HP Proliant Dl785 Server Maintenance and Service Guide Generation 5 and Generation 6

HP ProLiant DL785 Server Maintenance and
Service Guide Generation 5 and Generation

6
Maintenance and Service Guide
HP Part Number: AH233-9002A_ed7

Published: January 2010
Edition: 7
Copyright 20082010 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft, Windows, and Windows NT are U.S. registered trademarks of Microsoft Corporation. Windows Server 2003 is a U.S. trademark of
Microsoft Corporation. AMD is a registered trademark of Advanced Micro Devices, Inc.
Audience assumptions This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment
and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack
installations.
Table of Contents
1 Customer self repair.......................................................................................................7
Rparation par le client (CSR)................................................................................................................7
Riparazione da parte del cliente.............................................................................................................8
Customer Self Repair..............................................................................................................................8
Reparaciones del propio cliente..............................................................................................................9
Customer Self Repair............................................................................................................................10
Reparo feito pelo cliente.......................................................................................................................10
2 Illustrated Parts Catalog...............................................................................................13

Mechanical components.......................................................................................................................13
System components..............................................................................................................................16
3 Removal and replacement procedures......................................................................23

Required tools.......................................................................................................................................23
Safety considerations............................................................................................................................23
Preventing electrostatic discharge...................................................................................................23
Server warnings and cautions.........................................................................................................24
Preparation procedures........................................................................................................................24
Power down the server....................................................................................................................25
Extending the server from the rack.................................................................................................25
Removing the server from the rack.................................................................................................26
Removing the access panel..............................................................................................................27
Media module (SID assembly)..............................................................................................................28
Front Bezel............................................................................................................................................29
Mezzanine filler....................................................................................................................................29
Mezzanine filler bezel...........................................................................................................................29
Mezzanine board..................................................................................................................................29
Processor memory cell..........................................................................................................................29
Processor memory cell bezel.................................................................................................................30
Processor memory cell airflow baffle...................................................................................................30
Processors..............................................................................................................................................30
DIMMs..................................................................................................................................................36
SAS hard drive blank............................................................................................................................37
SAS hard drives....................................................................................................................................37
DVD, CD drive or blank.......................................................................................................................38
Power supply blank..............................................................................................................................38
Power supply........................................................................................................................................38
Hot-plug fans........................................................................................................................................39
Rear accessed hot-plug fans............................................................................................................39
Internally accessed hot-plug fans....................................................................................................40
Expansion slot covers............................................................................................................................41
Expansion boards..................................................................................................................................42
SAS backplane.......................................................................................................................................44
Battery-backed write cache procedures................................................................................................44
Removing the cache module...........................................................................................................45
Removing the BBWC battery pack..................................................................................................45
Recovering data from the battery-backed write cache....................................................................47
Power supply backplane.......................................................................................................................47
SPI (core I/O) board...............................................................................................................................48
Table of Contents 3
Re-entering the server serial number and product ID....................................................................48
System battery.......................................................................................................................................48
I/O backplane assembly........................................................................................................................49
Midplane board.....................................................................................................................................50
4 Diagnostic tools............................................................................................................53
SmartStart software...............................................................................................................................53
SmartStart Scripting Toolkit..................................................................................................................53
HP Instant Support Enterprise Edition.................................................................................................54
Option ROM Configuration for Arrays................................................................................................54
HP ROM-Based Setup Utility...............................................................................................................54
ROMPaq utility.....................................................................................................................................55
System Online ROM flash component utility.......................................................................................55
Integrated Management Log................................................................................................................55
Integrated Lights-Out 2 technology......................................................................................................55
Automatic Server Recovery..................................................................................................................56
HP Systems Insight Manager................................................................................................................56
HP Insight Diagnostics.........................................................................................................................56
USB support..........................................................................................................................................56
Troubleshooting the system using port 85 codes..................................................................................57
Processor-related port 85 codes.......................................................................................................57
Memory-related port 85 codes.........................................................................................................58
Expansion board-related port 85 codes...........................................................................................58
Miscellaneous port 85 codes............................................................................................................59
5 Component identification............................................................................................61
Front panel components.......................................................................................................................61
Front panel LEDs and buttons..............................................................................................................63
System Insight Display LEDs...............................................................................................................64
SAS and SATA hard drive LEDs...........................................................................................................66
SAS and SATA hard drive LED combinations......................................................................................66
Processor memory cell components.....................................................................................................67
Rear panel components.........................................................................................................................68
Rear panel LEDs and buttons...............................................................................................................69
Power supply LED................................................................................................................................70
Internal components.............................................................................................................................70
SPI board components..........................................................................................................................72
System maintenance switch (SW6).......................................................................................................72
System maintenance switch (SW1).......................................................................................................74
Battery pack LEDs.................................................................................................................................74
Fan locations.........................................................................................................................................75
6 Cabling.........................................................................................................................77
Cabling overview..................................................................................................................................77
BBWC cabling.......................................................................................................................................77
SAS and SATA hard drive cabling........................................................................................................78
SAS expander cabling...........................................................................................................................78
High power graphics card cabling........................................................................................................80
7 Specifications................................................................................................................81
Environmental specification.................................................................................................................81
Server specifications..............................................................................................................................81
4 Table of Contents
8 Technical support.........................................................................................................83
Before you contact HP...........................................................................................................................83
HP contact information.........................................................................................................................83
A Acronyms and abbreviations......................................................................................85
Index.................................................................................................................................87
Table of Contents 5
6
1 Customer self repair
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time
and allow for greater flexibility in performing defective parts replacement. If during the diagnosis
period HP (or HP service providers or service partners) identifies that the repair can be
accomplished by the use of a CSR part, HP will ship that part directly to you for replacement.
There are two categories of CSR parts:
Mandatory Parts for which customer self repair is mandatory. If you request HP to replace
these parts, you will be charged for the travel and labor costs of this service.
Optional Parts for which customer self repair is optional. These parts are also designed
for customer self repair. If, however, you require that HP replace them for you, there may
or may not be additional charges, depending on the type of warranty service designated for
your product.
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer
warranty, HP requires that an authorized service provider replace the part. These parts are
identified as "No" in the Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business
day delivery. Same day or four-hour delivery may be offered at an additional charge where
geography permits. If assistance is required, you can call the HP Technical Support Center and
a technician will help you over the telephone. HP specifies in the materials shipped with a
replacement CSR part whether a defective part must be returned to HP. In cases where it is
required to return the defective part to HP, you must ship the defective part back to HP within
a defined period of time, normally five (5) business days. The defective part must be returned
with the associated documentation in the provided shipping material. Failure to return the
defective part may result in HP billing you for the replacement. With a customer self repair, HP
will pay all shipping and part return costs and determine the courier/carrier to be used.
For more information about HP's Customer Self Repair program, contact your local service
provider. For the North American program, refer to the HP website
(http://www.hp.com/go/selfrepair).
Rparation par le client (CSR)

Les produits HP comportent de nombreuses pices CSR (Customer Self Repair = rparation par
le client) afin de minimiser les dlais de rparation et faciliter le remplacement des pices
dfectueuses. Si pendant la priode de diagnostic, HP (ou ses partenaires ou mainteneurs agrs)
dtermine que la rparation peut tre effectue l'aide d'une pice CSR, HP vous l'envoie
directement. Il existe deux catgories de pices CSR:
Obligatoire Pices pour lesquelles la rparation par le client est obligatoire. Si vous
demandez HP de remplacer ces pices, les cots de dplacement et main d'uvre du
service vous seront facturs.
Facultatif Pices pour lesquelles la rparation par le client est facultative. Ces pices sont
galement conues pour permettre au client d'effectuer lui-mme la rparation. Toutefois,
si vous demandez HP de remplacer ces pices, l'intervention peut ou non vous tre facture,
selon le type de garantie applicable votre produit.
REMARQUE: Certaines pices HP ne sont pas conues pour permettre au client d'effectuer
lui-mme la rparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement
de la pice soit effectu par un Mainteneur Agr. Ces pices sont identifies par la mention
"Non" dans le Catalogue illustr.
Rparation par le client (CSR) 7

Les pices CSR sont livres le jour ouvr suivant, dans la limite des stocks disponibles et selon
votre situation gographique. Si votre situation gographique le permet et que vous demandez
une livraison le jour mme ou dans les 4 heures, celle-ci vous sera facture. Pour bnficier d'une
assistance tlphonique, appelez le Centre d'assistance technique HP. Dans les documents envoys
avec la pice de rechange CSR, HP prcise s'il est ncessaire de lui retourner la pice dfectueuse.
Si c'est le cas, vous devez le faire dans le dlai indiqu, gnralement cinq (5) jours ouvrs. La
pice et sa documentation doivent tre retournes dans l'emballage fourni. Si vous ne retournez
pas la pice dfectueuse, HP se rserve le droit de vous facturer les cots de remplacement. Dans
le cas d'une pice CSR, HP supporte l'ensemble des frais d'expdition et de retour, et dtermine
la socit de courses ou le transporteur utiliser.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agre local.
Pour plus d'informations sur ce programme en Amrique du Nord, consultez le site Web HP
Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilit nella sostituzione di
parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati
direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro
di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP
lo spedir direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:
Obbligatorie Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne
affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il
servizio.
Opzionali Parti la cui riparazione da parte del cliente facoltativa. Si tratta comunque di
componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad
HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per
il prodotto.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per
rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza
autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
In base alla disponibilit e alla localit geografica, le parti CSR vengono spedite con consegna
entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore offerta
con un supplemento di costo solo in alcune zone. In caso di necessit si pu richiedere l'assistenza
telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte
di ricambio CSR, HP specifica se il cliente deve restituire dei componenti. Qualora sia richiesta
la resa ad HP del componente difettoso, lo si deve spedire ad HP entro un determinato periodo
di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito
con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del
componente pu comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione
da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da
utilizzare.
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona.
Per il programma in Nord America fare riferimento al sito Web HP
Customer Self Repair

HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren
und hhere Flexibilitt beim Austausch defekter Bauteile zu ermglichen. Wenn HP (oder ein
HP Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert
werden kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in
zwei Kategorien unterteilt:

Zwingend Teile, fr die das Customer Self Repair-Verfahren zwingend vorgegeben ist.
Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt-
und Arbeitskosten fr diesen Service berechnet.
Optional Teile, fr die das Customer Self Repair-Verfahren optional ist. Diese Teile sind
auch fr Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von
HP vornehmen lassen mchten, knnen bei diesem Service je nach den fr Ihr Produkt
vorgesehenen Garantiebedingungen zustzliche Kosten anfallen.
HINWEIS: Einige Teile sind nicht fr Customer Self Repair ausgelegt. Um den Garantieanspruch
des Kunden zu erfllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im
illustrierten Teilekatalog sind diese Teile mit No bzw. Nein gekennzeichnet.
CSR-Teile werden abhngig von der Verfgbarkeit und vom Lieferziel am folgenden Geschftstag
geliefert. Fr bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier
Stunden gegen einen Aufpreis verfgbar. Wenn Sie Hilfe bentigen, knnen Sie das HP technische
Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien,
die mit einem CSR-Ersatzteil geliefert werden, knnen Sie entnehmen, ob das defekte Teil an
HP zurckgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP
zurckzuschicken, mssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel
innerhalb von fnf (5) Geschftstagen. Das defekte Teil muss mit der zugehrigen Dokumentation
in der Verpackung zurckgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das
defekte Teil nicht zurckschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle
von Customer Self Repair kommt HP fr alle Kosten fr die Lieferung und Rcksendung auf
und bestimmt den Kurier-/Frachtdienst.
Weitere Informationen ber das HP Customer Self Repair Programm erhalten Sie von Ihrem
Servicepartner vor Ort. Informationen ber das CSR-Programm in Nordamerika finden Sie auf
der HP Website unter (http://www.hp.com/go/selfrepair).
Reparaciones del propio cliente

Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar
(Customer Self Repair, CSR) para minimizar el tiempo de reparacin y ofrecer una mayor
flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase
de diagnstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparacin
puede llevarse a cabo mediante el uso de un componente CSR, HP le enviar dicho componente
directamente para que realice su sustitucin. Los componentes CSR se clasifican en dos categoras:
Obligatorio: componentes para los que la reparacin por parte del usuario es obligatoria.
Si solicita a HP que realice la sustitucin de estos componentes, tendr que hacerse cargo
de los gastos de desplazamiento y de mano de obra de dicho servicio.
Opcional: componentes para los que la reparacin por parte del usuario es opcional. Estos
componentes tambin estn diseados para que puedan ser reparados por el usuario. Sin
embargo, si precisa que HP realice su sustitucin, puede o no conllevar costes adicionales,
dependiendo del tipo de servicio de garanta correspondiente al producto.
NOTA: Algunos componentes no estn diseados para que puedan ser reparados por el usuario.
Para que el usuario haga valer su garanta, HP pone como condicin que un proveedor de
servicios autorizado realice la sustitucin de estos componentes. Dichos componentes se identifican
con la palabra "No" en el catlogo ilustrado de componentes.
Segn la disponibilidad y la situacin geogrfica, los componentes CSR se enviarn para que
lleguen a su destino al siguiente da laborable. Si la situacin geogrfica lo permite, se puede
solicitar la entrega en el mismo da o en cuatro horas con un coste adicional. Si precisa asistencia
tcnica, puede llamar al Centro de asistencia tcnica de HP y recibir ayuda telefnica por parte
de un tcnico. Con el envo de materiales para la sustitucin de componentes CSR, HP especificar
si los componentes defectuosos debern devolverse a HP. En aquellos casos en los que sea
necesario devolver algn componente a HP, deber hacerlo en el periodo de tiempo especificado,
Reparaciones del propio cliente 9

normalmente cinco das laborables. Los componentes defectuosos debern devolverse con toda
la documentacin relacionada y con el embalaje de envo. Si no enviara el componente defectuoso
requerido, HP podr cobrarle por el de sustitucin. En el caso de todas sustituciones que lleve
a cabo el cliente, HP se har cargo de todos los gastos de envo y devolucin de componentes y
escoger la empresa de transporte que se utilice para dicho servicio.
Para obtener ms informacin acerca del programa de Reparaciones del propio cliente de HP,
pngase en contacto con su proveedor de servicios local. Si est interesado en el programa para
Norteamrica, visite la pgina web de HP siguiente (http://www.hp.com/go/selfrepair).
Customer Self Repair

Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur
tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen
groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP
(of een HP Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met
een CSR-onderdeel, verzendt HP dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel
daarmee kunt vervangen. Er zijn twee categorien CSR-onderdelen:
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt
deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon
in rekening gebracht.
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen
zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen
voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk
van het type garantieservice voor het product.
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In
verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service
Partner worden vervangen. Deze onderdelen worden in de gellustreerde onderdelencatalogus
aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering
op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten
worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt
u een HP Service Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt
in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan HP moet
worden geretourneerd. Als het defecte onderdeel aan HP moet worden teruggezonden, moet u
het defecte onderdeel binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren
aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd
in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP
u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt
HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke
koerier/transportonderneming hiervoor wordt gebruikt.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair
programma van HP. Informatie over Service Partners vindt u op de HP website
Reparo feito pelo cliente

Os produtos da HP so projetados com muitas peas para reparo feito pelo cliente (CSR) de
modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituio de peas
com defeito. Se, durante o perodo de diagnstico, a HP (ou fornecedores/parceiros de servio
da HP) concluir que o reparo pode ser efetuado pelo uso de uma pea CSR, a pea de reposio
ser enviada diretamente ao cliente. Existem duas categorias de peas CSR:

Obrigatria Peas cujo reparo feito pelo cliente obrigatrio. Se desejar que a HP substitua
essas peas, sero cobradas as despesas de transporte e mo-de-obra do servio.
Opcional Peas cujo reparo feito pelo cliente opcional. Essas peas tambm so projetadas
para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou
no a cobrana de taxa adicional, dependendo do tipo de servio de garantia destinado ao
produto.
OBSERVAO: Algumas peas da HP no so projetadas para o reparo feito pelo cliente. A
fim de cumprir a garantia do cliente, a HP exige que um tcnico autorizado substitua a pea.
Essas peas esto identificadas com a marca "No" (No), no catlogo de peas ilustrado.
Conforme a disponibilidade e o local geogrfico, as peas CSR sero enviadas no primeiro dia
til aps o pedido. Onde as condies geogrficas permitirem, a entrega no mesmo dia ou em
quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxlio, entre em contato
com o Centro de suporte tcnico da HP para que um tcnico o ajude por telefone. A HP especifica
nos materiais fornecidos com a pea CSR de reposio se a pea com defeito deve ser devolvida
HP. Nos casos em que isso for necessrio, preciso enviar a pea com defeito HP dentro do
perodo determinado, normalmente cinco (5) dias teis. A pea com defeito deve ser enviada
com a documentao correspondente no material de transporte fornecido. Caso no o faa, a HP
poder cobrar a reposio. Para as peas de reparo feito pelo cliente, a HP paga todas as despesas
de transporte e de devoluo da pea e determina a transportadora/servio postal a ser utilizado.
Para obter mais informaes sobre o programa de reparo feito pelo cliente da HP, entre em
contato com o fornecedor de servios local. Para o programa norte-americano, visite o site da
HP (http://www.hp.com/go/selfrepair).
Reparo feito pelo cliente 11

2 Illustrated Parts Catalog
In this section
Mechanical components (page 13)
System components (page 16)
Mechanical components
IMPORTANT: The list of part numbers is current and correct as of the publication of the
document. Part numbers change often. Check the HP Partsurfer website, http://partsurfer.hp.com/,
to ensure you have the latest part numbers associated with this server.
Customer self repair

Item Description Assembly part number Spare part number (Chapter 1 (page 7))
1 Access panel AH233-2115A 491715-001 Mandatory1
2 Front bezel AH233-2118B 491209-001 Mandatory1
3 Blank, SAS hard drive 376383-001 392613-001 Mandatory1
4 Blank, SAS hard drive 443259-001 449433-001 Mandatory1

bay cover
5 Blank, media drive AH233-2132A 492134-001 Mandatory1

bay cover
6 Processor memory AH233-2109D 491104-001 Optional2

cell
6 Processor memory AH233-3401B 492132-001 Mandatory1

cell bezel
Mechanical components 13
Customer self repair
Item Description Assembly part number Spare part number (Chapter 1 (page 7))
Filler, memory air AH233-3417A 491911-001 Mandatory1

blocker (DIMM filler)*
Mezzanine filler* AH233-2117E 491102-001 Optional2
Mezzanine filler AH233-3402A 492133-001 Mandatory1

bezel*
7 Blank, power supply 440204-001 449433-001 Mandatory1
Tool, Torx, T-15* 107473-001 199630-001 Mandatory1
*
Not shown
1
MandatoryParts for which customer self repair is mandatory. If you request HP to replace
2
OptionalParts for which customer self repair is optional. These parts are also designed for
customer self repair. If, however, you require that HP replace them for you, there may or may
not be additional charges, depending on the type of warranty service designated for your product.
3
NoSome HP parts are not designed for customer self repair. In order to satisfy the customer
1
Mandatory: ObligatoirePices pour lesquelles la rparation par le client est obligatoire. Si
vous demandez HP de remplacer ces pices, les cots de dplacement et main d'uvre du
2
Optional: FacultatifPices pour lesquelles la rparation par le client est facultative. Ces pices
sont galement conues pour permettre au client d'effectuer lui-mme la rparation. Toutefois,
3
No: NonCertaines pices HP ne sont pas conues pour permettre au client d'effectuer lui-mme
la rparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pice
soit effectu par un Mainteneur Agr. Ces pices sont identifies par la mention Non dans le
Catalogue illustr.
1
Mandatory: ObbligatorieParti che devono essere necessariamente riparate dal cliente. Se il
cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera
per il servizio.
2
Optional: OpzionaliParti la cui riparazione da parte del cliente facoltativa. Si tratta comunque
di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad
HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il
prodotto.
3
No: Non CSRAlcuni componenti HP non sono progettati per la riparazione da parte del
cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di
assistenza autorizzato. Tali parti sono identificate da un No nel Catalogo illustrato dei
componenti.
1
Mandatory: ZwingendTeile, die im Rahmen des Customer Self Repair Programms ersetzt
werden mssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und
Arbeitskosten fr diesen Service berechnet.
2
Optional: OptionalTeile, fr die das Customer Self Repair-Verfahren optional ist. Diese Teile
sind auch fr Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von

3
No: KeinEinige Teile sind nicht fr Customer Self Repair ausgelegt. Um den Garantieanspruch
1
Mandatory: Obligatoriocomponentes para los que la reparacin por parte del usuario es
obligatoria. Si solicita a HP que realice la sustitucin de estos componentes, tendr que hacerse
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
2
Optional: Opcional componentes para los que la reparacin por parte del usuario es opcional.
Estos componentes tambin estn diseados para que puedan ser reparados por el usuario. Sin
3
No: NoAlgunos componentes no estn diseados para que puedan ser reparados por el
usuario. Para que el usuario haga valer su garanta, HP pone como condicin que un proveedor
de servicios autorizado realice la sustitucin de estos componentes. Dichos componentes se
identifican con la palabra No en el catlogo ilustrado de componentes.
1
Mandatory: VerplichtOnderdelen waarvoor Customer Self Repair verplicht is. Als u HP
verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: OptioneelOnderdelen waarvoor reparatie door de klant optioneel is. Ook deze
onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen
3
No: NeeSommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband
met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden
vervangen. Deze onderdelen worden in de gellustreerde onderdelencatalogus aangemerkt met
"Nee".
1
Mandatory: ObrigatriaPeas cujo reparo feito pelo cliente obrigatrio. Se desejar que a HP
substitua essas peas, sero cobradas as despesas de transporte e mo-de-obra do servio.
2
Optional: OpcionalPeas cujo reparo feito pelo cliente opcional. Essas peas tambm so
projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode
haver ou no a cobrana de taxa adicional, dependendo do tipo de servio de garantia destinado
ao produto.
3
No: NenhumaAlgumas peas da HP no so projetadas para o reparo feito pelo cliente. A
Essas peas esto identificadas com a marca No (No), no catlogo de peas ilustrado.
Mechanical components 15
System components

IMPORTANT: The list of part numbers is current and correct as of the publication of the
document. Part numbers change often. Check the HP Partsurfer website, http://partsurfer.hp.com/,
to ensure you have the latest part numbers associated with this server.
Assembly part Customer self repair

Item Description number Spare part number (Chapter 1 (page 7))
1 Power supplies
Power supply (G5) 440785-001 441830-001 Mandatory1
Power supply (G6) (HP 1200W CS HE 500172-B21 498152-001 Mandatory1

Power Supply Kit)
Power supply (G6) (HP Z 1200W 12V 500173-B21 498152-001 Mandatory1

Hotplug ACC Pwr Supply)
2 Internal hot-plug fan AH233-2113A 491200-001 Mandatory1
not Rear hot-plug fan AH233-2125A 491201-001 Mandatory1

shown
Boards
3 SPI assembly (G5) AH233-60001 512020-001 No3

or
512020-002
SPI assembly (G6) 512020-002 No3
4 Media module (SID assembly) AH233-2124A 491198-001 Optional2
5 SAS backplane 013151-001 449420-001 Optional2
6 Midplane board AH233-60002 491716-001 No3
Mezzanine boardx AH233-60003 491717-001 Optional2
7 Power supply backplane assembly AH233-60008 491199-001 No3
Processor memory cell assemblyx AH233-2109D 491104-001 Optional2

(G5)
Processor memory cell assemblyx AH233-2109E 588797-001 Optional2

(G6)
8 PCIe I/O backplane assembly AH233-60009 587976-001 No3
Combo PCIe HTx I/O backplane AH233-60010 587977-001 No3

assemblyx
10 Media drive options
DVD/CD-RW drive 383696-002 399959-001 Mandatory1
DVD+RW drive, 8x (optional) 395911-001 399402-001 Mandatory1
DVD drive, 8/24x 395910-001 397928-001 Mandatory1
11 Processor options
Heatsink kit, DL785 G5 AH233-2127A 491101-001 Optional2
AMD Opteron 8360SE 2.5 GHz 105W 448202-001 448407-001 Optional2

replacement kit (G5)
AMD Opterton 8358SE 2.4 GHz 105W 448202-002 448406-001 Optional2

System components 17
AMD Opteron 8356 2.3 GHz 75W 448208-001 448405-001 Optional2





AMD Opteron 8376 HE 2.3 GHz 55W 495647-004 518005-001 Optional2

AMD Opteron 8393 SE 3.1 GHz 105W 535363-001 570009-001 Optional2



AMD Opteron 8381 HE 2.5 GHz 55W 530531-002 535708-001 Optional2

AMD Opteron 8425 HE 2.1 GHz (G6) 539686-001 572551-001 Optional2
AMD Opteron 8431 2.4 GHz (G6) 539451-002 539661-001 Optional2
AMD Opteron 8439 SE 2.8 GHz (G6) 539449-001 539659-001 Optional2
12 Memory
1 GB, 667 MHz 12 (dual rank) 405475-051 430450-001 Mandatory1
2 GB, 667 MHz (dual rank) 405476-051 432668-001 Mandatory1
4 GB, 667 MHz (dual rank) 405477-061 432670-001 Mandatory1
8 GB, 667 MHz (dual rank) 495605-B21 432671-001 Mandatory1
1 GB, PC2-5300, Low Power (single 487004-061 488608-001 Mandatory1

rank)
2 GB, PC2-5300, Low Power (single 405476-061 430451-001 Mandatory1

rank)
4 GB, PC2-5300, Low Power (dual 487005-061 487945-001 Mandatory1

rank)
4 GB, PC2-6400, Low Power 504465-061 504589-001 Mandatory1
2 GB, 800 MHz PC2-6400, (dual rank) 499276-061 501157-001 Mandatory1
4 GB, 800 MHz PC2-6400, (dual rank) 499277-061 501158-001 Mandatory1
Hard drivesx
36 GB 10k single port SAS hard drive 375863-003 376596-001 Mandatory1
36 GB 15k dual port SAS hard drive 418373-002 418397-001 Mandatory1

72 GB 10k SAS single port hard drive 375861-B21 404785-001 Mandatory1
146 GB 10k single port SAS hard 375863-012 432320-001 Mandatory1

drive
SAS parts
13 Smart Array cache module 256 MB 012764-004 405836-001 Optional2
14 Smart Array BBWC battery pack 256 381573-001 398648-001 Optional2

MB
Cablesx
Upper fan cable assembly AH233-2001A 491202-001 No3
Lower fan cable assembly AH233-2002A 491203-001 No3
Power cable midplane assembly AH233-2003B 491204-001 No3
Power cable I/O assembly AH233-2004A 491205-001 No3
Power signal cable assembly AH233-2005A 491206-001 No3
GPU power cable assembly AH233-2006A 491207-001 Optional2
SAS power assembly AH233-2008A 491208-001 Optional2
CA assembly , CD MULTIBAY,40" 356452-004
Cable kit None 449432-001 No3
Miscellaneousx
Battery, 3 V, Lithium 166899-001 153099-001 Mandatory1
Rack mount kit, universal 374503-001 377839-001 Mandatory1
ac power cord: HP 3.6m 391222-291 515763-001 Mandatory1

C19-NEMA515P JP
x
Not shown
1
MandatoryParts for which customer self repair is mandatory. If you request HP to replace
2
OptionalParts for which customer self repair is optional. These parts are also designed for
customer self repair. If, however, you require that HP replace them for you, there may or may
not be additional charges, depending on the type of warranty service designated for your product.
3
NoSome HP parts are not designed for customer self repair. In order to satisfy the customer
1
Mandatory: ObligatoirePices pour lesquelles la rparation par le client est obligatoire. Si
vous demandez HP de remplacer ces pices, les cots de dplacement et main d'uvre du
2
Optional: FacultatifPices pour lesquelles la rparation par le client est facultative. Ces pices
sont galement conues pour permettre au client d'effectuer lui-mme la rparation. Toutefois,
3
No: NonCertaines pices HP ne sont pas conues pour permettre au client d'effectuer lui-mme
la rparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pice
soit effectu par un Mainteneur Agr. Ces pices sont identifies par la mention Non dans le
Catalogue illustr.
1
Mandatory: ObbligatorieParti che devono essere necessariamente riparate dal cliente. Se il
cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera
per il servizio.
2
Optional: OpzionaliParti la cui riparazione da parte del cliente facoltativa. Si tratta comunque
di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad
HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il
prodotto.
3
No: Non CSRAlcuni componenti HP non sono progettati per la riparazione da parte del
cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di
assistenza autorizzato. Tali parti sono identificate da un No nel Catalogo illustrato dei
componenti.
1
Mandatory: ZwingendTeile, die im Rahmen des Customer Self Repair Programms ersetzt
werden mssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und
Arbeitskosten fr diesen Service berechnet.
2
Optional: OptionalTeile, fr die das Customer Self Repair-Verfahren optional ist. Diese Teile
sind auch fr Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von
3
No: KeinEinige Teile sind nicht fr Customer Self Repair ausgelegt. Um den Garantieanspruch
1
Mandatory: Obligatoriocomponentes para los que la reparacin por parte del usuario es
obligatoria. Si solicita a HP que realice la sustitucin de estos componentes, tendr que hacerse
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
2
Optional: Opcional componentes para los que la reparacin por parte del usuario es opcional.
Estos componentes tambin estn diseados para que puedan ser reparados por el usuario. Sin
3
No: NoAlgunos componentes no estn diseados para que puedan ser reparados por el
usuario. Para que el usuario haga valer su garanta, HP pone como condicin que un proveedor
de servicios autorizado realice la sustitucin de estos componentes. Dichos componentes se
identifican con la palabra No en el catlogo ilustrado de componentes.
1
Mandatory: VerplichtOnderdelen waarvoor Customer Self Repair verplicht is. Als u HP
verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: OptioneelOnderdelen waarvoor reparatie door de klant optioneel is. Ook deze
onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen
3
No: NeeSommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband
met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden
vervangen. Deze onderdelen worden in de gellustreerde onderdelencatalogus aangemerkt met
"Nee".

1
Mandatory: ObrigatriaPeas cujo reparo feito pelo cliente obrigatrio. Se desejar que a HP
substitua essas peas, sero cobradas as despesas de transporte e mo-de-obra do servio.
2
Optional: OpcionalPeas cujo reparo feito pelo cliente opcional. Essas peas tambm so
projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode
haver ou no a cobrana de taxa adicional, dependendo do tipo de servio de garantia destinado
ao produto.
3
No: NenhumaAlgumas peas da HP no so projetadas para o reparo feito pelo cliente. A
Essas peas esto identificadas com a marca No (No), no catlogo de peas ilustrado.
22
3 Removal and replacement procedures
In this section
Required tools (page 23)
Safety considerations (page 23)
Preparation procedures (page 24)
Media module (SID assembly) (page 28)
Front Bezel (page 29)
Mezzanine filler (page 29)
Mezzanine filler bezel (page 29)
Mezzanine board (page 29)
Processor memory cell (page 29)
Processor memory cell bezel (page 30)
Processor memory cell airflow baffle (page 30)
Processors (page 30)
DIMMs (page 36)
SAS hard drive blank (page 37)
SAS hard drives (page 37)
DVD, CD drive or blank (page 38)
Power supply blank (page 38)
Power supply (page 38)
Hot-plug fans (page 39)
Expansion slot covers (page 41)
Expansion boards (page 42)
SAS backplane (page 44)
Battery-backed write cache procedures (page 44)
Power supply backplane (page 47)
SPI (core I/O) board (page 48)
System battery (page 48)
I/O backplane assembly (page 49)
Midplane board (page 50)
Required tools
You need the following items for some removal and replacement procedures:
Torx T-15 screwdriver (provided with the server, see Rear panel components (page 68))
Phillips screwdriver
Flathead screwdriver
Diagnostics Utility
Safety considerations
Before performing service procedures, review the following safety information.
Preventing electrostatic discharge

To prevent damaging the system, be aware of the precautions you need to follow when setting
up the system and handling parts. A discharge of static electricity from a finger or other conductor
can damage system boards or other static-sensitive devices. This type of damage can reduce the
life expectancy of the server, component or port.
Required tools 23
To prevent electrostatic damage:
Avoid hand contact by transporting and storing products in static-safe containers.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free
workstations.
Place parts on a grounded surface before removing them from their containers.
Avoid touching pins, leads, or circuitry.
Always be properly grounded when touching a static-sensitive component or assembly.
Server warnings and cautions

Before installing a server, be sure that you understand the following warnings and cautions.
WARNING! To reduce the risk of electric shock or damage to the equipment:

Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
Plug the power cord into a grounded electrical outlet that is easily accessible at all times.
Unplug the power cord from the power supply to disconnect power to the equipment.
Do not route the power cord where it can be walked on or pinched by items placed against
it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends
from the server.
WARNING! To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
lead to thermal damage.
Preparation procedures
To access some components and perform certain service procedures, you must perform one or
more of the following procedures:
Power down the server (page 25)
If you must remove a server from a rack or remove a non-hot-plug component from a server,
first power down the server.
Extending the server from the rack (page 25)
If you are performing service procedures in an HP, Compaq branded, telco, or third-party
rack, you can use the locking feature of the rack rails to support the server and gain access
to internal components.
For more information about telco rack solutions, refer to the RackSolutions.com website
(http://www.racksolutions.com/hp).
Removing the server from the rack (page 26)
If the rack environment, cabling configuration, or server location in the rack creates awkward
conditions, remove the server from the rack.
Removing the access panel (page 27)
If you are servicing internal components, remove the access panel.

Power down the server
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.
To power down the server:
1. Shut down the OS as directed by the OS documentation.
2. Press the Power On/Standby button to place the server in standby mode. When the server
enters standby power mode, the system power LED changes to amber.
3. Disconnect the power cords.
The system is now without power.
WARNING! To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some
internal circuitry remain active until ac power is removed.
Extending the server from the rack

The design of the server enables you to access several components through the front of the server.
Installing or accessing the following components will not require extending the server from the
rack:
Processors
Processor memory cell
DIMMs
DVD or CD drive
Hard drives
WARNING! To reduce the risk of personal injury or equipment damage, be sure that the rack
is adequately stabilized before extending a component from the rack.
To extend the server from the rack:
1. Pull down the quick-release levers on each side of the server to release the server from the
rack.
2. Extend the server on the rack rails until the server rail-release latches engage.
Preparation procedures 25
NOTE: The release latches will lock into place when the rails are fully extended.
WARNING! To reduce the risk of personal injury, be careful when pressing the server
rail-release latches and sliding the server into the rack. The sliding rails could pinch your
fingers.
3. After performing the installation or maintenance procedure, slide the server into the rack
by pressing the server rail-release latches.
Removing the server from the rack

To remove the server from an HP, Compaq branded, telco, or third-party rack:
1. Power down the server, see Power down the server (page 25).
2. Disconnect the cabling from the server.
3. Extend the server from the rack, see Extending the server from the rack (page 25).
4. Remove the server from the rack. For more information, refer to the documentation that
ships with the rack mounting option.

5. Place the server on a sturdy, level surface.
Removing the access panel
WARNING! To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
lead to thermal damage.
To remove the access panel:
1. Extend the server from the rack (Extending the server from the rack (page 25)).
2. If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch.
NOTE: The T-15 Torx screwdriver is shipped with the server and can be located on the
rear panel, see Rear panel components (page 68).
3. Lift up on the hood latch and remove the access panel.
Preparation procedures 27
4. After installing hardware options, replace the access panel. Be sure that the panel is securely
locked into place before powering up the server.
Media module (SID assembly)

To remove the media module:
1. Power down the server (Power down the server (page 25)).
2. Extend or remove the server from the rack (Extending the server from the rack (page 25)
or Removing the server from the rack (page 26)).
3. Remove the access panel (Removing the access panel (page 27)).
4. Disconnect all cabling from the media module.
5. Press the media module release latch.
6. Pull the media module away from the server.

To replace the component, reverse the removal procedure.

NOTE: The release latch does not need to be pressed to reinsert the media module.
Front Bezel
To remove the front bezel:
3. Remove processor memory cell 1 (Processor memory cell (page 29)).
4. Remove the serial number tag.
5. Remove the eight screws (four on each side) that secure the bezel to the server.
6. Hold the top two corners of the bezel and pull the bezel away from the server until the two
soft release tabs under the hard drive cage release.
7. Hold open the release latches at the bottom corners of the bezel.
8. Slide the bezel to the right to release it from the tabs on the bottom corners of the chassis
and pull it away from the server.
Reverse the procedure to replace the front bezel.
Mezzanine filler
To remove the mezzanine filler:
2. Press the release button.
3. Open the lever.
4. Grasp the lever and slide the mezzanine filler from the enclosure. Place a hand under the
component to support it as you remove it from the enclosure.
To replace the mezzanine filler reverse the procedure.
IMPORTANT: If replacing the mezzanine filler with a new mezzanine filler, the mezzanine
board must be moved to the new mezzanine filler (see Mezzanine board (page 29)).
Mezzanine filler bezel

To remove the mezzanine filler bezel:
2. Pull out the mezzanine filler enough to access the bezel (Mezzanine filler (page 29)).
3. Press the two release tabs and remove the component.
To replace the mezzanine filler bezel reverse the procedure.
Mezzanine board
To remove the mezzanine board:
2. Remove the mezzanine filler (Mezzanine filler (page 29)).
3. Use a T-15 Torx screwdriver to remove the six screws holding the mezzanine board to the
mezzanine filler.
To replace the mezzanine board reverse the procedure.
Processor memory cell

To remove the processor memory cell:
Front Bezel 29
2. Press the release button.
3. Open the lever.
4. Grasp the lever and slide the processor memory cell from the enclosure. Place a hand under
the component to support it as you remove it from the enclosure.
CAUTION: Always place the processor memory cell on a flat, level, antistatic surface when
working with the component.
To replace the processor memory cell reverse the procedure.
Processor memory cell bezel

To remove the processor memory cell bezel:
2. Pull out the processor memory cell enough to access the bezel (Processor memory cell
(page 29)).
3. Press the back of the bezel, slide it upward, and remove the component.
Processor memory cell airflow baffle

To remove the processor memory cell airflow baffle:
2. Remove the processor memory cell (Processor memory cell (page 29)).
3. Press the two airflow baffle release tabs, pivot the airflow baffle up, and remove the
component.
Processors
The server supports a four- or eight-processor configuration.

CAUTION: The cell filler is required to be place in cells 3 6 in a four-processor configuration.
CAUTION: Before starting this procedure, read the information about protecting against
electrostatic discharge (Preventing electrostatic discharge (page 23)).
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor
configurations must contain processors with the same part number.
CAUTION: All supported AMD Opteron quad-core processors 3.1 GHz or greater and all
supported AMD Opteron six-core processors require the system maintenance switch, located on
the I/O backplane, (SW1) position 5 to be in the On position.
HP recommends updating to the latest version of firmware. Earlier firmware versions might not
validate the required switch setting for these processors.
NOTE: Six-core AMD Opteron Processors might show a 1 MB reduction in available L3 cache
when performance enhancing HT Assist is enabled because HT Assist requires 1MB of L3 cache
per CPU to operate.
To replace a processor:
3. Remove the processor memory cell airflow baffle (Processor memory cell airflow baffle
(page 30)).
WARNING! To reduce the risk of personal injury from hot surfaces, allow the heatsink to
cool before touching it.
4. Open the heatsink retaining bracket.
Processors 31
5. Remove the heatsink.
6. Open the processor retaining latch and the processor socket retaining bracket.

7. Using your fingers, remove the failed processor.
8. If the processor has separated from the installation tool, carefully reinsert the processor in
the tool.
IMPORTANT: Be sure the replacement processor remains inside the processor installation
tool.
9. Align the processor installation tool with the socket and install the spare processor.
CAUTION: The processor is designed to fit one way into the socket. Use the alignment
guides on the processor and socket to properly align the processor with the socket.
10. Press down firmly until the processor installation tool clicks and separates from the processor,
then remove the processor installation tool.
Processors 33
11. Close the processor retaining latch and the processor socket retaining bracket.

12. Clean the old thermal grease from the heatsink with an alcohol swab. Allow the alcohol to
evaporate before continuing.
13. Apply all the new grease to the top of the processor in one of the following patterns to ensure
even distribution.
14. Install the heatsink.
15. Close the heatsink retaining bracket.

16. Replace the processor memory airflow baffle.
Processors 35
17. Install the processor memory cell into the server.
18. Power up the server.
DIMMs
Each processor memory cell can hold two to eight DIMMs, At least one pair of DIMMs must be
installed in slots 1A and 2A on each processor memory cell to operate the server. The following
DDR2 667-MHz DIMM sizes are supported:
1 GB
2 GB
4 GB
8 GB
Number of processors Minimum memory Maximum memory
4 8 GB (eight 1-GB DIMMS) 256 GB (32 8-GB DIMMS)
8 16 GB (16 1-GB DIMMS) 512 GB (64 8-GB DIMMS)
Observe the following DIMM installation guidelines to add additional memory to the server:
DIMMs must be installed in pairs.
DIMM installed on the same memory bank (DIMM pairs) must have the same part number.
DIMMs installed in different memory banks can be of different sizes.
A minimum of two DIMMs must be installed per processor memory cell.
DIMM pairs must be installed evenly across processor memory cells.
DIMMs must be installed in decreasing capacity with the largest DIMMs installed in the
banks furthest away from each processor.
NOTE: If all four banks on a memory node are populated, the maximum memory clock
speed is 533 MHz. If two or fewer banks on a memory node are populated, the maximum
memory clock speed is 677 MHz.
CAUTION: DIMM fillers are required to cover pairs of empty DIMM slots.
To remove a DIMM:
3. Remove the processor memory cell airflow baffle (Processor memory cell airflow baffle
(page 30)).
4. Open the DIMM slot latches.
5. Remove the DIMM.

SAS hard drive blank
To remove a SAS hard drive blank:
1. Squeeze the tabs on the front of the filler to release it from the slot in the drive bay.
2. Pull gently until the filler slides out of the chassis.
SAS hard drives

CAUTION: Always power down the server if the boot partition resides on the drive you are
replacing or if you are replacing the only drive in the server.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To remove a SAS hard drive:
1. Determine the status of the hard drive from the hot-plug hard drive LEDs (SAS and SATA
hard drive LEDs (page 66) and SAS and SATA hard drive LED combinations (page 66)).
2. Back up all data on the hard drive.
3. Remove the hard drive.
SAS hard drive blank 37

DVD, CD drive or blank

To remove a DVD, CD drive or blank:
4. Remove the media module (Media module (SID assembly) (page 28)).
5. Lift the DVD release tab on the left side of the media module and push the drive out from
the rear.
Power supply blank

To remove a power supply blank, squeeze the thumb lever and pull the power supply blank out
of the server.
Power supply
The server supports three or six hot-plug power supplies. Six are required to provide 3+3
redundant power to the system in the event of a failure in a primary power supply. You can
install or replace a redundant hot-plug power supply without powering down the server.
WARNING! To reduce the risk of electric shock, do not disassemble the power supply or attempt
to repair it. Replace it only with the specified replacement part.
CAUTION: If only three power supply are installed, do not remove a power supply unless the
server has been powered down. Removing a primary operational power supply causes an
immediate power loss to the server.
all bays are populated with either a component or a blank.
IMPORTANT: For maximum server availability, be sure that the primary and redundant power
supplies are powered by separate ac power sources.
See Power supply LED (page 70) for information on the current status of the power supply.
To remove a power supply:
1. Disconnect the power cord from the power supply.
2. Press the thumb lever.

3. Remove the power supply.
Hot-plug fans
The server supports redundant hot-plug fans, each with two individual fans rotors, in a 5+1
configuration to provide proper airflow to the server. The airflow strategy contains two thermal
zones with three fan units in the bottom zone (accessed from the server rear), and three fan units
in the upper zone (accessed internally). See Fan locations (page 75).
WARNING! To prevent personal injury from hazardous energy:

Remove watches, rings, or other metal objects.
Use tools with insulated handles.
Do not place tools or metal parts on top of batteries.
Rear accessed hot-plug fans

To replace a rear accessed hot-plug fan:
1. Identify the failed fan by locating an amber LED on the Systems Insight Display.
Hot-plug fans 39
2. Pull on the fan tray release bar, pull the fan housing unit straight out from the rear of the
chassis until it stops, and tilt the tray down to expose the fan housing unit.
3. Insert your thumb and forefinger into the openings on the top of the fan and squeeze until
the fan releases from the socket.
4. Pull the fan straight up and out of the chassis.
IMPORTANT: Remove and replace only one fan at a time. If the system detects two fan
failures, the server shuts down to avoid thermal damage.
5. Install a new hot-plug fan.
CAUTION: To prevent server components from overheating, replace a fan within 20 seconds.
Failure to observe this caution results in the server automatically shutting down to prevent
an overtemperature condition.
NOTE: The fan unit is keyed to fit into the fan housing in the correct orientation only.
6. Push the fan housing unit toward the front of the chassis until it clicks into place.
7. Check the Systems Insight Display LED that corresponds to the replaced fan unit.
NOTE: It can take up to ten seconds after installation for the Systems Insight Display fan
LED to turn off.
If the front panel internal system health LED is not green after you install hot-plug fans,
reseat the hot-plug fan or refer to the troubleshooting section.
Internally accessed hot-plug fans

To replace an internally accessed hot-plug fan:
3. Identify the failed fan by it the lit LED on the Systems Insight Display.
4. Insert thumb and forefinger into the openings on the top of the fan and squeeze until the
fan releases from the socket.

5. Pull the fan straight up and out of the chassis.
IMPORTANT: Remove and replace only one fan at a time. If the system detects two fan
failures, the server shuts down to avoid thermal damage.
6. Install a new hot-plug fan.
CAUTION: To prevent server components from overheating, replace a fan within 20 seconds.
Failure to observe this caution results in the server automatically shutting down to prevent
an overtemperature condition.
NOTE: The fan unit is keyed to fit into the fan housing in the correct orientation only.
7. Check the Systems Insight Display LED that corresponds to the replaced fan unit.
NOTE: It can take up to ten seconds after installation for the Systems Insight Display fan
LED to turn off.
If the front panel internal system health LED is not green after you install hot-plug fans,
reseat the hot-plug fan or refer to the troubleshooting section.
8. Replace the access panel.
9. Slide the server into the rack.
Expansion slot covers

all expansion slots have either an expansion slot cover or an expansion board installed.
To remove an expansion slot cover:
4. Open the latch and remove the expansion slot cover.
Expansion slot covers 41

Expansion boards
PCIe I/O backplane
Item Description
1 PCI Express x8 non-hot-plug expansion slot 11

PCIe I/O backplane
Item Description
Combo PCIe/HTx I/O backplane
Item Description
1 Blank slot
2 HyperTransport non-hot-plug expansion slot 9
3 Blank slot
IMPORTANT: Install high powered graphics cards in PCIe 16x slots for optimum performance.
The server can power a maximum of four auxiliary high powered graphics card power
connections.
To remove a non-hot-plug expansion board:
Expansion boards 43
4. Disconnect any internal or external cables attached to the expansion board.
5. Push and hold the spring loaded latch to the side of the server, and lift up on the hinge.
6. Unlock the retaining clip (for full-length expansion boards).

7. Remove the board from the server.
SAS backplane
To remove the SAS backplane:
2. Remove all the hard drives (SAS hard drives (page 37)).
5. Disconnect all cables from the SAS backplane.
6. Slide the retaining bracket to the front of the server.
7. Lift the backplane, slide the board over the anchoring pins, and, tilting the board, lift it out
of the server.
Battery-backed write cache procedures

Three procedures are provided for the BBWC option:
Removal and replacement of failed components:
Removing the cache module (page 45)
Removing the BBWC battery pack (page 45)
Recovering data from the battery-backed write cache (page 47)

CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching
the cable causes any unsaved data in the cache module to be lost.
Removing the cache module
CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED
before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds,
do not remove the cable from the cache module. The cache module is backing up data, and data
is lost if the cable is detached.
2. Extend the server from the rack (Extending the server from the rack (page 25)).
4. If the existing cache is connected to a battery, observe the BBWC Status LED (Battery pack
LEDs (page 74)).
If the LED is blinking every two seconds, data is still trapped in the cache. Restore
system power and repeat the previous steps.
If the LED is not lit, disconnect the battery cable from the cache.
5. Remove the cache module from the controller.

Removing the BBWC battery pack

Battery-backed write cache procedures 45

CAUTION: To prevent a server malfunction or damage to the equipment, do not add or

remove the battery pack while an array capacity expansion, RAID level migration, or stripe
size migration is in progress.
CAUTION: After the server is powered down, wait 15 seconds and then check the amber
LED before unplugging the cable from the cache module. If the amber LED blinks after 15
seconds, do not remove the cable from the cache module. The cache module is backing up
data, and data is lost if the cable is detached.
4. Remove the BBWC battery pack.

5. Disconnect the cable from the cache module only if the battery pack is not being used to
recover data from the server or transfer data to another server.
CAUTION: Detaching the cable that connects the battery pack to the cache module while
it is being used to recover data from the server or transfer data to another server causes any
unsaved data in the cache module to be lost.

IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST
error message displays when the server is powered up, indicating that the battery pack is
temporarily disabled. No action is necessary. The internal circuitry automatically recharges the
batteries and enables the battery pack. This process can take up to four hours. During this time,
the cache module functions properly, but without the performance advantage of the battery
pack.
NOTE: The data protection and the time limit also apply if a power outage occurs. When power
is restored to the system, an initialization process writes the preserved data to the hard drives.
Recovering data from the battery-backed write cache

If the server fails, you can recover any data temporarily trapped in the BBWC by using the
following procedure.
1. Perform one of the following tasks:
Set up a recovery server station using an identical server model. Do not install any
internal drives or BBWC in this server. (This is the preferred option.)
Find a server that has enough empty drive bays to accommodate all the drives from
the failed server and that meets all the other requirements for drive and array migration.
2. Power down the failed server. If any data is trapped in the cache module, an amber LED on
the module blinks every 15 seconds.
CAUTION: Do not detach the cable that connects the battery pack to the cache module.
Detaching the cable causes any unsaved data in the cache module to be lost.
3. Transfer the hard drives from the failed server to the recovery server station.
4. Remove the BBWC module (Removing the cache module (page 45)) and battery pack
(Removing the BBWC battery pack (page 45)) from the failed server.
5. Perform one of the following tasks:
Install the BBWC into an empty BBWC DIMM socket on the system board of the recovery
server.
Install the BBWC into an empty BBWC DIMM socket on any Smart Array Controller
in the recovery server.
6. Power up the recovery server. A 1759 POST message displays, stating that valid data was
flushed from the cache. This data is now stored on the drives in the recovery server. You
can now transfer the drives (and controller, if one was used) to another server.
Power supply backplane

To remove the power supply backplane:
2. Remove the server from the rack (Removing the server from the rack (page 26)).
4. Remove all power supplies (Power supply (page 38)).
5. Disconnect all cables from the power supply backplane.
6. Slide the retaining bracket to the rear of the server.
7. Lift the backplane, slide the board over the anchoring pins, and lift the board straight out
of the server.
Power supply backplane 47

SPI (core I/O) board

The System Peripheral Interconnect (SPI) board implements all the logic to support the internal
devices and the standard connectivity of the product. The board includes a RAID5 SAS controller
which supports up to eight of the sixteen embedded SAS disk drives.
CAUTION: Only authorized technicians trained by HP should attempt to remove the SPI board.
If you believe the SPI board requires replacement, contact HP Technical Support before
proceeding.
The procedures for removing and replacing the SPI board are the same as other expansion boards.
See Expansion boards (page 42).
IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server serial
number through RBSU (Re-entering the server serial number and product ID (page 48)).
Re-entering the server serial number and product ID

After you replace the SPI board, you must re-enter the server serial number and the product ID.
1. During the server startup sequence, press F9 to access RBSU.
2. Select the Advanced Options menu.
3. Select Serial Number. The following warning displays:
Warning: The serial number should ONLY be modified by qualified service personnel. This value should always
match the serial number located on the chassis.
4. Press Enter to clear the warning.

5. Enter the serial number.
6. Select Product ID. The following warning displays:
Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always
match the Product ID located on the chassis.
7. Enter the product ID and press Enter.

8. Press Escape to close the menu.
9. Press Escape to exit RBSU.
10. Press F10 to confirm exiting RBSU. The server automatically reboots.
System battery
If the server no longer automatically displays the correct date and time, you might need to replace
the battery that provides power to the real-time clock. Under normal use, battery life is five to
ten years.
WARNING! The computer contains an internal lithium manganese dioxide, a vanadium

pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
Do not attempt to recharge the battery.
Do not expose the battery to temperatures higher than 60C (140F).
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
Replace only with the spare battery designated for this product.
To remove the battery:

4. Locate the battery on the SPI board (SPI board components (page 72)).
5. Remove the battery.

Run the RBSU to configure the server after replacing the battery. For more detailed information
see the HP ROM-Based Setup Utility User Guide on the Documentation CD.
I/O backplane assembly

To remove the I/O backplane assembly:
4. Disconnect all cables.
5. Remove all expansion boards and the SPI board (Expansion boards (page 42)
and SPI (core I/O) board (page 48)).
6. Slide the latch to unlock the release lever.
7. Pull up on the release lever to disengage the I/O backplane assembly from the midplane
board.
I/O backplane assembly 49

8. Pull the I/O backplane assembly out of the chassis.
Midplane board
TIP: HP recommends troubleshooting the system using port 85 codes before replacing the
midplane board. See Troubleshooting the system using port 85 codes (page 57) for a list of
codes and troubleshooting procedures.
To remove the midplane board:
2. Remove the server from the rack (Removing the server from the rack (page 26)).
4. Remove all processor memory cells (Processor memory cell (page 29)).
5. Remove the cell filler (Mezzanine filler (page 29)).
6. Remove the I/O backplane assembly (I/O backplane assembly (page 49)).
7. Disconnect the cables from the midplane board.
8. Use a T-15 Torx screwdriver to remove the three screws securing the midplane board to the
chassis.
9. Slide the midplane board to the right, over the anchoring pins.

CAUTION: When removing the midplane board do not allow the lower connectors to touch
the chassis. Allowing the midplane board connectors to touch the chassis can damage the
board.
10. Tilt the board to avoid contact between the lower connectors and the chassis, and pull the
board out through the front of the server.
Midplane board 51
52
4 Diagnostic tools
In this section
SmartStart software (page 53)
SmartStart Scripting Toolkit (page 53)
HP Instant Support Enterprise Edition (page 54)
Option ROM Configuration for Arrays (page 54)
HP ROM-Based Setup Utility (page 54)
ROMPaq utility (page 55)
System Online ROM flash component utility (page 55)
Integrated Management Log (page 55)
Integrated Lights-Out 2 technology (page 55)
Automatic Server Recovery (page 56)
HP Systems Insight Manager (page 56)
HP Insight Diagnostics (page 56)
USB support (page 56)
Troubleshooting the system using port 85 codes (page 57)
SmartStart software
SmartStart is a collection of software that optimizes single-server setup, providing a simple and
consistent way to deploy server configuration. SmartStart has been tested on many ProLiant
server products, resulting in proven, reliable configurations.
SmartStart assists the deployment process by performing a wide range of configuration activities,
including:
Configuring hardware using embedded configuration utilities, such as RBSU and ORCA
Preparing the system for installing "off-the-shelf" versions of leading operating system
software
Installing optimized server drivers, management agents, and utilities automatically with
every assisted installation
Testing server hardware using the Insight Diagnostics Utility (HP Insight Diagnostics
(page 56))
Installing software drivers directly from the CD. With systems that have internet connection,
the SmartStart Autorun Menu provides access to a complete list of ProLiant system software.
Enabling access to the Array Configuration Utility, Array Diagnostic Utility, and Erase
Utility
SmartStart is included in the HP ProLiant Essentials Foundation Pack. For more information
about SmartStart software, refer to the HP ProLiant Essentials Foundation Pack or the HP website
(http://h18013.www1.hp.com/products/servers/management/smartstart/
index.html).
SmartStart Scripting Toolkit

The SmartStart Scripting Toolkit is a server deployment product that delivers an unattended
automated installation for high-volume server deployments. The SmartStart Scripting Toolkit is
designed to support ProLiant BL, ML, and DL servers. The toolkit includes a modular set of
utilities and important documentation that describes how to apply these new tools to build an
automated server deployment process.
Using SmartStart technology, the Scripting Toolkit provides a flexible way to create standard
server configuration scripts. These scripts are used to automate many of the manual steps in the
SmartStart software 53
server configuration process. This automated server configuration process cuts time from each
server deployed, making it possible to scale server deployments to high volumes in a rapid
manner.
For more information, and to download the SmartStart Scripting Toolkit, refer to the HP website
(http://www.hp.com/servers/sstoolkit).
HP Instant Support Enterprise Edition

ISEE is a proactive remote monitoring and diagnostic tool to help manage your systems and
devices, a feature of HP support. ISEE provides continuous hardware event monitoring and
automated notification to identify and prevent potential critical problems. Through remote
diagnostic scripts and vital system configuration information collected about your systems, ISEE
enables fast restoration of your systems. Install ISEE on your systems to help mitigate risk and
prevent potential critical problems.
For more information on ISEE, refer to the HP website
(http://www.hp.com/hps/hardware/hw_enterprise.html).
To download HP ISEE, visit the HP website
(http://www.hp.com/hps/hardware/hw_downloads.html).
For installation information, refer to the HP ISEE Client Installation and Upgrade Guide
(ftp://ftp.hp.com/pub/services/hardware/info/isee_client.pdf).
Option ROM Configuration for Arrays

Before installing an operating system, you can use the ORCA utility to create the first logical
drive, assign RAID levels, and establish online spare configurations.
The utility also provides support for the following functions:
Reconfiguring one or more logical drives
Viewing the current logical drive configuration
Deleting a logical drive configuration
Setting the controller to be the boot controller
If you do not use the utility, ORCA will default to the standard configuration.
For more information regarding array controller configuration, refer to the controller user guide.
For more information regarding the default configurations that ORCA uses, refer to the HP
ROM-Based Setup Utility User Guide on the Documentation CD.
HP ROM-Based Setup Utility

RBSU, an embedded configuration utility, performs a wide range of configuration activities that
may include:
Configuring system devices and installed options
Enabling and disabling system features
Displaying system information
Selecting the primary boot controller
Configuring memory options
Language selection
For more information on RBSU, refer to the HP ROM-Based Setup Utility User Guide on the
Documentation CD or the HP website (http://www.hp.com/support/smartstart/
documentation).
54 Diagnostic tools
ROMPaq utility
The ROMPaq utility enables you to upgrade the system firmware (BIOS) or Lights-Out 100
firmware. To upgrade the firmware, insert a ROMPaq diskette into the diskette drive or ROMPaq
USB Key into an available USB port and boot the system.
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available
ROM revisions.
For more information about the ROMPaq utility, refer to the HP website (http://www.hp.com/
go/support).
System Online ROM flash component utility

The Online ROM Flash Component Utility enables system administrators to efficiently upgrade
system or controller ROM images across a wide range of servers and array controllers. This tool
has the following features:
Works offline and online
Supports MicrosoftWindows NT, Windows 2000, Windows Server 2003, Novell
Netware, and Linux operating systems
IMPORTANT: This utility supports operating systems that may not be supported by the
server. For operating systems supported by the server, refer to the HP website
(http://www.hp.com/support).
Integrates with other software maintenance, deployment, and operating system tools
Automatically checks for hardware, firmware, and operating system dependencies, and
installs only the correct ROM upgrades required by each target server
To download the tool and for more information, refer to the HP website
(http://www.hp.com/support).
Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps
each event with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
From within HP SIM (HP Systems Insight Manager (page 56))
From within Survey Utility
From within operating system-specific IML viewers
For NetWare: IML Viewer
For Windows: IML Viewer
For Linux: IML Viewer Application
From within the iLO 2 user interface
From within HP Insight Diagnostics (HP Insight Diagnostics (page 56))
For more information, refer to the Management CD in the HP ProLiant Essentials Foundation
Pack.
Integrated Lights-Out 2 technology

The iLO 2 subsystem is a standard component of selected ProLiant servers that provides server
health and remote server manageability. The iLO 2 subsystem includes an intelligent
microprocessor, secure memory, and a dedicated network interface. This design makes iLO 2
independent of the host server and its operating system. The iLO 2 subsystem provides remote
ROMPaq utility 55
access to any authorized network client, sends alerts, and provides other server management
functions.
Using iLO 2, you can:
Remotely power up, power down, or reboot the host server.
Send alerts from iLO 2 regardless of the state of the host server.
Access advanced troubleshooting features through the iLO 2 interface.
Diagnose iLO 2 using HP SIM through a web browser and SNMP alerting.
For more information about iLO 2 features, refer to the iLO 2 documentation on the Documentation
CD or on the HP website (http://www.hp.com/servers/lights-out).
Automatic Server Recovery

ASR is a feature that causes the system to restart when a catastrophic operating system error
occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts
when the System Management driver, also known as the Health Driver, is loaded. When the
operating system is functioning properly, the system periodically resets the timer. However,
when the operating system fails, the timer expires and restarts the server.
ASR increases server availability by restarting the server within a specified time after a system
hang or shutdown. At the same time, the HP SIM console notifies you by sending a message to
a designated pager number that ASR has restarted the system. You can disable ASR from the
HP SIM console or through RBSU.
HP Systems Insight Manager

HP SIM is a web-based application that allows system administrators to accomplish normal
administrative tasks from any remote location, using a web browser. HP SIM provides device
management capabilities that consolidate and integrate management data from HP and third-party
devices.
IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for
processors, SAS and SCSI hard drives, and memory modules.
For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation
Pack or the HP SIM website (http://www.hp.com/go/hpsim).
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online
versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators
who verify server installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing
while the OS is not running. To run this utility, launch the SmartStart CD.
HP Insight Diagnostics Online Edition is a web-based application that captures system
configuration and other related data needed for effective server management. Available in
Microsoft Windows and Linux versions, the utility helps to ensure proper system operation.
For more information or to download the utility, refer to the HP website
(http://www.hp.com/servers/diags).
USB support
HP provides both standard USB support and legacy USB support. Standard support is provided
by the operating system through the appropriate USB device drivers. HP provides support for
USB devices before the operating system loads through legacy USB support, which is enabled
56 Diagnostic tools
by default in the system ROM. HP hardware supports USB version 1.1 or 2.0, depending on the
version of the hardware.
Legacy USB support provides USB functionality in environments where USB support is normally
not available. Specifically, HP provides legacy USB functionality for:
POST
RBSU
Diagnostics
DOS
Operating environments which do not provide native USB support
For more information on ProLiant USB support, refer to the HP website
(http://h18004.www1.hp.com/products/servers/platforms/usb-support.html).
Troubleshooting the system using port 85 codes

For example, if the port 85 code displays "31h," see Processor-related port 85 codes (page 57)
for more information.
Port 85 code Description
3xh Port 85 codes in this format indicate processor-related

errors. See Processor-related port 85 codes (page 57)
for more information.
4xh Port 85 codes in this format indicate memory-related

errors. See Memory-related port 85 codes (page 58) for
more information.
6xh Port 85 codes in this format indicate expansion

board-related errors. See Expansion board-related port
85 codes (page 58) for more information.
All other codes, including 00h, 01h, and 5xh Port 85 codes in this range cover several areas. See
Miscellaneous port 85 codes (page 59) for more
information.
Processor-related port 85 codes

Processor-related port 85 codes Processor-related port 85 codes display in the format 3xh.
IMPORTANT: Reboot the server after completing each numbered step. If the error condition
continues, proceed with the next step.
To troubleshoot processor-related error codes:
1. Bring the server to base configuration by removing all components that are not required by
the server to complete POST. This process can include removing all:
IMPORTANT: The server requires a minimum of processor memory cells 1, 2, 7, 8 and

the cell filler populated with the minimum number of processors and DIMMs at all
times or the server does not function properly.
DIMMs (page 36)

Peripheral devices
2. Reseat the processor in socket 1.
Troubleshooting the system using port 85 codes 57

3. Reseat the remaining processors, rebooting after each installation to identify any failed
processors.
4. Replace the processor in socket 1.
5. Replace the processor board, if applicable.
6. Replace the midplane board.
IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server
serial number through RBSU, see Re-entering the server serial number and product ID
(page 48).
Memory-related port 85 codes

Memory-related port 85 codes display in the format 4xh.
To troubleshoot memory-related error codes:
1. Check the memory LEDs (see System Insight Display LEDs (page 64)) for any identified
errors or failed DIMMs, and take corrective action.

DIMMs (page 36)

Peripheral devices
3. Reseat the remaining memory boards, rebooting after each installation to isolate any failed
memory boards, if applicable.
4. Replace the DIMMs with a remaining bank of memory.
5. Replace the memory board, if applicable.
(page 48).
Expansion board-related port 85 codes

Expansion board-related port 85 codes display in the format 6xh.
To troubleshoot expansion board-related error codes:
1. Reseat all expansion boards.
58 Diagnostic tools

DIMMs (page 36)

Peripheral devices
3. Install the expansion boards one at a time, rebooting between each installation to isolate the
failed expansion board.
4. Replace the failed expansion board, if applicable.
5. Replace the PCI riser board, if applicable.
(page 48).
Miscellaneous port 85 codes

To troubleshoot all other port 85 codes:
continues, proceed with the next step

DIMMs (page 36)

Peripheral devices
2. Install each remaining system component, rebooting between each installation to isolate
any failed components.
3. Clear the system NVRAM.
IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server serial
number through RBSU, see Re-entering the server serial number and product ID (page 48).
Troubleshooting the system using port 85 codes 59

60
5 Component identification
In this section
Front panel components (page 61)
Front panel LEDs and buttons (page 63)
System Insight Display LEDs (page 64)
SAS and SATA hard drive LEDs (page 66)
SAS and SATA hard drive LED combinations (page 66)
Processor memory cell components (page 67)
Rear panel components (page 68)
Rear panel LEDs and buttons (page 69)
Power supply LED (page 70)
Internal components (page 70)
SPI board components (page 72)
System maintenance switch (SW6) (page 72)
System maintenance switch (SW1) (page 74)
Battery pack LEDs (page 74)
Fan locations (page 75)
Front panel components
Item Description
1 USB connector
2 USB connector
3 Video connector
4 SID
5 DVD drive
6 Hard drive bay 1 right
Front panel components 61

Item Description
not shown Hard drive bay 1 left (optional)
14 Processor memory cell 1

1 Occupied by a cell filler in four-processor servers.
Front panel LEDs and buttons
Item Description Color Status
1 UID button and LED Off UID button is not activated
Solid blue UID button is activated for server

identification
Flashing blue Server is being remotely managed
2 External health LED Off Normal (system is off or in standby

mode)
Solid green Normal (system is powered on)
Flashing amber Redundant power supply failure

(system power supply is no longer
redundant)
Flashing red Critical power supply failure
3 Internal health LED Off Normal (system is off or in standby

mode)
Solid green Normal (system is powered on)
Flashing amber System degraded (standby mode or

powered on)
Flashing red System critical (standby mode or

powered on)
4 NIC 1 LED Off NIC not used

NOTE: Rear panel NIC can show link
or activity while in standby mode.
Solid green Linked to the network
Flashing green Linked with activity on the network
Front panel LEDs and buttons 63

5 NIC 2 LED Off NIC not used

NOTE: Rear panel NIC can show link
or activity while in standby mode.
Solid green Linked to the network
Flashing green Linked with activity on the network
6 Power button and LED Off No ac power to the system
Solid amber System has ac power and is in standby

mode
Solid green System has ac power and is powered

on
System Insight Display LEDs

The front panel health LEDs indicate only the current hardware status. In some situations, HP
SIM might report server status differently than the health LEDs because the software tracks more
system attributes. The System Insight Display LEDs identify components experiencing an error,
event, or failure.
CAUTION: Do not block airflow by pushing the SID flush against the server while it is in the
down position.
IMPORTANT: When removing the access panel to view the Systems Insight Display LEDs, leave
the server powered on. The Systems Insight Display LEDs are cleared when the server is powered
off.
NOTE: The system management driver must be installed for the internal system health LED
to provide pre-failure and warranty conditions.
LED Component
POWER System power
INT HEALTH Internal component health
EXT HEALTH External component health
TEMP Over temperature
FAN X Fan
PS X Power supply
IO BOARD I/O backplane power
SPI BRD SPI board power
SPI ILK SPI board not fully seated into the I/O backplane
MP INTERLOCK I/O backplane not fully seated into the midplane board
CPU INTERLOCK Processor memory board cell 8 (boot CPU) not fully seated into the midplane
board
PROCESSOR/MEMORY BOARD X DIMM slot

DIMM 1A-8D
System Insight Display LEDs 65

LED Component
PROCESSOR/MEMORY BOARD X Processor

PROC X
PROCESSOR/MEMORY BOARD X Processor DIMM board

BOARD X
SAS and SATA hard drive LEDs
1 Fault/UID LED Amber Drive failure
Flashing amber Fault-process activity
Blue Unit identification is active
Off No fault-process activity
2 Online/activity LED Green Drive activity
Flashing green High activity on the drive or the drive is being

configured as part of an array
Off No drive activity
SAS and SATA hard drive LED combinations

Online/activity LED Fault/UID LED
(green) (amber/blue) Interpretation
On, off, or Alternating amber The drive has failed, or a predictive failure alert has been received for this
flashing and blue drive; it also has been selected by a management application.
On, off, or Solid blue The drive is operating normally and has been selected by a management
flashing application.
On Flashing amber A predictive failure alert has been received for this drive. Replace the drive
(1Hz) as soon as possible.
Online/activity LED Fault/UID LED
(green) (amber/blue) Interpretation
On Off The drive is online, but is not currently active.
Flashing (1 Hz) Flashing amber

(1Hz) CAUTION: Do not remove the drive. Removing a drive can terminate the
current operation and cause data loss.
The drive is part of an array that is undergoing capacity expansion or stripe
migration, but a predictive failure alert has been received for this drive. To
minimize the risk of data loss, do not replace the drive until the expansion
or migration is complete.
Flashing (1 Hz) Off

CAUTION: Do not remove the drive. Removing a drive can terminate the
current operation and cause data loss.
The drive is rebuilding, or it is part of an array that is undergoing capacity
expansion or stripe migration.
Flashing Flashing amber The drive is active, but a predictive failure alert has been received for this
irregularly (1Hz) drive. Replace the drive as soon as possible.
Flashing Off The drive is active and is operating normally.

irregularly
Off Solid amber A critical fault condition has been identified for this drive and the controller
has placed it offline. Replace the drive as soon as possible.
Off Flashing amber A predictive failure alert has been received for this drive. Replace the drive
(1Hz) as soon as possible.
Off Off The drive is: offline, a spare, or not configured as part of an array.
Processor memory cell components
Item Description
1 DIMM slot 1A
2 DIMM slot 2A
3 DIMM slot 3B
4 DIMM slot 4B
5 DIMM slot 5C
Processor memory cell components 67

Item Description
6 DIMM slot 6C
7 DIMM slot 7D
8 DIMM slot 8D
9 Processor socket
Rear panel components
Item Description
1 NIC connector 1
2 Keyboard connector
3 USB connector
4 Video connector
5 Serial connector
6 iLO 2 connector
7 Mouse connector
8 NIC connector 2
9 Power supply 1
10 Power supply 2
11 Power supply 3
12 Redundant power supply 4 (optional)
15 PCI Express or HTx expansion slots
16 T-15 Torx screwdriver
17 Fan 4
Item Description
18 Fan 5
19 Fan 6
Rear panel LEDs and buttons
Item Description LED Color Status
1 UID Solid blue Activated
Flashing blue Server remotely managed
Off Deactivated
2 LAN Link LED Green Linked to network
Off Not linked to network
3 LAN Activity LED Green (solid or flashing) Network activity
Off No network activity
Rear panel LEDs and buttons 69

Power supply LED
Color Status
Off No ac power
Blinking green ac power; standby power on
Solid green Full power on; normal operation
Blinking amber Power supply failure
Internal components
Item Description
1 Media module
2 Fan 3
3 Fan 2
Item Description
4 Fan 1
5 System maintenance switch SW6
6 System maintenance switch SW1
7 SPI Board
19 BBWC battery pack
20 Power supply backplane
21 BBWC battery pack (optional)
22 SAS backplane (optional)
23 SAS backplane
Item Description
1 Blank slot
Internal components 71
Item Description
3 Blank slot
SPI board components
SPI (core I/O) board
Item Description
1 BBWC module connections
2 Serial peripheral interface board
3 System battery
System maintenance switch (SW6)

The system maintenance switch (SW6) is an eight position switch that is used for system
configuration. The default position for all eight positions is Off (closed).
Position Description Switch Function
1 iLO 2 security Off iLO 2 security is enabled
On iLO 2 security is disabled
Position Description Switch Function
2 Configuration lock Off System configuration can be changed
On System configuration is locked
3 Reserved Reserved
4 Reserved Reserved
5 Password protection override Off Password is enabled
On Password is disabled
6 Reset configuration Off Switch has no function
On ROM reads system configuration as invalid
7 POST LED switch 1 See Table 5-1 (page 73) for details.
8 POST LED switch 2
Table 5-1 System Maintenance Switch Positions 7 and 8 Detail

Position 7 Position 8 Displayed on LED8LED1
Off Off Port 85
Off On Port 84
On Off iLO
On On Embedded SAS status
System maintenance switch (SW6) 73

System maintenance switch (SW1)
CAUTION: All supported AMD Opteron quad-core processors 3.1 GHz or greater and all
supported AMD Opteron six-core processors require the system maintenance switch, located on
the I/O backplane, (SW1) position 5 to be in the On position.
HP recommends updating to the latest version of firmware. Earlier firmware versions might not
validate the required switch setting for these processors.
Battery pack LEDs
Item ID LED Color Description
1 BBWC status Green To interpret the illumination patters of this LED, see Table 5-2 (page 74)
2 Battery health Amber To interpret the illumination patters of this LED, see Table 5-2 (page 74)
3 Auxiliary Green This LED glows solid when 3.3 V auxiliary voltage is detected. The auxiliary
power voltage preserves BBWC data and is available any time that the system
power cords are connected to a power supply.
4 System power Green This LED glows solid when the system is powered up and 12 V system
power is available. This power supply maintains the battery charge and
provides supplementary power to the cache microcontroller.
Table 5-2 Battery health and BBWC status LED patterns

LED 3 pattern LED 4 pattern Interpretation
Flashing (1/2 Hz) The system is powered down, and the cache contains data that has not yet
been written to the drives. Restore system power as soon as possible to
prevent data loss.
Data preservation time is extended any time that 3.3 V auxiliary power is
available, as indicated by LED 2. In the absence of auxiliary power, battery
None power alone preserves the data. A fullycharged battery can normally preserve
data for at least two days.
The battery lifetime also depends on the cache module size. For further
information, refer to the controller QuickSpecs on the HP website
(http://www.hp.com).
Double flash, then The cache microcontroller is waiting for the host controller to communicate.
None
pause
Table 5-2 Battery health and BBWC status LED patterns (continued)
LED 3 pattern LED 4 pattern Interpretation
Flashing (1 Hz) The battery pack is below the minimum charge level and is being charged.
Features that require a battery (such as write cache, capacity expansion,
None stripe size migration, and RAID migration) are temporarily unavailable until
charging is complete. The recharge process takes between 15 minutes and
two hours, depending on the initial capacity of the battery.
Solid The battery pack is fully charged, and posted write data is stored in the
None
cache.
Off The battery pack is fully charged, and there is no posted write data in the
None
cache.
Flashing (1 Hz) Flashing (1 Hz) An alternating green and amber flash pattern indicates that the cache
microcontroller is executing from within its boot loader and receiving new
flash code from the host controller.
Solid There is a short circuit across the battery terminals or within the battery
None pack. BBWC features are disabled until the battery pack is replaced. The life
expectancy of a battery pack is typically more than three years.
Flashing (1 Hz) There is an open circuit across the battery terminals or within the battery
None pack. BBWC features are disabled until the battery pack is replaced. The life
expectancy of a battery pack is typically more than three years.
Fan locations
Fan locations 75
Item Description
1 Fan 1
2 Fan 2
3 Fan 3
4 Fan 4
5 Fan 5
6 Fan 6
6 Cabling
In this section
Cabling overview (page 77)
BBWC cabling (page 77)
SAS and SATA hard drive cabling (page 78)
SAS expander cabling (page 78)
High power graphics card cabling (page 80)
Cabling overview
This section provides guidelines that help you make informed decisions about cabling the server
and hardware options to optimize performance.
For information on cabling peripheral components, refer to the white paper on high-density
deployment at the HP website (http://www.hp.com/products/servers/platforms).
BBWC cabling
Cabling overview 77
SAS and SATA hard drive cabling
CAUTION: When routing cables, always be sure that the cables are not in a position where they
can be pinched or crimped.
SAS expander cabling

To install a SAS expander:
4. Disconnect the cable connecting the SAS backplane and SPI board. Retain the cable for future
use.
5. Connect the SAS expander to the Smart Array Controller.
78 Cabling
6. Install together the Smart Array Controller into slot 1 and the SAS expander into slot 2
(Expansion boards (page 42)).
7. Route and connect the cables from the SAS expander to the SAS backplanes.
SAS expander cabling 79

TIP: For best cable management route the cable to SAS backplane 1 under the power cable at
the power supply backplane and the cable to SAS backplane 2 under other cables in the center
cable routing channel.
High power graphics card cabling
IMPORTANT: Install high powered graphics cards in PCIe 16x slots for optimum performance.
The server can power a maximum of four auxiliary high powered graphics card power
connections.
80 Cabling
7 Specifications
In this section
Environmental specification (page 81)
Server specifications (page 81)
Environmental specification
Specification Value
Temperature range
Operating 10C to 35C (50F to 95F)1
Non-operating -30C to 60C (-22F to 140F)2
Maximum wet bulb temperature 28C (82.4F)

3
Relative humidity (noncondensing)
Operating 10% to 90% relative humidity (Rh), 28C (82.4F)

maximum wet bulb temperature, non-condensing.
Non-operating 5% to 95% relative humidity (Rh), 38.7C (101.7F)

maximum wet bulb temperature, non-condensing.
Altitude
Operating 3050 m (10,000 ft). This value may be limited by the type
and number of options installed. Maximum allowable
altitude change rate is 457 m/min (1500 ft/min).
Non-operating 9144 m (30,000 ft). Maximum allowable altitude change

rate is 457 m/min (1500 ft/min).
1 10 to 35C (50 to 95F) at sea level with an altitude derating of 1.0C per every 305 m (1.8F per every 1000 ft) above
sea level to a maximum of 3050 m (10,000 ft), no direct sustained sunlight. Maximum rate of change is 10C/hr
(18F/hr). The upper limit may be limited by the type and number of options installed.
System performance may be reduced if operating with a fan fault or above 30C (86F).
2 Maximum rate of change is 20C/hr (36F/hr).
3 Storage maximum humidity of 95% is based on a maximum temperature of 45C (113F). Altitude maximum for
storage corresponds to a pressure minimum of 70 KPa.
Server specifications
Specification Value
Dimension
Height 30.58 cm (12.04 in)
Depth 69.6 cm (27.4 in)
Width 44 cm (17.32 in)

1
Weight (maximum ) 72 kg (160 lbs)
Weight (minium2) 67 kg (147 lbs)
Input requirement Low line High line3

100 - 120 V ac 200 - 240 V ac
Rated input voltage 90 - 132 V ac 180 - 264 V ac
Environmental specification 81
Specification Value
Rated input frequency 47- 63 Hz 47- 63 Hz
Rated input current 24A at100 V ac 14A at 200 V ac
Rated input power 2400 W 2800 W
BTUs per hour 8189 9554
Power supply output Low line High line3
Power supply output 800 W per P.S.U. at 3 P.S.U. active 1200 W per P.S.U. at 3 P.S.U. active
Acoustic Noise4
Idle LWAd 7.6 B
LpAm 58 dBa
Operating LWAd 7.6B
LpAm 58 dBa
1 all hard drives, power supplies, and processors installed
2 one hard drive, three power supplies, and four processor cells installed
3
IMPORTANT: To ensure the ProLiant DL785 G5 Server has sufficient power during normal operation, a server
configured with HP supported high powered graphics cards rated at 225 W or more require high line (200 - 240 V)
ac server configuration. As a precaution, if these cards are installed on a low line (100 - 127 V) ac configured server
the server will halt at Power-On Self-Test with a "Power Supply Solution not Sufficient" message and only boot to
RBSU.
At POST, the ProLiant DL785 G5 server automatically detects whether the power supplies are connected to high-line
power or low-line power. If the server is configured with high powered graphics cards, the system will halt if it
detects that the server is plugged into low-line power. This occurs by design because system configured high power
graphics cards, with a large amount of memory, hard drives, or other options might require more power than can
be provided by low-line power. POST halts this low-line configuration as a precaution against the server having
insufficient power during operation.
If a you wish to operate a server with high power graphics cards when utilizing low-line power, the power supply
solution should be verified as sufficient using the ProLiant DL785 G5 power calculator at http://
h30099.www3.hp.com/configurator/calc/Power%20Calculator%20Catalog.xls. If the power solution
is not deemed sufficient, the server may not have sufficient power to operate normally. If the solution is deemed
sufficient, a ROM-Based Setup Utility option, outlined below, can be used to allow the system to operate in this
configuration.
If the ProLiant DL785 G5 power calculator has determined that the server can be reliably powered at low-line power
with high power graphics cards installed, perform the following steps to override the Power Supply Requirements
setting in ROM-Based Setup Utility (RBSU):
1. Power down the server and remove the high power graphics cards.
2. Power the server back on and press F9 during POST to access RBSU.
3. Select Advanced Options.
4. Scroll down to Power Supply Requirements Override and choose to enable it.
5. Power down the server and reinstall the graphics cards previously removed.
4 Listed are the declared A-Weighted sound power levels (LWAd) and declared average bystander position A-Weighted
sound pressure levels (LpAm) when the product is operating in a 23C ambient environment. Noise emissions were
measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109).
82 Specifications
8 Technical support
In this section
Before you contact HP (page 83)
HP contact information (page 83)
Before you contact HP

Be sure to have the following information available before you call HP:
Technical support registration number (if applicable)
Product serial number
Product model name and number
Applicable error messages
Add-on boards or hardware
Third-party hardware or software
Operating system type and revision level
HP contact information
For the name of the nearest HP authorized reseller:
In the United States, see the HP US service locator webpage
(http://www.hp.com/service_locator).
In other locations, see the Contact HP worldwide (in English) webpage
(http://welcome.hp.com/country/us/en/wwcontact.html).
For HP technical support:
In the United States, for contact options see the Contact HP United States webpage
(http://welcome.hp.com/country/us/en/contact_us.html). To contact HP by
phone:
Call 1-800-HP-INVENT (1-800-474-6836). This service is available 24 hours a day, 7 days
a week. For continuous quality improvement, calls may be recorded or monitored.
If you have purchased a Care Pack (service upgrade), call 1-800-633-3600. For more
information about Care Packs, refer to the HP website (http://www.hp.com).
In other locations, see the Contact HP worldwide (in English) webpage
(http://welcome.hp.com/country/us/en/wwcontact.html).
Before you contact HP 83

84
A Acronyms and abbreviations
ABEND abnormal end
ACU Array Configuration Utility
ADU Array Diagnostics Utility
AMD Advanced Micro Devices
ASR Automatic Server Recovery
BBWR battery-backed write cache
BIOS Basic Input/Output System
CSA Canadian Standards Association
CSR Customer Self Repair
DIMM dual inline memory module
DOS disk operating system
ESD electrostatic discharge
HTx HyperTransport
IEC International Electrotechnical Commission
iLO 2 Integrated Lights-Out 2
IML Integrated Management Log
ISEE Instant Support Enterprise Edition
KVM keyboard, video, and mouse
NEMA National Electrical Manufacturers Association
NFPA National Fire Protection Association
NIC network interface controller
NiMH nickel metal hydride
NVRAM non-volatile memory
ORCA Option ROM Configuration for Arrays
OS operating system
PCI-X peripheral component interconnect extended
PCIe peripheral component interconnect express
PDU power distribution unit
POST Power-On Self Test
PPM processor power module
PSP ProLiant Support Pack
RAID redundant array of inexpensive (or independent) disks
RBSU ROM-Based Setup Utility
RDP Rapid Deployment Pack
RILOE II Remote Insight Lights-Out Edition II
ROM read-only memory
SAS serial attached SCSI
SCSI small computer system interface
SFF small form-factor
SID System Insight Display
SIM Systems Insight Manager
SNMP Simple Network Management Protocol
85
TMRA recommended ambient operating temperature
UID unit identification
UPS uninterruptible power system
USB universal serial bus
VCA Version Control Agent
86 Acronyms and abbreviations

Index
front bezel, 29
A
access panel, 27 H
ASR (see Automatic Server Recovery (ASR)) hard drives (see SAS, hard drives)
Automatic Server Recovery (ASR), 56 HP
contacting, 83
B HP Insight Diagnostics, 56
battery-backed write cache HP Instant Support Enterprise Edition (ISEE), 54
battery pack, 45 HP ROM-Based Setup Utility (see RBSU (HP ROM-Based
data recovery, 47 Setup Utility))
battery-backed write cache (BBWC), 44 HP SIM (see HP Systems Insight Manager)
BBWC (see battery-backed write cache) HP Systems Insight Manager, 56
LED (see LED, battery pack)
blanks I
DVD or CD, 38 illustrated parts catalog, 13
hard drive, 37 iLO 2 (Integrated Lights-Out 2), 55
power supply, 38 IML (see Integrated Management Log (IML))
Integrated Lights-Out 2 (see iLO 2 (Integrated Lights-Out
C 2))
cabling, 7780 Integrated Management Log (IML), 55
BBWC, 77 ISEE (see HP Instant Support Enterprise Edition (ISEE))
hard drive, 78
high power graphics card, 80 L
SAS expander, 7880 LED
components battery pack, 7475
front, 61 front panel, 63
internal, 7072 hard drive, 66
mechanical, 13 power supply, 70
processor memory cell, 67 rear, 69
rear, 68 System Insight Display, 64
system, 16
core I/O board (see SPI board) M
CSR (see customer self repair (CSR)) media module, 28
customer self repair (CSR), 7 mezzanine board, 29
mezzanine filler, 29
D mezzanine filler bezel, 29
diagnostic tools, 53 midplane board, 50
DIMMs, 36
installation guidelines, 36 O
ORCA (Option ROM Configuration for Arrays), 54
E
electrostatic discharge, 23 P
ESD (see electrostatic discharge) port 85 code, 5759
expansion boards, 42 expansion board-related, 58
expansion slot memory-related, 58
covers, 41 miscellanious, 59
expansion slots processor-related, 57
combo PCIe/HTx I/O backplane, 43 power supply, 38
PCIe I/O backplane, 42 backplane, 47
powering down, 25
F preparation procedures, 24
fan processor memory cell, 29
location, 75 airflow baffle, 30
fans, 39 bezel, 30
internal, 40 processors, 30
rear, 39
87
R
rack
extending server from, 25
removing server from, 26
RBSU (HP ROM-Based Setup Utility), 54
removal and replacement procedures, 23
required tools, 23
ROM
updating, 55
ROMPaq Utility, 55
S
safety considerations, 23
SAS
backplane, 44
hard drives, 37
serial number, 48
SID (see System Insight Display)
SmartStart Scripting Toolkit, 53
SmartStart software, 53
specifications
environmental, 81
server, 81
SPI board, 72
system battery, 48
System Insight Display, 64
system maintenance switch
SW1, 74
SW6, 72
Systems Insight Manager (see HP Systems Insight
Manager)
T
technical support, 83
U
USB
support, 56
88 Index
89
*AH233-9002A_ed7*
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HP ProLiant DL785 Server Maintenance and

Service Guide Generation 5 and Generation

HP Part Number: AH233-9002A_ed7

2 Illustrated Parts Catalog...............................................................................................13

3 Removal and replacement procedures......................................................................23

A Acronyms and abbreviations......................................................................................85

Rparation par le client (CSR)

Rparation par le client (CSR) 7

Riparazione da parte del cliente

Customer Self Repair

8 Customer self repair

Reparaciones del propio cliente

Reparaciones del propio cliente 9

Customer Self Repair

Reparo feito pelo cliente

10 Customer self repair

Reparo feito pelo cliente 11

Customer self repair

1 Access panel AH233-2115A 491715-001 Mandatory1

2 Front bezel AH233-2118B 491209-001 Mandatory1

3 Blank, SAS hard drive 376383-001 392613-001 Mandatory1

4 Blank, SAS hard drive 443259-001 449433-001 Mandatory1

5 Blank, media drive AH233-2132A 492134-001 Mandatory1

6 Processor memory AH233-2109D 491104-001 Optional2

6 Processor memory AH233-3401B 492132-001 Mandatory1

Filler, memory air AH233-3417A 491911-001 Mandatory1

Mezzanine filler* AH233-2117E 491102-001 Optional2

Mezzanine filler AH233-3402A 492133-001 Mandatory1

7 Blank, power supply 440204-001 449433-001 Mandatory1

Tool, Torx, T-15* 107473-001 199630-001 Mandatory1

14 Illustrated Parts Catalog

16 Illustrated Parts Catalog

Assembly part Customer self repair

Power supply (G5) 440785-001 441830-001 Mandatory1

Power supply (G6) (HP 1200W CS HE 500172-B21 498152-001 Mandatory1

Power supply (G6) (HP Z 1200W 12V 500173-B21 498152-001 Mandatory1

2 Internal hot-plug fan AH233-2113A 491200-001 Mandatory1

not Rear hot-plug fan AH233-2125A 491201-001 Mandatory1

3 SPI assembly (G5) AH233-60001 512020-001 No3

SPI assembly (G6) 512020-002 No3

4 Media module (SID assembly) AH233-2124A 491198-001 Optional2

5 SAS backplane 013151-001 449420-001 Optional2

6 Midplane board AH233-60002 491716-001 No3

Mezzanine boardx AH233-60003 491717-001 Optional2

7 Power supply backplane assembly AH233-60008 491199-001 No3

Processor memory cell assemblyx AH233-2109D 491104-001 Optional2

Processor memory cell assemblyx AH233-2109E 588797-001 Optional2

8 PCIe I/O backplane assembly AH233-60009 587976-001 No3

Combo PCIe HTx I/O backplane AH233-60010 587977-001 No3

10 Media drive options

DVD/CD-RW drive 383696-002 399959-001 Mandatory1

DVD+RW drive, 8x (optional) 395911-001 399402-001 Mandatory1

DVD drive, 8/24x 395910-001 397928-001 Mandatory1

Heatsink kit, DL785 G5 AH233-2127A 491101-001 Optional2

AMD Opteron 8360SE 2.5 GHz 105W 448202-001 448407-001 Optional2

AMD Opterton 8358SE 2.4 GHz 105W 448202-002 448406-001 Optional2

AMD Opteron 8356 2.3 GHz 75W 448208-001 448405-001 Optional2

AMD Opteron 8354 2.2 GHz 75W 448208-002 448404-001 Optional2

AMD Opteron 8384 2.7 GHz 75W 509498-001 508593-001 Optional2