Pic16F7X7 Data Sheet: 28/40/44-Pin, 8-Bit Cmos Flash Microcontrollers With 10-Bit A/D and Nanowatt Technology
Pic16F7X7 Data Sheet: 28/40/44-Pin, 8-Bit Cmos Flash Microcontrollers With 10-Bit A/D and Nanowatt Technology
Pic16F7X7 Data Sheet: 28/40/44-Pin, 8-Bit Cmos Flash Microcontrollers With 10-Bit A/D and Nanowatt Technology
Preliminary DS30498B
PIC16F7X7
Data Sheet
28/40/44-Pin, 8-Bit CMOS Flash
Microcontrollers with 10-Bit A/D
and nanoWatt Technology
DS30498B-page ii Preliminary 2003 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchips products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Companys quality system processes and
procedures are QS-9000 compliant for its
PICmicro
8-bit MCUs, KEELOQ
code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchips quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2003 Microchip Technology Inc. Preliminary DS30498B-page 1
PIC16F7X7
Low-Power Features:
Power Managed modes:
- Primary Run (XT, RC oscillator, 76 A,
1 MHz, 2V)
- RC_RUN (7 A, 31.25 kHz, 2V)
- SEC_RUN (9 A, 32 kHz, 2V)
- Sleep (0.1 A, 2V)
Timer1 Oscillator (1.8 A, 32 kHz, 2V)
Watchdog Timer (0.7 A, 2V)
Two-Speed Oscillator Start-up
Oscillators:
Three Crystal modes:
- LP, XT, HS (up to 20 MHz)
Two External RC modes
One External Clock mode:
- ECIO (up to 20 MHz)
Internal Oscillator Block:
- 8 user-selectable frequencies (31 kHz,
125 kHz, 250 kHz, 500 kHz, 1 MHz, 2 MHz,
4 MHz, 8 MHz)
Analog Features:
10-bit, up to 14-channel Analog-to-Digital Converter:
- Programmable Acquisition Time
- Conversion available during Sleep mode
Dual Analog Comparators
Programmable Low Current Brown-out Reset
(BOR) Circuitry and Programmable Low-Voltage
Detect (LVD)
Peripheral Features:
High Sink/Source Current: 25 mA
Two 8-bit Timers with Prescaler
Timer1/RTC module:
- 16-bit timer/counter with prescaler
- Can be incremented during Sleep via
external 32 kHz watch crystal
Master Synchronous Serial Port (MSSP) with
3-wire SPI
TM
and I
2
C
TM
(Master and Slave) modes
Addressable Universal Synchronous
Asynchronous Receiver Transmitter (AUSART)
Three Capture, Compare, PWM modules:
- Capture is 16-bit, max. resolution is 12.5 ns
- Compare is 16-bit, max. resolution is 200 ns
- PWM max. resolution is 10 bits
Parallel Slave Port (PSP) 40/44-pin devices only
Special Microcontroller Features:
Fail-Safe Clock Monitor for protecting critical
applications against crystal failure
Two-Speed Start-up mode for immediate code
execution
Power-on Reset (POR), Power-up Timer (PWRT)
and Oscillator Start-up Timer (OST)
Programmable Code Protection
Processor Read Access to Program Memory
Power Saving Sleep mode
In-Circuit Serial Programming (ICSP) via
two pins
MPLAB
ST
Oscillator crystal or clock output.
Oscillator crystal output.
Connects to crystal or resonator in Crystal Oscillator
mode.
In RC mode, OSC2 pin outputs CLKO, which has 1/4 the
frequency of OSC1 and denotes the instruction cycle rate.
Digital I/O.
MCLR/VPP/RE3
MCLR
VPP
RE3
1 26
I
P
I
ST Master Clear (input) or programming voltage (output).
Master Clear (Reset) input. This pin is an active-low
Reset to the device.
Programming voltage input.
Digital input only pin.
PORTA is a bidirectional I/O port.
RA0/AN0
RA0
AN0
2 27
I/O
I
TTL
Digital I/O.
Analog input 0.
RA1/AN1
RA1
AN1
3 28
I/O
I
TTL
Digital I/O.
Analog input 1.
RA2/AN2/VREF-/CVREF
RA2
AN2
VREF-
CVREF
4 1
I/O
I
I
0
TTL
Digital I/O.
Analog input 2.
A/D reference voltage input (low).
Comparator voltage reference output.
RA3/AN3/VREF+
RA3
AN3
VREF+
5 2
I/O
I
I
TTL
Digital I/O.
Analog input 3.
A/D reference voltage input (high).
RA4/T0CKI/C1OUT
RA4
T0CKI
C1OUT
6 3
I/O
I
O
ST
Digital I/O Open-drain when configured as output.
Timer0 external clock input.
Comparator 1 output bit.
RA5/AN4/LVDIN/SS/C2OUT
RA5
AN4
LVDIN
SS
C2OUT
7 4
I/O
I
I/O
I
O
TTL
Digital I/O.
Analog input 4.
Low-voltage detect input.
SPI slave select input.
Comparator 2 output bit.
Legend: I = input O = output I/O = input/output P = power
= Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
2: This buffer is a Schmitt Trigger input when used in Serial Programming mode.
3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.
2003 Microchip Technology Inc. Preliminary DS30498B-page 9
PIC16F7X7
PORTB is a bidirectional I/O port. PORTB can be software
programmed for internal weak pull-up on all inputs.
RB0/INT/AN12
RB0
INT
AN12
21 18
I/O
I
I
TTL/ST
(1)
Digital I/O.
External interrupt.
Analog input channel 12.
RB1/AN10
RB1
AN10
22 19
I/O
I
TTL
Digital I/O.
Analog input channel 10.
RB2/AN8
RB2
AN8
23 20
I/O
I
TTL
Digital I/O.
Analog input channel 8.
RB3/CCP2/AN9
RB3
CCP2
AN9
24 21
I/O
I/O
I
TTL
Digital I/O.
CCP2 capture input, compare output, PWM output.
Analog input channel 9.
RB4/AN11
RB4
AN11
25 22
I/O
I
TTL
Digital I/O.
Analog input channel 11.
RB5/AN13/CCP3
RB5
AN13
CCP3
26 23
I/O
I
I/O
TTL
Digital I/O.
Analog input channel 13.
CCP3 capture input, compare output, PWM output.
RB6/PGC
RB6
PGC
27 24
I/O
I/O
TTL/ST
(2)
Digital I/O.
In-circuit debugger and ICSP programming clock.
RB7/PGD
RB7
PGD
28 25
I/O
I/O
TTL/ST
(2)
Digital I/O.
In-circuit debugger and ICSP programming data.
TABLE 1-2: PIC16F737 AND PIC16F767 PINOUT DESCRIPTION (CONTINUED)
Pin Name
PDIP
SSOP
SOIC
Pin #
QFN
Pin #
I/O/P
Type
Buffer
Type
Description
Legend: I = input O = output I/O = input/output P = power
= Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
2: This buffer is a Schmitt Trigger input when used in Serial Programming mode.
3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.
PIC16F7X7
DS30498B-page 10 Preliminary 2003 Microchip Technology Inc.
PORTC is a bidirectional I/O port.
RC0/T1OSO/T1CKI
RC0
T1OSO
T1CKI
11 8
I/O
O
I
ST
Digital I/O.
Timer1 oscillator output.
Timer1 external clock input.
RC1/T1OSI/CCP2
RC1
T1OSI
CCP2
12 9
I/O
I
I/O
ST
Digital I/O.
Timer1 oscillator input.
Capture2 input, Compare2 output, PWM2 output.
RC2/CCP1
RC2
CCP1
13 10
I/O
I/O
ST
Digital I/O.
Capture1 input, Compare1 output, PWM1 output.
RC3/SCK/SCL
RC3
SCK
SCL
14 11
I/O
I/O
I/O
ST
Digital I/O.
Synchronous serial clock input/output for SPI mode.
Synchronous serial clock input/output for I
2
C mode.
RC4/SDI/SDA
RC4
SDI
SDA
15 12
I/O
I
I/O
ST
Digital I/O.
SPI data in.
I
2
C data I/O.
RC5/SDO
RC5
SDO
16 13
I/O
O
ST
Digital I/O.
SPI data out.
RC6/TX/CK
RC6
TX
CK
17 14
I/O
O
I/O
ST
Digital I/O.
USART asynchronous transmit.
USART1 synchronous clock.
RC7/RX/DT
RC7
RX
DT
18 15
I/O
I
I/O
ST
Digital I/O.
USART asynchronous receive.
USART synchronous data.
VSS 8, 19 5, 16 P Ground reference for logic and I/O pins.
VDD 20 17 P Positive supply for logic and I/O pins.
TABLE 1-2: PIC16F737 AND PIC16F767 PINOUT DESCRIPTION (CONTINUED)
Pin Name
PDIP
SSOP
SOIC
Pin #
QFN
Pin #
I/O/P
Type
Buffer
Type
Description
Legend: I = input O = output I/O = input/output P = power
= Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
2: This buffer is a Schmitt Trigger input when used in Serial Programming mode.
3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.
2003 Microchip Technology Inc. Preliminary DS30498B-page 11
PIC16F7X7
TABLE 1-3: PIC16F747 AND PIC16F777 PINOUT DESCRIPTION
Pin Name
PDIP
Pin #
QFN
Pin #
TQFP
Pin #
I/O/P
Type
Buffer
Type
Description
OSC1/CLKI/RA7
OSC1
CLKI
RA7
13 32 31
I
I
I/O
ST/CMOS
(4)
ST
Oscillator crystal or external clock input.
Oscillator crystal input or external clock source input.
ST buffer when configured in RC mode; otherwise
CMOS.
External clock source input. Always associated with
pin function OSC1 (see OSC1/CLKI, OSC2/CLKO
pins).
Bidirectional I/O pin.
OSC2/CLKO/RA6
OSC2
CLKO
RA6
14 33 30
O
O
I/O
ST
Oscillator crystal or clock output.
Oscillator crystal output. Connects to crystal or
resonator in Crystal Oscillator mode.
In RC mode, OSC2 pin outputs CLKO, which has
1/4 the frequency of OSC1 and denotes the
instruction cycle rate.
Bidirectional I/O pin.
MCLR/VPP/RE3
MCLR
VPP
RE3
1 18 18
I
P
I
ST Master Clear (input) or programming voltage (output).
Master Clear (Reset) input. This pin is an
active- low Reset to the device.
Programming voltage input.
Digital input only pin.
PORTA is a bidirectional I/O port.
RA0/AN0
RA0
AN0
2 19 19
I/O
I
TTL
Digital I/O.
Analog input 0.
RA1/AN1
RA1
AN1
3 20 20
I/O
I
TTL
Digital I/O.
Analog input 1.
RA2/AN2/VREF-/CVREF
RA2
AN2
VREF-
CVREF
4 21 21
I/O
I
I
I
TTL
Digital I/O.
Analog input 2.
A/D reference voltage input (low).
Comparator voltage reference output.
RA3/AN3/VREF+
RA3
AN3
VREF+
5 22 22
I/O
I
I
TTL
Digital I/O.
Analog input 3.
A/D reference voltage input (high).
RA4/T0CKI/C1OUT
RA4
T0CKI
C1OUT
6 23 23
I/O
I
O
ST
Digital I/O Open-drain when configured as output.
Timer0 external clock input.
Comparator 1 output.
RA5/AN4/LVDIN/SS/C2OUT
RA5
AN4
LVDIN
SS
C2OUT
7 24 24
I/O
I
I
I
I
TTL
Digital I/O.
Analog input 4.
Low-voltage detect input.
SPI slave select input.
Comparator 2 output.
Legend: I = input O = output I/O = input/output P = power
= Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as an external interrupt.
2: This buffer is a Schmitt Trigger input when used in Serial Programming mode.
3: This buffer is a Schmitt Trigger input when configured as a general purpose I/O and a TTL input when used in the Parallel
Slave Port mode (for interfacing to a microprocessor bus).
4: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.
PIC16F7X7
DS30498B-page 12 Preliminary 2003 Microchip Technology Inc.
PORTB is a bidirectional I/O port. PORTB can be
software programmed for internal weak pull-up on all
inputs.
RB0/INT/AN12
RB0
INT
AN12
33 9 8
I/O
I
I
TTL/ST
(1)
Digital I/O.
External interrupt.
Analog input channel 12.
RB1/AN10
RB1
AN10
34 10 9
I/O
I
TTL
Digital I/O.
Analog input channel 10.
RB2/AN8
RB2
AN8
35 11 10
I/O
I
TTL
Digital I/O.
Analog input channel 8.
RB3/CCP2/AN9
RB3
CCP2
AN9
36 12 11
I/O
I/O
I
TTL
Digital I/O.
CCP2 capture input, compare output, PWM output.
Analog input channel 9.
RB4/AN11
RB4
AN11
37 14 14
I/O
I
TTL
Digital I/O.
Analog input channel 11
RB5/AN13/CCP3
RB5
AN13
CCP3
38 15 15
I/O
I
I
TTL
Digital I/O.
Analog input channel 13.
CCP3 capture input, compare output, PWM output.
RB6/PGC
RB6
PGC
39 16 16
I/O
I/O
TTL/ST
(2)
Digital I/O.
In-circuit debugger and ICSP programming clock.
RB7/PGD
RB7
PGD
40 17 17
I/O
I/O
TTL/ST
(2)
Digital I/O.
In-circuit debugger and ICSP programming data.
TABLE 1-3: PIC16F747 AND PIC16F777 PINOUT DESCRIPTION (CONTINUED)
Pin Name
PDIP
Pin #
QFN
Pin #
TQFP
Pin #
I/O/P
Type
Buffer
Type
Description
Legend: I = input O = output I/O = input/output P = power
= Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as an external interrupt.
2: This buffer is a Schmitt Trigger input when used in Serial Programming mode.
3: This buffer is a Schmitt Trigger input when configured as a general purpose I/O and a TTL input when used in the Parallel
Slave Port mode (for interfacing to a microprocessor bus).
4: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.
2003 Microchip Technology Inc. Preliminary DS30498B-page 13
PIC16F7X7
PORTC is a bidirectional I/O port.
RC0/T1OSO/T1CKI
RC0
T1OSO
T1CKI
15 34 32
I/O
O
I
ST
Digital I/O.
Timer1 oscillator output.
Timer1 external clock input.
RC1/T1OSI/CCP2
RC1
T1OSI
CCP2
16 35 35
I/O
I
I/O
ST
Digital I/O.
Timer1 oscillator input.
Capture2 input, Compare2 output, PWM2 output.
RC2/CCP1
RC2
CCP1
17 36 36
I/O
I/O
ST
Digital I/O.
Capture1 input, Compare1 output, PWM1 output.
RC3/SCK/SCL
RC3
SCK
SCL
18 37 37
I/O
I/O
I/O
ST
Digital I/O.
Synchronous serial clock input/output for SPI mode.
Synchronous serial clock input/output for I
2
C mode.
RC4/SDI/SDA
RC4
SDI
SDA
23 42 42
I/O
I
I/O
ST
Digital I/O.
SPI data in.
I
2
C data I/O.
RC5/SDO
RC5
SDO
24 43 43
I/O
O
ST
Digital I/O.
SPI data out.
RC6/TX/CK
RC6
TX
CK
25 44 44
I/O
O
I/O
ST
Digital I/O.
USART asynchronous transmit.
USART1 synchronous clock.
RC7/RX/DT
RC7
RX
DT
26 1 1
I/O
I
I/O
ST
Digital I/O.
USART asynchronous receive.
USART synchronous data.
TABLE 1-3: PIC16F747 AND PIC16F777 PINOUT DESCRIPTION (CONTINUED)
Pin Name
PDIP
Pin #
QFN
Pin #
TQFP
Pin #
I/O/P
Type
Buffer
Type
Description
Legend: I = input O = output I/O = input/output P = power
= Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as an external interrupt.
2: This buffer is a Schmitt Trigger input when used in Serial Programming mode.
3: This buffer is a Schmitt Trigger input when configured as a general purpose I/O and a TTL input when used in the Parallel
Slave Port mode (for interfacing to a microprocessor bus).
4: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.
PIC16F7X7
DS30498B-page 14 Preliminary 2003 Microchip Technology Inc.
PORTD is a bidirectional I/O port or Parallel Slave Port
when interfacing to a microprocessor bus.
RD0/PSP0
RD0
PSP0
19 38 38
I/O
I/O
ST/TTL
(3)
Digital I/O.
Parallel Slave Port data.
RD1/PSP1
RD1
PSP1
20 39 39
I/O
I/O
ST/TTL
(3)
Digital I/O.
Parallel Slave Port data.
RD2/PSP2
RD2
PSP2
21 40 40
I/O
I/O
ST/TTL
(3)
Digital I/O.
Parallel Slave Port data.
RD3/PSP3
RD3
PSP3
22 41 41
I/O
I/O
ST/TTL
(3)
Digital I/O.
Parallel Slave Port data.
RD4/PSP4
RD4
PSP4
27 2 2
I/O
I/O
ST/TTL
(3)
Digital I/O.
Parallel Slave Port data.
RD5/PSP5
RD5
PSP5
28 3 3
I/O
I/O
ST/TTL
(3)
Digital I/O.
Parallel Slave Port data.
RD6/PSP6
RD6
PSP6
29 4 4
I/O
I/O
ST/TTL
(3)
Digital I/O.
Parallel Slave Port data.
RD7/PSP7
RD7
PSP7
30 5 5
I/O
I/O
ST/TTL
(3)
Digital I/O.
Parallel Slave Port data.
PORTE is a bidirectional I/O port.
RE0/RD/AN5
RE0
RD
AN5
8 25 25
I/O
I
I
ST/TTL
(3)
Digital I/O.
Read control for Parallel Slave Port.
Analog input 5.
RE1/WR/AN6
RE1
WR
AN6
9 26 26
I/O
I
I
ST/TTL
(3)
Digital I/O.
Write control for Parallel Slave Port.
Analog input 6.
RE2/CS/AN7
RE2
CS
AN7
10 27 27
I/O
I
I
ST/TTL
(3)
Digital I/O.
Chip select control for Parallel Slave Port.
Analog input 7.
VSS 31 P Analog ground reference.
VSS 12, 31 6, 30 6, 29 P Ground reference for logic and I/O pins.
VDD 8 P Analog positive supply.
VDD 11, 32 7, 28 7, 28 P Positive supply for logic and I/O pins.
NC 13, 29 12, 13,
33, 34
These pins are not internally connected. These pins
should be left unconnected.
TABLE 1-3: PIC16F747 AND PIC16F777 PINOUT DESCRIPTION (CONTINUED)
Pin Name
PDIP
Pin #
QFN
Pin #
TQFP
Pin #
I/O/P
Type
Buffer
Type
Description
Legend: I = input O = output I/O = input/output P = power
= Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as an external interrupt.
2: This buffer is a Schmitt Trigger input when used in Serial Programming mode.
3: This buffer is a Schmitt Trigger input when configured as a general purpose I/O and a TTL input when used in the Parallel
Slave Port mode (for interfacing to a microprocessor bus).
4: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.
2003 Microchip Technology Inc. Preliminary DS30498B-page 15
PIC16F7X7
2.0 MEMORY ORGANIZATION
There are two memory blocks in each of these
PICmicro
000001 =
000000 = Center frequency. Oscillator module is running at the calibrated frequency.
111111 =
(1)
PORTE Data Direction bits 0000 1111 0000 1111
9Fh ADCON1 ADFM ADCS2 VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, - = unimplemented, read as 0. Shaded cells are not used by PORTE.
Note 1: RE3 is an input only. The state of the TRISE3 bit has no effect and will always read 1.
2003 Microchip Technology Inc. Preliminary DS30498B-page 69
PIC16F7X7
REGISTER 5-1: TRISE REGISTER (ADDRESS 89h)
R-0 R-0 R/W-0 R/W-0 U-0 R/W-1 R/W-1 R/W-1
IBF OBF IBOV PSPMODE
(1)
TRISE2 TRISE1 TRISE0
bit 7 bit 0
bit 7 Parallel Slave Port Status/Control bits:
IBF: Input Buffer Full Status bit
1 = A word has been received and is waiting to be read by the CPU
0 = No word has been received
bit 6 OBF: Output Buffer Full Status bit
1 = The output buffer still holds a previously written word
0 = The output buffer has been read
bit 5 IBOV: Input Buffer Overflow Detect bit (in Microprocessor mode)
1 = A write occurred when a previously input word has not been read (must be cleared in
software)
0 = No overflow occurred
bit 4 PSPMODE: Parallel Slave Port Mode Select bit
1 = Parallel Slave Port mode
0 = General Purpose I/O mode
bit 3 Unimplemented: Read as 1
(1)
Note 1: RE3 is an input only. The state of the TRISE3 bit has no effect and will always read 1.
bit 2 PORTE Data Direction bits:
TRISE2: Direction Control bit for pin RE2/CS/AN7
1 = Input
0 = Output
bit 1 TRISE1: Direction Control bit for pin RE1/WR/AN6
1 = Input
0 = Output
bit 0 TRISE0: Direction Control bit for pin RE0/RD/AN5
1 = Input
0 = Output
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
- n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
PIC16F7X7
DS30498B-page 70 Preliminary 2003 Microchip Technology Inc.
5.6 Parallel Slave Port
The Parallel Slave Port (PSP) is not implemented on
the PIC16F737 or PIC16F767.
PORTD operates as an 8-bit wide Parallel Slave Port or
microprocessor port when control bit, PSPMODE
(TRISE<4>), is set. In Slave mode, it is asynchronously
readable and writable by an external system using the
read control input pin RE0/RD/AN5, the write control
input pin RE1/WR/AN6 and the chip select control input
pin RE2/CS/AN7.
The PSP can directly interface to an 8-bit micro-
processor data bus. The external microprocessor can
read or write the PORTD latch as an 8-bit latch. Setting
bit PSPMODE enables port pin RE0/RD/AN5 to be the
RD input, RE1/WR/AN6 to be the WR input and
RE2/CS/AN7 to be the CS (Chip Select) input. For this
functionality, the corresponding data direction bits of
the TRISE register (TRISE<2:0>) must be configured
as inputs (i.e., set). The A/D port configuration bits,
PCFG3:PCFG0 (ADCON1<3:0>), must be set to
configure pins RE2:RE0 as digital I/O.
There are actually two 8-bit latches, one for data output
(external reads) and one for data input (external
writes). The firmware writes 8-bit data to the PORTD
output data latch and reads data from the PORTD input
data latch (note that they have the same address). In
this mode, the TRISD register is ignored since the
external device is controlling the direction of data flow.
An external write to the PSP occurs when the CS and
WR lines are both detected low. Firmware can read the
actual data on the PORTD pins during this time. When
either the CS or WR lines become high (level trig-
gered), the data on the PORTD pins is latched and the
Input Buffer Full (IBF) status flag bit (TRISE<7>) and
interrupt flag bit, PSPIF (PIR1<7>), are set on the Q4
clock cycle following the next Q2 cycle to signal the
write is complete (Figure 5-21). Firmware clears the
IBF flag by reading the latched PORTD data and clears
the PSPIF bit.
The Input Buffer Overflow (IBOV) status flag bit
(TRISE<5>) is set if an external write to the PSP occurs
while the IBF flag is set from a previous external write.
The previous PORTD data is overwritten with the new
data. IBOV is cleared by reading PORTD and clearing
IBOV.
A read from the PSP occurs when both the CS and RD
lines are detected low. The data in the PORTD output
latch is output to the PORTD pins. The Output Buffer
Full (OBF) status flag bit (TRISE<6>) is cleared imme-
diately (Figure 5-22), indicating that the PORTD latch is
being read or has been read by the external bus. If
firmware writes new data to the output latch during this
time, it is immediately output to the PORTD pins but
OBF will remain cleared.
When either the CS or RD pins are detected high, the
PORTD outputs are disabled and the interrupt flag bit
PSPIF is set on the Q4 clock cycle following the next
Q2 cycle, indicating that the read is complete. OBF
remains low until firmware writes new data to PORTD.
When not in PSP mode, the IBF and OBF bits are held
clear. Flag bit IBOV remains unchanged. The PSPIF bit
must be cleared by the user in firmware; the interrupt
can be disabled by clearing the interrupt enable bit,
PSPIE (PIE1<7>).
FIGURE 5-20: PORTD AND PORTE
BLOCK DIAGRAM
(PARALLEL SLAVE PORT)
Data Bus
WR
Port
RD
RDx pin
Q D
CK
EN
Q D
EN
Port
One bit of PORTD
Set Interrupt Flag
PSPIF (PIR1<7>)
Read
Chip Select
Write
RD
CS
WR
Note: I/O pin has protection diodes to VDD and VSS.
TTL
TTL
TTL
TTL
2003 Microchip Technology Inc. Preliminary DS30498B-page 71
PIC16F7X7
FIGURE 5-21: PARALLEL SLAVE PORT WRITE WAVEFORMS
FIGURE 5-22: PARALLEL SLAVE PORT READ WAVEFORMS
TABLE 5-11: REGISTERS ASSOCIATED WITH PARALLEL SLAVE PORT
Q1 Q2 Q3 Q4
CS
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
WR
RD
IBF
OBF
PSPIF
PORTD<7:0>
Q1 Q2 Q3 Q4
CS
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
WR
IBF
PSPIF
RD
OBF
PORTD<7:0>
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR, BOR
Value on
all other
Resets
08h PORTD Port Data Latch when written: Port pins when read xxxx xxxx uuuu uuuu
09h PORTE RE3 RE2 RE1 RE0 ---- x000 ---- x000
89h TRISE IBF OBF IBOV PSPMODE
(2)
PORTE Data Direction bits 0000 1111 0000 1111
0Ch PIR1
PSPIF
(1)
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
8Ch PIE1
PSPIE
(1)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
9Fh ADCON1 ADFM ADCS2 VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, - = unimplemented, read as 0. Shaded cells are not used by the Parallel Slave Port.
Note 1: Bits PSPIE and PSPIF are reserved on the PIC16F737/767; always maintain these bits clear.
2: RE3 is an input only. The state of the TRISE3 bit has no effect and will always read 1.
PIC16F7X7
DS30498B-page 72 Preliminary 2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc. Preliminary DS30498B-page 73
PIC16F7X7
6.0 TIMER0 MODULE
The Timer0 module timer/counter has the following
features:
8-bit timer/counter
Readable and writable
8-bit software programmable prescaler
Internal or external clock select
Interrupt on overflow from FFh to 00h
Edge select for external clock
Additional information on the Timer0 module is
available in the PICmicro
w
h
e
n
S
E
N
=
0
)
2003 Microchip Technology Inc. Preliminary DS30498B-page 109
PIC16F7X7
FIGURE 10-9: I
2
C SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESS)
S
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PIC16F7X7
DS30498B-page 110 Preliminary 2003 Microchip Technology Inc.
FIGURE 10-10: I
2
C SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESS)
S
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2003 Microchip Technology Inc. Preliminary DS30498B-page 111
PIC16F7X7
FIGURE 10-11: I
2
C SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESS)
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PIC16F7X7
DS30498B-page 112 Preliminary 2003 Microchip Technology Inc.
10.4.4 CLOCK STRETCHING
Both 7-bit and 10-bit Slave modes implement
automatic clock stretching during a transmit sequence.
The SEN bit (SSPCON2<0>) allows clock stretching to
be enabled during receives. Setting SEN will cause
the SCL pin to be held low at the end of each data
receive sequence.
10.4.4.1 Clock Stretching for 7-bit Slave
Receive Mode (SEN = 1)
In 7-bit Slave Receive mode, on the falling edge of the
ninth clock, at the end of the ACK sequence if the BF bit
is set, the CKP bit in the SSPCON register is automati-
cally cleared, forcing the SCL output to be held low. The
CKP being cleared to 0 will assert the SCL line low.
The CKP bit must be set in the users ISR before recep-
tion is allowed to continue. By holding the SCL line low,
the user has time to service the ISR and read the
contents of the SSPBUF before the master device can
initiate another receive sequence. This will prevent
buffer overruns from occurring (see Figure 10-13).
10.4.4.2 Clock Stretching for 10-bit Slave
Receive Mode (SEN = 1)
In 10-bit Slave Receive mode during the address
sequence, clock stretching automatically takes place
but CKP is not cleared. During this time, if the UA bit is
set after the ninth clock, clock stretching is initiated.
The UA bit is set after receiving the upper byte of the
10-bit address and following the receive of the second
byte of the 10-bit address, with the R/W bit cleared to
0. The release of the clock line occurs upon updating
SSPADD. Clock stretching will occur on each data
receive sequence as described in 7-bit mode.
10.4.4.3 Clock Stretching for 7-bit Slave
Transmit Mode
7-bit Slave Transmit mode implements clock stretching
by clearing the CKP bit after the falling edge of the
ninth clock, if the BF bit is clear. This occurs
regardless of the state of the SEN bit.
The users ISR must set the CKP bit before transmis-
sion is allowed to continue. By holding the SCL line
low, the user has time to service the ISR and load the
contents of the SSPBUF before the master device can
initiate another transmit sequence (see Figure 10-9).
10.4.4.4 Clock Stretching for 10-bit Slave
Transmit Mode
In 10-bit Slave Transmit mode, clock stretching is con-
trolled during the first two address sequences by the
state of the UA bit, just as it is in 10-bit Slave Receive
mode. The first two addresses are followed by a third
address sequence, which contains the high order bits
of the 10-bit address and the R/W bit set to 1. After
the third address sequence is performed, the UA bit is
not set, the module is now configured in Transmit
mode and clock stretching is controlled by the BF flag
as in 7-bit Slave Transmit mode (see Figure 10-11).
Note 1: If the user reads the contents of the
SSPBUF before the falling edge of the
ninth clock, thus clearing the BF bit, the
CKP bit will not be cleared and clock
stretching will not occur.
2: The CKP bit can be set in software
regardless of the state of the BF bit. The
user should be careful to clear the BF bit
in the ISR before the next receive
sequence in order to prevent an overflow
condition.
Note: If the user polls the UA bit and clears it by
updating the SSPADD register before the
falling edge of the ninth clock occurs and if
the user hasnt cleared the BF bit by read-
ing the SSPBUF register before that time,
then the CKP bit will still NOT be asserted
low. Clock stretching on the basis of the
state of the BF bit only occurs during a
data sequence, not an address sequence.
Note 1: If the user loads the contents of SSPBUF,
setting the BF bit before the falling edge of
the ninth clock, the CKP bit will not be
cleared and clock stretching will not occur.
2: The CKP bit can be set in software
regardless of the state of the BF bit.
2003 Microchip Technology Inc. Preliminary DS30498B-page 113
PIC16F7X7
10.4.4.5 Clock Synchronization
and the CKP Bit
When the CKP bit is cleared, the SCL output is forced
to 0; however, setting the CKP bit will not assert the
SCL output low until the SCL output is already sam-
pled low. Therefore, the CKP bit will not assert the
SCL line until an external I
2
C master device has
already asserted the SCL line. The SCL output will
remain low until the CKP bit is set and all other
devices on the I
2
C bus have deasserted SCL. This
ensures that a write to the CKP bit will not violate the
minimum high time requirement for SCL (see
Figure 10-12).
FIGURE 10-12: CLOCK SYNCHRONIZATION TIMING
SDA
SCL
DX-1 DX
WR
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SSPCON
CKP
Master device
deasserts clock
Master device
asserts clock
PIC16F7X7
DS30498B-page 114 Preliminary 2003 Microchip Technology Inc.
FIGURE 10-13: I
2
C SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESS)
S
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2003 Microchip Technology Inc. Preliminary DS30498B-page 115
PIC16F7X7
FIGURE 10-14: I
2
C SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 10-BIT ADDRESS)
S
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PIC16F7X7
DS30498B-page 116 Preliminary 2003 Microchip Technology Inc.
10.4.5 GENERAL CALL ADDRESS
SUPPORT
The addressing procedure for the I
2
C bus is such that
the first byte after the Start condition usually deter-
mines which device will be the slave addressed by the
master. The exception is the general call address,
which can address all devices. When this address is
used, all devices should, in theory, respond with an
Acknowledge.
The general call address is one of eight addresses
reserved for specific purposes by the I
2
C protocol. It
consists of all 0s with R/W = 0.
The general call address is recognized when the Gen-
eral Call Enable bit (GCEN) is enabled (SSPCON2<7>
set). Following a Start bit detect, 8 bits are shifted into
the SSPSR and the address is compared against the
SSPADD. It is also compared to the general call
address and fixed in hardware.
If the general call address matches, the SSPSR is
transferred to the SSPBUF, the BF flag bit is set (eighth
bit) and on the falling edge of the ninth bit (ACK bit), the
SSPIF interrupt flag bit is set.
When the interrupt is serviced, the source for the inter-
rupt can be checked by reading the contents of the
SSPBUF. The value can be used to determine if the
address was device specific or a general call address.
In 10-bit mode, the SSPADD is required to be updated
for the second half of the address to match and the UA
bit is set (SSPSTAT<1>). If the general call address is
sampled when the GCEN bit is set and while the slave
is configured in 10-bit Address mode, then the second
half of the address is not necessary, the UA bit will not
be set and the slave will begin receiving data after the
Acknowledge (Figure 10-15).
FIGURE 10-15: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE
(7 OR 10-BIT ADDRESS MODE)
SDA
SCL
S
SSPIF
BF (SSPSTAT<0>)
SSPOV (SSPCON<6>)
Cleared in software
SSPBUF is read
R/W = 0
ACK
General Call Address
Address is compared to general call address
GCEN (SSPCON2<7>)
Receiving Data ACK
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
D7 D6 D5 D4 D3 D2 D1 D0
after ACK, set interrupt
0
1
2003 Microchip Technology Inc. Preliminary DS30498B-page 117
PIC16F7X7
10.4.6 MASTER MODE
Master mode is enabled by setting and clearing the
appropriate SSPM bits in SSPCON and by setting the
SSPEN bit. In Master mode, the SCL and SDA lines
are manipulated by the MSSP hardware.
Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop con-
ditions. The Stop (P) and Start (S) bits are cleared from
a Reset or when the MSSP module is disabled. Control
of the I
2
C bus may be taken when the P bit is set or the
bus is Idle, with both the S and P bits clear.
In Firmware Controlled Master mode, user code
conducts all I
2
C bus operations based on Start and
Stop bit conditions.
Once Master mode is enabled, the user has six
options:
1. Assert a Start condition on SDA and SCL.
2. Assert a Repeated Start condition on SDA and
SCL.
3. Write to the SSPBUF register, initiating
transmission of data/address.
4. Configure the I
2
C port to receive data.
5. Generate an Acknowledge condition at the end
of a received byte of data.
6. Generate a Stop condition on SDA and SCL.
The following events will cause SSP Interrupt Flag bit,
SSPIF, to be set (SSP interrupt if enabled):
Start condition
Stop condition
Data transfer byte transmitted/received
Acknowledge Transmit
Repeated Start
FIGURE 10-16: MSSP BLOCK DIAGRAM (I
2
C MASTER MODE)
Note: The MSSP module, when configured in
I
2
C Master mode, does not allow queueing
of events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPBUF register to
initiate transmission before the Start condi-
tion is complete. In this case, the SSPBUF
will not be written to and the WCOL bit will
be set, indicating that a write to the
SSPBUF did not occur.
Read Write
SSPSR
Start bit, Stop bit,
Start bit Detect
SSPBUF
Internal
Data Bus
Set/Reset S, P, WCOL (SSPSTAT)
Shift
Clock
MSb LSb
SDA
Acknowledge
Generate
Stop bit Detect
Write Collision Detect
Clock Arbitration
State Counter for
end of XMIT/RCV
SCL
SCL In
Bus Collision
SDA In
R
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Set SSPIF, BCLIF
Reset ACKSTAT, PEN (SSPCON2)
Rate
Generator
SSPM3:SSPM0
PIC16F7X7
DS30498B-page 118 Preliminary 2003 Microchip Technology Inc.
10.4.6.1 I
2
C Master Mode Operation
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I
2
C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the Read/Write (R/W) bit.
In this case, the R/W bit will be logic 0. Serial data is
transmitted 8 bits at a time. After each byte is transmit-
ted, an Acknowledge bit is received. Start and Stop
conditions are output to indicate the beginning and the
end of a serial transfer.
In Master Receive mode, the first byte transmitted con-
tains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic 1. Thus, the first byte transmitted is a 7-bit slave
address followed by a 1 to indicate a receive bit. Serial
data is received via SDA while SCL outputs the serial
clock. Serial data is received 8 bits at a time. After each
byte is received, an Acknowledge bit is transmitted.
Start and Stop conditions indicate the beginning and
end of transmission.
The baud rate generator used for the SPI mode opera-
tion is used to set the SCL clock frequency for either
100 kHz, 400 kHz or 1 MHz I
2
C operation. See
Section 10.4.7 Baud Rate Generator for more
detail.
A typical transmit sequence would go as follows:
1. The user generates a Start condition by setting
the Start enable bit, SEN (SSPCON2<0>).
2. SSPIF is set. The MSSP module will wait the
required Start time before any other operation
takes place.
3. The user loads the SSPBUF with the slave
address to transmit.
4. Address is shifted out the SDA pin until all 8 bits
are transmitted.
5. The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
SSPCON2 register (SSPCON2<6>).
6. The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
7. The user loads the SSPBUF with eight bits of
data.
8. Data is shifted out the SDA pin until all 8 bits are
transmitted.
9. The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
SSPCON2 register (SSPCON2<6>).
10. The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
11. The user generates a Stop condition by setting
the Stop enable bit, PEN (SSPCON2<2>).
12. Interrupt is generated once the Stop condition is
complete.
2003 Microchip Technology Inc. Preliminary DS30498B-page 119
PIC16F7X7
10.4.7 BAUD RATE GENERATOR
In I
2
C Master mode, the Baud Rate Generator (BRG)
reload value is placed in the lower 7 bits of the
SSPADD register (Figure 10-17). When a write occurs
to SSPBUF, the Baud Rate Generator will automatically
begin counting. The BRG counts down to 0 and stops
until another reload has taken place. The BRG count is
decremented twice per instruction cycle (TCY) on the
Q2 and Q4 clocks. In I
2
C Master mode, the BRG is
reloaded automatically.
Once the given operation is complete (i.e., transmis-
sion of the last data bit is followed by ACK), the internal
clock will automatically stop counting and the SCL pin
will remain in its last state.
Table 10-3 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSPADD.
FIGURE 10-17: BAUD RATE GENERATOR BLOCK DIAGRAM
TABLE 10-3: I
2
C CLOCK RATE w/BRG
FCY FCY*2 BRG VALUE
FSCL
(2 Rollovers of BRG)
10 MHz 20 MHz 19h 400 kHz
(1)
10 MHz 20 MHz 20h 312.5 kHz
10 MHz 20 MHz 3Fh 100 kHz
4 MHz 8 MHz 0Ah 400 kHz
(1)
4 MHz 8 MHz 0Dh 308 kHz
4 MHz 8 MHz 28h 100 kHz
1 MHz 2 MHz 03h 333 kHz
(1)
1 MHz 2 MHz 0Ah 100 kHz
1 MHz 2 MHz 00h 1 MHz
(1)
Note 1: The I
2
C interface does not conform to the 400 kHz I
2
C specification (which applies to rates greater than
100 kHz) in all details, but may be used with care where higher rates are required by the application.
SSPM3:SSPM0
BRG Down Counter CLKO
FOSC/4
SSPADD<6:0>
SSPM3:SSPM0
SCL
Reload
Control
Reload
PIC16F7X7
DS30498B-page 120 Preliminary 2003 Microchip Technology Inc.
10.4.7.1 Clock Arbitration
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition,
deasserts the SCL pin (SCL allowed to float high).
When the SCL pin is allowed to float high, the Baud
Rate Generator (BRG) is suspended from counting
until the SCL pin is actually sampled high. When the
SCL pin is sampled high, the Baud Rate Generator is
reloaded with the contents of SSPADD<6:0> and
begins counting. This ensures that the SCL high time
will always be at least one BRG rollover count in the
event that the clock is held low by an external device
(Figure 10-18).
FIGURE 10-18: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
SDA
SCL
SCL deasserted but slave holds
DX-1 DX
BRG
SCL is sampled high, reload takes
place and BRG starts its count
03h 02h 01h 00h (hold off) 03h 02h
Reload
BRG
Value
SCL low (clock arbitration)
SCL allowed to transition high
BRG decrements on
Q2 and Q4 cycles
2003 Microchip Technology Inc. Preliminary DS30498B-page 121
PIC16F7X7
10.4.8 I
2
C MASTER MODE START
CONDITION TIMING
To initiate a Start condition, the user sets the Start Con-
dition Enable bit, SEN (SSPCON2<0>). If the SDA and
SCL pins are sampled high, the Baud Rate Generator
is reloaded with the contents of SSPADD<6:0> and
starts its count. If SCL and SDA are both sampled high
when the Baud Rate Generator times out (TBRG), the
SDA pin is driven low. The action of the SDA being
driven low while SCL is high is the Start condition and
causes the S bit (SSPSTAT<3>) to be set. Following
this, the Baud Rate Generator is reloaded with the con-
tents of SSPADD<6:0> and resumes its count. When
the Baud Rate Generator times out (TBRG), the SEN bit
(SSPCON2<0>) will be automatically cleared by hard-
ware, the Baud Rate Generator is suspended, leaving
the SDA line held low and the Start condition is
complete.
10.4.8.1 WCOL Status Flag
If the user writes the SSPBUF when a Start sequence
is in progress, the WCOL is set and the contents of the
buffer are unchanged (the write doesnt occur).
FIGURE 10-19: FIRST START BIT TIMING
Note: If at the beginning of the Start condition,
the SDA and SCL pins are already sam-
pled low, or if during the Start condition, the
SCL line is sampled low before the SDA
line is driven low, a bus collision occurs,
the Bus Collision Interrupt Flag, BCLIF, is
set, the Start condition is aborted and the
I
2
C module is reset into its Idle state.
Note: Because queueing of events is not
allowed, writing to the lower 5 bits of
SSPCON2 is disabled until the Start
condition is complete.
SDA
SCL
S
TBRG
1st bit 2nd bit
TBRG
SDA = 1,
At completion of Start bit,
SCL = 1
Write to SSPBUF occurs here
TBRG
hardware clears SEN bit
TBRG
Write to SEN bit occurs here
Set S bit (SSPSTAT<3>)
and sets SSPIF bit
PIC16F7X7
DS30498B-page 122 Preliminary 2003 Microchip Technology Inc.
10.4.9 I
2
C MASTER MODE REPEATED
START CONDITION TIMING
A Repeated Start condition occurs when the RSEN bit
(SSPCON2<1>) is programmed high and the I
2
C logic
module is in the Idle state. When the RSEN bit is set,
the SCL pin is asserted low. When the SCL pin is sam-
pled low, the Baud Rate Generator is loaded with the
contents of SSPADD<5:0> and begins counting. The
SDA pin is released (brought high) for one Baud Rate
Generator count (TBRG). When the Baud Rate Genera-
tor times out, if SDA is sampled high, the SCL pin will
be deasserted (brought high). When SCL is sampled
high, the Baud Rate Generator is reloaded with the
contents of SSPADD<6:0> and begins counting. SDA
and SCL must be sampled high for one TBRG. This
action is then followed by assertion of the SDA pin
(SDA = 0) for one TBRG while SCL is high. Following
this, the RSEN bit (SSPCON2<1>) will be automatically
cleared and the Baud Rate Generator will not be
reloaded, leaving the SDA pin held low. As soon as a
Start condition is detected on the SDA and SCL pins,
the S bit (SSPSTAT<3>) will be set. The SSPIF bit will
not be set until the Baud Rate Generator has timed out.
Immediately following the SSPIF bit getting set, the
user may write the SSPBUF with the 7-bit address in
7-bit mode or the default first address in 10-bit mode.
After the first eight bits are transmitted and an ACK is
received, the user may then transmit an additional eight
bits of address (10-bit mode) or eight bits of data (7-bit
mode).
10.4.9.1 WCOL Status Flag
If the user writes the SSPBUF when a Repeated Start
sequence is in progress, the WCOL is set and the con-
tents of the buffer are unchanged (the write doesnt
occur).
FIGURE 10-20: REPEAT START CONDITION WAVEFORM
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
2: A bus collision during the Repeated Start
condition occurs if:
SDA is sampled low when SCL goes
from low-to-high.
SCL goes low before SDA is
asserted low. This may indicate that
another master is attempting to
transmit a data 1.
Note: Because queueing of events is not
allowed, writing of the lower 5 bits of
SSPCON2 is disabled until the Repeated
Start condition is complete.
SDA
SCL
Sr = Repeated Start
Write to SSPCON2
Write to SSPBUF occurs here
Falling edge of ninth clock.
End of Xmit.
At completion of Start bit,
hardware clears RSEN bit
1st bit
Set S (SSPSTAT<3>)
TBRG
TBRG
SDA = 1,
SDA = 1,
SCL (no change).
SCL = 1
occurs here.
TBRG TBRG TBRG
and sets SSPIF
2003 Microchip Technology Inc. Preliminary DS30498B-page 123
PIC16F7X7
10.4.10 I
2
C MASTER MODE
TRANSMISSION
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address, is accomplished by sim-
ply writing a value to the SSPBUF register. This action
will set the Buffer Full flag bit, BF, and allow the Baud
Rate Generator to begin counting and start the next
transmission. Each bit of address/data will be shifted
out onto the SDA pin after the falling edge of SCL is
asserted (see data hold time specification parameter
#106). SCL is held low for one Baud Rate Generator
rollover count (TBRG). Data should be valid before SCL
is released high (see data setup time specification
parameter #107). When the SCL pin is released high, it
is held that way for TBRG. The data on the SDA pin
must remain stable for that duration and some hold
time after the next falling edge of SCL. After the eighth
bit is shifted out (the falling edge of the eighth clock),
the BF flag is cleared and the master releases SDA.
This allows the slave device being addressed to
respond with an ACK bit during the ninth bit time, if an
address match occurred or if data was received prop-
erly. The status of ACK is written into the ACKDT bit on
the falling edge of the ninth clock. If the master receives
an Acknowledge, the Acknowledge Status bit,
ACKSTAT, is cleared. If not, the bit is set. After the ninth
clock, the SSPIF bit is set and the master clock (Baud
Rate Generator) is suspended until the next data byte
is loaded into the SSPBUF, leaving SCL low and SDA
unchanged (Figure 10-21).
After the write to the SSPBUF, each bit of address will
be shifted out on the falling edge of SCL until all seven
address bits and the R/W bit are completed. On the fall-
ing edge of the eighth clock, the master will deassert
the SDA pin, allowing the slave to respond with an
Acknowledge. On the falling edge of the ninth clock, the
master will sample the SDA pin to see if the address
was recognized by a slave. The status of the ACK bit is
loaded into the ACKSTAT status bit (SSPCON2<6>).
Following the falling edge of the ninth clock transmis-
sion of the address, the SSPIF is set, The BF flag Is
cleared and the Baud Rate Generator is turned off until
another write to the SSPBUF takes place, holding SCL
low and allowing SDA to float.
10.4.10.1 BF Status Flag
In Transmit mode, the BF bit (SSPSTAT<0>) is set
when the CPU writes to SSPBUF and is cleared when
all 8 bits are shifted out.
10.4.10.2 WCOL Status Flag
If the user writes the SSPBUF when a transmit is
already in progress (i.e., SSPSR is still shifting out a
data byte), the WCOL is set and the contents of the
buffer are unchanged (the write doesnt occur).
WCOL must be cleared in software.
10.4.10.3 ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit (SSPCON2<6>) is
cleared when the slave has sent an Acknowledge
(ACK = 0) and is set when the slave does not Acknowl-
edge (ACK = 1). A slave sends an Acknowledge when
it has recognized its address (including a general call)
or when the slave has properly received its data.
10.4.11 I
2
C MASTER MODE RECEPTION
Master mode reception is enabled by programming the
Receive Enable bit, RCEN (SSPCON2<3>).
The Baud Rate Generator begins counting and on each
rollover, the state of the SCL pin changes (high-to-low/
low-to-high) and data is shifted into the SSPSR. After
the falling edge of the eighth clock, the receive enable
flag is automatically cleared, the contents of the
SSPSR are loaded into the SSPBUF, the BF flag bit is
set, the SSPIF flag bit is set and the Baud Rate Gener-
ator is suspended from counting, holding SCL low. The
MSSP is now in Idle state, awaiting the next command.
When the buffer is read by the CPU, the BF flag bit is
automatically cleared. The user can then send an
Acknowledge bit at the end of reception by setting the
Acknowledge Sequence Enable bit, ACKEN
(SSPCON2<4>).
10.4.11.1 BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPBUF from SSPSR. It is
cleared when the SSPBUF register is read.
10.4.11.2 SSPOV Status Flag
In receive operation, the SSPOV bit is set when 8 bits
are received into the SSPSR and the BF flag bit is
already set from a previous reception.
10.4.11.3 WCOL Status Flag
If the user writes the SSPBUF when a receive is
already in progress (i.e., SSPSR is still shifting in a data
byte), the WCOL bit is set and the contents of the buffer
are unchanged (the write doesnt occur).
Note: The MSSP module must be in an Idle state
before the RCEN bit is set or the RCEN bit
will be disregarded.
PIC16F7X7
DS30498B-page 124 Preliminary 2003 Microchip Technology Inc.
FIGURE 10-21: I
2
C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)
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2003 Microchip Technology Inc. Preliminary DS30498B-page 125
PIC16F7X7
FIGURE 10-22: I
2
C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
P
9
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PIC16F7X7
DS30498B-page 126 Preliminary 2003 Microchip Technology Inc.
10.4.12 ACKNOWLEDGE SEQUENCE
TIMING
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable bit, ACKEN
(SSPCON2<4>). When this bit is set, the SCL pin is
pulled low and the contents of the Acknowledge data bit
are presented on the SDA pin. If the user wishes to gen-
erate an Acknowledge, then the ACKDT bit should be
cleared. If not, the user should set the ACKDT bit before
starting an Acknowledge sequence. The Baud Rate
Generator then counts for one rollover period (TBRG)
and the SCL pin is deasserted (pulled high). When the
SCL pin is sampled high (clock arbitration), the Baud
Rate Generator counts for TBRG. The SCL pin is then
pulled low. Following this, the ACKEN bit is automatically
cleared, the Baud Rate Generator is turned off and the
MSSP module then goes into Idle mode (Figure 10-23).
10.4.12.1 WCOL Status Flag
If the user writes the SSPBUF when an Acknowledge
sequence is in progress, then WCOL is set and the
contents of the buffer are unchanged (the write doesnt
occur).
10.4.13 STOP CONDITION TIMING
A Stop bit is asserted on the SDA pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN (SSPCON2<2>). At the end of a receive/
transmit, the SCL line is held low after the falling edge
of the ninth clock. When the PEN bit is set, the master
will assert the SDA line low. When the SDA line is sam-
pled low, the Baud Rate Generator is reloaded and
counts down to 0. When the Baud Rate Generator
times out, the SCL pin will be brought high and one
TBRG (Baud Rate Generator rollover count) later, the
SDA pin will be deasserted. When the SDA pin is sam-
pled high while SCL is high, the P bit (SSPSTAT<4>) is
set. A TBRG later, the PEN bit is cleared and the SSPIF
bit is set (Figure 10-24).
10.4.13.1 WCOL Status Flag
If the user writes the SSPBUF when a Stop sequence
is in progress, then the WCOL bit is set and the
contents of the buffer are unchanged (the write doesnt
occur).
FIGURE 10-23: ACKNOWLEDGE SEQUENCE WAVEFORM
FIGURE 10-24: STOP CONDITION RECEIVE OR TRANSMIT MODE
Note: TBRG = one Baud Rate Generator period.
SDA
SCL
Set SSPIF at the end
Acknowledge sequence starts here,
write to SSPCON2
ACKEN automatically cleared
Cleared in
TBRG TBRG
of receive
ACK
8
ACKEN = 1, ACKDT = 0
D0
9
SSPIF
software
Set SSPIF at the end
of Acknowledge sequence
Cleared in
software
SCL
SDA
SDA asserted low before rising edge of clock to setup Stop condition
Write to SSPCON2,
set PEN
Falling edge of
SCL = 1 for TBRG, followed by SDA = 1 for TBRG
9th clock
SCL brought high after TBRG
Note: TBRG = one Baud Rate Generator period.
TBRG TBRG
after SDA sampled high. P bit (SSPSTAT<4>) is set.
TBRG
ACK
P
TBRG
PEN bit (SSPCON2<2>) is cleared by
hardware and the SSPIF bit is set
2003 Microchip Technology Inc. Preliminary DS30498B-page 127
PIC16F7X7
10.4.14 SLEEP OPERATION
While in Sleep mode, the I
2
C module can receive
addresses or data and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSP interrupt is enabled).
10.4.15 EFFECT OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
10.4.16 MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset or when the
MSSP module is disabled. Control of the I
2
C bus may
be taken when the P bit (SSPSTAT<4>) is set or the
bus is Idle, with both the S and P bits clear. When the
bus is busy, enabling the SSP interrupt will generate
the interrupt when the Stop condition occurs.
In multi-master operation, the SDA line must be moni-
tored for arbitration to see if the signal level is at the
expected output level. This check is performed in
hardware with the result placed in the BCLIF bit.
The states where arbitration can be lost are:
Address Transfer
Data Transfer
A Start Condition
A Repeated Start Condition
An Acknowledge Condition
10.4.17 MULTI-MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus arbitra-
tion. When the master outputs address/data bits onto
the SDA pin, arbitration takes place when the master
outputs a 1 on SDA by letting SDA float high and
another master asserts a 0. When the SCL pin floats
high, data should be stable. If the expected data on
SDA is a 1 and the data sampled on the SDA pin = 0,
then a bus collision has taken place. The master will set
the Bus Collision Interrupt Flag, BCLIF, and reset the
I
2
C port to its Idle state (Figure 10-25).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF flag is
cleared, the SDA and SCL lines are deasserted and the
SSPBUF can be written to. When the user services the
bus collision Interrupt Service Routine and if the I
2
C
bus is free, the user can resume communication by
asserting a Start condition.
If a Start, Repeated Start, Stop or Acknowledge condi-
tion was in progress when the bus collision occurred,
the condition is aborted, the SDA and SCL lines are
deasserted and the respective control bits in the
SSPCON2 register are cleared. When the user
services the bus collision Interrupt Service Routine and
if the I
2
C bus is free, the user can resume
communication by asserting a Start condition.
The master will continue to monitor the SDA and SCL
pins. If a Stop condition occurs, the SSPIF bit will be set.
A write to the SSPBUF will start the transmission of
data at the first data bit, regardless of where the
transmitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the determi-
nation of when the bus is free. Control of the I
2
C bus can
be taken when the P bit is set in the SSPSTAT register or
the bus is Idle and the S and P bits are cleared.
FIGURE 10-25: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
SDA
SCL
BCLIF
SDA released
SDA line pulled low
by another source
Sample SDA. While SCL is high,
data doesnt match what is driven
Set bus collision
interrupt (BCLIF)
by the master. Bus collision has occurred.
by master
Data changes
while SCL = 0
PIC16F7X7
DS30498B-page 128 Preliminary 2003 Microchip Technology Inc.
10.4.17.1 Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a) SDA or SCL are sampled low at the beginning of
the Start condition (Figure 10-26).
b) SCL is sampled low before SDA is asserted low
(Figure 10-27).
During a Start condition, both the SDA and the SCL
pins are monitored.
If the SDA pin is already low, or the SCL pin is already
low, then all of the following occur:
the Start condition is aborted,
the BCLIF flag is set and
the MSSP module is reset to its Idle state
(Figure 10-26).
The Start condition begins with the SDA and SCL pins
deasserted. When the SDA pin is sampled high, the
Baud Rate Generator is loaded from SSPADD<6:0>
and counts down to 0. If the SCL pin is sampled low
while SDA is high, a bus collision occurs because it is
assumed that another master is attempting to drive a
data 1 during the Start condition.
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 10-28). If, however, a 1 is sampled on the SDA
pin, the SDA pin is asserted low at the end of the BRG
count. The Baud Rate Generator is then reloaded and
counts down to 0 and during this time, if the SCL pin is
sampled as 0, a bus collision does not occur. At the
end of the BRG count, the SCL pin is asserted low.
FIGURE 10-26: BUS COLLISION DURING START CONDITION (SDA ONLY)
Note: The reason that bus collision is not a factor
during a Start condition is that no two bus
masters can assert a Start condition at the
exact same time. Therefore, one master
will always assert SDA before the other.
This condition does not cause a bus colli-
sion because the two masters must be
allowed to arbitrate the first address fol-
lowing the Start condition. If the address is
the same, arbitration must be allowed to
continue into the data portion, Repeated
Start or Stop conditions.
SDA
SCL
SEN
SDA sampled low before
SDA goes low before the SEN bit is set.
S bit and SSPIF set because
SSP module resets into Idle state.
SEN cleared automatically because of bus collision.
S bit and SSPIF set because
Set SEN, enable Start
condition if SDA = 1, SCL = 1
SDA = 0, SCL = 1.
BCLIF
S
SSPIF
SDA = 0, SCL = 1.
SSPIF and BCLIF are
cleared in software
SSPIF and BCLIF are
cleared in software
Set BCLIF,
Start condition. Set BCLIF.
2003 Microchip Technology Inc. Preliminary DS30498B-page 129
PIC16F7X7
FIGURE 10-27: BUS COLLISION DURING START CONDITION (SCL = 0)
FIGURE 10-28: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA
SCL
SEN
bus collision occurs. Set BCLIF.
SCL = 0 before SDA = 0,
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
TBRG TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
Interrupt cleared
in software
bus collision occurs. Set BCLIF.
SCL = 0 before BRG time-out,
0 0
0 0
SDA
SCL
SEN
Set S
Less than TBRG
TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
S
Interrupts cleared
in software set SSPIF
SDA = 0, SCL = 1,
SDA pulled low by other master.
Reset BRG and assert SDA.
SCL pulled low after BRG
time-out
Set SSPIF
0
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
PIC16F7X7
DS30498B-page 130 Preliminary 2003 Microchip Technology Inc.
10.4.17.2 Bus Collision During a Repeated
Start Condition
During a Repeated Start condition, a bus collision
occurs if:
a) A low level is sampled on SDA when SCL goes
from low level to high level.
b) SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data 1.
When the user deasserts SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD<6:0> and
counts down to 0. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data 0, see
Figure 10-29). If SDA is sampled high, the BRG is
reloaded and begins counting. If SDA goes from high-
to-low before the BRG times out, no bus collision
occurs because no two masters can assert SDA at
exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data 1 during the Repeated Start condition
(Figure 10-30).
If at the end of the BRG time-out, both SCL and SDA are
still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is complete.
FIGURE 10-29: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
FIGURE 10-30: BUS COLLISION DURING A REPEATED START CONDITION (CASE 2)
SDA
SCL
RSEN
BCLIF
S
SSPIF
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
Cleared in software
0
0
S
SDA
SCL
BCLIF
RSEN
S
SSPIF
Interrupt cleared
in software
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
TBRG TBRG
0
2003 Microchip Technology Inc. Preliminary DS30498B-page 131
PIC16F7X7
10.4.17.3 Bus Collision During a Stop
Condition
Bus collision occurs during a Stop condition if:
a) After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
b) After the SCL pin is deasserted, SCL is sampled
low before SDA goes high.
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD<6:0>
and counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data 0 (Figure 10-31). If the SCL pin is
sampled low before SDA is allowed to float high, a bus
collision occurs. This is another case of another master
attempting to drive a data 0 (Figure 10-32).
FIGURE 10-31: BUS COLLISION DURING A STOP CONDITION (CASE 1)
FIGURE 10-32: BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
SDA asserted low
SDA sampled
low after TBRG,
set BCLIF
0
0
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
Assert SDA
SCL goes low before SDA goes high,
set BCLIF
0
0
PIC16F7X7
DS30498B-page 132 Preliminary 2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc. Preliminary DS30498B-page 133
PIC16F7X7
11.0 ADDRESSABLE UNIVERSAL
SYNCHRONOUS
ASYNCHRONOUS RECEIVER
TRANSMITTER (USART)
The Universal Synchronous Asynchronous Receiver
Transmitter (USART) module is one of the two serial
I/O modules. (USART is also known as a Serial
Communications Interface or SCI.) The USART can be
configured as a full-duplex asynchronous system that
can communicate with peripheral devices, such as
CRT terminals and personal computers, or it can be
configured as a half-duplex synchronous system that
can communicate with peripheral devices, such as A/D
or D/A integrated circuits, serial EEPROMs, etc.
The USART can be configured in the following modes:
Asynchronous (full-duplex)
Synchronous Master (half-duplex)
Synchronous Slave (half-duplex)
Bit SPEN (RCSTA<7>) and bits TRISC<7:6> have
to be set in order to configure pins RC6/TX/CK and
RC7/RX/DT as the Universal Synchronous
Asynchronous Receiver Transmitter.
The USART module also has a multi-processor
communication capability using 9-bit address detection.
REGISTER 11-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER (ADDRESS 98h)
R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R-1 R/W-0
CSRC TX9 TXEN SYNC BRGH TRMT TX9D
bit 7 bit 0
bit 7 CSRC: Clock Source Select bit
Asynchronous mode:
Dont care.
Synchronous mode:
1 = Master mode (clock generated internally from BRG)
0 = Slave mode (clock from external source)
bit 6 TX9: 9-bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5 TXEN: Transmit Enable bit
1 = Transmit enabled
0 = Transmit disabled
Note: SREN/CREN overrides TXEN in Sync mode.
bit 4 SYNC: USART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3 Unimplemented: Read as 0
bit 2 BRGH: High Baud Rate Select bit
Asynchronous mode:
1 = High speed
0 = Low speed
Synchronous mode:
Unused in this mode.
bit 1 TRMT: Transmit Shift Register Status bit
1 = TSR empty
0 = TSR full
bit 0 TX9D: 9th bit of Transmit Data, can be Parity bit
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
- n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
PIC16F7X7
DS30498B-page 134 Preliminary 2003 Microchip Technology Inc.
REGISTER 11-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER (ADDRESS 18h)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x
SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
bit 7 bit 0
bit 7 SPEN: Serial Port Enable bit
1 = Serial port enabled (configures RC7/RX/DT and RC6/TX/CK pins as serial port pins)
0 = Serial port disabled
bit 6 RX9: 9-bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5 SREN: Single Receive Enable bit
Asynchronous mode:
Dont care.
Synchronous mode Master:
1 = Enables single receive
0 = Disables single receive
This bit is cleared after reception is complete.
Synchronous mode Slave:
Dont care.
bit 4 CREN: Continuous Receive Enable bit
Asynchronous mode:
1 = Enables continuous receive
0 = Disables continuous receive
Synchronous mode:
1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)
0 = Disables continuous receive
bit 3 ADDEN: Address Detect Enable bit
Asynchronous mode 9-bit (RX9 = 1):
1 = Enables address detection, enables interrupt and load of the receive buffer when
RSR<8> is set
0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit
bit 2 FERR: Framing Error bit
1 = Framing error (can be updated by reading RCREG register and receiving next valid byte)
0 = No framing error
bit 1 OERR: Overrun Error bit
1 = Overrun error (can be cleared by clearing bit CREN)
0 = No overrun error
bit 0 RX9D: 9th bit of Received Data (can be parity bit, but must be calculated by user firmware)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
- n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
2003 Microchip Technology Inc. Preliminary DS30498B-page 135
PIC16F7X7
11.1 USART Baud Rate Generator
(BRG)
The BRG supports both the Asynchronous and Syn-
chronous modes of the USART. It is a dedicated 8-bit
Baud Rate Generator. The SPBRG register controls
the period of a free-running 8-bit timer. In Asynchro-
nous mode, bit BRGH (TXSTA<2>) also controls the
baud rate. In Synchronous mode, bit BRGH is ignored.
Table 11-1 shows the formula for computation of the
baud rate for different USART modes, which only apply
in Master mode (internal clock).
Given the desired baud rate and FOSC, the nearest
integer value for the SPBRG register can be calculated
using the formula in Table 11-1. From this, the error in
baud rate can be determined.
It may be advantageous to use the high baud rate
(BRGH = 1), even for slower baud clocks. This is
because the FOSC/(16(X + 1)) equation can reduce the
baud rate error in some cases.
Writing a new value to the SPBRG register causes the
BRG timer to be reset (or cleared). This ensures the
BRG does not wait for a timer overflow before
outputting the new baud rate.
11.1.1 SAMPLING
The data on the RC7/RX/DT pin is sampled three times
by a majority detect circuit to determine if a high or a
low level is present at the RX pin.
TABLE 11-1: BAUD RATE FORMULA
TABLE 11-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR
SYNC BRGH = 0 (Low Speed) BRGH = 1 (High Speed)
0
1
(Asynchronous) Baud Rate = FOSC/(64(X + 1))
(Synchronous) Baud Rate = FOSC/(4(X + 1))
Baud Rate = FOSC/(16(X + 1))
N/A
X = value in SPBRG (0 to 255)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR, BOR
Value on
all other
Resets
98h TXSTA CSRC TX9 TXEN SYNC BRGH TRMT TX9D 0000 -010 0000 -010
18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented, read as 0. Shaded cells are not used by the BRG.
PIC16F7X7
DS30498B-page 136 Preliminary 2003 Microchip Technology Inc.
TABLE 11-3: BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 0)
BAUD
RATE
(K)
FOSC = 20 MHz FOSC = 16 MHz FOSC = 10 MHz
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
0.3 - - - - - - - - -
1.2 1.221 1.75 255 1.202 0.17 207 1.202 0.17 129
2.4 2.404 0.17 129 2.404 0.17 103 2.404 0.17 64
9.6 9.766 1.73 31 9.615 0.16 25 9.766 1.73 15
19.2 19.531 1.72 15 19.231 0.16 12 19.531 1.72 7
28.8 31.250 8.51 9 27.778 3.55 8 31.250 8.51 4
33.6 34.722 3.34 8 35.714 6.29 6 31.250 6.99 4
57.6 62.500 8.51 4 62.500 8.51 3 52.083 9.58 2
HIGH 1.221 - 255 0.977 - 255 0.610 - 255
LOW 312.500 - 0 250.000 - 0 156.250 - 0
BAUD
RATE
(K)
FOSC = 4 MHz FOSC = 3.6864 MHz
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
0.3 0.300 0 207 0.3 0 191
1.2 1.202 0.17 51 1.2 0 47
2.4 2.404 0.17 25 2.4 0 23
9.6 8.929 6.99 6 9.6 0 5
19.2 20.833 8.51 2 19.2 0 2
28.8 31.250 8.51 1 28.8 0 1
33.6 - - - - - -
57.6 62.500 8.51 0 57.6 0 0
HIGH 0.244 - 255 0.225 - 255
LOW 62.500 - 0 57.6 - 0
TABLE 11-4: BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 1)
BAUD
RATE
(K)
FOSC = 20 MHz FOSC = 16 MHz FOSC = 10 MHz
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
0.3 - - - - - - - - -
1.2 - - - - - - - - -
2.4 - - - - - - 2.441 1.71 255
9.6 9.615 0.16 129 9.615 0.16 103 9.615 0.16 64
19.2 19.231 0.16 64 19.231 0.16 51 19.531 1.72 31
28.8 29.070 0.94 42 29.412 2.13 33 28.409 1.36 21
33.6 33.784 0.55 36 33.333 0.79 29 32.895 2.10 18
57.6 59.524 3.34 20 58.824 2.13 16 56.818 1.36 10
HIGH 4.883 - 255 3.906 - 255 2.441 - 255
LOW 1250.000 - 0 1000.000 0 625.000 - 0
BAUD
RATE
(K)
FOSC = 4 MHz FOSC = 3.6864 MHz
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
0.3 - - - - - -
1.2 1.202 0.17 207 1.2 0 191
2.4 2.404 0.17 103 2.4 0 95
9.6 9.615 0.16 25 9.6 0 23
19.2 19.231 0.16 12 19.2 0 11
28.8 27.798 3.55 8 28.8 0 7
33.6 35.714 6.29 6 32.9 2.04 6
57.6 62.500 8.51 3 57.6 0 3
HIGH 0.977 - 255 0.9 - 255
LOW 250.000 - 0 230.4 - 0
2003 Microchip Technology Inc. Preliminary DS30498B-page 137
PIC16F7X7
TABLE 11-5: INTRC BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 0)
BAUD
RATE
(K)
FOSC = 8 MHz FOSC = 4 MHz FOSC = 2 MHz FOSC = 1 MHz
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
0.3 NA 0.300 0 207 0.300 0 103 0.300 0 51
1.2 1.202 +0.16 103 1.202 +0.16 51 1.202 +0.16 25 1.202 +0.16 12
2.4 2.404 +0.16 51 2.404 +0.16 25 2.404 +0.16 12 2.232 -6.99 6
9.6 9.615 +0.16 12 8.929 -6.99 6 10.417 +8.51 2 NA
19.2 17.857 -6.99 6 20.833 +8.51 2 NA NA
28.8 31.250 +8.51 3 31.250 +8.51 1 31.250 +8.51 0 NA
38.4 41.667 +8.51 2 NA NA NA
57.6 62.500 +8.51 1 62.500 8.51 0 NA NA
TABLE 11-6: INTRC BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 1)
BAUD
RATE
(K)
FOSC = 8 MHz FOSC = 4 MHz FOSC = 2 MHz FOSC = 1 MHz
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
KBAUD
%
ERROR
SPBRG
value
(decimal)
0.3 NA NA NA 0.300 0 207
1.2 NA 1.202 +0.16 207 1.202 +0.16 103 1.202 +0.16 51
2.4 2.404 +0.16 207 2.404 +0.16 103 2.404 +0.16 51 2.404 +0.16 25
9.6 9.615 +0.16 51 9.615 +0.16 25 9.615 +0.16 12 8.929 -6.99 6
19.2 19.231 +0.16 25 19.231 +0.16 12 17.857 -6.99 6 20.833 +8.51 2
28.8 29.412 +2.12 16 27.778 -3.55 8 31.250 +8.51 3 31.250 +8.51 1
38.4 38.462 +0.16 12 35.714 -6.99 6 41.667 +8.51 2 NA
57.6 55.556 -3.55 8 62.500 +8.51 3 62.500 +8.51 1 62.500 +8.51 0
PIC16F7X7
DS30498B-page 138 Preliminary 2003 Microchip Technology Inc.
11.2 USART Asynchronous Mode
In this mode, the USART uses standard Non-Return-
to-Zero (NRZ) format (one Start bit, eight or nine data
bits and one Stop bit). The most common data format
is 8-bits. An on-chip, dedicated, 8-bit Baud Rate Gen-
erator can be used to derive standard baud rate fre-
quencies from the oscillator. The USART transmits and
receives the LSb first. The transmitter and receiver are
functionally independent but use the same data format
and baud rate. The Baud Rate Generator produces a
clock, either x16 or x64 of the bit shift rate, depending
on bit BRGH (TXSTA<2>). Parity is not supported by
the hardware but can be implemented in software (and
stored as the ninth data bit). Asynchronous mode is
stopped during Sleep.
Asynchronous mode is selected by clearing bit, SYNC
(TXSTA<4>).
The USART asynchronous module consists of the
following important elements:
Baud Rate Generator
Sampling Circuit
Asynchronous Transmitter
Asynchronous Receiver
11.2.1 USART ASYNCHRONOUS
TRANSMITTER
The USART transmitter block diagram is shown in
Figure 11-1. The heart of the transmitter is the Transmit
(Serial) Shift Register (TSR). The Shift register obtains
its data from the Read/Write Transmit Buffer register,
TXREG. The TXREG register is loaded with data in
software. The TSR register is not loaded until the Stop
bit has been transmitted from the previous load. As
soon as the Stop bit is transmitted, the TSR is loaded
with new data from the TXREG register (if available).
Once the TXREG register transfers the data to the TSR
register (occurs in one TCY), the TXREG register is
empty and flag bit, TXIF (PIR1<4>), is set. This inter-
rupt can be enabled/disabled by setting/clearing
enable bit, TXIE (PIE1<4>). Flag bit TXIF will be set
regardless of the state of enable bit TXIE and cannot be
cleared in software. It will reset only when new data is
loaded into the TXREG register. While flag bit TXIF
indicates the status of the TXREG register, another bit,
TRMT (TXSTA<1>), shows the status of the TSR reg-
ister. Status bit TRMT is a read-only bit which is set
when the TSR register is empty. No interrupt logic is
tied to this bit, so the user has to poll this bit in order to
determine if the TSR register is empty.
Transmission is enabled by setting enable bit, TXEN
(TXSTA<5>). The actual transmission will not occur
until the TXREG register has been loaded with data
and the Baud Rate Generator (BRG) has produced a
shift clock (Figure 11-2). The transmission can also be
started by first loading the TXREG register and then
setting enable bit TXEN. Normally, when transmission
is first started, the TSR register is empty. At that point,
transfer to the TXREG register will result in an immedi-
ate transfer to TSR, resulting in an empty TXREG. A
back-to-back transfer is thus possible (Figure 11-3).
Clearing enable bit TXEN during a transmission will
cause the transmission to be aborted and will reset the
transmitter. As a result, the RC6/TX/CK pin will revert
to high-impedance.
In order to select 9-bit transmission, transmit bit TX9
(TXSTA<6>) should be set and the ninth bit should be
written to TX9D (TXSTA<0>). The ninth bit must be
written before writing the 8-bit data to the TXREG
register. This is because a data write to the TXREG
register can result in an immediate transfer of the data
to the TSR register (if the TSR is empty). In such a
case, an incorrect ninth data bit may be loaded in the
TSR register.
FIGURE 11-1: USART TRANSMIT BLOCK DIAGRAM
Note 1: The TSR register is not mapped in data
memory so it is not available to the user.
2: Flag bit TXIF is set when enable bit TXEN
is set. TXIF is cleared by loading TXREG.
TXIF
TXIE
Interrupt
TXEN Baud Rate CLK
SPBRG
Baud Rate Generator
TX9D
MSb LSb
Data Bus
TXREG Register
TSR Register
(8) 0
TX9
TRMT SPEN
RC6/TX/CK pin
Pin Buffer
and Control
8
2003 Microchip Technology Inc. Preliminary DS30498B-page 139
PIC16F7X7
When setting up an Asynchronous Transmission,
follow these steps:
1. Initialize the SPBRG register for the appropriate
baud rate. If a high-speed baud rate is desired,
set bit BRGH (Section 11.1 USART Baud
Rate Generator (BRG)).
2. Enable the asynchronous serial port by clearing
bit SYNC and setting bit SPEN.
3. If interrupts are desired, then set enable bit TXIE.
4. If 9-bit transmission is desired, then set transmit
bit TX9.
5. Enable the transmission by setting bit TXEN,
which will also set bit TXIF.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit TX9D.
7. Load data to the TXREG register (starts
transmission).
8. If using interrupts, ensure that GIE and PEIE
(bits 7 and 6) of the INTCON register are set.
FIGURE 11-2: ASYNCHRONOUS MASTER TRANSMISSION
FIGURE 11-3: ASYNCHRONOUS MASTER TRANSMISSION (BACK TO BACK)
TABLE 11-7: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR, BOR
Value on
all other
Resets
0Bh, 8Bh,
10Bh,18Bh
INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u
0Ch PIR1 PSPIF
(1)
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN FERR OERR RX9D 0000 -00x 0000 -00x
19h TXREG USART Transmit Register 0000 0000 0000 0000
8Ch PIE1 PSPIE
(1)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented locations read as 0. Shaded cells are not used for asynchronous transmission.
Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear.
Word 1
Stop bit
Word 1
Transmit Shift Reg
Start bit bit 0 bit 1 bit 7/8
Write to TXREG
Word 1
BRG Output
(Shift Clock)
RC6/TX/CK (pin)
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Transmit Shift Reg.
Write to TXREG
BRG Output
(Shift Clock)
RC6/TX/CK (pin)
TXIF bit
(Interrupt Reg. Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Word 1 Word 2
Word 1 Word 2
Start bit
Stop bit
Start bit
Transmit Shift Reg.
Word 1 Word 2
bit 0 bit 1 bit 7/8 bit 0
Note: This timing diagram shows two consecutive transmissions.
PIC16F7X7
DS30498B-page 140 Preliminary 2003 Microchip Technology Inc.
11.2.2 USART ASYNCHRONOUS
RECEIVER
The receiver block diagram is shown in Figure 11-4.
The data is received on the RC7/RX/DT pin and drives
the data recovery block. The data recovery block is
actually a high-speed shifter, operating at x16 times the
baud rate; whereas, the main receive serial shifter
operates at the bit rate or at FOSC.
Once Asynchronous mode is selected, reception is
enabled by setting bit, CREN (RCSTA<4>).
The heart of the receiver is the Receive (Serial) Shift
Register (RSR). After sampling the Stop bit, the
received data in the RSR is transferred to the RCREG
register (if it is empty). If the transfer is complete, flag
bit, RCIF (PIR1<5>), is set. The actual interrupt can be
enabled/disabled by setting/clearing enable bit, RCIE
(PIE1<5>). Flag bit RCIF is a read-only bit which is
cleared by the hardware. It is cleared when the RCREG
register has been read and is empty. The RCREG is a
double-buffered register (i.e., it is a two-deep FIFO). It
is possible for two bytes of data to be received and
transferred to the RCREG FIFO and a third byte to
begin shifting to the RSR register. On the detection of
the Stop bit of the third byte, if the RCREG register is
still full, the Overrun Error bit, OERR (RCSTA<1>), will
be set. The word in the RSR will be lost. The RCREG
register can be read twice to retrieve the two bytes in
the FIFO. Overrun bit OERR has to be cleared in soft-
ware. This is done by resetting the receive logic (CREN
is cleared and then set). If bit OERR is set, transfers
from the RSR register to the RCREG register are inhib-
ited and no further data will be received. It is, therefore,
essential to clear error bit OERR if it is set. Framing
Error bit, FERR (RCSTA<2>), is set if a Stop bit is
detected as clear. Bit FERR and the 9th receive bit are
buffered the same way as the receive data. Reading
the RCREG will load bits RX9D and FERR with new
values, therefore, it is essential for the user to read the
RCSTA register before reading the RCREG register, in
order not to lose the old FERR and RX9D information.
FIGURE 11-4: USART RECEIVE BLOCK DIAGRAM
FIGURE 11-5: ASYNCHRONOUS RECEPTION
x64 Baud Rate CLK
SPBRG
Baud Rate Generator
RC7/RX/DT
Pin Buffer
and Control
SPEN
Data
Recovery
CREN
OERR FERR
RSR Register MSb LSb
RX9D RCREG Register
FIFO
Interrupt
RCIF
RCIE
Data Bus
8
64
16
or
Stop Start (8) 7 1 0
RX9
FOSC
Start
bit
bit 7/8 bit 1 bit 0 bit 7/8 bit 0 Stop
bit
Start
bit bit 7/8
RX (pin)
Reg
Rcv Buffer Reg
Rcv Shift
Read Rcv
Buffer Reg
RCREG
RCIF
(Interrupt Flag)
OERR bit
CREN
Word 1
RCREG
Word 2
RCREG
Stop
bit
Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word,
causing the OERR (overrun) bit to be set.
bit Stop
bit
Start
2003 Microchip Technology Inc. Preliminary DS30498B-page 141
PIC16F7X7
When setting up an Asynchronous Reception, follow
these steps:
1. Initialize the SPBRG register for the appropriate
baud rate. If a high-speed baud rate is desired,
set bit BRGH (Section 11.1 USART Baud
Rate Generator (BRG)).
2. Enable the asynchronous serial port by clearing
bit SYNC and setting bit SPEN.
3. If interrupts are desired, then set enable bit
RCIE.
4. If 9-bit reception is desired, then set bit RX9.
5. Enable the reception by setting bit CREN.
6. Flag bit RCIF will be set when reception is
complete and an interrupt will be generated if
enable bit RCIE is set.
7. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
8. Read the 8-bit received data by reading the
RCREG register.
9. If any error occurred, clear the error by clearing
enable bit CREN.
10. If using interrupts, ensure that GIE and PEIE
(bits 7 and 6) of the INTCON register are set.
TABLE 11-8: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR, BOR
Value on
all other
Resets
0Bh, 8Bh,
10Bh,18Bh
INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u
0Ch PIR1 PSPIF
(1)
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN FERR OERR RX9D 0000 -00x 0000 -00x
1Ah RCREG USART Receive Register 0000 0000 0000 0000
8Ch PIE1 PSPIE
(1)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented locations read as 0. Shaded cells are not used for asynchronous reception.
Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear.
PIC16F7X7
DS30498B-page 142 Preliminary 2003 Microchip Technology Inc.
11.2.3 SETTING UP 9-BIT MODE WITH
ADDRESS DETECT
When setting up an Asynchronous Reception with
address detect enabled:
Initialize the SPBRG register for the appropriate
baud rate. If a high-speed baud rate is desired,
set bit BRGH.
Enable the asynchronous serial port by clearing
bit SYNC and setting bit SPEN.
If interrupts are desired, then set enable bit RCIE.
Set bit RX9 to enable 9-bit reception.
Set ADDEN to enable address detect.
Enable the reception by setting enable bit CREN.
Flag bit RCIF will be set when reception is
complete and an interrupt will be generated if
enable bit RCIE was set.
Read the RCSTA register to get the ninth bit and
determine if any error occurred during reception.
Read the 8-bit received data by reading the
RCREG register to determine if the device is
being addressed.
If any error occurred, clear the error by clearing
enable bit CREN.
If the device has been addressed, clear the
ADDEN bit to allow data bytes and address bytes
to be read into the receive buffer and interrupt the
CPU.
FIGURE 11-6: USART RECEIVE BLOCK DIAGRAM
x64 Baud Rate CLK
SPBRG
Baud Rate Generator
RC7/RX/DT
Pin Buffer
and Control
SPEN
Data
Recovery
CREN
OERR
FERR
RSR Register MSb LSb
RX9D RCREG Register
FIFO
Interrupt
RCIF
RCIE
Data Bus
8
64
16
or
Stop Start (8) 7 1 0
RX9
RX9
ADDEN
RX9
ADDEN
RSR<8>
Enable
Load of
Receive
Buffer
8
8
FOSC
2003 Microchip Technology Inc. Preliminary DS30498B-page 143
PIC16F7X7
FIGURE 11-7: ASYNCHRONOUS RECEPTION WITH ADDRESS DETECT
FIGURE 11-8: ASYNCHRONOUS RECEPTION WITH ADDRESS BYTE FIRST
TABLE 11-9: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Start
bit
bit 1 bit 0 bit 8 bit 0 Stop
bit
Start
bit bit 8 Stop
bit
RC7/RX/DT (pin)
Load RSR
Read
RCIF
Word 1
RCREG
bit 8 = 0, Data Byte bit 8 = 1, Address Byte
Note: This timing diagram shows a data byte followed by an address byte. The data byte is not read into the RCREG (receive buffer)
because ADDEN = 1.
Start
bit bit 1 bit 0 bit 8 bit 0 Stop
bit
Start
bit bit 8 Stop
bit
RC7/RX/DT (pin)
Load RSR
Read
RCIF
Word 1
RCREG
bit 8 = 1, Address Byte bit 8 = 0, Data Byte
Note: This timing diagram shows a data byte followed by an address byte. The data byte is not read into the RCREG (receive buffer)
because ADDEN was not updated and still = 0.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR, BOR
Value on
all other
Resets
0Bh, 8Bh,
10Bh,18Bh
INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u
0Ch PIR1 PSPIF
(1)
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
1Ah RCREG USART Receive Register 0000 0000 0000 0000
8Ch PIE1 PSPIE
(1)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented locations read as 0. Shaded cells are not used for asynchronous reception.
Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear.
PIC16F7X7
DS30498B-page 144 Preliminary 2003 Microchip Technology Inc.
11.3 USART Synchronous
Master Mode
In Synchronous Master mode, the data is transmitted in
a half-duplex manner (i.e., transmission and reception
do not occur at the same time). When transmitting data,
the reception is inhibited and vice versa. Synchronous
mode is entered by setting bit, SYNC (TXSTA<4>). In
addition, enable bit, SPEN (RCSTA<7>), is set in order
to configure the RC6/TX/CK and RC7/RX/DT I/O pins
to CK (clock) and DT (data) lines, respectively. The
Master mode indicates that the processor transmits the
master clock on the CK line. The Master mode is
entered by setting bit, CSRC (TXSTA<7>).
11.3.1 USART SYNCHRONOUS MASTER
TRANSMISSION
The USART transmitter block diagram is shown in
Figure 11-6. The heart of the transmitter is the Transmit
(Serial) Shift Register (TSR). The Shift register obtains
its data from the Read/Write Transmit Buffer register,
TXREG. The TXREG register is loaded with data in
software. The TSR register is not loaded until the last
bit has been transmitted from the previous load. As
soon as the last bit is transmitted, the TSR is loaded
with new data from the TXREG (if available). Once the
TXREG register transfers the data to the TSR register
(occurs in one TCYCLE), the TXREG is empty and inter-
rupt bit, TXIF (PIR1<4>), is set. The interrupt can be
enabled/disabled by setting/clearing enable bit, TXIE
(PIE1<4>). Flag bit TXIF will be set regardless of the
state of enable bit TXIE and cannot be cleared in soft-
ware. It will reset only when new data is loaded into the
TXREG register. While flag bit TXIF indicates the status
of the TXREG register, another bit, TRMT (TXSTA<1>),
shows the status of the TSR register. TRMT is a read-
only bit which is set when the TSR is empty. No
interrupt logic is tied to this bit so the user has to poll
this bit in order to determine if the TSR register is
empty. The TSR is not mapped in data memory so it is
not available to the user.
Transmission is enabled by setting enable bit, TXEN
(TXSTA<5>). The actual transmission will not occur
until the TXREG register has been loaded with data.
The first data bit will be shifted out on the next available
rising edge of the clock on the CK line. Data out is sta-
ble around the falling edge of the synchronous clock
(Figure 11-9). The transmission can also be started by
first loading the TXREG register and then setting bit
TXEN (Figure 11-10). This is advantageous when slow
baud rates are selected, since the BRG is kept in Reset
when bits TXEN, CREN and SREN are clear. Setting
enable bit TXEN will start the BRG, creating a shift
clock immediately. Normally, when transmission is first
started, the TSR register is empty so a transfer to the
TXREG register will result in an immediate transfer to
TSR, resulting in an empty TXREG. Back-to-back
transfers are possible.
Clearing enable bit TXEN during a transmission will
cause the transmission to be aborted and will reset the
transmitter. The DT and CK pins will revert to high-
impedance. If either bit CREN or bit SREN is set during
a transmission, the transmission is aborted and the DT
pin reverts to a high-impedance state (for a reception).
The CK pin will remain an output if bit CSRC is set
(internal clock). The transmitter logic, however, is not
reset, although it is disconnected from the pins. In order
to reset the transmitter, the user has to clear bit TXEN.
If bit SREN is set (to interrupt an on-going transmission
and receive a single word), then after the single word is
received, bit SREN will be cleared and the serial port
will revert back to transmitting since bit TXEN is still set.
The DT line will immediately switch from High-
Impedance Receive mode to transmit and start driving.
To avoid this, bit TXEN should be cleared.
In order to select 9-bit transmission, the TX9
(TXSTA<6>) bit should be set and the ninth bit should
be written to bit TX9D (TXSTA<0>). The ninth bit must
be written before writing the 8-bit data to the TXREG
register. This is because a data write to the TXREG can
result in an immediate transfer of the data to the TSR
register (if the TSR is empty). If the TSR was empty and
the TXREG was written before writing the new TX9D,
the present value of bit TX9D is loaded.
Steps to follow when setting up a Synchronous Master
Transmission:
1. Initialize the SPBRG register for the appropriate
baud rate (Section 11.1 USART Baud Rate
Generator (BRG)).
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
3. If interrupts are desired, set enable bit TXIE.
4. If 9-bit transmission is desired, set bit TX9.
5. Enable the transmission by setting bit TXEN.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit TX9D.
7. Start transmission by loading data to the TXREG
register.
8. If using interrupts, ensure that GIE and PEIE
(bits 7 and 6) of the INTCON register are set.
2003 Microchip Technology Inc. Preliminary DS30498B-page 145
PIC16F7X7
TABLE 11-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION
FIGURE 11-9: SYNCHRONOUS TRANSMISSION
FIGURE 11-10: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR, BOR
Value on
all other
Resets
0Bh, 8Bh,
10Bh,18Bh
INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u
0Ch PIR1 PSPIF
(1)
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN FERR OERR RX9D 0000 -00x 0000 -00x
19h TXREG USART Transmit Register 0000 0000 0000 0000
8Ch PIE1 PSPIE
(1)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented, read as 0. Shaded cells are not used for synchronous master transmission.
Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear.
bit 0 bit 1 bit 7
Word 1
Q1Q2 Q3Q4 Q1Q2Q3Q4Q1Q2Q3 Q4Q1Q2Q3 Q4Q1 Q2 Q3Q4 Q3Q4 Q1Q2 Q3Q4 Q1Q2Q3Q4 Q1Q2Q3 Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3 Q4
bit 2 bit 0 bit 1 bit 7
RC7/RX/DT
RC6/TX/CK
Write to
TXREG Reg
TXIF bit
(Interrupt Flag)
TXEN bit
1 1
Word 2
TRMT bit
Write Word 1
Write Word 2
Note: Sync Master mode, SPBRG = 0. Continuous transmission of two 8-bit words.
pin
pin
RC7/RX/DT pin
RC6/TX/CK pin
Write to
TXREG Reg
TXIF bit
TRMT bit
bit 0 bit 1 bit 2 bit 6 bit 7
TXEN bit
PIC16F7X7
DS30498B-page 146 Preliminary 2003 Microchip Technology Inc.
11.3.2 USART SYNCHRONOUS MASTER
RECEPTION
Once Synchronous mode is selected, reception is
enabled by setting either enable bit, SREN
(RCSTA<5>) or enable bit, CREN (RCSTA<4>). Data is
sampled on the RC7/RX/DT pin on the falling edge of
the clock. If enable bit SREN is set, then only a single
word is received. If enable bit CREN is set, the recep-
tion is continuous until CREN is cleared. If both bits are
set, CREN takes precedence. After clocking the last bit,
the received data in the Receive Shift Register (RSR)
is transferred to the RCREG register (if it is empty).
When the transfer is complete, interrupt flag bit, RCIF
(PIR1<5>), is set. The actual interrupt can be enabled/
disabled by setting/clearing enable bit, RCIE
(PIE1<5>). Flag bit RCIF is a read-only bit which is
reset by the hardware. In this case, it is reset when the
RCREG register has been read and is empty. The
RCREG is a double-buffered register (i.e., it is a two-
deep FIFO). It is possible for two bytes of data to be
received and transferred to the RCREG FIFO and a
third byte to begin shifting into the RSR register. On the
clocking of the last bit of the third byte, if the RCREG
register is still full, then Overrun Error bit, OERR
(RCSTA<1>), is set. The word in the RSR will be lost.
The RCREG register can be read twice to retrieve the
two bytes in the FIFO. Bit OERR has to be cleared in
software (by clearing bit CREN). If bit OERR is set,
transfers from the RSR to the RCREG are inhibited so
it is essential to clear bit OERR if it is set. The ninth
receive bit is buffered the same way as the receive
data. Reading the RCREG register will load bit RX9D
with a new value, therefore, it is essential for the user
to read the RCSTA register before reading RCREG, in
order not to lose the old RX9D information.
When setting up a Synchronous Master Reception:
1. Initialize the SPBRG register for the appropriate
baud rate (Section 11.1 USART Baud Rate
Generator (BRG)).
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
3. Ensure bits CREN and SREN are clear.
4. If interrupts are desired, then set enable bit
RCIE.
5. If 9-bit reception is desired, then set bit RX9.
6. If a single reception is required, set bit SREN.
For continuous reception, set bit CREN.
7. Interrupt flag bit RCIF will be set when reception
is complete and an interrupt will be generated if
enable bit RCIE was set.
8. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
9. Read the 8-bit received data by reading the
RCREG register.
10. If any error occurred, clear the error by clearing
bit CREN.
11. If using interrupts, ensure that GIE and PEIE
(bits 7 and 6) of the INTCON register are set.
TABLE 11-11: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR, BOR
Value on
all other
Resets
0Bh, 8Bh,
10Bh,18Bh
INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u
0Ch PIR1 PSPIF
(1)
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN FERR OERR RX9D 0000 -00x 0000 -00x
1Ah RCREG USART Receive Register 0000 0000 0000 0000
8Ch PIE1 PSPIE
(1)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented, read as 0. Shaded cells are not used for synchronous master reception.
Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear.
2003 Microchip Technology Inc. Preliminary DS30498B-page 147
PIC16F7X7
FIGURE 11-11: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
CREN bit
RC7/RX/DT pin
RC6/TX/CK pin
Write to
bit SREN
SREN bit
RCIF bit
(Interrupt)
Read
RXREG
Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRG = 0.
Q3Q4 Q1Q2Q3Q4 Q1 Q2Q3Q4 Q2 Q1Q2Q3 Q4Q1 Q2Q3 Q4 Q1Q2 Q3Q4Q1Q2Q3 Q4 Q1Q2 Q3Q4Q1 Q2Q3 Q4 Q1Q2Q3 Q4
0
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
0
Q1Q2 Q3Q4
PIC16F7X7
DS30498B-page 148 Preliminary 2003 Microchip Technology Inc.
11.4 USART Synchronous Slave Mode
Synchronous Slave mode differs from the Master mode
in the fact that the shift clock is supplied externally at
the RC6/TX/CK pin (instead of being supplied internally
in Master mode). This allows the device to transfer or
receive data while in Sleep mode. Slave mode is
entered by clearing bit, CSRC (TXSTA<7>).
11.4.1 USART SYNCHRONOUS SLAVE
TRANSMIT
The operation of the Synchronous Master and Slave
modes is identical, except in the case of the Sleep mode.
If two words are written to the TXREG and then the
SLEEP instruction is executed, the following will occur:
a) The first word will immediately transfer to the
TSR register and transmit.
b) The second word will remain in TXREG register.
c) Flag bit TXIF will not be set.
d) When the first word has been shifted out of TSR,
the TXREG register will transfer the second word
to the TSR and flag bit TXIF will now be set.
e) If enable bit TXIE is set, the interrupt will wake
the chip from Sleep and if the global interrupt is
enabled, the program will branch to the interrupt
vector (0004h).
When setting up a Synchronous Slave Transmission,
follow these steps:
1. Enable the synchronous slave serial port by
setting bits SYNC and SPEN and clearing bit
CSRC.
2. Clear bits CREN and SREN.
3. If interrupts are desired, then set enable bit
TXIE.
4. If 9-bit transmission is desired, then set bit TX9.
5. Enable the transmission by setting enable bit
TXEN.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit TX9D.
7. Start transmission by loading data to the TXREG
register.
8. If using interrupts, ensure that GIE and PEIE
(bits 7 and 6) of the INTCON register are set.
TABLE 11-12: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR, BOR
Value on
all other
Resets
0Bh, 8Bh,
10Bh,18Bh
INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u
0Ch PIR1 PSPIF
(1)
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
19h TXREG USART Transmit Register 0000 0000 0000 0000
8Ch PIE1 PSPIE
(1)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented, read as 0. Shaded cells are not used for synchronous slave transmission.
Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear.
2003 Microchip Technology Inc. Preliminary DS30498B-page 149
PIC16F7X7
11.4.2 USART SYNCHRONOUS SLAVE
RECEPTION
The operation of the Synchronous Master and Slave
modes is identical, except in the case of the Sleep
mode. Bit SREN is a don't care in Slave mode.
If receive is enabled by setting bit CREN prior to the
SLEEP instruction, then a word may be received during
Sleep. On completely receiving the word, the RSR reg-
ister will transfer the data to the RCREG register and if
enable bit RCIE bit is set, the interrupt generated will
wake the chip from Sleep. If the global interrupt is
enabled, the program will branch to the interrupt vector
(0004h).
When setting up a Synchronous Slave Reception,
follow these steps:
1. Enable the synchronous master serial port by
setting bits SYNC and SPEN and clearing bit
CSRC.
2. If interrupts are desired, set enable bit RCIE.
3. If 9-bit reception is desired, set bit RX9.
4. To enable reception, set enable bit CREN.
5. Flag bit RCIF will be set when reception is com-
plete and an interrupt will be generated if enable
bit RCIE was set.
6. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
7. Read the 8-bit received data by reading the
RCREG register.
8. If any error occurred, clear the error by clearing
bit CREN.
9. If using interrupts, ensure that GIE and PEIE
(bits 7 and 6) of the INTCON register are set.
TABLE 11-13: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR, BOR
Value on
all other
Resets
0Bh, 8Bh,
10Bh,18Bh
INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u
0Ch PIR1 PSPIF
(1)
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
1Ah RCREG USART Receive Register 0000 0000 0000 0000
8Ch PIE1 PSPIE
(1)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented, read as 0. Shaded cells are not used for synchronous slave reception.
Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices, always maintain these bits clear.
PIC16F7X7
DS30498B-page 150 Preliminary 2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc. Preliminary DS30498B-page 151
PIC16F7X7
12.0 ANALOG-TO-DIGITAL
CONVERTER (A/D) MODULE
The Analog-to-Digital (A/D) Converter module has 11
inputs for the PIC16F737 and PIC16F767 devices and
14 for the PIC16F747 AND PIC16F777 devices.
The A/D allows conversion of an analog input signal to
a corresponding 10-bit digital number.
A new feature for the A/D converter is the addition of
programmable acquisition time. This feature allows the
user to select a new channel for conversion and to set
the GO/DONE bit immediately. When the GO/DONE bit
is set, the selected channel is sampled for the pro-
grammed acquisition time before a conversion is actu-
ally started. This removes the firmware overhead
required to allow for an acquisition (sampling) period
(see Register 12-3 and Section 12.2 Selecting and
Configuring Automatic Acquisition Time).
The module has five registers:
A/D Result High Register (ADRESH)
A/D Result Low Register (ADRESL)
A/D Control Register 0 (ADCON0)
A/D Control Register 1 (ADCON1)
A/D Control Register 2 (ADCON2)
The ADCON0 register, shown in Register 12-1, controls
the operation of the A/D module and clock source. The
ADCON1 register, shown in Register 12-2, configures
the functions of the port pins, justification and voltage
reference sources. The ADCON2, shown in
Register 12-3, configures the programmed acquisition
time.
Additional information on using the A/D module can be
found in the PICmicro
+
VIN+
VIN-
Output
VIN
VIN+
Output
Output
VIN+
VIN-
Note 1: When reading the Port register, all pins
configured as analog inputs will read as a
0. Pins configured as digital inputs will
convert an analog input according to the
Schmitt Trigger input specification.
2: Analog levels on any pin defined as a dig-
ital input may cause the input buffer to
consume more current than is specified.
3: RA4 is an open collector I/O pin. When
used as an output, a pull-up resistor is
required.
PIC16F7X7
DS30498B-page 164 Preliminary 2003 Microchip Technology Inc.
FIGURE 13-3: COMPARATOR OUTPUT BLOCK DIAGRAM
13.6 Comparator Interrupts
The comparator interrupt flag is set whenever there is
a change in the output value of either comparator.
Software will need to maintain information about the
status of the output bits, as read from CMCON<7:6>, to
determine the actual change that occurred. The CMIF
bit (PIR registers) is the Comparator Interrupt Flag. The
CMIF bit must be reset by clearing it (0). Since it is
also possible to write a 1 to this register, a simulated
interrupt may be initiated.
The CMIE bit (PIE registers) and the PEIE bit (INTCON
register) must be set to enable the interrupt. In addition,
the GIE bit must also be set. If any of these bits are
clear, the interrupt is not enabled, though the CMIF bit
will still be set if an interrupt condition occurs.
The user, in the Interrupt Service Routine, can clear the
interrupt in the following manner:
a) Any read or write of CMCON will end the
mismatch condition.
b) Clear flag bit CMIF.
A mismatch condition will continue to set flag bit CMIF.
Reading CMCON will end the mismatch condition and
allow flag bit CMIF to be cleared.
D Q
EN
To RA4 or
RA5 pin
Bus
Data
Read CMCON
Set
MULTIPLEX
CMIF
bit
- +
D Q
EN
CL
Port pins
Read CMCON
Reset
From
Other
Comparator
CxINV
Note: If a change in the CMCON register
(C1OUT or C2OUT) should occur when a
read operation is being executed (start of
the Q2 cycle), then the CMIF (PIR
registers) interrupt flag may not get set.
2003 Microchip Technology Inc. Preliminary DS30498B-page 165
PIC16F7X7
13.7 Comparator Operation
During Sleep
When a comparator is active and the device is placed
in Sleep mode, the comparator remains active and the
interrupt is functional if enabled. This interrupt will
wake-up the device from Sleep mode when enabled.
While the comparator is powered up, higher Sleep
currents than shown in the power-down current
specification will occur. Each operational comparator
will consume additional current as shown in the com-
parator specifications. To minimize power consumption
while in Sleep mode, turn off the comparators
(CM<2:0> = 111) before entering Sleep. If the device
wakes up from Sleep, the contents of the CMCON
register are not affected.
13.8 Effects of a Reset
A device Reset forces the CMCON register to its Reset
state, causing the comparator module to be in the
Comparator Off mode, CM<2:0> = 111. This ensures
compatibility to the PIC16F87X devices.
13.9 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 13-4. Since the analog pins are connected to a
digital output, they have reverse biased diodes to VDD
and VSS. The analog input, therefore, must be between
VSS and VDD. If the input voltage deviates from this
range by more than 0.6V in either direction, one of the
diodes is forward biased and a latch-up condition may
occur. A maximum source impedance of 10 k is
recommended for the analog sources. Any external
component connected to an analog input pin, such as
a capacitor or a Zener diode, should have very little
leakage current.
FIGURE 13-4: ANALOG INPUT MODEL
TABLE 13-1: REGISTERS ASSOCIATED WITH COMPARATOR MODULE
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR
Value on
all other
Resets
9Ch CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 0000 0111
9Dh CVRCON CVREN CVROE CVRR CVR3 CVR2 CVR1 CVR0 000- 0000 000- 0000
0Bh, 8Bh,
10Bh,18Bh
INTCON GIE PEIE TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
0Dh PIR2 OSFIF CMIF LVDIF BCLIF CCP3IF CCP2IF 000- 0-00 000- 0-00
8Dh PIE2 OSFIE CMIE LVDIE BCLIE CCP3IE CCP2IE 000- 0-00 000- 0-00
05h PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xx0x 0000 uu0u 0000
85h TRISA TRISA7 TRISA6 PORTA Data Direction Register 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, - = unimplemented, read as 0. Shaded cells are unused by the comparator module.
VA
RS < 10K
AIN
CPIN
5 pF
VDD
VT = 0.6V
VT = 0.6V
RIC
ILEAKAGE
500 nA
VSS
Legend: CPIN = Input Capacitance
VT = Threshold Voltage
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS = Source Impedance
VA = Analog Voltage
PIC16F7X7
DS30498B-page 166 Preliminary 2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc. Preliminary DS30498B-page 167
PIC16F7X7
14.0 COMPARATOR VOLTAGE
REFERENCE MODULE
The comparator voltage reference generator is a 16-tap
resistor ladder network that provides a fixed voltage
reference when the comparators are in mode 110. A
programmable register controls the function of the
reference generator. Register 14-1 lists the bit functions
of the CVRCON register.
As shown in Figure 14-1, the resistor ladder is seg-
mented to provide two ranges of CVREF values and has
a power-down function to conserve power when the
reference is not being used. The comparator reference
supply voltage (also referred to as CVRSRC) comes
directly from VDD. It should be noted, however, that the
voltage at the top of the ladder is CVRSRC VSAT,
where VSAT is the saturation voltage of the power
switch transistor. This reference will only be as
accurate as the values of CVRSRC and VSAT.
The output of the reference generator may be
connected to the RA2/AN2/VREF-/CVREF pin. This can
be used as a simple D/A function by the user if a very
high-impedance load is used. The primary purpose of
this function is to provide a test path for testing the
reference generator function.
REGISTER 14-1: CVRCON CONTROL REGISTER (ADDRESS 9Dh)
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
CVREN CVROE CVRR CVR3 CVR2 CVR1 CVR0
bit 7 bit 0
bit 7 CVREN: Comparator Voltage Reference Enable bit
1 = CVREF circuit powered on
0 = CVREF circuit powered down
bit 6 CVROE: Comparator VREF Output Enable bit
1 = CVREF voltage level is output on RA2/AN2/VREF-/CVREF pin
0 = CVREF voltage level is disconnected from RA2/AN2/VREF-/CVREF pin
bit 5 CVRR: Comparator VREF Range Selection bit
1 = 0 to 0.75 CVRSRC, with CVRSRC/24 step size
0 = 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size
bit 4 Unimplemented: Read as 0
bit 3-0 CVR3:CVR0: Comparator VREF Value Selection bits 0 VR3:VR0 15
When CVRR = 1:
CVREF = (CVR<3:0>/24) (CVRSRC)
When CVRR = 0:
CVREF = 1/4 (CVRSRC) + (CVR3:CVR0/32) (CVRSRC)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
PIC16F7X7
DS30498B-page 168 Preliminary 2003 Microchip Technology Inc.
FIGURE 14-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
TABLE 14-1: REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE
CVRR
8R
CVR3
CVR0
16:1 Analog MUX
8R R R R R
CVREN
CVREF
16 Stages
Input to
Comparator
CVROE
RA2/AN2/VREF-/CVREF
VDD
CVR2
CVR1
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR
Value on
all other
Resets
9Dh CVRCON CVREN CVROE CVRR CVR3 CVR2 CVR1 CVR0 000- 0000 000- 0000
9Ch CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 0000 0111
Legend: x = unknown, u = unchanged, - = unimplemented, read as 0.
Shaded cells are not used with the comparator voltage reference.
2003 Microchip Technology Inc. Preliminary DS30498B-page 169
PIC16F7X7
15.0 SPECIAL FEATURES OF THE
CPU
These devices have a host of features intended to max-
imize system reliability, minimize cost through elimina-
tion of external components, provide power saving
operating modes and offer code protection:
Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
- Low-Voltage Detect (LVD)
Interrupts
Watchdog Timer (WDT)
Two-Speed Start-up
Fail-Safe Clock Monitor
Sleep
Code Protection
ID Locations
In-Circuit Serial Programming
There are two timers that offer necessary delays on
power-up. One is the Oscillator Start-up Timer (OST),
intended to keep the chip in Reset until the crystal oscil-
lator is stable. The other is the Power-up Timer
(PWRT), which provides a fixed delay of 72 ms (nomi-
nal) on power-up only. It is designed to keep the part in
Reset while the power supply stabilizes and is enabled
or disabled using a configuration bit. With these two
timers on-chip, most applications need no external
Reset circuitry.
Sleep mode is designed to offer a very low current
power-down mode. The user can wake-up from Sleep
through external Reset, Watchdog Timer Wake-up or
through an interrupt.
Several oscillator options are also made available to
allow the part to fit the application. The RC oscillator
option saves system cost while the LP crystal option
saves power. Configuration bits are used to select the
desired oscillator mode.
Additional information on special features is available
in the PICmicro
Mid-Range
MCU Family Reference Manual (DS33023).
For byte-oriented instructions, f represents a file
register designator and d represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The destination designator specifies where the result of
the operation is to be placed. If d is zero, the result is
placed in the W register. If d is one, the result is placed
in the file register specified in the instruction.
For bit-oriented instructions, b represents a bit field
designator which selects the bit affected by the opera-
tion, while f represents the address of the file in which
the bit is located.
For literal and control operations, k represents an
eight or eleven-bit constant or literal value
One instruction cycle consists of four oscillator periods;
for an oscillator frequency of 4 MHz, this gives a normal
instruction execution time of 1 s. All instructions are
executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
changed as a result of an instruction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as a NOP.
All instruction examples use the format 0xhh to
represent a hexadecimal number, where h signifies a
hexadecimal digit.
16.1 Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (R-M-W)
operation. The register is read, the data is modified,
and the result is stored according to either the instruc-
tion, or the destination designator d. A read operation
is performed on a register even if the instruction writes
to that register.
For example, a CLRF PORTB instruction will read
PORTB, clear all the data bits, then write the result
back to PORTB. This example would have the unin-
tended result that the condition that sets the RBIF flag
would be cleared for pins configured as inputs and
using the PORTB interrupt-on-change feature.
TABLE 16-1: OPCODE FIELD
DESCRIPTIONS
FIGURE 16-1: GENERAL FORMAT FOR
INSTRUCTIONS
Note: To maintain upward compatibility with
future PIC16F7X7 products, do not use
the OPTION and TRIS instructions.
Field Description
f Register file address (0x00 to 0x7F)
W Working register (accumulator)
b Bit address within an 8-bit file register
k Literal field, constant data or label
x Dont care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
d Destination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
PC Program Counter
TO Time-out bit
PD Power-down bit
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC16F7X7
DS30498B-page 194 Preliminary 2003 Microchip Technology Inc.
TABLE 16-2: PIC16F7X7 INSTRUCTION SET
Mnemonic,
Operands
Description Cycles
14-Bit Opcode
Status
Affected
Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
xxxx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C, DC, Z
Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
Z
1, 2
1, 2
2
1, 2
1, 2
1, 2, 3
1, 2
1, 2, 3
1, 2
1, 2
1,2
1, 2
1, 2
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1, 2
1, 2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
k
k
k
-
k
k
k
-
k
-
-
k
k
Add literal and W
AND literal with W
Call subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move literal to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into Standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C, DC, Z
Z
TO, PD
Z
TO, PD
C, DC, Z
Z
Note 1: When an I/O register is modified as a function of itself ( e.g., MOVF PORTB, 1), the value used will be that value
present on the pins themselves. For example, if the data latch is 1 for a pin configured as input and is driven low by an
external device, the data will be written back with a 0.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if
assigned to the Timer0 module.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
Note: Additional information on the mid-range instruction set is available in the PICmicro
Mid-Range MCU
Family Reference Manual (DS33023).
2003 Microchip Technology Inc. Preliminary DS30498B-page 195
PIC16F7X7
16.2 Instruction Descriptions
ADDLW Add Literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register
are added to the eight-bit literal k
and the result is placed in the W
register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Description: Add the contents of the W register
with register f. If d is 0, the
result is stored in the W register. If
d is 1, the result is stored back
in register f.
ANDLW AND Literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
ANDed with the eight-bit literal
k. The result is placed in the W
register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Description: AND the W register with register
f. If d is 0, the result is stored in
the W register. If d is 1, the
result is stored back in register f.
BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Affected: None
Description: Bit b in register f is cleared.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Affected: None
Description: Bit b in register f is set.
BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Description: If bit b in register f is 0, the next
instruction is executed.
If bit b is 1, then the next
instruction is discarded and a NOP
is executed instead, making this a
2 TCY instruction.
BTFSC Bit Test, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Affected: None
Description: If bit b in register f is 1, the next
instruction is executed.
If bit b in register f is 0, the next
instruction is discarded and a NOP
is executed instead, making this a
2 TCY instruction.
PIC16F7X7
DS30498B-page 196 Preliminary 2003 Microchip Technology Inc.
CALL Call Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<4:3>) PC<12:11>
Status Affected: None
Description: Call Subroutine. First, return
address (PC+1) is pushed onto
the stack. The eleven-bit
immediate address is loaded into
PC bits<10:0>. The upper bits of
the PC are loaded from PCLATH.
CALL is a two-cycle instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Description: The contents of register f are
cleared and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z)
is set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Affected: TO, PD
Description: CLRWDT instruction resets the
Watchdog Timer. It also resets the
prescaler of the WDT. Status bits,
TO and PD, are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Description: The contents of register f are
complemented. If d is 0, the
result is stored in W. If d is 1, the
result is stored back in register f.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Affected: Z
Description: Decrement register f. If d is 0,
the result is stored in the W
register. If d is 1, the result is
stored back in register f.
2003 Microchip Technology Inc. Preliminary DS30498B-page 197
PIC16F7X7
DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register f are
decremented. If d is 0, the result
is placed in the W register. If d is
1, the result is placed back in
register f.
If the result is 1, the next
instruction is executed. If the
result is 0, then a NOP is
executed instead, making it a
2 TCY instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<4:3> PC<12:11>
Status Affected: None
Description: GOTO is an unconditional branch.
The eleven-bit immediate value is
loaded into PC bits<10:0>. The
upper bits of PC are loaded from
PCLATH<4:3>. GOTO is a
two-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register f are
incremented. If d is 0, the result
is placed in the W register. If d is
1, the result is placed back in
register f.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Affected: None
Description: The contents of register f are
incremented. If d is 0, the result
is placed in the W register. If d is
1, the result is placed back in
register f.
If the result is 1, the next
instruction is executed. If the
result is 0, a NOP is executed
instead, making it a 2 TCY
instruction.
IORLW Inclusive OR Literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Affected: Z
Description: The contents of the W register are
ORed with the eight-bit literal k.
The result is placed in the W
register.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Affected: Z
Description: Inclusive OR the W register with
register f. If d is 0, the result is
placed in the W register. If d is
1, the result is placed back in
register f.
PIC16F7X7
DS30498B-page 198 Preliminary 2003 Microchip Technology Inc.
MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Description: The contents of register f are
moved to a destination dependant
upon the status of d. If d = 0,
the destination is W register. If
d = 1, the destination is file register
f itself. d = 1 is useful to test a file
register since status flag Z is
affected.
MOVLW Move Literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Description: The eight-bit literal k is loaded
into W register. The dont cares
will assemble as 0s.
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Affected: None
Description: Move data from W register to
register f.
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Affected: None
Description: No operation.
RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
RETLW Return with Literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Affected: None
Description: The W register is loaded with the
eight-bit literal k. The program
counter is loaded from the top of
the stack (the return address).
This is a two-cycle instruction.
2003 Microchip Technology Inc. Preliminary DS30498B-page 199
PIC16F7X7
RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register f are
rotated one bit to the left through the
Carry flag. If d is 0, the result is
placed in the W register. If d is 1,
the result is stored back in register f.
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Affected: None
Description: Return from subroutine. The stack
is POPed and the top of the stack
(TOS) is loaded into the program
counter. This is a two-cycle
instruction.
RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register f are
rotated one bit to the right through
the Carry flag. If d is 0, the
result is placed in the W register.
If d is 1, the result is placed
back in register f.
Register f C
Register f C
SLEEP
Syntax: [ label ] SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Affected: TO, PD
Description: The power-down status bit, PD,
is cleared. Time-out status bit,
TO, is set. Watchdog Timer and
its prescaler are cleared.
The processor is put into Sleep
mode with the oscillator stopped.
SUBLW Subtract W from Literal
Syntax: [ label ] SUBLW k
Operands: 0 k 255
Operation: k - (W) (W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2s
complement method) from the
eight-bit literal k. The result is
placed in the W register.
SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) (destination)
Status Affected: C, DC, Z
Description: Subtract (2s complement method)
W register from register f. If d is
0, the result is stored in the W
register. If d is 1, the result is
stored back in register f.
PIC16F7X7
DS30498B-page 200 Preliminary 2003 Microchip Technology Inc.
SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of
register f are exchanged. If d is
0, the result is placed in the W
register. If d is 1, the result is
placed in register f.
XORLW Exclusive OR Literal with W
Syntax: [ label ] XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k (W)
Status Affected: Z
Description: The contents of the W register
are XORed with the eight-bit
literal k. The result is placed in
the W register.
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) (destination)
Status Affected: Z
Description: Exclusive OR the contents of the
W register with register f. If d is
0, the result is stored in the W
register. If d is 1, the result is
stored back in register f.
2003 Microchip Technology Inc. Preliminary DS30498B-page201
PIC16F7X7
17.0 DEVELOPMENT SUPPORT
The PICmicro
IDE Software
Assemblers/Compilers/Linkers
- MPASM
TM
Assembler
- MPLAB C17 and MPLAB C18 C Compilers
- MPLINK
TM
Object Linker/
MPLIB
TM
Object Librarian
- MPLAB C30 C Compiler
- MPLAB ASM30 Assembler/Linker/Library
Simulators
- MPLAB SIM Software Simulator
- MPLAB dsPIC30 Software Simulator
Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB ICE 4000 In-Circuit Emulator
In-Circuit Debugger
- MPLAB ICD 2
Device Programmers
- PRO MATE
- PICDEM MSC
- microID
- CAN
- PowerSmart
- Analog
17.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit micro-
controller market. The MPLAB IDE is a Windows
standard HEX
files, MAP files to detail memory usage and symbol ref-
erence, absolute LST files that contain source lines and
generated machine code and COFF files for
debugging.
The MPASM assembler features include:
Integration into MPLAB IDE projects
User defined macros to streamline assembly code
Conditional assembly for multi-purpose source
files
Directives that allow complete control over the
assembly process
PIC16F7X7
DS30498B-page 202 Preliminary 2003 Microchip Technology Inc.
17.3 MPLAB C17 and MPLAB C18
C Compilers
The MPLAB C17 and MPLAB C18 Code Development
Systems are complete ANSI C compilers for
Microchips PIC17CXXX and PIC18CXXX family of
microcontrollers. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use not found with other compilers.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
17.4 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK object linker combines relocatable
objects created by the MPASM assembler and the
MPLAB C17 and MPLAB C18 C compilers. It can link
relocatable objects from precompiled libraries, using
directives from a linker script.
The MPLIB object librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
17.5 MPLAB C30 C Compiler
The MPLAB C30 C compiler is a full-featured, ANSI
compliant, optimizing compiler that translates standard
ANSI C programs into dsPIC30F assembly language
source. The compiler also supports many command-
line options and language extensions to take full
advantage of the dsPIC30F device hardware capabili-
ties and afford fine control of the compiler code
generator.
MPLAB C30 is distributed with a complete ANSI C
standard library. All library functions have been vali-
dated and conform to the ANSI C library standard. The
library includes functions for string manipulation,
dynamic memory allocation, data conversion, time-
keeping and math functions (trigonometric, exponential
and hyperbolic). The compiler provides symbolic
information for high-level source debugging with the
MPLAB IDE.
17.6 MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB ASM30 assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
17.7 MPLAB SIM Software Simulator
The MPLAB SIM software simulator allows code devel-
opment in a PC hosted environment by simulating the
PICmicro series microcontrollers on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a file, or user defined key press, to any pin. The execu-
tion can be performed in Single-Step, Execute Until
Break or Trace mode.
The MPLAB SIM simulator fully supports symbolic
debugging using the MPLAB C17 and MPLAB C18
C Compilers, as well as the MPASM assembler. The
software simulator offers the flexibility to develop and
debug code outside of the laboratory environment,
making it an excellent, economical software
development tool.
17.8 MPLAB SIM30 Software Simulator
The MPLAB SIM30 software simulator allows code
development in a PC hosted environment by simulating
the dsPIC30F series microcontrollers on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a file, or user defined key press, to any of the pins.
The MPLAB SIM30 simulator fully supports symbolic
debugging using the MPLAB C30 C Compiler and
MPLAB ASM30 assembler. The simulator runs in either
a Command Line mode for automated tasks, or from
MPLAB IDE. This high-speed simulator is designed to
debug, analyze and optimize time intensive DSP
routines.
2003 Microchip Technology Inc. Preliminary DS30498B-page203
PIC16F7X7
17.9 MPLAB ICE 2000
High-Performance Universal
In-Circuit Emulator
The MPLAB ICE 2000 universal in-circuit emulator is
intended to provide the product development engineer
with a complete microcontroller design tool set for
PICmicro microcontrollers. Software control of the
MPLAB ICE 2000 in-circuit emulator is advanced by
the MPLAB Integrated Development Environment,
which allows editing, building, downloading and source
debugging from a single environment.
The MPLAB ICE 2000 is a full-featured emulator sys-
tem with enhanced trace, trigger and data monitoring
features. Interchangeable processor modules allow the
system to be easily reconfigured for emulation of differ-
ent processors. The universal architecture of the
MPLAB ICE in-circuit emulator allows expansion to
support new PICmicro microcontrollers.
The MPLAB ICE 2000 in-circuit emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft
IDE (Inte-
grated Development Environment) software, software
and hardware Tips 'n Tricks for 8-pin Flash PIC
development kit
microID development and rfLab
TM
development
software
SEEVAL
5.5
5.5
5.5
V
V
V
A/D in use, -40C to +85C
A/D in use, 0C to +85C
A/D not used, -40C to +85C
D001
D001A
PIC16F7X7 4.0
VBOR*
5.5
5.5
V
V
All configurations
BOR enabled (Note 7)
D002* VDR RAM Data Retention
Voltage (Note 1)
1.5 V
D003 VPOR VDD Start Voltage to
ensure internal Power-on
Reset signal
VSS V See section on Power-on Reset for details
D004* SVDD VDD Rise Rate to ensure
internal Power-on Reset signal
0.05 V/ms See section on Power-on Reset for details
VBOR Brown-out Reset Voltage
PIC16LF7X7 Industrial Low Voltage
D005 BORV1:BORV0 = 11 NA NA V Reserved
BORV1:BORV0 = 10 2.50 2.72 2.94 V
BORV1:BORV0 = 01 3.88 4.22 4.56 V
BORV1:BORV0 = 00 4.18 4.54 4.90 V
D005 PIC16F7X7 Industrial
BORV1:BORV0 = 1x NA NA V Not in operating voltage range of device
BORV1:BORV0 = 01 3.88 4.22 4.56 V
BORV1:BORV0 = 00 4.18 4.54 4.90 V
Legend: Shading of rows is to assist in readability of of the table.
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from-rail to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be
estimated by the formula Ir = VDD/2REXT (mA) with REXT in k.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from
characterization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.
PIC16F7X7
DS30498B-page 210 Preliminary 2003 Microchip Technology Inc.
18.2 DC Characteristics: Power-down and Supply Current
PIC16F7X7 (Industrial)
PIC16LF7X7 (Industrial)
PIC16LF7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
PIC16F7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
Param
No.
Device Typ Max Units Conditions
Power-down Current (IPD)
(1)
PIC16LF7X7 0.1 0.4 A -40C
VDD = 2.0V 0.1 0.4 A +25C
0.4 1.5 A +85C
PIC16LF7X7 0.3 0.5 A -40C
VDD = 3.0V 0.3 0.5 A +25C
0.7 1.7 A +85C
All devices 0.6 1.0 A -40C
VDD = 5.0V 0.6 1.0 A +25C
1.2 5.0 A +85C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
2003 Microchip Technology Inc. Preliminary DS30498B-page 211
PIC16F7X7
Supply Current (IDD)
(2,3)
PIC16LF7X7 9 20 A -40C
VDD = 2.0V
FOSC = 32 kHZ
(LP Oscillator)
7 15 A +25C
7 15 A +85C
PIC16LF7X7 16 30 A -40C
VDD = 3.0V 14 25 A +25C
14 25 A +85C
All devices 32 40 A -40C
VDD = 5.0V 26 35 A +25C
26 35 A +85C
PIC16LF7X7 72 95 A -40C
VDD = 2.0V
FOSC = 1 MHZ
(RC Oscillator)
(3)
76 90 A +25C
76 90 A +85C
PIC16LF7X7 138 175 A -40C
VDD = 3.0V 136 170 A +25C
136 170 A +85C
All devices 310 380 A -40C
VDD = 5.0V 290 360 A +25C
280 360 A +85C
PIC16LF7X7 270 315 A -40C
VDD = 2.0V
FOSC = 4 MHz
(RC Oscillator)
(3)
280 310 A +25C
285 310 A +85C
PIC16LF7X7 460 610 A -40C
VDD = 3.0V 450 600 A +25C
450 600 A +85C
All devices 900 1060 A -40C
VDD = 5.0V 890 1050 A +25C
890 1050 A +85C
18.2 DC Characteristics: Power-down and Supply Current
PIC16F7X7 (Industrial)
PIC16LF7X7 (Industrial) (Continued)
PIC16LF7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
PIC16F7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
PIC16F7X7
DS30498B-page 212 Preliminary 2003 Microchip Technology Inc.
Supply Current (IDD)
(2,3)
All devices 1.8 2.3 mA -40C
VDD = 4.0V
FOSC = 20 MHZ
(HS Oscillator)
1.6 2.2 mA +25C
1.3 2.2 mA +85C
All devices 3.0 4.2 mA -40C
VDD = 5.0V 2.5 4.0 mA +25C
2.5 4.0 mA +85C
18.2 DC Characteristics: Power-down and Supply Current
PIC16F7X7 (Industrial)
PIC16LF7X7 (Industrial) (Continued)
PIC16LF7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
PIC16F7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
2003 Microchip Technology Inc. Preliminary DS30498B-page 213
PIC16F7X7
Supply Current (IDD)
(2,3)
PIC16LF7X7 8 20 A -40C
VDD = 2.0V
FOSC = 31.25 kHz
(RC_RUN mode,
Internal RC Oscillator)
7 15 A +25C
7 15 A +85C
PIC16LF7X7 16 30 A -40C
VDD = 3.0V 14 25 A +25C
14 25 A +85C
All devices 32 40 A -40C
VDD = 5.0V 29 35 A +25C
29 35 A +85C
PIC16LF7X7 132 160 A -40C
VDD = 2.0V
FOSC = 1 MHz
(RC_RUN mode,
Internal RC Oscillator)
126 155 A +25C
126 155 A +85C
PIC16LF7X7 260 310 A -40C
VDD = 3.0V 230 300 A +25C
230 300 A +85C
All devices 560 690 A -40C
VDD = 5.0V 500 650 A +25C
500 650 A +85C
PIC16LF7X7 310 420 A -40C
VDD = 2.0V
FOSC = 4 MHz
(RC_RUN mode,
Internal RC Oscillator)
300 410 A +25C
300 410 A +85C
PIC16LF7X7 550 650 A -40C
VDD = 3.0V 530 620 A +25C
530 620 A +85C
All devices 1.2 1.5 mA -40C
VDD = 5.0V 1.1 1.4 mA +25C
1.1 1.4 mA +85C
18.2 DC Characteristics: Power-down and Supply Current
PIC16F7X7 (Industrial)
PIC16LF7X7 (Industrial) (Continued)
PIC16LF7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
PIC16F7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
PIC16F7X7
DS30498B-page 214 Preliminary 2003 Microchip Technology Inc.
Supply Current (IDD)
(2,3)
PIC16LF7X7 .950 1.3 mA -40C
VDD = 3.0V
FOSC = 8 MHz
(RC_RUN mode,
Internal RC Oscillator)
.930 1.2 mA +25C
.930 1.2 mA +85C
All devices 1.8 3.0 mA -40C
VDD = 5.0V 1.7 2.8 mA +25C
1.7 2.8 mA +85C
PIC16LF7X7 9 13 A -10C
VDD = 2.0V
FOSC = 32 kHz
(SEC_RUN mode,
Timer1 as Clock)
9 14 A +25C
11 16 A +70C
PIC16LF7X7 12 34 A -10C
VDD = 3.0V 12 31 A +25C
14 28 A +70C
All devices 20 72 A -10C
VDD = 5.0V 20 65 A +25C
25 59 A +70C
18.2 DC Characteristics: Power-down and Supply Current
PIC16F7X7 (Industrial)
PIC16LF7X7 (Industrial) (Continued)
PIC16LF7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
PIC16F7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
2003 Microchip Technology Inc. Preliminary DS30498B-page 215
PIC16F7X7
Module Differential Currents (IWDT, IBOR, ILVD, IOSCB, IAD)
D022
(IWDT)
Watchdog Timer 1.5 3.8 A -40C
VDD = 2.0V 2.2 3.8 A +25C
2.7 4.0 A +85C
2.3 4.6 A -40C
VDD = 3.0V 2.7 4.6 A +25C
3.1 4.8 A +85C
3.0 10.0 A -40C
VDD = 5.0V 3.3 10.0 A +25C
3.9 13.0 A +85C
D022A
(IBOR)
Brown-out Reset 17 35 A -40C to +85C VDD = 3.0V
47 45 A -40C to +85C VDD = 5.0V
0 0 A -40C to +85C VDD = 2.0V
VDD = 3.0V
VDD = 5.0V
BOREN:BORSEN = 10
in Sleep mode
D022B
(ILVD)
Low-Voltage Detect 14 25 A -40C to +85C VDD = 2.0V
18 35 A -40C to +85C VDD = 3.0V
21 45 A -40C to +85C VDD = 5.0V
D025
(IOSCB)
Timer1 Oscillator 1.7 2.3 A -40C
VDD = 2.0V
32 kHz on Timer1
1.8 2.3 A +25C
2.0 2.3 A +85C
2.2 3.8 A -40C
VDD = 3.0V 2.6 3.8 A +25C
2.9 3.8 A +85C
3.0 6.0 A -40C
VDD = 5.0V 3.2 6.0 A +25C
3.4 7.0 A +85C
D026
(IAD)
A/D Converter 0.001 2.0 A -40C to +85C VDD = 2.0V
A/D on, not converting 0.001 2.0 A -40C to +85C VDD = 3.0V
0.003 2.0 A -40C to +85C VDD = 5.0V
18.2 DC Characteristics: Power-down and Supply Current
PIC16F7X7 (Industrial)
PIC16LF7X7 (Industrial) (Continued)
PIC16LF7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
PIC16F7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
PIC16F7X7
DS30498B-page 216 Preliminary 2003 Microchip Technology Inc.
18.3 DC Characteristics: Internal RC Accuracy
PIC16F7X7 (Industrial, Extended)
PIC16LF7X7 (Industrial)
PIC16LF7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
PIC16F7X7
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
Param
No.
Device Min Typ Max Units Conditions
INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz
(1)
PIC16LF7X7 -2 1 2 % +25C VDD = 2.7V-3.3V
-5 5 % -10C to +85C VDD = 2.7V-3.3V
-10 10 % -40C to +85C VDD = 2.7V-3.3V
PIC16F7X7 -2 1 2 % +25C VDD = 4.5V-5.5V
-5 5 % -10C to +85C VDD = 4.5V-5.5V
-10 10 % -40C to +85C VDD = 4.5V-5.5V
INTRC Accuracy @ Freq = 31 kHz
(2)
PIC16LF7X7 26.562 35.938 kHz -40C to +85C VDD = 2.7V-3.3V
PIC16F7X7 26.562 35.938 kHz -40C to +85C VDD = 4.5V-5.5V
Legend: Shading of rows is to assist in readability of the table.
Note 1: Frequency calibrated at 25C. OSCTUNE register can be used to compensate for temperature drift.
2: INTRC is used to calibrate INTOSC.
2003 Microchip Technology Inc. Preliminary DS30498B-page 217
PIC16F7X7
18.4 DC Characteristics: PIC16F737/747/767/777 (Industrial, Extended)
PIC16LF737/747/767/777 (Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
-40C TA +125C for extended
Operating voltage VDD range as described in
Section 18.1 DC Characteristics.
Param
No.
Sym Characteristic Min Typ Max Units Conditions
VIL Input Low Voltage
I/O ports:
D030 with TTL buffer VSS 0.15 VDD V For entire VDD range
D030A VSS 0.8V V 4.5V VDD 5.5V
D031 with Schmitt Trigger buffer VSS 0.2 VDD V
D032 MCLR, OSC1 (in RC mode) VSS 0.2 VDD V (Note 1)
D033 OSC1 (in XT and LP mode) VSS 0.3V V
OSC1 (in HS mode) VSS 0.3 VDD V
VIH Input High Voltage
I/O ports:
D040 with TTL buffer 2.0 VDD V 4.5V VDD 5.5V
D040A 0.25 VDD + 0.8 V VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8 VDD VDD V For entire VDD range
D042 MCLR 0.8 VDD VDD V
D042A OSC1 (in XT and LP mode) 1.6V VDD V
OSC1 (in HS mode) 0.7 VDD VDD V
D043 OSC1 (in RC mode) 0.9 VDD VDD V (Note 1)
D070 IPURB PORTB Weak Pull-up Current 50 250 400 A VDD = 5V, VPIN = VSS
IIL Input Leakage Current (Notes 2, 3)
D060 I/O ports 1 A VSS VPIN VDD, pin at
high-impedance
D061 MCLR, RE3/T0CKI 5 A VSS VPIN VDD
D063 OSC1 5 A VSS VPIN VDD, XT, HS
and LP osc configuration
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the
PIC16F7X7 be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
PIC16F7X7
DS30498B-page 218 Preliminary 2003 Microchip Technology Inc.
VOL Output Low Voltage
D080 I/O ports 0.6 V IOL = 8.5 mA, VDD = 4.5V,
-40C to +125C
D083 OSC2/CLKO (RC osc config)
0.6
0.6
V
V
IOL = 1.6 mA, VDD = 4.5V,
-40C to +125C
IOL = 1.2 mA, VDD = 4.5V,
-40C to +125C
VOH Output High Voltage
D090 I/O ports (Note 3) VDD 0.7 V IOH = -3.0 mA, VDD = 4.5V,
-40C to +125C
D092 OSC2/CLKO (RC osc config) VDD 0.7
VDD 0.7
V
V
IOH = -1.3 mA, VDD = 4.5V,
-40C to +125C
IOH = -1.0 mA, VDD = 4.5V,
-40C to +125C
D150* VOD Open-Drain High Voltage 12 V RA4 pin
Capacitive Loading Specs on Output Pins
D100 COSC2 OSC2 pin 15 pF In XT, HS and LP modes
when external clock is used
to drive OSC1
D101 CIO All I/O pins and OSC2
(in RC mode)
50 pF
D102 CB SCL, SDA in I
2
C mode 400 pF
Program Flash Memory
D130 EP Endurance 100 1000 E/W 25C at 5V
D131 VPR VDD for Read 2.0 5.5 V
18.4 DC Characteristics: PIC16F737/747/767/777 (Industrial, Extended)
PIC16LF737/747/767/777 (Industrial) (Continued)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
-40C TA +125C for extended
Operating voltage VDD range as described in
Section 18.1 DC Characteristics.
Param
No.
Sym Characteristic Min Typ Max Units Conditions
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the
PIC16F7X7 be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
2003 Microchip Technology Inc. Preliminary DS30498B-page 219
PIC16F7X7
TABLE 18-1: COMPARATOR SPECIFICATIONS
TABLE 18-2: VOLTAGE REFERENCE SPECIFICATIONS
Operating Conditions: 3.0V < VDD < 5.5V, -40C < TA < +85C (unless otherwise stated).
Param
No.
Sym Characteristics Min Typ Max Units Comments
D300 VIOFF Input Offset Voltage 5.0 10 mV
D301 VICM Input Common Mode Voltage* 0 - VDD 1.5 V
D302 CMRR Common Mode Rejection Ratio* 55 - dB
300
300A
TRESP Response Time
(1)*
150 400
600
ns
ns
PIC16F7X7
PIC16LF7X7
301 TMC2OV Comparator Mode Change to
Output Valid*
10 s
* These parameters are characterized but not tested.
Note 1: Response time measured with one comparator input at (VDD 1.5)/2, while the other input transitions from
VSS to VDD.
Operating Conditions: 3.0V < VDD < 5.5V, -40C < TA < +85C (unless otherwise stated).
Param
No.
Sym Characteristics Min Typ Max Units Comments
D310 VRES Resolution VDD/24 VDD/32 LSb
D311 VRAA Absolute Accuracy
1/4
1/2
LSb
LSb
Low Range (VRR = 1)
High Range (VRR = 0)
D312 VRUR Unit Resistor Value (R)* 2 k
310 TSET Settling Time
(1)*
10 s
* These parameters are characterized but not tested.
Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from 0000 to 1111.
PIC16F7X7
DS30498B-page 220 Preliminary 2003 Microchip Technology Inc.
FIGURE 18-3: LOW-VOLTAGE DETECT CHARACTERISTICS
TABLE 18-3: LOW-VOLTAGE DETECT CHARACTERISTICS
VLVD
LVDIF
VDD
(LVDIF set by hardware)
(LVDIF can be
cleared in software)
PIC16LF7X7
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
PIC16F7X7
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C for industrial
-40C TA +125C for extended
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
D420 LVD Voltage on VDD Transition High to Low Industrial
PIC16LF7X7 LVDL<3:0> = 0000 N/A N/A N/A V Reserved
LVDL<3:0> = 0001 N/A N/A N/A V Reserved
LVDL<3:0> = 0010 2.15 2.26 2.37 V
LVDL<3:0> = 0011 2.33 2.45 2.58 V
LVDL<3:0> = 0100 2.43 2.55 2.68 V
LVDL<3:0> = 0101 2.63 2.77 2.91 V
LVDL<3:0> = 0110 2.73 2.87 3.01 V
LVDL<3:0> = 0111 2.91 3.07 3.22 V
LVDL<3:0> = 1000 3.20 3.36 3.53 V
LVDL<3:0> = 1001 3.39 3.57 3.75 V
LVDL<3:0> = 1010 3.49 3.67 3.85 V
LVDL<3:0> = 1011 3.68 3.87 4.07 V
LVDL<3:0> = 1100 3.87 4.07 4.28 V
LVDL<3:0> = 1101 4.06 4.28 4.49 V
LVDL<3:0> = 1110 4.37 4.60 4.82 V
D420 LVD Voltage on VDD Transition High to Low Industrial
PIC16F7X7 LVDL<3:0> = 1011 3.68 3.87 4.07 V
LVDL<3:0> = 1100 3.87 4.07 4.28 V
LVDL<3:0> = 1101 4.06 4.28 4.49 V
LVDL<3:0> = 1110 4.37 4.60 4.82 V
Legend: Shading of rows is to assist in readability of the table.
Production tested at TAMB = 25C. Specifications over temperature limits ensured by characterization.
2003 Microchip Technology Inc. Preliminary DS30498B-page 221
PIC16F7X7
18.5 Timing Parameter Symbology
The timing parameter symbols have been created
using one of the following formats:
FIGURE 18-4: LOAD CONDITIONS
1. TppS2ppS
3. TCC:ST (I
2
C specifications only)
2. TppS
4. Ts (I
2
C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKO rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
H High R Rise
I Invalid (Hi-impedance) V Valid
L Low Z High-impedance
I
2
C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I
2
C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO Stop condition
STA Start condition
VDD/2
CL
RL
pin pin
VSS VSS
CL
RL = 464
CL = 50 pF for all pins except OSC2, but including PORTD and PORTE outputs as ports
15 pF for OSC2 output
Note: PORTD and PORTE are not implemented on the PIC16F737/767 devices.
Load Condition 1 Load Condition 2
PIC16F7X7
DS30498B-page 222 Preliminary 2003 Microchip Technology Inc.
FIGURE 18-5: EXTERNAL CLOCK TIMING
TABLE 18-4: EXTERNAL CLOCK TIMING REQUIREMENTS
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
FOSC External CLKI Frequency
(Note 1)
DC 1 MHz XT Osc mode
DC 20 MHz HS Osc mode
DC 32 kHz LP Osc mode
Oscillator Frequency
(Note 1)
DC 4 MHz RC Osc mode
0.1 4 MHz XT Osc mode
4
5
20
200
MHz
kHz
HS Osc mode
LP Osc mode
1 TOSC External CLKI Period
(Note 1)
1000 ns XT Osc mode
50 ns HS Osc mode
5 ms LP Osc mode
Oscillator Period
(Note 1)
250 ns RC Osc mode
250 10,000 ns XT Osc mode
50 250 ns HS Osc mode
5 ms LP Osc mode
2 TCY Instruction Cycle Time
(Note 1)
200 TCY DC ns TCY = 4/FOSC
3 TOSL,
TOSH
External Clock in (OSC1)
High or Low Time
500 ns XT oscillator
2.5 ms LP oscillator
15 ns HS oscillator
4 TOSR,
TOSF
External Clock in (OSC1)
Rise or Fall Time
25 ns XT oscillator
50 ns LP oscillator
15 ns HS oscillator
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are
based on characterization data for that particular oscillator type, under standard operating conditions, with
the device executing code. Exceeding these specified limits may result in an unstable oscillator operation
and/or higher than expected current consumption. All devices are tested to operate at min. values with an
external clock applied to the OSC1/CLKI pin. When an external clock input is used, the max. cycle time
limit is DC (no clock) for all devices.
OSC1
CLKO
Q4 Q1 Q2 Q3 Q4 Q1
1
2
3 3 4 4
2003 Microchip Technology Inc. Preliminary DS30498B-page 223
PIC16F7X7
FIGURE 18-6: CLKO AND I/O TIMING
TABLE 18-5: CLKO AND I/O TIMING REQUIREMENTS
Note: Refer to Figure 18-4 for load conditions.
OSC1
CLKO
I/O pin
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
10
13
14
17
20, 21
19
18
15
11
12
16
Old Value New Value
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
10* TOSH2CKL OSC1 to CLKO 75 200 ns (Note 1)
11* TOSH2CKH OSC1 to CLKO 75 200 ns (Note 1)
12* TCKR CLKO Rise Time 35 100 ns (Note 1)
13* TCKF CLKO Fall Time 35 100 ns (Note 1)
14* TCKL2IOV CLKO to Port Out Valid 0.5 TCY + 20 ns (Note 1)
15* TIOV2CKH Port In Valid before CLKO TOSC + 200 ns (Note 1)
16* TCKH2IOI Port In Hold after CLKO 0 ns (Note 1)
17* TOSH2IOV OSC1 (Q1 cycle) to Port Out Valid 100 255 ns
18* TOSH2IOI OSC1 (Q2 cycle) to
Port Input Invalid (I/O in
hold time)
PIC16F7X7 100 ns
PIC16LF7X7 200 ns
19* TIOV2OSH Port Input Valid to OSC1 (I/O in setup time) 0 ns
20* TIOR Port Output Rise Time PIC16F7X7 10 40 ns
PIC16LF7X7 145 ns
21* TIOF Port Output Fall Time PIC16F7X7 10 40 ns
PIC16LF7X7 145 ns
22* TINP INT pin High or Low Time TCY ns
23* TRBP RB7:RB4 Change INT High or Low Time TCY ns
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
These parameters are asynchronous events not related to any internal clock edges.
Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC.
PIC16F7X7
DS30498B-page 224 Preliminary 2003 Microchip Technology Inc.
FIGURE 18-7: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
FIGURE 18-8: BROWN-OUT RESET TIMING
TABLE 18-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET REQUIREMENTS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
Reset
Watchdog
Timer
Reset
33
32
30
31
34
I/O pins
34
Note: Refer to Figure 18-4 for load conditions.
VDD
VBOR
35
Param
No.
Sym Characteristic Min Typ Max Units Conditions
30 TMCL MCLR Pulse Width (low) 2 s VDD = 5V, -40C to +85C
31* TWDT Watchdog Timer Time-out Period
(no prescaler)
7 18 33 ms VDD = 5V, -40C to +85C
32 TOST Oscillation Start-up Timer Period 1024 TOSC TOSC = OSC1 period
33* TPWRT Power-up Timer Period 28 72 132 ms VDD = 5V, -40C to +85C
34 TIOZ I/O High-Impedance from MCLR Low or
Watchdog Timer Reset
2.1 s
35 TBOR Brown-out Reset Pulse Width 100 s VDD VBOR (D005)
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
2003 Microchip Technology Inc. Preliminary DS30498B-page 225
PIC16F7X7
FIGURE 18-9: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 18-7: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 ns Must also meet
parameter 42
With Prescaler 10 ns
41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 ns Must also meet
parameter 42
With Prescaler 10 ns
42* TT0P T0CKI Period No Prescaler TCY + 40 ns
With Prescaler Greater of:
20 or TCY + 40
N
ns N = prescale
value (2, 4, ...,
256)
45* TT1H T1CKI High Time Synchronous, Prescaler = 1 0.5 TCY + 20 ns Must also meet
parameter 47
Synchronous,
Prescaler = 2, 4, 8
PIC16F7X7 15 ns
PIC16LF7X7 25 ns
Asynchronous PIC16F7X7 30 ns
PIC16LF7X7 50 ns
46* TT1L T1CKI Low Time Synchronous, Prescaler = 1 0.5 TCY + 20 ns Must also meet
parameter 47
Synchronous,
Prescaler = 2, 4, 8
PIC16F7X7 15 ns
PIC16LF7X7 25 ns
Asynchronous PIC16F7X7 30 ns
PIC16LF7X7 50 ns
47* TT1P T1CKI Input
Period
Synchronous PIC16F7X7 Greater of:
30 or TCY + 40
N
ns N = prescale
value (1, 2, 4, 8)
PIC16LF7X7 Greater of:
50 or TCY + 40
N
N = prescale
value (1, 2, 4, 8)
Asynchronous PIC16F7X7 60 ns
PIC16LF7X7 100 ns
FT1 Timer1 Oscillator Input Frequency Range
(oscillator enabled by setting bit T1OSCEN)
DC 200 kHz
48 TCKEZTMR1 Delay from External Clock Edge to Timer Increment 2 TOSC 7 TOSC
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note: Refer to Figure 18-4 for load conditions.
46
47
45
48
41
42
40
RA4/T0CKI/C1OUT
RC0/T1OSO/T1CKI
TMR0 or TMR1
PIC16F7X7
DS30498B-page 226 Preliminary 2003 Microchip Technology Inc.
FIGURE 18-10: CAPTURE/COMPARE/PWM TIMINGS (CCP1 AND CCP2)
TABLE 18-8: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1 AND CCP2)
Note: Refer to Figure 18-4 for load conditions.
and RC2/CCP1
(Capture Mode)
50 51
52
53 54
RC1/T1OSI/CCP2
and RC2/CCP1
(Compare or PWM Mode)
RC1/T1OSI/CCP2
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
50* TCCL CCP1, CCP2 and
CCP3 Input Low
Time
No Prescaler 0.5 TCY + 20 ns
With Prescaler
PIC16F7X7 10 ns
PIC16LF7X7 20 ns
51* TCCH CCP1, CCP2 and
CCP3 Input High
Time
No Prescaler 0.5 TCY + 20 ns
With Prescaler
PIC16F7X7 10 ns
PIC16LF7X7 20 ns
52* TCCP CCP1, CCP2 and CCP3 Input Period 3 TCY + 40
N
ns N = prescale
value (1,4 or 16)
53* TCCR CCP1, CCP2 and CCP3 Output
Rise Time
PIC16F7X7 10 25 ns
PIC16LF7X7 25 50 ns
54* TCCF CCP1, CCP2 and CCP3 Output
Fall Time
PIC16F7X7 10 25 ns
PIC16LF7X7 25 45 ns
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and
are not tested.
2003 Microchip Technology Inc. Preliminary DS30498B-page 227
PIC16F7X7
FIGURE 18-11: PARALLEL SLAVE PORT TIMING (PIC16F747/777 DEVICES ONLY)
TABLE 18-9: PARALLEL SLAVE PORT REQUIREMENTS (PIC16F747/777 DEVICES ONLY)
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
62 TDTV2WRH Data In Valid before WR or CS (setup time) 20
25
ns
ns Extended range only
63* TWRH2DTI WR or CS to Data In Invalid
(hold time)
PIC16F7X7 20 ns
PIC16LF7X7 35 ns
64 TRDL2DTV RD and CS to Data Out Valid
80
90
ns
ns Extended range only
65 TRDH2DTI RD or CS to Data Out Invalid 10 30 ns
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note: Refer to Figure 18-4 for load conditions.
RE2/CS/AN7
RE0/RD/AN5
RE1/WR/AN6
RD7/PSP7:RD0/PSP0
62
63
64
65
PIC16F7X7
DS30498B-page 228 Preliminary 2003 Microchip Technology Inc.
FIGURE 18-12: SPI MASTER MODE TIMING (CKE = 0, SMP = 0)
FIGURE 18-13: SPI MASTER MODE TIMING (CKE = 1, SMP = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76
78 79
80
79 78
MSb LSb bit 6 - - - - - -1
MSb In LSb In bit 6 - - - -1
Note: Refer to Figure 18-4 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
81
71 72
74
75, 76
78
80
MSb
79
73
MSb In
bit 6 - - - - - -1
LSb In
bit 6 - - - -1
LSb
Note: Refer to Figure 18-4 for load conditions.
2003 Microchip Technology Inc. Preliminary DS30498B-page 229
PIC16F7X7
FIGURE 18-14: SPI SLAVE MODE TIMING (CKE = 0)
FIGURE 18-15: SPI SLAVE MODE TIMING (CKE = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76
77
78 79
80
79 78
MSb LSb bit 6 - - - - - -1
MSb In bit 6 - - - -1 LSb In
83
Note: Refer to Figure 18-4 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
82
74
75, 76
MSb bit 6 - - - - - -1 LSb
77
MSb In bit 6 - - - -1 LSb In
80
83
Note: Refer to Figure 18-4 for load conditions.
PIC16F7X7
DS30498B-page 230 Preliminary 2003 Microchip Technology Inc.
TABLE 18-10: SPI MODE REQUIREMENTS
FIGURE 18-16: I
2
C BUS START/STOP BITS TIMING
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
70* TSSL2SCH,
TSSL2SCL
SS to SCK or SCK Input TCY ns
71* TSCH SCK Input High Time (Slave mode) TCY + 20 ns
72* TSCL SCK Input Low Time (Slave mode) TCY + 20 ns
73* TDIV2SCH,
TDIV2SCL
Setup Time of SDI Data Input to SCK Edge 100 ns
74* TSCH2DIL,
TSCL2DIL
Hold Time of SDI Data Input to SCK Edge 100 ns
75* TDOR SDO Data Output Rise Time PIC16F7X7
PIC16LF7X7
10
25
25
50
ns
ns
76* TDOF SDO Data Output Fall Time 10 25 ns
77* TSSH2DOZ SS to SDO Output High-Impedance 10 50 ns
78* TSCR SCK Output Rise Time
(Master mode)
PIC16F7X7
PIC16LF7X7
10
25
25
50
ns
ns
79* TSCF SCK Output Fall Time (Master mode) 10 25 ns
80* TSCH2DOV,
TSCL2DOV
SDO Data Output Valid after
SCK Edge
PIC16F7X7
PIC16LF7X7
50
145
ns
ns
81* TDOV2SCH,
TDOV2SCL
SDO Data Output Setup to SCK Edge TCY ns
82* TSSL2DOV SDO Data Output Valid after SS Edge 50 ns
83* TSCH2SSH,
TSCL2SSH
SS after SCK Edge 1.5 TCY + 40 ns
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note: Refer to Figure 18-4 for load conditions.
91
92
93
SCL
SDA
Start
Condition
Stop
Condition
90
2003 Microchip Technology Inc. Preliminary DS30498B-page 231
PIC16F7X7
TABLE 18-11: I
2
C BUS START/STOP BITS REQUIREMENTS
FIGURE 18-17: I
2
C BUS DATA TIMING
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
90* TSU:STA Start condition 100 kHz mode 4700 ns Only relevant for Repeated
Start condition
Setup time 400 kHz mode 600
91* THD:STA Start condition 100 kHz mode 4000 ns After this period, the first clock
pulse is generated
Hold time 400 kHz mode 600
92* TSU:STO Stop condition 100 kHz mode 4700 ns
Setup time 400 kHz mode 600
93 THD:STO Stop condition 100 kHz mode 4000 ns
Hold time 400 kHz mode 600
* These parameters are characterized but not tested.
Note: Refer to Figure 18-4 for load conditions.
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
PIC16F7X7
DS30498B-page 232 Preliminary 2003 Microchip Technology Inc.
TABLE 18-12: I
2
C BUS DATA REQUIREMENTS
Param.
No.
Symbol Characteristic Min Max Units Conditions
100* THIGH Clock High Time 100 kHz mode 4.0 s Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 s Device must operate at a
minimum of 10 MHz
SSP module 1.5 TCY
101* TLOW Clock Low Time 100 kHz mode 4.7 s Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 s Device must operate at a
minimum of 10 MHz
SSP module 1.5 TCY
102* TR SDA and SCL Rise
Time
100 kHz mode 1000 ns
400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from
10-400 pF
103* TF SDA and SCL Fall
Time
100 kHz mode 300 ns
400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from
10-400 pF
90* TSU:STA Start Condition
Setup Time
100 kHz mode 4.7 s Only relevant for Repeated
Start
condition
400 kHz mode 0.6 s
91* THD:STA Start Condition Hold
Time
100 kHz mode 4.0 s After this period, the first
clock pulse is generated
400 kHz mode 0.6 s
106* THD:DAT Data Input Hold
Time
100 kHz mode 0 ns
400 kHz mode 0 0.9 s
107* TSU:DAT Data Input Setup
Time
100 kHz mode 250 ns (Note 2)
400 kHz mode 100 ns
92* TSU:STO Stop Condition
Setup Time
100 kHz mode 4.7 s
400 kHz mode 0.6 s
109* TAA Output Valid from
Clock
100 kHz mode 3500 ns (Note 1)
400 kHz mode ns
110* TBUF Bus Free Time 100 kHz mode 4.7 s Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 s
CB Bus Capacitive Loading 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
2: A fast mode (400 kHz) I
2
C bus device can be used in a standard mode (100 kHz) I
2
C bus system, but the
requirement, TSU:DAT 250 ns, must then be met. This will automatically be the case if the device does not
stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal,
it must output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to
the standard mode I
2
C bus specification), before the SCL line is released.
2003 Microchip Technology Inc. Preliminary DS30498B-page 233
PIC16F7X7
FIGURE 18-18: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 18-13: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 18-19: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TABLE 18-14: USART SYNCHRONOUS RECEIVE REQUIREMENTS
Note: Refer to Figure 18-4 for load conditions.
121
121
122
RC6/TX/CK
RC7/RX/DT
pin
pin
120
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
120 TCKH2DTV SYNC XMIT (MASTER &
SLAVE)
Clock High to Data Out Valid
PIC16F7X7
80 ns
PIC16LF7X7 100 ns
121 TCKRF Clock Out Rise Time and Fall Time
(Master mode)
PIC16F7X7 45 ns
PIC16LF7X7 50 ns
122 TDTRF Data Out Rise Time and Fall Time PIC16F7X7 45 ns
PIC16LF7X7 50 ns
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note: Refer to Figure 18-4 for load conditions.
125
126
RC6/TX/CK
RC7/RX/DT
pin
pin
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
125 TDTV2CKL SYNC RCV (MASTER & SLAVE)
Data Setup before CK (DT setup time) 15 ns
126 TCKL2DTL Data Hold after CK (DT hold time) 15 ns
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
PIC16F7X7
DS30498B-page 234 Preliminary 2003 Microchip Technology Inc.
TABLE 18-15: A/D CONVERTER CHARACTERISTICS: PIC16F7X7 (INDUSTRIAL, EXTENDED)
PIC16LF7X7 (INDUSTRIAL)
Param
No.
Sym Characteristic Min Typ Max Units Conditions
A01 NR Resolution PIC16F7X7 8 bits bit VREF = VDD = 5.12V,
VSS VAIN VREF
PIC16LF7X7 8 bits bit VREF = VDD = 2.2V
A02 EABS Total Absolute Error < 1 LSb VREF = VDD = 5.12V,
VSS VAIN VREF
A03 EIL Integral Linearity Error < 1 LSb VREF = VDD = 5.12V,
VSS VAIN VREF
A04 EDL Differential Linearity Error < 1 LSb VREF = VDD = 5.12V,
VSS VAIN VREF
A05 EFS Full-Scale Error < 1 LSb VREF = VDD = 5.12V,
VSS VAIN VREF
A06 EOFF Offset Error < 1 LSb VREF = VDD = 5.12V,
VSS VAIN VREF
A10 Monotonicity (Note 3) guaranteed VSS VAIN VREF
A20 VREF Reference Voltage 2.5
2.2
5.5
5.5
V
V
-40C to +125C
0C to +125C
A25 VAIN Analog Input Voltage VSS 0.3 VREF + 0.3 V
A30 ZAIN Recommended Impedance of
Analog Voltage Source
10.0 k
A40 IAD A/D Conversion
Current (VDD)
PIC16F7X7 180 A Average current
consumption when A/D
is on (Note 1)
PIC16LF7X7 90 A
A50 IREF VREF Input Current (Note 2) N/A
5
500
A
A
During VAIN acquisition.
During A/D conversion
cycle.
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current
spec includes any such leakage from the A/D module.
2: VREF current is from the RA3 pin or the VDD pin, whichever is selected as a reference input.
3: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
2003 Microchip Technology Inc. Preliminary DS30498B-page 235
PIC16F7X7
FIGURE 18-20: A/D CONVERSION TIMING
TABLE 18-16: A/D CONVERSION REQUIREMENTS
131
130
132
BSF ADCON0, GO
Q4
A/D CLK
A/D DATA
ADRES
ADIF
GO
SAMPLE
OLD_DATA
SAMPLING STOPPED
DONE
NEW_DATA
(TOSC/2)
(1)
7 6 5 4 3 2 1 0
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction
to be executed.
1 TCY
134
Param
No.
Sym Characteristic Min Typ Max Units Conditions
130 TAD A/D Clock Period PIC16F7X7 1.6 s TOSC based, VREF 3.0V
PIC16LF7X7 2.0 s TOSC based,
2.0V VREF 5.5V
PIC16F7X7 2.0 4.0 6.0 s A/D RC mode
PIC16LF7X7 3.0 6.0 9.0 s A/D RC mode
131 TCNV Conversion Time (not including
S/H time) (Note 1)
9 9 TAD
132 TACQ Acquisition Time 5* s The minimum time is the
amplifier settling time. This
may be used if the new input
voltage has not changed by
more than 1 LSb (i.e.,
20.0 mV @ 5.12V) from the
last sampled voltage (as
stated on CHOLD).
134 TGO Q4 to A/D Clock Start TOSC/2 If the A/D clock source is
selected as RC, a time of TCY
is added before the A/D clock
starts. This allows the SLEEP
instruction to be executed.
* These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: ADRES register may be read on the following TCY cycle.
2: See Section 12.1 A/D Acquisition Requirements for minimum conditions.
PIC16F7X7
DS30498B-page 236 Preliminary 2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc. Preliminary DS30498B-page 237
PIC16F7X7
19.0 DC AND AC
CHARACTERISTICS GRAPHS
AND TABLES
Graphs and tables are not available at this time.
PIC16F7X7
DS30498B-page 238 Preliminary 2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc. Preliminary DS30498B-page 239
PIC16F7X7
20.0 PACKAGING INFORMATION
20.1 Package Marking Information
28-Lead PDIP (Skinny DIP)
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC16F737-I/SP
0310017
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC16F767-I/SO
0310017
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
PIC16F737
-I/SS
0310017
28-Lead QFN
XXXXXXXX
XXXXXXXX
YYWWNNN
Example
16F737
-I/ML
0310017
Legend: XX...X Customer specific information*
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week 01)
NNN Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard PICmicro device marking consists of Microchip part number, year code, week code, and
traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP
price.
PIC16F7X7
DS30498B-page 240 Preliminary 2003 Microchip Technology Inc.
Package Marking Information (Contd)
Example
PIC16F777-I/P
0310017
40-Lead PDIP
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
YYWWNNN
44-Lead TQFP
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
PIC16F777
-I/PT
0310017
XXXXXXXXXX
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
PIC16F777
Example
-I/ML
0310017
2003 Microchip Technology Inc. Preliminary DS30498B-page 241
PIC16F7X7
20.2 Package Details
The following sections give the technical details of the
packages.
28-Lead Skinny Plastic Dual In-line (SP) 300 mil (PDIP)
15 10 5 15 10 5 Mold Draft Angle Bottom
15 10 5 15 10 5 Mold Draft Angle Top
10.92 8.89 8.13 .430 .350 .320 eB Overall Row Spacing
0.56 0.48 0.41 .022 .019 .016 B Lower Lead Width
1.65 1.33 1.02 .065 .053 .040 B1 Upper Lead Width
0.38 0.29 0.20 .015 .012 .008 c Lead Thickness
3.43 3.30 3.18 .135 .130 .125 L Tip to Seating Plane
35.18 34.67 34.16 1.385 1.365 1.345 D Overall Length
7.49 7.24 6.99 .295 .285 .275 E1 Molded Package Width
8.26 7.87 7.62 .325 .310 .300 E Shoulder to Shoulder Width
0.38 .015 A1 Base to Seating Plane
3.43 3.30 3.18 .135 .130 .125 A2 Molded Package Thickness
4.06 3.81 3.56 .160 .150 .140 A Top to Seating Plane
2.54 .100
p
Pitch
28 28 n Number of Pins
MAX NOM MIN MAX NOM MIN Dimension Limits
MILLIMETERS INCHES* Units
2
1
D
n
E1
c
eB
p
L
A2
B
B1
A
A1
Notes:
JEDEC Equivalent: MO-095
Drawing No. C04-070
* Controlling Parameter
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
Significant Characteristic
PIC16F7X7
DS30498B-page 242 Preliminary 2003 Microchip Technology Inc.
28-Lead Plastic Small Outline (SO) Wide, 300 mil (SOIC)
Foot Angle Top 0 4 8 0 4 8
15 12 0 15 12 0 Mold Draft Angle Bottom
15 12 0 15 12 0 Mold Draft Angle Top
0.51 0.42 0.36 .020 .017 .014 B Lead Width
0.33 0.28 0.23 .013 .011 .009 c Lead Thickness
1.27 0.84 0.41 .050 .033 .016 L Foot Length
0.74 0.50 0.25 .029 .020 .010 h Chamfer Distance
18.08 17.87 17.65 .712 .704 .695 D Overall Length
7.59 7.49 7.32 .299 .295 .288 E1 Molded Package Width
10.67 10.34 10.01 .420 .407 .394 E Overall Width
0.30 0.20 0.10 .012 .008 .004 A1 Standoff
2.39 2.31 2.24 .094 .091 .088 A2 Molded Package Thickness
2.64 2.50 2.36 .104 .099 .093 A Overall Height
1.27 .050
p
Pitch
28 28 n Number of Pins
MAX NOM MIN MAX NOM MIN Dimension Limits
MILLIMETERS INCHES* Units
2
1
D
p
n
B
E
E1
L
c
45
h
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Significant Characteristic
2003 Microchip Technology Inc. Preliminary DS30498B-page 243
PIC16F7X7
28-Lead Plastic Shrink Small Outline (SS) 209 mil, 5.30 mm (SSOP)
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
10 5 0 10 5 0 Mold Draft Angle Bottom
10 5 0 10 5 0 Mold Draft Angle Top
0.38 0.32 0.25 .015 .013 .010 B Lead Width
203.20 101.60 0.00 8 4 0 Foot Angle
0.25 0.18 0.10 .010 .007 .004 c Lead Thickness
0.94 0.75 0.56 .037 .030 .022 L Foot Length
10.34 10.20 10.06 .407 .402 .396 D Overall Length
5.38 5.25 5.11 .212 .207 .201 E1 Molded Package Width
8.10 7.85 7.59 .319 .309 .299 E Overall Width
0.25 0.15 0.05 .010 .006 .002 A1 Standoff
1.83 1.73 1.63 .072 .068 .064 A2 Molded Package Thickness
1.98 1.85 1.73 .078 .073 .068 A Overall Height
0.65 .026
p
Pitch
28 28 n Number of Pins
MAX NOM MIN MAX NOM MIN Dimension Limits
MILLIMETERS* INCHES Units
2
1
D
p
n
B
E1
E
L
A2
A1
A
Significant Characteristic
PIC16F7X7
DS30498B-page 244 Preliminary 2003 Microchip Technology Inc.
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
Lead Width
*Controlling Parameter
Drawing No. C04-114
Notes:
Mold Draft Angle Top
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
B
.009
12
.011 .014 0.23
12
0.28 0.35
Pitch
Number of Pins
Overall Width
Standoff
Molded Package Length
Overall Length
Molded Package Width
Molded Package Thickness
Overall Height
MAX
Units
Dimension Limits
A2
A1
E1
D
D1
E
n
p
A
.026
.236 BSC
.000
.226 BSC
INCHES
.026 BSC
MIN
28
NOM MAX
0.65 .031
.002 0.00
6.00 BSC
5.75 BSC
MILLIMETERS*
.039
MIN
28
0.65 BSC
NOM
0.80
0.05
1.00
.008 REF Base Thickness A3 0.20 REF
JEDEC equivalent: mMO-220
0.85 .033
.0004 0.01
.236 BSC
.226 BSC
6.00 BSC
5.75 BSC
Lead Length
Tie Bar Width
L .020 .024 .030 0.50 0.60 0.75
R .005 .007 .010 0.13 0.17 0.23
Tie Bar Length Q .012 .016 .026 0.30 0.40 0.65
Chamfer CH .009 .017 .024 0.24 0.42 0.60
E2
D2
Exposed Pad Width
Exposed Pad Length .140 .146 .152 3.55 3.70 3.85
.140 .146 .152 3.55 3.70 3.85
D
E
E1
n
1
2
D1
A
A2
EXPOSED
METAL
PADS
BOTTOM VIEW
TOP VIEW
Q
L
R
p
A1
A3
CH X 45
B
D2
E2
2003 Microchip Technology Inc. Preliminary DS30498B-page 245
PIC16F7X7
40-Lead Plastic Dual In-line (P) 600 mil (PDIP)
15 10 5 15 10 5 Mold Draft Angle Bottom
15 10 5 15 10 5 Mold Draft Angle Top
17.27 16.51 15.75 .680 .650 .620 eB Overall Row Spacing
0.56 0.46 0.36 .022 .018 .014 B Lower Lead Width
1.78 1.27 0.76 .070 .050 .030 B1 Upper Lead Width
0.38 0.29 0.20 .015 .012 .008 c Lead Thickness
3.43 3.30 3.05 .135 .130 .120 L Tip to Seating Plane
52.45 52.26 51.94 2.065 2.058 2.045 D Overall Length
14.22 13.84 13.46 .560 .545 .530 E1 Molded Package Width
15.88 15.24 15.11 .625 .600 .595 E Shoulder to Shoulder Width
0.38 .015 A1 Base to Seating Plane
4.06 3.81 3.56 .160 .150 .140 A2 Molded Package Thickness
4.83 4.45 4.06 .190 .175 .160 A Top to Seating Plane
2.54 .100
p
Pitch
40 40 n Number of Pins
MAX NOM MIN MAX NOM MIN Dimension Limits
MILLIMETERS INCHES* Units
A2
1
2
D
n
E1
c
eB
E
p
L
B
B1
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
Significant Characteristic
PIC16F7X7
DS30498B-page 246 Preliminary 2003 Microchip Technology Inc.
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
1.14 0.89 0.64 .045 .035 .025 CH Pin 1 Corner Chamfer
1.00 .039 (F) Footprint (Reference)
(F)
A
A1 A2
E
E1
#leads=n1
p
B
D1 D
n
1
2
L
Units INCHES MILLIMETERS*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 44 44
Pitch
p
.031 0.80
Overall Height A .039 .043 .047 1.00 1.10 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle 0 3.5 7 0 3.5 7
Overall Width E .463 .472 .482 11.75 12.00 12.25
Overall Length D .463 .472 .482 11.75 12.00 12.25
Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10
Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10
Pins per Side n1 11 11
Lead Thickness c .004 .006 .008 0.09 0.15 0.20
Lead Width B .012 .015 .017 0.30 0.38 0.44
Mold Draft Angle Top 5 10 15 5 10 15
Mold Draft Angle Bottom 5 10 15 5 10 15
CH x 45
Significant Characteristic
2003 Microchip Technology Inc. Preliminary DS30498B-page 247
PIC16F7X7
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
Contact Width
*Controlling Parameter
Drawing No. C04-103
Notes:
1.
2.
B .008 .013 .013 0.20 0.33 0.35
Pitch
Number of Contacts
Overall Width
Standoff
Overall Length
Overall Height
MAX
Units
Dimension Limits
A1
D
E
n
p
A
.000
INCHES
.026 BSC
MIN
44
NOM MAX
.002 0
MILLIMETERS*
.039
MIN
44
0.65 BSC
NOM
0.05
1.00
.010 REF Base Thickness (A3) 0.25 REF
4.
0.90 .035
.001 0.02
.315 8.00
Contact Length L .014 .016 .019 0.35 0.40 0.48
E2
D2
Exposed Pad Width
Exposed Pad Length .246 .268 .274 6.25 6.80 6.95
.246 .268 .274 6.25 6.80 6.95
D2
D
A1
(A3)
A
TOP VIEW
n
1
L
E2
BOTTOM VIEW
B
E
2
PAD
METAL
EXPOSED
p
PIN 1
INDEX ON
EXPOSED PAD
TOP MARKING
INDEX ON
OPTIONAL PIN 1
.031 0.80
DETAIL: CONTACT VARIANTS
7.85 8.15 .321 .309
.309 .315 8.00 7.85 .321 8.15
2 2
1 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC equivalent: M0-220
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
See ASME Y14.5M
3. Contact profiles may vary.
(PROFILE MAY VARY)
PIC16F7X7
DS30498B-page 248 Preliminary 2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc. Preliminary DS30498B-page 249
PIC16F7X7
APPENDIX A: REVISION HISTORY
Revision A (June 2003)
This is a new data sheet. However, these devices are
similar to the PIC16C7X devices found in the
PIC16C7X Data Sheet (DS30390) or the PIC16F87X
devices (DS30292).
Revision B (November 2003)
This revision includes updates to the Electrical Specifi-
cations in Section 18.0 Electrical Characteristics
and minor corrections to the data sheet text.
APPENDIX B: DEVICE
DIFFERENCES
The differences between the devices in this data sheet
are listed in Table B-1.
TABLE B-1: DEVICE DIFFERENCES
Difference PIC16F737 PIC16F747 PIC16F767 PIC16F777
Flash Program Memory
(14-bit words)
4K 4K 8K 8K
Data Memory (bytes) 368 368 368 368
I/O Ports 3 5 3 5
A/D 11 channels,
10 bits
14 channels,
10 bits
11 channels,
10 bits
14 channels,
10 bits
Parallel Slave Port no yes no yes
Interrupt Sources 16 17 16 17
Packages 28-pin PDIP
28-pin SOIC
28-pin SSOP
28-pin QFN
40-pin PDIP
44-pin QFN
44-pin TQFP
28-pin PDIP
28-pin SOIC
28-pin SSOP
28-pin QFN
40-pin PDIP
44-pin QFN
44-pin TQFP
PIC16F7X7
DS30498B-page 250 Preliminary 2003 Microchip Technology Inc.
APPENDIX C: CONVERSION
CONSIDERATIONS
Considerations for converting from previous versions
of devices to the ones listed in this data sheet are listed
in Table C-1.
TABLE C-1: CONVERSION CONSIDERATIONS
Characteristic PIC16C7X PIC16F87X PIC16F7X7
Pins 28/40 28/40 28/40
Timers 3 3 3
Interrupts 11 or 12 13 or 14 16 or 17
Communication PSP, USART, SSP
(SPI, I
2
C Slave)
PSP, USART, SSP
(SPI, I
2
C Master/Slave)
PSP, AUSART, MSSP
(SPI, I
2
C Slave)
Frequency 20 MHz 20 MHz 20 MHz
A/D 8-bit 10-bit 10-bit
CCP 2 2 3
Program Memory 4K, 8K EPROM 4K, 8K Flash
(1,000 E/W cycles)
4K, 8K Flash
(100 E/W cycles)
RAM 192, 368 bytes 192, 368 bytes 368 bytes
EEPROM Data None 128, 256 bytes None
Other In-Circuit Debugger,
Low-Voltage Programming
or Microsoft