7 A H-Bridge For DC-Motor Applications TLE 7209-2R: Final Datasheet

7 A H-Bridge for DC-Motor Applications TLE 7209-2R
Final Datasheet
1 Overview
1.1 Features
Operating supply voltage 5 V to 28 V
Typical RDSon = 150 m for each output transistor
(at 25 C)
Continuous DC load current 5 A (TC < 100 C)
Output current limitation at typ. 6.6 A 1.1 A
Short circuit shut-down for output currents over 8 A
Logic- inputs TTL/CMOS-compatible
Output switching frequency up to 30 kHz
Rise and fall times optimized for 0.5-2 kHz
Over-temperature protection
Short circuit protection
Undervoltage disable function
Diagnostic by SPI or Status-Flag (configurable)
Enable and Disable inputs
P-DSO-20-12 power package
Type Ordering Code Package

TLE 7209-2R Q67007-A9702 P-DSO-20-12
Functional Description
The TLE 7209-2R is an intelligent full H-Bridge, designed for the control of DC and
stepper motors in safety critical applications and under extreme environmental
conditions.
The H-Bridge is protected against over-temperature and short circuits and has an under
voltage lockout for all the supply voltages VS (main DC power supply). All malfunctions
cause the output stages to go tristate.
The device is configurable by the DMS pin. When grounded, the device gives diagnostic
information via a simple error flag. When supplied with VCC = 5 V, the device works in
SPI mode. In this mode, detailed failure diagnosis is available via the serial interface.
Final Datasheet 1 V1.2, 2004-jul-01

TLE 7209-2R
Overview
1.2 Pin Configuration
GND 1 20 GND
S C K /S F 2 19 IN 2
IN 1 3 18 D IS
VS CP 4 17 CSN
VS 5 16 VS
O UT1 6 15 O U T2
O UT1 7 14 O U T2
SDO 8 13 EN
SDI 9 12 DMS
GND 10 11 GND
M etal slug is
connected to G N D
pins internally
Figure 1 Pinout TLE 7209-2R
Table 1 Pin Definitions and Functions

Pin. No. Symbol Function
1 GND Ground
2 SCK/SF SPI-Clock/Status-flag
3 IN1 Input 1
4 VSCP Supply voltage for internal charge pump
5, 16 VS Supply voltage; connect pins externally
6, 7 OUT1 Output 1; connect pins externally
8 SDO Serial data out
9 SDI Serial data in
10 GND Ground
11 GND Ground

TLE 7209-2R
Overview
Table 1 Pin Definitions and Functions (contd)

Pin. No. Symbol Function
12 DMS Diagnostic-Mode selection
(+ Supply voltage for SPI-Interface)
13 EN Enable
14, 15 OUT2 Output 2; connect pins externally
17 CSN Chip Select (low active)
18 DIS Disable
19 IN2 Input 2
20 GND Ground

TLE 7209-2R
Overview
1.3 Block Diagram
DMS VSCP VS
Charge
Bias
Pump
Fault-
Detect
EN
DIS
Driver
CSN 8 Bit OUT 1
SDI Logic &
SPI
SDO and
Latch Gate- OUT 2
SCK/SF
Control
IN1 Direct
IN2 Input
Under
Voltage
Over
Temperature
GND
Figure 2 Block Diagram TLE 7209-2R

TLE 7209-2R
Circuit Description
2 Circuit Description
2.1 Control Inputs

The bridge is controlled by the Inputs IN1, IN2, DIS and EN as shown in Table 2. The
outputs OUT1 and OUT2 are set to High or Low by the parallel inputs IN1 and IN2,
respectively. In addition, the outputs can be disabled (set to tristate) by the Disable and
Enable inputs DIS and EN.
Inputs IN1, IN2 and DIS have an internal pull-up. Input EN has an internal pull-down.
Table 2 Functional Truth Table

Pos. DIS EN IN1 IN2 OUT1 OUT2 SF1) SPI2)
DIA_REG
1. Forward L H H L H L H see
2. Reverse L H L H L H H Chapter 2.4.2
3. Free-wheeling low L H L L L L H
4. Free-wheeling high L H H H H H H
5. Disable H X X X Z Z L
6. Enable X L X X Z Z L
7. IN1 disconnected L H Z X H X H
8. IN2 disconnected L H X Z X H H
9. DIS disconnected Z X X X Z Z L
10. EN disconnected X Z X X Z Z L
11. Current limit. active L H X X Z Z H
12. Under Voltage X X X X Z Z L
13. Over-temperature X X X X Z Z L
14. Over-current X X X X Z Z L
1)
If Mode Status-Flag is selected (see Chapter 2.4)
2)
If Mode SPI-Diagnosis is selected (see Chapter 2.4)

TLE 7209-2R
Circuit Description
2.2 Power Stages

Four n-channel power-DMOS transistors build up the output H-bridge. Integrated circuits
protect the outputs against over current and over-temperature if there is a short-circuit to
ground, to the supply voltage or across the load. Positive and negative voltage spikes,
which occur when switching inductive loads, are limited by integrated freewheeling
diodes. To drive the gates of the high-side DMOS, an internal charge pump is integrated
to generate a voltage higher than the supply voltage.
2.2.1 Chopper Current Limitation

To limit the output current at low power loss, a chopper current limitation is integrated as
shown in Figure 3. The current is measured by sense cells integrated in the low-side
switches. When the current limit IL has been exceeded for a time tb, all output stages are
switched off for a fixed time ta.
Blanking time tb
Current limit IL
IOUT
Switch-off time ta
time
Figure 3 Chopper current limitation

TLE 7209-2R
Circuit Description
2.2.2 Temperature-depending Current Reduction

For TILR < Tj < TSD the current limit decreases from IL = 6.6 A 1.1 A to
IL = 2.5 A 1.1 A as shown in Figure 4
A
6.6A
tolerance of temperature range of over-

dependent current temperature shut-down
IL
reduction
2.5A
Tj TILR TSD C
Figure 4 Temperature dependent current reduction
2.3 Protection
The TLE 7209-2R is protected against short circuits, overload and invalid supply voltage
by the following measures:
2.3.1 Short circuit to Ground

The high-side switches are protected against a short of the output to ground by an over
current shut-down. If a high-side switch is turned on and the current rises above the short
circuit detection current IOUK all output transistors are turned off after a typical filter time
of 2 s, and the error bit Short Circuit to Ground on output 1 (2), SCG1 (SCG2) is stored
in the internal status register.
2.3.2 Short circuit to VS

Due to the chopper current regulation, the low-side switches are already protected
against a short to the supply voltage. To be able to distinguish a short circuit from normal
current limit operation, the current limitation is deactivated for the blanking time tb after
the current has exceeded the current limit threshold IL. If the short circuit detection
current IOUK is reached within this blanking time, a short circuit is detected (see
Figure 5). All output transistors are turned OFF and the according error bit Short Circuit
to Battery on output 1 (2), SCB1 (SCB2) is set.

TLE 7209-2R
Circuit Description
IN
IN
IOUK IOUK
tb ta tb tb
IL IL
IOUT
IOUT
time time
Figure 5 Short to Vs detection. Left: normal operation. Right: short circuit is

detected
2.3.3 Short circuit across the load

If short circuit messages from high- and low-side switch occur simultaneously within a
delay time of typically 2s, the error bit Short Circuit Over Load, SCOL is set.
2.3.4 Over-Temperature
In case of high DC-currents, insufficient cooling or high ambient temperature, the chip
temperature may rise above the thermal shut-down temperature TSD. In that case, all
output transistors are shut-down and the error-bit Over-Temperature, OT is set.
2.3.5 Under-Voltage shut-down

If the supply-voltage at the VS pins falls below the under-voltage detection threshold, the
outputs are set to tristate and the error-bit Under-Voltage at VS is set.
2.4 Diagnosis
The Diagnosis-Mode can be selected between SPI-Diagnosis and Status-Flag
Diagnosis. The choice of the Diagnosis-Mode is selected by the voltage-level on Pin 12
(DMS Diagnosis Mode Selection):
DMS = GND, Status-Flag Mode
DMS = VCC, SPI-Diagnosis Mode
For the connection of Pins SDI, SDO, CSN and SCK/SF see Figure 14 and Figure 15.

TLE 7209-2R
Circuit Description
2.4.1 Status-Flag (SF) Mode (DMS = GND)
2.4.1.1 SF output
In SF-mode, pin 2 is used as an open-drain output status-flag. The pin has to be pulled
to the logic supply voltage with a pull-up resistor, 47 kOhm recommended.
In case of any failure that leads to a shut-down of the outputs, the status-flag is set (e.g.
SF pin pulled to low). These failures are:
Under Voltage on VS
Short circuit of OUT1 or OUT2 against VS or GND
Short circuit between OUT1 and OUT2
Over-current
Over-temperature
SF is also pulled low when the outputs are disabled by EN or DIS.
2.4.1.2 Fault storage and reset

In case of under-Voltage, the failure is not latched. As soon as VS falls below the
under-Voltage detection threshold, the output stage switches in tristate and the status-
flag is set from high level to low-level. If the voltage has risen above the specified value
again, the output stage switches on again and the status-flag is reset to high-level.
The Under Voltage failure is shown at the SF pin for VS in the voltage range below the
detection threshold (typical 4.2V) down to 2.5V.
In the SF-mode, all internal circuitry is supplied by the voltage on VS. For that reason,
a loss of VS supply voltage leads to a reset of all stored information (Power-ON-
Reset). This Power-ON-Reset occurs as soon as under-Voltage is detected on VS
In case of short circuit, over-current or over-temperature, the fault will be stored.
The output stage remains in tristate and the status-flag at low-level until the error is
reset by one of the following conditions: H -> L on DIS, L -> H on EN or Power-ON
Reset.
2.4.2 SPI-Mode (DMS = 5V)
2.4.2.1 SPI-Interface
The serial SPI interface establishes a communication link between TLE 7209-2R and the
systems microcontroller. The TLE 7209-2R always operates in slave mode whereas the
controller provides the master function. The maximum baud rate is 2 MBaud (200pF on
SDO).
By applying an active slave select signal at CSN the TLE 7209-2R is selected by the SPI
master. SDI is the data input (Slave In), SDO the data output (Slave Out). Via SCK
(Serial Clock Input) the SPI clock is provided by the master. In case of inactive slave
select signal (High) the data output SDO goes into tristate.

TLE 7209-2R
Circuit Description
The first two bits of an instruction may be used to establish an extended device-
addressing. This gives the opportunity to operate up to 4 Slave-devices sharing one
common CSN signal from the Master-Unit (see Figure 7)
S P I p o w e r-
DMS
s u p p ly
CSN S P I - C o n t r o l:
SCK
- > s t a t e m a c h in e
- > c lo c k c o u n t e r
- > in s t r u c t io n r e c o g n i t io n
SDI
s h if t - r e g i s t e r 8
SDO
D IA _ R E G 8
R eset
D ia g n o s t ic s
D IS
OR DMS
EN U n d e r-
v o lt a g e
Figure 6 SPI block-diagram
2.4.2.2 Characteristics of the SPI Interface

1. When DMS is > 3.5V, the SPI is active, independently of the state of EN or DIS. During
active reset conditions (DMS < 3.5V) the SPI is driven into its default state. When reset
becomes inactive, the state machine enters into a wait-state for the next instruction.
2. If the slave select signal at CSN is inactive (high), the state machine is forced to enter
the wait-state, i.e. the state machine waits for the following instruction.
3. During active (low) state of the select signal CSN the falling edge of the serial clock
signal SCK will be used to latch the input data at SDI. Output data at SDO are driven
with the rising edge of SCK (see timing diagram Figure 13)
4. Chip-address:
In order to establish the option of extended addressing the uppermost two bits of the
instruction-byte (i.e the first two SDI-bits of a Frame) are reserved to send a chip-
address. To avoid a bus conflict the output SDO must stay high impedance during the
addressing phase of a frame (i.e. until the address-bits are recognized as valid chip-
address). If the chip-address does not match, the data at SDI will be ignored and SDO
remains high impedance for the complete frame. See also Figure 7
5. Verification byte:
Simultaneously to the receipt of an SPI instruction TLE 7209-2R transmits a
verification byte via the output SDO to the controller. Refer to Figure 8. This byte
indicates normal or abnormal operation of the SPI. It contains an initial bit pattern and
a flag indicating an error occurred during the previous access.

TLE 7209-2R
Circuit Description
6. Because only read access is used in the TLE 7209-2R, the SDI data-bits (2nd byte)
are not used
7. Invalid instruction/access:
An instruction is invalid if an unused instruction code is detected (see tables with SPI
instructions). In case an unused instruction code occurred, the data byte ffhex (no
error) will be transmitted after having sent the verification byte. This transmission
takes place within the same SPI-frame that contained the unused instruction byte. In
addition any transmission is invalid if the number of SPI clock pulses (falling edge)
counted during active CSN differs from exactly 16 clock pulses. If an invalid instruction
is detected, bit TRANS_F in the following verification byte (next SPI transmission) is
set to HIGH. The TRANS_F bit must not be cleared before it has been sent to the
microcontroller.
8. Transfer error bit TRANS_F:
The bit TRANS_F indicates an error during the previous transfer. An error is
considered to have occurred when an invalid command was sent, the number of SPI
clock pulses (falling edge) counted during active CSN was less than or greater than
16 clock pulses, or SPI clock (SCK) was logical high during falling edge of CSN.

TLE 7209-2R
Circuit Description
SDO remains tristated Address sent by Correct addres is recognized,

after CSN active master is "00" data transmitted to SDO
CSN
SCK 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
SDI 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
SDO Z 5 4 3 2 1 0 7 6 5 4 3 2 1 0
SDO remains tristated Address sent by master Correct addres is not recognized, SDO
after CSN active is differnt from "00" remains tristated and SDI data are ignored
CSN
SCK 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
SDI 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
SDO Z
Figure 7 Bus-arbitration by chip-address

TLE 7209-2R
Circuit Description
2.4.2.3 SPI-Communication
The 16 input bits consist of the SPI-instruction byte and a second, unused byte. The 16
output bits consist of the verification-byte and the data-byte (see also Figure 8). The
definition of these bytes is given in the subsequent sections.
CSN
SCK 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
SDI MSB SPI Instruction LSB not used
SDO MSB Verification byte LSB MSB data-byte LSB
Figure 8 SPI communication
2.4.2.4 SPI instruction

The uppermost 2 bit of the instruction byte contain the chip-address. The chip-address
of the TLE 7209-2R is 00. During read-access, the output data according to the register
requested in the instruction byte are applied to SDO within the same SPI frame. That
means, the output data corresponding to an instruction byte sent during one SPI frame
are transmitted to SDO during the same SPI frame.
Table 3 SPI Instruction Format

MSB
7 6 5 4 3 2 1 0
0 0 INSTR4 INSTR3 INSTR2 INSTR1 INSTR0 INSW
Table 4 SPI instruction Description
Bit Name Description
7,6 CPAD1,0 Chip Address (has to be 0, 0)
5-1 INSTR (4-0) SPI instruction (encoding)
0 INSW Even parity

TLE 7209-2R
Circuit Description
Table 5 SPI Instruction-Bytes Encoding

SPI Instruction Encoding Description
bit 7,6 bit 5-1 Bit 0
CPAD1,0 INSTR(4-0) INSW
RD_IDENT 00 00000 0 read identifier
RD_VERSION 00 00001 1 read version
RD_DIA 00 00100 1 read DIA_REG
00 all others x unused, TRANS_F is set to high,
ff_hex is sent as data bit
all others xxxxx x invalid address, SDO remains
tristate during entire SPI frame
2.4.2.5 Verification Byte
Table 6 Verification Byte Format

MSB
7 6 5 4 3 2 1 0
Z Z 1 0 1 0 1 TRANS_F
Table 7 Verification Byte Description

0 TRANS_F Bit = 1: error detected during previous transfer
Bit = 0: previous transfer was recognized as valid
1 Fixed to High
2 Fixed to Low
3 Fixed to High
4 Fixed to Low
5 Fixed to High
6 send as high impedance
7 send as high impedance
The default value after power-up at DMS of the TRANS_F bit is L (previous transfer valid)

TLE 7209-2R
Circuit Description
2.4.2.6 Data-byte: Diagnostics/Encoding of Failures

(Register DIA_REG, SPI Instruction RD_DIA)
)
Table 8 DIA_REG Format

MSB
7 6 5 4 3 2 1 0
EN/DIS OT CurrRed CurrLim DIA21 DIA20 DIA11 DIA10
Table 9 DIA_REG Description

Default value after reset is FFhex. Access by controller is read only
Bit Name Description latch
behavior
0 DIA 10 Diagnosis-Bit1 of OUT1 see below
4 CurrLim is set to 0 in case of current limitation. latched
5 CurrRed is set to 0 in case of temperature dependent latched
current limitation
6 OT is set to 0 in case of over-temperature latched
7 EN/DIS is set to 0 in case of EN = L or DIS = H not latched
EN DIS DIA_REG_7
H L 1
L L 0
H H 0
L H 0

TLE 7209-2R
Circuit Description
Table 10 Encoding of the Diagnostic Bits of OUT1 and OUT2

DIA21 DIA20 DIA11 DIA10 Description latch
behavior
1 1 0 0 Short circuit over load (SCOL) latched
- - 0 1 Short circuit to battery on OUT1 (SCB1) latched
- - 1 0 Short circuit to ground on OUT1 (SCG1) latched
- - 1 1 No error detected on OUT1 -
0 0 1 1 Open load (OL) latched
0 1 - - Short circuit to battery on OUT2 (SCB2) latched
1 0 - - Short circuit to ground on OUT2 (SCG2) latched
1 1 - - No error detected on OUT2 -
0 0 0 0 Under Voltage on Pin Vs not latched
Failure Encoding in case of multiple faults

If multiple faults are stored in the failure register, the faults that are encoded in the DIAxx
bits can not be displayed simultaneously due to the encoding scheme that is used. In this
case, errors are encoded according to the following priority list.
Priority 1: Under Voltage (please note that after removal of Under Voltage, the original
error will be restored, see below)
Priority 2: Short circuit across the load
Priority 3: all other short circuits
Priority 4: open load
If a failure of higher priority is detected, the failures of lower priority are no longer visible
in the encoded SPI message.
Fault storage and reset of the Diagnosis Register DIA_REG

Register DIA_REG is reset upon the following conditions:
With the rising edge of the CSN-Signal after the SPI-instruction RD_DIA. This reset
only takes place if the correct number of 16 SCK pulses has been counted.
When the voltage on DMS exceeds the threshold for detecting SPI-Mode (after Under
Voltage condition). Under Voltage on Vs (typ. < 5,0V) sets Bit 0.... Bit 3 of DIA_REG
to 0000. If Vs rises above the Under Voltage level, Bits of DIA_REG are restored
(when DMS > 3.5V).
A rising edge on EN while DIS=0 or a falling edge on DIS while EN=1 re-activates the
output power-stages, and resets the DIA_REG register.

TLE 7209-2R
Circuit Description
2.4.2.7 Data-byte: Device Identifier and Version

(SPI instructions RD_IDENT and RD_VERSION)
The ICs identifier (device ID) and version number are used for production test purposes
and features plug & play functionality depending on the systems software release. The
two numbers are read-only accessible via the SPI instructions RD_IDENT and
RD_VERSION as described in Section 2.4.2.4.
The device ID is defined to allow identification of different IC-Types by software and is
fixed for the TLE 7209-2R.
The Version number may be utilized to distinguish different states of hardware and is
updated with each redesign of the TLE 7209-2R. The contents is divided into an upper
4 bit field reserved to define revisions (SWR) corresponding to specific software releases
and a lower 4 bit field utilized to identify the actual mask set revision (MSR).
Both (SWR and MSR) will start with 0000b and are increased by 1 every time an
according modification of the hardware is introduced.
Reading the IC Identifier (SPI Instruction: RD_IDENT):
Table 11 Device Identifier Format

MSB
7 6 5 4 3 2 1 0
ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0
Table 12 Device Identifier Description

7...0 device-ID(7...0) ID-No.: 10100010
Reading the IC version number (SPI Instruction: RD_VERSION):
Table 13 IC version number Format

MSB
7 6 5 4 3 2 1 0
SWR3 SWR2 SWR1 SWR0 MSR3 MSR2 MSR1 MSR0
Table 14 IC version number Description

7...4 SWR(3...0) This register is set to 0
3...0 MSR(3...0) Version corresponding to Mask set

TLE 7209-2R
Circuit Description
2.4.2.8 Open-Load Diagnosis

Open-load diagnostic in OFF-state is only possible in the SPI-mode (DMS = 5 V) if the
device is Disabled (EN = L or DIS = H). The detection mechanism is depicted in
Figure 9. The according diagnostic information can be read out via the SPI diagnostic
register. The resulting overall diagnostic truth-table is shown as Table 15
VS VS
DMS
1.5mA
-
+
AND
DIS
OR OUT1 OUT2
EN
1V
- to diagnostic
+ register
1V
1mA
1 AND
Figure 9 Functional block diagram of open-load detection

Table 15 Diagnosis Truth Table for open load detection
Output stage inactive, EN = low or DIS = high, DMS > 4.5 V
OUT1 OUT2
Load available H H
Open Load H L OL detected
SC -> GND on OUT1 and Open Load L L OL not detected double Fault
SC -> GND on OUT2 and Open Load H L OL detected
SC -> VS on OUT1 and Open Load H L OL detected
SC -> VS on OUT2 and Open Load H H OL not detected double Fault

TLE 7209-2R
Electrical Characteristics
3 Electrical Characteristics
3.1 Absolute Maximum Ratings

Pos. Parameter Sym- Limit Values Unit Test Conditions
bol min. max.
3.1.1 Junction temperature Tj -40 +150 C
+175 C dynamic: t < 1 s
3.1.2 Storage temperature Ts -55 +125 C
3.1.3 Ambient temperature Ta -40 +125 C
3.1.4 Supply voltage VS -1 40 V static destruction proof
-2 40 V dynamic destruction proof
t < 0.5 s
(single pulse, Tj < 85 C)
3.1.5 Voltage at logic V -0.5 18 V In status-flag-mode, SF
inputs pull-up R 10 k
IN1, IN2, DIS, EN,
SDI, SCK/SF
3.1.6 Voltage at logic input V -0.5 40 V
CSN
3.1.7 Voltage at logic input VDMS -0.5 13 V
DMS
3.1.8 Voltage at logic V -0.5 VDMS V
output SDO +0.5
3.1.9 Voltage at VsCP VCP VS - VS + V -
0.5 0.5
3.1.10 ESD voltage human VESD 4kV all pins
3.1.11 body model (MIL VESD-- 8kV only pins 6, 7, 14 and 15
STD 883D / ANSI (outputs)
OUT
EOS\ESD S5.1)
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.

TLE 7209-2R
3.2 Operating Range

Pos. Parameter Sym- Limit Values Unit Remark
bol min. max.
3.2.1 Supply Voltage VS 5 28 V
3.2.2 DMS Supply Voltage VDMS 3.5 5.5 V Device in SPI-mode
3.2.3 PWM frequency f 30 kHz May be limited to lower values
in the application due to
switching losses or duty cycle
requirements
3.2.4 Junction Temperature TJ -40 150 C
Note: In the operating range, the circuit functionality as described in the circuit
description is fulfilled.
3.3 Thermal Resistance

3.3.1 Junction-case RthJC 1.5 K/W specified by design
3.3.2 Junction-ambient RthJA 50 K/W minimal footprint
3.4 Electrical Characteristics

5V < VS < 28V; 40 C < Tj < 150 C; unless otherwise specified
Pos. Parameter Symbol Limit Values Unit Test Conditions
min. typ. max.
Power Supply
3.4.1 Under voltage at VS VUV OFF 3.4 4.2 5 V Switch off threshold
VUV ON 3.6 4.4 5.2 Switch on threshold
VUV HY 100 1000 mV Hysteresis
3.4.2 Supply current IUB 30 mA f = 20 kHz, IOUT = 0 A
20 mA f = 0 Hz, IOUT = 0 A

TLE 7209-2R
3.4 Electrical Characteristics (contd)

min. typ. max.
Logic Inputs IN1, IN2, DIS, EN
3.4.3 Input high VIH 2 V

3.4.4 Input low VIL 1 V
3.4.5 Input hysteresis VIHY 0.1 0.6 V
3.4.6 pull-up current IIL -200 -125 A U1V
IN1, IN2, DIS
3.4.7 pull-down current EN IIH 100 A U2V
Power Outputs OUT1, OUT2
3.4.8 Switch on resistance 300 m ROUT-UB, ROUT-GND

VS > 5 V, IOUT = 3 A
3.4.9 Switch-off current |IL| 5.5 6.6 7.7 A -40 C < Tj < TILR
1.4 2.5 3.6 A Tj = TSD; specified by
design
3.4.10 Switch-off time ta 8 16 26 s Vs=13.2 V, L=2.2 mH,
R=0.23
3.4.11 Blanking time tb 8 13 19 s Vs=13.2 V, L=2.2 mH,
R=0.23
3.4.12 Switch-off Tracking ta/tb 1.0 Vs=13.2 V, L=2.2 mH,
R=0.23
3.4.13 Short circuit detection |IOUK| 8 18 A
current
3.4.14 Current Tracking |IOUK|- 2 3.5 A specified by design
|IL|
3.4.15 Reactivation time after t 200 s Over-current- or over-
internal shut-down temperature shut-
down to reactivation
of the output stage
Note: Reactivation time is not subject to production test; specified by design

TLE 7209-2R

min. typ. max.
3.4.16 Leakage current 200 A Output stage
switched off
3.4.17 Free-wheel diode UD 2 V IOUT = 3 A
forward voltage
3.4.18 Free-wheel diode trr 100 ns Reverse recovery
reverse recovery time time is not subject to
production test;
specified by design
Output Status-flag, Open Drain Output DMS < 0.8 V
3.4.19 Output high ISF 20 A VSF = 5 V

(SF not set)
3.4.20 Output low ISF 300 A VSF = 1 V
(SF set) 100 A VSF = 0.5 V
Timing
3.4.21 Output ON-delay tdon 6 s IN1 --> OUT1 resp.

IN2 --> OUT2, IOUT =
3A
3.4.22 Output OFF-delay tdoff 6 s IN1 --> OUT1 resp.
IN2 --> OUT2, IOUT =
3A
3.4.23 Output switching time tr, tf 5 s OUT1H --> OUT1L,
OUT2H --> OUT2L,
IOUT = 3 A
OUT1L --> OUT1H,
OUT2L --> OUT2H
3.4.24 Disable delay time tddis 2 s DIS --> OUTn,
EN --> OUTn
3.4.25 Power on delay time 1 ms VS = on --> output
stage active; no load
3.4.26 Delay time for fault tdf 1.0 2 s specified by design
detection
3.4.27 Minimum pulse width tden 1.6 2.2 s EN/DIS-->Reset
DIA_REG

TLE 7209-2R

min. typ. max.
Input SCK, SPI Clock Input
3.4.28 Low Level USCKL 1 V

3.4.29 High Level USCKH 2 V
3.4.30 Hysteresis USCK 0.1 0.4 V
3.4.31 Input Capacity CSCK 10 pF
3.4.32 Input Current -ISCK 20 50 A Pull-up current source
connected to VCC
Input CSN, Chip Select Signal
3.4.33 Low Level UCSNL 1 V TLE 7209-2R is

selected
3.4.34 High Level UCSNH 2 V
3.4.35 Hysteresis UCSN 0.1 0.4 V
3.4.36 Input Capacity CCSN 10 pF
3.4.37 Input Current -ICSN 20 50 A Pull up current source
connected to VCC
Input SDI, SPI Data Input
3.4.38 Low Level USDIL 1 V

3.4.39 High Level USDIH 2 V
3.4.40 Hysteresis USDI 0.1 0.4 V
3.4.41 Input Capacity CSDI 10 pF
3.4.42 Input Current -ISDI 20 50 A Pull up current source
connected to VCC

TLE 7209-2R

min. typ. max.
Output SDO
Tristate Output of the TLE 7209-2R (SPI output);
3.4.43 Low Level VSDOL 0.4 V ISDO = 2 mA

3.4.44 High Level VSDOH VDMS V ISDO = -2 mA
- 0.75
3.4.45 Capacity CSDO 10 pF Capacity of the pin in
tristate
3.4.46 Leakage Current ISDO -10 10 A In tristate
Note: All in- and output pin capacities are not subject to production test; specified by design
Input DMS
Supply-Input for the SPI-Interface and Selection Pin for SPI- or SF-Mode
3.4.47 Input Voltage VDMS 3.5 V SPI-Mode

VDMS 0.8 V Status-Flag-Mode
3.4.48 Input Current IDMS 10 mA SPI-Mode
Open-Load Diagnosis
3.4.49 Diagnostic Threshold VOUT1 0.8 2.0 V DMS > 4.5 V, EN <
VOUT2 0.8 2.0 V 0.8 V or DIS > 4.5 V;
no load
3.4.50 Pull-up Current -IOUT1 1000 1500 2000 A VOUT1=0 V,
DMS > 4.5 V, EN <
0.8 V or DIS > 4.5 V;
no load
3.4.51 Pull-down Current IOUT2 700 1000 1400 A VOUT2=5 V,
DMS > 4.5 V, EN <
0.8 V or DIS > 4.5 V;
no load
3.4.52 Tracking Diag. C 1.2 1.5 1.7 IOUT1/IOUT2
3.4.53 Delay Time tD 30 100 ms
Note: Open Load is detected if VOUT1 > 2 V AND VOUT2 < 0.8 V (refer to fig. 9).

TLE 7209-2R

min. typ. max.
SPI Timing (see Figure 13)
3.4.54 Cycle-Time (1) tcyc (1) 200 ns referred to master

3.4.55 Enable Lead Time tlead (2) 100 ns referred to master
3.4.56 Enable Lag Time tlag (3) 150 ns referred to master
3.4.57 Data Valid tv (4) 40 ns CL = 40 pF
150 ns CL = 200 pF
referred to TLE 7209-
2R
3.4.58 Data Setup Time tsu (5) 50 ns referred to master
3.4.59 Data Hold Time th (6) 20 ns referred to master
3.4.60 Disable Time tdis (7) 100 ns referred to TLE 7209-
2R; specified by
design
3.4.61 Transfer Delay tdt (8) 150 ns referred to master
3.4.62 Select time tCSN (9) 50 ns referred to master
3.4.63 Access time tacc (10) 8.35 s referred to master
3.4.64 Clock inactive before (11) 200 ns
chip select becomes
valid
3.4.65 Clock inactive after (12) 200 ns
chip select becomes
invalid
Temperature Thresholds
3.4.66 Start of current limit TILR 150 165 C

reduction
3.4.67 Thermal Shut-down TSD 175 C
Note: Temperature thresholds are not subject to production test; specified by design

TLE 7209-2R
Timing Diagrams
4 Timing Diagrams
5
INx
50% 50%
80%
OUTx
20%
tdon tdoff
Figure 10 Output Delay Time--Depicted for Low-Side FETs
5
DIS / EN
50%
OUTx
20%
Z
tddis
Figure 11 Disable Delay Time

TLE 7209-2R
Timing Diagrams
tRISE tFALL
80% 80%
OUTx
20% 20%
Figure 12 Output Switching Time
10 9
CSN
11 2 1 3 8
SCK 12
4 7
SDO tristate
Bit (n-3) Bit (n-4)...1 Bit 0; LSB
5 6
SDI MSB IN Bit (n-2) Bit (n-3) Bit (n-4)...1 LSB IN
n = 16
Figure 13 SPI-timing

TLE 7209-2R
Application
5 Application
VSCP VS
DMS
V-Reg
Vcc
IN1
IN2
DIS
C CSN OUT 1
M
SDI
SDO
OUT 2
SCK/SF
from Watchdog or EN
fail-safe Controller
GND
Figure 14 Application Example with SPI-Interface
VSCP VS
DMS
V-Reg
Vcc
IN1
IN2
DIS
C CSN OUT 1
47k M
SDI
SDO
OUT 2
SCK/SF
from Watchdog or EN
fail-safe Controller
GND
Figure 15 Application Example with Status-Flag

TLE 7209-2R
Application
Reverse polarity protection via main relay

VS TLE 7209-2R
main
Vs < 40V
100F 100nF
relay
ignition
switch
battery
Figure 16 Application Examples for Over-Voltage- and Reverse-Voltage

Protection

TLE 7209-2R
Package Outlines
6 Package Outlines
P-DSO-20-12
(Plastic Dual Small Outline Package)
11 0.15 1)
3.5 MAX.
B
3.25 0.1
0.25 +0.07
1.2 -0.3 2.8
0.02
0 +0.1
5 3
1.3
15.74 0.1
6.3
1.27 (Heatslug) 0.1 Heatslug
(Mold)
0.95 0.15
0.4 +0.13
0.25 M A 20x 14.2 0.3
0.25 B
5.9 0.1
(Metal)
3.2 0.1
(Metal)
20 11 11 20
Index Marking
1 10 10 1 Heatslug
1 x 45 13.7 -0.2
15.9 0.15 1) (Metal)
A
(Mold)
GPS05791
1)
Does not include plastic or metal protrusion of 0.15 max. per side
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book Package Information
SMD = Surface Mounted Device Dimensions in mm

TLE 7209-2R
Revision History
7 Revision History
TLE 7209-2R 2004-jul-01 V1.2

Previous Version: Final Datasheet V1.1, 2004-may-25
Section Subjects (major changes since last revision)
3.4.25 Added no load to Test Conditions
3.4.26 Added 1.0 sec minimum
3.4.49 Clarified Open Load diagnostic threshold
4 Figure 10 is depicted for low-side FETs

Edition 2004-jul-01
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 Mnchen, Germany
Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.

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7 A H-Bridge For DC-Motor Applications TLE 7209-2R: Final Datasheet

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7 A H-Bridge for DC-Motor Applications TLE 7209-2R

Type Ordering Code Package

Final Datasheet 1 V1.2, 2004-jul-01

1.2 Pin Configuration

Figure 1 Pinout TLE 7209-2R

Table 1 Pin Definitions and Functions

Final Datasheet 2 V1.2, 2004-jul-01

Table 1 Pin Definitions and Functions (contd)

Final Datasheet 3 V1.2, 2004-jul-01

1.3 Block Diagram

Figure 2 Block Diagram TLE 7209-2R

Final Datasheet 4 V1.2, 2004-jul-01

2.1 Control Inputs

Table 2 Functional Truth Table

Final Datasheet 5 V1.2, 2004-jul-01

2.2 Power Stages

2.2.1 Chopper Current Limitation

Final Datasheet 6 V1.2, 2004-jul-01

2.2.2 Temperature-depending Current Reduction

tolerance of temperature range of over-

Figure 4 Temperature dependent current reduction

2.3.1 Short circuit to Ground

2.3.2 Short circuit to VS

Final Datasheet 7 V1.2, 2004-jul-01

Figure 5 Short to Vs detection. Left: normal operation. Right: short circuit is

2.3.3 Short circuit across the load

2.3.5 Under-Voltage shut-down

Final Datasheet 8 V1.2, 2004-jul-01

2.4.1 Status-Flag (SF) Mode (DMS = GND)

2.4.1.2 Fault storage and reset

2.4.2 SPI-Mode (DMS = 5V)

Final Datasheet 9 V1.2, 2004-jul-01

Figure 6 SPI block-diagram

2.4.2.2 Characteristics of the SPI Interface

Final Datasheet 10 V1.2, 2004-jul-01

Final Datasheet 11 V1.2, 2004-jul-01

SDO remains tristated Address sent by Correct addres is recognized,

Figure 7 Bus-arbitration by chip-address

Final Datasheet 12 V1.2, 2004-jul-01

SDI MSB SPI Instruction LSB not used

SDO MSB Verification byte LSB MSB data-byte LSB

Figure 8 SPI communication

2.4.2.4 SPI instruction

Table 3 SPI Instruction Format

Final Datasheet 13 V1.2, 2004-jul-01

Table 5 SPI Instruction-Bytes Encoding

2.4.2.5 Verification Byte

Table 6 Verification Byte Format

Table 7 Verification Byte Description

Final Datasheet 14 V1.2, 2004-jul-01

2.4.2.6 Data-byte: Diagnostics/Encoding of Failures

Table 8 DIA_REG Format

Table 9 DIA_REG Description

Final Datasheet 15 V1.2, 2004-jul-01

Table 10 Encoding of the Diagnostic Bits of OUT1 and OUT2

Failure Encoding in case of multiple faults

Fault storage and reset of the Diagnosis Register DIA_REG

Final Datasheet 16 V1.2, 2004-jul-01

2.4.2.7 Data-byte: Device Identifier and Version