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    Cpu - Dg35Ec

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    ANIKET HULAGE
    The document describes the components and thermal analysis of a CPU module. It lists the key components, their specifications including maximum operating temperatures, thermal power dissipation and ambient temperature. It then discusses the thermal modeling and simulations conducted in IcePak to analyze the effect of adding a heat sink, cooling fan and other components. The simulations show adding both a heat sink and cooling fan is most effective in reducing temperatures, and turbulence from other components further improves heat transfer.

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    © All Rights Reserved
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    Cpu - Dg35Ec

    Uploaded by

    ANIKET HULAGE
    42 views42 pages
    The document describes the components and thermal analysis of a CPU module. It lists the key components, their specifications including maximum operating temperatures, thermal power dissipation and ambient temperature. It then discusses the thermal modeling and simulations conducted in IcePak to analyze the effect of adding a heat sink, cooling fan and other components. The simulations show adding both a heat sink and cooling fan is most effective in reducing temperatures, and turbulence from other components further improves heat transfer.

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    LID DRIVEN CAVITY

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    tnect

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    The document describes the components and thermal analysis of a CPU module. It lists the key components, their specifications including maximum operating temperatures, thermal power dissipation and ambient temperature. It then discusses the thermal modeling and simulations conducted in IcePak to analyze the effect of adding a heat sink, cooling fan and other components. The simulations show adding both a heat sink and cooling fan is most effective in reducing temperatures, and turbulence from other components further improves heat transfer.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    42 views42 pages

    Cpu - Dg35Ec

    Uploaded by

    ANIKET HULAGE
    The document describes the components and thermal analysis of a CPU module. It lists the key components, their specifications including maximum operating temperatures, thermal power dissipation and ambient temperature. It then discusses the thermal modeling and simulations conducted in IcePak to analyze the effect of adding a heat sink, cooling fan and other components. The simulations show adding both a heat sink and cooling fan is most effective in reducing temperatures, and turbulence from other components further improves heat transfer.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 42

    CPU - DG35EC

    Pranjal Jhaveri (15D170001)


    Fatima Saleh (15D170002)
    Richa Agarwal (150100070)
    Kartik Bilolkar (150100036)
    Mrunal Chavan (15D110011)
    Aniket Hulage (183100026)
    Contribution
    Power Circuit

    DDR Memory

    Fan

    Processor +
    Heat Sink

    Ventilation
    GMCH

    I/O Chip
    Ventilation
    Airflow inside CPU
    Intel 82G35 GMCH
    Maximum Allowable Temperature 97°C

    Thermal Design Power 28 W

    Heat Flux 0.234 MW/m^2

    Ambient Temperature 35°C


    Intel 82801HB ICH8
    Maximum Allowable Temperature 92°C

    Thermal Design Power 3.7 W

    Heat Flux 5.47 kW/m^2

    Ambient Temperature 35°C


    Intel Q6600 Processor
    Maximum Allowable Temperature 71°C

    Thermal Design Power 95 W

    Heat Flux 0.154 MW/m^2

    Fan flow rate 25-30 CFM (normal) -


    60-70CFM(max)

    Fan RPM 1000-3000

    Ambient Temperature 35°C


    DDR RAM
    Maximum Allowable Temperature 85°C

    Thermal Design Power 400 mW


    (per component)

    Voltage Regulator Area


    Maximum Allowable Temperature 95°C
    Observations
    Observations :
    ● Dust accumulation :
    Observations :
    ● Thermal interface materials :
    Thermal Analysis of SMPS Module
    Description of the SMPS Module
    ● SMPS (Switched-Mode Power Supply) module transfers
    power from an AC source to CPU, while converting
    voltage and current characteristics.
    • This is done by switching
    ideally lossless storage
    elements, such as
    inductors and capacitors,
    between different
    electrical configurations.

    Source: Wikipedia &


    Losses in the SMPS Module
    ● Rectifier voltage drop
    ● Switching losses in the transistors
    ● Equivalent series resistance in the inductor and capacitors
    ● Core losses in the inductor
    All these effects contribute to a typical efficiency of 60–70%.
    However, by optimizing the SMPS design,
    • Such as choosing the optimal switching frequency
    • Avoiding saturation of inductors, and active rectification
    Source: Wikipedia
    Components of the SMPS Module
    Primary side Transformers Secondary side
    Heat Sink Heat Sink

    Output filter
    capacitors
    Input filter
    capacitors Digital – Analog
    Comparator

    Fan SMPS
    Comparator
    Top View
    Components of the SMPS Module
    Rectifiers
    (Total No.: 6) Output Filter Coil
    (Inductor)

    Transistor
    Side Views
    Specifications of the SMPS Module

    Source: technical specification label on the module cover


    Assumptions for Thermal Modelling
    • Locations of thermal power dissipation:
    • Since both heat sinks are directly mounted on top of the Rectifiers, it is assumed that the majority of power is
    dissipated by Rectifiers
    • Assuming the power dissipated by other
    components to be negligible in comparison
    to Rectifiers

    • Assuming an optimized electrical design of


    the module, we should have the overall power
    conversion efficiency of about 95%. This implies that,
    0.05 * 300 W = 15 W of power is collectively dissipated through the heat sinks.

    Source: Wikipedia
    Boundary conditions used for the
    simulations
    • Natural convection boundary condition is assumed for the top and side faces.
    • Typical HTCs for natural convection are assumed to be 4.4 (W/m *K) in case of vertical plate & 5.6 (W/m *K) in case of
    2 2

    horizontal plate.

    • The cooling fan occupies a certain portion of area of the front face and rest of the face is modelled to have a natural
    convection boundary condition. HTC for this case is assumed to be 4.4 (W/m2*K).

    Source: https://quickfield.com/natural_convection.htm
    Boundary conditions used for the
    simulations
    • The back face of module is modelled as a grill, which
    allows the air to flow out of the module.
    • Forced convection boundary
    condition is assumed at the
    bottom face due to the presence
    of cooling fan for Motherboard.
    Typical HTC is assumed to be 20
    (W/m2*K)
    • Ambient temperature is assumed
    to be 25 C
    Sources:
    • Max. safe Temp. for Rectifier is
    https://www.engineeringtoolbox.com/convective-heat-transfer-d_430.html
    Specifications of the Cooling Fan
    • Cooling fan works as an
    exhaust
    • This is evident from the
    clockwise rotation of its
    blades
    • Average airflow of the fan is
    about 90 CFM.
    • Average rated speed of the fan
    is about 6600 RPM.
    • Average static pressure for the
    fan is 266 Pa.
    Source: https://products.sanyodenki.com/en/contents/hp0213/list.php?CNo=213&ProSStyle=1&PNo=1
    • Linear model of the Fan Curve
    Model created for analysis in IcePak
    Front
    Face
    Detailed view of the Model
    Solutions obtained from the Simulation
    • Number of iterations considered for the solutions: 25
    • The solutions are observed to converge, suggesting that
    the number of iterations are sufficient
    Considering Different Cases

    Case Presence of Presence of Presence of Other


    Cooling Fan Heat Sink Components
    (a) No No No
    (b) No Yes No
    (c) Yes No No
    (d) Yes Yes No
    (e) Yes Yes Yes
    Effect of Addition of a Heat Sink
    Case (a): Without both Heat Sink & Cooling Fan Case (b): With Heat Sink, but no Cooling Fan

    Max. Temp.: 371 C (approx.) Max. Temp.: 189 C (approx.)


    Effect of Addition of a Cooling Fan
    Case (a): Without both Heat Sink and Cooling Fan Case (c): With Cooling Fan, but no Heat Sink

    Max. Temp.: 371 C (approx.) Max. Temp.: 252 C (approx.)


    Adding just a cooling fan without a heat sink is not that effective.
    Effect of Addition of both a Cooling Fan
    and a Heat Sink
    Case (a): Without both Heat Sink and Cooling Fan Case (d): With both Cooling Fan and Heat Sink

    Max. Temp.: 371 C (approx.) Max. Temp.: 135 C (approx.)


    Adding both a cooling fan as well as a heat sink is quite effective
    Effect of presence of other components
    Case (d): With Heat Sink, Cooling Case (e): With Cooling Fan, Heat
    Fan, but no other components Sink and also other components

    Max. Temp.: 135 C (approx.) Max. Temp.: 125 C (approx.)


    Extra turbulence in the flow seems to be a plausible explanation
    Streamlines for both the cases
    Case (d): With Heat Sink, Cooling Case (e): With Cooling Fan, Heat
    Fan, but no other components Sink and also other components

    Max. Temp.: 135 C (approx.) Max. Temp.: 125 C (approx.)


    Extra turbulence enables better mixing and hence better heat transfer
    Summary of obtained Results
    • For conditions of this problem, the use of just a heat sink is more effect than just using a fan for cooling.
    • Addition of both heat sink and fan significantly reduces the maximum temperature in the system. For conditions of this
    problem, overall cooling ensures that the operating temperatures remain within the safe temperature range.

    • Effect of turbulence is observed to result in better heat transfer.


    Distribution of Effort in each task

    Task Kartik Bilolikar Aniket Hulage


    Literature review 70 % 30 %
    Resolving technical issues 50 % 50 %
    IcePak Modelling 30 % 70 %
    IcePak Simulations 30 % 70 %
    Presentation 70 % 30 %

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