Approval sheet

WW25W, WW20W, WW10W, WW12W,

WW08W, WW06W
±1%, ±5%
Thick Film Normal Low Ohm Chip Resistors
RoHS Exemption free and Lead free
Size 2512, 2010, 1210, 1206, 0805, 0603

*Contents in this sheet are subject to change without prior notice.

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Approval sheet

FEATURE
1. High power rating and low TCR
2. High reliability and stability
3. Reduced size of final equipment
4. RoHS exemption free and Lead free products

APPLICATION
• Power supply
• PDA
• Digital meter
• Computer
• Automotives
• Battery charger
• DC-DC power converter

DESCRIPTION
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
nominated value within tolerance which controlled by laser trimming of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is Tin (lead free) alloy.

Fig 1. Construction of Chip-R

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QUICK REFERENCE DATA

Item General Specification
Series No. WW25W WW20W WW10W WW12W WW08W WW06W
Size code 2512 (6432) 2010 (5025) 1210 ( 3225 ) 1206 ( 3216 ) 0805 ( 2012 ) 0603 ( 1608 )
Resistance ±5%, ±1%
Tolerance
Resistance 0.010Ω ~ 0.910Ω, 0.050Ω ~ 0.910Ω,
Range E24 E24

TCR (ppm/°C)
10 - 20mΩ: ±1000 10 - 20mΩ: ±1000 10 - 20mΩ: ±600 10 - 20mΩ: ±1000 10 - 20mΩ: ±1000 50 - 91mΩ: ±400
22 - 39mΩ: ±600 22 - 39mΩ: ±600 22 - 39mΩ: ±400 22 - 39mΩ: ±600 22 - 39mΩ: ±600 100 - 910mΩ: ±200
40 - 47mΩ: ±200 40 - 47mΩ: ±200 40 - 47mΩ: ±200 40 - 47mΩ: ±200 40 - 47mΩ: ±400
50 - 91mΩ: ±100 50 - 91mΩ: ±100 50 - 91mΩ: ±100 50 - 91mΩ: ±100 50 - 91mΩ: ±200
100 - 910mΩ: ±100 100 - 910mΩ: ±100 100 - 910mΩ: ±100 100 - 910mΩ: ±100 100 - 910mΩ: ±100

Max. dissipation
1W 3/4W 2/3 W 1/3 W 1/4 W 1/8 W
at Tamb=70°C
Operation
-55 ~ +155’C
temperature

MECHANICAL DATA

Symbol WW25W WW20W WW10W WW12W WW08W WW06W

L 6.30 ± 0.20 5.00 ± 0.20 3.10 ± 0.10 3.10 ± 0.10 2.00 ± 0.10 1.60 ± 0.10

W 3.10 ± 0.20 2.50 ± 0.20 2.60 ± 0.10 1.60 ± 0.10 1.25 ± 0.10 0.80 ± 0.10

T 0.60 ± 0.15 0.60 ± 0.10 0.55 ± 0.10 0.55 ± 0.10 0.50 ± 0.10 0.45 ± 0.10

Tt 0.60 ± 0.25 0.60 ± 0.25 0.50 ± 0.25 0.50 ± 0.25 0.40 ± 0.20 0.30 ± 0.20

Tb 0.90 ± 0.25 0.60 ± 0.25 0.50 ± 0.25 0.50 ± 0.25 0.40 ± 0.20 0.30 ± 0.20

RECOMMENDED SOLDERING PAD

Symbol WW25W WW20W WW10W WW12W WW08W WW06W

WL 3.70mm 3.00mm 3.00mm 1.80mm 1.30mm 0.90mm

D 1.60mm 1.50mm 1.30mm 1.30mm 1.15mm 1.00mm

L 7.60mm 6.80mm 4.70mm 4.70mm 3.50mm 3.00mm

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MARKING

4-digits marking for 2512, 2010, 1210, 1206, 0805 size
Each resistor is marked with a four-digit code on the protective coating to designate the nominal resistance
value.

3-digits marking for 0603 size

Each resistor is marked with a three -digit code on the protective coating to designate the nominal
resistance value.

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FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of ±5% &
±1%. The values of the E24 series are in accordance with “IEC publication 60063”.

Derating curve
The power that the resistor can dissipate depends on the operating temperature; see Fig.2

Figure 2 Maximum dissipation in percentage of rated power as a

function of the ambient temperature

MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by
automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.

SOLDERING CONDITION
The robust construction of chip resistors allows
them to be completely immersed in a solder bath
of 260°C for 10 seconds. Therefore, it is possible
to mount Surface Mount Resistors on one side of
a PCB and other discrete components on the
reverse (mixed PCBs).
Surface Mount Resistors are tested for
solderability at 235°C during 2 seconds. The test
condition for no leaching is 260°C for 30 seconds.
Typical examples of soldering processes that
provide reliable joints without any damage are
given in Fig 3.

Fig 3. Infrared soldering profile

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CATALOGUE NUMBERS
The resistors have a catalogue number starting with:
WW12 W R020 F T L
Size code Type code Resistance code Tolerance Packaging code Termination
code
WW25 : 2512 W : Thick film 0.020Ω = R020 J : ±5% T : 7” Reel taping
Power low ohm L = Sn base
WW20 : 2010 low TCR 0.510Ω = R510 F : ±1% Q : 10” Reel taping (lead free)
WW10 : 1210 0.025Ω = R025 G : 13” Reel taping
WW12 : 1206
WW08 : 0805
WW06 : 0603

Tape packaging WW10, WW12,WW08, WW06 : 8mm width paper taping

5,000pcs per 7” reel;
10,000pcs per 10” reel;
20,000pcs per 13” reel.

WW25, WW20: 12mm width emboss taping

4,000pcs per 7” reel;
8,000pcs per 10” reel;
16,000pcs per 13” reel.

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TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)

TEST PROCEDURE REQUIREMENT
Temperature Coefficient of Natural resistance change per change in degree centigrade. Refer to
Resistance(T.C.R) R2 − R1 “QUICK REFERENCE DATA”
× 106
R1 (t2 − t1 )
Clause 4.8 (ppm/°C) t1 : 25°C

R1 : Resistance at reference temperature 25°C

R2 : Resistance at test temperature 155°C
Short time overload Permanent resistance change after a 5second application of a 5 J: ∆R/R max. ±(2%+0.5mΩ)
(S.T.O.L) times rated power. F: ∆R/R max. ±(1%+0.5mΩ)
Clause 4.13
Solderability Un-mounted chips completely immersed for 3±0.5 second in a SAC good tinning (>95% covered)
solder bath at 245℃±2℃ no visible damage
Clause 4.17
Resistance to soldering Un-mounted chips completely immersed for 10±1 second in a SAC no visible damage
heat(R.S.H)
solder bath at 260℃±5ºC J: ∆R/R max. ±(1%+0.5mΩ)
Clause 4.18
F: ∆R/R max. ±(0.5%+0.5mΩ)
Temperature cycling 30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes no visible damage
Clause 4.19 at +155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous J: ∆R/R max. ±(1%+0.5mΩ)
cycles F: ∆R/R max. ±(0.5%+0.5mΩ)
Load life (endurance) 1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller J: ∆R/R max. ±(3%+0.5mΩ)
70±2ºC, 1.5 hours on and 0.5 hours off
Clause 4.25 F: ∆R/R max. ±(1%+0.5mΩ)
Load life in Humidity 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber J: ∆R/R max. ±(3%+0.5mΩ)
controller at 40°C±2°C and 90~95% relative humidity, 1.5hours on
Clause 4.24 F: ∆R/R max. ±(1%+0.5mΩ)
and 0.5 hours off

Bending strength Resistors mounted on a 90mm glass epoxy resin PCB(FR4); no visible damage
Clause 4.33 bending : 3mm for 0603/0805, 2mm for 1206 and above sizes, once J: ∆R/R max. ±(1%+0.5mΩ)
for 10 seconds F: ∆R/R max. ±(0.5%+0.5mΩ)
Adhesion Pressurizing force: 5N, Test time: 10±1sec. No remarkable damage or
Clause 4.32 removal of the terminations
Insulation Resistance Test voltage: 100+/-15V I.R≧1GΩ
Clause 4.6

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PACKAGING
Paper Tape specifications (unit :mm)

Series No. A B W F E
WW25W 6.70±0.20 3.50±0.20 12.00±0.30
WW20W 5.50±0.20 2.80±0.20 12.00±0.30
WW10W 3.60±0.20 3.00±0.20
3.50±0.20 1.75±0.10
WW12W 3.60±0.20 2.00±0.20
8.00±0.30
WW08W 2.40±0.20 1.65±0.20
WW06W 1.90±0.20 1.10±0.20

Series No. P1 P0 ΦD T
WW25W Max. 1.2
WW20W Max. 1.2
WW10W Max. 1.0
4.00±0.10 4.00±0.10 Φ1.50 +−00..10
WW12W Max. 1.0
WW08W Max. 1.0
WW06W Max. 0.8

Reel dimensions

Symbol A B C D
7” reel Φ178.0±2.0 Φ60.0±1.0
10.0±1.5 ( 8mm tape )
10” reel Φ254.0±2.0 Φ100.0±1.0 13.0±0.5
13.8±1.5 (12mm tape)
13: reel Φ330.0±2.0 Φ100.0±1.0

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