Nte 2371
Nte 2371
Nte 2371
MOSFET
PCh, Enhancement Mode
High Speed Switch
TO220 Type Package
Features: D
D Dynamic dv/dt Rating
D Repetitive Avalanche Rated
D PChannel
D Fast Switching
G
D Ease of Paralleling
D Simple Drive Requirements
S
Absolute Maximum Ratings:
Continuous Drain Current (VGS = 10V), ID
TC = +25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19A
TC = +100C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13A
Pulsed Drain Current (Note 1), IDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72A
Power Dissipation (TC = +25C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150W
Derate Linearly Above 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W/C
GatetoSource Voltage, VGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Single Pulse Avalanche Energy (Note 2), EAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 640mJ
Avalanche Current (Note 1), IAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19A
Peak Diode Recovery dv/dt (Note 3), dv/dt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V/ns
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 to +175C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 to +175C
Lead Temperature (During Soldering, 1.6mm from case for 10sec), TL . . . . . . . . . . . . . . . . . +300C
Mounting Torque (632 or M3 Screw) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 lbfin (1.1Nm)
Thermal Resistance, JunctiontoCase, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0C/W
Thermal Resistance, JunctiontoAmbient, RthJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62C/W
Typical Thermal Resistance, CasetoSink (Flat, Greased Surface), RthCS . . . . . . . . . . . . 0.5C/W
Note 1. Repetitive rating; pulse width limited by maximum junction temperature.
Note 2. VDD = 25V, starting TJ = +25C, L = 2.7mH, RG = 25 , IAS = 19A
Note 3. ISD 19A, di/dt 200A/s, VDD V(BR)DSS, TJ +175C
Note 4. Pules Width 300s, Duty Cycle 2%.
Rev. 1013
Electrical Characteristics: (TJ = +25C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
DraintoSource Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250A 100 V
Breakdown Voltage Temp. Coefficient V(BR)DSS Reference to +25C, ID = 1mA 0.087 V/C
TJ
Static DraintoSource OnResistance RDS(on) VGS = 10V, ID = 11A, Note 4 0.20
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250A 2.0 4.0 V
Forward Transconductance gfs VDS = 50V, ID = 11A, Note4 6.2 mhos
DraintoSource Leakage Current IDSS VDS = 100V, VGS = 0V 100 A
VDS = 80V, VGS = 0V, TJ = +150C 500 A
GatetoSource Forward Leakage IGSS VGS = 20V 100 nA
GatetoSource Reverse Leakage IGSS VGS = 20V 100 nA
Total Gate Charge Qg ID = 19A, VDS = 80V, VGS = 10V, 61 nC
Note 4
GatetoSource Charge Qgs 14 nC
GatetoDrain (Miller) Charge Qgd 29 nC
TurnOn Delay Time td(on) VDD = 50V, ID = 19A, RG = 9.1 , 16 ns
RD = 2.4 , Note 4
Rise Time tr 73 ns
TurnOff Delay Time td(off) 34 ns
Fall Time tf 57 ns
Internal Drain Inductance LD Between lead, .250in. (6.0) mm from 4.5 nH
package and center of die contact
Internal Source Inductance LS 7.5 nH
Input Capacitance Ciss VGS = 0V, VDS = 25V, f = 1MHz 1400 pF
Output Capacitance Coss 590 pF
Reverse Transfer Capaticance Crss 140 pF
.110 (2.79)
.250 (6.35)
Max
.500
(12.7)
Min
.070 (1.78) Max
Gate Source