VND10BSP

ISO HIGH SIDE SMART POWER SOLID STATE RELAY

T YPE V DSS R DS( on ) I OUT V CC
VND10BSP 40 V 0.1 3.4 A 26 V

OUTPUT CURRENT (CONTINUOUS):

14A @ T c = 85oC PER CHANNEL
5V LOGIC LEVEL COMPATIBLE INPUT
THERMAL SHUT-DOWN
UNDER VOLTAGE PROTECTION
OPEN DRAIN DIAGNOSTIC OUTPUT
INDUCTIVE LOAD FAST
DEMAGNETIZATION 10
VERY LOW STAND-BY POWER
DISSIPATION 1

DESCRIPTION
The VND10BSP is a monolithic device made PowerSO-10
using SGS-THOMSON Vertical Intelligent Power
Technology, intended for driving resistive or
inductive loads with one side grounded. This
device has two channels, and a common
diagnostic. Built-in thermal shut-down protects
the chip from over temperature and short circuit.
The status output provides an indication of open
load in on state, open load in off state,
overtemperature conditions and stuck-on to VCC.

BLOCK DIAGRAM

March 1998 1/9

VND10BSP

ABSOLUTE MAXIMUM RATING

Symb ol Parameter Value Unit
V (BR)DSS Drain-Source Breakdown Voltage 40 V
I OUT Output Current (cont.) at T c = 85 o C 14 A
o
I OUT (RMS) RMS Output Current at Tc = 85 C and f > 1Hz 14 A
o
IR Reverse Output Current at T c = 85 C -14 A
I IN Input Current 10 mA
-V CC Reverse Supply Voltage -4 V
I STAT Status Current 10 mA
V ESD Electrostatic Discharge (1.5 k, 100 pF) 2000 V
o
P tot Power Dissipation at T c = 25 C 75 W
o
Tj Junction Operating Temperature -40 to 150 C
o
T s tg Storage Temperature -55 to 150 C

CONNECTION DIAGRAMS

CURRENT AND VOLTAGE CONVENTIONS

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 VND10BSP

THERMAL DATA
o
R t hj-ca se Thermal Resistance Junction-case Max 1.65 C/W
o
R t hj- amb Thermal Resistance Junction-ambient ($) Max 60 C/W
($) When mounted using minimum recommended pad size on FR-4 board

ELECTRICAL CHARACTERISTICS (8 < VCC < 16 V; -40 Tj 125 oC unless otherwise specified)
POWER
Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
VCC Supply Voltage 6 13 26 V
o
In(*) Nominal Current T c = 85 C V DS(on) 0.5 V CC = 13 V 3.4 5.2 A
o
R on On State Resistance I OUT = I n V CC = 13 V T j = 25 C 0.065 0.1
o
IS Supply Current Off St ate Tj = 25 C V CC = 13 V 35 100 A
V DS(MAX) Maximum Voltage Drop I OUT = 7.5 A T j = 85 o C VCC = 13 V 1.2 2 V
o
Ri Output to GND internal T j = 25 C 5 10 20 K
Impedance

SWITCHING
Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
t d(on)(^) Turn-on Delay Time Of R out = 2.7 5 35 200 s
Output Current
t r (^) Rise Time O f O utput R out = 2.7 28 110 360 s
Current
t d(off )(^) Turn-off Delay Time O f R out = 2.7 10 140 500 s
Output Current
tf (^) Fall T ime Of Output R out = 2.7 28 75 360 s
Current
(di/dt) on Turn-on Current Slope R out = 2.7 0.003 0.1 A/s
(di/dt) off Turn-off Current Slope R out = 2.7 0.005 0.1 A/s

LOGIC INPUT
Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
VI L Input Low Level 1.5 V
Voltage
VI H Input High Level 3.5 () V
Voltage
V I(hyst.) Input Hysteresis 0.2 0.9 1.5 V
Voltage
o
I IN Input Current VI N = 5 V Tj = 25 C 30 100 A
V ICL Input Clamp Voltage I IN = 10 mA 5 6 7 V
I IN = -10 mA -0.7 V

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VND10BSP

ELECTRICAL CHARACTERISTICS (continued)

PROTECTION AND DIAGNOSTICS
Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
V STAT Status Voltage Output I STAT = 1.6 mA 0.4 V
Low
V USD Under Voltage Shut 3.5 4.5 6 V
Down
V SCL Status Clamp Voltage I STAT = 10 mA 5 6 7 V
I STAT = -10 mA -0.7 V
o
T TSD Thermal Shut-down 140 160 180 C
Temperature
o
T SD(hys t.) Thermal Shut-down 50 C
Hysteresis
o
TR Reset Temperature 125 C
V OL Open Voltage Level Off-State (note 2) 2.5 4 5 V
I OL Open Load Current On-State 0.6 0.9 1.4 A
Level
t povl Status Delay (note 3) 5 10 s
t po l Status Delay (note 3) 50 500 2500 s
(*) In= Nominal current according to ISO definition for high side automotive switch (see note 1)
NOTE = (^) See switching time waveform
NOTE = () The VIH is internally clamped at 6V about. It is possible to connect this pin to an higher voltage via an external resistor
calculated to not exceed 10 mA at the input pin.
NOTE = note 1: The Nominal Current is the current at Tc = 85 oC for battery voltage of 13V which produces a voltage drop of 0.5 V
NOTE = note 2: IOL(off) = (VCC -VOL)/ROL
note 3:tpovl tpol: ISO definition.

Note 2 Relevant Figure Note 3 Relevant Figure

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 VND10BSP

Switching Time Waveforms

FUNCTIONAL DESCRIPTION temperature to reach the shut-down temperature

The device has a diagnostic output which in a specified thermal environment is a function of
indicates open load in on-state, open load in the load current for a fixed VCC, Vdemag and f
off-state, over temperature conditions and according to the above formula. In this device if
stuck-on to VCC. the GND pin is disconnected, with VCC not
From the falling edge of the input signal, the exceeding 16V, it will switch off.
status output, initially low to signal a fault
condition (overtemperature or open load PROTECTING THE DEVICE AGAINST
on-state), will go back to a high state with a REVERSE BATTERY
different delay in case of overtemperature (tpovl) The simplest way to protect the device against a
and in case of open open load (tpol) respectively. continuous reverse battery voltage (-26V) is to
This feature allows to discriminate the nature of insert a Schottky diode between pin 1 (GND) and
ground, as shown in the typical application circuit
the detected fault. To protect the device against
short circuit and over current condition, the (fig.3).
thermal protection turns the integrated Power The consequences of the voltage drop across
MOS off at a minimum junction temperature of this diode are as follows:
140 oC. When this temperature returns to 125 oC If the input is pulled to power GND, a negative
the switch is automatically turned on again. In voltage of -Vf is seen by the device. (Vil, Vih
short circuit the protection reacts with virtually no thresholds and Vstat are increased by Vf with
delay, the sensor being located inside the Power respect to power GND).
MOS area. An internal function of the devices The undervoltage shutdown level is increa- sed
ensures the fast demagnetization of inductive by Vf.
loads with a typical voltage (Vdemag) of -18V. This If there is no need for the control unit to handle
function allows to greatly reduces the power external analog signals referred to the power
dissipation according to the formula: GND, the best approach is to connect the
Pdem = 0.5 Lload (load)2 [(VCC+Vdemag)/Vdemag] reference potential of the control unit to node [1]
f (see application circuit in fig. 3), which becomes
where f = switching frequency and the common signal GND for the whole control
Vdemag = demagnetization voltage. board avoiding shift of Vih, Vil and Vstat. This
The maximum inductance which causes the chip solution allows the use of a standard diode.

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VND10BSP

TRUTH TABLE
INPUT 1 INPUT 2 OUT PUT 1 OUTPUT 2 DIAGNOSTIC
Normal Operation L L L L H
H H H H H
L H L H H
H L H L H
Under-voltage X X L L H
T hermal Shutdown Channel 1 H X L X L
Channel 2 X H X L L
O pen Load Channel 1 H X H X L
L L L L L(**)
Channel 2 X H X H L
L L L L L(**)
O utput Shorted to V CC Channel 1 H X H X L
L L H L L
Channel 2 X H X H L
L L L H L
(**) with additional external resistor.

Figure 1: Waveforms

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 VND10BSP

Figure 2: Typical Application Circuit With A Schottky Diode For Reverse Supply Protection

Figure 3: Typical Application Circuit With Separate Signal Ground

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VND10BSP

Power SO-10 MECHANICAL DATA

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 3.35 3.65 0.132 0.144
A1 0.00 0.10 0.000 0.004
B 0.40 0.60 0.016 0.024
c 0.35 0.55 0.013 0.022
D 9.40 9.60 0.370 0.378
D1 7.40 7.60 0.291 0.300
E 9.30 9.50 0.366 0.374
E1 7.20 7.40 0.283 0.291
E2 7.20 7.60 0.283 0.300
E3 6.10 6.35 0.240 0.250
E4 5.90 6.10 0.232 0.240
e 1.27 0.050
F 1.25 1.35 0.049 0.053
H 13.80 14.40 0.543 0.567
h 0.50 0.002
L 1.20 1.80 0.047 0.071
q 1.70 0.067
o
0 8o

0.10 A B
10 6
=

=
=

H E E2 E3 E1 E4
=
=

=
=
=

1 5
SEATING
PLANE

e B DETAIL A A

0.25 M C
Q
D
h = D1 =
= =
SEATING
PLANE
A
F
A1 A1

L
DETAIL A

0068039-C

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 VND10BSP

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.

1998 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved

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