Reference Design: PR883: A 300-W, Universal Input, Isolated PFC Power Supply For LCD TV Applications

Download as pdf or txt
Download as pdf or txt
You are on page 1of 23

Reference Design

SLUU341 –December 2008

PR883: A 300-W, Universal Input, Isolated PFC Power Supply for LCD TV
Applications
Power Management – Power Supply Controllers

1 INTRODUCTION
This guide documents a low-profile power supply that is suitable for powering LCD TVs or other flat screen
applications. The power supply accepts a universal AC line-input voltage (85 VRMS to 265 VRMS), and produces
an output voltage of 24-VDC for loads up to 12 A (288 W).
The requirements for a flat-panel display include a physical profile and the ability to operate from the ac-line input
at close to unity power factor. Therefore a flat-panel display application demands that an internal power supply be
thin so as to fit behind the screen inside the TV case, and comply with the power quality requirements defined in
the IEC standard, 61000-3-2. In addition, the combination of a tight physical package and the desire to meet
Energy Star® guidelines requires that the design also demonstrates very high efficiency. Described herein is a
practical design that uses standard components. It achieves the requirements using a traditional two-stage power
converter topology along with state-of-the-art power circuit control methods. The first stage is an interleaved,
transition-mode, power factor correcting (PFC) boost pre-regulator. This is followed by an isolated LLC series-
resonant DC-DC main converter.
The design takes advantage of three integrated circuit (IC) power controllers. The PFC pre-regulator stage is
controlled by the UCC28061, a dual-phase, interleaved, transition-mode PFC controller. The resonant LLC
converter uses the UCC25600; a low-cost 8-pin controller. The third IC is the UCC2813D-4. This is used to
control a small 5-W flyback converter that provides a bias supply voltage. The bias supply is optional. It is
provided for convenience so that the circuit can be demonstrated without the need for a bench supply.

2 SCOPE
A reference design is primarily intended to demonstrate the design of a functional circuit, the operation of which
has been verified through a limited number of performance tests. This circuit incorporates essential safety
features. These include an input line fuse, inrush current control, output over-current limit, and output over-voltage
protection. An area not addressed by this design is electromagnetic compatibility (EMC). For most applications,
EMI filter components would need to be added so that the design meets applicable environmental and system
compatibility requirements. To comply with EMC standards, components such as input and output filters would be
required to suppress electromagnetic interference (EMI). In addition components that suppress and/or protect the
unit from high-voltage line surges and lightening would be required to meet power quality and safety standards.

1
Reference Design
SLUU341 –December 2008

3 ELECTRICAL PERFORMANCE
Table 1 Performance Specifications

Symbol Parameter Notes & Conditions Min Nom Max Units


INPUT CHARACTERSTICS
VI Input Voltage 85 265 VRMS
f Line Frequency 48 65 Hz
II Input Current 4 ARMS
p.f. Power Factor 0.95
OUTPUT CHARACTERSTICS
PFC Stage:
Vo (HVDC) Output Voltage 390 VDC
LLC Resonant Stage:
Vi (HVDC) Input Voltage 330 410 VDC
VO Output Voltage 22.8 24 25.2 V
IO Output Current 11 12 A
PO Output Power 288 W
ILIM Current Limit ΔVO = -4 V 20 A
ΔVLOAD Load Regulation %VO
SYSTEM CHARACTERSTICS
η Full Load Efficiency 110 VAC, 80% load 87 %
tHOLD Hold-up Time Nominal VI, 80% load 40 ms
OVTHLD Over-Voltage Threshold OV shutdown and restart 30 V
Overall thickness 20 mm
Temp. Range Nat’l Conv. airflow 0 50 °C
Fuse Rating Fast acting 5 A

Notes:
1. Operates down to zero load with reduced regulation.

2
Reference Design
SLUU341 –December 2008

4 DESCRIPTION
Fig. 1 shows the circuit divided into three blocks. Each block represents one of the three converters that make up
the complete power system. They include the boost PFC pre-regulator, the LLC series-resonant DC-DC converter,
and the 5-W bias supply. The PFC boost pre-regulator operates off a universal ac-line input voltage and produces
a regulated 390 VDC output. The output from this stage is fed to both the main LLC resonant and bias supply
converters. The bias supply provides a regulated 15 VDC to power the control circuitry, and the LLC resonant
converter produces an isolated output that is regulated at 24 VDC. For each of the three circuits, the theory of
operation is described.

Fig. 1 LCD TV Power System Block Diagram

4.1 Boost PFC Pre-Regulator


The principle function of the boost PFC pre-regulator is to convert a wide-input voltage (universal) ac-line input
source to a regulated DC voltage, while operating at near unity power factor. It achieves this by controlling the
power MOSFET of a boost converter at a relatively constant ‘on’ time over each half period of the rectified ac
input. Applying a constant ‘on’ time to each switch period causes the current in the boost inductor to rise
proportionally to the applied input voltage. As the current in the inductor is equal to the input current, then the
average switched current drawn from the input source is proportional to the source voltage. In this condition the
input of the circuit appears as a pure resistance and the circuit operates at unity power factor. To maintain boost
converter operation, the regulated output voltage is set at 390 VDC. This voltage must be higher than the peak of
the maximum input ac rms voltage, which is 375 V. The output capacitance to the boost PFC converter is
relatively large. This is because a large frequency component of the inductor ripple current is at just twice the
minimum line frequency (94 Hz).
The circuit presented in this design is similar to that described in the UCC28060 evaluation module
(UCC28060EVM). It includes a number of operating refinements to the basic boost PFC converter concept. The
design uses two boost inductors and MOSFET switches. These are connected in parallel to form two phases that
feed the common output capacitance. During normal operation the MOSFETS are operated 180° out of phase to
each other, such that they are electrically interleaved. As a further enhancement the boost inductors are operated

3
Reference Design
SLUU341 –December 2008

in “transition mode.” With this technique the current in each inductor is required to completely decay to zero
during the ‘off’ period of the transistor switch before the next ‘on’ period is initiated. Zero inductor current is
detected by the control circuit using an auxiliary winding on each inductor. The voltage across the auxiliary
winding collapses to zero when the inductor energy is exhausted. The combination of interleaved phases and
transition-mode control results in improved efficiency and smaller component sizes when compared to a
traditional single-phase solution. These and other control enhancements, such as phase management and input
current shaping, are built in to the UCC28061 PFC control IC.
The PWMCNTL pin (pin 9) of the UCC28061 provides an automatic on/off enable for a downstream converter.
This is used to prevent the LLC series-resonant converter from starting up before the output voltage from the PFC
pre-regulator has reached a minimum value. The output voltage is sensed through a resistor divider connected at
the VSENS pin (pin 2). The on/off threshold and hysteresis are controlled by the gain and output impedance of
the divider. The values selected for this design provide a nominal ‘on’ threshold of 330 VDC, and an ‘off’ threshold
of 300 VDC for the resonant converter.

4.2 LLC Series-Resonant DC-DC Converter


The LLC series-resonant DC-DC converter is powered from the regulated output of the boost PFC pre-regulator.
The circuit comprises of a ½-bridge power stage, which is connected to the series elements of an LLC resonant
circuit. The resonant circuit is formed by the series combination of a low-value resonant inductance, the
magnetizing inductance of the main transformer, and combined capacitance on the passive side of the bridge.
The resonant frequency is set by resonant inductance (17.5 µH ‡ ) and circuit capacitance (0.045 µF). These
values set the resonant frequency of this circuit to between 175 kHz and 180 kHz.
When operated at the resonant frequency, the voltages across the resonant components of the circuit cancel,
allowing the full peak-peak voltage from the power stage to be applied across the transformer primary. This is the
unity gain operating condition. By then varying the stimulus frequency either below or above resonance, the gain
of the circuit, and hence the output voltage, can be increased or decreased respectively. The switch frequency of
the power stage is the control parameter that regulates the output of a resonant converter.
In this design the main transformer and resonant inductor are represented by separate components. Commercial
designs often integrate the resonant inductor into the transformer as the leakage component. This is fairly easy to
achieve when a traditional ferrite ‘E’ core is used for the main transformer. In order to meet the low-profile
requirement of this design, planar magnetic components were selected. Integrating the resonant inductance into
the main transformer is more difficult to achieve with a planar transformer. In particular, power dissipation is
significantly increased. However the availability of new ferrite geometries may make it possible to achieve a low-
profile design using a traditional E-core shape.
The magnetizing inductance of the main transformer affects the gain variation of the circuit versus the switching
frequency. It also plays an important role in limiting the switching losses of the MOSFET drivers. Energy stored in
the magnetizing inductance causes current to circulate during the short period when both MOSFET switches are
‘off’. The phase of this current has the effect of reducing the voltage across the next MOSFET to be turned on.
This is referred to as zero-voltage switching (ZVS). It improves efficiency by significantly reducing the switching
losses of the converter. It also reduces the magnitude of electrical noise generated by the circuit compared to a
more rapid collapse of the MOSFET drain voltage with normal switching.
The ½-bridge power stage operates at 50% duty and varying frequency. The upper and lower MOSFETs of the
bridge are controlled by the UCC25600 IC via an isolated gate drive. The converter output voltage is regulated by
a TL431A shunt regulator located in the secondary. The error signal generated from the TL431A is passed back
to the converter primary using an opto’ coupler. A decrease in the error voltage at the output of the opto’ coupler
increases the current pulled from RC pin (pin 2) of the UCC25600. This increases the switching frequency of the
converter, which reduces its gain and output voltage.
The UCC25600 is a very simple and low-cost part to use. In addition to providing a variable drive frequency for
½-bridge power stage, it includes a soft-start feature, over-current shutdown protection, and adjustment of
MOSFET switch dead time.


Includes the primary referred leakage inductance of the main transformer

4
Reference Design
SLUU341 –December 2008

The circuit senses load current through the resonant capacitance using a parallel 0.001-µF capacitor as an
impedance divider. Current through this capacitor is half-wave rectified and then passed through a low-value
sense resistor. The resulting signal is then filtered and fed to the OC pin (pin 3) of the UCC25600. Our testing
suggests that this method of sensing current results in less variation of the sensed current with switching
frequency.
The resonant current is susceptible to a high surge current during converter start-up. For this reason it is
recommended that the sensitivity of the current sense is reduced during converter start up. In the reference circuit
this is accomplished with a P-channel JFET and a divider resistor. The gate of the JFET is connected to the SS
pin (pin 4) of the UCC25600, which is initially low during converter start up. The JFET places the divider resistor in
circuit during the period that its gate voltage is low. When the soft start period is complete the JFET turns off to
return current sensitivity to normal.
Other protection features, such as over-voltage shutdown, are easily implemented by momentarily pulling the SS
pin (pin 4) of the UCC25600 to ground. Over-voltage protection has been added to the reference design using this
method. At the converter output a 27-V Zener diode is used to sense an output over voltage. The diode is
connected in series with an opto’ coupler. When the output voltage is sufficiently high to break down the Zener
diode, the output of the coupler pulls down the soft-start pin to the UCC25600.
A limitation of the LLC series-resonant converter is that they operate over a limited input voltage range. This is
because below a certain operating frequency the frequency-gain relationship of the converter is reversed. This is
prevented by disabling the converter when the DC input voltage is below a certain value. This is implemented with
the automatic on/off enable signal (CONV_OFF) from the upstream PFC pre-regulator. This signal is used to hold
down the SS pin (pin 4) whenever the output voltage from the PFC stage is insufficient for the resonant converter
to reliably start. In this case a simple NPN bipolar transistor is used to ground the SS pin whenever the
CONV_OFF control signal is high.

4.3 5-W Bias Converter


The 5-W bias supply is produced by a low-cost simple flyback converter. This regulator provides 15-VDC bias to
power the control circuits on the primary side of the power supply. The circuit is based on the UCC2813D-4, a
small current-mode controller. The converter is powered from the output of the PFC pre-regulator stage and must
be able to start up prior to the PFC stage being operational. For this reason the circuit is designed to operate over
a wide input voltage, 100 – 450 VDC. The low power level and current limit setting of this circuit eliminates the
need for a snubber at the MOSFET drain. It also ensures that the flyback transformer is confined to operating in
discontinuous current mode (DCM).
For applications that have higher bias power requirements, or require a significant amount of standby power in the
secondary, a converter design based on the UCC28610 is recommended. The UCC28610 is a robust and
efficient controller that is capable of meeting the high efficiency and low standby power limitations demanded by
EnergyStar®.

4.4 PCB Jumper Settings


The PCB design includes two 0.1-in spaced pin headers, J3 and J6. Using standard shorting jumpers, these
headers provide on/off and power-up options for the board for diagnostic purposes. The jumper settings are
described as follows.

4.4.1 J3: BOOST PFC OFF


Placing a jumper at J3 prevents operation of the Boost PFC Pre-Regulator. With this setting the DC output
voltage will only be as high as the peak AC voltage applied at the input connector, J1. This option allows the LLC
Resonant Converter to be operated independent of the Boost PFC Pre-Regulator. Note that a relatively high AC-
line voltage (265–280 V ACRMS) must be applied to the input in order for the LLC converter to properly regulate.
The power supply will also operate at very poor power factor. The default setting is NO jumper.

4.4.2 J6: LLC CONVERTER (OFF) / AUTO / RUN


The jumper setting at J6 provides three power-up options for the LLC Resonant Converter. A standard 2-pin
jumper can be placed in either the “Auto” or “Run” position. The default jumper position is “Auto.” In this position
the resonant converter powers up whenever the Boost PFC Pre-Regulator is operating.
5
Reference Design
SLUU341 –December 2008

When the jumper is in the “Run” position the resonant converter will operate whenever a valid VCC supply voltage
is available. This mode is useful for testing the resonant converter independently from the PFC pre-regulator. The
removal of the jumper will then disable the resonant converter. The settings are summarized in Table 2.

Table 2: LLC Resonant Converter Jumper Settings

Jumper Position LLC Converter Operating Mode

No Jumper Disabled (no operation)

1
Auto (default) / Operates with PFC pre-regulator

1
Run / Operates without PFC pre-regulator

1. Use a standard 2-pin jumper in either position

6
Reference Design
SLUU341 –December 2008

5 SCHEMATICS
The schematics provided in this section are for reference only. For the purposes of clarity some of the detailed
component parameters are not shown. Consult the bill of materials for additional information.

Fig. 2 Schematic, Boost PFC Pre-Regulator

7
Reference Design
SLUU341 –December 2008

Fig. 3 Schematic, LLC Resonant Converter

8
Reference Design
SLUU341 –December 2008

Fig. 4 Schematic, Bias Supply Converter

6 PCB DESIGN

6.1 General
Fig. 22 and Fig. 23 show the component placement and copper routing of the printed circuit board (PCB), that
used to test and characterize this design. The PCB was designed using single-layer, 1-oz. copper foil. A
combination of both through-hole (T/H) and surface mount devices (SMD) were used. T/H components are
mounted on the top side of the PCB and SMD parts on the underside.
The layout detailed in Fig. 22 & Fig. 23 is missing one component. Fig. 3 Schematic, LLC Resonant Converter,
shows two pairs of rectifiers connected to the T302 secondary; D301 and D306. The layout shows just one, D301.
For improved efficiency and thermal management, two output rectifier pairs are recommended.

6.2 Grounding
The PCB design is limited to a single layer of copper foil. This requires careful attention to the layout of the copper
traces. Differential high-frequency noise developed across discontinuities in the ground system can cause
spurious operation of the control circuits. For this reason the design dedicates large areas of copper to the power
ground node (PWRGND). Care should then be exercised to keep the ground contiguous and connected with wide
paths of copper. The ground connections should take priority over the routing of all other signals. Where
necessary, wire links or axial T/H components should be used to pass signals to other areas of the board. These
techniques minimize the impedance to high-frequency ground currents to ensure low-noise operation.
Most of the control circuitry uses surface mount devices (SMDs), which are placed on the underside of the PCB.
There are three control circuits, one for each of the power converters on the board. To provide noise immunity
from the high-frequency currents generated by the power circuitry, the components associated with each control
circuit are grouped together and referenced to one of three analog grounds. The control circuit for the PFC Boost
converter uses AGND1, the Bias Supply Converter AGND2, and the LLC Resonant Converter AGND3. Each of

9
Reference Design
SLUU341 –December 2008

these analog grounds is represented on the PCB layout as a small copper area (or island) which is then
connected to power ground (PWRGND) at just one location. This single-point grounding technique forces the
high-frequency ground currents generated by the power circuitry to be directed around (as opposed to through)
the quiet ground area occupied of the sensitive control circuits.

6.3 Creepage & Clearance


Both the component placement and spacing between the copper areas or the PCB were designed to comply with
the creepage and clearance requirements defined in the UL 60950 safety standard. The board was designed to
meet the requirements for functional isolation for the high-voltage nodes on the primary (ac-line) side of the power
supply, and reinforced isolation between all primary and secondary circuits. To comply with the UL standard 4 mm
of separation was used for the primary-side high-voltage traces, and 8 mm between all primary and secondary
side traces. The default trace separation for low-voltage nodes, as used for control circuits, was 0.3 mm.

6.4 Thermal Considerations


The PCB assembly dissipates a significant amount of heat and requires some thermal management initiatives for
it operate in a confined space over the defined ambient temperature range. Several components on the PCB
either require a heat sink, or must be provided with a thermally conductive path to the metal surfaces of the
enclosure. Table 3 provides a list of the components that may require conductive cooling, along with their
approximate power dissipation.

Table 3 Parts with High Thermal Dissipation

Ref. Des. Description Dissipation 1/


D101 Input bridge rectifier 5.7 W
T302 LLC converter transformer 5.3 W
L101, L102 PFC boost inductors 4.5 W
D301, D302 LLC output rectifiers 4.0 W
Q101, Q102 Boost PFC MOSFETs 2.0 W
Q301, Q302 LLC ½-Bridge MOSFETs 0.7 W
1. Estimated power dissipation at the maximum rated load
For the assembly that was tested, heat sinks were used for D101, Q101, Q102, Q301, Q302, D301, & D302.
Standard (off-the-shelf) heat sinks were used wherever possible. The exception was the input bridge rectifier,
D101. To spread the heat and maintain a low profile, a special heat sink was fabricated from 13 AWG (0.072 in.
thick) aluminum sheet. The construction details are provided in Fig. 21: Heat Sink for Bridge Rectifier (D101).

10
Reference Design
SLUU341 –December 2008

7 PERFORMANCE CHARACTERISTICS
Fig. 5 through Fig. 20 present typical performance curves. Since actual performance data can be affected by
measurement techniques and environmental variables, these curves are presented for reference and may differ
from actual field measurements.

7.1 Typical Efficiency and Power Factor


90 95

85 90

80 85

Efficiency (%)
Efficiency (%)

75 VI 80 VI
90 V 190 V
70 130 V 75 220 V
110 V 250 V
65 70

60 65

55 60

50 55
0 2 4 6 8 10 12 0 2 4 6 8 10 12

Output Current (A) Output Current (A)

Fig. 5 Operating Efficiency; Low AC-Line Fig. 6 Operating Efficiency; High AC-Line
Range 1 Range 1

7.2 Typical Power Dissipation


60 45

40
50
35
Power Diss. (W)

Power Diss. (W)

40 VI 30

90 V 25 190 V
30 130 V 250 V
110 V 20 220 V

20 15

10
10
5

0 0
0 2 4 6 8 10 12 0 2 4 6 8 10 12
Output Current (A) Output Current (A)

Fig. 7 Power Dissipation; Low AC-Line Range 1 Fig. 8 Power Dissipation; High AC-Line
Range 1

Notes:
1. The discontinuity in the performance curves at approximately 4 A of output current is caused by the
phase management feature of the UCC28061 PFC control IC. The shift occurs when the IC transitions
from single to dual-phase operation.

11
Reference Design
SLUU341 –December 2008

7.3 Typical Output AC Ripple Voltage


300 300

250 250
AC Output Ripple (mVpp)

AC Output Ripple (mVpp)


200 VI 200 VI

90 V 190 V
150 130 V 150 250 V
110 V 220 V

100 100

50 50

0 0
0 2 4 6 8 10 12 0 2 4 6 8 10 12
Output Current (A) Output Current (A)

Fig. 9 Output AC-Ripple; Low AC-Line Range Fig. 10 Output AC-Ripple; High AC-Line Range

12
Reference Design
SLUU341 –December 2008

8 CIRCUIT WAVEFORMS

8.1 Boost PFC Pre-Regulator

Fig. 11 V & I Input AC Waveforms; Fig. 12 V & I Input AC Waveforms;


110 V AC-Line & 8-A Load 220 V AC-Line & 8-A Load

Fig. 13 PFC Inductor Waveforms; 8-A Load & Fig. 14 PFC Inductor Waveforms; 8-A Load &
with AC-Line at 160 V (110-V pk) with AC-Line at 40 V (Crossover)

13
Reference Design
SLUU341 –December 2008

8.2 LLC Resonant Converter

Fig. 15 Switch Node & Inductor Current; Fig. 16 Switch Node & Inductor Current;
8-A Load & 390 VDC Link (174 kHz) 8-A Load & 340 VDC Link (150 kHz)

8.3 Response to AC-Line Input Drop-outs

Fig. 17 Line Dropout: 2 Cycles; Fig. 18 Line Dropout: 2 Cycles;


8-A Load & 110 V 60 Hz AC-Line 8-A Load & 220 V 50 Hz AC-Line

14
Reference Design
SLUU341 –December 2008

8.4 Start Up & Shut Down

Fig. 19 Start-up Sequence; 110 V AC-Line Input Fig. 20 Shut-Down Sequence; 220 V AC-Line
Input

15
Reference Design
SLUU341 –December 2008

9 ASSEMBLY DRAWINGS AND LAYOUT

9.1 Special Part Drawings

Fig. 21: Heat Sink for Bridge Rectifier (D101)

16
Reference Design
SLUU341 –December 2008

9.2 Board Layout

Fig. 22: Component Placement (Viewed from Top)

17
Reference Design
SLUU341 –December 2008

Fig. 23: Bottom Copper and Part Placement (Viewed from Bottom)

18
Reference Design
SLUU341 –December 2008

9.3 LIST OF MATERIALS


Table 4 lists the components as configured according to the schematic shown in Fig. 2 through Fig. 4.

Table 4 Bill of Materials

Qty. Ref. Des. Value Description Part Number Manufacturer

3 C101-C103 0.33 µF CAPACITOR, PET FILM, X1, 250 VAC, 20% ECQ-U3A334MG Panasonic
1 C104 0.1 µF CAPACITOR, PET FILM, X2, 250 VAC, 20% ECQ-U2A104BC1 Panasonic
2 C105, C106 22 pF CAPACITOR, MLC, 0603, 50 V, 5% Generic Multi-sourced
1 C107 0.047 µF CAPACITOR, PET FILM, 630 V, 10% ECQ-E6473KZ Panasonic
4 C108-C111 100 µF CAPACITOR, ELECTROLYTIC, 450 V, 10% EKXG451ELL101MM40S Nippon Chemi-Con
2 C112, C118 1200 pF CAPACITOR, MLC, 0603, 50 V, 10% Generic Multi-sourced
2 C113, C317 0.01 µF CAPACITOR, MLC, 0603, 50 V, 10% Generic Multi-sourced
1 C114 0.33 µF CAPACITOR, MLC, 1206, 25 V, 20% Generic Multi-sourced
2 C115, C117 2.2 µF CAPACITOR, MLC, 1206, 25 V, 20% Generic Multi-sourced
2 C116, C208 1000 pF CAPACITOR, MLC, 0603, 100 V, 5% Generic Multi-sourced
1 C119 3300 pF CAPACITOR, MLC, 0603, 50 V, 10% Generic Multi-sourced
1 C201 0.01 µF CAPACITOR, FILM, 630 V, 10% ECQ-E6103KZ Panasonic
2 C202, C206 0.1 µF CAPACITOR, MLC, 0603, 16 V, 10% Generic Multi-sourced
2 C203, C314 0.1 µF CAPACITOR, MLC, 0805, 25 V, 20% Generic Multi-sourced
1 C204 470 pF CAPACITOR, MLC, 0603, 50 V, 5% Generic Multi-sourced
1 C210 100 pF CAPACITOR, MLC, 0603, 100 V, 10% 06031A101KAT2A AVX
1 C211 10 µF CAPACITOR, MLC, 1206, 25 V, 10% Generic Multi-sourced
1 C212 330 µF CAPACITOR, ELECTROLYTIC, 25 V, 20% EEU-FC1E331 Panasonic
3 C301-C303 0.33 µF CAPACITOR, FILM, 630 V, 10% MF630V.33K Xicon
1 C304 0.001 µF CAPACITOR, PP FILM, 1 KV, 10% MKP10 1000/1600/10 WIMA
2 C305, C321 0.022 µF CAPACITOR, PP FILM, 1 KV, 10% MKP10-.022/1KV/10 WIMA
6 C306-C311 150 µF CAPACITOR, ELECTROLYTIC, 35 V, 10% EEUFM1V151 Panasonic
1 C312 1 uF CAPACITOR, MLC, 1210, 50 V, 20% Generic Multi-sourced
1 C313 0.1 uF CAPACITOR, MLC, 1206, 50 V, 20% Generic Multi-sourced
1 C315 1 uF CAPACITOR, MLC, 0805, 25 V, 10% Generic Multi-sourced
1 C316 0.047 uF CAPACITOR, MLC, 0603, 25 V, 10% Generic Multi-sourced
1 C320 0.01uF CAPACITOR, MLC, 0805, 50 V, 10% Generic Multi-sourced
1 C322 0.22uF CAPACITOR, MLC, 0603, 10 V, 10% Generic Multi-sourced
1 D101 BRIDGE RECTIFIER GBPC606-E4/51 Vishay
3 D102-D104 RECTIFIER, POWER, ULTRA-FAST MURS360T3G ON Semiconductor
3 D201, D303, DIODE, SIGNAL MMBD914LT1G ON Semiconductor
D304
1 D203 DIODE, SCHOTTKY MBRS1100T3G ON-Semiconductor
1 D204 DIODE, FAST RECOVERY, T/H 1N4934G ON-Semiconductor
2 D301, D302 DIODE, DUAL, SCHOTTKY, 100-V, 10-A STPS20H100CT ST Microelectronics
1 D304 27 V DIODE, ZENER, 0.5-W, 27 V MMSZ5254B Diodes, Inc.
1 D305 12 V DIODE, ZENER, 0.5-W, 12 V MMSZ5242BT1 ON Semiconductor

19
Reference Design
SLUU341 –December 2008

Qty. Ref. Des. Value Description Part Number Manufacturer

1 D306 DIODE, SCHOTTKY, T/H 1N5711 STMicroelectronics


1 F1 FUSE CLIPS, 5X20MM, CARTRIDGE 3517 Keystone
1 F2 0.25 A FUSE, AXIAL-LEADED, FAST-ACTING 0263.250 Littelfuse
1 J1 HEADER, PLUGGABLE, HORIZ, 3-WAY 39522-1003 Molex
1 J3 CONNECTOR, HEADER, 0.025 SQ., 2-WAY 68001-202HLF FCI BergStik
1 J5 HEADER PLUGGABLE, HORIZ, 4-WAY 39522-1004 Molex
1 J6 CONNECTOR, HEADER, 0.025 SQ., 3-WAY 68001-203HLF FCI BergStik
2 L101, L102 330 µH INDUCTOR, BOOST, 5.5 A I080-330µH/5.5A Payton America
1 L301 13.6 µH INDUCTOR, RESONANT, 175 KHZ I40-13.6µH/3.5A Payton America
2 Q101. Q102 MOSFET, POWER, N-CHANNEL IRFB11N50APbF Vishay
1 Q103 TRANSISTOR, BIPOLAR, PNP BC857BTT1G ON-Semiconductor
1 Q201 MOSFET, DPAK FQD3N60TF Fairchild
2 Q301, Q302 MOSFET, TO-220 2SK3934 Toshiba
1 Q303 TRANSISTOR, NPN MMBT3904LT1G ON-Semiconductor
1 Q304 TRANSISTOR, JFET, P-CHANNEL MMBFJ176 Fairchild
6 R101-R103, 1M0 RESISTOR, T/H, 0.25 W, 1% 271-1.0M/AP-RC Xicon
R115-R117
1 R104 0R015 RESISTOR, SMD, 2010, 1% WSL2010R0120FEB Vishay-Dale
2 R105, R112 20k5 RESISTOR, SMD, 0805, 1% Generic Multi-sourced
4 R106, R113, 4R99 RESISTOR, SMD, 0805, 1% SR732ATT4R99F KOA
R208, R212
3 R107, R114, 10k0 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
R323
2 R108, R118 47k0 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R109 100R RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R110 121k RESISTOR, SMD, 0805, 1% Generic Multi-sourced
1 R111 6k34 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R119 178k RESISTOR, T/H, 0.25 W, 1% 271-178K/AP-RC Xicon
2 R120-R121 536k RESISTOR, T/H, 0.25 W, 1% 271-536K/AP-RC Xicon
1 R122 10k2 RESISTOR, SMD, 0805, 1% Generic Multi-sourced
2 R123, R206 100k RESISTOR, SMD, 0603, 1% Generic Multi-sourced
4 R201-R204 100k RESISTOR, T/H, 0.25 W, 1% 271-100K/AP-RC Xicon
1 R205 75k0 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R207 2k49 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R211 75R0 RESISTOR, T/H, 0.25 W, 1% 271-75/AP-RC Xicon
1 R213 100R RESISTOR, SMD, 0805, 1% Generic Multi-sourced
1 R214 3k01 RESISTOR, SMD, 0805, 1% Generic Multi-sourced
1 R215 16k9 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R216 3k4 RESISTOR, T/H, 0.25 W, 1% 271-3.4K/AP-RC Xicon
2 R301-R302 0R0 RESISTOR, ZERO LINK, T/H, 0.25 W 291-0/AP-RC Xicon
1 R304 10k RESISTOR, T/H, 0.25 W, 1% 271-10K/AP-RC Xicon
1 R306 33R2 RESISTOR, SMD, 0603, 1% Generic Multi-sourced

20
Reference Design
SLUU341 –December 2008

Qty. Ref. Des. Value Description Part Number Manufacturer

1 R308 11k5 RESISTOR, SMD, 0603, 1% Generic Multi-sourced


1 R309 1k82 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R310 499R RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R311 6k49 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R312 1k5 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R314 7k5 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R315 1k5 RESISTOR, T/H, 0.25 W, 1% 271-1.5K/AP-RC Xicon
1 R316 31k6 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R317 3k65 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R318 200R RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R319 348R RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R320 31k6 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R321 60k4 RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 R322 10k RESISTOR, SMD, 0603, 1% Generic Multi-sourced
1 RT1 5 Ohms THERMISTOR, NTC CL-40 GE Sensing
1 T201 TRANSFORMER, FLYBACK GA3544-AL Coilcraft
1 T301 TRANSFORMER, GATE DRIVE, 1:1:1 HA3858-AL Coilcraft
1 T302 TRANSFORMER, 350VA, 175 KHZ T250AC-16-4C Payton America
1 U101 INTEGRATED CIRCUIT UCC28061D Texas Instruments
1 U201 INTEGRATED CIRCUIT UCC2813D-4 Texas Instruments
1 U301 INTEGRATED CIRCUIT UCC25600D Texas Instruments
2 U302, U303 OPTO-COUPLER H11AV1A-M Fairchild
1 U304 INTEGRATED CIRCUIT TL431AIDBV Texas Instruments
1 VR1 VARISTOR SIOV-S10K275E2 EPCOS
2 Q101, Q102 HEATSINK, EXTRUDED, LOW-PROFILE 7-345-1PP-BA IERC
2 D301, D302 HEATSINK, EXTRUDED, LOW-PROFILE 7-345-2PP IERC
1 J1 CONNECTOR PLUG, 3-WAY 39520-0003 Molex
1 J5 CONNECTOR PLUG, 4-WAY 39520-0004 Molex
2 Q301, Q302 HEATSINK, LOW-PROFILE, TO-220 274-1AB Wakefield
4 Q101, Q102, INSULATOR PAD, TO-220 SP900S-58 Berquist
D301, D302
1 F1 5A FUSE, 5X20MM, GLASS, FAST-ACTING 0217005P Littelfuse
8 Q101, Q102, NUT, STAINLESS STEEL, #4-40 Generic
D301, D302
2 D301, D302 LOCK WASHER, INTERNAL TOOTH, #4 Generic
4 Q101, Q102, PLAIN WASHER, #4 Generic
D301, D302
8 Q101, Q102, SCREW, PANHEAD, PHILLIPS, #4-40 × 3/8 Generic
D301, D302
4 Q101, Q102, INSULATOR, MOLDED, NYLON Richco Plastic Co.
D301, D302

21
Reference Design
SLUU341 –December 2008

10 References
The following is a list of data sheets, evaluation guides, and papers that were used to design of the 300-W LCD
TV power supply.
[1] UCC28061 Data Sheet, Texas Instruments Ref. SLUS837
[2] UCC28061EVM 300-W Interleaved PFC Pre-Regulator User’s Guide, Texas Instruments Ref. SLUU316
[3] UCC25600 Data Sheet; Texas Instruments Ref. SLUS846
[4] Bing Lu, Wenduo Liu,Yan Liang, Fred C. Lee, and Jacobus D. van Wyk, “Optimal Design Methodology for
LLC Resonant Converter,” IEEE APEC 2006.

11 Additional Information
The PCB layout for this reference design was created using PADS 2005 CAD software by Mentor Graphics.
PADS ‘Logic’ was used for schematic capture, and PADS ‘Layout’ was used to design the PCB. The Gerber file,
silk screen, solder mask, and drill drawing files produced by PADS, including the program files that created them,
are available to designers. Enquiries should be made to the regional Texas Instruments Product Information
Center (PIC), or the local TI sales representative. Use the prototype reference design number, PR883, for this
request.

22
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DLP® Products www.dlp.com Broadband www.ti.com/broadband
DSP dsp.ti.com Digital Control www.ti.com/digitalcontrol
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Military www.ti.com/military
Logic logic.ti.com Optical Networking www.ti.com/opticalnetwork
Power Mgmt power.ti.com Security www.ti.com/security
Microcontrollers microcontroller.ti.com Telephony www.ti.com/telephony
RFID www.ti-rfid.com Video & Imaging www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated

You might also like