X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) : Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCS)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Overview
KEMET’s X7R dielectric features a 125°C maximum circuits where Q and stability of capacitance characteristics
operating temperature and is considered temperature are not critical. X7R exhibits a predictable change in
stable. The Electronics Components, Assemblies and capacitance with respect to time and voltage, boasting a
Materials Association (EIA) characterizes X7R dielectric as minimal change in capacitance with reference to ambient
a Class II material. Components of this classification are temperature. Capacitance change is limited to ±15% from
fixed, ceramic dielectric capacitors suited for bypass and −55°C to +125°C.
decoupling applications or for frequency discriminating
Benefits
• −55°C to +125°C operating temperature range
• Lead (Pb)-free, RoHS, and REACH Compliant
• Temperature stable dielectric
• EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220,
and 2225 case sizes
• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 35 V, 50 V,
100 V, 200 V, and 250 V
• Capacitance offerings ranging from 10 pF to 47 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability Click image above for interactive 3D content
• SnPb termination finish option available upon request Open PDF in Adobe Reader for full functionality
(5% Pb minimum)
Applications
Typical applications include decoupling, bypass, filtering and transient voltage suppression.
One world. One KEMET

© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1002_X7R_SMD • 5/3/2019 1
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Ordering Information
C 1206 C 106 M 4 R A C TU
Case Size Specification/ Capacitance Capacitance Rated Voltage Failure Rate/ Termination Packaging/
Ceramic Dielectric
(L" x W") Series1 Code (pF) Tolerance (VDC) Design Finish2 Grade (C-Spec)
0402 C = Standard Two J = ±5% 9 = 6.3 R = X7R A = N/A C = 100% See
0603 significant K = ±10% 8 = 10 Matte Sn “Packaging
0805 digits and M = ±20% 4 = 16 C-Spec
1206 number of 3 = 25 Ordering
1210 zeros. 6 = 35 Options
1808 5 = 50 Table”
1812 1 = 100
1825 2 = 200
2220 A = 250
2225
1
Flexible termination option is available. Please see FT-CAP product bulletin C1013_X7R_FT-CAP_SMD.
2
Additional termination finish options may be available. Contact KEMET for details.
Packaging C-Spec Ordering Options Table

Packaging/Grade
Packaging Type1
Ordering Code (C-Spec)
Bulk Bag/Unmarked Not required (Blank)
7" Reel/Unmarked TU
7411 (EIA 0603 and smaller case sizes)
13" Reel/Unmarked
7210 (EIA 0805 and larger case sizes)
7" Reel/Marked TM
7040 (EIA 0603)
13" Reel/Marked
7215 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2 mm pitch2 7081
13" Reel/Unmarked/2 mm pitch2 7082
1
Default packaging is "Bulk Bag." An ordering code C-Spec is not required for "Bulk Bag" packaging.
1
The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking."
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
Dimensions – Millimeters (Inches)
W L
T B
EIA Metric S
L W T B Mounting
Size Size Separation
Length Width Thickness Bandwidth Technique
Code Code Minimum
1.00 (0.040) 0.50 (0.020) 0.30 (0.012) Solder reflow
0402 1005 0.30 (0.012) only
±0.05 (0.002) ±0.05 (0.002) ±0.10 (0.004)
1.60 (0.063) 0.80 (0.032) 0.35 (0.014)
0603 1608 0.70 (0.028)
±0.15 (0.006) ±0.15 (0.006) ±0.15 (0.006)
2.00 (0.079) 1.25 (0.049) 0.50 (0.02) Solder wave or
0805 2012 ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) 0.75 (0.030)
Solder reflow
3.20 (0.126) 1.60 (0.063) 0.50 (0.02)
1206 3216 ±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010)
3.20 (0.126) 2.50 (0.098) 0.50 (0.02)
12101 3225 See Table 2
±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010)
for Thickness
4.70 (0.185) 2.00 (0.079) 0.60 (0.024)
1808 4520 ±0.50 (0.020) ±0.20 (0.008) ±0.35 (0.014)
4.50 (0.177) 3.20 (0.126) 0.60 (0.024) N/A
1812 4532 ±0.30 (0.012) ±0.30 (0.012) ±0.35 (0.014) Solder reflow
4.50 (0.177) 6.40 (0.252) 0.60 (0.024) only
1825 4564 ±0.30 (0.012) ±0.40 (0.016) ±0.35 (0.014)
5.70 (0.224) 5.00 (0.197) 0.60 (0.024)
2220 5650 ±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014)
2225 5664 5.60 (0.220) 6.40 (0.248) 0.60 (0.024)
±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014)
1
For capacitance values ≥ 4.7 µF add 0.02 (0.001) to the width tolerance dimension and 0.10 (0.004) to the length tolerance dimension.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°C to +125°C
Capacitance Change with Reference to
±15%
+25°C and 0 VDC Applied (TCC)
1
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
250% of rated voltage
2
Dielectric Withstanding Voltage (DWV) (5 ±1 seconds and charge/discharge not exceeding 50mA)
3
Dissipation Factor (DF) Maximum Limit at 25°C See Dissipation Factor Limit Table
See Insulation Resistance Limit Table

4
Insulation Resistance (IR) Minimum Limit at 25°C (Rated voltage applied for 120 ±5 seconds at 25°C)
1
Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 48 or 1,000 hours. Please refer to a part
number specific datasheet for referee time details.
2
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
4
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Insulation Resistance Limit Table

1,000 megohm 500 megohm 100 megohm
EIA Case Size Rated DC Voltage
microfarads or 100 GΩ microfarads or 10 GΩ microfarads or 10 GΩ
0402 ALL < 0.012 µF ≥ 0.012 µF N/A
≤ 200 V < 0.047 µF ≥ 0.047 µf < 0.47 µf ≥ 0.47 µf
0603
250 V N/A N/A ALL
≤ 200 V < 0.15 µF ≥ 0.15 µF < 2.2 µf ≥ 2.2 µf
0805
250 V < .027 µF N/A ≥ .027 µF
≤ 200 V < 0.47 µF ≥ 0.47 µF < 2.2 µf ≥ 2.2 µf
1206
250 V < 0.12 µF N/A ≥ 0.12 µF
≤ 200 V < 0.39 µF ≥ 0.39 µF < 10 µf ≥ 10 µf
1210
250 V < 0.27 µF N/A ≥ 0.27 µF
1808 ALL ALL N/A N/A
1812 ALL < 2.2 µF ≥ 2.2 µF N/A
2220 ALL < 10 µF ≥ 10 µF N/A
Dissipation Factor (DF) Limit Table
Dissipation
EIA Case Rated DC Factor
Capacitance
Size Voltage (Maximum
%)
< 16 5.0
All
16 3.5
0402 25 < 0.1 µF 3.5
25 ≥ 0.1 µF 10.0
> 25 All 2.5
< 16 5.0
16/25 < 1.0 µF 3.5
0603 1
> 25 2.5
< 16
≥ 1.0 µF 10.0
16/25
< 16 5.0
< 2.2 µF
16/25 3.5
> 25 < 1.0 µF 2.5
0805
< 16
≥ 2.2 µF
16/25 10.0
> 25 ≥ 1.0 µF
< 16 5.0
< 10 µF
16/25 3.5
12062 > 25 All 2.5
< 16
≥ 10 µF 10.0
16/25
< 16 5.0
16/25 < 22 µF 3.5
12103 > 25 2.5
< 16
≥ 22 µF 10.0
16/25
< 16 5.0
1808–2225 16/25 All 3.5
> 25 2.5
1
For Capacitance values 0.22uF (16 and 25 Volts) DF is 5%.
2
For Capacitance value 2.2uF (25 Volts) and ≥ 2.2 µF (35 and 50 Volts) DF is 10%.
3
For Capacitance value 10uF (25 Volts) DF is 10%.
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance

Dissipation
Rated DC Capacitance Capacitance Insulation
Dielectric Case Size Factor
Voltage Value Shift Resistance
(Maximum %)
< 16 7.5
0402 16/25 All 5.0
> 25 3.0
< 16 7.5
16/25 < 1.0 µF 5.0
0603 1
> 25 3.0
< 16
≥ 1.0 µF 20.0
16/25
< 16 7.5
< 2.2 µF
16/25 5.0
> 25 < 1.0 µF 3.0
0805
< 16
≥ 2.2 µF
16/25 20.0
10% of Initial
X7R > 25 ≥ 1.0 µF ± 20%
limit
< 16 7.5
< 10 µF
16/25 5.0
12062 > 25 All 3.0
< 16
≥ 10 µF 20.0
16/25
< 16 7.5
16/25 < 22 µF 5.0
12103 > 25 3.0
< 16
≥ 22 µF 20.0
16/25
< 16 7.5
1808-2225 16/25 All 5.0
> 25 3.5
1
For Capacitance values 0.22 uF (16 and 25 Volts) DF is 7.5%.
2
For Capacitance value 2.2 uF (25 Volts) and ≥ 2.2 µF (35 and 50 Volts) DF is 20%.
3
For Capacitance value 10 uF (25 Volts) DF is 20%.
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)
Case Size/
Series
C0402C C0603C C0805C C1206C
Cap
Cap Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 6 5 1 2 A 9 8 4 3 6 5 1 2 A
Code Rated Voltage
200
250
200
250
200
250
100
100
100
6.3
6.3
6.3
6.3
25
50
25
35
50
35
25
50
25
50
10
10
16
10
10
16
16
16
(VDC)
Cap Tolerance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
10 - 20 pF* 100 - 200* J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
22 pF 220 J K M BB BB BB BB BB CF CF CF CF CF CF CF DM DM DM DM DM DM DN DN EB EB EB EB EB EB EB EB
24 - 91pF 240 - 910* J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
100 - 150 pF** 101 - 151** J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
180 - 820 pF** 181 - 821** J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
1000pF 102 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB EB
1200 pF 122 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB EB
12000 pF 123 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB EB
27000 pF 273 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN DP DE DG EB EB EB EB EB EB EB EB EB
33000 pF 333 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN DP DE DG EB EB EB EB EB EB EB EB EB
39000 pF 393 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN DP DE DG EB EB EB EB EB EB EC EB EB
47000 pF 473 J K M BB BB BB BB CF CF CF CF CJ CF DO DO DO DO DO DO DE DG DG EB EB EB EB EB EB EC ED ED
56000 pF 563 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DP DE DG DG EB EB EB EB EB EB EB ED ED
68000 pF 683 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DP DE DG DG EB EB EB EB EB EB EB ED ED
82000 pF 823 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DP DE EB EB EB EB EB EB EB ED ED
0.1 µF 104 J K M BB BB BB BB¹ CJ CJ CJ CJ CJ DN DN DN DN DN DN DE EB EB EB EB EB EB EB EM EM
0.12 µF 124 J K M CF CF CF CF CF DN DN DN DN DP DP DG EC EC EC EC EC EC EC EG EM
0.15 µF 154 J K M CF CF CF CF CF DN DN DN DN DP DP DG EC EC EC EC EC EC EC EG EG
0.18 µF 184 J K M CF CF CF CF DN DN DN DN DG DG DG EC EC EC EC EC EC EC EM EM
0.22 µF 224 J K M CF CF CF CF DN DN DN DN DG DG DG EC EC EC EC EC EC EC EG EG
0.27 µF 274 J K M CF CF CF DP DP DP DP DP DP EB EB EB EB EC EC EM
0.33 µF 334 J K M CF CF CF DG DG DG DG DP DP EB EB EB EB EC EC EG
0.39 µF 394 J K M CF CF CF DG DG DG DG DE DE EB EB EB EB EC EC EG
0.47 µF 474 J K M CF CF CF CG¹ DG DG DG DG DE DE EC EC EC EC EC EC EG
0.56 µF 564 J K M DP DP DP DG DH DH ED ED ED ED EC EC EM
0.68 µF 684 J K M DP DP DP DG DH DH EE EE EE EE ED ED EM
0.82 µF 824 J K M DP DP DP DG EF EF EF EF ED ED EH
1 µF 105 J K M CG¹ CG¹ CG¹ CD¹ DP DP DP DG DG¹ DG¹ EP EP EP EP ED ED EH
1.2 µF 125 J K M DE DE DE ED ED ED EG EH EH
1.5 µF 155 J K M DG DG DG ED ED ED EG EH EH
1.8 µF 185 J K M DG DG DG ED ED ED EF EH EH
2.2 µF 225 J K M CG¹ CG¹ DG DG DG DG¹ EH EH EH¹ EH¹ EH EH
2.7 µF 275 J K M EN EN EN EH
3.3 µF 335 J K M ED ED ED EH
3.9 µF 395 J K M EF EF EF EH
4.7 µF 475 J K M DG DG DG DG EH EH EH EH EH¹ EH¹
Rated Voltage
200
250
200
250
200
250
100
100
100
6.3
6.3
6.3
6.3
25
35
50
25
35
50
25
50
25
50
10
10
16
10
10
16
16
16
(VDC)
Cap
Code
Case Size/
C0402C C0603C C0805C C1206C
Series
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91).
**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82).
xx1 Available only in K and M tolerance.
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) cont'd

Case Size/
Series
C0402C C0603C C0805C C1206C
Cap
Code Rated Voltage
200
250
200
250
200
250
100
100
100
6.3
6.3
6.3
6.3
25
35
50
25
35
50
25
50
25
50
10
10
10
10
16
16
16
16
(VDC)
5.6 µF 565 J K M EH EH EH
10 µF 106 J K M DH DH EH EH EH EH
22 µF 226 J K M EH¹ EH¹
Rated Voltage
200
250
200
250
200
250
100
100
100
6.3
6.3
6.3
6.3
25
35
50
50
25
35
50
25
50
25
10
10
10
16
10
16
16
16
(VDC)
Cap
Code
Case Size/
C0402C C0603C C0805C C1206C
Series
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes)
Case Size/
C1210C C1808C C1812C C1825C C2220C C2225C
Series
Cap
Cap Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A 5 1 2 A
Code
Rated Voltage
200
250
200
250
200
250
200
250
200
250
200
100
100
100
100
100
100
6.3
50
50
50
25
50
25
50
50
25
10
16
(VDC)
10 - 91 pF* 100 - 910* J K M FB FB FB FB FB FB FB
11 pF 110 J K M FB FB FB FB FB FB FB
Rated Voltage
200
250
200
250
200
250
200
200
250
200
250
100
100
100
100
100
100
6.3
50
25
50
50
50
25
50
25
50
10
16
(VDC)
Cap
Code
Case Size/
C1210C C1808C C1812C C1825C C2220C C2225C
Series
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) cont'd
Case Size/
C1210C C1808C C1812C C1825C C2220C C2225C
Series
Cap
Code
Rated Voltage
200
250
200
250
200
250
200
250
200
200
250
100
100
100
100
100
100
6.3
50
50
25
50
50
25
50
25
50
10
16
(VDC)
100 - 270 pF** 101 - 271** J K M FB FB FB FB FB FB FB
330 pF 331 J K M FB FB FB FB FB FB FB LF LF LF
390 pF 391 J K M FB FB FB FB FB FB FB LF LF LF
470 - 1,200 pF** 471 - 122** J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
560 pF 561 J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
1,000 pF 102 J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
1,200 pF 122 J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
1,500 pF 152 J K M FB FB FB FB FB FB FE LF LF LF GB GB GB GB
1,800 pF 182 J K M FB FB FB FB FB FB FE LF LF LF GB GB GB GB
2,200 pF 222 J K M FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB
2,700 pF 272 J K M FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB
3,300 pF 332 J K M FB FB FB FB FB FB FB FB LF LF GB GB GB GB
3,900 pF 392 J K M FB FB FB FB FB FB FB FB LF LF GB GB GB GB HB HB HB
4,700 pF 472 J K M FB FB FB FB FB FB FB FB LD LD LD GB GB GB GD HB HB HB KE KE KE
5,600 pF 562 J K M FB FB FB FB FB FB FB FB LD LD LD GB GB GB GH HB HB HB KE KE KE
6,800 pF 682 J K M FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HB HB JE JE JE KE KE KE
8,200 pF 822 J K M FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HB HB JE JE JE KE KE KE
10,000 pF 103 J K M FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HB HE JE JE JE KE KE KE
12,000 pF 123 J K M FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HB HE JE JE JE KE KE KE
15,000 pF 153 J K M FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HB JE JE JE KE KE KE
18,000 pF 183 J K M FB FB FB FB FB FB FB FB LD LD LD GB GB GB GB GB HB HE JE JE JE KE KE
22,000 pF 223 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB HB JE JE JE KE KE
27,000 pF 273 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB HB JE JE JE KE KE
33,000 pF 333 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB HB JB JB JB KE
39,000 pF 393 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB HB JB JB JB
47,000 pF 473 J K M FB FB FB FB FB FB FC FC LD LD GB GB GB GB GB HB HB HB HB JB JB JB
56,000 pF 563 J K M FB FB FB FB FB FB FC FC LD LD GB GB GB GB GB HB HB HB HB JB JB JB
68,000 pF 683 J K M FB FB FB FB FB FB FC FC LD GB GB GB GB GB HB HB HB HB JB JB JB
82,000 pF 823 J K M FB FB FB FB FB FC FF FF LD GB GB GB GB GB HB HB HB HB JC JC JC JC JC
0.10 µF 104 J K M FB FB FB FB FB FD FG FG LD GB GB GB GB GB HB HB HB HB JC JC JC JC JC KC KC KC KC
0.12 µF 124 J K M FB FB FB FB FB FD FH FH LD GB GB GB GB GB HB HB HB HB JC JC JC JC JC KC KC KC KC
0.15 µF 154 J K M FC FC FC FC FC FD FM FM LD GB GB GB GE GE HB HB HB HB JC JC JC JC JC KC KC KC KC
0.18 µF 184 J K M FC FC FC FC FC FD FK FK LD GB GB GB GG GG HB HB HB HB JC JC JC JC JC KC KC KC KC
0.22 µF 224 J K M FC FC FC FC FC FD FK FK GB GB GB GG GG HB HB HB HB JC JC JC JC JC KC KC KC KC
0.27 µF 274 J K M FC FC FC FC FC FD FP FP GB GB GG GG GG HB HB HB HB JC JC JC JC JC KB KC KC KC
0.33 µF 334 J K M FD FD FD FD FD FD FM FM GB GB GG GG GG HB HB HB HB JC JC JC JC JC KB KC KC KC
0.39 µF 394 J K M FD FD FD FD FD FD FK FK GB GB GG GG GG HB HB HD HD JC JC JC JC JC KB KC KC KC
0.47 µF 474 J K M FD FD FD FD FD FD FS FS GB GB GG GJ GJ HB HB HD HD JC JC JC JC JC KB KC KD KD
Rated Voltage
200
250
200
250
200
250
200
250
200
250
200
100
100
100
100
100
100
6.3
50
50
25
50
50
25
50
25
50
10
16
(VDC)
Cap
Code
Case Size/
C1210C C1808C C1812C C1825C C2220C C2225C
Series
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) cont'd
Case Size/
C1210C C1808C C1812C C1825C C2220C C2225C
Series
Cap
Code
Rated Voltage
250
200
250
200
250
200
250
200
200
250
200
100
100
100
100
100
100
6.3
50
50
50
50
25
50
25
25
50
10
16
(VDC)
0.56 µF 564 J K M FD FD FD FD FD FF GC GC GG HB HD HD HD JC JC JC JD JD KB KC KD KD
0.68 µF 684 J K M FD FD FD FD FD FG GC GC GG HB HD HD HD JC JC JD JD JD KB KC KD KD
0.82 µF 824 J K M FF FF FF FF FF FL GE GE GG HB HF HF HF JC JC JF JF JF KB KC KE KE
1.0 µF 105 J K M FH FH FH FH FH FM GE GE GG HB HF HF HF JC JC JF JF JF KB KD KE KE
1.2 µF 125 J K M FH FH FH FH FG FH GB GB GB HB JC JC KB KE KE KE
1.5 µF 155 J K M FH FH FH FH FG FM GC GC GC HC JC JC KC
1.8 µF 185 J K M FH FH FH FH FG FJ GE GE GE HD JD JD KD
2.2 µF 225 J K M FJ FJ FJ FJ FG FT¹ GO GO GO¹ HF JF JF KD
2.7 µF 275 J K M FE FE FE FG FH GJ GJ GJ
3.3 µF 335 J K M FF FF FF FM FM GL GL GL
3.9 µF 395 J K M FG FG FG FG FK GK GK
4.7 µF 475 J K M FC FC FC FG FS GK GK JF JF
5.6 µF 565 J K M FF FF FF FH
6.8 µF 685 J K M FG FG FG FM
8.2 µF 825 J K M FH FH FH FK
10 µF 106 J K M FT¹ FT¹ FT¹ FS¹ FS¹ GK JF JO
12 µF 126 J K M
15 µF 156 J K M FM FM JO JO
18 µF 186 J K M
22 µF 226 J K M FS FS FS¹ FS¹ JO
47 µF 476 J K M FS¹ FS¹
Rated Voltage
200
250
200
250
200
250
200
250
200
250
200
100
100
100
100
100
100
6.3
50
50
25
50
50
25
50
25
50
10
16
(VDC)
Cap
Code
Case Size/
C1210C C1808C C1812C C1825C C2220C C2225C
Series
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Thickness Case Thickness ± Paper Quantity1 Plastic Quantity
Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel
BB 0402 0.50 ± 0.05 10,000 50,000 0 0
CF 0603 0.80 ± 0.07* 4,000 15,000 0 0
CG 0603 0.80 ± 0.10* 4,000 15,000 0 0
CD 0603 0.80 ± 0.15 4,000 10,000 0 0
CJ 0603 0.80 ± 0.15* 4,000 15,000 0 0
DM 0805 0.70 ± 0.20* 4,000 15,000 0 0
DN 0805 0.78 ± 0.10* 4,000 15,000 0 0
DO 0805 0.80 ± 0.10* 4,000 15,000 0 0
DP 0805 0.90 ± 0.10* 4,000 15,000 0 0
DE 0805 1.00 ± 0.10 0 0 2,500 10,000
DG 0805 1.25 ± 0.15 0 0 2,500 10,000
DH 0805 1.25 ± 0.20 0 0 2,500 10,000
EB 1206 0.78 ± 0.10 4,000 10,000 4,000 10,000
EC 1206 0.90 ± 0.10 0 0 4,000 10,000
EN 1206 0.95 ± 0.10 0 0 4,000 10,000
ED 1206 1.00 ± 0.10 0 0 2,500 10,000
EE 1206 1.10 ± 0.10 0 0 2,500 10,000
EF 1206 1.20 ± 0.15 0 0 2,500 10,000
EP 1206 1.20 ± 0.20 0 0 2,500 10,000
EM 1206 1.25 ± 0.15 0 0 2,500 10,000
EG 1206 1.60 ± 0.15 0 0 2,000 8,000
EH 1206 1.60 ± 0.20 0 0 2,000 8,000
FB 1210 0.78 ± 0.10 0 0 4,000 10,000
FC 1210 0.90 ± 0.10 0 0 4,000 10,000
FD 1210 0.95 ± 0.10 0 0 4,000 10,000
FE 1210 1.00 ± 0.10 0 0 2,500 10,000
FF 1210 1.10 ± 0.10 0 0 2,500 10,000
FG 1210 1.25 ± 0.15 0 0 2,500 10,000
FL 1210 1.40 ± 0.15 0 0 2,000 8,000
FH 1210 1.55 ± 0.15 0 0 2,000 8,000
FP 1210 1.60 ± 0.20 0 0 2,000 8,000
FM 1210 1.70 ± 0.20 0 0 2,000 8,000
FJ 1210 1.85 ± 0.20 0 0 2,000 8,000
FT 1210 1.90 ± 0.20 0 0 2,000 8,000
FK 1210 2.10 ± 0.20 0 0 2,000 8,000
FS 1210 2.50 ± 0.30 0 0 1,000 4,000
NA 1706 0.90 ± 0.10 0 0 4,000 10,000
NC 1706 1.00 ± 0.15 0 0 4,000 10,000
LD 1808 0.90 ± 0.10 0 0 2,500 10,000
LF 1808 1.00 ± 0.15 0 0 2,500 10,000
GB 1812 1.00 ± 0.10 0 0 1,000 4,000
GC 1812 1.10 ± 0.10 0 0 1,000 4,000
GD 1812 1.25 ± 0.15 0 0 1,000 4,000
GE 1812 1.30 ± 0.10 0 0 1,000 4,000
GH 1812 1.40 ± 0.15 0 0 1,000 4,000
GG 1812 1.55 ± 0.10 0 0 1,000 4,000
GK 1812 1.60 ± 0.20 0 0 1,000 4,000
GJ 1812 1.70 ± 0.15 0 0 1,000 4,000
GL 1812 1.90 ± 0.20 0 0 500 2,000
GO 1812 2.50 ± 0.20 0 0 500 2,000
7" Reel 13" Reel 7" Reel 13" Reel
Thickness Case Thickness ±
Code Size1 Range (mm)
Paper Quantity1 Plastic Quantity
Package quantity based on finished chip thickness specifications.

1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities cont'd

Thickness Case Thickness ± Paper Quantity1 Plastic Quantity
Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel
HB 1825 1.10 ± 0.15 0 0 1,000 4,000
HC 1825 1.15 ± 0.15 0 0 1,000 4,000
HD 1825 1.30 ± 0.15 0 0 1,000 4,000
HE 1825 1.40 ± 0.15 0 0 1,000 4,000
HF 1825 1.50 ± 0.15 0 0 1,000 4,000
JB 2220 1.00 ± 0.15 0 0 1,000 4,000
JC 2220 1.10 ± 0.15 0 0 1,000 4,000
JD 2220 1.30 ± 0.15 0 0 1,000 4,000
JE 2220 1.40 ± 0.15 0 0 1,000 4,000
JF 2220 1.50 ± 0.15 0 0 1,000 4,000
JO 2220 2.40 ± 0.15 0 0 500 2,000
KB 2225 1.00 ± 0.15 0 0 1,000 4,000
KC 2225 1.10 ± 0.15 0 0 1,000 4,000
KD 2225 1.30 ± 0.15 0 0 1,000 4,000
KE 2225 1.40 ± 0.15 0 0 1,000 4,000
7" Reel 13" Reel 7" Reel 13" Reel
Thickness Case Thickness ±
Code Size1 Range (mm)
Paper Quantity1 Plastic Quantity
Package quantity based on finished chip thickness specifications.

1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1 N/A 2
Case Size Packaging Quantities (pieces/unit packaging)

EIA (in) Metric (mm) Minimum Maximum
0402 1005
0603 1608
0805 2012 50,000
1206 3216
1210 3225
1
1808 4520
1812 4532
1825 4564 20,000
2220 5650
2225 5664
1
The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for automotive grade products.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding anti-static Bulk Bag and automotive grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA Metric Density Level A: Density Level B: Density Level C:

Size Size Maximum (Most) Median (Nominal) Minimum (Least)
Code Code Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00
1
Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y Y
X X V2
C C
Grid Placement Courtyard
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Termination Finish TP
Profile Feature Maximum Ramp-up Rate = 3°C/second tP
SnPb 100% Matte Sn Maximum Ramp-down Rate = 6°C/second
TL
Preheat/Soak tL
Temperature
Temperature Minimum (TSmin) 100°C 150°C Tsmax
Temperature Maximum (TSmax) 150°C 200°C
Tsmin
Time (tS) from TSmin to TSmax 60 – 120 seconds 60 – 120 seconds ts
3°C/second 3°C/second
Ramp-Up Rate (TL to TP)
maximum maximum
25
Liquidous Temperature (TL) 183°C 217°C 25°C to Peak
Time
Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP) 235°C 260°C

Time Within 5°C of Maximum 20 seconds 30 seconds
Peak Temperature (tP) maximum maximum
6°C/second 6°C/second
Ramp-Down Rate (TP to TL)
maximum maximum
Time 25°C to Peak 6 minutes 8 minutes
Temperature maximum maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method

Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for
Board Flex JIS–C–6429
C0G. Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C

Solderability J–STD–002
b) Method B, category 3 at 215°C
c) Method D, category 3 at 260°C
Temperature Cycling JESD22 Method JA–104 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours ±4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
MIL–STD–202 Measurement at 24 hours ±4 hours after test conclusion.
Biased Humidity
Method 103 Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
MIL–STD–202 t = 24 hours/cycle. Steps 7a and 7b not required.
Moisture Resistance
Method 106 Measurement at 24 hours ±4 hours after test conclusion.
MIL–STD–202 −55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20
Thermal Shock
Method 107 seconds. Dwell time – 15 minutes. Air – air.
1,000 hours at 125°C with 2 X rated voltage applied excluding the following:
Case Size Capacitance Applied Voltage
MIL–STD–202
High Temperature Life
Method 108/EIA–198 0603 & 0805 ≥ 1.0 µF
1.5 X
1206 & 1210 ≥ 10 µF
MIL–STD–202
Storage Life 150°C, 0 VDC for 1,000 hours.
Method 108
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick
MIL–STD–202
Vibration 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
Method 204
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
MIL–STD–202
Mechanical Shock Figure 1 of Method 213, Condition F.
Method 213
MIL–STD–202
Resistance to Solvents Add aqueous wash chemical, OKEM Clean or equivalent.
Method 215
Storage & Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Construction (Typical)
Detailed Cross Section

Dielectric Material
(BaTiO3)
Barrier Layer Dielectric

(Ni) Material (BaTiO3)
Termination
Finish End Termination/
(100% Matte Sn) External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu) Barrier Layer
(Ni)
Termination
Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are Marking appears in legible contrast. Illustrated below
normally supplied unmarked. If required, they can be is an example of an MLCC with laser marking of “KA8”,
marked as an extra cost option. Marking is available which designates a KEMET device with rated capacitance
on most KEMET devices, but must be requested using of 100 µF. Orientation of marking is vendor optional.
the correct ordering code identifi er(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited 2-Digit
to the “K” character only. KEMET
ID Capacitance
Code
Laser marking option is not available on:
• C0G, ultra stable X8R and Y5V dielectric devices.
• EIA 0402 case size devices.
• EIA 0603 case size devices with fl exible termination
option.
• KPS commercial and automotive grade stacked
devices.
• X7R dielectric products in capacitance values outlined
below.
EIA Case Size Metric Size Code Capacitance

0603 1608 ≤ 170 pF
0805 2012 ≤ 150 pF
1206 3216 ≤ 910 pF
1210 3225 ≤ 2,000 pF
1808 4520 ≤ 3,900 pF
1812 4532 ≤ 6,700 pF
1825 4564 ≤ 0.018 µF
2220 5650 ≤ 0.027 µF
2225 5664 ≤ 0.033 µF
Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
9 0 1 2 3 4 5 6 7 8
Character
Capacitance (pF)
A 0.10 1.0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000
B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000
C 0.12 1.2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000
D 0.13 1.3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000
E 0.15 1.5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000
F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000
G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000
H 0.20 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000
J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000
K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000
L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000
M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000
N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000
P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000
Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000
R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000
S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000
T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000
U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000
V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000
W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000
X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000
Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000
Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000
a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000
b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000
d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000
e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000
f 0.50 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000
m 0.60 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000
n 0.70 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000
t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000
y 0.90 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000
Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
ET Chip and KPS orientation in pocket
KEM punched paper carrier.
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
Anti-static cover tape
or 16 mm carrier tape
180 mm (7.00") (0.10 mm (0.004") maximum thickness)
or
330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
Embossed Plastic Punched Paper New 2 mm Pitch Reel Options*

Tape
EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Packaging
(W)* Ordering Code Packaging Type/Options
Pitch (P1)* Pitch (P1)*
(C-Spec)
01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked
0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked
C-7081 Commercial grade 7" reel unmarked
0805 8 4 4 4 4
C-7082 Commercial grade 13" reel unmarked
1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size.
1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development.
≥ 1812 12 8 8 Benefits of Changing from 4 mm to 2 mm Pitching Spacing

KPS 1210 12 8 8 • Lower placement costs.
KPS 1812 16 12 12 • Double the parts on each reel results in fewer reel
and 2220
changes and increased effi ciency.
Array 0612 8 4 4
• Fewer reels result in lower packaging, shipping and
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. storage costs, reducing waste.
*Refer to Tables 6 and 7 for tolerance specifications.
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T P2
T2 (10 pitches cumulative E1
ØD0 P0
tolerance on tape ±0.2 mm)
A0
F
K0
W
B1 B0 E2
S1 P1
T1 Center Lines of Cavity Embossment

ØD1
For cavity size,
Cover Tape
see Note 1 Table 4
B1 is for tape feeder reference only,
including draft concentric about B0. User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern
Constant Dimensions — Millimeters (Inches)

D1 Minimum R Reference S1 Minimum T T1
Tape Size D0 E1 P0 P2
Note 1 Note 2 Note 3 Maximum Maximum
1.0 25.0
8 mm (0.039) (0.984)
1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100
12 mm (0.059 +0.004/−0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004)
(0.059) (1.181)
16 mm
Variable Dimensions — Millimeters (Inches)

B1 Maximum E2 T2 W
Tape Size Pitch F P1 A0,B0 & K0
Note 4 Minimum Maximum Maximum
4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3
8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327)
Single (4 mm) 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3
12 mm Note 5
and double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484)
12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3
16 mm Triple (12 mm) (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
Figure 2 – Punched (Paper) Carrier Tape Dimensions

T
(10 pitches cumulative E1
ØDo Po tolerance on tape ±0.2 mm)
A0
F
W
B0 E2
Bottom Cover Tape
P1 G
T1
Cavity Size,
T1 See
Top Cover Tape Center Lines of Cavity
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

R Reference
Tape Size D0 E1 P0 P2 T1 Maximum G Minimum Note 2
0.10
1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25
8 mm (0.004)
(0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984)
maximum
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B 0
2.0 ±0.05 8.3
8 mm Half (2 mm)
6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327)
Note 1
(0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3
8 mm Single (4 mm) (0.157 ±0.004) (0.327)
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength

8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation Maximum Component Rotation
Top View Side View
Typical Pocket Centerline
Tape Maximum °
° s
Width (mm) Rotation ( T)
Bo 8,12 20
16 – 200 10 Tape Maximum
°
Width (mm) Rotation ( S)
8,12 20
Typical Component Centerline 16 – 56 10
Ao 72 – 200 5
Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius

8 mm & 12 mm Tape 16 mm Tape Embossed Punched
Carrier Carrier
0.5 mm maximum 1.0 mm maximum
0.5 mm maximum 1.0 mm maximum
Bending R
R
Radius
Figure 6 – Reel Dimensions
Full Radius, Access Hole at W3 (Includes

See Note Slot Location flange distortion
(Ø 40 mm minimum) at outer edge)
W2 (Measured at hub)
A D (See Note) N
C
(Arbor hole
W1 (Measured at hub)
diameter)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
B (see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions

Metric will govern

Tape Size A B Minimum C D Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
12 mm or 1.5 13.0 +0.5/−0.2 20.2
(0.059) (0.521 +0.02/−0.008) (0.795)
330 ±0.20
16 mm (13.000 ±0.008)

Tape Size N Minimum W1 W2 Maximum W3
8 mm 8.4 +1.5/−0.0 14.4

(0.331 +0.059/−0.0) (0.567)
50 12.4 +2.0/−0.0 18.4 Shall accommodate tape
12 mm (1.969) (0.488 +0.078/−0.0) (0.724) width without interference
16.4 +2.0/−0.0 22.4
16 mm (0.646 +0.078/−0.0) (0.882)
Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier
Punched Carrier Carrier Tape

8 mm & 12 mm only
Round Sprocket Holes START
END
Top Cover Tape
Elongated Sprocket Holes

(32 mm tape and wider)
100 mm
minimum leader
Trailer Components 400 mm minimum
160 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber

Elongated Sprocket Holes Carrier Tape
(32 mm & wider tapes)
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
KEMET Electronics Corporation Sales Offices

For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
Mouser Electronics
Authorized Distributor
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X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) : Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCS)

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X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) : Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCS)

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

One world. One KEMET

Packaging C-Spec Ordering Options Table

Dimensions – Millimeters (Inches)

See Insulation Resistance Limit Table

Insulation Resistance Limit Table

Dissipation Factor (DF) Limit Table

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)

Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) cont'd

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes)

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) cont'd

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) cont'd

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Package quantity based on finished chip thickness specifications.

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities cont'd

Package quantity based on finished chip thickness specifications.

Table 2B – Bulk Packaging Quantities

Case Size Packaging Quantities (pieces/unit packaging)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

EIA Metric Density Level A: Density Level B: Density Level C:

Recommended Reflow Soldering Profile:

Peak Temperature (TP) 235°C 260°C

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress Reference Test or Inspection Method

a) Method B, 4 hours at 155°C, dry heat at 235°C

c) Method D, category 3 at 260°C

Storage & Handling

Detailed Cross Section

Barrier Layer Dielectric

Capacitor Marking (Optional):

EIA Case Size Metric Size Code Capacitance

Capacitor Marking (Optional) cont’d

Tape & Reel Packaging Information

Bar code label

Embossment or punched cavity

Embossed Plastic Punched Paper New 2 mm Pitch Reel Options*

≥ 1812 12 8 8 Benefits of Changing from 4 mm to 2 mm Pitching Spacing

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T1 Center Lines of Cavity Embossment

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Constant Dimensions — Millimeters (Inches)

Variable Dimensions — Millimeters (Inches)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Constant Dimensions — Millimeters (Inches)

Packaging Information Performance Notes

Tape Width Peel Strength

12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)

Figure 3 – Maximum Component Rotation

Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius

Figure 6 – Reel Dimensions

Full Radius, Access Hole at W3 (Includes

Table 8 – Reel Dimensions

Constant Dimensions — Millimeters (Inches)