LM148-N, LM248-N, LM348-N

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LM148/LM248/LM348 Quad 741 Op Amps

Check for Samples: LM148-N, LM248-N, LM348-N

1FEATURES DESCRIPTION
•
2 741 Op Amp Operating Characteristics The LM148 series is a true quad 741. It consists of
four independent, high gain, internally compensated,
• Class AB Output Stage—No Crossover low power operational amplifiers which have been
Distortion designed to provide functional characteristics
• Pin Compatible With the LM124 identical to those of the familiar 741 operational
• Overload Protection for Inputs and Outputs amplifier. In addition the total supply current for all
four amplifiers is comparable to the supply current of
• Low Supply Current Drain: 0.6 mA/Amplifier a single 741 type op amp. Other features include
• Low Input Offset Voltage: 1 mV input offset currents and input bias current which are
• Low Input Offset Current: 4 nA much less than those of a standard 741. Also,
excellent isolation between amplifiers has been
• Low Input Bias Current 30 nA
achieved by independently biasing each amplifier and
• High Degree of Isolation Between Amplifiers: using layout techniques which minimize thermal
120 dB coupling.
• Gain Bandwidth Product The LM148 can be used anywhere multiple 741 or
– LM148 (Unity Gain): 1.0 MHz 1558 type amplifiers are being used and in
applications where amplifier matching or high packing
density is required. For lower power refer to LF444.

Schematic Diagram

* 1 pF in the LM149

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM148-N, LM248-N, LM348-N
SNOSBT2E – MAY 1999 – REVISED MARCH 2013 www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings (1) (2)

LM148 LM248 LM348
Supply Voltage ±22V ±18V ±18V
Differential Input Voltage ±44V ±36V ±36V
(3)
Output Short Circuit Duration Continuous Continuous Continuous
Power Dissipation (Pd at 25°C) and Thermal Resistance (θjA) (4)
PDIP (NFF) Pd — — 750 mW
θJA — — 100°C/W
CDIP (J) Pd 1100 mW 800 mW 700 mW
θJA 110°C/W 110°C/W 110°C/W
Maximum Junction Temperature (TjMAX) 150°C 110°C 100°C
−55°C ≤ TA ≤ −25°C ≤ TA ≤ 0°C ≤ TA ≤ +70°C
Operating Temperature Range
+125°C +85°C
Storage Temperature Range −65°C to +150°C −65°C to +150°C −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) Ceramic 300°C 300°C 300°C
Lead Temperature (Soldering, 10 sec.) Plastic 260°C
Soldering Information
Dual-In-Line Package Soldering (10 seconds) 260°C 260°C 260°C
Small Outline Package Vapor Phase (60 seconds) 215°C 215°C 215°C
Infrared (15 seconds) 220°C 220°C 220°C
ESD tolerance (5) 500V 500V 500V

(1) Refer to RETS 148X for LM148 military specifications.

(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Any of the amplifier outputs can be shorted to ground indefinitely; however, more than one should not be simultaneously shorted as the
maximum junction temperature will be exceeded.
(4) The maximum power dissipation for these devices must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the
ambient temperature, TA. The maximum available power dissipation at any temperature is Pd = (TJMAX − TA)/θJA or the 25°C PDMAX,
whichever is less.
(5) Human body model, 1.5 kΩ in series with 100 pF.

Electrical Characteristics
These specifications apply for VS = ±15V and over the absolute maximum operating temperature range (TL ≤ TA ≤ TH) unless
otherwise noted.
LM148 LM248 LM348 Units
Parameter Conditions
Min Typ Max Min Typ Max Min Typ Max
Input Offset Voltage TA = 25°C, RS ≤ 10 kΩ 1.0 5.0 1.0 6.0 1.0 6.0 mV
Input Offset Current TA = 25°C 4 25 4 50 4 50 nA
Input Bias Current TA = 25°C 30 100 30 200 30 200 nA
Input Resistance TA = 25°C 0.8 2.5 0.8 2.5 0.8 2.5 MΩ
Supply Current All TA = 25°C, VS = ±15V 2.4 3.6 2.4 4.5 2.4 4.5 mA
Amplifiers
TA = 25°C, VS = ±15V
Large Signal Voltage Gain 50 160 25 160 25 160 V/mV
VOUT = ±10V, RL ≥ 2 kΩ
TA = 25°C, f = 1 Hz to 20 kHz
Amplifier to Amplifier
(Input Referred) −120 −120 −120 dB
Coupling
See Crosstalk Test Circuit
TA = 25°C,
Small Signal Bandwidth 1.0 1.0 1.0 MHz
LM148 Series
TA = 25°C,
Phase Margin 60 60 60 degrees
LM148 Series (AV = 1)

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Electrical Characteristics (continued)

These specifications apply for VS = ±15V and over the absolute maximum operating temperature range (TL ≤ TA ≤ TH) unless
otherwise noted.
LM148 LM248 LM348 Units
Parameter Conditions
Min Typ Max Min Typ Max Min Typ Max
TA = 25°C,
Slew Rate 0.5 0.5 0.5 V/μs
LM148 Series (AV = 1)
Output Short Circuit TA = 25°C 25 25 25 mA
Current
Input Offset Voltage RS ≤ 10 kΩ 6.0 7.5 7.5 mV
Input Offset Current 75 125 100 nA
Input Bias Current 325 500 400 nA
Large Signal Voltage Gain VS = ±15V, VOUT = ±10V,
25 15 15 V/mV
RL > 2 kΩ
Output Voltage Swing VS = ±15V, RL = 10 kΩ ±12 ±13 ±12 ±13 ±12 ±13 V
RL = 2 kΩ ±10 ±12 ±10 ±12 ±10 ±12 V
Input Voltage Range VS = ±15V ±12 ±12 ±12 V
Common-Mode Rejection RS ≤ 10 kΩ
70 90 70 90 70 90 dB
Ratio
Supply Voltage Rejection RS ≤ 10 kΩ, ±5V ≤ VS ≤ ±15V 77 96 77 96 77 96 dB

CROSS TALK TEST CIRCUIT

VS = ±15V

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Typical Performance Characteristics

Supply Current Input Bias Current

Figure 1. Figure 2.

Voltage Swing Positive Current Limit

Figure 3. Figure 4.

Negative Current Limit Output Impedance

Figure 5. Figure 6.

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Typical Performance Characteristics (continued)

Common-Mode Rejection Ratio Open Loop Frequency Response

Figure 7. Figure 8.

Bode Plot LM148 Large Signal Pulse Response (LM148)

Figure 9. Figure 10.

Small Signal Pulse Response (LM148) Undistorted Output Voltage Swing

Figure 11. Figure 12.

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Typical Performance Characteristics (continued)

Gain Bandwidth Slew Rate

Figure 13. Figure 14.

Inverting Large Signal Pulse Response (LM148) Input Noise Voltage and Noise Current

Figure 15. Figure 16.

Positive Common-Mode Input Voltage Limit Negative Common-Mode Input Voltage Limit

Figure 17. Figure 18.

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APPLICATION HINTS

The LM148 series are quad low power 741 op amps. In the proliferation of quad op amps, these are the first to
offer the convenience of familiar, easy to use operating characteristics of the 741 op amp. In those applications
where 741 op amps have been employed, the LM148 series op amps can be employed directly with no change
in circuit performance.
The package pin-outs are such that the inverting input of each amplifier is adjacent to its output. In addition, the
amplifier outputs are located in the corners of the package which simplifies PC board layout and minimizes
package related capacitive coupling between amplifiers.
The input characteristics of these amplifiers allow differential input voltages which can exceed the supply
voltages. In addition, if either of the input voltages is within the operating common-mode range, the phase of the
output remains correct. If the negative limit of the operating common-mode range is exceeded at both inputs, the
output voltage will be positive. For input voltages which greatly exceed the maximum supply voltages, either
differentially or common-mode, resistors should be placed in series with the inputs to limit the current.
Like the LM741, these amplifiers can easily drive a 100 pF capacitive load throughout the entire dynamic output
voltage and current range. However, if very large capacitive loads must be driven by a non-inverting unity gain
amplifier, a resistor should be placed between the output (and feedback connection) and the capacitance to
reduce the phase shift resulting from the capacitive loading.
The output current of each amplifier in the package is limited. Short circuits from an output to either ground or the
power supplies will not destroy the unit. However, if multiple output shorts occur simultaneously, the time
duration should be short to prevent the unit from being destroyed as a result of excessive power dissipation in
the IC chip.
As with most amplifiers, care should be taken lead dress, component placement and supply decoupling in order
to ensure stability. For example, resistors from the output to an input should be placed with the body close to the
input to minimize “pickup” and maximize the frequency of the feedback pole which capacitance from the input to
ground creates.
A feedback pole is created when the feedback around any amplifier is resistive. The parallel resistance and
capacitance from the input of the device (usually the inverting input) to AC ground set the frequency of the pole.
In many instances the frequency of this pole is much greater than the expected 3 dB frequency of the closed
loop gain and consequently there is negligible effect on stability margin. However, if the feedback pole is less
than approximately six times the expected 3 dB frequency a lead capacitor should be placed from the output to
the input of the op amp. The value of the added capacitor should be such that the RC time constant of this
capacitor and the resistance it parallels is greater than or equal to the original feedback pole time constant.

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Typical Applications—LM148

Figure 19. One Decade Low Distortion Sinewave Generator

fMAX = 5 kHz, THD ≤ 0.03%

R1 = 100k pot. C1 = 0.0047 μF, C2 = 0.01 μF, C3 = 0.1 μF, R2 = R6 = R7 = 1M,
R3 = 5.1k, R4 = 12Ω, R5 = 240Ω, Q = NS5102, D1 = 1N914, D2 = 3.6V avalanche
diode (ex. LM103), VS = ±15V
A simpler version with some distortion degradation at high frequencies can be made by using A1 as a simple inverting
amplifier, and by putting back to back zeners in the feedback loop of A3.

Figure 20. Low Cost Instrumentation Amplifier

VS = ±15V
R = R2, trim R2 to boost CMRR

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Figure 21. Low Drift Peak Detector with Bias Current Compensation

Adjust R for minimum drift

D3 low leakage diode
D1 added to improve speed
VS = ±15V

Figure 22. Universal State-Variable Filter

Tune Q through R0,

For predictable results: fO Q ≤ 4 × 104
Use Band Pass output to tune for Q

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Figure 23. A 1 kHz 4 Pole Butterworth

Use general equations, and tune each section separately

Q1stSECTION = 0.541, Q2ndSECTION = 1.306
The response should have 0 dB peaking

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Figure 24. A 3 Amplifier Bi-Quad Notch Filter

Ex: fNOTCH = 3 kHz, Q = 5, R1 = 270k, R2 = R3 = 20k, R4 = 27k, R5 = 20k, R6 = R8 = 10k, R7 = 100k, C1 = C2 =

0.001 μF
Better noise performance than the state-space approach.

Figure 25. A 4th Order 1 kHz Elliptic Filter (4 Poles, 4 Zeros)

R1C1 = R2C2 = t
R′1C′1 = R′2C′2 = t′
fC = 1 kHz, fS = 2 kHz, fp = 0.543, fZ = 2.14, Q = 0.841, f′ P = 0.987, f′ Z = 4.92, Q′ = 4.403, normalized to ripple BW

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Use the BP outputs to tune Q, Q′, tune the 2 sections separately

R1 = R2 = 92.6k, R3 = R4 = R5 = 100k, R6 = 10k, R0 = 107.8k, RL = 100k, RH = 155.1k,
R′1 = R′2 = 50.9k, R′4 = R′5 = 100k, R′6 = 10k, R′0 = 5.78k, R′L = 100k, R′H = 248.12k, R′f = 100k. All capacitors
are 0.001 μF.

Figure 26. Lowpass Response

Typical Simulation

Figure 27. LM148, LM741 Macromodel for Computer Simulation

For more details, see IEEE Journal of Solid-State Circuits, Vol. SC-9, No. 6, December 1974
o1 = 112IS = 8 × 10−16
o2 = 144*C2 = 6 pF for LM149

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Connection Diagram

Figure 28. Top View

See Package Number J0014A, D0014A or NFF00014A

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REVISION HISTORY

Changes from Revision D (March 2013) to Revision E Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 13

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 PACKAGE OPTION ADDENDUM

www.ti.com 19-Mar-2015

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LM148J/PB ACTIVE CDIP J 14 25 TBD Call TI Call TI LM148J

LM348M NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM348M

LM348M/NOPB ACTIVE SOIC D 14 55 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 LM348M
& no Sb/Br)
LM348MX NRND SOIC D 14 2500 TBD Call TI Call TI 0 to 70 LM348M
LM348MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 LM348M
& no Sb/Br)
LM348N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS CU SN Level-1-NA-UNLIM 0 to 70 LM348N
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 19-Mar-2015

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM348MX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LM348MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM348MX SOIC D 14 2500 367.0 367.0 35.0
LM348MX/NOPB SOIC D 14 2500 367.0 367.0 35.0

Pack Materials-Page 2
 MECHANICAL DATA
N0014A
NFF0014A

N14A (Rev G)

www.ti.com
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