocures
begins to level off and this is often taken as the vitrification in a DMA instrument is the current lack of a commer-
point, Tvf . cially available photocuring accessory, comparable to the
The vitrification point is where the cure rate slows photocalorimeters on the market. One normally has to
because the material has become so viscous that the bulk adapt a commercial DMA instrument to run these exper-
reaction has stopped. At this point, the rate of cure slows iments. The Perkin-Elmer DMA-7e has been successfully
significantly. The apparent Tvf , however, is not always adapted.126/ to use quartz fixtures, a laboratory-made
real: any analyzer has an upper force limit. When that heating chamber and commercial UV source triggered
force limit is reached, the ‘topping out’ of the analyzer from the DMA instrument’s RS232 port. This is a fairly
can pass as the Tvf . Use of a combined technique such easy process and other instruments such as the RheoSci
as DMA/DEA [DEA is dielectric analysis, where an DMTA 4 have also been adapted.
oscillating electrical signal is applied to a sample; from
this signal, the ion mobility can be calculated, which is 4.3.3 Modeling Cure Cycles
then converted to a viscosity (see McCrum.18/ for details);
DEA will measure to significantly higher viscosities than The above discussions are based on using a simple
DMA] to see the higher viscosities or the removal of a temperature ramp to see how a material responds to
sample from parallel plate and sectioning it into a flexure heating. In actual use, many thermosets are actually
beam is often necessary to see the true vitrification point. cured using more complex cure cycles to optimize the
A reaction can also completely cure without vitrifying tradeoff between the processing time and the final
and will level off in the same way. One should be aware product’s properties..127,128/ The use of two-stage cure
that reaching vitrification or complete cure too quickly cycles is known to develop stronger laminates in the
could be as bad as reaching it too slowly. Often an overly aerospace industry. Exceptionally thick laminates often
aggressive cure cycle will lead to a weaker material as also require multiple stage cycles in order to develop
DYNAMIC MECHANICAL ANALYSIS OF POLYMERS AND RUBBERS 17
,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,, EŁ complex modulus
,,,,,,,,,,,,,,,,
Gel
E0 storage modulus
Fu
T g∞
,,,,,,,,,,,,,,,,
rubber Char
ll
Vitr E00
cu
tion
rubber J compliance
,,,,,,,,,,,,,,,,
Temperature of curing
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
,,,,,
Devitrifi k deformation
,,,,,,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,, , , , , , , , ,
,,,,,,,,,,,, , , , , , , , ,
,,,,,,,,,,,, , , , , , , , ,
,,,,,,,,,,,, , , , , , , , ,
,,,,,,,,,,,, , , , , , , , ,
,,,,,,,,,,,, , , , , , , , ,
,,,,,,,,,,,,,,,,
cation
T period
,,,,,,,,,
Gel glas
Ge s r density
lat Tg = T ∞
ion V g G shear modulus
itr
ific Me entanglement molecular weight
at
ion Sol−gel glass Mc molecular weight between cross-links
Mw Molecular weight
Liquid f Frequency
,,,,,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,,
,,,,,,,,, T g = T gel w Frequency in hertz
,,,
g k Rate constant
Ea Activation energy
T gel
g Sol glass vf Free volume
Ta,b,g Transition
T g0 Log time Logarithmic decrement
Torque
Figure 21 The Gillham – Enns or TTT diagram. (Reprinted
from J.K. Gillham, J.B. Enns, ‘On the Cure and Properties
of Thermosetting Polymers using Torsional Braid Analysis’,
Trends Polym. Sci., 2(12), 406 – 419 (1994), Copyright 1994, with ABBREVIATIONS AND ACRONYMS
permission from Elsevier Science.)
ASTM American Society for Testing and Materials
CGL Constant Gauge Length
CTE Coefficient of Thermal Expansion
ACKNOWLEDGMENTS
DDSC Dynamic Differential Scanning Calorimetry
DEA Dielectric Analysis
The authors acknowledge the Analytical Instruments DMA Dynamic Mechanical Analysis
Division of Perkin-Elmer Inc. and the Materials Sci- DMS Dynamic Mechanical Spectroscopy
ence Department of the University of North Texas DMTA Dynamic Mechanical Thermal Analysis
for their support and assistance. In addition, the help DSC Differential Scanning Calorimetry
and advice of Professor Witold Brostow of the Materi- DTA Differential Thermal Analysis
als Science Department of UNT, Debra Kauffman and DTMA Dynamic Thermomechanical Analysis
Karen Lanigan of the PE Division Research Library, and FTIR Fourier Transform Infrared
the editorial staff of John Wiley & Sons Ltd is greatly GPC Gel Permeation Chromatography
appreciated. IR Infrared
TBA Torsional Braid Analyzer
TMA Thermomechanical Analyzer
LIST OF SYMBOLS TTT Time – Temperature – Transformation
UV Ultraviolet
WLF Williams – Landel – Ferry
d phase angle
tan d tangent of the phase angle, also called the
damping
s stress RELATED ARTICLES
g shear strain
e tensile strains Coatings (Volume 2)
gP shear strain rate Coatings Analysis: Introduction ž Mechanical Properties
eP strain rate of Solid Coatings ž Rheology in Coatings, Principles and
h viscosity Methods ž Thermal Analysis of Coatings
hŁ complex viscosity
h0 storage viscosity Food (Volume 5)
h00 loss viscosity Viscosity of Food: Measurement and Application
DYNAMIC MECHANICAL ANALYSIS OF POLYMERS AND RUBBERS 19
Polymers and Rubbers (Volume 8) 19. P. Flory, Principles of Polymer Chemistry, Cornell
Polymers and Rubbers: Introduction ž Atomic Force University Press, Ithaca, NY, 1953.
Microscopy in Analysis of Polymers 20. R. Bird, C. Curtis, R. Armstrong, O. Hassenger, Dynam-
ics of Polymer Fluids, 2nd edition, John Wiley & Sons,
Polymers and Rubbers cont’d (Volume 9) New York, 1987.
Dielectric Spectroscopy in Analysis of Polymers ž 21. J.D. Ferry, Viscoelastic Properties of Polymers, 3rd
Mechanical Properties of Polymers and Rubbers edition, John Wiley & Sons, New York, 1980.
22. J.J. Aklonis, W.J. McKnight, Introduction to Polymer
Viscoelasticity, 2nd edition, John Wiley & Sons, New
Thermal Analysis (Volume 15)
York, 1983.
Thermal Analysis: Introduction ž Differential Scan-
23. L.C.E. Struik, Physical Aging in Amorphous Polymers
ning Calorimetry and Differential Thermal Analysis ž
and Other Materials, Elsevier, New York, 1978.
Inorganic Systems, Thermal Analysis Applications to ž
24. L.C.E. Struik, in Failure of Plastics, ed. W. Brostow,
Simultaneous Techniques in Thermal Analysis ž Ther- R.D. Corneliussen, Hanser, New York, 1986.
mogravimetry 25. S. Matsuoka, in Failure of Plastics, ed. W. Brostow,
R.D. Corneliussen, Hanser, New York, 24 – 59, 1986.
26. S. Matsuoka, Relaxation Phenomena in Polymers, Han-
ser, New York, 237 – 264, 1992.
REFERENCES
27. J.D. Vrentas, J.L. Duda, J.W. Huang, Macromolecules,
19, 1718 (1986).
1. K. Menard, Dynamic Mechanical Analysis: a Practical 28. W. Brostow, M.A. Macip, Macromolecules, 22(6), 2761
Introduction, CRC Press, Boca Raton, FL, 1999. (1989).
2. M. Sepe, Dynamic Mechanical Analysis for Plastic 29. N. McCrum, G. Williams, B. Read, Anelastic and Dielec-
Engineering, Plastic Design Library, New York, 1998. tric Effects in Polymeric Solids, Dover, New York,
3. T. Murayama, Dynamic Mechanical Analysis of Poly- 1967.
meric Materials, Elsevier, New York, 1977. 30. M. Doi, S. Edwards, The Dynamics of Polymer Chains,
4. J.H. Poynting, Proc. R. Soc. London, Ser. A, 82, 546 Oxford University Press, New York, 1986.
(1909). 31. A.J. Aklonis, W. MacKnight, Introduction to Viscoelas-
5. A. Kimball, D. Lovell, Trans. Am. Soc. Mech. Eng., 48, ticity, John Wiley & Sons, New York, 1983.
479 (1926). 32. C.L. Rohn, Analytical Polymer Rheology, Hanser-
6. K. te Nijenhuis, in Rheology. Volume 1. Principles, ed. Gardener, New York, 1995.
G. Astarita et al., Plenum Press, New York, 263, 1980. 33. J.Heijboer, Int. J. Polym. Mater., 6, 11 (1977).
7. M.L. Miller, The Structure of Polymers, Reinhold, New 34. N. McCrum, G. Williams, B. Read, Anelastic and Dielec-
York, 1966. tric Effects in Polymeric Solids, Dover, New York,
8. J. Dealy, Rheometers for Molten Plastics, Van Nostrand 1967.
Reinhold, New York, 136 – 137, 234 – 236, 1992. 35. R.F. Boyer, Polym. Eng. Sci., 8(3), 161 (1968).
9. J. Ferry, Viscoelastic Properties of Polymers, 3rd edition, 36. C.L. Rohn, Analytical Polymer Rheology, Hanser-
John Wiley & Sons, New York, 1980. Gardener, New York, 279 – 283, 1995.
10. N. McCrum, B. Williams, G. Read, Anelastic and Dielec- 37. J. Heijboer, Int. J. Polym. Mater., 6, 11 (1977).
tric Effects in Polymeric Solids, Dover, New York, 1991. 38. M. Mangion, G. Johari, J. Polym. Sci., Part B: Polym.
11. J. Gilham, J. Enns, Trends Polym. Sci., 2, 406 (1994). Phys., 29, 437 (1991).
12. C. Macosko, J. Starita, SPE J., 27, 38 (1971). 39. G. Johari, G. Mikoljaczak, J. Cavaille, Polymer, 28, 2023
13. T. Murayama, Dynamic Mechanical Analysis of Poly- (1987).
meric Materials, Elsevier, New York, 1977. 40. S. Cheng, F. Arnold, F. Harris, Polym. Sci. Eng., 33, 21
14. B.E. Read, G.D. Brown, The Determination of the (1993).
Dynamic Properties of Polymers and Composites, John 41. G. Johari, Lect. Notes Phys., 277, 90 (1987).
Wiley & Sons, New York, 1978. 42. R. Daiz-Calleja, E. Riande, Rheol. Acta, 34, 58 (1995).
15. J. Gillham, in Developments in Polymer Characteriza- 43. R. Boyd, Polymer, 26, 323 (1985).
tions, ed. J. Dworkins, Applied Science, Princeton, NJ, 44. V. Bershtein, V. Egorov, L. Egorova, V. Ryzhov, Ther-
159 – 227, Vol. 3, 1982. mochim. Acta, 238, 41 (1994).
16. J. Gillham, J. Enns, Trends Polym. Sci., 2(12), 406 (1994). 45. B. Twombly, Proc. of the North American Thermal
17. U. Zolzer, H.-F. Eicke, Rheolo. Acta, 32, 104 (1993). Analysis Society, 20, 63 (1991).
18. N. McCrum, G. Williams, B. Read, Anelastic and Dielec- 46. C.L. Rohn, Analytical Polymer Rheology, Hanser-
tric Properties of Polymeric Solids, Dover, New York, Gardener, New York, 1995.
192 – 200, 1991. 47. J. Heijboer, Int. J. Polym. Mater., 6, 11 (1977).
18a. D. Holland, J. Rheology, 38(6), 1941 – 1943 (1994). 48. R. Boyer, Polym. Eng. Sci., 8(3), 161 (1968).
20 POLYMERS AND RUBBERS
49. V. Bershtein, V. Egorov, Differential Scanning Calorime- 87. B. Cassel, G. Curran, PETAN #69 DDSC, Perkin-Elmer,
tery in the Physical Chemistry of Polymers, Ellis Hor- Norwalk, CT, 1995.
wood, Chichester, 1993. 88. W. Sichina, Proc. of the North American Thermal
50. B. Coxton, personal communication. Analysis Society, 23, 137 (1994).
51. S. Cheng, D. Shen, K. Bruno, F. Arnold, M. Eashoo, 89. B. Wunderlich, A. Boller, Y. Jin, J. Thermal Anal., 42,
C. Lee, F. Harris, Polym. Sci. Eng., 33, 21 (1993). 307 (1994).
52. G. Johari, G. Mikoljaczak, J. Cavaille, Polymer, 28, 2023 90. B. Wunderlich, Modulated DSC, University of Ten-
(1987). nessee, Knoxville, TN, 1994.
53. M. Mangion, G. Johari, J. Polym. Sci., Part B: Polym. 91. J. Dealy, K. Wissbrun, Melt Rheology and its Role in
Phys., 29, 437 (1991). Plastic Processing, Van Nostrand Reinhold, Toronto,
54. F.C. Nelson, Shock Vibr. Dig., 26(2), 11 (1994). 1990.
55. F.C. Nelson, Shock Vibr. Dig., 26(2), 24 (1994). 92. N. Chereminsinoff, An Introduction to Polymer Rheol-
56. W. Brostow, personal communication. ogy and Processing, CRC Press, Boca Raton, FL, 1993.
57. R. Boyer, Polym. Eng. Sci., 8(3), 161 (1968). 93. E. Turi (ed.), Thermal Characterization of Polymeric
58. G. Johari, Lect. Notes Phys., 277, 90 (1987). Materials, Academic Press, Boston, 1981.
59. J. Heijboer, Int. J. Polym. Mater., 6, 11 (1977). 94. E. Turi (ed.), Thermal Analysis in Polymer Characteri-
60. J. Heijboer, A. Waterman, L Struik, M. van der Duik- zation, Heyden, London, 1981.
eren, in Physics of Non-crystalline Solids, ed. J. Prins, 95. C. Rohn, Analytical Polymer Rheology, Hanser, New
Interscience, New York, 214 – 245, 1965. York, 1995.
61. J. Heijboer, J. Polym. Sci., C16, 3755 (1968). 96. M. Miller, The Structure of Polymers, Reinhold, New
62. L. Nielsen et al., J. Macromol. Sci. Phys., 9, 239 (1974). York, 611 – 612, 1966.
63. A. Yee, S. Smith, Macromolecules, 14, 54 (1981). 97. S. Rosen, Fundamantal Principles of Polymeric Mate-
rials, Wiley – Interscience, New York, 53 – 77, 258 – 259,
64. G. Gordon, J. Polym. Sci., Part A2, 9, 1693 (1984).
1993.
65. J. Wendorff, B. Schartel, Polymer, 36(5), 899 (1995).
98. W. Cox, E. Merz, J. Polym. Sci., 28, 619 (1958).
66. R.H. Boyd, Polymer, 26, 323 (1985).
99. P. Leblans et al., J. Polym. Sci., 21, 1703 (1983).
67. I. Noda, Appl. Spectrosc., 44(4), 550 (1990).
100. W. Gleissele, in Rheology, ed. G. Astarita et al., Plenum
68. V. Kien, Proceedings of the 6th Symposium on Radiation
Press, New York, 457, Vol. 2, 1980.
Chemistry, 463, Vol. 2, 1987.
101. D.W. Van Krevelin, Properties of Polymers, Elsevier,
69. L.H. Sperling, Introduction to Physical Polymer Science,
New York, 289, 1987.
2nd edition, John Wiley & Sons, New York, 1992.
102. C. Macosko, Rheology, VCH, New York, 120 – 127,
70. C. Macosko, Rheology, VCH, New York, 1994.
1996.
71. F. Quinn et al., Thermal Analysis, John Wiley & Sons,
103. L.-H. Lee (ed.), Adhesive Bonding, Plenum Press, New
New York, 1994.
York, 1991.
72. B. Wunderlich, Thermal Analysis, Academic Press, New
104. L.-H. Lee (ed.), Fundamentals of Adhesion, Plenum
York, 1990. Press, New York, 1991.
73. J. Schawe, Thermochim. Acta, 261, 183 (1995). 105. G. Martin, A. Tungare, J. Gotro, Polymer Characteri-
74. J. Schawe, Thermochim. Acta, 260, 1 (1995). zation, American Chemical Society, Washington, DC,
75. J. Schawe, Thermochim. Acta, 271, 1 (1995). 1990.
76. B. Wunderlich et al., J. Thermal Anal., 42, 949 (1994). 106. M. Ryan et al., ANTEC Proc., 31, 187 (1973).
77. R.H. Boyd, Polymer, 26, 323 (1985). 107. C. Gramelt, Am. Labo., January, 26 (1984).
78. R.H. Boyd, Polymer, 26, 1123 (1985). 108. S. Etoh et al., SAMPE J., 3, 6 (1985).
79. S. Godber, personal communication. 109. F. Hurwitz, Polym. Compos., 4(2), 89 (1983).
80. M. Ahmed, Polypropylene Fiber – Science and Techno- 110. M. Roller, Polym. Eng. Sci., 19, 692 (1979).
logy, Elsevier, New York, 1982. 111. M. Roller et al., J. Coating Technol., 50, 57 (1978).
81. A. Lobanov et al., Polym. Sci. USSR, 22, 1150 (1980). 112. M. Heise et al., Polym. Eng. Sci., 30, 83 (1990).
82. R. Boyer, J. Polym Sci., Part B: Polym. Phys., 30, 1177 113. K. O’Driscoll et al., J. Polym. Sci., Polym. Chem., 17,
(1992). 1891 (1979).
83. J.K. Gilham et al., J. Appl. Polym. Sci., 20, 1245 (1976). 114. O. Okay, Polymer, 35, 2613 (1994).
84. J.B. Enns, R. Boyer, Encycl. Polym. Sci., 17, 23 – 47 115. M. Hiese, G, Martin, J. Gotro, Polym. Eng. Sci., 30(2),
(1989). 83 (1990).
85. V. Bershtien, V. Egorov, L. Egorova, V. Ryzhov, Ther- 116. K. Wissbrun et al., J. Coating Technol., 48, 42 (1976).
mochim. Acta., 238, 41 (1994). 117. F. Champon et al., J. Rheol., 31, 683 (1987).
86. C.M. Warner, ‘Evaluation of the DSC for Observation of 118. H. Winter, Polym. Eng. Sci., 27, 1698 (1987).
the Liquid – Liquid Transition’, Master’s Thesis, Central 119. C. Michon, G. Curvelier, Launay, Rheol. Acta, 32, 94
Michigan State University, 1988. (1993).
DYNAMIC MECHANICAL ANALYSIS OF POLYMERS AND RUBBERS 21
120. I. Kalnin et al., Epoxy Resins, American Chemical 139. C. Rohn, Problem Solving for Thermosetting Plastics,
Society, Washington, DC, 1970. Rheometrics, Austin, TX, 1989.
121. H. Barnes, J. Hutton, K. Walters, An Introduction to 140. J. Seferis et al., Chemorheology of Thermosetting Poly-
Rheology, Elsevier, New York, 1989. mers, American Chemical Society, Washington, DC, 301,
122. A.W. Snow et al., J. Appl. Polym. Sci., 52, 401 (1994). 1983.
123. T. Renault et al., NATAS Notes, 25, 44 (1994). 141. R. Patel et al., J. Thermal Anal., 39, 229 (1993).
124. H.L. Xuan et al., J. Polym. Sci., Part A, 31, 769 (1993). 142. M. Roller, Polym. Eng. Sci., 26, 432 (1986).
125. W. Shi et al., J. Appl. Polym. Sci., 51, 1129 (1994). 143. M. Roller, personal communication, 1998.
126. J. Enns, personal communication. 144. J. Gillham et al., Polym. Compos., 1, 97 (1980).
127. R. Follensbee, J. Koutsky, A. Christiansen, C. Myers, 145. J. Enns, J. Gillham, J. Appl. Polym. Sci., 28, 2567 (1983).
R. Geimer, J. Appl. Polym. Sci., 47, 1481 (1993). 146. L.C. Chan et al., J. Appl. Polym. Sci., 29, 3307 (1984).
128. R. Roberts, SAMPE J., 5, 28 (1987). 147. J. Gillham, Polym. Eng. Sci., 26, 1429 (1986).
129. P.J. Halley, M.E. MacKay, Polym. Eng. Sci., 36(5), 593 148. S. Simon, G. McKenna, J. Appl. Polym. Sci., 51, 1741
(1996). (1994).
130. J. Ferry, Viscoelastic Properties of Polymers, 3rd edition, 149. G. Palmese et al., J. Appl. Polym. Sci., 34, 1925 (1987).
John Wiley & Sons, New York, 1980. 150. J. Enns et al., in Polymer Characterization, ed. C. Craver,
131. J. Mijovic, B. Schafran, J. Compos. Mater., 23, 163 American Chemical Society, Washington, DC, 1983.
(1989). 151. J. Gillham, J. Enns, J. Appl. Polym. Sci., 53, 709 (1994).
132. J. Mijovic, T. Ho, SAMPE J., 23, 51 (1990). 152. J. Enns, J. Gillham, Trends Polym. Sci., 2(12), 406
133. M. Roller, Met. Finish., 78, 28 (1980). (1994).
134. M. Roller, ANTEC Proc., 24, 9 (1978). 153. A. Otero et al., Thermochim. Acta, 203, 379 (1992).
135. J. Gilham, ACS Symp. Ser., 78, 53 (1978). 154. J. Gillham, J. Enns, J. Appl. Polym. Sci., 42, 2453 (1991).
136. M. Roller, ANTEC Proc., 21, 212 (1975). 155. B. Osinski, Polymers, 34, 752 (1993).
137. M. Roller, Polym. Eng. Sci., 15, 406 (1975). 156. J. Enns, J. Gillham, Trends Polym. Sci., 2(12), 406 (1994).
138. M. Roller, Polym. Eng. Sci., 26, 432 (1986).