US007 1836.

61 B2

(12) United States Patent (10) Patent No.: US 7,183,661 B2

Bogner et al. (45) Date of Patent: Feb. 27, 2007
(54) EPOXY-RESIN SYSTEMS, WHICH ARE 5,026,751 A * 6/1991 Bopp ......................... 524/102
RESISTANT TO AGING, MOULDING 5,112,890 A * 5/1992 Behrens et al. ............... 524.95
MATERIALS, COMPONENTS PRODUCED 5,505,895 A * 4/1996 Bull et al. .................. 264,327
THEREFROMAND THE USE THEREOF 5,616,633 A * 4/1997 Wombwell et al. ......... 523,400
6,066,861 A 5, 2000 Hohn et al.
(75) Inventors: Georg Bogner, Lappersdorf (DE); 6,507,049 B1* 1/2003 Yeager et al................ 257/100
Herbert Brunner, Regensburg (DE);
Klaus Hoehn, Taufkirchen (DE) FOREIGN PATENT DOCUMENTS
(73) Assignee: Osram Opto Semiconductors GmbH, DE 3241767 5, 1984
Regensburg (DE) DE 38 76 173 T2 4, 1993
DE 3886 058 T2 5, 1994
(*) Notice: Subject to any disclaimer, the term of this DE 196284.09 11, 1999
patent is extended or adjusted under 35 EP O400898 12/1990
U.S.C. 154(b) by 0 days. EP O507333 10, 1992
JP O2-170820 * 7/1990
(21) Appl. No.: 10/296,848
OTHER PUBLICATIONS
(22) PCT Filed: May 16, 2001 JPO abstract of JPO2-170820.
(86). PCT No.: PCT/DEO1AO1848 Derwent abstract of JP 02/170820.
Product data sheet for Ciba Tinuvin 144.
S 371 (c)(1), Product data sheet for Ciba Tinuvin 326.
(2), (4) Date: Nov. 27, 2002 Schriver-Rzymelka, P. “Light Stabilizers”, 1999, Munich, Ger
s 9 many, Carl Hanser Verlag, KU Kunstoffe, pp. 87-90. (Translation).
(87) PCT Pub. No.: WO01/92396 * cited by examiner
PCT Pub. Date: Dec. 6, 2001 Primary Examiner Michael J. Feely
(74) Attorney, Agent, or Firm Fish & Richardson PC.
(65) Prior Publication Data
US 2003/0144414 A1 Jul. 31, 2003 (57) ABSTRACT
(30) Foreign Application Priority Data Epoxy-resin Systems resistant to aging, molded materials
May 31, 2000 (DE) 1OO 27 206 and components generated from them, and their utilization.
(51) Int. Cl An epoxy-resin system especially Suitable in the application
iotL 23/29 (2006.01) of casting-resin methods comprising an epoxide-containing
B32B 27/38 (2006.015 A component based on a glycidyl ether or glycidyl ester and
a B component containing anhydride as a hardener is
(52) U.S. Cl. ...................... 257/793; 257/788: E. proposed, where a sterically hindered amine is added to the
A component as a stabilizer to prevent aging of molded
(58) Field of Station Stars, 106.12. s.S. materials. Light-emitting components potted with it exhibit
42 8/4 13 s41 41 8. 2 57/7 87 788, 793. increased aging stability, especially as with respect to light
See application file for com lete search histo s yield over time. The epoxy-resin System can also be used for
pp p ry. encapsulants and molding compositions, and can be blended
(56) References Cited with acrylates, for all applications, particularly in the exte
1O.
U.S. PATENT DOCUMENTS
4,033,928 A 7, 1977 Randell et al. 25 Claims, 1 Drawing Sheet
U.S. Patent Feb. 27, 2007 US 7,183,661 B2

SN NN
N N
NN QN
N
 US 7,183,661 B2
1. 2
EPOXY-RESIN SYSTEMS, WHICH ARE as well as cracks, tears and reduced compound strength with
RESISTANT TO AGING, MOULDING the light-emitting component, including delamination. But
MATERIALS, COMPONENTS PRODUCED molded materials from casting resins containing damage of
THEREFROMAND THE USE THEREOF this type result in a reduced light yield resulting in reduced
optical-radiation characteristics, rendering them unsuitable
BACKGROUND for components in use constantly or according to customer
specifications.
Epoxy-resin Systems resistant to aging, molded materials
and components generated from them, and their utilization. SUMMARY
To protect them from environmental influences, electrical 10
and electronic components are potted or encapsulated with The objective of the present invention is therefore to
reaction resins through the application of casting-resin meth indicate reaction-resin Systems for the encapsulation of
ods. The intention is to provide protection against mechani components and particularly of optoelectric components
cal, chemical and climatic environmental influences, par exhibiting increased resistance to aging under radiation
ticularly protection against impact, against breakage, against 15 stress, preferably without negatively affecting the remaining
aggressive chemicals and against moisture, where Such characteristics of the reaction-resin Systems, and of the
protection must be upheld at high environmental tempera molded materials generated from them.
tures, which can reach approximately 130 degrees Celsius in This objective is achieved according to the invention by
the engine area of an automobile. Optoelectronic compo means of an epoxy resin having the characteristic contained
nents, especially light-emitting components such as light in Claim 1. Preferable constructions of the invention, as well
emitting diodes (LEDs), are exposed to particular stress, as of the components generated from it, are contained in
because the resin System used for encapsulation is subjected Succeeding claims.
to additional radiation stress coming from the LED itself. In The epoxy-resin System according to the invention is
addition to having chemical and mechanical resistance, as Suitable for casting-resin applications, pottant and encapsu
well as a high degree of compound strength with a variety 25 lant compositions and for lacquers. It exhibits significantly
of substrates, such reaction-resin molded material must have improved resistance against the aging of molded materials
a high degree of transparency, with an index of refraction nD when subjected to additional radiation stress. Since the
greater than 1.5, if possible, and it must also exhibit resis formation of clouding, tears and cracks are especially pre
tance to light in terms of clouding, embrittlement and vented, this also results in increased resistance to weather
yellowing. The problem of increased radiation stress in 30 conditions, because the named aging occurrences attribut
light-emitting semiconductor components is amplified espe able to light lead to an increasing lack of resistance to
cially at decreasing wavelengths, increasing radiation doses moisture in materials, especially components, which are
of the component and the amplification of the radiation potted, encapsulated or sealed with it.
intensity in so-called high-power LEDs emitting at longer
wavelengths, and for blue-emitting semiconductor compo 35 DETAILED DESCRIPTION
nents, for example, this results in the continuing lack of
Success in finding a satisfactory resin system resistant to The epoxy resin system can incorporate an A component
aging that can be used for their encapsulation. with epoxy resin and a B component with a hardener, usually
Commercially available LEDs are currently potted with a carboxylic anhydride. Aside from these basic components,
two-component thermally cross-linking reaction resins 40 the epoxy-resin System may contain further components
based on epoxides, with anhydrides as hardeners. These known for it that are Suitable to a particular application.
substances are Theologically optimized and exhibit ther Surprisingly, it has been shown that a sterically hindered
moreactive properties that allow for rational mass produc amine added as a stabilizer exhibits good compatibility with
tion. There the epoxy-resin component (A component) of the A component, and does not affect the shelf life of the A
these two-component reaction-resin systems consists of a 45 component. Storage-stable A components are obtained,
low to medium-viscosity bisphenol A diglycidyl ether and a which in turn produces reaction-resin systems that can be
reactive epoxy diluent or polyfunctional epoxy novolak stored unaltered with respect to processing mixture, meter
resins, as well as the additives and auxiliary Substances ing/application, hardening—and to their characteristics, for
common in casting resins. When used in LEDs, the A periods up to several months, and these lead to molded
component may also be colored with organic pigments. 50 materials that, while maintaining otherwise unchanged char
Diffusely light-emitting components can exhibit special dif acteristics, exhibit significant resistance to aging from tem
fusor pastes based on inorganic pigments. With the aid of perature, moisture and radiation stress. The molded materi
specific metal-salt accelerators containing organic carboxy als obtained can be manufactured to a water-clear degree of
late and alcoholate anions or ligands, two-component reac transparency, and they exhibit an extremely low tendency
tion-resin Systems on anhydride/epoxide basis can be hard 55 for yellowing, clouding or embrittlement. This is attributable
ened. For the encapsulation of optoelectronic components, to the positive, light-stabilizing effect of the sterically hin
there are also two-component anhydride? epoxy casting-resin dered amines, which were already known as light stabilizers
compositions based on cycloaliphatic epoxy resins and their for use in thermoplastic polyolefin plastic materials under
blends with glycidyl-ether and glycidyl-ester resins. In spe the name HALS (Hindered Amine Light Stabilizers).
cial cases, acrylic-based encapsulants are also used. 60 Amines and their derivatives are known as hardeners and
However, it can be seen that the known casting compo hardening accelerators for reaction resin Systems, and they
sitions are not constructed to be sufficiently age-resistant to generally deliver molded materials that are colored and
conform to the requirements for encapsulation of high highly susceptible to yellowing. It is therefore Surprising
power LEDs, in particular, which are becoming ever more that despite this known reaction of amines, storage-stable
demanding. Even within the useful lives of the components, 65 reaction-resin systems are still obtained with sterically hin
they already begin to exhibit clouding and yellowing, and dered amines. It is assumed that steric shielding of the free
can also exhibit brittleness, resulting in increasing porosity, electron pair in the nitrogen atom of the amine and the
 US 7,183,661 B2
3 4
reduced basicity of the compounds has the effect of pre In the invention it is preferable to use a sterically hindered
venting the characteristics of reaction resins for use in phenol derivative in the A component as another stabilizer.
large-scale manufacturing processes, and thus the charac This will stabilize the casting-resin molded material against
teristics of reaction resins, from being negatively influenced. thermo-oxidative attacks.
The sterically hindered amine is a secondary or tertiary Contained in the A component as an epoxide is preferably
amine or amine oxide, which is shielded for chemical a diglycidyl ether, a diglycidyl ester or a cycloaliphatic
reactions by sterically Voluminous groups in particular. epoxide, or a mixture of these, as the principal component.
Sterically demanding groups can be substituents containing Preferably, diglycidyl ether of bisphenol A and, as a
tertiary carbon atoms with Sterically demanding aliphatic, secondary component, a polyfunctional epoxy novolak
cycloaliphatic and aromatic Substituents at the alpha position 10 resin, together making up more than 80 percent weight for
of the nitrogen. Sterically demanding amines are also het weight, are included.
erocyclic amines, which are preferably also sterically There may additionally be included common additives for
shielded at the alpha position. The third substituent at the casting resins, which are selected from among reactive
nitrogen can be an alkyl, an aryl, an alkylaryl or a cycloalkyl diluents, particularly those based on monoglycidyl ethers,
group. Also preferred are corresponding groups bound to the 15 alcohols, bonding agents, flow promoters, deaerators, opti
nitrogen via an oxygen atom, or groups that have oxygen cal brighteners, light absorbers, release agents or thixotropic
atoms in their chains, such as ether groups or ester groups. agents. Altogether, for casting-resin Systems according to
Especially preferred are amines with reduced or adjusted the invention, this leads to the following compositions for
basicity, where one Substituent on the nitrogen is a group the A component, which are indicated in the following table
bound via an oxygen atom. Especially preferred are, for with their respective limit values:
example, amine oxide alkyl compounds of the general Epoxy resins based on glycidyl ethers or glycidyl esters,
structure (R1)(R2)N O—R3, where R1 and R2, indepen and cycloaliphatic epoxy resins >50%
dently from each other, denote alkyl, aryl or alkylaryl Epoxy novolak <40%
groups, or where R1 and R2 combined is a divalent sub Reactive diluents (monoglycidyl ethers)<10%
stituent that forms a ring, or a heterocyclic ring, in combi 25 Alcohols <10%
nation with the nitrogen atom. R3 can again denote the third Sterically-hindered amine <5.0%
substituent described above. Oxidation Stabilizer <5.0%
These amine oxide alkyl compounds exhibit particularly Bonding agent <5.0%
low basicity; this reduction is brought about by the steric Light absorber <0.5%
shielding of the free electron pair on the one hand, and also 30 Silicone-based flow promoters <1.0%
by the inductive effect of the oxygen. These amines exhibit Silicone-based deaerators <1.0%
particularly good compatibility with epoxy. A components. Optical brighteners <1.0%
When the reaction-resin systems are hardened, they have no Internal release agents for the housing <1.0%
negative influence on the hardening reaction, and they yield Thixotropic agents <10%
casting-resin molded materials where the amine is actually 35 Diffusors (inorganic particles)<30%
not chemically bound, but still safely enclosed and protected Organic dyes/pigments <10%
from evaporation due to possible hydrogen bridging in the Inorganic luminescent Substances <40%
cross-linked structure and a relatively high molecular Using the glycidyl ethers as the principal component,
weight. The molded materials are water-clear/transparent casting-resin molding materials with high glass-transition
and exhibit a markedly improved resistance to aging in 40 temperatures of 110 and, in one exemplary embodiment, 130
moist environments at temperatures above 100° C. and degrees Celsius and more can be obtained that display the
under added radiation stress. high age resistance according to the invention. The digly
For the invention, it is sufficient that a proportionally cidyl ethers exhibit preferred reduced chlorine contents,
Small amount of the amine used as a stabilizer be mixed into which has further positive effects; in particular, it brings
the A component, where an amount of 0.1 to 5.0 percent 45 about a lower tendency for yellowing of the casting-resin
weight for weight, preferably 0.1 to 1.0 percent weight for molding material and makes the molding materials less
weight, is sufficient. As the hardener component, or B Susceptible to delamination. Epoxy resins according to the
component, an anhydride, which is preferably derived from invention exhibit chlorine contents of less than 250 ppm of
a cycloaliphatic or aromatic di- or tetracarboxylic acid, is hydrolyzable chlorine and less than 1000 ppm of total
used. It can contain the carboxylic acid anhydride as its 50 chlorine.
principal component and also acid esters that are obtained When hardening the epoxy-resin System, stoichiometric
from the partial reaction of these anhydrides with aliphatic amounts of A and B components are preferably used, as this
alcohol. is best for its interaction with moisture and for the electrical
The B components can contain phosphorus-containing characteristic data in the component. With respect to the A
oxidation stabilizers. For optoelectronic applications, metal 55 component, 0.7 to 1.2 reaction equivalents of B component
salts are preferably used as accelerators. are used. In processes adapted to mass production, however,
The epoxy-resin system is very good for casting-resin the preferred epoxy-resin Systems used have a shortage of B
applications and, at processing temperature, exhibits suffi component comprising 0.7 to 0.9 reaction equivalents
ciently low viscosity, good usage characteristics with a present. This takes into account both the intramolecular
sufficiently long pot life, and it can be applied free of streaks 60 reaction of the epoxides and a certain amount of hydrolysis,
or bubbles. It comprises an epoxide-containing. A component so that altogether a stoichiometric reaction of reactive
and a B component containing anhydride as a hardener. The epoxide groups with the corresponding anhydride groups
A component contains more than 60 percent weight for can take place. The molded materials thus created exhibit
weight of a glycidyl-ether or glycidyl-ester-based epoxide as low moisture uptake as well as high thermal and thermo
well as the sterically hindered amine as a stabilizer to 65 mechanical stability. This makes the casting-resin molded
prevent aging of the molded materials from added radiation materials suitable also for SMD (Surface Mount Device)
StreSS. components, as these are exposed to high temperatures with
 US 7,183,661 B2
5 6
distinctive temperature profiles during a soldering process. In the following, the invention is described in more detail
The low moisture uptake and a glass-transition temperature by means of exemplary embodiments and the FIGURE
of over 130° C. makes the casting-resin molded materials pertaining thereto.
suitable for use in the automotive sector. The high degree of The FIGURE shows a schematic cross-section of a known
transparency and the resistance to aging in terms of optical 5 LED with a casting-resin encapsulation.
properties makes the casting-resin molded materials suitable Five different A components are indicated, where exem
especially for use in optoelectronics and especially for use in plary embodiments one and two represent preferable base
the encapsulation of optoelectronic components such as compositions, to which sterically hindered amines and steri
LEDs, for example. The high photochemical stability of the cally hindered phenols, respectively, are added in exemplary
casting-resin molded materials allows the use of the epoxy 10 embodiments three, four and five. For all five exemplary
resin Systems for the potting of high-power light-emitting embodiments, the same B component is used; it is a meth
semiconductor components, especially those emitting at ylhexahydrophthalic acid anhydride modified with an acid
wavelengths shorter than 500 nm. That makes them suitable ester. The acid ester is a formulation component of the
for potting blue-emitting LEDs, preferably in combination hardener, wherein up to 50% of the difunctional anhydride
with luminescence-converting Substances. These are 15 group are transformed into a half-ester with mono- or
admixed to the epoxy resin, so that the blue light coming polyvalent alcohols. Hexahydrophthalic acid is a preferable
from the semiconductor element can be turned into a white base anhydride to use for optoelectronic applications.
luminescent LED through luminescence conversion. With each of the epoxy-resin systems from exemplary
Another advantage that comes particularly from the use of embodiments one through five, molded padding is fabricated
low-chlorine, hydroxyl-free epoxy-based resins is entailed and cured, the molds are then tested for their thermome
in the lower moisture uptake, a markedly lowered E-modu chanical properties and for climatic resistance, particularly
lus and a lower thermal expansion coefficient at almost moisture uptake. In addition, the epoxy-resin Systems are
unchanged glass-transition temperature. If a light-emitting used to pot blue-emitting LEDs. The aging stability of the
component is encapsulated with the epoxy-resin System LEDs is tested in continuous operation by means of the
according to the invention, that reduces the thermomechani 25 luminous intensity emitted.
cal stress exerted on the component by the encapsulation. It is generally assumed of amines that they lead to the
The danger of mechanically-caused component degradation gellation of the epoxy resin component and for that reason
is thereby also decreased further, and the total package is end up not being used in as a formulation component in
further stabilized. In addition, the low chlorine content of the storage-stable epoxy A components. The reduced reactivity
epoxy-resin System used for potting works to counteract the 30 of amine stabilizers in the epoxy resin rests primarily on the
corrosion of corrodible structures on the component. The fact that the reactive amine function is shielded by means of
deciding factor here is primarily the low hydrolyzable sterically demanding side groups. Through the targeted
chlorine content. During a long-term climate test with com selection of electrophilic groups that are either bound
parable chlorine-containing resin Systems, it was shown that directly to the amine nitrogen or are located in B position to
under harsher temperature/moisture conditions and under 35 it, the basicity of the amine nitrogen is further reduced,
electric stress, chloride ions and chlorine-containing species thereby also reducing the reactivity. DSC (Dynamic Scan
can be released, which can lead to clouding at the interface ning Calorimetry) examinations on the reactive behavior of
between the chip of the semiconductorcomponent and the epoxy components stabilized with HALS, especially after
potting composition. This results in a reduction of the having stored the resins at 80° C., prove their stability in
luminous intensity of light-emitting components. In addi 40 storage. At 30°C., the shelf life is, Surprisingly, longer than
tion, hydrolysis activity Such as that with chlorine can 6 months.
reduce the strength of the bond to the chip to such an extent In accelerated-aging tests under short-wave radiation of
that delamination occurs at the potting composition-chip between 360 nm and 500 nm, and at energy-rich radia
interface, reducing yet further the luminous intensity. With tion>420 nm (UV-B filter), the efficacy of HALS stabilizers
respect to the moisture stability of epoxy-resin Systems 45
in epoxy-anhydride molded materials was demonstrated.
according to the invention, it was found that the casting FIG. 1 shows the schematic construction of an LED,
resin molded materials based on hydroxyl-free bisphenol A which here is constructed SMD-capable. This semiconduc
epoxy resins during moisture uptake exhibited a slight tor component 1, that is, the diode itself, is mounted on a
lowering of the glass-transition temperature by only a few leadframe 4 and electronically connected to it. The plastic
degrees Celsius, a lowering that is much smaller than in 50
housing 3.5 preferably made from thermoplastic material,
traditional potting compositions. together with the transparent casting resin 2, constitutes the
A further advantageous component of epoxy-resin Sys SMD package that protects the component from adverse
tems according to the invention are light-screening agents, environmental influences, thereby assuring its capacity to
especially in the A component. These absorb energy-rich function throughout its useful life. Above the casting-resin
electromagnetic radiation and release it after radiation-free 55
encapsulation 2, an optical lens may be affixed Subsequently
deactivation. Such light-screening compounds, of the ben if additional bundling of radiation is desired.
Zophenone type or on the basis of triazines, are already First Exemplary Embodiment
known for thermoplastic substances. The absorbers added in For the A component of the first exemplary embodiment,
accordance with the invention are selected so that no absorp the following components, indicated at weight-for-weight
tion of light takes place at wavelengths above 420 nm. 60
percentages, are mixed homogeneously.
To keep absorption by the light-screening agents of the
radiation to be used at a minimum, their concentration, or Bisphenol A diglycidyl ether (Ritapox VE3748-Bakelite)
portion of the A component, is kept as low as possible. A 98.98%
preferable concentration of light-screening agents in an Deaerator (BYKA-506, BYK Chemie) 0.2%
epoxy-resin System used in the transparent encapsulation of 65 Bonding agent (Silane A-187, ABCR GmbH) 0.80%
optoelectronic components is in a region of less than 0.2 Optical brightener (Master Batch 09, CIBASCISIN)
percent weight for weight. O.O16%
 US 7,183,661 B2
7 8
After reaction with the named B component, a molded Fifth Exemplary Embodiment
material exhibiting a glass-transition temperature of 125 to To the A component from Example 2 is added 0.2 percent,
126 degrees Celsius is obtained. After 6 weeks of storage in weight for weight, of Tinuvin 123 (CIBA Specialty), as well
cold water, the moisture uptake is 0.65 percent, weight for as 0.3% of a sterically hindered phenol derivative (Akcros
weight, where the associated decrease in the glass-transition Chemicals). The same behavior as in the fourth exemplary
temperature to only 124 degrees Celsius is remarkably low. embodiment was measured; in addition, the aging stability
The E-modulus (tensile, 3 K/minute, 1 Hz) is 2660 MPa. The and sensitivity to oxidation was lowered further.
thermal expansion coefficient CTE (-50/+50° C.) is 59.7 It is thus demonstrated that with the epoxy-resin systems
ppm/K. The cold-water intake after one week at 23° C. is according to the invention, casting-resin potting composi
O.31%. 10 tions become available that are perfectly suitable for potting
electrical and electronic components, especially components
These very good thermomechanical properties in them that are exposed to high thermal stress, increased moisture
selves, as well as the high degree of resistance to humidity, uptake and radiation stress. The molded materials made
are attributed to the low content of hydroxyl groups in the from them can be produced at high glass-transition tempera
specific bisphenol A diglycidyl ether product (Ritapox VE 15 tures and exhibit increased resistance to aging, particularly
9748). in light, compared to known molded materials. The high
Second Exemplary Embodiment glass-transition temperatures also make them especially
The A component of the second exemplary embodiment is useful for application in SMD processes, since components
modified from that of the first exemplary embodiment in encapsulated with them Survive soldering treatment
unharmed.
terms of its epoxy component. It has the following compo The transparent molded materials described are especially
sition (indicated in weight-for-weight percentages). Suitable for optoelectronic components. Because of the high
Tg, the epoxy resins can also be applied for potting com
ponents and sensors in the automotive sector. Because of the
Bisphenol A diglycidyl ether (Ritapox VE3748) 78.98% 25 good resistance to weather conditions with respect to tem
Epoxy novolak resin (D.E.N., DOW) 20.00% perature, moisture and radiation, the epoxy potting compo
Deaerator (BYKA-506, (Deaerator, BYK Chemie) O.20% sitions are also suitable for exterior application areas. Lac
Bonding agent (Silane A-187, ABCR GmbH) O.80%
Optical brightener (Master Batch 09, CIBASCISIN) O.O16% quers and molding compositions based on epoxy resins with
HALS stabilizers are also advantageous and, when com
30 pared to corresponding known compositions without the
The A component according to the second example is HALS stabilizers, they exhibit the indicated improved resis
transformed with the B component indicated above. The tance to radiation and weather conditions.
thermomechanical properties are determined from the cor What is claimed is:
responding molds. The casting-resin molded material exhib
its a glass-transition temperature of up to 141° C. depending 35 1. An apparatus comprising:
on the hardening conditions. After 6 weeks of storage in cold an optoelectronic component; and
water, the moisture uptake is 0.67 percent, where the glass an epoxy-resin System containing a first component
transition temperature deceases by just 4°C. to 137° C. The including a sterically hindered amine as a stabilizer to
E-modulus (tensile, 3 K/minute, 1 Hz) is 2570 MPa. A prevent aging of molded material due to radiation and
thermal expansion coefficient CTE (-50/+50° C.) of 57.4 40 a second component including an anhydride as a hard
ppm/K was determined. After one week of storage in cold ener and corresponding ester of the anhydride, wherein
water at 23°C., a cold-water intake of 0.36% is determined. the epoxy-resin System is arranged in an optical path of
Third Exemplary Embodiment the optoelectronic component and is transparent for the
For this example, 0.2 percent, weight for weight, of a radiation of the optoelectronic component.
sterically hindered N-oxyalkyl amine (Tinuvin 123, CIBA 45 2. The apparatus of claim 1, wherein:
Specialty) is added to the A component from the sterically hindered amine has a general formula of
RRN O—R, where R and R, independently from
EXAMPLE 1.
each other, denote alkyl, aryl or alkylaryl groups, or
where R and R combined is a divalent substituent that
50 forms a ring, or a heterocyclic ring, in combination
A storage-stable A component with almost unchanged with the nitrogen atom and where R denotes an alkyl
reactive behavior and almost unchanged glass-transition group, an aryl group, an alkylaryl group, a cycloalkyl
temperature is obtained in the resulting molded material. In group or an oxygen containing group, where the oxy
light-emitting diodes potted with this material, improved gen containing group is one of an aliphatic group, a
resistance to aging is observed after exposure to energy-rich 55 cycloaliphatic group, the alkylaryl group or the aryl
electromagnetic radiation; the reduction in luminous inten group.
sity attributable to aging is significantly better than in 3. The apparatus of claim 2, wherein the first component
Example 1. contains more than 60 percent weight for weight of a
Fourth Exemplary Embodiment glycidyl-ether or glycidyl-ester-based epoxide.
0.1 percent, weight for weight, of Tinuvin 123 (CIBA 60 4. The apparatus of claim 3, wherein the anhydride is an
Specialty) is added to the A component from Example 2. anhydride of hexahydrophthalic acid.
Here also, a storage-stable A component with almost 5. The apparatus of claim 2, wherein the R denotes an
unchanged reactive behavior and almost unchanged glass alkyl or alkoxy group of 1-18 C atoms, which can contain
transition temperature is obtained in the resulting molded one or two functional groups, with the exception of NH.
material. Improved resistance to aging in LEDs potted with 65 6. The apparatus of claim 2, wherein the sterically hin
it is observed after exposure to energy-rich electromagnetic dered amine is present in the first component at 0.1 to 5.0
radiation. percent weight for weight.
 US 7,183,661 B2
9 10
7. The apparatus of claim 2, wherein the second compo general formula of RRN O—R, where R and R
nent includes an anhydride of a cycloaliphatic or aromatic independently from each other, denote alkyl, aryl or
di- or tetracarboxylic acid as a main component. alkylaryl groups, or where R and R2 combined is a
8. The apparatus of claim 7, wherein the corresponding divalent Substituent that forms a ring or a heterocyclic
ester of the anhydride is an acid ester that is obtained when 5 ring, in combination with the nitrogen atom and where
an aliphatic alcohol is partially reacted with the anhydride. R. denotes an alkyl group, an aryl group, an alkylaryl
9. The apparatus of claim 2, wherein the second compo group, a cycloalkyl group or an oxygen containing
nent further comprises organophosphoric oxidation stabiliz group, where the oxygen containing group is one of an
ers and accelerators. aliphatic group, a cycloaliphatic group, the alkylaryl
10. The apparatus of claim 2, wherein the first component 10 group or the aryl group.
further comprises a sterically hindered phenol derivative as 24. An apparatus comprising:
a second stabilizer. a white-luminescent light-emitting diode; and
11. The apparatus of claim 2, wherein the first component an epoxy-resin System containing a first component
further comprises a diglycidyl ether, a diglycidyl ester, a including a sterically hindered amine as a stabilizer, the
cycloaliphatic epoxide, or a mixture of these as a primary 15 sterically hindered amine having the general formula of
component. RRN O R, where R and R, independently from
12. The apparatus of claim 2, wherein the first component each other, denote alkyl, aryl or alkylaryl groups, or
further comprises a diglycidyl ether of bisphenol A as a where R and R combined is a divalent substituent that
primary component and a polyfunctional epoxy novolak forms a ring or a heterocyclic ring, in combination with
resin as a secondary component, together making up more the nitrogenatom and where R denotes an alkyl group,
than 80 percent weight for weight. an aryl group, an alkylaryl group, a cycloalkyl group or
13. The apparatus of claim 2, wherein: an oxygen containing group, where the oxygen con
the epoxy-resin system has a glass transition temperature taining group is one of an aliphatic group, a
of at least 130° C. cycloaliphatic group, the alkylaryl group or the aryl
14. The apparatus of claim 2, wherein the first component 25 group and a second component including an anhydride
has a low hydrolyzable-chlorine content. as a hardener,
15. The apparatus of claim 2, wherein the first component wherein the epoxy-resin system is arranged in an optical
further comprises a light-screening agent. path of the white-luminescent light-emitting diode and
16. The apparatus of claim 15, wherein the light-screening is transparent to the radiation of the white-luminescent
agent is a benzophenone or a triazine. 30 light-emitting diode; and
17. The apparatus of claim 15, wherein the light-screening the epoxy-resin System is a transparent epoxy-resin cast
agent is selected so that no absorption of light takes place ing system.
above 420 nm. 25. An apparatus comprising:
18. The apparatus of claim 15, wherein the light-screening a Surface mountable device: and
agent is less than 0.2 percent weight for weight. 35 a transparent epoxy resin System containing a first com
19. The apparatus of claim 1, wherein the optoelectronic ponent including a sterically hindered amine as a
component is a light-emitting diode. stabilizer and a second component including an anhy
20. The apparatus of claim 19, wherein the optoclectronic dride as a hardener, wherein the epoxy resin System
component has an emission wavelength in the blue spectral covers at least part of the surface mountable device so
region below 500 nm. 40 that the surface mountable device is visible through the
21. The apparatus of claim 19, wherein the light-emitting transparent epoxy and the sterically hindered amine has
diode is a white-luminescent light emitting diode. the general formula of RRN O—R, where R and
22. The apparatus of claim 1, wherein the epoxy-resin R, independently from each other, denote alkyl, aryl or
system, further comprises a light-screening agent, which is alkylaryl groups, or where R and R2 combined is a
selected so that no absorption of light takes place above 420 45 divalent Substituent that forms a ring or a heterocyclic
. ring, in combination with the nitrogen atom and where
23. An apparatus comprising: R. denotes an alkyl group, an aryl group, an alkylaryl
an epoxy-resin System containing a first component group, a cycloalkyl group or an oxygen containing
including a sterically hindered amine as a stabilizer and group, where the oxygen containing group is one of an
a second component including an anhydride as a hard 50 aliphatic group, a cycloaliphatic group, the alkylaryl
ener and a corresponding ester of the anhydride; and group or the aryl group.
a Surface mount device potted with the epoxy resin
system, wherein the sterically hindered amine has the k k k k k