9623 BIT3251 Datasheet
9623 BIT3251 Datasheet
9623 BIT3251 Datasheet
in
BIT3251
Low Cost PWM Controller
Version: A0
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Firstly, the information furnished by Beyond Innovation Technology Co. Ltd. (BiTEK) in this document is believed to be
accurate and reliable and subject to BiTEK’s amendment without prior notice. And the aforesaid information does not
form any part or parts of any quotation or contract between BiTEK and the information receiver.
Further, no responsibility is assumed for the usage of the aforesaid information. BiTEK makes no representation that
the interconnect of its circuits as described herein will not infringe on exiting or future patent rights, nor do the descriptions
contained herein imply the granting of licenses to make, use or sell equipment constructed in accordance therewith.
Besides, the product in this document is not designed for use in life support appliances, devices, or systems where
malfunction of this product can reasonably be expected to result in personal injury. BiTEK customers’ using or selling this
product for use in such applications shall do so at their own risk and agree to fully indemnify BiTEK for any damage
resulting from such improper use or sale.
At last, the information furnished in this document is the property of BiTEK and shall be treated as highly
confidentiality; any kind of distribution, disclosure, copying, transformation or use of whole or parts of this document
without duly authorization from BiTEK by prior written consent is strictly prohibited. The receiver shall fully compensate
BiTEK without any reservation for any losses thereof due to its violation of BiTEK’s confidential request. The receiver is
deemed to agree on BiTEK’s confidential request therein suppose that said receiver receives this document without making
any expressly opposition. In the condition that aforesaid opposition is made, the receiver shall return this document to
BiTEK immediately without any delay. -Version A4
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Band Gap
Voltage
References
EAN UVLO 4.0V
EA
EA EHV
3.6V
HV
ERR_OVP OVPN HV
+ ERR_OVP
LATCH
1.5V -
Digital
1.75V + Control BUFFER OUT
- PWMOUT Circuit
EHV RAMP
OVPN +
CMP
-
0.308V 1.8V
0.2V +
0.45K
-
0.75K
Ramp Wave
Error Amplifier RAMP Generator
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INN CMP VDD BIT3251
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*** For Extreme Operating Ambient Temperature, the supply voltage should be limited. The recommended voltage range is
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from 4.5V to 7.5V.
Function Description:
The PWM Controller: The pulse width modulation Initial Setting: System will have a fast transition
control circuit includes a ramp wave generator, an error response by setting a suitably initial voltage. The
amplifier and a comparator. These devices provide BIT3251 will set an initial voltage of Vinn and Vcmp
the required active components for the PWM feedback under below conditions.
control application. The inverting input of the error
amplifier is pulled high to reduce its output CMP when Table 1. Initial setting Voltage
VDD<3.6V. The maximum duty cycle of the PWM Voltage Setting(@5V) VEA VDD VOVP
controller is limited to 93% VINN =0.68V, VCMP =0.53V VEA > 1.2V VDD < 3.6V VOVP < 1.5V
VINN =0.68V, VCMP =0.53V VEA < 0.8V VDD > 4.0V VOVP < 1.5V
The Over Voltage Protection: The converter output VINN =0.68V, VCMP =0.53V VEA > 1.2V VDD > 4.0V VOVP > 1.5V
voltage will boost too high when the LEDs are Setting Equation:
disconnected from the circuit or fail open. The BIT3251 VINN =0.68V+0.12V*(VDD-5) (1)
will latch off the output if the OVP pin senses a voltage VCMP =0.53V+0.08V*(VDD-5) (2)
that is larger than 1.5V. The latched off status can be
reset by reducing the supply voltage to lower than 3.6V. Vcmp
Vinn
UVLO: The Under-Voltage-Lock-Out circuit turns the Vcmp
output driver off when supplying voltage drops to less
than 3.6V
Vinn=0.2V
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Layout Notice:
Some of the pins are very sensitive to noise. Please follow the bellowing guideline to make the layout:
Note 1. Please keep the capacitor between VDD and GND as close as possible. Noisy IC VDD may trigger UVLO.
Note 2. Figure 2 is an example of making shortest traces between VDD and GND. The layout traces are under the IC.
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VDD OUT
EA GND
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CMP NC
INN OVP
4 5 DCC CONTROLLED
Figure 2
Reflow Soldering:
The choice of heating method may be influenced by plastic QFP package). If infrared or vapor phase heating is
used and the package is not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small
amount of moisture in them can cause cracking of the plastic body. Preheating is necessary to dry the paste and
evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface
temperature of the packages should preferable be kept below 245 °C for thick/large packages (packages with a
3
thickness ≧ 2.5 mm or with a volume ≧ 350 mm so called thick/large packages). The top-surface temperature of
the packages should preferable be kept below 260 °C for thin/small packages (packages with a thickness < 2.5 mm
3
and a volume < 350 mm so called thin/small packages).
Temp (℃)
260
217
200
150
25
RT
Wave Soldering:
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit
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boards with a high component density, as solder bridging and non-wetting can present 頡科 技 BiTEK
problems.
BIT3251-SO
SO: SOP
Part number
Beyond Innovation Technology Co., Ltd.
Package Information :
Unit: mm
SOP type :
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