Zwickau University of Applied Sciences EMC Lab Testing For Automotive Ethernet Physical Layer Qualification

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IEEE 802.

3 RTPGE PHY Study Group

Zwickau University of Applied Sciences


EMC Lab Testing for Automotive
Ethernet Physical Layer Qualification

Michael Jones
Micrel Semiconductor

September, 2012 - Geneva


Introduction

• Overview of the work Zwickau University of


Applied Sciences (FTZ) have performed to aid
the qualification of Ethernet Physical Layer for
Automotive applications
• We feel that these test methods will be useful
information for the RTPGE Study Group
Introduction to FTZ
• Expert knowledge of EMC test methodology
• Vast experience in Automotive EMC qualifications
• Commissioned by the German OEM car makers to
develop lab bench EMC test methods
• Reduces the high cost & limited availability of stripline testing
facilities
• Through extensive testing (since 2008), excellent
correlation has been shown between FTZ test
setup and classic stripline tests
• The FTZ testing is now the preferred 1st step before
strip line testing is performed in Europe
• Similar to UNH IOL
Note – Any test results in this presentation have been performed by FTZ
FTZ lab vs Classic Stripline Testing

FTZ Lab based Stripline (chamber) based

RF Emissions Stripline Emissions


Based on IEC 61967-1/4 Based on CISPR25
FTZ RF Board FTZ Dummy ECU Board

Direct Power Injection Bulk Current Immunity


(DPI) (BCI)
Based on IEC 62132-1/4 Based on ISO 11452-4
FTZ RF Board FTZ Dummy ECU Board
RF Test Board Functional Diagram

µC Used to generate BIN Filter network, including


traffic if the PHY cannot transformer, termination,
TC Ethernet transceiver ESD protection
under test (DUT) CN EMC Coupling network
RF Board
PHY under test

Test Points
DPI / RF

Traffic Generator Board

• Same board design / setup / test method


• Consistent comparable results
Coupling Networks
Line Emissions coupling network

Line Immunity coupling network

NOTE: For worse case testing


coupling network is modified to
+/-2.5% unbalanced
Voltage Supply Emissions coupling network
Emission of RF Disturbances
(RF Test Board)
RF Emissions Functional Diagram
Photo of the RF Emissions Test Setup
Rohde & Schwarz ESCI7 Standard Compliant Measuring Receiver

Test controller PHY under test


Typical 100BASE-TX PHY Emissions over UTP

• High Energy 50MHz to 100MHz due to line data


• Sensitive to transformer, termination
• 25MHz /125MHz (line) harmonics
Simulating worse case - Unsymmetrical Testing

• Coupling network is modified to +/-2.5% unbalanced


• Simulates worse case conditions
• Transformer, termination, connector….
Immunity to RF Disturbances
(RF Test Board)
DPI Immunity Functional Diagram
Example of PHY passing DPI Immunity
39dBm DPI equivalent
to 106dBuA / 200mA
(Level 5) BCI
RF Emissions & Immunity using
Stripline methods
(Dummy ECU Test Board)
Dummy ECU Test Board Functional Diagram

1.7m–2m cable

• Same schematic / layout used as the RF Test Board


Strip line Emission test

• Stripline emission measurement according to CISPR25 with 1.8m


cable length
• 2x2 unshielded twisted pair
• Dummy ECU used : Processor + PHY (DUT) board
• Fibre link to PC running monitoring tool
• Any errors monitored
Bulk Current Immunity test
Dummy ECU - DUT2
Dummy ECU – DUT1

2x2 UTP (1.8m)

BCI clamp

Power Fibre link to PC

• BCI test according to ISO 11452-4 (substitution method) with


1,8m cable length
• 2x2 unshielded twisted pair
• Dummy ECU used : Processor + PHY (DUT) board
• Fibre link to PC running monitoring tool
• Link, CRC and Flow control errors monitored for both nodes
Example of OEM BCI Immunity limits

[mA]
200mA
(Level 5)

100mA
(Level 4)
Summary

• Such test methodologies can provide a means


to qualifying the Ethernet PHY Layer
• PHY Transceiver and Network Interface (transformer,
termination etc)
• Lowers the cost and time versus classic stripline
methods
• Testing performed on lab bench and not EMC Chamber
• Extremely useful during pre-qualification /
selection of Ethernet PHY Layer components
IEEE 802.3 RTPGE PHY Study Group

Thank you

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