N - Channel 50V - 0.06 - 23A To-220 Stripfet Mosfet

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 BUZ10

N - CHANNEL 50V - 0.06Ω - 23A TO-220


STripFET MOSFET

T YPE V DSS R DS(o n) ID


BUZ 10 50 V < 0.07 Ω 23 A
■ TYPICAL RDS(on) = 0.06 Ω
■ AVALANCHE RUGGED TECHNOLOGY
■ 100% AVALANCHE TESTED
■ HIGH CURRENT CAPABILITY
■ 175oC OPERATING TEMPERATURE
3
2
1

APPLICATIONS TO-220
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SOLENOID AND RELAY DRIVERS

■ REGULATORS

■ DC-DC & DC-AC CONVERTERS

■ MOTOR CONTROL, AUDIO AMPLIFIERS

■ AUTOMOTIVE ENVIRONMENT (INJECTION, INTERNAL SCHEMATIC DIAGRAM


ABS, AIR-BAG, LAMPDRIVERS, Etc.)

ABSOLUTE MAXIMUM RATINGS


Symbol Parameter Value Un it
V DS Drain-source Voltage (VGS = 0) 50 V
V DGR Drain- gate Voltage (R GS = 20 kΩ) 50 V
V GS G ate-source Voltage ± 20 V
o
ID Drain Current (continuous) at Tc = 25 C 23 A
IDM Drain Current (pulsed) 92 A
o
P tot T otal Dissipation at Tc = 25 C 75 W
o
Ts tg Storage Temperature -65 to 175 C
o
Tj Max. Operating Junction Temperature 175 C
DIN HUMIDITY CAT EGORY (DIN 40040) E
IEC CLIMAT IC CAT EG ORY (DIN IEC 68-1) 55/150/56
First digit of the datecode being Z or K identifies silicon characterized in this datasheet.

February 2000 1/8


BUZ10

THERMAL DATA
o
R thj -case Thermal Resistance Junction-case Max 2.0 C/W
o
R thj -amb Thermal Resistance Junction-ambient Max 62.5 C/W

AVALANCHE CHARACTERISTICS
Symbo l Parameter Valu e Unit
IAR Avalanche Current, Repetitive or Not-Repetitive 10 A
(pulse width limited by Tj max, δ < 1%)
E AS Single Pulse Avalanche Energy 150 mJ
(starting Tj = 25 o C, ID = IAR , V DD = 30 V)

ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)


OFF
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
V (BR)DSS Drain-source I D = 250 µA V GS = 0 50 V
Breakdown Voltage
I DSS Zero Gate Voltage V DS = Max Rating 1 µA
Drain Current (V GS = 0) V DS = Max Rating Tj = 125 oC 10 µA
IGSS Gate-body Leakage V GS = ± 20 V ± 100 nA
Current (VDS = 0)

ON (∗)
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
V GS(th) Gate Threshold Voltage V DS = V GS ID = 1 mA 2.1 3 4 V
R DS(on) Static Drain-source On V GS = 10V ID = 14 A 0.06 0.07 Ω
Resistance

DYNAMIC
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
g f s (∗) Forward V DS = 25 V I D = 14 A 6 11 S
Transconductance
C iss Input Capacitance V DS = 25 V f = 1 MHz V GS = 0 900 pF
C os s Output Capacitance 130 pF
C rss Reverse Transfer 40 pF
Capacitance

SWITCHING
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
t d(on) Turn-on Time V DD = 30 V ID = 10 A 20 ns
tr Rise Time R GS = 4.7 Ω V GS = 10 V 45 ns
t d(of f) Turn-off Delay T ime 48 ns
tf Fall T ime 10 ns

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BUZ10

ELECTRICAL CHARACTERISTICS (continued)


SOURCE DRAIN DIODE
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
ISD Source-drain Current 23 A
I SDM Source-drain Current 92 A
(pulsed)
V SD (∗) Forward On Voltage I SD = 46 A V GS = 0 1.9 V
t rr Reverse Recovery I SD = 23 A di/dt = 100 A/µs 50 ns
Time V DD = 30 V T j = 150 o C
Q rr Reverse Recovery 0.17 µC
Charge
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %

Safe Operating Area Thermal Impedance

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BUZ10

Output Characteristics Transfer Characteristics

Transconductance Static Drain-source On Resistance

Gate Charge vs Gate-source Voltage Capacitance Variations

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Normalized Gate Threshold Voltage vs Normalized On Resistance vs Temperature


Temperature

Source-drain Diode Forward Characteristics

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Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform

Fig. 3: Switching Times Test Circuits For Fig. 4: Gate Charge test Circuit
Resistive Load

Fig. 5: Test Circuit For Inductive Load Switching


And Diode Recovery Times

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BUZ10

TO-220 MECHANICAL DATA

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.067
F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409
L2 16.4 0.645
L4 13.0 14.0 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.2 6.6 0.244 0.260
L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
E
A

D
C

D1

L2
F1

G1

H2
G

Dia.
F
F2

L5
L9
L7

L6 L4
P011C

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BUZ10

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 1999 STMicroelectronics – Printed in Italy – All Rights Reserved


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