Kia 2431

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SEMICONDUCTOR

TECHNICAL DATA

KIA2431P/S/T/M/AP/AS/
AT/AM/BM
BIPOLAR LINEAR INTEGRATED CIRCUIT

PROGRAMMABLE PRECISION REFERENCES


The KIA2431P/S/T/M/AP/AS/AT/AM/BM are integrated
circuits are three-terminal programmable shunt regulator diodes.
These monolithic IC voltage reference operate as a low temperature
coefficient zener which is programmable from Vref to 16 volts with
two external resistors.
These devices exhibit a wide operating current range of 80A
to 50mA with a typical dynamic impedance of 0.22.
The characteristics of these references make them excellent
replacements for zener diodes in many applications such as
digital voltmeters, power supplies, and op amp circuitry.
FEATURES
Programmable Output Voltage to 16 Volts.

LINE UP
ITEM
KIA2431

KIA2431
KIA2431

P
S
T
M
AP
AS
AT
AM
BM

Package
TO-92
TSM
TSV
SOT-23
TO-92
TSM
TSV
SOT-23
SOT-23

Vref Tolerance (%)


1.5

1.0
0.5

Low Dynamic Output Impedance : 0.22(Typ.).


A to 50mA.
Sink Current Capability of 80
Equivalent Full-Range Temperature Coefficient of 30ppm/ (Typ.).
Temperature Compensated for Operation Over Full Rated
Operating Temperature Range.
Low Output Noise Voltage.

Marking
Type No.

Marking

KIA2431T/S/M

24A

KIA2431AT/AS/AM

24B

KIA2431BM

24C

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Revision No : 6

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KIA2431P/S/T/M/AP/AS/AT/AM/BM
MAXIMUM RATINGS (Ta=25)
(Full operating ambient temperature range applies unless otherwise noted.)
CHARACTERISTIC

SYMBOL

RATING

UNIT

VKA

16

Cathode Current Range, Continuous

IK

50

mA

Reference Input Current Range, Continuos

Iref

mA

Operating Junction Temperature

Tj

150

Operating Temperature

Topr

-4085

Storage Temperature

Tstg

-65150

Cathode To Anode Voltage

KIA2431P/AP

700

KIA2431S/AS (Note1)
Total Power Dissipation

900
PD

KIA2431T/AT

mW

550

KIA2431AM/BM (Note2)

350

Note1) Package Mounted on 99.5% Alumina (1080.6)


Note2) Package Mounted on a ceramic board (6000.8)

ELECTRICAL CHARACTERISTICS (Ta=25)


CHARACTERISTICS

SYMBOL

TEST
CIRCUIT

TEST CONDITION

KIA2431P/S/T/M
Reference
Input Voltage

KIA2431AP/AS/AT/AM

Vref

Figure 1

VKA=Vref , IK=10mA

KIA2431BM
Reference Input Voltage

Vref

Deviation Over Temperature Range


Ratio of Change in Reference Input Voltage

Vref /

to Change in Cathode to Anode Voltage

VKA

Figure 1
(Note 1)

VKA=Vref , IK=10mA
VKA=

MIN.

TYP.

MAX.

UNIT

1.222

1.240

1.258

1.228

1.240

1.252

1.234

1.240

1.246

7.0

20

mV

-0.6

-1.5

mV/V

Figure 2

IK=10mA

Iref

Figure 2

IK=10mA, R1=10k, R2=

0.15

0.5

Iref

Figure 2

IK=10mA, R1=10k, R2=

0.05

0.3

Minimum Cathode Current For Regulation

Imin

Figure 1

VKA=Vref

55

80

Off-State Cathode Current

Ioff

Figure 3

VKA=16V, Vref=0V

2.6

1000

nA

Dynamic Impedance

Zka

0.22

0.4

Reference Input Current

Ta=25

Reference Input Current


Deviation Over Temperature Range

2011. 7. 6

Revision No : 6

16VVref

Figure 1

VKA=Vref, IK=0.08mA50mA,

(Note 2)

f1.0kHz

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KIA2431P/S/T/M/AP/AS/AT/AM/BM

Example : Vref = 5.0mV and slope is positive,


Vref at 25=1.245V, Ta=110
Vref =

0.005106
= 36.5 ppm/
1101.245

Note 2: The dynamic impedance Zka is defined as:


|Zka| =

VKA
Ik

* CKA greater than 100nF is needed for stability.

When the device is programmed with two external

Note 1:

resistors, R1 and R2, (refer to Figure 2) the total

The deviation parameter Vref is defined as the differences

dynamic impedance of the circuit is defined as:

between the maximum and minimum values obtained over the


full operating ambient temperature range that applies.

|Zka'| = |Zka| (1+

R1
R2

The average temperature coefficient of the Reference


input voltage, Vref , is defined as:

Vref (

ppm

(
)=

Vref
Vref at 25

) 106

Ta
Vref 106
Ta(Vref at 25)

Vref can be positive or negative depending on whether


Vref Min. or Vref Max. occurs at the lower ambient temperature.

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Revision No : 6

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KIA2431P/S/T/M/AP/AS/AT/AM/BM

2011. 7. 6

Revision No : 6

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KIA2431P/S/T/M/AP/AS/AT/AM/BM

2011. 7. 6

Revision No : 6

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KIA2431P/S/T/M/AP/AS/AT/AM/BM
PRECAUTION FOR USE

SOLDERING
Flat Package (TSM/TSV/SOT-23 Package)
Elements mounting styles of electronic devices are gaining in further diversification over recent
years, and needs for components are all the more expanding in varieties. Especially, surface mounting
is steadily penetrating into industrial segments as a world-wide popular technical trend.
Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering
temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability.

(a) When employing solder reflow method


Atmospheric temperature around resin surfaces must be less than 240, not exceeding the time length of 10 sec.
Recommend temperature profile
Precautions on heating method
When resin in kept exposed to high temperature for a long time, device reliability may be marred.
Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising.
(b) When employing halogen lamps or infrared-ray heaters
When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause
extensive localized temperature rise.
Please keep a reflow solder operating when TSM/TSV package's soldering.

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Revision No : 6

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