CD4553
CD4553
CD4553
1
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 1.)
Symbol Parameter Value Unit A = Assembly Location
WL, L = Wafer Lot
VDD DC Supply Voltage Range 0.5 to +18.0 V YY, Y = Year
Vin, Vout Input or Output Voltage Range 0.5 to VDD + 0.5 V WW, W = Work Week
(DC or Transient)
Iin Input Current 10 mA
(DC or Transient) per Pin
ORDERING INFORMATION
Iout Output Current +20 mA
(DC or Transient) per Pin Device Package Shipping
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
highimpedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS (Vin or Vout) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
www.sycelectronica.com.ar
MC14553B
4 3
CIA CIB Q0 9
12 CLOCK Q1 7
Q2 6
10 LE
Q3 5
O.F. 14
11 DIS
DS1 2
DS2 1
13 MR
DS3 15
VDD = PIN 16
VSS = PIN 8
TRUTH TABLE
Inputs
Master
Reset Clock Disable LE Outputs
0 0 0 No Change
0 0 0 Advance
0 X 1 X No Change
0 1 0 Advance
0 1 0 No Change
0 0 X X No Change
0 X X Latched
0 X X 1 Latched
1 X X 0 Q0 = Q1 = Q2 = Q3 = 0
X = Dont Care
www.sycelectronica.com.ar
MC14553B
VDD
Characteristic Symbol Vdc Min Max Min (Note 3.) Max Min Max Unit
Output Voltage 0 Level VOL 5.0 0.05 0 0.05 0.05 Vdc
Vin = VDD or 0 10 0.05 0 0.05 0.05
15 0.05 0 0.05 0.05
1 Level VOH 5.0 4.95 4.95 5.0 4.95 Vdc
Vin = 0 or VDD 10 9.95 9.95 10 9.95
15 14.95 14.95 15 14.95
Input Voltage 0 Level VIL Vdc
(VO = 4.5 or 0.5 Vdc) 5.0 1.5 2.25 1.5 1.5
(VO = 9.0 or 1.0 Vdc) 10 3.0 4.50 3.0 3.0
(VO = 13.5 or 1.5 Vdc) 15 4.0 6.75 4.0 4.0
1 Level VIH Vdc
(VO = 0.5 or 4.5 Vdc) 5.0 3.5 3.5 2.75 3.5
(VO = 1.0 or 9.0 Vdc) 10 7.0 7.0 5.50 7.0
(VO = 1.5 or 13.5 Vdc) 15 11 11 8.25 11
Output Drive Current IOH mAdc
(VOH = 4.6 Vdc) Source 5.0 0.25 0.2 0.36 0.14
(VOH = 9.5 Vdc) Pin 3 10 0.62 0.5 0.9 0.35
(VOH = 13.5 Vdc) 15 1.8 1.5 3.5 1.1
(VOH = 4.6 Vdc) Source 5.0 0.64 0.51 0.88 0.36 mAdc
(VOH = 9.5 Vdc) Other 10 1.6 1.3 2.25 0.9
(VOH = 13.5 Vdc) Outputs 15 4.2 3.4 8.8 2.4
(VOL = 0.4 Vdc) Sink IOL 5.0 0.5 0.4 0.88 0.28 mAdc
(VOL = 0.5 Vdc) Pin 3 10 1.1 0.9 2.25 0.65
(VOL = 1.5 Vdc) 15 1.8 1.5 8.8 1.20
(VOL = 0.4 Vdc) Sink Other 5.0 3.0 2.5 4.0 1.6 mAdc
(VOL = 0.5 Vdc) Outputs 10 6.0 5.0 8.0 3.5
(VOL = 1.5 Vdc) 15 18 15 20 10
Input Current Iin 15 0.1 0.00001 0.1 1.0 Adc
Input Capacitance Cin 5.0 7.5 pF
(Vin = 0)
Quiescent Current IDD 5.0 5.0 0.010 5.0 150 Adc
(Per Package) 10 10 0.020 10 300
MR = VDD 15 20 0.030 20 600
Total Supply Current (Note 4., 5.) IT 5.0 IT = (0.35 A/kHz) f + IDD Adc
(Dynamic plus Quiescent, 10 IT = (0.85 A/kHz) f + IDD
Per Package) 15 IT = (1.50 A/kHz) f + IDD
(CL = 50 pF on all outputs, all
buffers switching)
3. Data labelled Typ is not to be used for design purposes but is intended as an indication of the ICs potential performance.
4. The formulas given are for the typical characteristics only at 25C.
5. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL 50) Vfk
where: IT is in A (per package), CL in pF, V = (VDD VSS) in volts, f in kHz is input frequency, and k = 0.004.
www.sycelectronica.com.ar
MC14553B
www.sycelectronica.com.ar
MC14553B
1000
100
101
899
900
901
990
991
992
993
994
995
996
997
998
999
10
12
13
14
15
16
17
86
87
88
89
90
91
92
93
94
95
96
97
98
99
11
1
2
3
4
5
6
7
8
9
UNITS CLOCK
UNITS Q0
UNITS Q1
UNITS Q2
UNITS Q3
TENS CLOCK
TENS Q0
TENS Q3
UP AT 80 UP AT 980
HUNDREDS
CLOCK
HUNDREDS Q0
HUNDREDS Q3
UP AT 800
DISABLE (DISABLES CLOCK WHEN HIGH)
OVERFLOW
MASTER
RESET
SCAN
OSCILLATOR
DIGIT SELECT 1
UNITS
DIGIT SELECT 2 TENS
DIGIT SELECT 3 HUNDREDS
16 VDD
(a)
PULSE Q3 20 ns tWL(cl)
1000
C
999
GENERATOR Q2 CL 20 ns
90%
Q1 CL CLOCK 50%
10%
LE Q0 CL tPLH
O.F. CL tPHL 1/fcl
DIS DS1 CL BCD OUT 10% 90% 50% tPHL
DS2 tTLH tTHL
MR DS3 OVERFLOW 50%
8 VSS
tTLH
90%
VDD CLOCK 50%
(b) 10%
GENERATOR Q3 tsu trem
C
1 Q2 CL
Q1 CL LATCH 50%
GENERATOR
LE Q0 CL ENABLE
2 tPHL, tPLH
O.F. CL tsu
GENERATOR MR DS1 CL
3 BCD OUT 50%
DS2
DIS DS3
tPHL
VSS
MASTER RESET 50%
tWH(R)
Figure 3. Switching Time Test Circuits and Waveforms
www.sycelectronica.com.ar
MC14553B
OPERATING CHARACTERISTICS
The MC14553B threedigit counter, shown in Figure 4, The Master Reset input, when taken high, initializes the
consists of three negative edgetriggered BCD counters three BCD counters and the multiplexer scanning circuit.
which are cascaded in a synchronous fashion. A quad latch While Master Reset is high the digit scanner is set to digit
at the output of each of the three BCD counters permits one; but all three digit select outputs are disabled to prolong
storage of any given count. The three sets of BCD outputs display life, and the scan oscillator is inhibited. The Disable
(active high), after going through the latches, are time input, when high, prevents the input clock from reaching the
division multiplexed, providing one BCD number or digit at counters, while still retaining the last count. A pulse shaping
a time. Digit select outputs (active low) are provided for circuit at the clock input permits the counters to continue
display control. All outputs are TTL compatible. operating on input pulses with very slow rise times.
An onchip oscillator provides the low frequency Information present in the counters when the latch input
scanning clock which drives the multiplexer output selector. goes high, will be stored in the latches and will be retained
The frequency of the oscillator can be controlled externally while the latch input is high, independent of other inputs.
by a capacitor between pins 3 and 4, or it can be overridden Information can be recovered from the latches after the
and driven with an external clock at pin 4. Multiple devices counters have been reset if Latch Enable remains high
can be cascaded using the overflow output, which provides during the entire reset cycle.
one pulse for every 1000 counts.
C1A
LATCH ENABLE 4
10 SCAN PULSE
R C1
OSCILLATOR 3 GENERATOR
C1B
CLOCK
12 R SCANNER
Q0
PULSE C Q1 QUAD
SHAPER Q2 LATCH
R 10
Q3 9
UNITS Q0
11
DISABLE
(ACTIVE
HIGH) MULTIPLEXER
7
Q0 Q1
C
Q1 QUAD BCD
Q2 LATCH OUTPUTS
R 10
Q3 (ACTIVE
TENS
HIGH)
6
Q2
Q0
C
Q1 QUAD 5
Q3
Q2 LATCH
R
10 Q3
HUNDREDS
2 1 15
DS1 DS2 DS3
13 14 (LSD) DIGIT SELECT (MSD)
MR OVERFLOW (ACTIVE LOW)
(ACTIVE HIGH)
Figure 4. Expanded Block Diagram
www.sycelectronica.com.ar
STROBE
RESET
10 13 10 13
LE MR 4 LE MR 4
12 C1A 0.001 12 C1 A
CLOCK CLK CLK 3
INPUT 3 F
C1B MC14553B C1 B
11 MC14553B 11 14
DIS 14 DIS
O.F. O.F.
Q3 Q2 Q1 Q0 DS3 DS2 DS1 Q3 Q2 Q1 Q0 DS3 DS2 DS1
5 6 7 9 15 1 2 5 6 7 9 15 1 2
5 9
A a
www.sycelectronica.com.ar
3 10
B b
2 11
VDD C c
4 12
MC14553B
D MC14543B d
6 13
Ph e
1 15
7
VDD LD f
7 g 14
BI
5 9
A a
3
B b 10
2 11
C c
4 12
D MC14543B d
6 13
Ph e
1 15
VDD LD f
7 14
BI g
PACKAGE DIMENSIONS
PDIP16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 64808 NOTES:
A 1. DIMENSIONING AND TOLERANCING PER ANSI
ISSUE R Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
B 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F C A 0.740 0.770 18.80 19.55
L
B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.70 1.02 1.77
T PLANE G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
H K M J 0.008 0.015 0.21 0.38
J K 0.110 0.130 2.80 3.30
G L 0.295 0.305 7.50 7.74
D 16 PL
M 0 10 0 10
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01
www.sycelectronica.com.ar
MC14553B
PACKAGE DIMENSIONS
SOIC16
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G03
ISSUE B
D A
16 9 NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
M
h X 45
PROTRUSION.
M
E
8X
MILLIMETERS
16X B B DIM MIN MAX
A 2.35 2.65
0.25 M T A S B S A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
A
H 10.05 10.55
h 0.25 0.75
L
SEATING
14X e PLANE L 0.50 0.90
0 7
A1
T C
www.sycelectronica.com.ar