Pic 18F45K22
Pic 18F45K22
Pic 18F45K22
Preliminary DS41412A
PIC18(L)F2X/4XK22
Data Sheet
28/40/44-Pin, Low-Power,
High-Performance Microcontrollers
with nanoWatt XLP Technology
DS41412A-page 2 Preliminary 2010 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyers risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC
32
logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 987-1-60932-018-8
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Companys quality system processes and procedures
are for its PIC
MCUs and dsPIC
DSCs, KEELOQ
code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchips quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2010 Microchip Technology Inc. Preliminary DS41412A-page 3
PIC18(L)F2X/4XK22
High-Performance RISC CPU:
C Compiler Optimized Architecture:
- Optional extended instruction set designed to
optimize re-entrant code
Up to 1024 Bytes Data EEPROM
Up to 64 Kbytes Linear Program Memory
Addressing
Up to 3896 Bytes Linear Data Memory Address-
ing
Up to 16 MIPS Operation
16-bit Wide Instructions, 8-bit Wide Data Path
Priority Levels for Interrupts
31-Level, Software Accessible Hardware Stack
8 x 8 Single-Cycle Hardware Multiplier
Flexible Oscillator Structure:
Precision 16 MHz Internal Oscillator Block:
- Factory calibrated to 1%
- Selectable frequencies, 31 kHz to 16 MHz
- 64 MHz performance available using PLL
no external components required
Four Crystal modes up to 64 MHz
Two External Clock modes up to 64 MHz
4X Phase Lock Loop (PLL)
Secondary Oscillator using Timer1 @ 32 kHz
Fail-Safe Clock Monitor:
- Allows for safe shutdown if peripheral clock
stops
- Two-Speed Oscillator Start-up
Analog Features:
Analog-to-Digital Converter (ADC) module:
- 10-bit resolution, up to 30 external channels
- Auto-acquisition capability
- Conversion available during Sleep
- Fixed Voltage Reference (FVR) channel
- Independent input multiplexing
Analog Comparator module:
- Two rail-to-rail analog comparators
- Independent input multiplexing
Digital-to-Analog Converter (DAC) module:
- Fixed Voltage Reference (FVR) with 1.024V,
2.048V and 4.096V output levels
- 5-bit rail-to-rail resistive DAC with positive
and negative reference selection
Charge Time Measurement Unit (CTMU) module:
- Supports capacitive touch sensing for touch
screens and capacitive switches
Extreme Low-Power Management
with nanoWatt XLP:
Sleep mode: 100 nA, typical
Watchdog Timer: 500 nA, typical
Timer1 Oscillator: 500 nA @ 32 kHz
Peripheral Module Disable
Special Microcontroller Features:
Full 5.5V Operation PIC18FXXK22 devices
1.8V to 3.6V Operation PIC18LFXXK22 devices
Self-Programmable under Software Control
High/Low-Voltage Detection (HLVD) module:
- Programmable 16-Level
- Interrupt on High/Low-Voltage Detection
Programmable Brown-out Reset (BOR):
- With software enable option
- Configurable shutdown in Sleep
Extended Watchdog Timer (WDT):
- Programmable period from 4 ms to 131s
In-Circuit Serial Programming (ICSP):
- Single-Supply 3V
In-Circuit Debug (ICD)
Peripheral Highlights:
Up to 35 I/O Pins plus 1 Input-Only Pin:
- High-Current Sink/Source 25 mA/25 mA
- Three programmable external interrupts
- Four programmable interrupt-on-change
- Nine programmable weak pull-ups
- Programmable slew rate
SR Latch:
- Multiple Set/Reset input options
Two Capture/Compare/PWM (CCP) modules
Three Enhanced CCP (ECCP) modules:
- One, two or four PWM outputs
- Selectable polarity
- Programmable dead time
- Auto-Shutdown and Auto-Restart
- PWM steering
Two Master Synchronous Serial Port (MSSP)
modules:
- 3-wire SPI (supports all 4 modes)
- I
2
C Master and Slave modes with address
mask
28/40/44-Pin, Low-Power, High-Performance
Microcontrollers with nanoWatt XLP Technology
PIC18(L)F2X/4XK22
DS41412A-page 4 Preliminary 2010 Microchip Technology Inc.
Two Enhanced Universal Synchronous
Asynchronous Receiver Transmitter (EUSART)
modules:
- Supports RS-485, RS-232 and LIN
- RS-232 operation using internal oscillator
- Auto-Wake-up on Break
- Auto-Baud Detect
Device
Program
Memory
Data Memory
I
/
O
(
1
)
1
0
-
b
i
t
A
/
D
C
h
a
n
n
e
l
s
(
2
)
C
C
P
E
C
C
P
(
F
u
l
l
-
B
r
i
d
g
e
)
E
C
C
P
(
H
a
l
f
-
B
r
i
d
g
e
)
MSSP
E
U
S
A
R
T
C
o
m
p
a
r
a
t
o
r
C
T
M
U
B
O
R
/
L
V
D
S
R
L
a
t
c
h
8
-
b
i
t
T
i
m
e
r
1
6
-
b
i
t
T
i
m
e
r
F
l
a
s
h
(
B
y
t
e
s
)
#
S
i
n
g
l
e
-
W
o
r
d
I
n
s
t
r
u
c
t
i
o
n
s
S
R
A
M
(
B
y
t
e
s
)
E
E
P
R
O
M
(
B
y
t
e
s
)
S
P
I
I
2
C
12
(3)
13
(3)
33
(3)
34 13 NC
TABLE 2: PIC18(L)F4XK22 PIN SUMMARY (CONTINUED)
4
0
-
P
D
I
P
4
4
-
T
Q
F
P
4
4
-
Q
F
N
I
/
O
A
n
a
l
o
g
C
o
m
p
a
r
a
t
o
r
C
T
M
U
S
R
L
a
t
c
h
R
e
f
e
r
e
n
c
e
(
E
)
C
C
P
E
U
S
A
R
T
M
S
S
P
T
i
m
e
r
s
I
n
t
e
r
r
u
p
t
s
P
u
l
l
-
u
p
B
a
s
i
c
Note 1: CCP2 multiplexed in fuses.
2: T3CKI multiplexed in fuses.
3: Pins are enabled on -ICE derivative only, otherwise they are No Connects.
4: CCP3/P3A multiplexed in fuses.
5: P2B multiplexed in fuses.
2010 Microchip Technology Inc. Preliminary DS41412A-page 11
PIC18(L)F2X/4XK22
Table of Contents
1.0 Device Overview ....................................................................................................................................................................... 13
2.0 Oscillator Module (With Fail-Safe Clock Monitor)...................................................................................................................... 27
3.0 Power-Managed Modes ............................................................................................................................................................ 47
4.0 Reset ......................................................................................................................................................................................... 59
5.0 Memory Organization................................................................................................................................................................ 69
6.0 Flash Program Memory............................................................................................................................................................. 95
7.0 Data EEPROM Memory .......................................................................................................................................................... 105
8.0 8 x 8 Hardware Multiplier......................................................................................................................................................... 111
9.0 Interrupts ................................................................................................................................................................................. 113
10.0 I/O Ports .................................................................................................................................................................................. 133
11.0 Timer0 Module ........................................................................................................................................................................ 159
12.0 Timer1/3/5 Module with Gate Control...................................................................................................................................... 163
13.0 Timer2/4/6 Module .................................................................................................................................................................. 175
14.0 Capture/Compare/PWM Modules ........................................................................................................................................... 179
15.0 Master Synchronous Serial Port (MSSP1 and MSSP2) Module............................................................................................. 209
16.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .............................................................. 265
17.0 Analog-to-Digital Converter (ADC) Module ............................................................................................................................. 293
18.0 Comparator Module................................................................................................................................................................. 307
19.0 Charge Time Measurement Unit (CTMU) ............................................................................................................................... 319
20.0 SR Latch.................................................................................................................................................................................. 335
21.0 Fixed Voltage Reference (FVR) .............................................................................................................................................. 339
22.0 Digital-to-Analog Converter (DAC) .......................................................................................................................................... 341
23.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................ 345
24.0 Special Features of the CPU................................................................................................................................................... 351
25.0 Instruction Set Summary......................................................................................................................................................... 369
26.0 Development Support.............................................................................................................................................................. 419
27.0 Electrical Characteristics......................................................................................................................................................... 423
28.0 DC and AC Characteristics Graphs and Tables...................................................................................................................... 463
29.0 Packaging Information............................................................................................................................................................. 465
Appendix A: Revision History............................................................................................................................................................ 479
Appendix B: Device Differences ....................................................................................................................................................... 479
Index ................................................................................................................................................................................................. 481
The Microchip Web Site.................................................................................................................................................................... 491
Customer Change Notification Service ............................................................................................................................................. 485
Customer Support ............................................................................................................................................................................. 485
Reader Response............................................................................................................................................................................. 492
Product Identification System ........................................................................................................................................................... 493
PIC18(L)F2X/4XK22
DS41412A-page 12 Preliminary 2010 Microchip Technology Inc.
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150.
We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
Microchips Worldwide Web site; http://www.microchip.com
Your local Microchip sales office (see last page)
The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277
When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include
literature number) you are using.
Customer Notification System
Register on our web site at www.microchip.com/cn to receive the most current information on all of our products.
2010 Microchip Technology Inc. Preliminary DS41412A-page 13
PIC18(L)F2X/4XK22
1.0 DEVICE OVERVIEW
This document contains device specific information for
the following devices:
This family offers the advantages of all PIC18
microcontrollers namely, high computational
performance at an economical price with the addition
of high-endurance, Flash program memory. On top of
these features, the PIC18(L)F2X/4XK22 family
introduces design enhancements that make these
microcontrollers a logical choice for many high-
performance, power sensitive applications.
1.1 New Core Features
1.1.1 nanoWatt TECHNOLOGY
All of the devices in the PIC18(L)F2X/4XK22 family
incorporate a range of features that can significantly
reduce power consumption during operation. Key
items include:
Alternate Run Modes: By clocking the controller
from the Timer1 source or the internal oscillator
block, power consumption during code execution
can be reduced by as much as 90%.
Multiple Idle Modes: The controller can also run
with its CPU core disabled but the peripherals still
active. In these states, power consumption can be
reduced even further, to as little as 4% of normal
operation requirements.
On-the-fly Mode Switching: The power-
managed modes are invoked by user code during
operation, allowing the user to incorporate power-
saving ideas into their applications software
design.
Low Consumption in Key Modules: The
power requirements for both Timer1 and the
Watchdog Timer are minimized. See
Section 27.0 Electrical Characteristics
for values.
1.1.2 MULTIPLE OSCILLATOR OPTIONS
AND FEATURES
All of the devices in the PIC18(L)F2X/4XK22 family
offer ten different oscillator options, allowing users a
wide range of choices in developing application
hardware. These include:
Four Crystal modes, using crystals or ceramic
resonators
Two External Clock modes, offering the option of
using two pins (oscillator input and a divide-by-4
clock output) or one pin (oscillator input, with the
second pin reassigned as general I/O)
Two External RC Oscillator modes with the same
pin options as the External Clock modes
An internal oscillator block which contains a
16 MHz HFINTOSC oscillator and a 31 kHz
LFINTOSC oscillator, which together provide 8
user selectable clock frequencies, from 31 kHz to
16 MHz. This option frees the two oscillator pins
for use as additional general purpose I/O.
A Phase Lock Loop (PLL) frequency multiplier,
available to both external and internal oscillator
modes, which allows clock speeds of up to
64 MHz. Used with the internal oscillator, the PLL
gives users a complete selection of clock speeds,
from 31 kHz to 64 MHz all without using an
external crystal or clock circuit.
Besides its availability as a clock source, the internal
oscillator block provides a stable reference source that
gives the family additional features for robust
operation:
Fail-Safe Clock Monitor: This option constantly
monitors the main clock source against a
reference signal provided by the LFINTOSC. If a
clock failure occurs, the controller is switched to
the internal oscillator block, allowing for continued
operation or a safe application shutdown.
Two-Speed Start-up: This option allows the
internal oscillator to serve as the clock source
from Power-on Reset, or wake-up from Sleep
mode, until the primary clock source is available.
PIC18F23K22 PIC18LF23K22
PIC18F24K22 PIC18LF24K22
PIC18F25K22 PIC18LF25K22
PIC18F26K22 PIC18LF26K22
PIC18F43K22 PIC18LF43K22
PIC18F44K22 PIC18LF44K22
PIC18F45K22 PIC18LF45K22
PIC18F46K22 PIC18LF46K22
PIC18(L)F2X/4XK22
DS41412A-page 14 Preliminary 2010 Microchip Technology Inc.
1.2 Other Special Features
Memory Endurance: The Flash cells for both
program memory and data EEPROM are rated to
last for many thousands of erase/write cycles up to
10K for program memory and 100K for EEPROM.
Data retention without refresh is conservatively
estimated to be greater than 40 years.
Self-programmability: These devices can write
to their own program memory spaces under inter-
nal software control. By using a bootloader routine
located in the protected Boot Block at the top of
program memory, it becomes possible to create
an application that can update itself in the field.
Extended Instruction Set: The PIC18(L)F2X/
4XK22 family introduces an optional extension to
the PIC18 instruction set, which adds 8 new
instructions and an Indexed Addressing mode.
This extension, enabled as a device configuration
option, has been specifically designed to optimize
re-entrant application code originally developed in
high-level languages, such as C.
Enhanced CCP module: In PWM mode, this
module provides 1, 2 or 4 modulated outputs for
controlling half-bridge and full-bridge drivers.
Other features include:
- Auto-Shutdown, for disabling PWM outputs
on interrupt or other select conditions
- Auto-Restart, to reactivate outputs once the
condition has cleared
- Output steering to selectively enable one or
more of 4 outputs to provide the PWM signal.
Enhanced Addressable EUSART: This serial
communication module is capable of standard
RS-232 operation and provides support for the LIN
bus protocol. Other enhancements include
automatic baud rate detection and a 16-bit Baud
Rate Generator for improved resolution. When the
microcontroller is using the internal oscillator
block, the EUSART provides stable operation for
applications that talk to the outside world without
using an external crystal (or its accompanying
power requirement).
10-bit A/D Converter: This module incorporates
programmable acquisition time, allowing for a
channel to be selected and a conversion to be
initiated without waiting for a sampling period and
thus, reduce code overhead.
Extended Watchdog Timer (WDT): This
enhanced version incorporates a 16-bit
postscaler, allowing an extended time-out range
that is stable across operating voltage and
temperature. See Section 27.0 Electrical
Characteristics for time-out periods.
Charge Time Measurement Unit (CTMU)
SR Latch Output:
1.3 Details on Individual Family
Members
Devices in the PIC18(L)F2X/4XK22 family are avail-
able in 28-pin and 40/44-pin packages. The block dia-
gram for the device family is shown in Figure 1-1.
The devices have the following differences:
1. Flash program memory
2. Data Memory SRAM
3. Data Memory EEPROM
4. A/D channels
5. I/O ports
6. ECCP modules (Full/Half Bridge)
7. Input Voltage Range/Power Consumption
All other features for devices in this family are identical.
These are summarized in Table 1-1.
The pinouts for all devices are listed in the pin summary
tables: Table 1 and Table 2, and I/O description tables:
Table 1-2 and Table 1-3.
2010 Microchip Technology Inc. Preliminary DS41412A-page 15
PIC18(L)F2X/4XK22
TABLE 1-1: DEVICE FEATURES
F
e
a
t
u
r
e
s
P
I
C
1
8
F
2
3
K
2
2
P
I
C
1
8
L
F
2
3
K
2
2
P
I
C
1
8
F
2
4
K
2
2
P
I
C
1
8
L
F
2
4
K
2
2
P
I
C
1
8
F
2
5
K
2
2
P
I
C
1
8
L
F
2
5
K
2
2
P
I
C
1
8
F
2
6
K
2
2
P
I
C
1
8
L
F
2
6
K
2
2
P
I
C
1
8
F
4
3
K
2
2
P
I
C
1
8
L
F
4
3
K
2
2
P
I
C
1
8
F
4
4
K
2
2
P
I
C
1
8
L
F
4
4
K
2
2
P
I
C
1
8
F
4
5
K
2
2
P
I
C
1
8
L
F
4
5
K
2
2
P
I
C
1
8
F
4
6
K
2
2
P
I
C
1
8
L
F
4
6
K
2
2
P
r
o
g
r
a
m
M
e
m
o
r
y
(
B
y
t
e
s
)
8
1
9
2
1
6
3
8
4
3
2
7
6
8
6
5
5
3
6
8
1
9
2
1
6
3
8
4
3
2
7
6
8
6
5
5
3
6
P
r
o
g
r
a
m
M
e
m
o
r
y
(
I
n
s
t
r
u
c
t
i
o
n
s
)
4
0
9
6
8
1
9
2
1
6
3
8
4
3
2
7
6
8
4
0
9
6
8
1
9
2
1
6
3
8
4
3
2
7
6
8
D
a
t
a
M
e
m
o
r
y
(
B
y
t
e
s
)
5
1
2
7
6
8
1
5
3
6
3
8
9
6
5
1
2
7
6
8
1
5
3
6
3
8
9
6
D
a
t
a
E
E
P
R
O
M
M
e
m
o
r
y
(
B
y
t
e
s
)
2
5
6
2
5
6
2
5
6
1
0
2
4
2
5
6
2
5
6
2
5
6
1
0
2
4
I
/
O
P
o
r
t
s
A
,
B
,
C
,
E
(
1
)
A
,
B
,
C
,
E
(
1
)
A
,
B
,
C
,
E
(
1
)
A
,
B
,
C
,
E
(
1
)
A
,
B
,
C
,
D
,
E
A
,
B
,
C
,
D
,
E
A
,
B
,
C
,
D
,
E
A
,
B
,
C
,
D
,
E
C
a
p
t
u
r
e
/
C
o
m
p
a
r
e
/
P
W
M
M
o
d
-
u
l
e
s
(
C
C
P
)
2
2
2
2
2
2
2
2
E
n
h
a
n
c
e
d
C
C
P
M
o
d
u
l
e
s
(
E
C
C
P
)
-
H
a
l
f
B
r
i
d
g
e
2
2
2
2
1
1
1
1
E
n
h
a
n
c
e
d
C
C
P
M
o
d
u
l
e
s
(
E
C
C
P
)
-
F
u
l
l
B
r
i
d
g
e
1
1
1
1
2
2
2
2
1
0
-
b
i
t
A
n
a
l
o
g
-
t
o
-
D
i
g
i
t
a
l
M
o
d
u
l
e
(
A
D
C
)
2
i
n
t
e
r
n
a
l
1
7
i
n
p
u
t
2
i
n
t
e
r
n
a
l
1
7
i
n
p
u
t
2
i
n
t
e
r
n
a
l
1
7
i
n
p
u
t
2
i
n
t
e
r
n
a
l
1
7
i
n
p
u
t
2
i
n
t
e
r
n
a
l
2
8
i
n
p
u
t
2
i
n
t
e
r
n
a
l
2
8
i
n
p
u
t
2
i
n
t
e
r
n
a
l
2
8
i
n
p
u
t
2
i
n
t
e
r
n
a
l
2
8
i
n
p
u
t
P
a
c
k
a
g
e
s
2
8
-
p
i
n
P
D
I
P
2
8
-
p
i
n
S
O
I
C
2
8
-
p
i
n
S
S
O
P
2
8
-
p
i
n
Q
F
N
2
8
-
p
i
n
U
Q
F
N
2
8
-
p
i
n
P
D
I
P
2
8
-
p
i
n
S
O
I
C
2
8
-
p
i
n
S
S
O
P
2
8
-
p
i
n
Q
F
N
2
8
-
p
i
n
U
Q
F
N
2
8
-
p
i
n
P
D
I
P
2
8
-
p
i
n
S
O
I
C
2
8
-
p
i
n
S
S
O
P
2
8
-
p
i
n
Q
F
N
2
8
-
p
i
n
P
D
I
P
2
8
-
p
i
n
S
O
I
C
2
8
-
p
i
n
S
S
O
P
2
8
-
p
i
n
Q
F
N
4
0
-
p
i
n
P
D
I
P
4
4
-
p
i
n
Q
F
N
4
4
-
p
i
n
T
Q
F
P
4
0
-
p
i
n
P
D
I
P
4
4
-
p
i
n
Q
F
N
4
4
-
p
i
n
T
Q
F
P
4
0
-
p
i
n
P
D
I
P
4
4
-
p
i
n
Q
F
N
4
4
-
p
i
n
T
Q
F
P
4
0
-
p
i
n
P
D
I
P
4
4
-
p
i
n
Q
F
N
4
4
-
p
i
n
T
Q
F
P
I
n
t
e
r
r
u
p
t
S
o
u
r
c
e
s
3
3
T
i
m
e
r
s
(
1
6
-
b
i
t
)
4
S
e
r
i
a
l
C
o
m
m
u
n
i
c
a
t
i
o
n
s
2
M
S
S
P
,
2
E
U
S
A
R
T
S
R
L
a
t
c
h
Y
e
s
C
h
a
r
g
e
T
i
m
e
M
e
a
s
u
r
e
m
e
n
t
U
n
i
t
M
o
d
u
l
e
(
C
T
M
U
)
Y
e
s
P
r
o
g
r
a
m
m
a
b
l
e
H
i
g
h
/
L
o
w
-
V
o
l
t
a
g
e
D
e
t
e
c
t
(
H
L
V
D
)
Y
e
s
P
r
o
g
r
a
m
m
a
b
l
e
B
r
o
w
n
-
o
u
t
R
e
s
e
t
(
B
O
R
)
Y
e
s
R
e
s
e
t
s
(
a
n
d
D
e
l
a
y
s
)
P
O
R
,
B
O
R
,
R
E
S
E
T
I
n
s
t
r
u
c
t
i
o
n
,
S
t
a
c
k
O
v
e
r
f
l
o
w
,
S
t
a
c
k
U
n
d
e
r
f
l
o
w
(
P
W
R
T
,
O
S
T
)
,
M
C
L
R
,
W
D
T
I
n
s
t
r
u
c
t
i
o
n
S
e
t
7
5
I
n
s
t
r
u
c
t
i
o
n
s
;
8
3
w
i
t
h
E
x
t
e
n
d
e
d
I
n
s
t
r
u
c
t
i
o
n
S
e
t
e
n
a
b
l
e
d
O
p
e
r
a
t
i
n
g
F
r
e
q
u
e
n
c
y
D
C
-
6
4
M
H
z
N
o
t
e
1
:
P
O
R
T
E
c
o
n
t
a
i
n
s
t
h
e
s
i
n
g
l
e
R
E
3
r
e
a
d
-
o
n
l
y
b
i
t
.
PIC18(L)F2X/4XK22
DS41412A-page 16 Preliminary 2010 Microchip Technology Inc.
FIGURE 1-1: PIC18(L)F2X/4XK22 FAMILY BLOCK DIAGRAM
Instruction
Decode and
Control
Data Latch
Data Memory
Address Latch
Data Address<12>
12
Access BSR
FSR0
FSR1
FSR2
inc/dec
logic
Address
4 12 4
PCH PCL
PCLATH
8
31-Level Stack
Program Counter
PRODL PRODH
8 x 8 Multiply
8
BITOP
8 8
ALU<8>
20
8
8
Table Pointer<21>
inc/dec logic
21
8
Data Bus<8>
Table Latch
8
IR
12
3
ROM Latch
PCLATU
PCU
Note 1: RE3 is only available when MCLR functionality is disabled.
2: OSC1/CLKIN and OSC2/CLKOUT are only available in select oscillator modes and when these pins are not being used as digital I/O.
Refer to Section 2.0 Oscillator Module (With Fail-Safe Clock Monitor) for additional information.
3: Full-Bridge operation for PIC18(L)F4XK22, Half-Bridge operation for PIC18(L)F2XK22.
EUSART1
Comparators
MSSP1
10-bit
ADC
Timer2 Timer1
CTMU Timer0
CCP4
HLVD
ECCP1
BOR Data
EEPROM
W
Instruction Bus <16>
STKPTR
Bank
8
State machine
control signals
Decode
8
8
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
OSC1
(2)
OSC2
(2)
Brown-out
Reset
Internal
Oscillator
Fail-Safe
Clock Monitor
Precision
Reference
Band Gap
MCLR
(1)
Block
LFINTOSC
Oscillator
16 MHz
Oscillator
Single-Supply
Programming
In-Circuit
Debugger
SOSCO
SOSCI
FVR
FVR
FVR
DAC
Address Latch
Program Memory
(8/16/32/64 Kbytes)
Data Latch
PORTA
RA0:RA7
PORTB
RB0:RB7
PORTC
RC0:RC7
PORTD
RD0:RD7
Timer4
Timer6
Timer3
Timer5
SR Latch
EUSART2 MSSP2 CCP5
ECCP2
(3)
C1/C2
ECCP3
PORTE
RE0:RE2
RE3
(1)
DAC
2010 Microchip Technology Inc. Preliminary DS41412A-page 17
PIC18(L)F2X/4XK22
TABLE 1-2: PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP,
SOIC
QFN
2 27 RA0/C12IN0-/AN0
RA0 I/O TTL Digital I/O.
C12IN0- I Analog Comparators C1 and C2 inverting input.
AN0 I Analog Analog input 0.
3 28 RA1/C12IN1-/AN1
RA1 I/O TTL Digital I/O.
C12IN1- I Analog Comparators C1 and C2 inverting input.
AN1 I Analog Analog input 1.
4 1 RA2/C2IN+/AN2/DACOUT/VREF-
RA2 I/O TTL Digital I/O.
C2IN+ I Analog Comparator C2 non-inverting input.
AN2 I Analog Analog input 2.
DACOUT O Analog DAC Reference output.
VREF- I Analog A/D reference voltage (low) input.
5 2 RA3/C1IN+/AN3/VREF+
RA3 I/O TTL Digital I/O.
C1IN+ I Analog Comparator C1 non-inverting input.
AN3 I Analog Analog input 3.
VREF+ I Analog A/D reference voltage (high) input.
6 3 RA4/CCP5/C1OUT/SRQ/T0CKI
RA4 I/O TTL Digital I/O.
CCP5 I/O ST Capture 5 input/Compare 5 output/PWM 5 output.
C1OUT O CMOS Comparator C1 output.
SRQ O TTL SR Latch Q output.
T0CKI I ST Timer0 external clock input.
7 4 RA5/C2OUT/SRNQ/SS1/HLVDIN/AN4
RA5 I/O TTL Digital I/O.
C2OUT O CMOS Comparator C2 output.
SRNQ O TTL SR Latch Q output.
SS1 I TTL SPI slave select input (MSSP1).
HLVDIN I Analog High/Low-Voltage Detect input.
AN4 I Analog Analog input 4.
10 7 RA6/CLKO/OSC2
RA6 I/O TTL Digital I/O.
CLKO O In RC mode, OSC2 pin outputs CLKOUT which has
1/4 the frequency of OSC1 and denotes the instruction
cycle rate.
OSC2 O Oscillator crystal output. Connects to crystal or
resonator in Crystal Oscillator mode.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
PIC18(L)F2X/4XK22
DS41412A-page 18 Preliminary 2010 Microchip Technology Inc.
9 6 RA7/CLKI/OSC1
RA7 I/O TTL Digital I/O.
CLKI I CMOS External clock source input. Always associated with
pin function OSC1.
OSC1 I ST Oscillator crystal input or external clock source input
ST buffer when configured in RC mode; CMOS
otherwise.
21 18 RB0/INT0/CCP4/FLT0/SRI/SS2/AN12
RB0 I/O TTL Digital I/O.
INT0 I ST External interrupt 0.
CCP4 I/O ST Capture 4 input/Compare 4 output/PWM 4 output.
FLT0 I ST PWM Fault input for ECCP Auto-Shutdown.
SRI I ST SR Latch input.
SS2 I TTL SPI slave select input (MSSP2).
AN12 I Analog Analog input 12.
22 19 RB1/INT1/P1C/SCK2/SCL2/C12IN3-/AN10
RB1 I/O TTL Digital I/O.
INT1 I ST External interrupt 1.
P1C O CMOS Enhanced CCP1 PWM output.
SCK2 I/O ST Synchronous serial clock input/output for SPI mode
(MSSP2).
SCL2 I/O ST Synchronous serial clock input/output for I
2
C mode
(MSSP2).
C12IN3- I Analog Comparators C1 and C2 inverting input.
AN10 I Analog Analog input 10.
23 20 RB2/INT2/CTED1/P1B/SDI2/SDA2/AN8
RB2 I/O TTL Digital I/O.
INT2 I ST External interrupt 2.
CTED1 I ST CTMU Edge 1 input.
P1B O CMOS Enhanced CCP1 PWM output.
SDI2 I ST SPI data in (MSSP2).
SDA2 I/O ST I
2
C data I/O (MSSP2).
AN8 I Analog Analog input 8.
24 21 RB3/CTED2/P2A/CCP2/SDO2/C12IN2-/AN9
RB3 I/O TTL Digital I/O.
CTED2 I ST CTMU Edge 2 input.
P2A O CMOS Enhanced CCP2 PWM output.
CCP2
(2)
I/O ST Capture 2 input/Compare 2 output/PWM 2 output.
SDO2 O SPI data out (MSSP2).
C12IN2- I Analog Comparators C1 and C2 inverting input.
AN9 I Analog Analog input 9.
TABLE 1-2: PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP,
SOIC
QFN
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
2010 Microchip Technology Inc. Preliminary DS41412A-page 19
PIC18(L)F2X/4XK22
25 22 RB4/IOC0/P1D/T5G/AN11
RB4 I/O TTL Digital I/O.
IOC0 I TTL Interrupt-on-change pin.
P1D O CMOS Enhanced CCP1 PWM output.
T5G I ST Timer5 external clock gate input.
AN11 I Analog Analog input 11.
26 23 RB5/IOC1/P2B/P3A/CCP3/T3CKI/T1G/AN13
RB5 I/O TTL Digital I/O.
IOC1 I TTL Interrupt-on-change pin.
P2B
(1)
O CMOS Enhanced CCP2 PWM output.
P3A
(1)
O CMOS Enhanced CCP3 PWM output.
CCP3
(1)
I/O ST Capture 3 input/Compare 3 output/PWM 3 output.
T3CKI
(2)
I ST Timer3 clock input.
T1G I ST Timer1 external clock gate input.
AN13 I Analog Analog input 13.
27 24 RB6/IOC2/TX2/CK2/PGC
RB6 I/O TTL Digital I/O.
IOC2 I TTL Interrupt-on-change pin.
TX2 O EUSART 2 asynchronous transmit.
CK2 I/O ST EUSART 2 synchronous clock (see related RXx/DTx).
PGC I/O ST In-Circuit Debugger and ICSP programming clock
pin.
28 25 RB7/IOC3/RX2/DT2/PGD
RB7 I/O TTL Digital I/O.
IOC3 I TTL Interrupt-on-change pin.
RX2 I ST EUSART 2 asynchronous receive.
DT2 I/O ST EUSART 2 synchronous data (see related TXx/CKx).
PGD I/O ST In-Circuit Debugger and ICSP programming data
pin.
11 8 RC0/P2B/T3CKI/T3G/T1CKI/SOSCO
RC0 I/O TTL Digital I/O.
P2B
(2)
O CMOS Enhanced CCP1 PWM output.
T3CKI
(1)
I ST Timer3 clock input.
T3G I ST Timer3 external clock gate input.
T1CKI I ST Timer1 clock input.
SOSCO O Secondary oscillator output.
12 9 RC1/P2A/CCP2/SOSCI
RC1 I/O TTL Digital I/O.
P2A O CMOS Enhanced CCP2 PWM output.
CCP2
(1)
I/O ST Capture 2 input/Compare 2 output/PWM 2 output.
SOSCI I Analog Secondary oscillator input.
TABLE 1-2: PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP,
SOIC
QFN
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
PIC18(L)F2X/4XK22
DS41412A-page 20 Preliminary 2010 Microchip Technology Inc.
13 10 RC2/CTPLS/P1A/CCP1/T5CKI/AN14
RC2 I/O TTL Digital I/O.
CTPLS O CTMU pulse generator output.
P1A O CMOS Enhanced CCP1 PWM output.
CCP1 I/O ST Capture 1 input/Compare 1 output/PWM 1 output.
T5CKI I ST Timer5 clock input.
AN14 I Analog Analog input 14.
14 11 RC3/SCK1/SCL1/AN15
RC3 I/O TTL Digital I/O.
SCK1 I/O ST Synchronous serial clock input/output for SPI mode
(MSSP2).
SCL1 I/O ST Synchronous serial clock input/output for I
2
C mode
(MSSP2).
AN15 I Analog Analog input 15.
15 12 RC4/SDI1/SDA1/AN16
RC4 I/O TTL Digital I/O.
SDI1 I ST SPI data in (MSSP1).
SDA1 I/O ST I
2
C data I/O (MSSP1).
AN16 I Analog Analog input 16.
16 13 RC5/SDO1/AN17
RC5 I/O TTL Digital I/O.
SDO1 O SPI data out (MSSP1).
AN17 I Analog Analog input 17.
17 14 RC6/P3A/CCP3/TX1/CK1/AN18
RC6 I/O TTL Digital I/O.
P3A
(2)
O CMOS Enhanced CCP3 PWM output.
CCP3
(2)
I/O ST Capture 3 input/Compare 3 output/PWM 3 output.
TX1 O EUSART 1 asynchronous transmit.
CK1 I/O ST EUSART 1 synchronous clock (see related RXx/DTx).
AN18 I Analog Analog input 18.
18 15 RC7/P3B/RX1/DT1/AN19
RC7 I/O TTL Digital I/O.
P3B O CMOS Enhanced CCP3 PWM output.
RX1 I ST EUSART 1 asynchronous receive.
DT1 I/O ST EUSART 1 synchronous data (see related TXx/CKx).
AN19 I Analog Analog input 19.
1 26 RE3/VPP/MCLR
RE3 I ST Digital input.
VPP P Programming voltage input.
MCLR I ST Active-Low Master Clear (device Reset) input.
TABLE 1-2: PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP,
SOIC
QFN
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
2010 Microchip Technology Inc. Preliminary DS41412A-page 21
PIC18(L)F2X/4XK22
20 17 VDD P Positive supply for logic and I/O pins.
8, 19 5, 16 VSS P Ground reference for logic and I/O pins.
TABLE 1-2: PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP,
SOIC
QFN
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
TABLE 1-3: PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP TQFP QFN
2 19 19 RA0/C12IN0-/AN0
RA0 I/O TTL Digital I/O.
C12IN0- I Analog Comparators C1 and C2 inverting input.
AN0 I Analog Analog input 0.
3 20 20 RA1/C12IN1-/AN1
RA1 I/O TTL Digital I/O.
C12IN1- I Analog Comparators C1 and C2 inverting input.
AN1 I Analog Analog input 1.
4 21 21 RA2/C2IN+/AN2/DACOUT/VREF-
RA2 I/O TTL Digital I/O.
C2IN+ I Analog Comparator C2 non-inverting input.
AN2 I Analog Analog input 2.
DACOUT O Analog DAC Reference output.
VREF- I Analog A/D reference voltage (low) input.
5 22 22 RA3/C1IN+/AN3/VREF+
RA3 I/O TTL Digital I/O.
C1IN+ I Analog Comparator C1 non-inverting input.
AN3 I Analog Analog input 3.
VREF+ I Analog A/D reference voltage (high) input.
6 23 23 RA4/C1OUT/SRQ/T0CKI
RA4 I/O TTL Digital I/O.
C1OUT O CMOS Comparator C1 output.
SRQ O TTL SR Latch Q output.
T0CKI I ST Timer0 external clock input.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
PIC18(L)F2X/4XK22
DS41412A-page 22 Preliminary 2010 Microchip Technology Inc.
7 24 24 RA5/C2OUT/SRNQ/SS1/HLVDIN/AN4
RA5 I/O TTL Digital I/O.
C2OUT O CMOS Comparator C2 output.
SRNQ O TTL SR Latch Q output.
SS1 I TTL SPI slave select input (MSSP1).
HLVDIN I Analog High/Low-Voltage Detect input.
AN4 I Analog Analog input 4.
14 31 33 RA6/CLKO/OSC2
RA6 I/O TTL Digital I/O.
CLKO O In RC mode, OSC2 pin outputs CLKOUT which
has 1/4 the frequency of OSC1 and denotes the
instruction cycle rate.
OSC2 O Oscillator crystal output. Connects to crystal or
resonator in Crystal Oscillator mode.
13 30 32 RA7/CLKI/OSC1
RA7 I/O TTL Digital I/O.
CLKI I CMOS External clock source input. Always associated
with pin function OSC1.
OSC1 I ST Oscillator crystal input or external clock source
input ST buffer when configured in RC mode;
CMOS otherwise.
33 8 9 RB0/INT0/FLT0/SRI/AN12
RB0 I/O TTL Digital I/O.
INT0 I ST External interrupt 0.
FLT0 I ST PWM Fault input for ECCP Auto-Shutdown.
SRI I ST SR Latch input.
AN12 I Analog Analog input 12.
34 9 10 RB1/INT1/C12IN3-/AN10
RB1 I/O TTL Digital I/O.
INT1 I ST External interrupt 1.
C12IN3- I Analog Comparators C1 and C2 inverting input.
AN10 I Analog Analog input 10.
35 10 11 RB2/INT2/CTED1/AN8
RB2 I/O TTL Digital I/O.
INT2 I ST External interrupt 2.
CTED1 I ST CTMU Edge 1 input.
AN8 I Analog Analog input 8.
36 11 12 RB3/CTED2/P2A/CCP2/C12IN2-/AN9
RB3 I/O TTL Digital I/O.
CTED2 I ST CTMU Edge 2 input.
P2A
(2)
O CMOS Enhanced CCP2 PWM output.
CCP2
(2)
I/O ST Capture 2 input/Compare 2 output/PWM 2 output.
C12IN2- I Analog Comparators C1 and C2 inverting input.
AN9 I Analog Analog input 9.
TABLE 1-3: PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP TQFP QFN
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
2010 Microchip Technology Inc. Preliminary DS41412A-page 23
PIC18(L)F2X/4XK22
37 14 14 RB4/IOC0/T5G/AN11
RB4 I/O TTL Digital I/O.
IOC0 I TTL Interrupt-on-change pin.
T5G I ST Timer5 external clock gate input.
AN11 I Analog Analog input 11.
38 15 15 RB5/IOC1/P3A/CCP3/T3CKI/T1G/AN13
RB5 I/O TTL Digital I/O.
IOC1 I TTL Interrupt-on-change pin.
P3A
(1)
O CMOS Enhanced CCP3 PWM output.
CCP3
(1)
I/O ST Capture 3 input/Compare 3 output/PWM 3 output.
T3CKI
(2)
I ST Timer3 clock input.
T1G I ST Timer1 external clock gate input.
AN13 I Analog Analog input 13.
39 16 16 RB6/IOC2/PGC
RB6 I/O TTL Digital I/O.
IOC2 I TTL Interrupt-on-change pin.
PGC I/O ST In-Circuit Debugger and ICSP programming
clock pin.
40 17 17 RB7/IOC3/PGD
RB7 I/O TTL Digital I/O.
IOC3 I TTL Interrupt-on-change pin.
PGD I/O ST In-Circuit Debugger and ICSP programming
data pin.
15 32 34 RC0/P2B/T3CKI/T3G/T1CKI/SOSCO
RC0 I/O TTL Digital I/O.
P2B
(2)
O CMOS Enhanced CCP1 PWM output.
T3CKI
(1)
I ST Timer3 clock input.
T3G I ST Timer3 external clock gate input.
T1CKI I ST Timer1 clock input.
SOSCO O Secondary oscillator output.
16 35 35 RC1/P2A/CCP2/SOSCI
RC1 I/O TTL Digital I/O.
P2A
(1)
O CMOS Enhanced CCP2 PWM output.
CCP2
(1)
I/O ST Capture 2 input/Compare 2 output/PWM 2 output.
SOSCI I Analog Secondary oscillator input.
17 36 36 RC2/CTPLS/P1A/CCP1/T5CKI/AN14
RC2 I/O TTL Digital I/O.
CTPLS O CTMU pulse generator output.
P1A O CMOS Enhanced CCP1 PWM output.
CCP1 I/O ST Capture 1 input/Compare 1 output/PWM 1 output.
T5CKI I ST Timer5 clock input.
AN14 I Analog Analog input 14.
TABLE 1-3: PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP TQFP QFN
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
PIC18(L)F2X/4XK22
DS41412A-page 24 Preliminary 2010 Microchip Technology Inc.
18 37 37 RC3/SCK1/SCL1/AN15
RC3 I/O TTL Digital I/O.
SCK1 I/O ST Synchronous serial clock input/output for SPI
mode (MSSP2).
SCL1 I/O ST Synchronous serial clock input/output for I
2
C
mode (MSSP2).
AN15 I Analog Analog input 15.
23 42 42 RC4/SDI1/SDA1/AN16
RC4 I/O TTL Digital I/O.
SDI1 I ST SPI data in (MSSP1).
SDA1 I/O ST I
2
C data I/O (MSSP1).
AN16 I Analog Analog input 16.
24 43 43 RC5/SDO1/AN17
RC5 I/O TTL Digital I/O.
SDO1 O SPI data out (MSSP1).
AN17 I Analog Analog input 17.
25 44 44 RC6/TX1/CK1/AN18
RC6 I/O TTL Digital I/O.
TX1 O EUSART 1 asynchronous transmit.
CK1 I/O ST EUSART 1 synchronous clock (see related RXx/
DTx).
AN18 I Analog Analog input 18.
26 1 1 RC7/RX1/DT1/AN19
RC7 I/O TTL Digital I/O.
RX1 I ST EUSART 1 asynchronous receive.
DT1 I/O ST EUSART 1 synchronous data (see related TXx/
CKx).
AN19 I Analog Analog input 19.
19 38 38 RD0/SCK2/SCL2/AN20
RD0 I/O TTL Digital I/O.
SCK2 I/O ST Synchronous serial clock input/output for SPI
mode (MSSP2).
SCL2 I/O ST Synchronous serial clock input/output for I
2
C
mode (MSSP2).
AN20 I Analog Analog input 20.
20 39 39 RD1/CCP4/SDI2/SDA2/AN21
RD1 I/O TTL Digital I/O.
CCP4 I/O ST Capture 4 input/Compare 4 output/PWM 4 output.
SDI2 I ST SPI data in (MSSP2).
SDA2 I/O ST I
2
C data I/O (MSSP2).
AN21 I Analog Analog input 21.
TABLE 1-3: PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP TQFP QFN
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
2010 Microchip Technology Inc. Preliminary DS41412A-page 25
PIC18(L)F2X/4XK22
21 40 40 RD2/P2B/AN22
RD2 I/O TTL Digital I/O
P2B
(1)
O CMOS Enhanced CCP2 PWM output.
AN22 I Analog Analog input 22.
22 41 41 RD3/P2C/SS2/AN23
RD3 I/O TTL Digital I/O.
P2C O CMOS Enhanced CCP2 PWM output.
SS2 I TTL SPI slave select input (MSSP2).
AN23 I Analog Analog input 23.
27 2 2 RD4/P2D/SDO2/AN24
RD4 I/O TTL Digital I/O.
P2D O CMOS Enhanced CCP2 PWM output.
SDO2 O SPI data out (MSSP2).
AN24 I Analog Analog input 24.
28 3 3 RD5/P1B/AN25
RD5 I/O TTL Digital I/O.
P1B O CMOS Enhanced CCP1 PWM output.
AN25 I Analog Analog input 25.
29 4 4 RD6/P1C/TX2/CK2/AN26
RD6 I/O TTL Digital I/O.
P1C O CMOS Enhanced CCP1 PWM output.
TX2 O EUSART 2 asynchronous transmit.
CK2 I/O ST EUSART 2 synchronous clock (see related RXx/
DTx).
AN26 I Analog Analog input 26.
30 5 5 RD7/P1D/RX2/DT2/AN27
RD7 I/O TTL Digital I/O.
P1D O CMOS Enhanced CCP1 PWM output.
RX2 I ST EUSART 2 asynchronous receive.
DT2 I/O ST EUSART 2 synchronous data (see related TXx/
CKx).
AN27 I Analog Analog input 27.
8 25 25 RE0/P3A/CCP3/AN5
RE0 I/O TTL Digital I/O.
P3A
(2)
O CMOS Enhanced CCP3 PWM output.
CCP3
(2)
I/O ST Capture 3 input/Compare 3 output/PWM 3 output.
AN5 I Analog Analog input 5.
9 26 26 RE1/P3B/AN6
RE1 I/O TTL Digital I/O.
P3B O CMOS Enhanced CCP3 PWM output.
AN6 I Analog Analog input 6.
TABLE 1-3: PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP TQFP QFN
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
PIC18(L)F2X/4XK22
DS41412A-page 26 Preliminary 2010 Microchip Technology Inc.
10 27 27 RE2/CCP5/AN7
RE2 I/O TTL Digital I/O.
CCP5 I/O ST Capture 5 input/Compare 5 output/PWM 5 output
AN7 I Analog Analog input 7.
1 18 18 RE3/VPP/MCLR
RE3 I ST Digital input.
VPP P Programming voltage input.
MCLR I ST Active-low Master Clear (device Reset) input.
11,32 7,28 7,8,
28,29
VDD P Positive supply for logic and I/O pins.
12,31 6,29 6,30,31 VSS P Ground reference for logic and I/O pins.
12,13,
33,34
13 NC
TABLE 1-3: PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
Pin
Type
Buffer
Type
Description
PDIP TQFP QFN
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
2010 Microchip Technology Inc. Preliminary DS41412A-page 27
PIC18(L)F2X/4XK22
2.0 OSCILLATOR MODULE (WITH
FAIL-SAFE CLOCK MONITOR)
2.1 Overview
The oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing perfor-
mance and minimizing power consumption. Figure 2-1
illustrates a block diagram of the oscillator module.
Clock sources can be configured from external
oscillators, quartz crystal resonators, ceramic resonators
and Resistor-Capacitor (RC) circuits. In addition, the
system clock source can be configured from one of three
internal oscillators, with a choice of speeds selectable via
software. Additional clock features include:
Selectable system clock source between external
or internal sources via software.
Two-Speed Start-up mode, which minimizes
latency between external oscillator start-up and
code execution.
Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP,
XT, HS, EC or RC modes) and switch
automatically to the internal oscillator.
Oscillator Start-up Timer (OST) ensures stability
of crystal oscillator sources.
The primary clock module can be configured to provide
one of six clock sources as the primary clock.
1. RC External Resistor/Capacitor
2. LP Low-Power Crystal
3. XT Crystal/Resonator
4. INTOSC Internal Oscillator
5. HS High-Speed Crystal/Resonator
6. EC External Clock
The HS and EC oscillator circuits can be optimized for
power consumption and oscillator speed using settings
in FOSC<3:0>. Additional FOSC<3:0> selections
enable RA6 to be used as I/O or CLKO (FOSC/4) for
RC, EC and INTOSC Oscillator modes.
Primary Clock modes are selectable by the
FOSC<3:0> bits of the CONFIG1H Configuration
register. The primary clock operation is further defined
by these Configuration and register bits:
1. PRICLKEN (CONFIG1H<5>)
2. PRISD (OSCCON2<2>)
3. PLLCFG (CONFIG1H<4>)
4. PLLEN (OSCTUNE<6>)
5. HFOFST (CONFIG3H<3>)
6. IRCF<2:0> (OSCCON<6:4>)
7. MFIOSEL (OSCCON2<4>)
8. INTSRC (OSCTUNE<7>)
The HFINTOSC, MFINTOSC and LFINTOSC are
factory calibrated high, medium and low-frequency
oscillators, respectively, which are used as the internal
clock sources.
PIC18(L)F2X/4XK22
DS41412A-page 28 Preliminary 2010 Microchip Technology Inc.
FIGURE 2-1: SIMPLIFIED OSCILLATOR SYSTEM BLOCK DIAGRAM
Note 1: Details in Figure 2-4.
2: Details in Figure 2-2.
3: Details in Figure 2-3.
4: Details in Table 2-1.
5: The Primary Oscillator MUX uses the INTOSC branch when FOSC<3:0> = 100x.
SOSCO
SOSCI
Secondary
Oscillator
(SOSC)
Secondary Oscillator
(1)
OSC2
OSC1
Primary
Oscillator
(2)
( OSC)
Primary Oscillator
0
1
FOSC<3:0>
(5)
PLL Select
(3) (4)
0
1
4xPLL
INTOSC
Primary Clock Module
Low-Power Mode
Event Switch
(SCS<1:0>)
01
00
1x
Secondary
Oscillator
2
Primary
Clock
INTOSC
C
l
o
c
k
S
w
i
t
c
h
M
U
X
INTOSC
IRCF<2:0>
MFIOSEL
INTSRC
HF-16 MHZ
HF-8 MHZ
HF-4 MHZ
HF-2 MHZ
HF-1 MHZ
HF-31.25 kHZ
HF-250 kHZ
HF-500 kHZ
HFINTOSC
MFINTOSC
LFINTOSC
(16 MHz)
(500 kHz)
(31.25 kHz)
INTOSC
Divide
Circuit
I
n
t
e
r
n
a
l
O
s
c
i
l
l
a
t
o
r
M
U
X
(
3
)
MF-31.25 kHZ
MF-250 kHZ
MF-500 kHZ
LF-31.25 kHz
3 3
Internal Oscillator
SOSCOUT
PRICLKEN
PRISD
EN
2010 Microchip Technology Inc. Preliminary DS41412A-page 29
PIC18(L)F2X/4XK22
2.2 Oscillator Control
The OSCCON, OSCCON2 and OSCTUNE registers
(Register 2-1 to Register 2-3) control several aspects
of the device clocks operation, both in full-power
operation and in power-managed modes.
Main System Clock Selection (SCS)
Primary Oscillator Circuit Shutdown (PRISD)
Secondary Oscillator Enable (SOSCGO)
Primary Clock Frequency 4x multiplier (PLLEN)
Internal Frequency selection bits (IRCF, INTSRC)
Clock Status bits (OSTS, HFIOFS, MFIOFS,
LFIOFS. SOSCRUN, PLLRDY)
Power management selection (IDLEN)
2.2.1 MAIN SYSTEM CLOCK SELECTION
The System Clock Select bits, SCS<1:0>, select the
main clock source. The available clock sources are
Primary clock defined by the FOSC<3:0> bits of
CONFIG1H. The primary clock can be the primary
oscillator, an external clock, or the internal
oscillator block.
Secondary clock (secondary oscillator)
Internal oscillator block (HFINTOSC, MFINTOSC
and LFINTOSC).
The clock source changes immediately after one or
more of the bits is written to, following a brief clock
transition interval. The SCS bits are cleared to select
the primary clock on all forms of Reset.
2.2.2 INTERNAL FREQUENCY
SELECTION
The Internal Oscillator Frequency Select bits
(IRCF<2:0>) select the frequency output of the internal
oscillator block. The choices are the LFINTOSC source
(31.25 kHz), the MFINTOSC source (31.25 kHz,
250 kHz or 500 kHz) and the HFINTOSC source
(16 MHz) or one of the frequencies derived from the
HFINTOSC postscaler (31.25 kHz to 8 MHz). If the
internal oscillator block is supplying the main clock,
changing the states of these bits will have an immedi-
ate change on the internal oscillators output. On
device Resets, the output frequency of the internal
oscillator is set to the default frequency of 1 MHz.
2.2.3 LOW FREQUENCY SELECTION
When a nominal output frequency of 31.25 kHz is
selected (IRCF<2:0> = 000), users may choose
which internal oscillator acts as the source. This is
done with the INTSRC bit of the OSCTUNE register
and MFIOSEL bit of the OSCCON2 register. See
Figure 2-2 and Register 2-1 for specific 31.25 kHz
selection. This option allows users to select a
31.25 kHz clock (MFINTOSC or HFINTOSC) that can
be tuned using the TUN<5:0> bits in OSCTUNE
register, while maintaining power savings with a very
low clock speed. LFINTOSC always remains the
clock source for features such as the Watchdog Timer
and the Fail-Safe Clock Monitor, regardless of the
setting of INTSRC and MFIOSEL bits
This option allows users to select the tunable and more
precise HFINTOSC as a clock source, while
maintaining power savings with a very low clock speed.
2.2.4 POWER MANAGEMENT
The IDLEN bit of the OSCCON register determines
whether the device goes into Sleep mode or one of the
Idle modes when the SLEEP instruction is executed.
PIC18(L)F2X/4XK22
DS41412A-page 30 Preliminary 2010 Microchip Technology Inc.
FIGURE 2-2: INTERNAL OSCILLATOR
MUX BLOCK DIAGRAM
FIGURE 2-3: PLL SELECT BLOCK
DIAGRAM
111
110
101
100
001
000
INTOSC
250 kHZ
500 kHZ
31.25 kHZ
1
0
1
0
11
10
0X
IRCF<2:0>
MFIOSEL
INTSRC
HF-16 MHZ
HF-8 MHZ
HF-4 MHZ
HF-2 MHZ
HF-1 MHZ
LF-31.25 KHZ
MF-31.25 KHZ
HF-31.25 KHZ
HF-250 KHZ
MF-250 KHZ
HF-500 KHZ
MF-500 KHZ
3
011
010
PLL
Select
PLLCFG
FOSC<3:0> = 100x
PLLEN
TABLE 2-1: PLL SELECT TRUTH TABLE
Primary Clock MUX Source FOSC<3:0> PLLCFG PLLEN PLL Select
FOSC (any source) 0000-1111 0 0 0
OSC1/OSC2 (external source) 0000-0111
1010-1111
1 x 1
0 1 1
INTOSC (internal source) 1000-1001 x 0 0
INTOSC (internal source) x 1 1
2010 Microchip Technology Inc. Preliminary DS41412A-page 31
PIC18(L)F2X/4XK22
FIGURE 2-4: SECONDARY OSCILLATOR AND EXTERNAL CLOCK INPUTS
0
1
1
0
EN
SOSCEN
SOSCGO
T1SOSCEN
T3SOSCEN
T5SOSCEN
To Clock Switch Module
SOSCOUT
Secondary
Oscillator
SOSCI
SOSCO
T1CKI
T3G
T3CKI
SOSCEN
T1CKI
SOSCEN
SOSCEN
T3G
T3CKI
T3CMX
T1G
T5CKI
T5G
T5CKI
T5G
T3CKI
T1G
1
0
1
0
T1CKI
T1SOSCEN
T1CLK_EXT_SRC
T3CLK_EXT_SRC
T5CLK_EXT_SRC
T3SOSCEN
T5SOSCEN
T3CKI
T5CKI
PIC18(L)F2X/4XK22
DS41412A-page 32 Preliminary 2010 Microchip Technology Inc.
REGISTER 2-1: OSCCON: OSCILLATOR CONTROL REGISTER
R/W-0 R/W-0 R/W-1 R/W-1 R-q R-0 R/W-0 R/W-0
IDLEN IRCF<2:0> OSTS
(1)
HFIOFS SCS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0 q = depends on condition
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 IDLEN: Idle Enable bit
1 = Device enters Idle mode on SLEEP instruction
0 = Device enters Sleep mode on SLEEP instruction
bit 6-4 IRCF<2:0>: Internal RC Oscillator Frequency Select bits
(2)
111 = HFINTOSC (16 MHz)
110 = HFINTOSC/2 (8 MHz)
101 = HFINTOSC/4 (4 MHz)
100 = HFINTOSC/8 (2 MHz)
011 = HFINTOSC/16 (1 MHz)
(3)
If INTSRC = 0 and MFIOSEL = 0:
010 = HFINTOSC/32 (500 kHz)
001 = HFINTOSC/64 (250 kHz)
000 = LFINTOSC (31.25 kHz)
If INTSRC = 1 and MFIOSEL = 0:
010 = HFINTOSC/32 (500 kHz)
001 = HFINTOSC/64 (250 kHz)
000 = HFINTOSC/512 (31.25 kHz)
If INTSRC = 0 and MFIOSEL = 1:
010 = MFINTOSC (500 kHz)
001 = MFINTOSC/2 (250 kHz)
000 = LFINTOSC (31.25 kHz)
If INTSRC = 1 and MFIOSEL = 1:
010 = MFINTOSC (500 kHz)
001 = MFINTOSC/2 (250 kHz)
000 = MFINTOSC/16 (31.25 kHz)
bit 3 OSTS: Oscillator Start-up Time-out Status bit
1 = Device is running from the clock defined by FOSC<3:0> of the CONFIG1H register
0 = Device is running from the internal oscillator (HFINTOSC, MFINTOSC or LFINTOSC)
bit 2 HFIOFS: HFINTOSC Frequency Stable bit
1 = HFINTOSC frequency is stable
0 = HFINTOSC frequency is not stable
bit 1-0 SCS<1:0>: System Clock Select bit
1x = Internal oscillator block
01 = Secondary (SOSC) oscillator
00 = Primary clock (determined by FOSC<3:0> in CONFIG1H).
Note 1: Reset state depends on state of the IESO Configuration bit.
2: INTOSC source may be determined by the INTSRC bit in OSCTUNE and the MFIOSEL bit in OSCCON2.
3: Default output frequency of HFINTOSC on Reset.
2010 Microchip Technology Inc. Preliminary DS41412A-page 33
PIC18(L)F2X/4XK22
REGISTER 2-2: OSCCON2: OSCILLATOR CONTROL REGISTER 2
R-0/0 R-0/q U-0 R/W-0/0 R/W-0/u R/W-1/1 R-x/u R-0/0
PLLRDY SOSCRUN MFIOSEL SOSCGO
(1)
PRISD MFIOFS LFIOFS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0 q = depends on condition
1 = Bit is set 0 = Bit is cleared x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
bit 7 PLLRDY: PLL Run Status bit
1 = System clock comes from 4xPLL
0 = System clock comes from an oscillator, other than 4xPLL
bit 6 SOSCRUN: SOSC Run Status bit
1 = System clock comes from secondary SOSC
0 = System clock comes from an oscillator, other than SOSC
bit 5 Unimplemented: Read as 0.
bit 4 MFIOSEL: MFINTOSC Select bit
1 = MFINTOSC is used in place of HFINTOSC frequencies of 500 kHz, 250 kHz and 31.25 kHz
0 = MFINTOSC is not used
bit 3 SOSCGO
(1)
: Oscillator Start Control bit
1 = Secondary oscillator is running even if no other sources are requesting it
0 = Secondary oscillator is shut off if no other sources are requesting it. When the SOSC is selected
to run from a digital clock input, rather than an external crystal, this bit has no effect.
bit 2 PRISD: Primary Oscillator Drive Circuit Shutdown bit
1 = Oscillator drive circuit on
0 = Oscillator drive circuit off (zero power)
bit 1 MFIOFS: MFINTOSC Frequency Stable bit
1 = MFINTOSC is stable
0 = MFINTOSC is not stable
bit 0 LFIOFS: LFINTOSC Frequency Stable bit
1 = LFINTOSC is stable
0 = LFINTOSC is not stable
Note 1: The SOSCGO bit is only reset on a VDD Reset.
PIC18(L)F2X/4XK22
DS41412A-page 34 Preliminary 2010 Microchip Technology Inc.
2.3 Clock Source Modes
Clock Source modes can be classified as external or
internal.
External Clock modes rely on external circuitry for
the clock source. Examples are: Clock modules
(EC mode), quartz crystal resonators or ceramic
resonators (LP, XT and HS modes) and Resistor-
Capacitor (RC mode) circuits.
Internal clock sources are contained internally
within the Oscillator block. The Oscillator block
has three internal oscillators: the 16 MHz High-
Frequency Internal Oscillator (HFINTOSC),
500 kHz Medium-Frequency Internal Oscillator
(MFINTOSC) and the 31.25 kHz Low-Frequency
Internal Oscillator (LFINTOSC).
The system clock can be selected between external or
internal clock sources via the System Clock Select
(SCS<1:0>) bits of the OSCCON register. See
Section 2.9 Clock Switching for additional
information.
2.4 External Clock Modes
2.4.1 OSCILLATOR START-UP TIMER (OST)
When the oscillator module is configured for LP, XT or
HS modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
crystal resonator or ceramic resonator, has started and
is providing a stable system clock to the oscillator
module. When switching between clock sources, a
delay is required to allow the new clock to stabilize.
These oscillator delays are shown in Table 2-2.
In order to minimize latency between external oscillator
start-up and code execution, the Two-Speed Clock
Start-up mode can be selected (see Section 2.10
Two-Speed Clock Start-up Mode).
TABLE 2-2: OSCILLATOR DELAY EXAMPLES
2.4.2 EC MODE
The External Clock (EC) mode allows an externally
generated logic level as the system clock source. When
operating in this mode, an external clock source is
connected to the OSC1 input and the OSC2 is available
for general purpose I/O. Figure 2-5 shows the pin
connections for EC mode.
The External Clock (EC) mode offers a Medium Power
(MP) and a High Power (HP) option selectable by the
FOSC<3:0> bits. The MP selections are best suited for
external clock frequencies between 4 and 16 MHz. The
HP selection is best suited for clock frequencies above
16 MHz.
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC
MCU
Note 1: Alternate pin functions are listed in
Section 1.0 Device Overview.
2010 Microchip Technology Inc. Preliminary DS41412A-page 35
PIC18(L)F2X/4XK22
2.4.3 LP, XT, HS MODES
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 and OSC2 (Figure 2-6). The mode selects a low,
medium or high gain setting of the internal inverter-
amplifier to support various resonator types and speed.
LP Oscillator mode selects the lowest gain setting of the
internal inverter-amplifier. LP mode current consumption
is the least of the three modes. This mode is best suited
to drive resonators with a low drive level specification, for
example, tuning fork type crystals.
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current consumption is the medium of the three modes.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode offers a Medium Power (MP) and a
High Power (HP) option selectable by the FOSC<3:0>
bits. The MP selections are best suited for oscillator
frequencies between 4 and 16 MHz. The HP selection
has the highest gain setting of the internal inverter-
amplifier and is best suited for frequencies above
16 MHz. HS mode is best suited for resonators that
require a high drive setting.
FIGURE 2-6: QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
FIGURE 2-7: CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 MO to 10 MO).
C1
C2
Quartz
RS
(1)
OSC1/CLKIN
RF
(2)
Sleep
To Internal
Logic
PIC
MCU
Crystal
OSC2/CLKOUT
Note 1: Quartz crystal characteristics vary according
to type, package and manufacturer. The
user should consult the manufacturer data
sheets for specifications and recommended
application.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator design assistance, refer to the
following Microchip Application Notes:
AN826, Crystal Oscillator Basics and
Crystal Selection for rfPIC
and PIC
Devices (DS00826)
AN849, Basic PIC
Oscillator Design
(DS00849)
AN943, Practical PIC
Oscillator
Analysis and Design (DS00943)
AN949, Making Your Oscillator Work
(DS00949)
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 MO to 10 MO).
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
C1
C2
Ceramic RS
(1)
OSC1/CLKIN
RF
(2)
Sleep
To Internal
Logic
PIC
MCU
RP
(3)
Resonator
OSC2/CLKOUT
PIC18(L)F2X/4XK22
DS41412A-page 36 Preliminary 2010 Microchip Technology Inc.
2.4.4 EXTERNAL RC MODES
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required. There are two modes: RC and RCIO.
2.4.4.1 RC Mode
In RC mode, the RC circuit connects to OSC1. OSC2/
CLKOUT outputs the RC oscillator frequency divided
by 4. This signal may be used to provide a clock for
external circuitry, synchronization, calibration, test or
other application requirements. Figure 2-8 shows the
external RC mode connections.
FIGURE 2-8: EXTERNAL RC MODES
2.4.4.2 RCIO Mode
In RCIO mode, the RC circuit is connected to OSC1.
OSC2 becomes a general purpose I/O pin.
The RC oscillator frequency is a function of the supply
voltage, the resistor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
input threshold voltage variation
component tolerances
packaging variations in capacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
2.5 Internal Clock Modes
The oscillator module has three independent, internal
oscillators that can be configured or selected as the
system clock source.
1. The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at
16 MHz. The frequency of the HFINTOSC can
be user-adjusted via software using the
OSCTUNE register (Register 2-3).
2. The MFINTOSC (Medium-Frequency Internal
Oscillator) is factory calibrated and operates
at 500 kHz. The frequency of the MFINTOSC
can be user-adjusted via software using the
OSCTUNE register (Register 2-3).
3. The LFINTOSC (Low-Frequency Internal
Oscillator) is factory calibrated and operates at
31.25 kHz. The LFINTOSC cannot be user-
adjusted, but is designed to be stable over
temperature and voltage.
The system clock speed can be selected via software
using the Internal Oscillator Frequency select bits
IRCF<2:0> of the OSCCON register.
The system clock can be selected between external or
internal clock sources via the System Clock Selection
(SCS<1:0>) bits of the OSCCON register. See
Section 2.9 Clock Switching for more information.
2.5.1 INTOSC WITH I/O OR CLOCKOUT
Two of the clock modes selectable with the FOSC<3:0>
bits of the CONFIG1H Configuration register configure
the internal oscillator block as the primary oscillator.
Mode selection determines whether OSC2/CLKOUT/
RA7 will be configured as general purpose I/O (RA7) or
FOSC/4 (CLKOUT). In both modes, OSC1/CLKIN/RA7
is configured as general purpose I/O. See
Section 24.0 Special Features of the CPU for more
information.
The CLKOUT signal may be used to provide a clock for
external circuitry, synchronization, calibration, test or
other application requirements.
OSC2/CLKOUT
(1)
CEXT
REXT
PIC
MCU
OSC1/CLKIN
FOSC/4 or
Internal
Clock
VDD
VSS
Recommended values: 10 kO s REXT s 100 kO
CEXT > 20 pF
Note 1: Alternate pin functions are listed in
Section 1.0 Device Overview.
2: Output depends upon RC or RCIO clock mode.
I/O
(2)
2010 Microchip Technology Inc. Preliminary DS41412A-page 37
PIC18(L)F2X/4XK22
2.5.1.1 OSCTUNE Register
The HFINTOSC/MFINTOSC oscillator circuits are
factory calibrated but can be adjusted in software by
writing to the TUN<5:0> bits of the OSCTUNE register
(Register 2-3).
The default value of the TUN<5:0> is 000000. The
value is a 6-bit twos complement number.
When the OSCTUNE register is modified, the
HFINTOSC/MFINTOSC frequency will begin shifting to
the new frequency. Code execution continues during this
shift. There is no indication that the shift has occurred.
The TUN<5:0> bits in OSCTUNE do not affect the
LFINTOSC frequency. Operation of features that
depend on the LFINTOSC clock source frequency, such
as the Power-up Timer (PWRT), Watchdog Timer
(WDT), Fail-Safe Clock Monitor (FSCM) and
peripherals, are not affected by the change in frequency.
The OSCTUNE register also implements the INTSRC
and PLLEN bits, which control certain features of the
internal oscillator block.
The INTSRC bit allows users to select which internal
oscillator provides the clock source when the
31.25 kHz frequency option is selected. This is covered
in greater detail in Section 2.2.3 Low Frequency
Selection.
The PLLEN bit controls the operation of the frequency
multiplier, PLL, in internal oscillator modes. For more
details about the function of the PLLEN bit, see
Section 2.6.2 PLL in HFINTOSC Modes
REGISTER 2-3: OSCTUNE: OSCILLATOR TUNING REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INTSRC PLLEN
(1)
TUN<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 INTSRC: Internal Oscillator Low-Frequency Source Select bit
1 = 31.25 kHz device clock derived from the MFINTOSC or HFINTOSC source
0 = 31.25 kHz device clock derived directly from LFINTOSC internal oscillator
bit 6 PLLEN: Frequency Multiplier 4xPLL for HFINTOSC Enable bit
(1)
1 = PLL enabled for HFINTOSC (8 MHz and 16 MHz only)
0 = PLL disabled
bit 5-0 TUN<5:0>: Frequency Tuning bits use to adjust MFINTOSC and HFINTOSC frequencies
011111 = Maximum frequency
011110 =
000001 =
000000 = Oscillator module (HFINTOSC and MFINTOSC) are running at the factory calibrated
frequency.
111111 =
100000 = Minimum frequency
Note 1: The PLLEN bit is active only when the HFINTOSC is the primary clock source (FOSC<2:0> = 100X) and
the selected frequency is 8 MHz or 16 MHz (IRCF<2:0> = 11x). Otherwise, the PLLEN bit is unavailable
and always reads 0.
PIC18(L)F2X/4XK22
DS41412A-page 38 Preliminary 2010 Microchip Technology Inc.
2.5.2 LFINTOSC
The Low-Frequency Internal Oscillator (LFINTOSC) is
a 31.25 kHz internal clock source. The LFINTOSC is
not tunable, but is designed to be stable across temper-
ature and voltage. See Section 27.0 Electrical Char-
acteristics for the LFINTOSC accuracy
specifications.
The output of the LFINTOSC can be a clock source to
the primary clock or the INTOSC clock (see Figure 2-1).
The LFINTOSC is also the clock source for the Power-
up Timer (PWRT), Watchdog Timer (WDT) and Fail-Safe
Clock Monitor (FSCM).
2.5.3 FREQUENCY SELECT BITS (IRCF)
The HFINTOSC (16 MHz) and MFINTOSC (500 MHz)
outputs connect to a divide circuit that provides
frequencies of 16 MHz to 31.25 kHz. These divide
circuit frequencies, along with the 31.25 kHz
LFINTOSC output, are multiplexed to provide a single
INTOSC clock output (see Figure 2-1). The IRCF<2:0>
bits of the OSCCON register, the MFIOSEL bit of the
OSCCON2 register and the INTSRC bit of the
OSCTUNE register, select the output frequency of the
internal oscillators. One of eight frequencies can be
selected via software:
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz (Default after Reset)
500 kHz (MFINTOSC or HFINTOSC)
250 kHz (MFINTOSC or HFINTOSC)
31 kHz (LFINTOSC, MFINTOSC or HFINTOSC)
2.5.4 INTOSC FREQUENCY DRIFT
The factory calibrates the internal oscillator block outputs
(HFINTOSC/MFINTOSC) for 16 MHz/500 kHz. However,
this frequency may drift as VDD or temperature changes.
It is possible to adjust the HFINTOSC/MFINTOSC fre-
quency by modifying the value of the TUN<5:0> bits in the
OSCTUNE register. This has no effect on the LFINTOSC
clock source frequency.
Tuning the HFINTOSC/MFINTOSC source requires
knowing when to make the adjustment, in which direc-
tion it should be made and, in some cases, how large a
change is needed. Three possible compensation tech-
niques are discussed in the following sections. However,
other techniques may be used.
2.5.4.1 Compensating with the EUSART
An adjustment may be required when the EUSART
begins to generate framing errors or receives data with
errors while in Asynchronous mode. Framing errors
indicate that the device clock frequency is too high; to
adjust for this, decrement the value in OSCTUNE to
reduce the clock frequency. On the other hand, errors
in data may suggest that the clock speed is too low; to
compensate, increment OSCTUNE to increase the
clock frequency.
2.5.4.2 Compensating with the Timers
This technique compares device clock speed to some
reference clock. Two timers may be used; one timer is
clocked by the peripheral clock, while the other is
clocked by a fixed reference source, such as the
Timer1 oscillator.
Both timers are cleared, but the timer clocked by the
reference generates interrupts. When an interrupt
occurs, the internally clocked timer is read and both
timers are cleared. If the internally clocked timer value
is greater than expected, then the internal oscillator
block is running too fast. To adjust for this, decrement
the OSCTUNE register.
2.5.4.3 Compensating with the CCP Module
in Capture Mode
A CCP module can use free running Timer1, Timer3 or
Timer5 clocked by the internal oscillator block and an
external event with a known period (i.e., AC power
frequency). The time of the first event is captured in the
CCPRxH:CCPRxL registers and is recorded for use later.
When the second event causes a capture, the time of the
first event is subtracted from the time of the second
event. Since the period of the external event is known,
the time difference between events can be calculated.
If the measured time is much greater than the calcu-
lated time, the internal oscillator block is running too
fast; to compensate, decrement the OSCTUNE register.
If the measured time is much less than the calculated
time, the internal oscillator block is running too slow; to
compensate, increment the OSCTUNE register.
2010 Microchip Technology Inc. Preliminary DS41412A-page 39
PIC18(L)F2X/4XK22
2.6 PLL Frequency Multiplier
A Phase Locked Loop (PLL) circuit is provided as an
option for users who wish to use a lower frequency
oscillator circuit or to clock the device up to its highest
rated frequency from the crystal oscillator. This may be
useful for customers who are concerned with EMI due
to high-frequency crystals or users who require higher
clock speeds from an internal oscillator.
2.6.1 PLL IN EXTERNAL OSCILLATOR
MODES
The PLL can be enabled for any of the external
oscillator modes using the OSC1/OSC2 pins by either
setting the PLLCFG bit (CONFIG1H<4>), or setting the
PLLEN bit (OSCTUNE<6>). The PLL is designed for
input frequencies of 4 MHz up to 16 MHz. The PLL then
multiplies the oscillator output frequency by 4 to
produce an internal clock frequency up to 64 MHz.
Oscillator frequencies below 4 MHz should not be used
with the PLL.
2.6.2 PLL IN HFINTOSC MODES
The 4x frequency multiplier can be used with the
internal oscillator block to produce faster device clock
speeds than are normally possible with the internal
oscillator. When enabled, the PLL multiplies the
HFINTOSC by 4 to produce clock rates up to 64 MHz.
Unlike external clock modes, the PLL can only be
controlled through software. The PLLEN control bit of
the OSCTUNE register is used to enable or disable the
PLL operation when the HFINTOSC is used.
PIC18(L)F2X/4XK22
DS41412A-page 40 Preliminary 2010 Microchip Technology Inc.
2.7 Effects of Power-Managed Modes
on the Various Clock Sources
For more information about the modes discussed in this
section see Section 3.0 Power-Managed Modes. A
quick reference list is also available in Table 3-1.
When PRI_IDLE mode is selected, the designated
primary oscillator continues to run without interruption.
For all other power-managed modes, the oscillator
using the OSC1 pin is disabled. The OSC1 pin (and
OSC2 pin, if used by the oscillator) will stop oscillating.
In secondary clock modes (SEC_RUN and
SEC_IDLE), the secondary oscillator (SOSC) is
operating and providing the device clock. The
secondary oscillator may also run in all power-
managed modes if required to clock Timer1, Timer3 or
Timer5.
In internal oscillator modes (INTOSC_RUN and
INTOSC_IDLE), the internal oscillator block provides
the device clock source. The 31.25 kHz LFINTOSC
output can be used directly to provide the clock and
may be enabled to support various special features,
regardless of the power-managed mode (see
Section 24.2 Watchdog Timer (WDT),
Section 2.10 Two-Speed Clock Start-up Mode and
Section 2.11 Fail-Safe Clock Monitor for more
information on WDT, Fail-Safe Clock Monitor and Two-
Speed Start-up). The HFINTOSC and MFINTOSC
outputs may be used directly to clock the device or may
be divided down by the postscaler. The HFINTOSC
and MFINTOSC outputs are disabled when the clock is
provided directly from the LFINTOSC output.
When the Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
have been stopped, Sleep mode achieves the lowest
current consumption of the device (only leakage
currents).
Enabling any on-chip feature that will operate during
Sleep will increase the current consumed during Sleep.
The LFINTOSC is required to support WDT operation.
Other features may be operating that do not require a
device clock source (i.e., SSP slave, PSP, INTn pins
and others). Peripherals that may add significant
current consumption are listed in Section 27.8 DC
Characteristics: Input/Output Characteristics,
PIC18(L)F2X/4XK22.
2.8 Power-up Delays
Power-up delays are controlled by two timers, so that
no external Reset circuitry is required for most
applications. The delays ensure that the device is kept
in Reset until the device power supply is stable under
normal circumstances and the primary clock is
operating and stable. For additional information on
power-up delays, see Section 4.5 Device Reset
Timers.
The first timer is the Power-up Timer (PWRT), which
provides a fixed delay on power-up. It is enabled by
clearing (= 0) the PWRTEN Configuration bit.
The second timer is the Oscillator Start-up Timer
(OST), intended to keep the chip in Reset until the
crystal oscillator is stable (LP, XT and HS modes). The
OST does this by counting 1024 oscillator cycles
before allowing the oscillator to clock the device.
When the PLL is enabled with external oscillator
modes, the device is kept in Reset for an additional
2 ms, following the OST delay, so the PLL can lock to
the incoming clock frequency.
There is a delay of interval TCSD, following POR, while
the controller becomes ready to execute instructions.
This delay runs concurrently with any other delays.
This may be the only delay that occurs when any of the
EC, RC or INTIOSC modes are used as the primary
clock source.
When the HFINTOSC is selected as the primary clock,
the main system clock can be delayed until the
HFINTOSC is stable. This is user selectable by the
HFOFST bit of the CONFIG3H Configuration register.
When the HFOFST bit is cleared, the main system
clock is delayed until the HFINTOSC is stable. When
the HFOFST bit is set, the main system clock starts
immediately.
In either case, the HFIOFS bit of the OSCCON register
can be read to determine whether the HFINTOSC is
operating and stable.
2010 Microchip Technology Inc. Preliminary DS41412A-page 41
PIC18(L)F2X/4XK22
TABLE 2-3: OSC1 AND OSC2 PIN STATES IN SLEEP MODE
2.9 Clock Switching
The system clock source can be switched between
external and internal clock sources via software using
the System Clock Select (SCS<1:0>) bits of the
OSCCON register.
PIC18(L)F2X/4XK22 devices contain circuitry to pre-
vent clock glitches when switching between clock
sources. A short pause in the device clock occurs dur-
ing the clock switch. The length of this pause is the sum
of two cycles of the old clock source and three to four
cycles of the new clock source. This formula assumes
that the new clock source is stable.
Clock transitions are discussed in greater detail in
Section 3.1.2 Entering Power-Managed Modes.
2.9.1 SYSTEM CLOCK SELECT
(SCS<1:0>) BITS
The System Clock Select (SCS<1:0>) bits of the
OSCCON register select the system clock source that
is used for the CPU and peripherals.
When SCS<1:0> = 00, the system clock source is
determined by configuration of the FOSC<3:0>
bits in the CONFIG1H Configuration register.
When SCS<1:0> = 10, the system clock source is
chosen by the internal oscillator frequency
selected by the INTSRC bit of the OSCTUNE
register, the MFIOSEL bit of the OSCCON2
register and the IRCF<2:0> bits of the OSCCON
register.
When SCS<1:0> = 01, the system clock source is
the 32.768 kHz secondary oscillator shared with
Timer1, Timer3 and Timer5.
After a Reset, the SCS<1:0> bits of the OSCCON
register are always cleared.
2.9.2 OSCILLATOR START-UP TIME-OUT
STATUS (OSTS) BIT
The Oscillator Start-up Time-out Status (OSTS) bit of
the OSCCON register indicates whether the system
clock is running from the external clock source, as
defined by the FOSC<3:0> bits in the CONFIG1H
Configuration register, or from the internal clock
source. In particular, when the primary oscillator is the
source of the primary clock, OSTS indicates that the
Oscillator Start-up Timer (OST) has timed out for LP,
XT or HS modes.
OSC Mode OSC1 Pin OSC2 Pin
RC, INTOSC with CLKOUT Floating, external resistor should pull high At logic low (clock/4 output)
RC with IO Floating, external resistor should pull high Configured as PORTA, bit 6
INTOSC with IO Configured as PORTA, bit 7 Configured as PORTA, bit 6
EC with IO Floating, pulled by external clock Configured as PORTA, bit 6
EC with CLKOUT Floating, pulled by external clock At logic low (clock/4 output)
LP, XT, HS Feedback inverter disabled at quiescent
voltage level
Feedback inverter disabled at quiescent
voltage level
Note: See Table 4-2 in Section 4.0 Reset for time-outs due to Sleep and MCLR Reset.
Note: Any automatic clock switch, which may
occur from Two-Speed Start-up or Fail-Safe
Clock Monitor, does not update the
SCS<1:0> bits of the OSCCON register.
The user can monitor the SOSCRUN,
MFIOFS and LFIOFS bits of the
OSCCON2 register, and the HFIOFS and
OSTS bits of the OSCCON register to
determine the current system clock source.
PIC18(L)F2X/4XK22
DS41412A-page 42 Preliminary 2010 Microchip Technology Inc.
2.9.3 CLOCK SWITCH TIMING
When switching between one oscillator and another,
the new oscillator may not be operating which saves
power (see Figure 2-9). If this is the case, there is a
delay after the SCS<1:0> bits of the OSCCON register
are modified before the frequency change takes place.
The OSTS and IOFS bits of the OSCCON register will
reflect the current active status of the external and
HFINTOSC oscillators. The timing of a frequency
selection is as follows:
1. SCS<1:0> bits of the OSCCON register are mod-
ified.
2. The old clock continues to operate until the new
clock is ready.
3. Clock switch circuitry waits for two consecutive
rising edges of the old clock after the new clock
ready signal goes true.
4. The system clock is held low starting at the next
falling edge of the old clock.
5. Clock switch circuitry waits for an additional two
rising edges of the new clock.
6. On the next falling edge of the new clock the low
hold on the system clock is released and new
clock is switched in as the system clock.
7. Clock switch is complete.
See Figure 2-1 for more details.
If the HFINTOSC is the source of both the old and new
frequency, there is no start-up delay before the new
frequency is active. This is because the old and new
frequencies are derived from the HFINTOSC via the
postscaler and multiplexer.
Start-up delay specifications are located in
Section 27.0 Electrical Characteristics, under AC
Specifications (Oscillator Module).
2.10 Two-Speed Clock Start-up Mode
Two-Speed Start-up mode provides additional power
savings by minimizing the latency between external
oscillator start-up and code execution. In applications
that make heavy use of the Sleep mode, Two-Speed
Start-up will remove the external oscillator start-up
time from the time spent awake and can reduce the
overall power consumption of the device.
This mode allows the application to wake-up from
Sleep, perform a few instructions using the HFINTOSC
as the clock source and go back to Sleep without
waiting for the primary oscillator to become stable.
When the oscillator module is configured for LP, XT or
HS modes, the Oscillator Start-up Timer (OST) is
enabled (see Section 2.4.1 Oscillator Start-up Timer
(OST)). The OST will suspend program execution until
1024 oscillations are counted. Two-Speed Start-up
mode minimizes the delay in code execution by
operating from the internal oscillator as the OST is
counting. When the OST count reaches 1024 and the
OSTS bit of the OSCCON register is set, program
execution switches to the external oscillator.
2.10.1 TWO-SPEED START-UP MODE
CONFIGURATION
Two-Speed Start-up mode is enabled when all of the
following settings are configured as noted:
Two-Speed Start-up mode is enabled when the
IESO of the CONFIG1H Configuration register is
set.
SCS<1:0> (of the OSCCON register) = 00.
FOSC<2:0> bits of the CONFIG1H Configuration
register are configured for LP, XT or HS mode.
Two-Speed Start-up mode becomes active after:
Power-on Reset (POR) and, if enabled, after
Power-up Timer (PWRT) has expired, or
Wake-up from Sleep.
Note: Executing a SLEEP instruction will abort
the oscillator start-up time and will cause
the OSTS bit of the OSCCON register to
remain clear.
2010 Microchip Technology Inc. Preliminary DS41412A-page 43
PIC18(L)F2X/4XK22
2.10.2 TWO-SPEED START-UP
SEQUENCE
1. Wake-up from Power-on Reset or Sleep.
2. Instructions begin executing by the internal
oscillator at the frequency set in the IRCF<2:0>
bits of the OSCCON register.
3. OST enabled to count 1024 external clock
cycles.
4. OST timed out. External clock is ready.
5. OSTS is set.
6. Clock switch finishes according to Figure 2-9
2.10.3 CHECKING TWO-SPEED CLOCK
STATUS
Checking the state of the OSTS bit of the OSCCON
register will confirm if the microcontroller is running
from the external clock source, as defined by the
FOSC<2:0> bits in CONFIG1H Configuration register,
or the internal oscillator. OSTS = 0 when the external
oscillator is not ready, which indicates that the system
is running from the internal oscillator.
FIGURE 2-9: CLOCK SWITCH TIMING
Old Clock
New Clock
IRCF <2:0>
System Clock
Start-up Time
(1)
Clock Sync Running
High Speed Low Speed
Select Old Select New
New Clk Ready
Low Speed High Speed
Old Clock
New Clock
IRCF <2:0>
System Clock
Start-up Time
(1)
Clock Sync Running
Select Old Select New
New Clk Ready
Note 1: Start-up time includes TOST (1024 TOSC) for external clocks, plus TPLL (approx. 2 ms) for HSPLL mode.
PIC18(L)F2X/4XK22
DS41412A-page 44 Preliminary 2010 Microchip Technology Inc.
2.11 Fail-Safe Clock Monitor
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue operating should the external oscillator fail.
The FSCM can detect oscillator failure any time after
the Oscillator Start-up Timer (OST) has expired. The
FSCM is enabled by setting the FCMEN bit in the
CONFIG1H Configuration register. The FSCM is
applicable to all external oscillator modes (LP, XT, HS,
EC, RC and RCIO).
FIGURE 2-10: FSCM BLOCK DIAGRAM
2.11.1 FAIL-SAFE DETECTION
The FSCM module detects a failed oscillator by
comparing the external oscillator to the FSCM sample
clock. The sample clock is generated by dividing the
LFINTOSC by 64 (see Figure 2-10). Inside the fail
detector block is a latch. The external clock sets the
latch on each falling edge of the external clock. The
sample clock clears the latch on each rising edge of the
sample clock. A failure is detected when an entire half-
cycle of the sample clock elapses before the primary
clock goes low.
2.11.2 FAIL-SAFE OPERATION
When the external clock fails, the FSCM switches the
device clock to an internal clock source and sets the bit
flag OSCFIF of the PIR2 register. The OSCFIF flag will
generate an interrupt if the OSCFIE bit of the PIE2
register is also set. The device firmware can then take
steps to mitigate the problems that may arise from a
failed clock. The system clock will continue to be
sourced from the internal clock source until the device
firmware successfully restarts the external oscillator
and switches back to external operation. An automatic
transition back to the failed clock source will not occur.
The internal clock source chosen by the FSCM is
determined by the IRCF<2:0> bits of the OSCCON
register. This allows the internal oscillator to be
configured before a failure occurs.
2.11.3 FAIL-SAFE CONDITION CLEARING
The Fail-Safe condition is cleared by either one of the
following:
Any Reset
By toggling the SCS1 bit of the OSCCON register
Both of these conditions restart the OST. While the
OST is running, the device continues to operate from
the INTOSC selected in OSCCON. When the OST
times out, the Fail-Safe condition is cleared and the
device automatically switches over to the external clock
source. The Fail-Safe condition need not be cleared
before the OSCFIF flag is cleared.
2.11.4 RESET OR WAKE-UP FROM SLEEP
The FSCM is designed to detect an oscillator failure
after the Oscillator Start-up Timer (OST) has expired.
The OST is used after waking up from Sleep and after
any type of Reset. The OST is not used with the EC or
RC Clock modes so that the FSCM will be active as
soon as the Reset or wake-up has completed. .
External
LFINTOSC
64
S
R
Q
31 kHz
(~32 s)
488 Hz
(~2 ms)
Clock Monitor
Latch
Clock
Failure
Detected
Oscillator
Clock
Q
Sample Clock
Note: Due to the wide range of oscillator start-up
times, the Fail-Safe circuit is not active
during oscillator start-up (i.e., after exiting
Reset or Sleep). After an appropriate
amount of time, the user should check the
OSTS bit of the OSCCON register to verify
the oscillator start-up and that the system
clock switchover has successfully
completed.
Note: When the device is configured for Fail-
Safe clock monitoring in either HS, XT, or
LS oscillator modes then the IESO config-
uration bit should also be set so that the
clock will automatically switch from the
internal clock to the external oscillator
when the OST times out.
2010 Microchip Technology Inc. Preliminary DS41412A-page 45
PIC18(L)F2X/4XK22
FIGURE 2-11: FSCM TIMING DIAGRAM
OSCFIF
System
Clock
Output
Sample Clock
Failure
Detected
Oscillator
Failure
Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in
this example have been chosen for clarity.
(Q)
Test Test Test
Clock Monitor Output
TABLE 2-4: REGISTERS ASSOCIATED WITH CLOCK SOURCES
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 115
IPR2 OSCFIP C1IP C2IP EEIP BCL1IP HLVDIP TMR3IP CCP2IP 128
OSCCON IDLEN IRCF<2:0> OSTS HFIOFS SCS<1:0> 32
OSCCON2 PLLRDY SOSCRUN MFIOSEL SOSCGO PRISD MFIOFS LFIOFS 33
OSCTUNE INTSRC PLLEN TUN<5:0> 37
PIE2 OSCFIE C1IE C2IE EEIE BCL1IE HLVDIE TMR3IE CCP2IE 124
PIR2 OSCFIF C1IF C2IF EEIF BCL1IF HLVDIF TMR3IF CCP2IF 119
Legend: = unimplemented locations, read as 0. Shaded bits are not used by Clock Sources.
TABLE 2-5: CONFIGURATION REGISTERS ASSOCIATED WITH CLOCK SOURCES
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
CONFIG1H IESO FCMEN PRICLKEN PLLCFG FOSC<3:0> 353
CONFIG2L BORV<1:0> BOREN<1:0> PWRTEN
354
CONFIG3H MCLRE P2BMX T3CMX HFOFST CCP3MX PBADEN CCP2MX
356
Legend: = unimplemented locations, read as 0. Shaded bits are not used for Clock Sources.
PIC18(L)F2X/4XK22
DS41412A-page 46 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS41412A-page 47
PIC18(L)F2X/4XK22
3.0 POWER-MANAGED MODES
PIC18(L)F2X/4XK22 devices offer a total of seven
operating modes for more efficient power manage-
ment. These modes provide a variety of options for
selective power conservation in applications where
resources may be limited (i.e., battery-powered
devices).
There are three categories of power-managed modes:
Run modes
Idle modes
Sleep mode
These categories define which portions of the device
are clocked and sometimes, what speed. The Run and
Idle modes may use any of the three available clock
sources (primary, secondary or internal oscillator
block). The Sleep mode does not use a clock source.
The power-managed modes include several power-
saving features offered on previous PIC
microcontroller
devices. One of the clock switching features allows the
controller to use the secondary oscillator (SOSC) in
place of the primary oscillator. Also included is the Sleep
mode, offered by all PIC
microcontroller devices. It is
entered by clearing the IDLEN bit of the OSCCON
register and executing the SLEEP instruction. This shuts
down the selected oscillator (Figure 3-4) and all clock
source status bits are cleared.
Entering the Sleep mode from either Run or Idle mode
does not require a clock switch. This is because no
clocks are needed once the controller has entered
Sleep. If the WDT is selected, the LFINTOSC source
will continue to operate. If the SOSC oscillator is
enabled, it will also continue to run.
When a wake event occurs in Sleep mode (by interrupt,
Reset or WDT time-out), the device will not be clocked
until the clock source selected by the SCS<1:0> bits
becomes ready (see Figure 3-5), or it will be clocked
from the internal oscillator block if either the Two-Speed
Start-up or the Fail-Safe Clock Monitor are enabled
(see Section 24.0 Special Features of the CPU). In
either case, the OSTS bit is set when the primary clock
is providing the device clocks. The IDLEN and SCS bits
are not affected by the wake-up.
3.4 Idle Modes
The Idle modes allow the controllers CPU to be
selectively shut down while the peripherals continue to
operate. Selecting a particular Idle mode allows users
to further manage power consumption.
If the IDLEN bit is set to a 1 when a SLEEP instruction is
executed, the peripherals will be clocked from the clock
source selected by the SCS<1:0> bits; however, the CPU
will not be clocked. The clock source status bits are not
affected. Setting IDLEN and executing a SLEEP instruc-
tion provides a quick method of switching from a given
Run mode to its corresponding Idle mode.
If the WDT is selected, the LFINTOSC source will con-
tinue to operate. If the SOSC oscillator is enabled, it will
also continue to run.
Since the CPU is not executing instructions, the only
exits from any of the Idle modes are by interrupt, WDT
time-out, or a Reset. When a wake event occurs, CPU
execution is delayed by an interval of TCSD while it
becomes ready to execute code. When the CPU
begins executing code, it resumes with the same clock
source for the current Idle mode. For example, when
waking from RC_IDLE mode, the internal oscillator
block will clock the CPU and peripherals (in other
words, RC_RUN mode). The IDLEN and SCS bits are
not affected by the wake-up.
While in any Idle mode or the Sleep mode, a WDT
time-out will result in a WDT wake-up to the Run mode
currently specified by the SCS<1:0> bits.
FIGURE 3-4: TRANSITION TIMING FOR ENTRY TO SLEEP MODE
Q4 Q3 Q2
OSC1
Peripheral
Sleep
Program
Q1 Q1
Counter
Clock
CPU
Clock
PC + 2 PC
PIC18(L)F2X/4XK22
DS41412A-page 52 Preliminary 2010 Microchip Technology Inc.
FIGURE 3-5: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)
3.4.1 PRI_IDLE MODE
This mode is unique among the three low-power Idle
modes, in that it does not disable the primary device
clock. For timing sensitive applications, this allows for
the fastest resumption of device operation with its more
accurate primary clock source, since the clock source
does not have to warm-up or transition from another
oscillator.
PRI_IDLE mode is entered from PRI_RUN mode by
setting the IDLEN bit and executing a SLEEP instruc-
tion. If the device is in another Run mode, set IDLEN
first, then clear the SCS bits and execute SLEEP.
Although the CPU is disabled, the peripherals continue
to be clocked from the primary clock source specified
by the FOSC<3:0> Configuration bits. The OSTS bit
remains set (see Figure 3-6).
When a wake event occurs, the CPU is clocked from the
primary clock source. A delay of interval TCSD is
required between the wake event and when code
execution starts. This is required to allow the CPU to
become ready to execute instructions. After the wake-
up, the OSTS bit remains set. The IDLEN and SCS bits
are not affected by the wake-up (see Figure 3-7).
3.4.2 SEC_IDLE MODE
In SEC_IDLE mode, the CPU is disabled but the
peripherals continue to be clocked from the SOSC
oscillator. This mode is entered from SEC_RUN by set-
ting the IDLEN bit and executing a SLEEP instruction. If
the device is in another Run mode, set the IDLEN bit
first, then set the SCS<1:0> bits to 01 and execute
SLEEP. When the clock source is switched to the SOSC
oscillator, the primary oscillator is shut down, the OSTS
bit is cleared and the SOSCRUN bit is set.
When a wake event occurs, the peripherals continue to
be clocked from the SOSC oscillator. After an interval
of TCSD following the wake event, the CPU begins exe-
cuting code being clocked by the SOSC oscillator. The
IDLEN and SCS bits are not affected by the wake-up;
the SOSC oscillator continues to run (see Figure 3-7).
FIGURE 3-6: TRANSITION TIMING FOR ENTRY TO IDLE MODE
Q3 Q4 Q1 Q2
OSC1
Peripheral
Program
PC
PLL Clock
Q3 Q4
Output
CPU Clock
Q1 Q2 Q3 Q4 Q1 Q2
Clock
Counter
PC + 6 PC + 4
Q1 Q2 Q3 Q4
Wake Event
Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
TOST
(1)
TPLL
(1)
OSTS bit set
PC + 2
Note: The SOSC oscillator should already be
running prior to entering SEC_IDLE mode.
At least one of the secondary oscillator
enable bits (SOSCGO, T1SOSCEN,
T3SOSCEN or T5SOSCEN) must be set
when the SLEEP instruction is executed.
Otherwise, the main system clock will con-
tinue to operate in the previously selected
mode and the corresponding IDLE mode
will be entered (i.e., PRI_IDLE or
RC_IDLE).
Q1
Peripheral
Program
PC PC + 2
OSC1
Q3 Q4 Q1
CPU Clock
Clock
Counter
Q2
2010 Microchip Technology Inc. Preliminary DS41412A-page 53
PIC18(L)F2X/4XK22
FIGURE 3-7: TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE
3.4.3 RC_IDLE MODE
In RC_IDLE mode, the CPU is disabled but the periph-
erals continue to be clocked from the internal oscillator
block from the HFINTOSC multiplexer output. This
mode allows for controllable power conservation during
Idle periods.
From RC_RUN, this mode is entered by setting the
IDLEN bit and executing a SLEEP instruction. If the
device is in another Run mode, first set IDLEN, then set
the SCS1 bit and execute SLEEP. It is recommended
that SCS0 also be cleared, although its value is
ignored, to maintain software compatibility with future
devices. The HFINTOSC multiplexer may be used to
select a higher clock frequency by modifying the IRCF
bits before executing the SLEEP instruction. When the
clock source is switched to the HFINTOSC multiplexer,
the primary oscillator is shut down and the OSTS bit is
cleared.
If the IRCF bits are set to any non-zero value, or either
the INTSRC or MFIOSEL bits are set, the HFINTOSC
output is enabled. Either the HFIOFS or the MFIOFS
bits become set, after the HFINTOSC output stabilizes
after an interval of TIOBST. For information on the
HFIOFS and MFIOFS bits, see Table 3-2.
Clocks to the peripherals continue while the
HFINTOSC source stabilizes. The HFIOFS and
MFIOFS bits will remain set if the IRCF bits were
previously set at a non-zero value or if INTSRC was set
before the SLEEP instruction was executed and the
HFINTOSC source was already stable. If the IRCF bits
and INTSRC are all clear, the HFINTOSC output will
not be enabled, the HFIOFS and MFIOFS bits will
remain clear and there will be no indication of the
current clock source.
When a wake event occurs, the peripherals continue to
be clocked from the HFINTOSC multiplexer output.
After a delay of TCSD following the wake event, the CPU
begins executing code being clocked by the
HFINTOSC multiplexer. The IDLEN and SCS bits are
not affected by the wake-up. The LFINTOSC source
will continue to run if either the WDT or the Fail-Safe
Clock Monitor is enabled.
OSC1
Peripheral
Program
PC
CPU Clock
Q1 Q3 Q4
Clock
Counter
Q2
Wake Event
TCSD
PIC18(L)F2X/4XK22
DS41412A-page 54 Preliminary 2010 Microchip Technology Inc.
3.5 Exiting Idle and Sleep Modes
An exit from Sleep mode or any of the Idle modes is
triggered by any one of the following:
an interrupt
a Reset
a Watchdog Time-out
This section discusses the triggers that cause exits
from power-managed modes. The clocking subsystem
actions are discussed in each of the power-managed
modes (see Section 3.2 Run Modes, Section 3.3
Sleep Mode and Section 3.4 Idle Modes).
3.5.1 EXIT BY INTERRUPT
Any of the available interrupt sources can cause the
device to exit from an Idle mode or the Sleep mode to
a Run mode. To enable this functionality, an interrupt
source must be enabled by setting its enable bit in one
of the INTCON or PIE registers. The exit sequence is
initiated when the corresponding interrupt flag bit is set.
The instruction immediately following the SLEEP
instruction is executed on all exits by interrupt from Idle
or Sleep modes. Code execution then branches to the
interrupt vector if the GIE/GIEH bit of the INTCON
register is set, otherwise code execution continues
without branching (see Section 9.0 Interrupts).
A fixed delay of interval TCSD following the wake event
is required when leaving Sleep and Idle modes. This
delay is required for the CPU to prepare for execution.
Instruction execution resumes on the first clock cycle
following this delay.
3.5.2 EXIT BY WDT TIME-OUT
A WDT time-out will cause different actions depending
on which power-managed mode the device is in when
the time-out occurs.
If the device is not executing code (all Idle modes and
Sleep mode), the time-out will result in an exit from the
power-managed mode (see Section 3.2 Run
Modes and Section 3.3 Sleep Mode). If the device
is executing code (all Run modes), the time-out will
result in a WDT Reset (see Section 24.2 Watchdog
Timer (WDT)).
The WDT timer and postscaler are cleared by any one
of the following:
executing a SLEEP instruction
executing a CLRWDT instruction
the loss of the currently selected clock source
when the Fail-Safe Clock Monitor is enabled
modifying the IRCF bits in the OSCCON register
when the internal oscillator block is the device
clock source
3.5.3 EXIT BY RESET
Exiting Sleep and Idle modes by Reset causes code
execution to restart at address 0. See Section 4.0
Reset for more details.
The exit delay time from Reset to the start of code
execution depends on both the clock sources before
and after the wake-up and the type of oscillator. Exit
delays are summarized in Table 3-3.
3.5.4 EXIT WITHOUT AN OSCILLATOR
START-UP DELAY
Certain exits from power-managed modes do not
invoke the OST at all. There are two cases:
PRI_IDLE mode, where the primary clock source
is not stopped and
the primary clock source is not any of the LP, XT,
HS or HSPLL modes.
In these instances, the primary clock source either
does not require an oscillator start-up delay since it is
already running (PRI_IDLE), or normally does not
require an oscillator start-up delay (RC, EC, INTOSC,
and INTOSCIO modes). However, a fixed delay of
interval TCSD following the wake event is still required
when leaving Sleep and Idle modes to allow the CPU
to prepare for execution. Instruction execution resumes
on the first clock cycle following this delay.
2010 Microchip Technology Inc. Preliminary DS41412A-page 55
PIC18(L)F2X/4XK22
TABLE 3-3: EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE
(BY CLOCK SOURCES)
Clock Source
before Wake-up
Clock Source
after Wake-up
Exit Delay
Clock Ready Status
Bit (OSCCON)
Primary Device Clock
(PRI_IDLE mode)
LP, XT, HS
TCSD
(1)
OSTS HSPLL
EC, RC
HFINTOSC
(2)
IOSF
T1OSC or LFINTOSC
(1)
LP, XT, HS TOST
(3)
OSTS HSPLL TOST + t
PLL
(3)
EC, RC TCSD
(1)
HFINTOSC
(1)
TIOBST
(4)
IOSF
HFINTOSC
(2)
LP, XT, HS TOST
(4)
OSTS HSPLL TOST + t
PLL
(3)
EC, RC TCSD
(1)
HFINTOSC
(1)
None IOSF
None
(Sleep mode)
LP, XT, HS TOST
(3)
OSTS HSPLL TOST + t
PLL
(3)
EC, RC TCSD
(1)
HFINTOSC
(1)
TIOBST
(4)
IOSF
Note 1: TCSD is a required delay when waking from Sleep and all Idle modes and runs concurrently with any other
required delays (see Section 3.4 Idle Modes). On Reset, HFINTOSC defaults to 1 MHz.
2: Includes both the HFINTOSC 16 MHz source and postscaler derived frequencies.
3: TOST is the Oscillator Start-up Timer. t
PLL
is the PLL Lock-out Timer.
4: Execution continues during the HFINTOSC stabilization period, TIOBST.
PIC18(L)F2X/4XK22
DS41412A-page 56 Preliminary 2010 Microchip Technology Inc.
3.6 Selective Peripheral Module
Control
Idle mode allows users to substantially reduce power
consumption by stopping the CPU clock. Even so,
peripheral modules still remain clocked, and thus, con-
sume power. There may be cases where the applica-
tion needs what IDLE mode does not provide: the
allocation of power resources to the CPU processing
with minimal power consumption from the peripherals.
PIC18(L)F2X/4XK22 family devices address this
requirement by allowing peripheral modules to be
selectively disabled, reducing or eliminating their
power consumption. This can be done with control bits
in the Peripheral Module Disable (PMD) registers.
These bits generically named XXXMD are located in
control registers PMD0, PMD1 or PMD2.
Setting the PMD bit for a module disables all clock
sources to that module, reducing its power
consumption to an absolute minimum. In this state, the
control and STATUS registers associated with the
peripheral are also disabled, so writes to these
registers have no effect and read values are invalid.
REGISTER 3-1: PMD0: PERIPHERAL MODULE DISABLE REGISTER 0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 UART2MD: UART2 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 6 UART1MD: UART1 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 5 TMR6MD: Timer6 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 4 TMR5MD: Timer5 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 3 TMR4MD: Timer4 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 2 TMR3MD: Timer3 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 1 TMR2MD: Timer2 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 0 TMR1MD: Timer1 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
2010 Microchip Technology Inc. Preliminary DS41412A-page 57
PIC18(L)F2X/4XK22
REGISTER 3-2: PMD1: PERIPHERAL MODULE DISABLE REGISTER 1
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MSSP2MD MSSP1MD CCP5MD CCP4MD CCP3MD CCP2MD CCP1MD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 MSSP2MD: MSSP2 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 6 MSSP1MD: MSSP1 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 5 Unimplemented: Read as 0
bit 4 CCP5MD: CCP5 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 3 CCP4MD: CCP4 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 2 CCP3MD: CCP3 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 1 CCP2MD: CCP2 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 0 CCP1MD: CCP1 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
PIC18(L)F2X/4XK22
DS41412A-page 58 Preliminary 2010 Microchip Technology Inc.
REGISTER 3-3: PMD2: PERIPHERAL MODULE DISABLE REGISTER 2
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
CTMUMD CMP2MD CMP1MD ADCMD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7-4 Unimplemented: Read as 0
bit 3 CTMUMD: CTMU Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 2 CMP2MD: Comparator C2 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 1 CMP1MD: Comparator C1 Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
bit 0 ADCMD: ADC Peripheral Module Disable Control bit
1 = Module is disabled, Clock Source is disconnected, module does not draw digital power
0 = Module is enabled, Clock Source is connected, module draws digital power
2010 Microchip Technology Inc. Preliminary DS41412A-page 59
PIC18(L)F2X/4XK22
4.0 RESET
The PIC18(L)F2X/4XK22 devices differentiate between
various kinds of Reset:
a) Power-on Reset (POR)
b) MCLR Reset during normal operation
c) MCLR Reset during power-managed modes
d) Watchdog Timer (WDT) Reset (during
execution)
e) Programmable Brown-out Reset (BOR)
f) RESET Instruction
g) Stack Full Reset
h) Stack Underflow Reset
This section discusses Resets generated by MCLR,
POR and BOR and covers the operation of the various
start-up timers. Stack Reset events are covered in
Section 5.1.2.4 Stack Full and Underflow Resets.
WDT Resets are covered in Section 24.2 Watchdog
Timer (WDT).
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 4-1.
4.1 RCON Register
Device Reset events are tracked through the RCON
register (Register 4-1). The lower five bits of the
register indicate that a specific Reset event has
occurred. In most cases, these bits can only be cleared
by the event and must be set by the application after
the event. The state of these flag bits, taken together,
can be read to indicate the type of Reset that just
occurred. This is described in more detail in
Section 4.6 Reset State of Registers.
The RCON register also has control bits for setting
interrupt priority (IPEN) and software control of the
BOR (SBOREN). Interrupt priority is discussed in
Section 9.0 Interrupts. BOR is covered in
Section 4.4 Brown-out Reset (BOR).
FIGURE 4-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
External Reset
MCLR
VDD
OSC1
WDT
Time-out
VDD
Detect
OST/PWRT
LFINTOSC
POR
OST
(2)
10-bit Ripple Counter
PWRT
(2)
11-bit Ripple Counter
Enable OST
(1)
Enable PWRT
Note 1: See Table for time-out situations.
2: PWRT and OST counters are reset by POR and BOR. See Sections 4.3 and 4.4.
Brown-out
Reset
BOREN
RESET
Instruction
Stack
Pointer
Stack Full/Underflow Reset
Sleep
( )_IDLE
1024 Cycles
65.5 ms
32 s
MCLRE
S
R Q
Chip_Reset
PIC18(L)F2X/4XK22
DS41412A-page 60 Preliminary 2010 Microchip Technology Inc.
REGISTER 4-1: RCON: RESET CONTROL REGISTER
R/W-0/0 R/W-q/u U-0 R/W-1/q R-1/q R-1/q R/W-q/u R/W-0/q
IPEN SBOREN
(1)
RI TO PD POR
(2)
BOR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
1 = Bit is set 0 = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets
x = Bit is unknown u = unchanged q = depends on condition
bit 7 IPEN: Interrupt Priority Enable bit
1 = Enable priority levels on interrupts
0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)
bit 6 SBOREN: BOR Software Enable bit
(1)
If BOREN<1:0> = 01:
1 = BOR is enabled
0 = BOR is disabled
If BOREN<1:0> = 00, 10 or 11:
Bit is disabled and read as 0.
bit 5 Unimplemented: Read as 0
bit 4 RI: RESET Instruction Flag bit
1 = The RESET instruction was not executed (set by firmware or Power-on Reset)
0 = The RESET instruction was executed causing a device Reset (must be set in firmware after a
code-executed Reset occurs)
bit 3 TO: Watchdog Time-out Flag bit
1 = Set by power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 2 PD: Power-down Detection Flag bit
1 = Set by power-up or by the CLRWDT instruction
0 = Set by execution of the SLEEP instruction
bit 1 POR: Power-on Reset Status bit
(2)
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
(3)
1 = A Brown-out Reset has not occurred (set by firmware only)
0 = A Brown-out Reset occurred (must be set by firmware after a POR or Brown-out Reset occurs)
Note 1: When CONFIG2L[2:1] = 01, then the SBOREN Reset state is 1; otherwise, it is 0.
2: The actual Reset value of POR is determined by the type of device Reset. See the notes following this
register and Section 4.6 Reset State of Registers for additional information.
3: See Table .
Note 1: Brown-out Reset is indicated when BOR is 0 and POR is 1 (assuming that both POR and BOR were set
to 1 by firmware immediately after POR).
2: It is recommended that the POR bit be set after a Power-on Reset has been detected so that subsequent
Power-on Resets may be detected.
2010 Microchip Technology Inc. Preliminary DS41412A-page 61
PIC18(L)F2X/4XK22
4.2 Master Clear (MCLR)
The MCLR pin provides a method for triggering an
external Reset of the device. A Reset is generated by
holding the pin low. These devices have a noise filter in
the MCLR Reset path which detects and ignores small
pulses. An internal weak pull-up is enabled when the
pin is configured as the MCLR input.
The MCLR pin is not driven low by any internal Resets,
including the WDT.
In PIC18(L)F2X/4XK22 devices, the MCLR input can
be disabled with the MCLRE Configuration bit. When
MCLR is disabled, the pin becomes a digital input. See
Section 10.6 PORTE Registers for more
information.
4.3 Power-on Reset (POR)
A Power-on Reset pulse is generated on-chip
whenever VDD rises above a certain threshold. This
allows the device to start in the initialized state when
VDD is adequate for operation.
To take advantage of the POR circuitry either leave the
pin floating, or tie the MCLR pin through a resistor to
VDD. This will eliminate external RC components
usually needed to create a Power-on Reset delay. A
minimum rise rate for VDD is specified. For a slow rise
time, see Figure 4-2.
When the device starts normal operation (i.e., exits the
Reset condition), device operating parameters (volt-
age, frequency, temperature, etc.) must be met to
ensure proper operation. If these conditions are not
met, the device must be held in Reset until the operat-
ing conditions are met.
POR events are captured by the POR bit of the RCON
register. The state of the bit is set to 0 whenever a
POR occurs; it does not change for any other Reset
event. POR is not reset to 1 by any hardware event.
To capture multiple events, the user must manually set
the bit to 1 by software following any POR.
FIGURE 4-2: EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
Note 1: External Power-on Reset circuit is required
only if the VDD power-up slope is too slow.
The diode D helps discharge the capacitor
quickly when VDD powers down.
2: 15 kO < R < 40 kO is recommended to make
sure that the voltage drop across R does not
violate the devices electrical specification.
3: R1 > 1 kO will limit any current flowing into
MCLR from external capacitor C, in the event
of MCLR/VPP pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
VDD
MCLR
VDD
PIC
MCU
PIC18(L)F2X/4XK22
DS41412A-page 62 Preliminary 2010 Microchip Technology Inc.
4.4 Brown-out Reset (BOR)
PIC18(L)F2X/4XK22 devices implement a BOR circuit
that provides the user with a number of configuration and
power-saving options. The BOR is controlled by the
BORV<1:0> and BOREN<1:0> bits of the CONFIG2L
Configuration register. There are a total of four BOR
configurations which are summarized in Table 4-1.
The BOR threshold is set by the BORV<1:0> bits. If
BOR is enabled (any values of BOREN<1:0>, except
00), any drop of VDD below VBOR for greater than
TBOR will reset the device. A Reset may or may not
occur if VDD falls below VBOR for less than TBOR. The
chip will remain in Brown-out Reset until VDD rises
above VBOR.
If the Power-up Timer is enabled, it will be invoked after
VDD rises above VBOR; it then will keep the chip in
Reset for an additional time delay, TPWRT. If VDD drops
below VBOR while the Power-up Timer is running, the
chip will go back into a Brown-out Reset and the
Power-up Timer will be initialized. Once VDD rises
above VBOR, the Power-up Timer will execute the
additional time delay.
BOR and the Power-on Timer (PWRT) are
independently configured. Enabling BOR Reset does
not automatically enable the PWRT.
The BOR circuit has an output that feeds into the POR
circuit and rearms the POR within the operating range
of the BOR. This early rearming of the POR ensures
that the device will remain in Reset in the event that VDD
falls below the operating range of the BOR circuitry.
4.4.1 DETECTING BOR
When BOR is enabled, the BOR bit always resets to 0
on any BOR or POR event. This makes it difficult to
determine if a BOR event has occurred just by reading
the state of BOR alone. A more reliable method is to
simultaneously check the state of both POR and BOR.
This assumes that the POR and BOR bits are reset to
1 by software immediately after any POR event. If
BOR is 0 while POR is 1, it can be reliably assumed
that a BOR event has occurred.
4.4.2 SOFTWARE ENABLED BOR
When BOREN<1:0> = 01, the BOR can be enabled or
disabled by the user in software. This is done with the
SBOREN control bit of the RCON register. Setting
SBOREN enables the BOR to function as previously
described. Clearing SBOREN disables the BOR
entirely. The SBOREN bit operates only in this mode;
otherwise it is read as 0.
Placing the BOR under software control gives the user
the additional flexibility of tailoring the application to the
environment without having to reprogram the device to
change BOR configuration. It also allows the user to
tailor device power consumption in software by
eliminating the incremental current that the BOR
consumes. While the BOR current is typically very small,
it may have some impact in low-power applications.
4.4.3 DISABLING BOR IN SLEEP MODE
When BOREN<1:0> = 10, the BOR remains under
hardware control and operates as previously
described. Whenever the device enters Sleep mode,
however, the BOR is automatically disabled. When the
device returns to any other operating mode, BOR is
automatically re-enabled.
This mode allows for applications to recover from
brown-out situations, while actively executing code,
when the device requires BOR protection the most. At
the same time, it saves additional power in Sleep mode
by eliminating the small incremental BOR current.
4.4.4 MINIMUM BOR ENABLE TIME
Enabling the BOR also enables the Fixed Voltage
Reference (FVR) when no other peripheral requiring the
FVR is active. The BOR becomes active only after the
FVR stabilizes. Therefore, to ensure BOR protection,
the FVR settling time must be considered when
enabling the BOR in software or when the BOR is
automatically enabled after waking from Sleep. If the
BOR is disabled, in software or by reentering Sleep
before the FVR stabilizes, the BOR circuit will not sense
a BOR condition. The FVRST bit of the VREFCON0
register can be used to determine FVR stability.
Note: Even when BOR is under software control,
the BOR Reset voltage level is still set by
the BORV<1:0> Configuration bits. It
cannot be changed by software.
2010 Microchip Technology Inc. Preliminary DS41412A-page 63
PIC18(L)F2X/4XK22
4.5 Device Reset Timers
PIC18(L)F2X/4XK22 devices incorporate three
separate on-chip timers that help regulate the Power-
on Reset process. Their main function is to ensure that
the device clock is stable before code is executed.
These timers are:
Power-up Timer (PWRT)
Oscillator Start-up Timer (OST)
PLL Lock Time-out
4.5.1 POWER-UP TIMER (PWRT)
The Power-up Timer (PWRT) of PIC18(L)F2X/4XK22
devices is an 11-bit counter which uses the
LFINTOSC source as the clock input. This yields an
approximate time interval of 2048 x 32 s = 65.6 ms.
While the PWRT is counting, the device is held in
Reset.
The power-up time delay depends on the LFINTOSC
clock and will vary from chip-to-chip due to temperature
and process variation.
The PWRT is enabled by clearing the PWRTEN
Configuration bit.
4.5.2 OSCILLATOR START-UP TIMER
(OST)
The Oscillator Start-up Timer (OST) provides a 1024
oscillator cycle (from OSC1 input) delay after the
PWRT delay is over. This ensures that the crystal
oscillator or resonator has started and stabilized.
The OST time-out is invoked only for XT, LP and HS
modes and only on Power-on Reset, or on exit from all
power-managed modes that stop the external oscillator.
4.5.3 PLL LOCK TIME-OUT
With the PLL enabled, the time-out sequence following a
Power-on Reset is slightly different from other oscillator
modes. A separate timer is used to provide a fixed time-
out that is sufficient for the PLL to lock to the main
oscillator frequency. This PLL lock time-out (TPLL) is
typically 2 ms and follows the oscillator start-up time-out.
4.5.4 TIME-OUT SEQUENCE
On power-up, the time-out sequence is as follows:
1. After the POR pulse has cleared, PWRT time-out
is invoked (if enabled).
2. Then, the OST is activated.
The total time-out will vary based on oscillator
configuration and the status of the PWRT. Figure 4-3,
Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7 all
depict time-out sequences on power-up, with the
Power-up Timer enabled and the device operating in
HS Oscillator mode. Figures 4-3 through 4-6 also
apply to devices operating in XT or LP modes. For
devices in RC mode and with the PWRT disabled, on
the other hand, there will be no time-out at all.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, all time-outs will expire, after
which, bringing MCLR high will allow program
execution to begin immediately (Figure 4-5). This is
useful for testing purposes or to synchronize more than
one PIC
TMR3H Holding Register for the Most Significant Byte of the 16-bit TMR3 Register
TMR3L Holding Register for the Least Significant Byte of the 16-bit TMR3 Register
TMR5H Holding Register for the Most Significant Byte of the 16-bit TMR5 Register
TMR5L Holding Register for the Least Significant Byte of the 16-bit TMR5 Register
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0
155
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 155
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0
155
TRISD
(1)
TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 155
TRISE WPUE3 TRISE2
(1)
TRISE1
(1)
TRISE0
(1)
155
TABLE 14-3: REGISTERS ASSOCIATED WITH CAPTURE (CONTINUED)
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
Legend: = Unimplemented location, read as 0. Shaded bits are not used by Capture mode.
Note 1: These registers/bits are available on PIC18(L)F4XK22 devices.
TABLE 14-4: CONFIGURATION REGISTERS ASSOCIATED WITH CAPTURE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
CONFIG3H MCLRE P2BMX T3CMX HFOFST CCP3MX PBADEN CCP2MX 356
Legend: = Unimplemented location, read as 0. Shaded bits are not used by Capture mode.
2010 Microchip Technology Inc. Preliminary DS41412A-page 183
PIC18(L)F2X/4XK22
14.2 Compare Mode
The Compare mode function described in this section
is identical for all CCP and ECCP modules available on
this device family.
Compare mode makes use of the 16-bit TimerX
resources, Timer1, Timer3 and Timer5. The 16-bit
value of the CCPRxH:CCPRxL register pair is
constantly compared against the 16-bit value of the
TMRxH:TMRxL register pair. When a match occurs,
one of the following events can occur:
Toggle the CCPx output
Set the CCPx output
Clear the CCPx output
Generate a Special Event Trigger
Generate a Software Interrupt
The action on the pin is based on the value of the
CCPxM<3:0> control bits of the CCPxCON register. At
the same time, the interrupt flag CCPxIF bit is set.
All Compare modes can generate an interrupt.
Figure 14-2 shows a simplified diagram of the
Compare operation.
FIGURE 14-2: COMPARE MODE
OPERATION BLOCK
DIAGRAM
14.2.1 CCP PIN CONFIGURATION
The user must configure the CCPx pin as an output by
clearing the associated TRIS bit.
Some CCPx outputs are multiplexed on a couple of
pins. Table 14-2 shows the CCP output pin
Multiplexing. Selection of the output pin is determined
by the CCPxMX bits in Configuration register 3H
(CONFIG3H). Refer to Register 24-4 for more details.
14.2.2 TimerX MODE RESOURCE
In Compare mode, 16-bit TimerX resource must be
running in either Timer mode or Synchronized Counter
mode. The compare operation may not work in
Asynchronous Counter mode.
See Section 12.0 Timer1/3/5 Module with Gate
Control for more information on configuring the 16-bit
TimerX resources.
14.2.3 SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen
(CCPxM<3:0> = 1010), the CCPx module does not
assert control of the CCPx pin (see the CCPxCON
register).
CCPRxH CCPRxL
TMRxH TMRxL
Comparator
Q S
R
Output
Logic
Special Event Trigger
Set CCPxIF Interrupt Flag
(PIR1/2/4)
Match
TRIS
CCPxM<3:0>
Mode Select
Output Enable
Pin
Special Event Trigger function on
ECCP1, ECCP2, ECCP3, CCP4 and CCP5 will:
- Reset TimerX TMRxH:TMRxL = 0x0000
- TimerX Interrupt Flag, (TMRxIF) is not set
Additional Function on
CCP5 will
- Set ADCON0<1>, GO/DONE bit to start an ADC
Conversion if ADCON<0>, ADON = 1.
CCPx
4
Note: Clearing the CCPxCON register will force
the CCPx compare output latch to the
default low level. This is not the PORT I/O
data latch.
Note: Clocking TimerX from the system clock
(FOSC) should not be used in Compare
mode. In order for Compare mode to
recognize the trigger event on the CCPx
pin, TImerX must be clocked from the
instruction clock (FOSC/4) or from an
external clock source.
PIC18(L)F2X/4XK22
DS41412A-page 184 Preliminary 2010 Microchip Technology Inc.
14.2.4 SPECIAL EVENT TRIGGER
When Special Event Trigger mode is selected
(CCPxM<3:0> = 1011), and a match of the
TMRxH:TMRxL and the CCPRxH:CCPRxL registers
occurs, all CCPx and ECCPx modules will immediately:
Set the CCP interrupt flag bit CCPxIF
CCP5 will start an ADC conversion, if the ADC is
enabled
On the next TimerX rising clock edge:
A Reset of TimerX register pair occurs
TMRxH:TMRxL = 0x0000,
This Special Event Trigger mode does not:
Assert control over the CCPx or ECCPx pins.
Set the TMRxIF interrupt bit when the
TMRxH:TMRxL register pair is reset. (TMRxIF
gets set on a TimerX overflow.)
If the value of the CCPRxH:CCPRxL registers are
modified when a match occurs, the user should be
aware that the automatic reset of TimerX occurs on the
next rising edge of the clock. Therefore, modifying the
CCPRxH:CCPRxL registers before this reset occurs
will allow the TimerX to continue without being reset,
inadvertently resulting in the next event being
advanced or delayed.
The Special Event Trigger mode allows the
CCPRxH:CCPRxL register pair to effectively provide a
16-bit programmable period register for TimerX.
14.2.5 COMPARE DURING SLEEP
The Compare mode is dependent upon the system
clock (FOSC) for proper operation. Since FOSC is shut
down during Sleep mode, the Compare mode will not
function properly during Sleep.
TABLE 14-5: REGISTERS ASSOCIATED WITH COMPARE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 203
CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0>
203
CCP3CON P3M<1:0> DC3B<1:0> CCP3M<3:0> 203
CCP4CON DC4B<1:0> CCP4M<3:0>
203
CCP5CON DC5B<1:0> CCP5M<3:0> 203
CCPR1H Capture/Compare/PWM Register 1 High Byte (MSB)
TMR3H Holding Register for the Most Significant Byte of the 16-bit TMR3 Register
TMR3L Holding Register for the Least Significant Byte of the 16-bit TMR3 Register
TMR5H Holding Register for the Most Significant Byte of the 16-bit TMR5 Register
TMR5L Holding Register for the Least Significant Byte of the 16-bit TMR5 Register
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 155
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 155
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 155
TRISD
(1)
TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 155
TRISE WPUE3 TRISE2
(1)
TRISE1
(1)
TRISE0
(1)
155
TABLE 14-5: REGISTERS ASSOCIATED WITH COMPARE (CONTINUED)
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
Legend: = Unimplemented location, read as 0. Shaded bits are not used by Capture mode.
Note 1: These registers/bits are available on PIC18(L)F4XK22 devices.
TABLE 14-6: CONFIGURATION REGISTERS ASSOCIATED WITH CAPTURE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
CONFIG3H MCLRE P2BMX T3CMX HFOFST CCP3MX PBADEN CCP2MX 356
Legend: = Unimplemented location, read as 0. Shaded bits are not used by Capture mode.
PIC18(L)F2X/4XK22
DS41412A-page 186 Preliminary 2010 Microchip Technology Inc.
14.3 PWM Overview
Pulse-Width Modulation (PWM) is a scheme that
provides power to a load by switching quickly between
fully on and fully off states. The PWM signal resembles
a square wave where the high portion of the signal is
considered the on state and the low portion of the signal
is considered the off state. The high portion, also known
as the pulse width, can vary in time and is defined in
steps. A larger number of steps applied, which
lengthens the pulse width, also supplies more power to
the load. Lowering the number of steps applied, which
shortens the pulse width, supplies less power. The
PWM period is defined as the duration of one complete
cycle or the total amount of on and off time combined.
PWM resolution defines the maximum number of steps
that can be present in a single PWM period. A higher
resolution allows for more precise control of the pulse
width time and in turn the power that is applied to the
load.
The term duty cycle describes the proportion of the on
time to the off time and is expressed in percentages,
where 0% is fully off and 100% is fully on. A lower duty
cycle corresponds to less power applied and a higher
duty cycle corresponds to more power applied.
Figure 14-3 shows a typical waveform of the PWM
signal.
14.3.1 STANDARD PWM OPERATION
The standard PWM function described in this section is
available and identical for CCP and ECCP modules.
The standard PWM mode generates a Pulse-Width
modulation (PWM) signal on the CCPx pin with up to 10
bits of resolution. The period, duty cycle, and resolution
are controlled by the following registers:
PRx registers
TxCON registers
CCPRxL registers
CCPxCON registers
Figure 14-4 shows a simplified block diagram of PWM
operation.
FIGURE 14-3: CCP PWM OUTPUT SIGNAL
FIGURE 14-4: SIMPLIFIED PWM BLOCK
DIAGRAM
14.3.2 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for standard PWM operation:
1. Disable the CCPx pin output driver by setting the
associated TRIS bit.
2. Select the 8-bit TimerX resource, (Timer2,
Timer4 or Timer6) to be used for PWM genera-
tion by setting the CxTSEL<1:0> bits in the
CCPTMRSx register.
(1)
3. Load the PRx register for the selected TimerX
with the PWM period value.
4. Configure the CCP module for the PWM mode
by loading the CCPxCON register with the
appropriate values.
5. Load the CCPRxL register and the DCxB<1:0>
bits of the CCPxCON register, with the PWM
duty cycle value.
Note 1: The corresponding TRIS bit must be
cleared to enable the PWM output on the
CCPx pin.
2: Clearing the CCPxCON register will
relinquish control of the CCPx pin.
Period
Pulse Width
TMRx = 0
TMRx = CCPRxH:CCPxCON<5:4>
TMRx = PRx
CCPRxL
CCPRxH
(2)
(Slave)
Comparator
TMRx
PRx
(1)
R Q
S
Duty Cycle Registers
CCPxCON<5:4>
Clear Timer,
toggle CCPx pin and
latch duty cycle
Note 1: The 8-bit timer TMRx register is concatenated
with the 2-bit internal system clock (FOSC), or
2 bits of the prescaler, to create the 10-bit time
base.
2: In PWM mode, CCPRxH is a read-only register.
TRIS
CCPx
Comparator
2010 Microchip Technology Inc. Preliminary DS41412A-page 187
PIC18(L)F2X/4XK22
6. Configure and start the 8-bit TimerX resource:
Clear the TMRxIF interrupt flag bit of the
PIR2 or PIR4 register. See Note 1 below.
Configure the TxCKPS bits of the TxCON
register with the Timer prescale value.
Enable the Timer by setting the TMRxON
bit of the TxCON register.
7. Enable PWM output pin:
Wait until the Timer overflows and the
TMRxIF bit of the PIR2 or PIR4 register is
set. See Note 1 below.
Enable the CCPx pin output driver by
clearing the associated TRIS bit.
14.3.3 PWM TIMER RESOURCE
The PWM standard mode makes use of one of the 8-bit
Timer2/4/6 timer resources to specify the PWM period.
Configuring the CxTSEL<1:0> bits in the CCPTMRS0
or CCPTMRS1 register selects which Timer2/4/6 timer
is used.
14.3.4 PWM PERIOD
The PWM period is specified by the PRx register of 8-bit
TimerX. The PWM period can be calculated using the
formula of Equation 14-1.
EQUATION 14-1: PWM PERIOD
When TMRx is equal to PRx, the following three events
occur on the next increment cycle:
TMRx is cleared
The CCPx pin is set. (Exception: If the PWM duty
cycle = 0%, the pin will not be set.)
The PWM duty cycle is latched from CCPRxL into
CCPRxH.
14.3.5 PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPRxL register and
DCxB<1:0> bits of the CCPxCON register. The
CCPRxL contains the eight MSbs and the DCxB<1:0>
bits of the CCPxCON register contain the two LSbs.
CCPRxL and DCxB<1:0> bits of the CCPxCON
register can be written to at any time. The duty cycle
value is not latched into CCPRxH until after the period
completes (i.e., a match between PRx and TMRx
registers occurs). While using the PWM, the CCPRxH
register is read-only.
Equation 14-2 is used to calculate the PWM pulse
width.
Equation 14-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 14-2: PULSE WIDTH
EQUATION 14-3: DUTY CYCLE RATIO
The CCPRxH register and a 2-bit internal latch are
used to double buffer the PWM duty cycle. This double
buffering is essential for glitchless PWM operation.
The 8-bit timer TMRx register is concatenated with either
the 2-bit internal system clock (FOSC), or 2 bits of the
prescaler, to create the 10-bit time base. The system
clock is used if the TimerX prescaler is set to 1:1.
When the 10-bit time base matches the CCPRxH and
2-bit latch, then the CCPx pin is cleared (see
Figure 14-4).
Note 1: In order to send a complete duty cycle
and period on the first PWM output, the
above steps must be included in the
setup sequence. If it is not critical to start
with a complete PWM signal on the first
output, then step 6 may be ignored.
Note: The Timer postscaler (see Section 13.0
Timer2/4/6 Module) is not used in the
determination of the PWM frequency.
PWM Period PRx ( ) 1 + | | 4 TOSC - - - =
(TMRx Prescale Value)
Note 1: TOSC = 1/FOSC
Pulse Width CCPRxL:CCPxCON<5:4> ( ) - =
TOSC - (TMRx Prescale Value)
Duty Cycle Ratio
CCPRxL:CCPxCON<5:4> ( )
4 PRx 1 + ( )
----------------------------------------------------------------------- =
PIC18(L)F2X/4XK22
DS41412A-page 188 Preliminary 2010 Microchip Technology Inc.
14.3.6 PWM RESOLUTION
The resolution determines the number of available duty
cycles for a given period. For example, a 10-bit resolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolution will result in 256 discrete duty cycles.
The maximum PWM resolution is 10 bits when PRx is
255. The resolution is a function of the PRx register
value as shown by Equation 14-4.
EQUATION 14-4: PWM RESOLUTION
14.3.7 OPERATION IN SLEEP MODE
In Sleep mode, the TMRx register will not increment
and the state of the module will not change. If the CCPx
pin is driving a value, it will continue to drive that value.
When the device wakes up, TMRx will continue from its
previous state.
14.3.8 CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 2.0 Oscillator Module (With Fail-Safe
Clock Monitor) for additional details.
14.3.9 EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
Note: If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
Resolution
4 PRx 1 + ( ) | | log
2 ( ) log
------------------------------------------ bits =
TABLE 14-7: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 32 MHz)
PWM Frequency 1.95 kHz 7.81 kHz 31.25 kHz 125 kHz 250 kHz 333.3 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PRx Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
TABLE 14-8: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PRx Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
TABLE 14-9: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PRx Value 0x65 0x65 0x65 0x19 0x0C 0x09
Maximum Resolution (bits) 8 8 8 6 5 5
2010 Microchip Technology Inc. Preliminary DS41412A-page 189
PIC18(L)F2X/4XK22
TABLE 14-11: CONFIGURATION REGISTERS ASSOCIATED WITH CAPTURE
TABLE 14-10: REGISTERS ASSOCIATED WITH STANDARD PWM
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0>
203
CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 203
CCP3CON P3M<1:0> DC3B<1:0> CCP3M<3:0>
203
CCP4CON DC4B<1:0> CCP4M<3:0> 203
CCP5CON DC5B<1:0> CCP5M<3:0>
203
CCPTMRS0 C3TSEL<1:0> C2TSEL<1:0> C1TSEL<1:0> 206
CCPTMRS1 C5TSEL<1:0> C4TSEL<1:0>
206
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 115
IPR1 ADIP RC1IP TX1IP SSP1IP CCP1IP TMR2IP TMR1IP
127
IPR2 OSCFIP C1IP C2IP EEIP BCL1IP HLVDIP TMR3IP CCP2IP 128
IPR4 CCP5IP CCP4IP CCP3IP
129
PIE1 ADIE RC1IE TX1IE SSP1IE CCP1IE TMR2IE TMR1IE 123
PIE2 OSCFIE C1IE C2IE EEIE BCL1IE HLVDIE TMR3IE CCP2IE
124
PIE4 CCP5IE CCP4IE CCP3IE 126
PIR1 ADIF RC1IF TX1IF SSP1IF CCP1IF TMR2IF TMR1IF 118
PIR2 OSCFIF C1IF C2IF EEIF BCL1IF HLVDIF TMR3IF CCP2IF 119
PIR4 CCP5IF CCP4IF CCP3IF 121
PMD0 UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD 56
PMD1 MSSP2MD MSSP1MD CCP5MD CCP4MD CCP3MD CCP2MD CCP1MD 57
PR2 Timer2 Period Register
PR4 Timer4 Period Register
PR6 Timer6 Period Register
microcon-
troller and user software. Two pins, SDAx and SCLx,
are exercised by the module to communicate with
other external I
2
C devices.
15.4.1 BYTE FORMAT
All communication in I
2
C is done in 9-bit segments. A
byte is sent from a master to a slave or vice-versa,
followed by an Acknowledge bit sent back. After the
8th falling edge of the SCLx line, the device outputting
data on the SDAx changes that pin to an input and
reads in an acknowledge value on the next clock
pulse.
The clock signal, SCLx, is provided by the master.
Data is valid to change while the SCLx signal is low,
and sampled on the rising edge of the clock. Changes
on the SDAx line while the SCLx line is high define
special conditions on the bus, explained below.
15.4.2 DEFINITION OF I
2
C TERMINOLOGY
There is language and terminology in the description
of I
2
C communication that have definitions specific to
I
2
C. That word usage is defined below and may be
used in the rest of this document without explana-
tion. This table was adapted from the Phillips I
2
C
specification.
15.4.3 SDAx AND SCLx PINS
Selection of any I
2
C mode with the SSPxEN bit set,
forces the SCLx and SDAx pins to be open-drain.
These pins should be set by the user to inputs by
setting the appropriate TRIS bits.
15.4.4 SDAx HOLD TIME
The hold time of the SDAx pin is selected by the
SDAHT bit of the SSPxCON3 register. Hold time is the
time SDAx is held valid after the falling edge of SCLx.
Setting the SDAHT bit selects a longer 300 ns mini-
mum hold time and may help on buses with large
capacitance.
TABLE 15-2: I
2
C BUS TERMS
Note: Data is tied to output zero when an I
2
C mode
is enabled.
TERM Description
Transmitter The device which shifts data out
onto the bus.
Receiver The device which shifts data in
from the bus.
Master The device that initiates a transfer,
generates clock signals and termi-
nates a transfer.
Slave The device addressed by the mas-
ter.
Multi-master A bus with more than one device
that can initiate data transfers.
Arbitration Procedure to ensure that only one
master at a time controls the bus.
Winning arbitration ensures that
the message is not corrupted.
Synchronization Procedure to synchronize the
clocks of two or more devices on
the bus.
Idle No master is controlling the bus,
and both SDAx and SCLx lines are
high.
Active Any time one or more master
devices are controlling the bus.
Addressed
Slave
Slave device that has received a
matching address and is actively
being clocked by a master.
Matching
Address
Address byte that is clocked into a
slave that matches the value
stored in SSPxADD.
Write Request Slave receives a matching
address with R/W bit clear, and is
ready to clock in data.
Read Request Master sends an address byte with
the R/W bit set, indicating that it
wishes to clock data out of the
Slave. This data is the next and all
following bytes until a Restart or
Stop.
Clock Stretching When a device on the bus holds
SCLx low to stall communication.
Bus Collision Any time the SDAx line is sampled
low by the module while it is out-
putting and expected high state.
2010 Microchip Technology Inc. Preliminary DS41412A-page 223
PIC18(L)F2X/4XK22
15.4.5 START CONDITION
The I
2
C specification defines a Start condition as a
transition of SDAx from a high-to -low state while SCLx
line is high. A Start condition is always generated by
the master and signifies the transition of the bus from
an Idle to an active state. Figure 15-10 shows wave
forms for Start and Stop conditions.
A bus collision can occur on a Start condition if the
module samples the SDAx line low before asserting it
low. This does not conform to the I
2
C specification that
states no bus collision can occur on a Start.
15.4.6 STOP CONDITION
A Stop condition is a transition of the SDAx line from a
low-to-high state while the SCLx line is high.
15.4.7 RESTART CONDITION
A Restart is valid any time that a Stop would be valid.
A master can issue a Restart if it wishes to hold the
bus after terminating the current transfer. A Restart
has the same effect on the slave that a Start would,
resetting all slave logic and preparing it to clock in an
address. The master may want to address the same or
another slave.
In 10-bit Addressing Slave mode a Restart is required
for the master to clock data out of the addressed slave.
Once a slave has been fully addressed, matching both
high and low address bytes, the master can issue a
Restart and the high address byte with the R/W bit set.
The slave logic will then hold the clock and prepare to
clock out data.
After a full match with R/W clear in 10-bit mode, a prior
match flag is set and maintained. Until a Stop
condition, a high address with R/W clear, or high
address match fails.
15.4.8 START/STOP CONDITION INTERRUPT
MASKING
The SCIE and PCIE bits of the SSPxCON3 register
can enable the generation of an interrupt in Slave
modes that do not typically support this function. Slave
modes where interrupt on Start and Stop detect are
already enabled, these bits will have no effect.
FIGURE 15-12: I
2
C START AND STOP CONDITIONS
FIGURE 15-13: I
2
C RESTART CONDITION
Note: At least one SCLx low time must appear
before a Stop is valid, therefore, if the SDAx
line goes low then high again while the SCLx
line stays high, only the Start condition is
detected.
SDAx
SCLx
P
Stop
Condition
S
Start
Condition
Change of
Data Allowed
Change of
Data Allowed
Restart
Condition
Sr
Change of
Data Allowed
Change of
Data Allowed
PIC18(L)F2X/4XK22
DS41412A-page 224 Preliminary 2010 Microchip Technology Inc.
15.4.9 ACKNOWLEDGE SEQUENCE
The 9th SCLx pulse for any transferred byte in I
2
C is
dedicated as an Acknowledge. It allows receiving
devices to respond back to the transmitter by pulling
the SDAx line low. The transmitter must release con-
trol of the line during this time to shift in the response.
The Acknowledge (ACK) is an active-low signal, pull-
ing the SDAx line low indicated to the transmitter that
the device has received the transmitted data and is
ready to receive more.
The result of an ACK is placed in the ACKSTAT bit of
the SSPxCON2 register.
Slave software, when the AHEN and DHEN bits are
set, allow the user to set the ACK value sent back to
the transmitter. The ACKDT bit of the SSPxCON2
register is set/cleared to determine the response.
Slave hardware will generate an ACK response if the
AHEN and DHEN bits of the SSPxCON3 register are
clear.
There are certain conditions where an ACK will not be
sent by the slave. If the BF bit of the SSPxSTAT
register or the SSPxOV bit of the SSPxCON1 register
are set when a byte is received.
When the module is addressed, after the 8th falling
edge of SCLx on the bus, the ACKTIM bit of the
SSPxCON3 register is set. The ACKTIM bit indicates
the acknowledge time of the active bus.
The ACKTIM Status bit is only active when the AHEN
bit or DHEN bit is enabled.
15.5 I
2
C SLAVE MODE OPERATION
The MSSPx Slave mode operates in one of four
modes selected in the SSPxM bits of SSPxCON1
register. The modes can be divided into 7-bit and 10-bit
Addressing mode. 10-bit Addressing modes operate
the same as 7-bit with some additional overhead for
handling the larger addresses.
Modes with Start and Stop bit interrupts operated the
same as the other modes with SSPxIF additionally
getting set upon detection of a Start, Restart, or Stop
condition.
15.5.1 SLAVE MODE ADDRESSES
The SSPxADD register (Register 15-6) contains the
Slave mode address. The first byte received after a
Start or Restart condition is compared against the
value stored in this register. If the byte matches, the
value is loaded into the SSPxBUF register and an
interrupt is generated. If the value does not match, the
module goes Idle and no indication is given to the
software that anything happened.
The SSPx Mask register (Register 15-5) affects the
address matching process. See Section 15.5.9
SSPx Mask Register for more information.
15.5.1.1 I
2
C Slave 7-bit Addressing Mode
In 7-bit Addressing mode, the LSb of the received data
byte is ignored when determining if there is an address
match.
15.5.1.2 I
2
C Slave 10-bit Addressing Mode
In 10-bit Addressing mode, the first received byte is
compared to the binary value of 1 1 1 1 0 A9 A8 0. A9
and A8 are the two MSb of the 10-bit address and
stored in bits 2 and 1 of the SSPxADD register.
After the acknowledge of the high byte the UA bit is set
and SCLx is held low until the user updates SSPxADD
with the low address. The low address byte is clocked
in and all 8 bits are compared to the low address value
in SSPxADD. Even if there is not an address match;
SSPxIF and UA are set, and SCLx is held low until
SSPxADD is updated to receive a high byte again.
When SSPxADD is updated the UA bit is cleared. This
ensures the module is ready to receive the high
address byte on the next communication.
A high and low address match as a write request is
required at the start of all 10-bit addressing
communication. A transmission can be initiated by
issuing a Restart once the slave is addressed, and
clocking in the high address with the R/W bit set. The
slave hardware will then acknowledge the read
request and prepare to clock out data. This is only
valid for a slave after it has received a complete high
and low address byte match.
2010 Microchip Technology Inc. Preliminary DS41412A-page 225
PIC18(L)F2X/4XK22
15.5.2 SLAVE RECEPTION
When the R/W bit of a matching received address byte
is clear, the R/W bit of the SSPxSTAT register is
cleared. The received address is loaded into the
SSPxBUF register and acknowledged.
When the overflow condition exists for a received
address, then not Acknowledge is given. An overflow
condition is defined as either bit BF of the SSPxSTAT
register is set, or bit SSPxOV of the SSPxCON1 regis-
ter is set. The BOEN bit of the SSPxCON3 register
modifies this operation. For more information see
Register 15-4.
An MSSPx interrupt is generated for each transferred
data byte. Flag bit, SSPxIF, must be cleared by
software.
When the SEN bit of the SSPxCON2 register is set,
SCLx will be held low (clock stretch) following each
received byte. The clock must be released by setting
the CKP bit of the SSPxCON1 register, except
sometimes in 10-bit mode. See Section 15.2.3 SPI
Master Mode for more detail.
15.5.2.1 7-bit Addressing Reception
This section describes a standard sequence of events
for the MSSPx module configured as an I
2
C slave in
7-bit Addressing mode. All decisions made by hard-
ware or software and their effect on reception.
Figure 15-13 and Figure 15-14 is used as a visual
reference for this description.
This is a step by step process of what typically must
be done to accomplish I
2
C communication.
1. Start bit detected.
2. S bit of SSPxSTAT is set; SSPxIF is set if
interrupt on Start detect is enabled.
3. Matching address with R/W bit clear is received.
4. The slave pulls SDAx low sending an ACK to the
master, and sets SSPxIF bit.
5. Software clears the SSPxIF bit.
6. Software reads received address from
SSPxBUF clearing the BF flag.
7. If SEN = 1; Slave software sets CKP bit to
release the SCLx line.
8. The master clocks out a data byte.
9. Slave drives SDAx low sending an ACK to the
master, and sets SSPxIF bit.
10. Software clears SSPxIF.
11. Software reads the received byte from
SSPxBUF clearing BF.
12. Steps 8-12 are repeated for all received bytes
from the master.
13. Master sends Stop condition, setting P bit of
SSPxSTAT, and the bus goes Idle.
15.5.2.2 7-bit Reception with AHEN and DHEN
Slave device reception with AHEN and DHEN set
operate the same as without these options with extra
interrupts and clock stretching added after the 8th fall-
ing edge of SCLx. These additional interrupts allow the
slave software to decide whether it wants to ACK the
receive address or data byte, rather than the hard-
ware. This functionality adds support for PMBus that
was not present on previous versions of this module.
This list describes the steps that need to be taken by
slave software to use these options for I
2
C
communication. Figure 15-15 displays a module using
both address and data holding. Figure 15-16 includes
the operation with the SEN bit of the SSPxCON2
register set.
1. S bit of SSPxSTAT is set; SSPxIF is set if
interrupt on Start detect is enabled.
2. Matching address with R/W bit clear is clocked
in. SSPxIF is set and CKP cleared after the 8th
falling edge of SCLx.
3. Slave clears the SSPxIF.
4. Slave can look at the ACKTIM bit of the
SSPxCON3 register to determine if the SSPxIF
was after or before the ACK.
5. Slave reads the address value from SSPxBUF,
clearing the BF flag.
6. Slave sets ACK value clocked out to the master
by setting ACKDT.
7. Slave releases the clock by setting CKP.
8. SSPxIF is set after an ACK, not after a NACK.
9. If SEN = 1 the slave hardware will stretch the
clock after the ACK.
10. Slave clears SSPxIF.
11. SSPxIF set and CKP cleared after 8th falling
edge of SCLx for a received data byte.
12. Slave looks at ACKTIM bit of SSPxCON3 to
determine the source of the interrupt.
13. Slave reads the received data from SSPxBUF
clearing BF.
14. Steps 7-14 are the same for each received data
byte.
15. Communication is ended by either the slave
sending an ACK = 1, or the master sending a
Stop condition. If a Stop is sent and Interrupt on
Stop detect is disabled, the slave will only know
by polling the P bit of the SSTSTAT register.
Note: SSPxIF is still set after the 9th falling edge of
SCLx even if there is no clock stretching and
BF has been cleared. Only if NACK is sent to
master is SSPxIF not set.
PIC18(L)F2X/4XK22
DS41412A-page 226 Preliminary 2010 Microchip Technology Inc.
FIGURE 15-14: I
2
C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0)
R
e
c
e
i
v
i
n
g
A
d
d
r
e
s
s
A
C
K
R
e
c
e
i
v
i
n
g
D
a
t
a
A
C
K
R
e
c
e
i
v
i
n
g
D
a
t
a
A
C
K
=
1
A
7
A
6
A
5
A
4
A
3
A
2
A
1
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
D
A
x
S
C
L
x
S
S
P
x
I
F
B
F
S
S
P
x
O
V
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
9
9
9
A
C
K
i
s
n
o
t
s
e
n
t
.
S
S
P
x
O
V
s
e
t
b
e
c
a
u
s
e
S
S
P
x
B
U
F
i
s
s
t
i
l
l
f
u
l
l
.
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
F
i
r
s
t
b
y
t
e
o
f
d
a
t
a
i
s
a
v
a
i
l
a
b
l
e
i
n
S
S
P
x
B
U
F
S
S
P
x
B
U
F
i
s
r
e
a
d
S
S
P
x
I
F
s
e
t
o
n
9
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
P
B
u
s
M
a
s
t
e
r
s
e
n
d
s
S
t
o
p
c
o
n
d
i
t
i
o
n
S
F
r
o
m
S
l
a
v
e
t
o
M
a
s
t
e
r
2010 Microchip Technology Inc. Preliminary DS41412A-page 227
PIC18(L)F2X/4XK22
FIGURE 15-15: I
2
C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
S
E
N
S
E
N
A
7
A
6
A
5
A
4
A
3
A
2
A
1
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
D
A
x
S
C
L
x
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P
S
S
P
x
I
F
s
e
t
o
n
9
t
h
S
C
L
x
i
s
n
o
t
h
e
l
d
C
K
P
i
s
w
r
i
t
t
e
n
t
o
1
i
n
s
o
f
t
w
a
r
e
,
C
K
P
i
s
w
r
i
t
t
e
n
t
o
i
n
s
o
f
t
w
a
r
e
,
A
C
K
l
o
w
b
e
c
a
u
s
e
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
r
e
l
e
a
s
i
n
g
S
C
L
x
A
C
K
i
s
n
o
t
s
e
n
t
.
B
u
s
M
a
s
t
e
r
s
e
n
d
s
C
K
P
S
S
P
x
O
V
B
F
S
S
P
x
I
F
S
S
P
x
O
V
s
e
t
b
e
c
a
u
s
e
S
S
P
x
B
U
F
i
s
s
t
i
l
l
f
u
l
l
.
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
F
i
r
s
t
b
y
t
e
o
f
d
a
t
a
i
s
a
v
a
i
l
a
b
l
e
i
n
S
S
P
x
B
U
F
A
C
K
=
1
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
S
S
P
x
B
U
F
i
s
r
e
a
d
C
l
o
c
k
i
s
h
e
l
d
l
o
w
u
n
t
i
l
C
K
P
i
s
s
e
t
t
o
r
e
l
e
a
s
i
n
g
S
C
L
x
S
t
o
p
c
o
n
d
i
t
i
o
n
S
A
C
K
A
C
K
R
e
c
e
i
v
e
A
d
d
r
e
s
s
R
e
c
e
i
v
e
D
a
t
a
R
e
c
e
i
v
e
D
a
t
a
R
/
W
=
0
PIC18(L)F2X/4XK22
DS41412A-page 228 Preliminary 2010 Microchip Technology Inc.
FIGURE 15-16: I
2
C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1)
R
e
c
e
i
v
i
n
g
A
d
d
r
e
s
s
R
e
c
e
i
v
i
n
g
D
a
t
a
R
e
c
e
i
v
e
d
D
a
t
a
P
A
7
A
6
A
5
A
4
A
3
A
2
A
1
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
D
A
x
S
C
L
x
B
F
C
K
PSP
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
M
a
s
t
e
r
s
e
n
d
s
S
t
o
p
c
o
n
d
i
t
i
o
n
S
D
a
t
a
i
s
r
e
a
d
f
r
o
m
S
S
P
x
B
U
F
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
S
S
P
x
I
F
i
s
s
e
t
o
n
9
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
,
a
f
t
e
r
A
C
K
C
K
P
s
e
t
b
y
s
o
f
t
w
a
r
e
,
S
C
L
x
i
s
r
e
l
e
a
s
e
d
S
l
a
v
e
s
o
f
t
w
a
r
e
9
A
C
K
T
I
M
c
l
e
a
r
e
d
b
y
h
a
r
d
w
a
r
e
i
n
9
t
h
r
i
s
i
n
g
e
d
g
e
o
f
S
C
L
x
s
e
t
s
A
C
K
D
T
t
o
n
o
t
A
C
K
W
h
e
n
D
H
E
N
=
1
:
C
K
P
i
s
c
l
e
a
r
e
d
b
y
h
a
r
d
w
a
r
e
o
n
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
S
l
a
v
e
s
o
f
t
w
a
r
e
c
l
e
a
r
s
A
C
K
D
T
t
o
A
C
K
t
h
e
r
e
c
e
i
v
e
d
b
y
t
e
A
C
K
T
I
M
s
e
t
b
y
h
a
r
d
w
a
r
e
o
n
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
W
h
e
n
A
H
E
N
=
1
:
C
K
P
i
s
c
l
e
a
r
e
d
b
y
h
a
r
d
w
a
r
e
a
n
d
S
C
L
x
i
s
s
t
r
e
t
c
h
e
d
A
d
d
r
e
s
s
i
s
r
e
a
d
f
r
o
m
S
S
B
U
F
A
C
K
T
I
M
s
e
t
b
y
h
a
r
d
w
a
r
e
o
n
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
A
C
K
M
a
s
t
e
r
R
e
l
e
a
s
e
s
S
D
A
x
t
o
s
l
a
v
e
f
o
r
A
C
K
s
e
q
u
e
n
c
e
N
o
i
n
t
e
r
r
u
p
t
a
f
t
e
r
n
o
t
A
C
K
f
r
o
m
S
l
a
v
e
A
C
K
=
1
A
C
K
A
C
K
D
T
A
C
K
T
I
M
S
S
P
x
I
F
I
f
A
H
E
N
=
1
:
S
S
P
x
I
F
i
s
s
e
t
2010 Microchip Technology Inc. Preliminary DS41412A-page 229
PIC18(L)F2X/4XK22
FIGURE 15-17: I
2
C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1)
R
e
c
e
i
v
i
n
g
A
d
d
r
e
s
s
R
e
c
e
i
v
e
D
a
t
a
R
e
c
e
i
v
e
D
a
t
a
A
7
A
6
A
5
A
4
A
3
A
2
A
1
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
D
A
x
S
C
L
x
S
S
P
x
I
F
B
F
A
C
K
D
T
C
K
PSP
A
C
K
S
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
A
C
K
A
C
K
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
A
C
K
T
I
M
i
s
c
l
e
a
r
e
d
b
y
h
a
r
d
w
a
r
e
S
S
P
x
B
U
F
c
a
n
b
e
S
e
t
b
y
s
o
f
t
w
a
r
e
,
r
e
a
d
a
n
y
t
i
m
e
b
e
f
o
r
e
n
e
x
t
b
y
t
e
i
s
l
o
a
d
e
d
r
e
l
e
a
s
e
S
C
L
x
o
n
9
t
h
r
i
s
i
n
g
e
d
g
e
o
f
S
C
L
x
R
e
c
e
i
v
e
d
a
d
d
r
e
s
s
i
s
l
o
a
d
e
d
i
n
t
o
S
S
P
x
B
U
F
S
l
a
v
e
s
o
f
t
w
a
r
e
c
l
e
a
r
s
A
C
K
D
T
t
o
A
C
K
R
/
W
=
0
M
a
s
t
e
r
r
e
l
e
a
s
e
s
S
D
A
x
t
o
s
l
a
v
e
f
o
r
A
C
K
s
e
q
u
e
n
c
e
t
h
e
r
e
c
e
i
v
e
d
b
y
t
e
W
h
e
n
A
H
E
N
=
1
;
o
n
t
h
e
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
o
f
a
n
a
d
d
r
e
s
s
b
y
t
e
,
C
K
P
i
s
c
l
e
a
r
e
d
A
C
K
T
I
M
i
s
s
e
t
b
y
h
a
r
d
w
a
r
e
o
n
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
W
h
e
n
D
H
E
N
=
1
;
o
n
t
h
e
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
o
f
a
r
e
c
e
i
v
e
d
d
a
t
a
b
y
t
e
,
C
K
P
i
s
c
l
e
a
r
e
d
R
e
c
e
i
v
e
d
d
a
t
a
i
s
a
v
a
i
l
a
b
l
e
o
n
S
S
P
x
B
U
F
S
l
a
v
e
s
e
n
d
s
n
o
t
A
C
K
C
K
P
i
s
n
o
t
c
l
e
a
r
e
d
i
f
n
o
t
A
C
K
P
M
a
s
t
e
r
s
e
n
d
s
S
t
o
p
c
o
n
d
i
t
i
o
n
N
o
i
n
t
e
r
r
u
p
t
a
f
t
e
r
i
f
n
o
t
A
C
K
f
r
o
m
S
l
a
v
e
A
C
K
T
I
M
PIC18(L)F2X/4XK22
DS41412A-page 230 Preliminary 2010 Microchip Technology Inc.
15.5.3 SLAVE TRANSMISSION
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSPxSTAT register is set. The received address is
loaded into the SSPxBUF register, and an ACK pulse is
sent by the slave on the ninth bit.
Following the ACK, slave hardware clears the CKP bit
and the SCLx pin is held low (see Section 15.5.6
Clock Stretching for more detail). By stretching the
clock, the master will be unable to assert another clock
pulse until the slave is done preparing the transmit
data.
The transmit data must be loaded into the SSPxBUF
register which also loads the SSPxSR register. Then
the SCLx pin should be released by setting the CKP bit
of the SSPxCON1 register. The eight data bits are
shifted out on the falling edge of the SCLx input. This
ensures that the SDAx signal is valid during the SCLx
high time.
The ACK pulse from the master-receiver is latched on
the rising edge of the ninth SCLx input pulse. This ACK
value is copied to the ACKSTAT bit of the SSPxCON2
register. If ACKSTAT is set (not ACK), then the data
transfer is complete. In this case, when the not ACK is
latched by the slave, the slave goes Idle and waits for
another occurrence of the Start bit. If the SDAx line was
low (ACK), the next transmit data must be loaded into
the SSPxBUF register. Again, the SCLx pin must be
released by setting bit CKP.
An MSSPx interrupt is generated for each data transfer
byte. The SSPxIF bit must be cleared by software and
the SSPxSTAT register is used to determine the status
of the byte. The SSPxIF bit is set on the falling edge of
the ninth clock pulse.
15.5.3.1 Slave Mode Bus Collision
A slave receives a Read request and begins shifting
data out on the SDAx line. If a bus collision is detected
and the SBCDE bit of the SSPxCON3 register is set,
the BCLxIF bit of the PIRx register is set. Once a bus
collision is detected, the slave goes Idle and waits to be
addressed again. User software can use the BCLxIF bit
to handle a slave bus collision.
15.5.3.2 7-bit Transmission
A master device can transmit a read request to a
slave, and then clock data out of the slave. The list
below outlines what software for a slave will need to do
to accomplish a standard transmission. Figure 15-17
can be used as a reference to this list.
1. Master sends a Start condition on SDAx and
SCLx.
2. S bit of SSPxSTAT is set; SSPxIF is set if inter-
rupt on Start detect is enabled.
3. Matching address with R/W bit set is received by
the slave setting SSPxIF bit.
4. Slave hardware generates an ACK and sets
SSPxIF.
5. SSPxIF bit is cleared by user.
6. Software reads the received address from
SSPxBUF, clearing BF.
7. R/W is set so CKP was automatically cleared
after the ACK.
8. The slave software loads the transmit data into
SSPxBUF.
9. CKP bit is set releasing SCLx, allowing the mas-
ter to clock the data out of the slave.
10. SSPxIF is set after the ACK response from the
master is loaded into the ACKSTAT register.
11. SSPxIF bit is cleared.
12. The slave software checks the ACKSTAT bit to
see if the master wants to clock out more data.
13. Steps 9-13 are repeated for each transmitted
byte.
14. If the master sends a not ACK; the clock is not
held, but SSPxIF is still set.
15. The master sends a Restart condition or a Stop.
16. The slave is no longer addressed.
Note 1: If the master ACKs the clock will be
stretched.
2: ACKSTAT is the only bit updated on the
rising edge of SCLx (9th) rather than the
falling.
2010 Microchip Technology Inc. Preliminary DS41412A-page 231
PIC18(L)F2X/4XK22
FIGURE 15-18: I
2
C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0)
R
e
c
e
i
v
i
n
g
A
d
d
r
e
s
s
A
u
t
o
m
a
t
i
c
T
r
a
n
s
m
i
t
t
i
n
g
D
a
t
a
A
u
t
o
m
a
t
i
c
T
r
a
n
s
m
i
t
t
i
n
g
D
a
t
a
A
7
A
6
A
5
A
4
A
3
A
2
A
1
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
S
D
A
x
S
C
L
x
S
S
P
x
I
F
B
F
C
K
P
A
C
K
S
T
A
T
R
/
W
D
/
ASP
R
e
c
e
i
v
e
d
a
d
d
r
e
s
s
W
h
e
n
R
/
W
i
s
s
e
t
R
/
W
i
s
c
o
p
i
e
d
f
r
o
m
t
h
e
I
n
d
i
c
a
t
e
s
a
n
a
d
d
r
e
s
s
i
s
r
e
a
d
f
r
o
m
S
S
P
x
B
U
F
S
C
L
x
i
s
a
l
w
a
y
s
h
e
l
d
l
o
w
a
f
t
e
r
9
t
h
S
C
L
x
f
a
l
l
i
n
g
e
d
g
e
m
a
t
c
h
i
n
g
a
d
d
r
e
s
s
b
y
t
e
h
a
s
b
e
e
n
r
e
c
e
i
v
e
d
M
a
s
t
e
r
s
n
o
t
A
C
K
i
s
c
o
p
i
e
d
t
o
A
C
K
S
T
A
T
C
K
P
i
s
n
o
t
h
e
l
d
f
o
r
n
o
t
A
C
K
B
F
i
s
a
u
t
o
m
a
t
i
c
a
l
l
y
c
l
e
a
r
e
d
a
f
t
e
r
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
D
a
t
a
t
o
t
r
a
n
s
m
i
t
i
s
l
o
a
d
e
d
i
n
t
o
S
S
P
x
B
U
F
S
e
t
b
y
s
o
f
t
w
a
r
e
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
A
C
K
A
C
K
A
C
K
R
/
W
=
1
S
P
M
a
s
t
e
r
s
e
n
d
s
S
t
o
p
c
o
n
d
i
t
i
o
n
PIC18(L)F2X/4XK22
DS41412A-page 232 Preliminary 2010 Microchip Technology Inc.
15.5.3.3 7-bit Transmission with Address
Hold Enabled
Setting the AHEN bit of the SSPxCON3 register
enables additional clock stretching and interrupt
generation after the 8th falling edge of a received
matching address. Once a matching address has
been clocked in, CKP is cleared and the SSPxIF
interrupt is set.
Figure 15-18 displays a standard waveform of a 7-bit
Address Slave Transmission with AHEN enabled.
1. Bus starts Idle.
2. Master sends Start condition; the S bit of
SSPxSTAT is set; SSPxIF is set if interrupt on
Start detect is enabled.
3. Master sends matching address with R/W bit
set. After the 8th falling edge of the SCLx line the
CKP bit is cleared and SSPxIF interrupt is
generated.
4. Slave software clears SSPxIF.
5. Slave software reads ACKTIM bit of SSPxCON3
register, and R/W and D/A of the SSPxSTAT
register to determine the source of the interrupt.
6. Slave reads the address value from the SSPxBUF
register clearing the BF bit.
7. Slave software decides from this information if it
wishes to ACK or not ACK and sets ACKDT bit
of the SSPxCON2 register accordingly.
8. Slave sets the CKP bit releasing SCLx.
9. Master clocks in the ACK value from the slave.
10. Slave hardware automatically clears the CKP bit
and sets SSPxIF after the ACK if the R/W bit is
set.
11. Slave software clears SSPxIF.
12. Slave loads value to transmit to the master into
SSPxBUF setting the BF bit.
13. Slave sets CKP bit releasing the clock.
14. Master clocks out the data from the slave and
sends an ACK value on the 9th SCLx pulse.
15. Slave hardware copies the ACK value into the
ACKSTAT bit of the SSPxCON2 register.
16. Steps 10-15 are repeated for each byte
transmitted to the master from the slave.
17. If the master sends a not ACK the slave
releases the bus allowing the master to send a
Stop and end the communication.
Note: SSPxBUF cannot be loaded until after the
ACK.
Note: Master must send a not ACK on the last byte
to ensure that the slave releases the SCLx
line to receive a Stop.
2010 Microchip Technology Inc. Preliminary DS41412A-page 233
PIC18(L)F2X/4XK22
FIGURE 15-19: I
2
C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1)
R
e
c
e
i
v
i
n
g
A
d
d
r
e
s
s
A
u
t
o
m
a
t
i
c
T
r
a
n
s
m
i
t
t
i
n
g
D
a
t
a
A
u
t
o
m
a
t
i
c
T
r
a
n
s
m
i
t
t
i
n
g
D
a
t
a
A
7
A
6
A
5
A
4
A
3
A
2
A
1
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
S
D
A
x
S
C
L
x
S
S
P
x
I
F
B
F
A
C
K
D
T
A
C
K
S
T
A
T
C
K
P
R
/
W
D
/
A
R
e
c
e
i
v
e
d
a
d
d
r
e
s
s
i
s
r
e
a
d
f
r
o
m
S
S
P
x
B
U
F
B
F
i
s
a
u
t
o
m
a
t
i
c
a
l
l
y
c
l
e
a
r
e
d
a
f
t
e
r
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
D
a
t
a
t
o
t
r
a
n
s
m
i
t
i
s
l
o
a
d
e
d
i
n
t
o
S
S
P
x
B
U
F
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
S
l
a
v
e
c
l
e
a
r
s
A
C
K
D
T
t
o
A
C
K
a
d
d
r
e
s
s
M
a
s
t
e
r
s
A
C
K
r
e
s
p
o
n
s
e
i
s
c
o
p
i
e
d
t
o
S
S
P
x
S
T
A
T
C
K
P
n
o
t
c
l
e
a
r
e
d
a
f
t
e
r
n
o
t
A
C
K
S
e
t
b
y
s
o
f
t
w
a
r
e
,
r
e
l
e
a
s
e
s
S
C
L
x
A
C
K
T
I
M
i
s
c
l
e
a
r
e
d
o
n
9
t
h
r
i
s
i
n
g
e
d
g
e
o
f
S
C
L
x
A
C
K
T
I
M
i
s
s
e
t
o
n
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
W
h
e
n
A
H
E
N
=
1
;
C
K
P
i
s
c
l
e
a
r
e
d
b
y
h
a
r
d
w
a
r
e
a
f
t
e
r
r
e
c
e
i
v
i
n
g
m
a
t
c
h
i
n
g
a
d
d
r
e
s
s
.
W
h
e
n
R
/
W
=
1
;
C
K
P
i
s
a
l
w
a
y
s
c
l
e
a
r
e
d
a
f
t
e
r
A
C
K
S
P
M
a
s
t
e
r
s
e
n
d
s
S
t
o
p
c
o
n
d
i
t
i
o
n
A
C
K
R
/
W
=
1
M
a
s
t
e
r
r
e
l
e
a
s
e
s
S
D
A
x
t
o
s
l
a
v
e
f
o
r
A
C
K
s
e
q
u
e
n
c
e
A
C
K
A
C
K
A
C
K
T
I
M
PIC18(L)F2X/4XK22
DS41412A-page 234 Preliminary 2010 Microchip Technology Inc.
15.5.4 SLAVE MODE 10-BIT ADDRESS
RECEPTION
This section describes a standard sequence of events
for the MSSPx module configured as an I
2
C slave in
10-bit Addressing mode.
Figure 15-19 and is used as a visual reference for this
description.
This is a step by step process of what must be done by
slave software to accomplish I
2
C communication.
1. Bus starts Idle.
2. Master sends Start condition; S bit of SSPxSTAT
is set; SSPxIF is set if interrupt on Start detect is
enabled.
3. Master sends matching high address with R/W
bit clear; UA bit of the SSPxSTAT register is set.
4. Slave sends ACK and SSPxIF is set.
5. Software clears the SSPxIF bit.
6. Software reads received address from SSPxBUF
clearing the BF flag.
7. Slave loads low address into SSPxADD,
releasing SCLx.
8. Master sends matching low address byte to the
slave; UA bit is set.
9. Slave sends ACK and SSPxIF is set.
10. Slave clears SSPxIF.
11. Slave reads the received matching address
from SSPxBUF clearing BF.
12. Slave loads high address into SSPxADD.
13. Master clocks a data byte to the slave and clocks
out the slaves ACK on the 9th SCLx pulse;
SSPxIF is set.
14. If SEN bit of SSPxCON2 is set, CKP is cleared
by hardware and the clock is stretched.
15. Slave clears SSPxIF.
16. Slave reads the received byte from SSPxBUF
clearing BF.
17. If SEN is set the slave sets CKP to release the
SCLx.
18. Steps 13-17 repeat for each received byte.
19. Master sends Stop to end the transmission.
15.5.5 10-BIT ADDRESSING WITH ADDRESS OR
DATA HOLD
Reception using 10-bit addressing with AHEN or
DHEN set is the same as with 7-bit modes. The only
difference is the need to update the SSPxADD register
using the UA bit. All functionality, specifically when the
CKP bit is cleared and SCLx line is held low are the
same. Figure 15-20 can be used as a reference of a
slave in 10-bit addressing with AHEN set.
Figure 15-21 shows a standard waveform for a slave
transmitter in 10-bit Addressing mode.
Note: Updates to the SSPxADD register are not
allowed until after the ACK sequence.
Note: If the low address does not match, SSPxIF
and UA are still set so that the slave software
can set SSPxADD back to the high address.
BF is not set because there is no match.
CKP is unaffected.
2010 Microchip Technology Inc. Preliminary DS41412A-page 235
PIC18(L)F2X/4XK22
FIGURE 15-20: I
2
C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
S
S
P
x
I
F
R
e
c
e
i
v
e
F
i
r
s
t
A
d
d
r
e
s
s
B
y
t
e
A
C
K
R
e
c
e
i
v
e
S
e
c
o
n
d
A
d
d
r
e
s
s
B
y
t
eA
C
K
R
e
c
e
i
v
e
D
a
t
a
A
C
K
R
e
c
e
i
v
e
D
a
t
a
A
C
K
1
1
1
1
0
A
9
A
8
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
D
A
x
S
C
L
x
U
A
C
K
P
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P
M
a
s
t
e
r
s
e
n
d
s
S
t
o
p
c
o
n
d
i
t
i
o
n
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
R
e
c
e
i
v
e
a
d
d
r
e
s
s
i
s
S
o
f
t
w
a
r
e
u
p
d
a
t
e
s
S
S
P
x
A
D
D
D
a
t
a
i
s
r
e
a
d
S
C
L
x
i
s
h
e
l
d
l
o
w
S
e
t
b
y
s
o
f
t
w
a
r
e
,
w
h
i
l
e
C
K
P
=
0
f
r
o
m
S
S
P
x
B
U
F
r
e
l
e
a
s
i
n
g
S
C
L
x
W
h
e
n
S
E
N
=
1
;
C
K
P
i
s
c
l
e
a
r
e
d
a
f
t
e
r
9
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
r
e
c
e
i
v
e
d
b
y
t
e
r
e
a
d
f
r
o
m
S
S
P
x
B
U
F
a
n
d
r
e
l
e
a
s
e
s
S
C
L
x
W
h
e
n
U
A
=
1
;
I
f
a
d
d
r
e
s
s
m
a
t
c
h
e
s
S
e
t
b
y
h
a
r
d
w
a
r
e
o
n
9
t
h
f
a
l
l
i
n
g
e
d
g
e
S
S
P
x
A
D
D
i
t
i
s
l
o
a
d
e
d
i
n
t
o
S
S
P
x
B
U
F
S
C
L
x
i
s
h
e
l
d
l
o
w
S
B
F
PIC18(L)F2X/4XK22
DS41412A-page 236 Preliminary 2010 Microchip Technology Inc.
FIGURE 15-21: I
2
C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0)
R
e
c
e
i
v
e
F
i
r
s
t
A
d
d
r
e
s
s
B
y
t
e
U
A
R
e
c
e
i
v
e
S
e
c
o
n
d
A
d
d
r
e
s
s
B
y
t
e
U
A
R
e
c
e
i
v
e
D
a
t
a
A
C
K
R
e
c
e
i
v
e
D
a
t
a
1
1
1
1
0
A
9
A
8
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
D
7
D
6
D
5
S
D
A
x
S
C
L
x
S
S
P
x
I
F
B
F
A
C
K
D
T
U
A
C
K
P
A
C
K
T
I
M
1
2
3
4
5
6
7
8
9
S
A
C
K
A
C
K
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
S
S
P
x
B
U
F
i
s
r
e
a
d
f
r
o
m
R
e
c
e
i
v
e
d
d
a
t
a
S
S
P
x
B
U
F
c
a
n
b
e
r
e
a
d
a
n
y
t
i
m
e
b
e
f
o
r
e
t
h
e
n
e
x
t
r
e
c
e
i
v
e
d
b
y
t
e
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
n
o
t
a
l
l
o
w
e
d
u
n
t
i
l
9
t
h
U
p
d
a
t
e
t
o
S
S
P
x
A
D
D
i
s
S
e
t
C
K
P
w
i
t
h
s
o
f
t
w
a
r
e
r
e
l
e
a
s
e
s
S
C
L
x
S
C
L
x
c
l
e
a
r
s
U
A
a
n
d
r
e
l
e
a
s
e
s
U
p
d
a
t
e
o
f
S
S
P
x
A
D
D
,
S
e
t
b
y
h
a
r
d
w
a
r
e
o
n
9
t
h
f
a
l
l
i
n
g
e
d
g
e
S
l
a
v
e
s
o
f
t
w
a
r
e
c
l
e
a
r
s
A
C
K
D
T
t
o
A
C
K
t
h
e
r
e
c
e
i
v
e
d
b
y
t
e
I
f
w
h
e
n
A
H
E
N
=
1
;
o
n
t
h
e
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
o
f
a
n
a
d
d
r
e
s
s
b
y
t
e
,
C
K
P
i
s
c
l
e
a
r
e
d
A
C
K
T
I
M
i
s
s
e
t
b
y
h
a
r
d
w
a
r
e
o
n
8
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
R
/
W
=
0
2010 Microchip Technology Inc. Preliminary DS41412A-page 237
PIC18(L)F2X/4XK22
FIGURE 15-22: I
2
C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0)
R
e
c
e
i
v
i
n
g
A
d
d
r
e
s
s
A
C
K
R
e
c
e
i
v
i
n
g
S
e
c
o
n
d
A
d
d
r
e
s
s
B
y
t
e
S
r
R
e
c
e
i
v
e
F
i
r
s
t
A
d
d
r
e
s
s
B
y
t
e
A
C
K
T
r
a
n
s
m
i
t
t
i
n
g
D
a
t
a
B
y
t
e
1
1
1
1
0
A
9
A
8
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
1
1
1
1
0
A
9
A
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
D
A
x
S
C
L
x
S
S
P
x
I
F
B
F
U
A
C
K
P
R
/
W
D
/
A
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
A
C
K
=
1
P
M
a
s
t
e
r
s
e
n
d
s
S
t
o
p
c
o
n
d
i
t
i
o
n
M
a
s
t
e
r
s
e
n
d
s
n
o
t
A
C
K
M
a
s
t
e
r
s
e
n
d
s
R
e
s
t
a
r
t
e
v
e
n
t
A
C
K
R
/
W
=
0
S
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
A
f
t
e
r
S
S
P
x
A
D
D
i
s
u
p
d
a
t
e
d
,
U
A
i
s
c
l
e
a
r
e
d
a
n
d
S
C
L
x
i
s
r
e
l
e
a
s
e
d
H
i
g
h
a
d
d
r
e
s
s
i
s
l
o
a
d
e
d
R
e
c
e
i
v
e
d
a
d
d
r
e
s
s
i
s
D
a
t
a
t
o
t
r
a
n
s
m
i
t
i
s
S
e
t
b
y
s
o
f
t
w
a
r
e
I
n
d
i
c
a
t
e
s
a
n
a
d
d
r
e
s
s
W
h
e
n
R
/
W
=
1
;
R
/
W
i
s
c
o
p
i
e
d
f
r
o
m
t
h
e
S
e
t
b
y
h
a
r
d
w
a
r
e
U
A
i
n
d
i
c
a
t
e
s
S
S
P
x
A
D
D
S
S
P
x
B
U
F
l
o
a
d
e
d
w
i
t
h
r
e
c
e
i
v
e
d
a
d
d
r
e
s
s
m
u
s
t
b
e
u
p
d
a
t
e
d
h
a
s
b
e
e
n
r
e
c
e
i
v
e
d
l
o
a
d
e
d
i
n
t
o
S
S
P
x
B
U
F
r
e
l
e
a
s
e
s
S
C
L
x
M
a
s
t
e
r
s
n
o
t
A
C
K
i
s
c
o
p
i
e
d
m
a
t
c
h
i
n
g
a
d
d
r
e
s
s
b
y
t
e
C
K
P
i
s
c
l
e
a
r
e
d
o
n
9
t
h
f
a
l
l
i
n
g
e
d
g
e
o
f
S
C
L
x
r
e
a
d
f
r
o
m
S
S
P
x
B
U
F
b
a
c
k
i
n
t
o
S
S
P
x
A
D
D
A
C
K
S
T
A
T
S
e
t
b
y
h
a
r
d
w
a
r
e
PIC18(L)F2X/4XK22
DS41412A-page 238 Preliminary 2010 Microchip Technology Inc.
15.5.6 CLOCK STRETCHING
Clock stretching occurs when a device on the bus
holds the SCLx line low effectively pausing communi-
cation. The slave may stretch the clock to allow more
time to handle data or prepare a response for the mas-
ter device. A master device is not concerned with
stretching as anytime it is active on the bus and not
transferring data it is stretching. Any stretching done
by a slave is invisible to the master software and han-
dled by the hardware that generates SCLx.
The CKP bit of the SSPxCON1 register is used to
control stretching in software. Any time the CKP bit is
cleared, the module will wait for the SCLx line to go
low and then hold it. Setting CKP will release SCLx
and allow more communication.
15.5.6.1 Normal Clock Stretching
Following an ACK if the R/W bit of SSPxSTAT is set, a
read request, the slave hardware will clear CKP. This
allows the slave time to update SSPxBUF with data to
transfer to the master. If the SEN bit of SSPxCON2 is
set, the slave hardware will always stretch the clock
after the ACK sequence. Once the slave is ready; CKP
is set by software and communication resumes.
15.5.6.2 10-bit Addressing Mode
In 10-bit Addressing mode, when the UA bit is set, the
clock is always stretched. This is the only time the
SCLx is stretched without CKP being cleared. SCLx is
released immediately after a write to SSPxADD.
15.5.6.3 Byte NACKing
When the AHEN bit of SSPxCON3 is set; CKP is
cleared by hardware after the 8th falling edge of SCLx
for a received matching address byte. When the
DHEN bit of SSPxCON3 is set; CKP is cleared after
the 8th falling edge of SCLx for received data.
Stretching after the 8th falling edge of SCLx allows the
slave to look at the received address or data and
decide if it wants to ACK the received data.
15.5.7 CLOCK SYNCHRONIZATION AND
THE CKP BIT
Any time the CKP bit is cleared, the module will wait
for the SCLx line to go low and then hold it. However,
clearing the CKP bit will not assert the SCLx output
low until the SCLx output is already sampled low.
Therefore, the CKP bit will not assert the SCLx line
until an external I
2
C master device has already
asserted the SCLx line. The SCLx output will remain
low until the CKP bit is set and all other devices on the
I
2
C bus have released SCLx. This ensures that a write
to the CKP bit will not violate the minimum high time
requirement for SCLx (see Figure 15-22).
FIGURE 15-23: CLOCK SYNCHRONIZATION TIMING
Note 1: The BF bit has no effect on whether the
clock will be stretched or not. This is
different than previous versions of the
module that would not stretch the clock,
clear CKP, if SSPxBUF was read before
the 9th falling edge of SCLx.
2: Previous versions of the module did not
stretch the clock for a transmission if
SSPxBUF was loaded before the 9th fall-
ing edge of SCLx. It is now always cleared
for read requests.
Note: Previous versions of the module did not
stretch the clock if the second address byte
did not match.
SDAx
SCLx
DX 1 DX
WR
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SSPxCON1
CKP
Master device
releases clock
Master device
asserts clock
2010 Microchip Technology Inc. Preliminary DS41412A-page 239
PIC18(L)F2X/4XK22
15.5.8 GENERAL CALL ADDRESS SUPPORT
The addressing procedure for the I
2
C bus is such that
the first byte after the Start condition usually
determines which device will be the slave addressed
by the master device. The exception is the general call
address which can address all devices. When this
address is used, all devices should, in theory, respond
with an acknowledge.
The general call address is a reserved address in the
I
2
C protocol, defined as address 0x00. When the
GCEN bit of the SSPxCON2 register is set, the slave
module will automatically ACK the reception of this
address regardless of the value stored in SSPxADD.
After the slave clocks in an address of all zeros with the
R/W bit clear, an interrupt is generated and slave soft-
ware can read SSPxBUF and respond. Figure 15-23
shows a general call reception sequence.
In 10-bit Address mode, the UA bit will not be set on
the reception of the general call address. The slave
will prepare to receive the second byte as data, just as
it would in 7-bit mode.
If the AHEN bit of the SSPxCON3 register is set, just
as with any other address reception, the slave
hardware will stretch the clock after the 8th falling
edge of SCLx. The slave must then set its ACKDT
value and release the clock with communication
progressing as it would normally.
FIGURE 15-24: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE
15.5.9 SSPx MASK REGISTER
An SSPx Mask (SSPxMSK) register (Register 15-5) is
available in I
2
C Slave mode as a mask for the value
held in the SSPxSR register during an address
comparison operation. A zero (0) bit in the SSPxMSK
register has the effect of making the corresponding bit
of the received address a dont care.
This register is reset to all 1s upon any Reset
condition and, therefore, has no effect on standard
SSPx operation until written with a mask value.
The SSPx Mask register is active during:
7-bit Address mode: address compare of A<7:1>.
10-bit Address mode: address compare of A<7:0>
only. The SSPx mask has no effect during the
reception of the first (high) byte of the address.
SDAx
SCLx
S
SSPxIF
BF (SSPxSTAT<0>)
Cleared by software
SSPxBUF is read
R/W = 0
ACK
General Call Address
Address is compared to General Call Address
Receiving Data ACK
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
D7 D6 D5 D4 D3 D2 D1 D0
after ACK, set interrupt
GCEN (SSPxCON2<7>)
1
PIC18(L)F2X/4XK22
DS41412A-page 240 Preliminary 2010 Microchip Technology Inc.
15.6 I
2
C MASTER MODE
Master mode is enabled by setting and clearing the
appropriate SSPxM bits in the SSPxCON1 register and
by setting the SSPxEN bit. In Master mode, the SCLx
and SDAx lines are set as inputs and are manipulated
by the MSSPx hardware.
Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop con-
ditions. The Stop (P) and Start (S) bits are cleared from
a Reset or when the MSSPx module is disabled. Con-
trol of the I
2
C bus may be taken when the P bit is set,
or the bus is Idle.
In Firmware Controlled Master mode, user code
conducts all I
2
C bus operations based on Start and
Stop bit condition detection. Start and Stop condition
detection is the only active circuitry in this mode. All
other communication is done by the user software
directly manipulating the SDAx and SCLx lines.
The following events will cause the SSPx Interrupt Flag
bit, SSPxIF, to be set (SSPx interrupt, if enabled):
Start condition detected
Stop condition detected
Data transfer byte transmitted/received
Acknowledge transmitted/received
Repeated Start generated
15.6.1 I
2
C MASTER MODE OPERATION
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I
2
C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDAx, while SCLx outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the Read/Write (R/W) bit.
In this case, the R/W bit will be logic 0. Serial data is
transmitted 8 bits at a time. After each byte is transmit-
ted, an Acknowledge bit is received. Start and Stop
conditions are output to indicate the beginning and the
end of a serial transfer.
In Master Receive mode, the first byte transmitted con-
tains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic 1. Thus, the first byte transmitted is a 7-bit slave
address followed by a 1 to indicate the receive bit.
Serial data is received via SDAx, while SCLx outputs
the serial clock. Serial data is received 8 bits at a time.
After each byte is received, an Acknowledge bit is
transmitted. Start and Stop conditions indicate the
beginning and end of transmission.
A Baud Rate Generator is used to set the clock
frequency output on SCLx. See Section 15.7 Baud
Rate Generator for more detail.
Note 1: The MSSPx module, when configured in
I
2
C Master mode, does not allow queue-
ing of events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPxBUF register
to initiate transmission before the Start
condition is complete. In this case, the
SSPxBUF will not be written to and the
WCOL bit will be set, indicating that a write
to the SSPxBUF did not occur
2: When in Master mode, Start/Stop
detection is masked and an interrupt is
generated when the SEN/PEN bit is
cleared and the generation is complete.
2010 Microchip Technology Inc. Preliminary DS41412A-page 241
PIC18(L)F2X/4XK22
15.6.2 CLOCK ARBITRATION
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition,
releases the SCLx pin (SCLx allowed to float high).
When the SCLx pin is allowed to float high, the Baud
Rate Generator (BRG) is suspended from counting
until the SCLx pin is actually sampled high. When the
SCLx pin is sampled high, the Baud Rate Generator is
reloaded with the contents of SSPxADD<7:0> and
begins counting. This ensures that the SCLx high time
will always be at least one BRG rollover count in the
event that the clock is held low by an external device
(Figure 15-25).
FIGURE 15-25: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
15.6.3 WCOL STATUS FLAG
If the user writes the SSPxBUF when a Start, Restart,
Stop, Receive or Transmit sequence is in progress, the
WCOL is set and the contents of the buffer are
unchanged (the write does not occur). Any time the
WCOL bit is set it indicates that an action on SSPxBUF
was attempted while the module was not Idle.
SDAx
SCLx
SCLx deasserted but slave holds
DX 1 DX
BRG
SCLx is sampled high, reload takes
place and BRG starts its count
03h 02h 01h 00h (hold off) 03h 02h
Reload
BRG
Value
SCLx low (clock arbitration)
SCLx allowed to transition high
BRG decrements on
Q2 and Q4 cycles
Note: Because queueing of events is not
allowed, writing to the lower 5 bits of
SSPxCON2 is disabled until the Start
condition is complete.
PIC18(L)F2X/4XK22
DS41412A-page 242 Preliminary 2010 Microchip Technology Inc.
15.6.4 I
2
C MASTER MODE START
CONDITION TIMING
To initiate a Start condition, the user sets the Start
Enable bit, SEN, of the SSPxCON2 register. If the
SDAx and SCLx pins are sampled high, the Baud Rate
Generator is reloaded with the contents of
SSPxADD<7:0> and starts its count. If SCLx and
SDAx are both sampled high when the Baud Rate
Generator times out (TBRG), the SDAx pin is driven
low. The action of the SDAx being driven low while
SCLx is high is the Start condition and causes the S bit
of the SSPxSTAT1 register to be set. Following this,
the Baud Rate Generator is reloaded with the contents
of SSPxADD<7:0> and resumes its count. When the
Baud Rate Generator times out (TBRG), the SEN bit of
the SSPxCON2 register will be automatically cleared
by hardware; the Baud Rate Generator is suspended,
leaving the SDAx line held low and the Start condition
is complete.
FIGURE 15-26: FIRST START BIT TIMING
Note 1: If at the beginning of the Start condition,
the SDAx and SCLx pins are already sam-
pled low, or if during the Start condition,
the SCLx line is sampled low before the
SDAx line is driven low, a bus collision
occurs, the Bus Collision Interrupt Flag,
BCLxIF, is set, the Start condition is
aborted and the I
2
C module is reset into its
Idle state.
2: The Philips I
2
C Specification states that a
bus collision cannot occur on a Start.
SDAx
SCLx
S
TBRG
1st bit 2nd bit
TBRG
SDAx = 1,
At completion of Start bit,
SCLx = 1
Write to SSPxBUF occurs here
TBRG
hardware clears SEN bit
TBRG
Write to SEN bit occurs here Set S bit (SSPxSTAT<3>)
and sets SSPxIF bit
2010 Microchip Technology Inc. Preliminary DS41412A-page 243
PIC18(L)F2X/4XK22
15.6.5 I
2
C MASTER MODE REPEATED
START CONDITION TIMING
A Repeated Start condition occurs when the RSEN bit
of the SSPxCON2 register is programmed high and the
master state machine is no longer active. When the
RSEN bit is set, the SCLx pin is asserted low. When the
SCLx pin is sampled low, the Baud Rate Generator is
loaded and begins counting. The SDAx pin is released
(brought high) for one Baud Rate Generator count
(TBRG). When the Baud Rate Generator times out, if
SDAx is sampled high, the SCLx pin will be deasserted
(brought high). When SCLx is sampled high, the Baud
Rate Generator is reloaded and begins counting. SDAx
and SCLx must be sampled high for one TBRG. This
action is then followed by assertion of the SDAx pin
(SDAx = 0) for one TBRG while SCLx is high. SCLx is
asserted low. Following this, the RSEN bit of the
SSPxCON2 register will be automatically cleared and
the Baud Rate Generator will not be reloaded, leaving
the SDAx pin held low. As soon as a Start condition is
detected on the SDAx and SCLx pins, the S bit of the
SSPxSTAT register will be set. The SSPxIF bit will not
be set until the Baud Rate Generator has timed out.
FIGURE 15-27: REPEAT START CONDITION WAVEFORM
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
2: A bus collision during the Repeated Start
condition occurs if:
SDAx is sampled low when SCLx
goes from low-to-high.
SCLx goes low before SDAx is
asserted low. This may indicate that
another master is attempting to
transmit a data 1.
SDAx
SCLx
Repeated Start
Write to SSPxCON2
Write to SSPxBUF occurs here
At completion of Start bit,
hardware clears RSEN bit
1st bit
S bit set by hardware
TBRG
TBRG
SDAx = 1,
SDAx = 1,
SCLx (no change)
SCLx = 1
occurs here
TBRG TBRG TBRG
and sets SSPxIF
Sr
PIC18(L)F2X/4XK22
DS41412A-page 244 Preliminary 2010 Microchip Technology Inc.
15.6.6 I
2
C MASTER MODE TRANSMISSION
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address is accomplished by simply
writing a value to the SSPxBUF register. This action will
set the Buffer Full flag bit, BF, and allow the Baud Rate
Generator to begin counting and start the next trans-
mission. Each bit of address/data will be shifted out
onto the SDAx pin after the falling edge of SCLx is
asserted. SCLx is held low for one Baud Rate Genera-
tor rollover count (TBRG). Data should be valid before
SCLx is released high. When the SCLx pin is released
high, it is held that way for TBRG. The data on the SDAx
pin must remain stable for that duration and some hold
time after the next falling edge of SCLx. After the eighth
bit is shifted out (the falling edge of the eighth clock),
the BF flag is cleared and the master releases SDAx.
This allows the slave device being addressed to
respond with an ACK bit during the ninth bit time if an
address match occurred, or if data was received prop-
erly. The status of ACK is written into the ACKSTAT bit
on the rising edge of the ninth clock. If the master
receives an Acknowledge, the Acknowledge Status bit,
ACKSTAT, is cleared. If not, the bit is set. After the ninth
clock, the SSPxIF bit is set and the master clock (Baud
Rate Generator) is suspended until the next data byte
is loaded into the SSPxBUF, leaving SCLx low and
SDAx unchanged (Figure 15-27).
After the write to the SSPxBUF, each bit of the address
will be shifted out on the falling edge of SCLx until all
seven address bits and the R/W bit are completed. On
the falling edge of the eighth clock, the master will
release the SDAx pin, allowing the slave to respond
with an Acknowledge. On the falling edge of the ninth
clock, the master will sample the SDAx pin to see if the
address was recognized by a slave. The status of the
ACK bit is loaded into the ACKSTAT Status bit of the
SSPxCON2 register. Following the falling edge of the
ninth clock transmission of the address, the SSPxIF is
set, the BF flag is cleared and the Baud Rate Generator
is turned off until another write to the SSPxBUF takes
place, holding SCLx low and allowing SDAx to float.
15.6.6.1 BF Status Flag
In Transmit mode, the BF bit of the SSPxSTAT register
is set when the CPU writes to SSPxBUF and is cleared
when all 8 bits are shifted out.
15.6.6.2 WCOL Status Flag
If the user writes the SSPxBUF when a transmit is
already in progress (i.e., SSPxSR is still shifting out a
data byte), the WCOL is set and the contents of the
buffer are unchanged (the write does not occur).
WCOL must be cleared by software before the next
transmission.
15.6.6.3 ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit of the SSPxCON2
register is cleared when the slave has sent an
Acknowledge (ACK = 0) and is set when the slave
does not Acknowledge (ACK = 1). A slave sends an
Acknowledge when it has recognized its address
(including a general call), or when the slave has
properly received its data.
15.6.6.4 Typical Transmit Sequence:
1. The user generates a Start condition by setting
the SEN bit of the SSPxCON2 register.
2. SSPxIF is set by hardware on completion of the
Start.
3. SSPxIF is cleared by software.
4. The MSSPx module will wait the required start
time before any other operation takes place.
5. The user loads the SSPxBUF with the slave
address to transmit.
6. Address is shifted out the SDAx pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPxBUF is written to.
7. The MSSPx module shifts in the ACK bit from
the slave device and writes its value into the
ACKSTAT bit of the SSPxCON2 register.
8. The MSSPx module generates an interrupt at
the end of the ninth clock cycle by setting the
SSPxIF bit.
9. The user loads the SSPxBUF with eight bits of
data.
10. Data is shifted out the SDAx pin until all 8 bits
are transmitted.
11. The MSSPx module shifts in the ACK bit from
the slave device and writes its value into the
ACKSTAT bit of the SSPxCON2 register.
12. Steps 8-11 are repeated for all transmitted data
bytes.
13. The user generates a Stop or Restart condition
by setting the PEN or RSEN bits of the
SSPxCON2 register. Interrupt is generated once
the Stop/Restart condition is complete.
2010 Microchip Technology Inc. Preliminary DS41412A-page 245
PIC18(L)F2X/4XK22
FIGURE 15-28: I
2
C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)
S
D
A
x
S
C
L
x
S
S
P
x
I
F
B
F
(
S
S
P
x
S
T
A
T
<
0
>
)
S
E
N
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
C
K
=
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
T
r
a
n
s
m
i
t
t
i
n
g
D
a
t
a
o
r
S
e
c
o
n
d
H
a
l
f
R
/
W
=
0
T
r
a
n
s
m
i
t
A
d
d
r
e
s
s
t
o
S
l
a
v
e
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
s
e
r
v
i
c
e
r
o
u
t
i
n
e
S
S
P
x
B
U
F
i
s
w
r
i
t
t
e
n
b
y
s
o
f
t
w
a
r
e
f
r
o
m
S
S
P
x
i
n
t
e
r
r
u
p
t
A
f
t
e
r
S
t
a
r
t
c
o
n
d
i
t
i
o
n
,
S
E
N
c
l
e
a
r
e
d
b
y
h
a
r
d
w
a
r
e
S
S
S
P
x
B
U
F
w
r
i
t
t
e
n
w
i
t
h
7
-
b
i
t
a
d
d
r
e
s
s
a
n
d
R
/
W
s
t
a
r
t
t
r
a
n
s
m
i
t
S
C
L
x
h
e
l
d
l
o
w
w
h
i
l
e
C
P
U
r
e
s
p
o
n
d
s
t
o
S
S
P
x
I
F
S
E
N
=
0
o
f
1
0
-
b
i
t
A
d
d
r
e
s
s
W
r
i
t
e
S
S
P
x
C
O
N
2
<
0
>
S
E
N
=
1
S
t
a
r
t
c
o
n
d
i
t
i
o
n
b
e
g
i
n
s
F
r
o
m
s
l
a
v
e
,
c
l
e
a
r
A
C
K
S
T
A
T
b
i
t
S
S
P
x
C
O
N
2
<
6
>
A
C
K
S
T
A
T
i
n
S
S
P
x
C
O
N
2
=
1
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
S
S
P
x
B
U
F
w
r
i
t
t
e
n
P
E
N
R
/
W
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
PIC18(L)F2X/4XK22
DS41412A-page 246 Preliminary 2010 Microchip Technology Inc.
15.6.7 I
2
C MASTER MODE RECEPTION
Master mode reception is enabled by programming the
Receive Enable bit, RCEN, of the SSPxCON2 register.
The Baud Rate Generator begins counting and on each
rollover, the state of the SCLx pin changes (high-to-low/
low-to-high) and data is shifted into the SSPxSR. After
the falling edge of the eighth clock, the receive enable
flag is automatically cleared, the contents of the
SSPxSR are loaded into the SSPxBUF, the BF flag bit
is set, the SSPxIF flag bit is set and the Baud Rate
Generator is suspended from counting, holding SCLx
low. The MSSPx is now in Idle state awaiting the next
command. When the buffer is read by the CPU, the BF
flag bit is automatically cleared. The user can then
send an Acknowledge bit at the end of reception by set-
ting the Acknowledge Sequence Enable bit, ACKEN, of
the SSPxCON2 register.
15.6.7.1 BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPxBUF from SSPxSR. It
is cleared when the SSPxBUF register is read.
15.6.7.2 SSPxOV Status Flag
In receive operation, the SSPxOV bit is set when 8 bits
are received into the SSPxSR and the BF flag bit is
already set from a previous reception.
15.6.7.3 WCOL Status Flag
If the user writes the SSPxBUF when a receive is
already in progress (i.e., SSPxSR is still shifting in a
data byte), the WCOL bit is set and the contents of the
buffer are unchanged (the write does not occur).
15.6.7.4 Typical Receive Sequence:
1. The user generates a Start condition by setting
the SEN bit of the SSPxCON2 register.
2. SSPxIF is set by hardware on completion of the
Start.
3. SSPxIF is cleared by software.
4. User writes SSPxBUF with the slave address to
transmit and the R/W bit set.
5. Address is shifted out the SDAx pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPxBUF is written to.
6. The MSSPx module shifts in the ACK bit from
the slave device and writes its value into the
ACKSTAT bit of the SSPxCON2 register.
7. The MSSPx module generates an interrupt at
the end of the ninth clock cycle by setting the
SSPxIF bit.
8. User sets the RCEN bit of the SSPxCON2 regis-
ter and the Master clocks in a byte from the slave.
9. After the 8th falling edge of SCLx, SSPxIF and
BF are set.
10. Master clears SSPxIF and reads the received
byte from SSPxUF, clears BF.
11. Master sets ACK value sent to slave in ACKDT
bit of the SSPxCON2 register and initiates the
ACK by setting the ACKEN bit.
12. Masters ACK is clocked out to the slave and
SSPxIF is set.
13. User clears SSPxIF.
14. Steps 8-13 are repeated for each received byte
from the slave.
15. Master sends a not ACK or Stop to end
communication.
Note: The MSSPx module must be in an Idle
state before the RCEN bit is set or the
RCEN bit will be disregarded.
2010 Microchip Technology Inc. Preliminary DS41412A-page 247
PIC18(L)F2X/4XK22
FIGURE 15-29: I
2
C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
P
9
8
7
6
5
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
S
A
7
A
6
A
5
A
4
A
3
A
2
A
1
S
D
A
x
S
C
L
x
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
B
u
s
m
a
s
t
e
r
t
e
r
m
i
n
a
t
e
s
t
r
a
n
s
f
e
r
A
C
K
R
e
c
e
i
v
i
n
g
D
a
t
a
f
r
o
m
S
l
a
v
e
R
e
c
e
i
v
i
n
g
D
a
t
a
f
r
o
m
S
l
a
v
e
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
A
C
K
R
/
W
=
0
T
r
a
n
s
m
i
t
A
d
d
r
e
s
s
t
o
S
l
a
v
e
S
S
P
x
I
F
B
F
A
C
K
i
s
n
o
t
s
e
n
t
W
r
i
t
e
t
o
S
S
P
x
C
O
N
2
<
0
>
(
S
E
N
=
1
)
,
W
r
i
t
e
t
o
S
S
P
x
B
U
F
o
c
c
u
r
s
h
e
r
e
,
A
C
K
f
r
o
m
S
l
a
v
e
M
a
s
t
e
r
c
o
n
f
i
g
u
r
e
d
a
s
a
r
e
c
e
i
v
e
r
b
y
p
r
o
g
r
a
m
m
i
n
g
S
S
P
x
C
O
N
2
<
3
>
(
R
C
E
N
=
1
)
P
E
N
b
i
t
=
1
w
r
i
t
t
e
n
h
e
r
e
D
a
t
a
s
h
i
f
t
e
d
i
n
o
n
f
a
l
l
i
n
g
e
d
g
e
o
f
C
L
K
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
s
t
a
r
t
X
M
I
T
S
E
N
=
0
S
S
P
x
O
V
S
D
A
x
=
0
,
S
C
L
x
=
1
w
h
i
l
e
C
P
U
(
S
S
P
x
S
T
A
T
<
0
>
)
A
C
K
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
S
e
t
S
S
P
x
I
F
i
n
t
e
r
r
u
p
t
a
t
e
n
d
o
f
r
e
c
e
i
v
e
S
e
t
P
b
i
t
(
S
S
P
x
S
T
A
T
<
4
>
)
a
n
d
S
S
P
x
I
F
C
l
e
a
r
e
d
i
n
s
o
f
t
w
a
r
e
A
C
K
f
r
o
m
M
a
s
t
e
r
S
e
t
S
S
P
x
I
F
a
t
e
n
d
S
e
t
S
S
P
x
I
F
i
n
t
e
r
r
u
p
t
a
t
e
n
d
o
f
A
c
k
n
o
w
l
e
d
g
e
s
e
q
u
e
n
c
e
S
e
t
S
S
P
x
I
F
i
n
t
e
r
r
u
p
t
a
t
e
n
d
o
f
A
c
k
n
o
w
-
l
e
d
g
e
s
e
q
u
e
n
c
e
o
f
r
e
c
e
i
v
e
S
e
t
A
C
K
E
N
,
s
t
a
r
t
A
c
k
n
o
w
l
e
d
g
e
s
e
q
u
e
n
c
e
S
S
P
x
O
V
i
s
s
e
t
b
e
c
a
u
s
e
S
S
P
x
B
U
F
i
s
s
t
i
l
l
f
u
l
l
S
D
A
x
=
A
C
K
D
T
=
1
R
C
E
N
c
l
e
a
r
e
d
a
u
t
o
m
a
t
i
c
a
l
l
y
R
C
E
N
=
1
,
s
t
a
r
t
n
e
x
t
r
e
c
e
i
v
e
W
r
i
t
e
t
o
S
S
P
x
C
O
N
2
<
4
>
t
o
s
t
a
r
t
A
c
k
n
o
w
l
e
d
g
e
s
e
q
u
e
n
c
e
S
D
A
x
=
A
C
K
D
T
(
S
S
P
x
C
O
N
2
<
5
>
)
=
0
R
C
E
N
c
l
e
a
r
e
d
a
u
t
o
m
a
t
i
c
a
l
l
y
r
e
s
p
o
n
d
s
t
o
S
S
P
x
I
F
A
C
K
E
N
b
e
g
i
n
S
t
a
r
t
c
o
n
d
i
t
i
o
n
C
l
e
a
r
e
d
b
y
s
o
f
t
w
a
r
e
S
D
A
x
=
A
C
K
D
T
=
0
L
a
s
t
b
i
t
i
s
s
h
i
f
t
e
d
i
n
t
o
S
S
P
x
S
R
a
n
d
c
o
n
t
e
n
t
s
a
r
e
u
n
l
o
a
d
e
d
i
n
t
o
S
S
P
x
B
U
F
R
C
E
N
M
a
s
t
e
r
c
o
n
f
i
g
u
r
e
d
a
s
a
r
e
c
e
i
v
e
r
b
y
p
r
o
g
r
a
m
m
i
n
g
S
S
P
x
C
O
N
2
<
3
>
(
R
C
E
N
=
1
)
R
C
E
N
c
l
e
a
r
e
d
a
u
t
o
m
a
t
i
c
a
l
l
y
A
C
K
f
r
o
m
M
a
s
t
e
r
S
D
A
x
=
A
C
K
D
T
=
0
R
C
E
N
c
l
e
a
r
e
d
a
u
t
o
m
a
t
i
c
a
l
l
y
PIC18(L)F2X/4XK22
DS41412A-page 248 Preliminary 2010 Microchip Technology Inc.
15.6.8 ACKNOWLEDGE SEQUENCE
TIMING
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable bit, ACKEN, of the
SSPxCON2 register. When this bit is set, the SCLx pin is
pulled low and the contents of the Acknowledge data bit
are presented on the SDAx pin. If the user wishes to
generate an Acknowledge, then the ACKDT bit should
be cleared. If not, the user should set the ACKDT bit
before starting an Acknowledge sequence. The Baud
Rate Generator then counts for one rollover period
(TBRG) and the SCLx pin is deasserted (pulled high).
When the SCLx pin is sampled high (clock arbitration),
the Baud Rate Generator counts for TBRG. The SCLx pin
is then pulled low. Following this, the ACKEN bit is auto-
matically cleared, the Baud Rate Generator is turned off
and the MSSPx module then goes into Idle mode
(Figure 15-29).
15.6.8.1 WCOL Status Flag
If the user writes the SSPxBUF when an Acknowledge
sequence is in progress, then WCOL is set and the
contents of the buffer are unchanged (the write does
not occur).
15.6.9 STOP CONDITION TIMING
A Stop bit is asserted on the SDAx pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN, of the SSPxCON2 register. At the end of a
receive/transmit, the SCLx line is held low after the
falling edge of the ninth clock. When the PEN bit is set,
the master will assert the SDAx line low. When the
SDAx line is sampled low, the Baud Rate Generator is
reloaded and counts down to 0. When the Baud Rate
Generator times out, the SCLx pin will be brought high
and one TBRG (Baud Rate Generator rollover count)
later, the SDAx pin will be deasserted. When the SDAx
pin is sampled high while SCLx is high, the P bit of the
SSPxSTAT register is set. A TBRG later, the PEN bit is
cleared and the SSPxIF bit is set (Figure 15-30).
15.6.9.1 WCOL Status Flag
If the user writes the SSPxBUF when a Stop sequence
is in progress, then the WCOL bit is set and the
contents of the buffer are unchanged (the write does
not occur).
FIGURE 15-30: ACKNOWLEDGE SEQUENCE WAVEFORM
Note: TBRG = one Baud Rate Generator period.
SDAx
SCLx
SSPxIF set at
Acknowledge sequence starts here,
write to SSPxCON2
ACKEN automatically cleared
Cleared in
TBRG TBRG
the end of receive
8
ACKEN = 1, ACKDT = 0
D0
9
SSPxIF
software SSPxIF set at the end
of Acknowledge sequence
Cleared in
software
ACK
2010 Microchip Technology Inc. Preliminary DS41412A-page 249
PIC18(L)F2X/4XK22
FIGURE 15-31: STOP CONDITION RECEIVE OR TRANSMIT MODE
15.6.10 SLEEP OPERATION
While in Sleep mode, the I
2
C slave module can receive
addresses or data and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSPx interrupt is enabled).
15.6.11 EFFECTS OF A RESET
A Reset disables the MSSPx module and terminates
the current transfer.
15.6.12 MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset or when the
MSSPx module is disabled. Control of the I
2
C bus may
be taken when the P bit of the SSPxSTAT register is
set, or the bus is Idle, with both the S and P bits clear.
When the bus is busy, enabling the SSPx interrupt will
generate the interrupt when the Stop condition occurs.
In multi-master operation, the SDAx line must be
monitored for arbitration to see if the signal level is the
expected output level. This check is performed by
hardware with the result placed in the BCLxIF bit.
The states where arbitration can be lost are:
Address Transfer
Data Transfer
A Start Condition
A Repeated Start Condition
An Acknowledge Condition
SCLx
SDAx
SDAx asserted low before rising edge of clock
Write to SSPxCON2,
set PEN
Falling edge of
SCLx = 1 for TBRG, followed by SDAx = 1 for TBRG
9th clock
SCLx brought high after TBRG
Note: TBRG = one Baud Rate Generator period.
TBRG TBRG
after SDAx sampled high. P bit (SSPxSTAT<4>) is set.
TBRG
to setup Stop condition
ACK
P
TBRG
PEN bit (SSPxCON2<2>) is cleared by
hardware and the SSPxIF bit is set
PIC18(L)F2X/4XK22
DS41412A-page 250 Preliminary 2010 Microchip Technology Inc.
15.6.13 MULTI -MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDAx pin, arbitration takes place when the
master outputs a 1 on SDAx, by letting SDAx float high
and another master asserts a 0. When the SCLx pin
floats high, data should be stable. If the expected data
on SDAx is a 1 and the data sampled on the SDAx pin
is 0, then a bus collision has taken place. The master
will set the Bus Collision Interrupt Flag, BCLxIF, and
reset the I
2
C port to its Idle state (Figure 15-31).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF flag is
cleared, the SDAx and SCLx lines are deasserted and
the SSPxBUF can be written to. When the user
services the bus collision Interrupt Service Routine and
if the I
2
C bus is free, the user can resume
communication by asserting a Start condition.
If a Start, Repeated Start, Stop or Acknowledge
condition was in progress when the bus collision
occurred, the condition is aborted, the SDAx and SCLx
lines are deasserted and the respective control bits in
the SSPxCON2 register are cleared. When the user
services the bus collision Interrupt Service Routine and
if the I
2
C bus is free, the user can resume
communication by asserting a Start condition.
The master will continue to monitor the SDAx and SCLx
pins. If a Stop condition occurs, the SSPxIF bit will be set.
A write to the SSPxBUF will start the transmission of
data at the first data bit, regardless of where the
transmitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I
2
C
bus can be taken when the P bit is set in the SSPxSTAT
register, or the bus is Idle and the S and P bits are
cleared.
FIGURE 15-32: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
SDAx
SCLx
BCLxIF
SDAx released
SDAx line pulled low
by another source
Sample SDAx. While SCLx is high,
data does not match what is driven
Bus collision has occurred.
Set bus collision
interrupt (BCLxIF)
by the master.
by master
Data changes
while SCLx = 0
2010 Microchip Technology Inc. Preliminary DS41412A-page 251
PIC18(L)F2X/4XK22
15.6.13.1 Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a) SDAx or SCLx are sampled low at the beginning
of the Start condition (Figure 15-32).
b) SCLx is sampled low before SDAx is asserted
low (Figure 15-33).
During a Start condition, both the SDAx and the SCLx
pins are monitored.
If the SDAx pin is already low, or the SCLx pin is
already low, then all of the following occur:
the Start condition is aborted,
the BCLxIF flag is set and
the MSSPx module is reset to its Idle state
(Figure 15-32).
The Start condition begins with the SDAx and SCLx
pins deasserted. When the SDAx pin is sampled high,
the Baud Rate Generator is loaded and counts down. If
the SCLx pin is sampled low while SDAx is high, a bus
collision occurs because it is assumed that another
master is attempting to drive a data 1 during the Start
condition.
If the SDAx pin is sampled low during this count, the
BRG is reset and the SDAx line is asserted early
(Figure 15-34). If, however, a 1 is sampled on the
SDAx pin, the SDAx pin is asserted low at the end of
the BRG count. The Baud Rate Generator is then
reloaded and counts down to zero; if the SCLx pin is
sampled as 0 during this time, a bus collision does not
occur. At the end of the BRG count, the SCLx pin is
asserted low.
FIGURE 15-33: BUS COLLISION DURING START CONDITION (SDAx ONLY)
Note: The reason that bus collision is not a factor
during a Start condition is that no two bus
masters can assert a Start condition at the
exact same time. Therefore, one master
will always assert SDAx before the other.
This condition does not cause a bus colli-
sion because the two masters must be
allowed to arbitrate the first address fol-
lowing the Start condition. If the address is
the same, arbitration must be allowed to
continue into the data portion, Repeated
Start or Stop conditions.
SDAx
SCLx
SEN
SDAx sampled low before
SDAx goes low before the SEN bit is set.
S bit and SSPxIF set because
SSPx module reset into Idle state.
SEN cleared automatically because of bus collision.
S bit and SSPxIF set because
Set SEN, enable Start
condition if SDAx = 1, SCLx = 1
SDAx = 0, SCLx = 1.
BCLxIF
S
SSPxIF
SDAx = 0, SCLx = 1.
SSPxIF and BCLxIF are
cleared by software
SSPxIF and BCLxIF are
cleared by software
Set BCLxIF,
Start condition. Set BCLxIF.
PIC18(L)F2X/4XK22
DS41412A-page 252 Preliminary 2010 Microchip Technology Inc.
FIGURE 15-34: BUS COLLISION DURING START CONDITION (SCLx = 0)
FIGURE 15-35: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDAx
SCLx
SEN
bus collision occurs. Set BCLxIF.
SCLx = 0 before SDAx = 0,
Set SEN, enable Start
sequence if SDAx = 1, SCLx = 1
TBRG TBRG
SDAx = 0, SCLx = 1
BCLxIF
S
SSPxIF
Interrupt cleared
by software
bus collision occurs. Set BCLxIF.
SCLx = 0 before BRG time-out,
0 0
0 0
SDAx
SCLx
SEN
Set S
Less than TBRG
TBRG
SDAx = 0, SCLx = 1
BCLxIF
S
SSPxIF
S
Interrupts cleared
by software set SSPxIF
SDAx = 0, SCLx = 1,
SCLx pulled low after BRG
time-out
Set SSPxIF
0
SDAx pulled low by other master.
Reset BRG and assert SDAx.
Set SEN, enable Start
sequence if SDAx = 1, SCLx = 1
2010 Microchip Technology Inc. Preliminary DS41412A-page 253
PIC18(L)F2X/4XK22
15.6.13.2 Bus Collision During a Repeated
Start Condition
During a Repeated Start condition, a bus collision
occurs if:
a) A low level is sampled on SDAx when SCLx
goes from low level to high level.
b) SCLx goes low before SDAx is asserted low,
indicating that another master is attempting to
transmit a data 1.
When the user releases SDAx and the pin is allowed to
float high, the BRG is loaded with SSPxADD and
counts down to zero. The SCLx pin is then deasserted
and when sampled high, the SDAx pin is sampled.
If SDAx is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data 0, Figure 15-35).
If SDAx is sampled high, the BRG is reloaded and
begins counting. If SDAx goes from high-to-low before
the BRG times out, no bus collision occurs because no
two masters can assert SDAx at exactly the same time.
If SCLx goes from high-to-low before the BRG times
out and SDAx has not already been asserted, a bus
collision occurs. In this case, another master is
attempting to transmit a data 1 during the Repeated
Start condition, see Figure 15-36.
If, at the end of the BRG time-out, both SCLx and SDAx
are still high, the SDAx pin is driven low and the BRG
is reloaded and begins counting. At the end of the
count, regardless of the status of the SCLx pin, the
SCLx pin is driven low and the Repeated Start
condition is complete.
FIGURE 15-36: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
FIGURE 15-37: BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SDAx
SCLx
RSEN
BCLxIF
S
SSPxIF
Sample SDAx when SCLx goes high.
If SDAx = 0, set BCLxIF and release SDAx and SCLx.
Cleared by software
0
0
SDAx
SCLx
BCLxIF
RSEN
S
SSPxIF
Interrupt cleared
by software
SCLx goes low before SDAx,
set BCLxIF. Release SDAx and SCLx.
TBRG TBRG
0
PIC18(L)F2X/4XK22
DS41412A-page 254 Preliminary 2010 Microchip Technology Inc.
15.6.13.3 Bus Collision During a Stop
Condition
Bus collision occurs during a Stop condition if:
a) After the SDAx pin has been deasserted and
allowed to float high, SDAx is sampled low after
the BRG has timed out.
b) After the SCLx pin is deasserted, SCLx is
sampled low before SDAx goes high.
The Stop condition begins with SDAx asserted low.
When SDAx is sampled low, the SCLx pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPxADD and
counts down to 0. After the BRG times out, SDAx is
sampled. If SDAx is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data 0 (Figure 15-37). If the SCLx pin is
sampled low before SDAx is allowed to float high, a bus
collision occurs. This is another case of another master
attempting to drive a data 0 (Figure 15-38).
FIGURE 15-38: BUS COLLISION DURING A STOP CONDITION (CASE 1)
FIGURE 15-39: BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDAx
SCLx
BCLxIF
PEN
P
SSPxIF
TBRG TBRG TBRG
SDAx asserted low
SDAx sampled
low after TBRG,
set BCLxIF
0
0
SDAx
SCLx
BCLxIF
PEN
P
SSPxIF
TBRG TBRG TBRG
Assert SDAx
SCLx goes low before SDAx goes high,
set BCLxIF
0
0
2010 Microchip Technology Inc. Preliminary DS41412A-page 255
PIC18(L)F2X/4XK22
TABLE 15-3: REGISTERS ASSOCIATED WITH I
2
C OPERATION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
ANSELA
ANSA5
\ .
|
| |
VAPPLIED 1
1
2047
----------- -
\ .
| |
=
VAPPLIED 1
1
2047
------------
\ .
| |
VCHOLD =
VAPPLI ED 1 e
TC
RC
----------
\ .
|
| |
VCHOLD =
;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Temperature 50C and external impedance of 10kO 3.0V VDD =
Assumptions:
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 kO. This is required to meet the pin
leakage specification.
2010 Microchip Technology Inc. Preliminary DS41412A-page 305
PIC18(L)F2X/4XK22
FIGURE 17-5: ANALOG INPUT MODEL
FIGURE 17-6: ADC TRANSFER FUNCTION
CPIN
VA
Rs
ANx
5 pF
V
D
D
I LEAKAGE
(1)
RIC s 1k
Sampling
Switch
SS
Rss
CHOLD = 13.5 pF
VSS/VREF-
2.5V
Rss (kO)
2.0V
1.5V
.1 1 10
VDD
Legend: CPIN
I LEAKAGE
RIC
SS
CHOLD
= Input Capacitance
= Leakage current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance
various junctions
Discharge
Switch
3.0V
3.5V
100
Note 1: See Section 27.0 Electrical Characteristics.
3FFh
3FEh
A
D
C
O
u
t
p
u
t
C
o
d
e
3FDh
3FCh
004h
003h
002h
001h
000h
Full-Scale
3FBh
1/2 LSB ideal
VSS/VREF-
Zero-Scale
Transition
VDD/VREF+
Transition
1/2 LSB ideal
Full-Scale Range
Analog Input Voltage
PIC18(L)F2X/4XK22
DS41412A-page 306 Preliminary 2010 Microchip Technology Inc.
TABLE 17-3: CONFIGURATION REGISTERS ASSOCIATED WITH THE ADC MODULE
TABLE 17-2: REGISTERS ASSOCIATED WITH A/D OPERATION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
ADCON0 CHS<4:0> GO/DONE ADON 300
ADCON1 TRIGSEL PVCFG<1:0> NVCFG<1:0> 301
ADCON2 ADFM ACQT<2:0> ADCS<2:0> 302
ADRESH A/D Result, High Byte 303
ADRESL A/D Result, Low Byte 303
ANSELA ANSA5 ANSA3 ANSA2 ANSA1 ANSA0 153
ANSELB ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 154
ANSELC ANSC7 ANSC6 ANSC5 ANSC4 ANSC3 ANSC2 154
ANSELD
(1)
ANSD7 ANSD6 ANSD5 ANSD4 ANSD3 ANSD2 ANSD1 ANSD0 154
ANSELE
(1)
ANSE2 ANSE1 ANSE0 155
CCP5CON DC5B<1:0> CCP5M<3:0> 203
CTMUCONH CTMUEN CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG 331
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 115
IPR1 ADIP RC1IP TX1IP SSP1IP CCP1IP TMR2IP TMR1IP 127
IPR3 SSP2IP BCL2IP RC2IP TX2IP CTMUIP TMR5GIP TMR3GIP TMR1GIP 129
IPR4 CCP5IP CCP4IP CCP3IP 130
PIE1 ADIE RC1IE TX1IE SSP1IE CCP1IE TMR2IE TMR1IE 123
PIE3 SSP2IE BCL2IE RC2IE TX2IE CTMUIE TMR5GIE TMR3GIE TMR1GIE 125
PIE4 CCP5IE CCP4IE CCP3IE 126
PIR1 ADIF RC1IF TX1IF SSP1IF CCP1IF TMR2IF TMR1IF 118
PIR3 SSP2IF BCL2IF RC2IF TX2IF CTMUIF TMR5GIF TMR3GIF TMR1GIF 120
PIR4 CCP5IF CCP4IF CCP3IF 121
PMD1 MSSP2MD MSSP1MD CCP5MD CCP4MD CCP3MD CCP2MD CCP1MD 57
PMD2 CTMUMD CMP2MD CMP1MD ADCMD 58
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 155
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 155
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 155
TRISD
(1)
TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 155
TRISE WPUE3 TRISE2
(1)
TRISE1
(1)
TRISE0
(1)
155
Legend: = unimplemented locations, read as 0. Shaded bits are not used by this module.
Note 1: Available on PIC18(L)F4XK22 devices.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
CONFIG3H MCLRE P2BMX T3CMX HFOFST
CCP3MX
PBADEN
CCP2MX
356
Legend: = unimplemented locations, read as 0. Shaded bits are not used by the ADC module.
2010 Microchip Technology Inc. Preliminary DS41412A-page 307
PIC18(L)F2X/4XK22
18.0 COMPARATOR MODULE
Comparators are used to interface analog circuits to a
digital circuit by comparing two analog voltages and
providing a digital indication of their relative magnitudes.
The comparators are very useful mixed signal building
blocks because they provide analog functionality
independent of the program execution. The analog
comparator module includes the following features:
Independent comparator control
Programmable input selection
Comparator output is available internally/externally
Programmable output polarity
Interrupt-on-change
Wake-up from Sleep
Programmable Speed/Power optimization
PWM shutdown
Programmable and fixed voltage reference
Selectable Hysteresis
18.1 Comparator Overview
A single comparator is shown in Figure 18-1 along with
the relationship between the analog input levels and
the digital output. When the analog voltage at VIN+ is
less than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of the comparator is a digital high level.
FIGURE 18-1: SINGLE COMPARATOR
+
VIN+
VIN-
Output
Output
VIN+
VIN-
Note: The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
PIC18(L)F2X/4XK22
DS41412A-page 308 Preliminary 2010 Microchip Technology Inc.
FIGURE 18-2: COMPARATOR C1/C2 SIMPLIFIED BLOCK DIAGRAM
Note 1: When C1ON = 0, the C1 comparator will produce a 0 output to the XOR Gate.
2: Q1 and Q3 are phases of the four-phase system clock (FOSC).
3: Q1 is held high during Sleep mode.
Cx
CxPOL
to PWM Logic
0
1
2
3
CxON
(1)
CxCH<1:0>
2
0
1
CxR
CM2CON1 (MCxOUT)
To Interrupts
CxVIN-
CxVIN+
C12IN0-
C12IN1-
C12IN2-
C12IN3-
CxIN+
D Q
EN Q1
(2),(3)
D Q
EN
CL
Read or Write
Reset
+
-
0
1
DAC
CXRSEL
FVR BUF1
CxSP
CXVREF
CxOE
CxOUT
Timer1 Clock
D Q
SYNCCxOUT
To CMxCON0 (CxOUT)
(CxIF)
of CMxCON0
Q3
(2)
0
1
CxSYNC
Cx Output
TRIS bit
- to SR Latch
- to TxG MUX
2010 Microchip Technology Inc. Preliminary DS41412A-page 309
PIC18(L)F2X/4XK22
18.2 Comparator Control
Each comparator has a separate control and
Configuration register: CM1CON0 for Comparator C1
and CM2CON0 for Comparator C2. In addition,
Comparator C2 has a second control register,
CM2CON1, for controlling the interaction with Timer1 and
simultaneous reading of both comparator outputs.
The CM1CON0 and CM2CON0 registers (see Registers
18-1 and 18-2, respectively) contain the control and
status bits for the following:
Enable
Input selection
Reference selection
Output selection
Output polarity
Speed selection
18.2.1 COMPARATOR ENABLE
Setting the CxON bit of the CMxCON0 register enables
the comparator for operation. Clearing the CxON bit
disables the comparator resulting in minimum current
consumption.
18.2.2 COMPARATOR INPUT SELECTION
The CxCH<1:0> bits of the CMxCON0 register direct
one of four analog input pins to the comparator
inverting input.
18.2.3 COMPARATOR REFERENCE
SELECTION
Setting the CxR bit of the CMxCON0 register directs an
internal voltage reference or an analog input pin to the
non-inverting input of the comparator. See
Section 21.0 Fixed Voltage Reference (FVR) for
more information on the Internal Voltage Reference
module.
18.2.4 COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the CxOUT bit of the CMxCON0 register
or the MCxOUT bit of the CM2CON1 register. In order
to make the output available for an external connection,
the following conditions must be true:
CxOE bit of the CMxCON0 register must be set
Corresponding TRIS bit must be cleared
CxON bit of the CMxCON0 register must be set
18.2.5 COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CxPOL bit of the CMxCON0 register.
Clearing the CxPOL bit results in a non-inverted output.
Table 18-1 shows the output state versus input
conditions, including polarity control.
18.2.6 COMPARATOR SPEED SELECTION
The trade-off between speed or power can be
optimized during program execution with the CxSP
control bit. The default state for this bit is 1 which
selects the normal speed mode. Device power
consumption can be optimized at the cost of slower
comparator propagation delay by clearing the CxSP bit
to 0.
18.3 Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new reference voltage. This period is referred to as
the response time. The response time of the
comparator differs from the settling time of the voltage
reference. Therefore, both of these times must be
considered when determining the total response time
to a comparator input change. See the Comparator and
Voltage Reference Specifications in Section 27.0
Electrical Characteristics for more details.
Note: To use CxIN+ and C12INx- pins as analog
inputs, the appropriate bits must be set in
the ANSEL register and the corresponding
TRIS bits must also be set to disable the
output drivers.
Note 1: The CxOE bit overrides the PORT data
latch. Setting the CxON has no impact on
the port override.
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
TABLE 18-1: COMPARATOR OUTPUT
STATE VS. INPUT
CONDITIONS
Input Condition CxPOL CxOUT
CxVIN- > CxVIN+ 0 0
CxVIN- < CxVIN+ 0 1
CxVIN- > CxVIN+ 1 1
CxVIN- < CxVIN+ 1 0
PIC18(L)F2X/4XK22
DS41412A-page 310 Preliminary 2010 Microchip Technology Inc.
18.4 Comparator Interrupt Operation
The comparator interrupt flag will be set whenever
there is a change in the output value of the comparator.
Changes are recognized by means of a mismatch
circuit which consists of two latches and an exclusive-
or gate (see Figure 18-2). The first latch is updated with
the comparator output value, when the CMxCON0
register is read or written. The value is latched on the
third cycle of the system clock, also known as Q3. This
first latch retains the comparator value until another
read or write of the CMxCON0 register occurs or a
Reset takes place. The second latch is updated with
the comparator output value on every first cycle of the
system clock, also known as Q1. When the output
value of the comparator changes, the second latch is
updated and the output values of both latches no
longer match one another, resulting in a mismatch
condition. The latch outputs are fed directly into the
inputs of an exclusive-or gate. This mismatch condition
is detected by the exclusive-or gate and sent to the
interrupt circuitry. The mismatch condition will persist
until the first latch value is updated by performing a
read of the CMxCON0 register or the comparator
output returns to the previous state.
When the mismatch condition occurs, the comparator
interrupt flag is set. The interrupt flag is triggered by the
edge of the changing value coming from the exclusive-
or gate. This means that the interrupt flag can be reset
once it is triggered without the additional step of read-
ing or writing the CMxCON0 register to clear the mis-
match latches. When the mismatch registers are
cleared, an interrupt will occur upon the comparators
return to the previous state, otherwise no interrupt will
be generated.
Software will need to maintain information about the
status of the comparator output, as read from the
CMxCON0 register, or CM2CON1 register, to determine
the actual change that has occurred. See Figures 18-3
and 18-4.
The CxIF bit of the PIR2 register is the comparator
interrupt flag. This bit must be reset by software by
clearing it to 0. Since it is also possible to write a 1 to
this register, an interrupt can be generated.
In mid-range Compatibility mode the CxIE bit of the
PIE2 register and the PEIE/GIEL and GIE/GIEH bits of
the INTCON register must all be set to enable compar-
ator interrupts. If any of these bits are cleared, the inter-
rupt is not enabled, although the CxIF bit of the PIR2
register will still be set if an interrupt condition occurs.
18.4.1 PRESETTING THE MISMATCH
LATCHES
The comparator mismatch latches can be preset to the
desired state before the comparators are enabled.
When the comparator is off the CxPOL bit controls the
CxOUT level. Set the CxPOL bit to the desired CxOUT
non-interrupt level while the CxON bit is cleared. Then,
configure the desired CxPOL level in the same instruc-
tion that the CxON bit is set. Since all register writes are
performed as a read-modify-write, the mismatch
latches will be cleared during the instruction read
phase and the actual configuration of the CxON and
CxPOL bits will be occur in the final write phase.
FIGURE 18-3: COMPARATOR
INTERRUPT TIMING W/O
CMxCON0 READ
FIGURE 18-4: COMPARATOR
INTERRUPT TIMING WITH
CMxCON0 READ
Note 1: A write operation to the CMxCON0
register will also clear the mismatch
condition because all writes include a read
operation at the beginning of the write
cycle.
2: Comparator interrupts will operate correctly
regardless of the state of CxOE.
Note 1: If a change in the CMxCON0 register
(CxOUT) should occur when a read oper-
ation is being executed (start of the Q2
cycle), then the CxIF interrupt flag of the
PIR2 register may not get set.
2: When either comparator is first enabled,
bias circuitry in the comparator module
may cause an invalid output from the
comparator until the bias circuitry is stable.
Allow about 1 s for bias settling then clear
the mismatch condition and interrupt flags
before enabling comparator interrupts.
Q1
Q3
CxIN+
CxIN
Set CxIF (edge)
CxIF
TRT
Reset by Software
Q1
Q3
CxIN+
CxOUT
Set CxIF (edge)
CxIF
TRT
Reset by Software Cleared by CMxCON0 Read
2010 Microchip Technology Inc. Preliminary DS41412A-page 311
PIC18(L)F2X/4XK22
18.5 Operation During Sleep
The comparator, if enabled before entering Sleep mode,
remains active during Sleep. The additional current
consumed by the comparator is shown separately in
Section 27.0 Electrical Characteristics. If the
comparator is not used to wake the device, power
consumption can be minimized while in Sleep mode by
turning off the comparator. Each comparator is turned off
by clearing the CxON bit of the CMxCON0 register.
A change to the comparator output can wake-up the
device from Sleep. To enable the comparator to wake
the device from Sleep, the CxIE bit of the PIE2 register
and the PEIE/GIEL bit of the INTCON register must be
set. The instruction following the SLEEP instruction
always executes following a wake from Sleep. If the
GIE/GIEH bit of the INTCON register is also set, the
device will then execute the Interrupt Service Routine.
18.6 Effects of a Reset
A device Reset forces the CMxCON0 and CM2CON1
registers to their Reset states. This forces both
comparators and the voltage references to their Off
states.
PIC18(L)F2X/4XK22
DS41412A-page 312 Preliminary 2010 Microchip Technology Inc.
REGISTER 18-1: CM1CON0: COMPARATOR 1 CONTROL REGISTER
R/W-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0
C1ON C1OUT C1OE C1POL C1SP C1R C1CH<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 C1ON: Comparator C1 Enable bit
1 = Comparator C1 is enabled
0 = Comparator C1 is disabled
bit 6 C1OUT: Comparator C1 Output bit
If C1POL = 1 (inverted polarity):
C1OUT = 0 when C1VIN+ > C1VIN-
C1OUT = 1 when C1VIN+ < C1VIN-
If C1POL = 0 (non-inverted polarity):
C1OUT = 1 when C1VIN+ > C1VIN-
C1OUT = 0 when C1VIN+ < C1VIN-
bit 5 C1OE: Comparator C1 Output Enable bit
1 = C1OUT is present on the C1OUT pin
(1)
0 = C1OUT is internal only
bit 4 C1POL: Comparator C1 Output Polarity Select bit
1 = C1OUT logic is inverted
0 = C1OUT logic is not inverted
bit 3 C1SP: Comparator C1 Speed/Power Select bit
1 = C1 operates in normal power, higher speed mode
0 = C1 operates in low-power, low-speed mode
bit 2 C1R: Comparator C1 Reference Select bit (non-inverting input)
1 = C1VIN+ connects to C1VREF output
0 = C1VIN+ connects to C12IN+ pin
bit 1-0 C1CH<1:0>: Comparator C1 Channel Select bit
00 = C12IN0- pin of C1 connects to C1VIN-
01 = C12IN1- pin of C1 connects to C1VIN-
10 = C12IN2- pin of C1 connects to C1VIN-
11 = C12IN3- pin of C1 connects to C1VIN-
Note 1: Comparator output requires the following three conditions: C1OE = 1, C1ON = 1 and corresponding port
TRIS bit = 0.
2010 Microchip Technology Inc. Preliminary DS41412A-page 313
PIC18(L)F2X/4XK22
REGISTER 18-2: CM2CON: COMPARATOR 2 CONTROL REGISTER
R/W-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0
C2ON C2OUT C2OE C2POL C2SP C2R C2CH<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 C2ON: Comparator C2 Enable bit
1 = Comparator C2 is enabled
0 = Comparator C2 is disabled
bit 6 C2OUT: Comparator C2 Output bit
If C2POL = 1 (inverted polarity):
C2OUT = 0 when C2VIN+ > C2VIN-
C2OUT = 1 when C2VIN+ < C2VIN-
If C2POL = 0 (non-inverted polarity):
C2OUT = 1 when C2VIN+ > C2VIN-
C2OUT = 0 when C2VIN+ < C2VIN-
bit 5 C2OE: Comparator C2 Output Enable bit
1 = C2OUT is present on C2OUT pin
(1)
0 = C2OUT is internal only
bit 4 C2POL: Comparator C2 Output Polarity Select bit
1 = C2OUT logic is inverted
0 = C2OUT logic is not inverted
bit 3 C2SP: Comparator C2 Speed/Power Select bit
1 = C2 operates in normal power, higher speed mode
0 = C2 operates in low-power, low-speed mode
bit 2 C2R: Comparator C2 Reference Select bits (non-inverting input)
1 = C2VIN+ connects to C2VREF
0 = C2VIN+ connects to C2IN+ pin
bit 1-0 C2CH<1:0>: Comparator C2 Channel Select bits
00 = C12IN0- pin of C2 connects to C2VIN-
01 = C12IN1- pin of C2 connects to C2VIN-
10 = C12IN2- pin of C2 connects to C2VIN-
11 = C12IN3- pin of C2 connects to C2VIN-
Note 1: Comparator output requires the following three conditions: C2OE = 1, C2ON = 1 and corresponding port
TRIS bit = 0.
PIC18(L)F2X/4XK22
DS41412A-page 314 Preliminary 2010 Microchip Technology Inc.
18.7 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 18-5. Since the analog input pins share their
connection with a digital input, they have reverse
biased ESD protection diodes to VDD and VSS. The
analog input, therefore, must be between VSS and VDD.
If the input voltage deviates from this range by more
than 0.6V in either direction, one of the diodes is
forward biased and a latch-up may occur.
A maximum source impedance of 10 kO is recommended
for the analog sources. Also, any external component
connected to an analog input pin, such as a capacitor or
a Zener diode, should have very little leakage current to
minimize inaccuracies introduced.
FIGURE 18-5: ANALOG INPUT MODEL
Note 1: When reading a PORT register, all pins
configured as analog inputs will read as a
0. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog levels on any pin defined as a
digital input, may cause the input buffer to
consume more current than is specified.
VA
Rs < 10K
CPIN
5 pF
VDD
VT ~ 0.6V
VT ~ 0.6V
RIC
ILEAKAGE
(1)
Vss
AIN
Legend: CPIN = Input Capacitance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS = Source Impedance
VA = Analog Voltage
VT = Threshold Voltage
Note 1: See Section 27.0 Electrical Characteristics.
To Comparator
2010 Microchip Technology Inc. Preliminary DS41412A-page 315
PIC18(L)F2X/4XK22
18.8 Additional Comparator Features
There are four additional comparator features:
Simultaneous read of comparator outputs
Internal reference selection
Hysteresis selection
Output Synchronization
18.8.1 SIMULTANEOUS COMPARATOR
OUTPUT READ
The MC1OUT and MC2OUT bits of the CM2CON1
register are mirror copies of both comparator outputs.
The ability to read both outputs simultaneously from a
single register eliminates the timing skew of reading
separate registers.
18.8.2 INTERNAL REFERENCE
SELECTION
There are two internal voltage references available to
the non-inverting input of each comparator. One of
these is the Fixed Voltage Reference (FVR) and the
other is the variable Digital-to-Analog Converter (DAC).
The CxRSEL bit of the CM2CON1 register determines
which of these references is routed to the Comparator
Voltage reference output (CXVREF). Further routing to
the comparator is accomplished by the CxR bit of the
CMxCON0 register. See Section 21.0 Fixed Voltage
Reference (FVR) and Figure 18-2 for more detail.
18.8.3 COMPARATOR HYSTERESIS
Each Comparator has a selectable hysteresis feature.
The hysteresis can be enabled by setting the CxHYS
bit of the CM2CON1 register. See Section 27.0 Elec-
trical Characteristics for more details.
18.8.4 SYNCHRONIZING COMPARATOR
OUTPUT TO TIMER1
The Comparator Cx output can be synchronized with
Timer1 by setting the CxSYNC bit of the CM2CON1
register. When enabled, the Cx output is latched on
the falling edge of the Timer1 source clock. If a
prescaler is used with Timer1, the comparator output
is latched after the prescaling function. To prevent a
race condition between the Timer1 clock and Timer1
gate, Timer1 increments on the rising edge of its clock
source, and the falling edge latches the comparator
output. See the Comparator Block Diagram
(Figure 18-2) and the Timer1 Block Diagram
(Figure 12-1) for more information.
Note 1: Obtaining the status of C1OUT or C2OUT
by reading CM2CON1 does not affect the
comparator interrupt mismatch registers.
PIC18(L)F2X/4XK22
DS41412A-page 316 Preliminary 2010 Microchip Technology Inc.
REGISTER 18-3: CM2CON1: COMPARATOR 1 AND 2 CONTROL REGISTER
R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MC1OUT MC2OUT C1RSEL C2RSEL C1HYS C2HYS C1SYNC C2SYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 MC1OUT: Mirror Copy of C1OUT bit
bit 6 MC2OUT: Mirror Copy of C2OUT bit
bit 5 C1RSEL: Comparator C1 Reference Select bit
1 = FVR BUF1 routed to C1VREF input
0 = DAC routed to C1VREF input
bit 4 C2RSEL: Comparator C2 Reference Select bit
1 = FVR BUF1 routed to C2VREF input
0 = DAC routed to C2VREF input
bit 3 C1HYS: Comparator C1 Hysteresis Enable bit
1 = Comparator C1 hysteresis enabled
0 = Comparator C1 hysteresis disabled
bit 2 C2HYS: Comparator C2 Hysteresis Enable bit
1 = Comparator C2 hysteresis enabled
0 = Comparator C2 hysteresis disabled
bit 1 C1SYNC: C1 Output Synchronous Mode bit
1 = C1 output is synchronized to rising edge of TMR1 clock (T1CLK)
0 = C1 output is asynchronous
bit 0 C2SYNC: C2 Output Synchronous Mode bit
1 = C2 output is synchronized to rising edge of TMR1 clock (T1CLK)
0 = C2 output is asynchronous
2010 Microchip Technology Inc. Preliminary DS41412A-page 317
PIC18(L)F2X/4XK22
TABLE 18-2: REGISTERS ASSOCIATED WITH COMPARATOR MODULE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
ANSELA ANSA5 ANSA3 ANSA2 ANSA1 ANSA0 153
ANSELB ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 154
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL C1HYS C2HYS C1SYNC C2SYNC 316
CM1CON0 C1ON C1OUT C1OE C1POL C1SP C1R C1CH<1:0> 312
CM2CON0 C2ON C2OUT C2OE C2POL C2SP C2R C2CH<1:0> 313
VREFCON1 DACEN DACLPS DACOE DACPSS<1:0> DACNSS 343
VREFCON2 DACR<4:0> 344
VREFCON0 FVREN FVRST FVRS<1:0> 340
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 115
IPR2 OSCFIP C1IP C2IP EEIP BCL1IP HLVDIP TMR3IP CCP2IP 128
PIE2 OSCFIE C1IE C2IE EEIE BCL1IE HLVDIE TMR3IE CCP2IE 124
PIR2 OSCFIF C1IF C2IF EEIF BCL1IF HLVDIF TMR3IF CCP2IF 119
PMD2 CTMUMD CMP2MD CMP1MD ADCMD 58
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 155
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 155
Legend: = unimplemented locations, read as 0. Shaded bits are not used by the Comparator Module.
PIC18(L)F2X/4XK22
DS41412A-page 318 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS41412A-page 319
PIC18(L)F2X/4XK22
19.0 CHARGE TIME
MEASUREMENT UNIT (CTMU)
The Charge Time Measurement Unit (CTMU) is a
flexible analog module that provides accurate
differential time measurement between pulse sources,
as well as asynchronous pulse generation. By working
with other on-chip analog modules, the CTMU can be
used to precisely measure time, measure capacitance,
measure relative changes in capacitance or generate
output pulses with a specific time delay. The CTMU is
ideal for interfacing with capacitive-based sensors.
The module includes the following key features:
Up to 28
(1)
channels available for capacitive or
time measurement input
On-chip precision current source
Four-edge input trigger sources
Polarity control for each edge source
Control of edge sequence
Control of response to edges
Time measurement resolution of 1 nanosecond
High precision time measurement
Time delay of external or internal signal
asynchronous to system clock
Accurate current source suitable for capacitive
measurement
The CTMU works in conjunction with the A/D Converter
to provide up to 28
(1)
channels for time or charge
measurement, depending on the specific device and
the number of A/D channels available. When config-
ured for time delay, the CTMU is connected to the
C12IN1- input of Comparator 2. The level-sensitive
input edge sources can be selected from four sources:
two external input pins (CTED1/CTED2) or the ECCP1/
(E)CCP2 Special Event Triggers.
Figure 19-1 provides a block diagram of the CTMU.
FIGURE 19-1: CTMU BLOCK DIAGRAM
Note 1: PIC18(L)F2XK22 devices have up to 17
channels available.
CTED1
CTED2
Current Source
Edge
Control
Logic
CTMUCONH/CTMUCONL
Pulse
Generator
A/D Converter Comparator 2
Input
ECCP2
ECCP1
Current
Control
ITRIM<5:0>
IRNG<1:0>
CTMUICON
CTMU
Control
Logic
EDGEN
EDGSEQEN
EDG1SELx
EDG1POL
EDG2SELx
EDG2POL
EDG1STAT
EDG2STAT
TGEN
IDISSEN
CTPLS
Comparator 2 Output
CTTRIG
PIC18(L)F2X/4XK22
DS41412A-page 320 Preliminary 2010 Microchip Technology Inc.
19.1 CTMU Operation
The CTMU works by using a fixed current source to
charge a circuit. The type of circuit depends on the type
of measurement being made. In the case of charge
measurement, the current is fixed, and the amount of
time the current is applied to the circuit is fixed. The
amount of voltage read by the A/D is then a measure-
ment of the capacitance of the circuit. In the case of
time measurement, the current, as well as the capaci-
tance of the circuit, is fixed. In this case, the voltage
read by the A/D is then representative of the amount of
time elapsed from the time the current source starts
and stops charging the circuit.
If the CTMU is being used as a time delay, both
capacitance and current source are fixed, as well as the
voltage supplied to the comparator circuit. The delay of
a signal is determined by the amount of time it takes the
voltage to charge to the comparator threshold voltage.
19.1.1 THEORY OF OPERATION
The operation of the CTMU is based on the equation
for charge:
More simply, the amount of charge measured in
coulombs in a circuit is defined as current in amperes
(I) multiplied by the amount of time in seconds that the
current flows (t). Charge is also defined as the
capacitance in farads (C) multiplied by the voltage of
the circuit (V). It follows that:
The CTMU module provides a constant, known current
source. The A/D Converter is used to measure (V) in
the equation, leaving two unknowns: capacitance (C)
and time (t). The above equation can be used to calcu-
late capacitance or time, by either the relationship
using the known fixed capacitance of the circuit:
or by:
using a fixed time that the current source is applied to
the circuit.
19.1.2 CURRENT SOURCE
At the heart of the CTMU is a precision current source,
designed to provide a constant reference for measure-
ments. The level of current is user-selectable across
three ranges or a total of two orders of magnitude, with
the ability to trim the output in 2% increments
(nominal). The current range is selected by the
IRNG<1:0> bits (CTMUICON<1:0>), with a value of
00 representing the lowest range.
Current trim is provided by the ITRIM<5:0> bits
(CTMUICON<7:2>). These six bits allow trimming of
the current source in steps of approximately 2% per
step. Note that half of the range adjusts the current
source positively and the other half reduces the current
source. A value of 000000 is the neutral position (no
change). A value of 100000 is the maximum negative
adjustment (approximately -62%) and 011111 is the
maximum positive adjustment (approximately +62%).
19.1.3 EDGE SELECTION AND CONTROL
CTMU measurements are controlled by edge events
occurring on the modules two input channels. Each
channel, referred to as Edge 1 and Edge 2, can be con-
figured to receive input pulses from one of the edge
input pins (CTED1 and CTED2) or ECCPx Special
Event Triggers. The input channels are level-sensitive,
responding to the instantaneous level on the channel
rather than a transition between levels. The inputs are
selected using the EDG1SEL and EDG2SEL bit pairs
(CTMUCONL<3:2 and 6:5>).
In addition to source, each channel can be configured for
event polarity using the EDGE2POL and EDGE1POL
bits (CTMUCONL<7,4>). The input channels can also
be filtered for an edge event sequence (Edge 1 occur-
ring before Edge 2) by setting the EDGSEQEN bit
(CTMUCONH<2>).
19.1.4 EDGE STATUS
The CTMUCONL register also contains two Status bits:
EDG2STAT and EDG1STAT (CTMUCONL<1:0>).
Their primary function is to show if an edge response
has occurred on the corresponding channel. The
CTMU automatically sets a particular bit when an edge
response is detected on its channel. The level-sensitive
nature of the input channels also means that the Status
bits become set immediately if the channels configura-
tion is changed and is the same as the channels
current state.
C I
dV
dT
------- =
I t C V. =
t C V ( ) I =
C I t ( ) V =
2010 Microchip Technology Inc. Preliminary DS41412A-page 321
PIC18(L)F2X/4XK22
The module uses the edge Status bits to control the
current source output to external analog modules (such
as the A/D Converter). Current is only supplied to
external modules when only one (but not both) of the
Status bits is set, and shuts current off when both bits
are either set or cleared. This allows the CTMU to
measure current only during the interval between
edges. After both Status bits are set, it is necessary to
clear them before another measurement is taken. Both
bits should be cleared simultaneously, if possible, to
avoid re-enabling the CTMU current source.
In addition to being set by the CTMU hardware, the
edge Status bits can also be set by software. This is
also the users application to manually enable or
disable the current source. Setting either one (but not
both) of the bits enables the current source. Setting or
clearing both bits at once disables the source.
19.1.5 INTERRUPTS
The CTMU sets its interrupt flag (PIR3<2>) whenever
the current source is enabled, then disabled. An
interrupt is generated only if the corresponding
interrupt enable bit (PIE3<2>) is also set. If edge
sequencing is not enabled (i.e., Edge 1 must occur
before Edge 2), it is necessary to monitor the edge
Status bits and determine which edge occurred last and
caused the interrupt.
19.2 CTMU Module Initialization
The following sequence is a general guideline used to
initialize the CTMU module:
1. Select the current source range using the IRNG
bits (CTMUICON<1:0>).
2. Adjust the current source trim using the ITRIM
bits (CTMUICON<7:2>).
3. Configure the edge input sources for Edge 1 and
Edge 2 by setting the EDG1SEL and EDG2SEL
bits (CTMUCONL<3:2 and 6:5>).
4. Configure the input polarities for the edge inputs
using the EDG1POL and EDG2POL bits
(CTMUCONL<4,7>). The default configuration
is for negative edge polarity (high-to-low
transitions).
5. Enable edge sequencing using the EDGSEQEN
bit (CTMUCONH<2>). By default, edge
sequencing is disabled.
6. Select the operating mode (Measurement or
Time Delay) with the TGEN bit. The default
mode is Time/Capacitance Measurement.
7. Discharge the connected circuit by setting the
IDISSEN bit (CTMUCONH<1>); after waiting a
sufficient time for the circuit to discharge, clear
IDISSEN.
8. Disable the module by clearing the CTMUEN bit
(CTMUCONH<7>).
9. Enable the module by setting the CTMUEN bit.
10. Clear the Edge Status bits: EDG2STAT and
EDG1STAT (CTMUCONL<1:0>).
11. Enable both edge inputs by setting the EDGEN
bit (CTMUCONH<3>).
Depending on the type of measurement or pulse
generation being performed, one or more additional
modules may also need to be initialized and configured
with the CTMU module:
Edge Source Generation: In addition to the
external edge input pins, both Timer1 and the
Output Compare/PWM1 module can be used as
edge sources for the CTMU.
Capacitance or Time Measurement: The CTMU
module uses the A/D Converter to measure the
voltage across a capacitor that is connected to one
of the analog input channels.
Pulse Generation: When generating system clock
independent output pulses, the CTMU module
uses Comparator 2 and the associated
comparator voltage reference.
PIC18(L)F2X/4XK22
DS41412A-page 322 Preliminary 2010 Microchip Technology Inc.
19.3 Calibrating the CTMU Module
The CTMU requires calibration for precise
measurements of capacitance and time, as well as for
accurate time delay. If the application only requires
measurement of a relative change in capacitance or
time, calibration is usually not necessary. An example of
this type of application would include a capacitive touch
switch, in which the touch circuit has a baseline
capacitance, and the added capacitance of the human
body changes the overall capacitance of a circuit.
If actual capacitance or time measurement is required,
two hardware calibrations must take place: the current
source needs calibration to set it to a precise current,
and the circuit being measured needs calibration to
measure and/or nullify all other capacitance other than
that to be measured.
19.3.1 CURRENT SOURCE CALIBRATION
The current source on board the CTMU module has a
range of 60% nominal for each of three current
ranges. Therefore, for precise measurements, it is
possible to measure and adjust this current source by
placing a high precision resistor, RCAL, onto an unused
analog channel. An example circuit is shown in
Figure 19-2. The current source measurement is
performed using the following steps:
1. Initialize the A/D Converter.
2. Initialize the CTMU.
3. Enable the current source by setting EDG1STAT
(CTMUCONL<0>).
4. Issue settling time delay.
5. Perform A/D conversion.
6. Calculate the current source current using
I = V/ RCAL, where RCAL is a high precision
resistance and V is measured by performing an
A/D conversion.
The CTMU current source may be trimmed with the
trim bits in CTMUICON using an iterative process to get
an exact desired current. Alternatively, the nominal
value without adjustment may be used; it may be
stored by the software for use in all subsequent
capacitive or time measurements.
To calculate the value for RCAL, the nominal current
must be chosen, and then the resistance can be
calculated. For example, if the A/D Converter reference
voltage is 3.3V, use 70% of full scale, or 2.31V as the
desired approximate voltage to be read by the A/D
Converter. If the range of the CTMU current source is
selected to be 0.55 A, the resistor value needed is cal-
culated as RCAL = 2.31V/0.55 A, for a value of 4.2 M.
Similarly, if the current source is chosen to be 5.5 A,
RCAL would be 420,000, and 42,000 if the current
source is set to 55 A.
FIGURE 19-2: CTMU CURRENT SOURCE
CALIBRATION CIRCUIT
A value of 70% of full-scale voltage is chosen to make
sure that the A/D Converter was in a range that is well
above the noise floor. Keep in mind that if an exact cur-
rent is chosen, that is to incorporate the trimming bits
from CTMUICON, the resistor value of RCAL may need
to be adjusted accordingly. RCAL may also be adjusted
to allow for available resistor values. RCAL should be of
the highest precision available, keeping in mind the
amount of precision needed for the circuit that the
CTMU will be used to measure. A recommended
minimum would be 0.1% tolerance.
The following examples show one typical method for
performing a CTMU current calibration. Example 19-1
demonstrates how to initialize the A/D Converter and
the CTMU; this routine is typical for applications using
both modules. Example 19-2 demonstrates one
method for the actual calibration routine.
PIC18(L)FXXK22 Device
A/D Converter
CTMU
ANx
RCAL
Current Source
MUX
A/D
2010 Microchip Technology Inc. Preliminary DS41412A-page 323
PIC18(L)F2X/4XK22
EXAMPLE 19-1: SETUP FOR CTMU CALIBRATION ROUTINES
#include "p18cxxx.h"
/**************************************************************************/
/*Setup CTMU *****************************************************************/
/**************************************************************************/
void setup(void)
{ //CTMUCONH/1 - CTMU Control registers
CTMUCONH = 0x00; //make sure CTMU is disabled
CTMUCONL = 0x90;
//CTMU continues to run when emulator is stopped,CTMU continues
//to run in idle mode,Time Generation mode disabled, Edges are blocked
//No edge sequence order, Analog current source not grounded, trigger
//output disabled, Edge2 polarity = positive level, Edge2 source =
//source 0, Edge1 polarity = positive level, Edge1 source = source 0,
//CTMUICON - CTMU Current Control Register
CTMUICON = 0x01; //0.55uA, Nominal - No Adjustment
/**************************************************************************/
//Setup AD converter;
/**************************************************************************/
TRISA=0x04; //set channel 2 as an input
// Configure AN2 as an analog channel
ANSELAbits.ANSA2=1;
TRISAbits.TRISA2=1;
// ADCON2
ADCON2bits.ADFM=1; // Results format 1= Right justified
ADCON2bits.ACQT=1; // Acquition time 7 = 20TAD 2 = 4TAD 1=2TAD
ADCON2bits.ADCS=2; // Clock conversion bits 6= FOSC/64 2=FOSC/32
// ADCON1
ADCON1bits.PVCFG0 =0; // Vref+ = AVdd
ADCON1bits.NVCFG1 =0; // Vref- = AVss
// ADCON0
ADCON0bits.CHS=2; // Select ADC channel
ADCON0bits.ADON=1; // Turn on ADC
}
PIC18(L)F2X/4XK22
DS41412A-page 324 Preliminary 2010 Microchip Technology Inc.
EXAMPLE 19-2: CURRENT CALIBRATION ROUTINE
#include "p18cxxx.h"
#define COUNT 500 //@ 8MHz = 125uS.
#define DELAY for(i=0;i<COUNT;i++)
#define RCAL .027 //R value is 4200000 (4.2M)
//scaled so that result is in
//1/100th of uA
#define ADSCALE 1023 //for unsigned conversion 10 sig bits
#define ADREF 3.3 //Vdd connected to A/D Vr+
int main(void)
{
int i;
int j = 0; //index for loop
unsigned int Vread = 0;
double VTot = 0;
float Vavg=0, Vcal=0, CTMUISrc = 0; //float values stored for calcs
//assume CTMU and A/D have been setup correctly
//see Example 25-1 for CTMU & A/D setup
setup();
CTMUCONHbits.CTMUEN = 1; //Enable the CTMU
CTMUCONLbits.EDG1STAT = 0; // Set Edge status bits to zero
CTMUCONLbits.EDG2STAT = 0;
for(j=0;j<10;j++)
{
CTMUCONHbits.IDISSEN = 1; //drain charge on the circuit
DELAY; //wait 125us
CTMUCONHbits.IDISSEN = 0; //end drain of circuit
CTMUCONLbits.EDG1STAT = 1; //Begin charging the circuit
//using CTMU current source
DELAY; //wait for 125us
CTMUCONLbits.EDG1STAT = 0; //Stop charging circuit
PIR1bits.ADIF = 0; //make sure A/D Int not set
ADCON0bits.GO=1; //and begin A/D conv.
while(!PIR1bits.ADIF); //Wait for A/D convert complete
Vread = ADRES; //Get the value from the A/D
PIR1bits.ADIF = 0; //Clear A/D Interrupt Flag
VTot += Vread; //Add the reading to the total
}
Vavg = (float)(VTot/10.000); //Average of 10 readings
Vcal = (float)(Vavg/ADSCALE*ADREF);
CTMUISrc = Vcal/RCAL; //CTMUISrc is in 1/100ths of uA
}
2010 Microchip Technology Inc. Preliminary DS41412A-page 325
PIC18(L)F2X/4XK22
19.3.2 CAPACITANCE CALIBRATION
There is a small amount of capacitance from the
internal A/D Converter sample capacitor as well as
stray capacitance from the circuit board traces and
pads that affect the precision of capacitance
measurements. A measurement of the stray
capacitance can be taken by making sure the desired
capacitance to be measured has been removed. The
measurement is then performed using the following
steps:
1. Initialize the A/D Converter and the CTMU.
2. Set EDG1STAT (= 1).
3. Wait for a fixed delay of time t.
4. Clear EDG1STAT.
5. Perform an A/D conversion.
6. Calculate the stray and A/D sample capacitances:
where I is known from the current source measurement
step, t is a fixed delay and V is measured by performing
an A/D conversion.
This measured value is then stored and used for
calculations of time measurement or subtracted for
capacitance measurement. For calibration, it is
expected that the capacitance of CSTRAY + CAD is
approximately known. CAD is approximately 4 pF.
An iterative process may need to be used to adjust the
time, t, that the circuit is charged to obtain a reasonable
voltage reading from the A/D Converter. The value of t
may be determined by setting COFFSET to a theoretical
value, then solving for t. For example, if CSTRAY is
theoretically calculated to be 11 pF, and V is expected
to be 70% of VDD, or 2.31V, then t would be:
or 63 s.
See Example 19-3 for a typical routine for CTMU
capacitance calibration.
C
OFFSET
C
STRAY
C
AD
+ I t ( ) V = =
(4 pF + 11 pF) 2.31V/0.55 A
PIC18(L)F2X/4XK22
DS41412A-page 326 Preliminary 2010 Microchip Technology Inc.
EXAMPLE 19-3: CAPACITANCE CALIBRATION ROUTINE
#include "p18cxxx.h"
#define COUNT 25 //@ 8MHz INTFRC = 62.5 us.
#define ETIME COUNT*2.5 //time in uS
#define DELAY for(i=0;i<COUNT;i++)
#define ADSCALE 1023 //for unsigned conversion 10 sig
bits
#define ADREF 3.3 //Vdd connected to A/D Vr+
#define RCAL .027 //R value is 4200000 (4.2M)
//scaled so that result is in
//1/100th of uA
int main(void)
{
int i;
int j = 0; //index for loop
unsigned int Vread = 0;
float CTMUISrc, CTMUCap, Vavg, VTot, Vcal;
//assume CTMU and A/D have been setup correctly
//see Example 25-1 for CTMU & A/D setup
setup();
CTMUCONHbits.CTMUEN = 1; //Enable the CTMU
CTMUCONLbits.EDG1STAT = 0; // Set Edge status bits to zero
CTMUCONLbits.EDG2STAT = 0;
for(j=0;j<10;j++)
{
CTMUCONHbits.IDISSEN = 1; //drain charge on the circuit
DELAY; //wait 125us
CTMUCONHbits.IDISSEN = 0; //end drain of circuit
CTMUCONLbits.EDG1STAT = 1; //Begin charging the circuit
//using CTMU current source
DELAY; //wait for 125us
CTMUCONLbits.EDG1STAT = 0; //Stop charging circuit
PIR1bits.ADIF = 0; //make sure A/D Int not set
ADCON0bits.GO=1; //and begin A/D conv.
while(!PIR1bits.ADIF); //Wait for A/D convert complete
Vread = ADRES; //Get the value from the A/D
PIR1bits.ADIF = 0; //Clear A/D Interrupt Flag
VTot += Vread; //Add the reading to the total
}
Vavg = (float)(VTot/10.000); //Average of 10 readings
Vcal = (float)(Vavg/ADSCALE*ADREF);
CTMUISrc = Vcal/RCAL; //CTMUISrc is in 1/100ths of uA
CTMUCap = (CTMUISrc*ETIME/Vcal)/100;
}
2010 Microchip Technology Inc. Preliminary DS41412A-page 327
PIC18(L)F2X/4XK22
19.4 Measuring Capacitance with the
CTMU
There are two separate methods of measuring
capacitance with the CTMU. The first is the absolute
method, in which the actual capacitance value is
desired. The second is the relative method, in which
the actual capacitance is not needed, rather an
indication of a change in capacitance is required.
19.4.1 ABSOLUTE CAPACITANCE
MEASUREMENT
For absolute capacitance measurements, both the
current and capacitance calibration steps found in
Section 19.3 Calibrating the CTMU Module
should be followed. Capacitance measurements are
then performed using the following steps:
1. Initialize the A/D Converter.
2. Initialize the CTMU.
3. Set EDG1STAT.
4. Wait for a fixed delay, T.
5. Clear EDG1STAT.
6. Perform an A/D conversion.
7. Calculate the total capacitance, CTOTAL = (I * T)/V,
where I is known from the current source
measurement step (see Section 19.3.1 Current
Source Calibration), T is a fixed delay and V is
measured by performing an A/D conversion.
8. Subtract the stray and A/D capacitance
(COFFSET from Section 19.3.2 Capacitance
Calibration) from CTOTAL to determine the
measured capacitance.
19.4.2 RELATIVE CHARGE
MEASUREMENT
An application may not require precise capacitance
measurements. For example, when detecting a valid
press of a capacitance-based switch, detecting a rela-
tive change of capacitance is of interest. In this type of
application, when the switch is open (or not touched),
the total capacitance is the capacitance of the combina-
tion of the board traces, the A/D Converter, etc. A larger
voltage will be measured by the A/D Converter. When
the switch is closed (or is touched), the total
capacitance is larger due to the addition of the
capacitance of the human body to the above listed
capacitances, and a smaller voltage will be measured
by the A/D Converter.
Detecting capacitance changes is easily accomplished
with the CTMU using these steps:
1. Initialize the A/D Converter and the CTMU.
2. Set EDG1STAT.
3. Wait for a fixed delay.
4. Clear EDG1STAT.
5. Perform an A/D conversion.
The voltage measured by performing the A/D
conversion is an indication of the relative capacitance.
Note that in this case, no calibration of the current
source or circuit capacitance measurement is needed.
See Example 19-4 for a sample software routine for a
capacitive touch switch.
PIC18(L)F2X/4XK22
DS41412A-page 328 Preliminary 2010 Microchip Technology Inc.
EXAMPLE 19-4: ROUTINE FOR CAPACITIVE TOUCH SWITCH
#include "p18cxxx.h"
#define COUNT 500 //@ 8MHz = 125uS.
#define DELAY for(i=0;i<COUNT;i++)
#define OPENSW 1000 //Un-pressed switch value
#define TRIP 300 //Difference between pressed
//and un-pressed switch
#define HYST 65 //amount to change
//from pressed to un-pressed
#define PRESSED 1
#define UNPRESSED 0
int main(void)
{
unsigned int Vread; //storage for reading
unsigned int switchState;
int i;
//assume CTMU and A/D have been setup correctly
//see Example 25-1 for CTMU & A/D setup
setup();
CTMUCONHbits.CTMUEN = 1; // Enable the CTMU
CTMUCONLbits.EDG1STAT = 0; // Set Edge status bits to zero
CTMUCONLbits.EDG2STAT = 0;
CTMUCONHbits.IDISSEN = 1; //drain charge on the circuit
DELAY; //wait 125us
CTMUCONHbits.IDISSEN = 0; //end drain of circuit
CTMUCONLbits.EDG1STAT = 1; //Begin charging the circuit
//using CTMU current source
DELAY; //wait for 125us
CTMUCONLbits.EDG1STAT = 0; //Stop charging circuit
PIR1bits.ADIF = 0; //make sure A/D Int not set
ADCON0bits.GO=1; //and begin A/D conv.
while(!PIR1bits.ADIF); //Wait for A/D convert complete
Vread = ADRES; //Get the value from the A/D
if(Vread < OPENSW - TRIP)
{
switchState = PRESSED;
}
else if(Vread > OPENSW - TRIP + HYST)
{
switchState = UNPRESSED;
}
}
2010 Microchip Technology Inc. Preliminary DS41412A-page 329
PIC18(L)F2X/4XK22
19.5 Measuring Time with the CTMU
Module
Time can be precisely measured after the ratio (C/I) is
measured from the current and capacitance calibration
step by following these steps:
1. Initialize the A/D Converter and the CTMU.
2. Set EDG1STAT.
3. Set EDG2STAT.
4. Perform an A/D conversion.
5. Calculate the time between edges as T = (C/I) * V,
where I is calculated in the current calibration step
(Section 19.3.1 Current Source Calibration),
C is calculated in the capacitance calibration step
(Section 19.3.2 Capacitance Calibration) and
V is measured by performing the A/D conversion.
It is assumed that the time measured is small enough
that the capacitance, COFFSET, provides a valid voltage
to the A/D Converter. For the smallest time measure-
ment, always set the A/D Channel Select register
(AD1CHS) to an unused A/D channel; the correspond-
ing pin for which is not connected to any circuit board
trace. This minimizes added stray capacitance, keep-
ing the total circuit capacitance close to that of the A/D
Converter itself (4-5 pF). To measure longer time
intervals, an external capacitor may be connected to an
A/D channel and this channel selected when making a
time measurement.
FIGURE 19-3: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR TIME
MEASUREMENT
A/D Converter
CTMU
CTED1
CTED2
ANX
Output Pulse
EDG1
EDG2
CAD
RPR
Current Source
PIC18(L)FXXK22 Device
PIC18(L)F2X/4XK22
DS41412A-page 330 Preliminary 2010 Microchip Technology Inc.
19.6 Creating a Delay with the CTMU
Module
A unique feature on board the CTMU module is its
ability to generate system clock independent output
pulses based on an external capacitor value. This is
accomplished using the internal comparator voltage
reference module, Comparator 2 input pin and an
external capacitor. The pulse is output onto the CTPLS
pin. To enable this mode, set the TGEN bit.
See Figure 19-4 for an example circuit. CPULSE is
chosen by the user to determine the output pulse width
on CTPLS. The pulse width is calculated by
T = (CPULSE/ I)*V, where I is known from the current
source measurement step (Section 19.3.1 Current
Source Calibration) and V is the internal reference
voltage (CVREF).
An example use of this feature is for interfacing with
variable capacitive-based sensors, such as a humidity
sensor. As the humidity varies, the pulse width output
on CTPLS will vary. The CTPLS output pin can be con-
nected to an input capture pin and the varying pulse
width is measured to determine the humidity in the
application.
Follow these steps to use this feature:
1. Initialize Comparator 2.
2. Initialize the comparator voltage reference.
3. Initialize the CTMU and enable time delay
generation by setting the TGEN bit.
4. Set EDG1STAT.
5. When CPULSE charges to the value of the voltage
reference trip point, an output pulse is generated
on CTPLS.
FIGURE 19-4: TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR PULSE
DELAY GENERATION
19.7 Operation During Sleep/Idle
Modes
19.7.1 SLEEP MODE AND DEEP SLEEP
MODES
When the device enters any Sleep mode, the CTMU
module current source is always disabled. If the CTMU
is performing an operation that depends on the current
source when Sleep mode is invoked, the operation may
not terminate correctly. Capacitance and time
measurements may return erroneous values.
19.7.2 IDLE MODE
The behavior of the CTMU in Idle mode is determined
by the CTMUSIDL bit (CTMUCONH<5>). If CTMUSIDL
is cleared, the module will continue to operate in Idle
mode. If CTMUSIDL is set, the modules current source
is disabled when the device enters Idle mode. If the
module is performing an operation when Idle mode is
invoked, in this case, the results will be similar to those
with Sleep mode.
19.8 CTMU Peripheral Module Disable
(PMD)
When this peripheral is not used, the Peripheral
Module Disable bit can be set to disconnect all clock
sources to the module, reducing power consumption to
an absolute minimum. See Section 3.6 Selective
Peripheral Module Control.
C2
CVREF
CTPLS
PIC18(L)FXXK22 Device
Current Source
Comparator
CTMU
CTED1
C12IN1-
CPULSE
EDG1
2010 Microchip Technology Inc. Preliminary DS41412A-page 331
PIC18(L)F2X/4XK22
19.9 Effects of a Reset on CTMU
Upon Reset, all registers of the CTMU are cleared. This
leaves the CTMU module disabled, its current source is
turned off and all configuration options return to their
default settings. The module needs to be re-initialized
following any Reset.
If the CTMU is in the process of taking a measurement at
the time of Reset, the measurement will be lost. A partial
charge may exist on the circuit that was being measured,
and should be properly discharged before the CTMU
makes subsequent attempts to make a measurement.
The circuit is discharged by setting and then clearing the
IDISSEN bit (CTMUCONH<1>) while the A/D Converter
is connected to the appropriate channel.
19.10 Registers
There are three control registers for the CTMU:
CTMUCONH
CTMUCONL
CTMUICON
The CTMUCONH and CTMUCONL registers
(Register 19-1 and Register 19-2) contain control bits
for configuring the CTMU module edge source selec-
tion, edge source polarity selection, edge sequencing,
A/D trigger, analog circuit capacitor discharge and
enables. The CTMUICON register (Register 19-3) has
bits for selecting the current source range and current
source trim.
REGISTER 19-1: CTMUCONH: CTMU CONTROL REGISTER 0
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
CTMUEN CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 CTMUEN: CTMU Enable bit
1 = Module is enabled
0 = Module is disabled
bit 6 Unimplemented: Read as 0
bit 5 CTMUSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 4 TGEN: Time Generation Enable bit
1 = Enables edge delay generation
0 = Disables edge delay generation
bit 3 EDGEN: Edge Enable bit
1 = Edges are not blocked
0 = Edges are blocked
bit 2 EDGSEQEN: Edge Sequence Enable bit
1 = Edge 1 event must occur before Edge 2 event can occur
0 = No edge sequence is needed
bit 1 IDISSEN: Analog Current Source Control bit
1 = Analog current source output is grounded
0 = Analog current source output is not grounded
bit 0 CTTRIG: CTMU Special Event Trigger Control Bit
1 = CTMU Special Event Trigger is enabled
0 = CTMU Special Event Trigger is disabled
PIC18(L)F2X/4XK22
DS41412A-page 332 Preliminary 2010 Microchip Technology Inc.
REGISTER 19-2: CTMUCONL: CTMU CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EDG2POL EDG2SEL<1:0> EDG1POL EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 EDG2POL: Edge 2 Polarity Select bit
1 = Edge 2 programmed for a positive edge response
0 = Edge 2 programmed for a negative edge response
bit 6-5 EDG2SEL<1:0>: Edge 2 Source Select bits
11 = CTED1 pin
10 = CTED2 pin
01 = ECCP1 Special Event Trigger
00 = ECCP2 Special Event Trigger
bit 4 EDG1POL: Edge 1 Polarity Select bit
1 = Edge 1 programmed for a positive edge response
0 = Edge 1 programmed for a negative edge response
bit 3-2 EDG1SEL<1:0>: Edge 1 Source Select bits
11 = CTED1 pin
10 = CTED2 pin
01 = ECCP1 Special Event Trigger
00 = ECCP2 Special Event Trigger
bit 1 EDG2STAT: Edge 2 Status bit
1 = Edge 2 event has occurred
0 = Edge 2 event has not occurred
bit 0 EDG1STAT: Edge 1 Status bit
1 = Edge 1 event has occurred
0 = Edge 1 event has not occurred
2010 Microchip Technology Inc. Preliminary DS41412A-page 333
PIC18(L)F2X/4XK22
REGISTER 19-3: CTMUICON: CTMU CURRENT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ITRIM<5:0> IRNG<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7-2 ITRIM<5:0>: Current Source Trim bits
011111 = Maximum positive change from nominal current
011110
.
.
.
000001 = Minimum positive change from nominal current
000000 = Nominal current output specified by IRNG<1:0>
111111 = Minimum negative change from nominal current
.
.
.
100010
100001 = Maximum negative change from nominal current
bit 1-0 IRNG<1:0>: Current Source Range Select bits
11 = 100 Base current
10 = 10 Base current
01 = Base current level (0.55 A nominal)
00 = Current source disabled
TABLE 19-1: REGISTERS ASSOCIATED WITH CTMU MODULE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
CTMUCONH CTMUEN CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG 331
CTMUCONL EDG2POL EDG2SEL<1:0> EDG1POL EDG1SEL<1:0> EDG2STAT EDG1STAT 332
CTMUICON ITRIM<5:0> IRNG<1:0>
333
IPR3 SSP2IP BCL2IP RC2IP TX2IP CTMUIP TMR5GIP TMR3GIP TMR1GIP 129
PIE3 SSP2IE BCL2IE RC2IE TX2IE CTMUIE TMR5GIE TMR3GIE TMR1GIE
125
PIR3 SSP2IF BCL2IF RC2IF TX2IF CTMUIF TMR5GIF TMR3GIF TMR1GIF 120
PMD2
CTMUMD CMP2MD CMP1MD ADCMD
58
Legend: = unimplemented, read as 0. Shaded bits are not used during CTMU operation.
PIC18(L)F2X/4XK22
DS41412A-page 334 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS41412A-page 335
PIC18(L)F2X/4XK22
20.0 SR LATCH
The module consists of a single SR Latch with multiple
Set and Reset inputs as well as separate latch outputs.
The SR Latch module includes the following features:
Programmable input selection
SR Latch output is available internally/externally
Selectable Q and Q output
Firmware Set and Reset
The SR Latch can be used in a variety of analog
applications, including oscillator circuits, one-shot
circuit, hysteretic controllers, and analog timing
applications.
20.1 Latch Operation
The latch is a Set-Reset Latch that does not depend on
a clock source. Each of the Set and Reset inputs are
active-high. The latch can be set or reset by:
Software control (SRPS and SRPR bits)
Comparator C1 output (SYNCC1OUT)
Comparator C2 output (SYNCC2OUT)
SRI Pin
Programmable clock (DIVSRCLK)
The SRPS and the SRPR bits of the SRCON0 register
may be used to set or reset the SR Latch, respectively.
The latch is Reset-dominant. Therefore, if both Set and
Reset inputs are high, the latch will go to the Reset
state. Both the SRPS and SRPR bits are self resetting
which means that a single write to either of the bits is all
that is necessary to complete a latch Set or Reset
operation.
The output from Comparator C1 or C2 can be used as
the Set or Reset inputs of the SR Latch. The output of
either Comparator can be synchronized to the Timer1
clock source. See Section 18.0 Comparator
Module and Section 12.0 Timer1/3/5 Module with
Gate Control for more information.
An external source on the SRI pin can be used as the
Set or Reset inputs of the SR Latch.
An internal clock source, DIVSRCLK, is available and it
can periodically set or reset the SR Latch. The
SRCLK<2:0> bits in the SRCON0 register are used to
select the clock source period. The SRSCKE and
SRRCKE bits of the SRCON1 register enable the clock
source to set or reset the SR Latch, respectively.
20.2 Latch Output
The SRQEN and SRNQEN bits of the SRCON0 register
control the Q and Q latch outputs. Both of the SR Latch
outputs may be directly output to I/O pins at the same
time. Control is determined by the state of bits SRQEN
and SRNQEN in the SRCON0 register.
The applicable TRIS bit of the corresponding port must
be cleared to enable the port pin output driver.
20.3 DIVSRCLK Clock Generation
The DIVSRCLK clock signal is generated from the
peripheral clock which is pre-scaled by a value
determined by the SRCLK<2:0> bits. See Figure 20-2
and Table for additional detail.
20.4 Effects of a Reset
Upon any device Reset, the SR Latch is not initialized,
and the SRQ and SRNQ outputs are unknown. The
users firmware is responsible to initialize the latch
output before enabling it to the output pins.
PIC18(L)F2X/4XK22
DS41412A-page 336 Preliminary 2010 Microchip Technology Inc.
FIGURE 20-1: DIVSRCLK BLOCK DIAGRAM
FIGURE 20-2: SR LATCH SIMPLIFIED BLOCK DIAGRAM
3
SRCLK<2:0>
Peripheral
Clock
DIVSRCLK
Programmable
SRCLK divider
1:4 to 1:512
Tosc
4-512 cycles
...
SRCLK<2:0> = "001"
1:8
t0+4 t0 t0+8 t0+12
SRPS
S
R
Q
Q
Note 1: If R = 1 and S = 1 simultaneously, Q = 0, Q = 1
2: Pulse generator causes a pulse width of 2 TOSC clock cycles.
3: Name denotes the connection point at the comparator output.
Pulse
Gen
(2)
SR
Latch
(1)
SRQEN
SRSPE
SRSC2E
SRSCKE
DIVSRCLK
SYNCC2OUT
(3)
SRSC1E
SYNCC1OUT
(3)
SRPR Pulse
Gen
(2)
SRRPE
SRRC2E
SRRCKE
DIVSRCLK
SYNCC2OUT
(3)
SRRC1E
SYNCC1OUT
(3)
SRLEN
SRNQEN
SRLEN
SRQ
SRNQ
SRI
SRI
2010 Microchip Technology Inc. Preliminary DS41412A-page 337
PIC18(L)F2X/4XK22
TABLE 20-1: DIVSRCLK FREQUENCY TABLE
SRCLK<2:0> Divider FOSC = 20 MHz FOSC = 16 MHz FOSC = 8 MHz FOSC = 4 MHz FOSC = 1 MHz
111 512 25.6 s 32 s 64 s 128 s 512 s
110 256 12.8 s 16 s 32 s 64 s 256 s
101 128 6.4 s 8 s 16 s 32 s 128 s
100 64 3.2 s 4 s 8 s 16 s 64 s
011 32 1.6 s 2 s 4 s 8 s 32 s
010 16 0.8 s 1 s 2 s 4 s 16 s
001 8 0.4 s 0.5 s 1 s 2 s 8 s
000 4 0.2 s 0.25 s 0.5 s 1 s 4 s
REGISTER 20-1: SRCON0: SR LATCH CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented C = Clearable only bit
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 SRLEN: SR Latch Enable bit
(1)
1 = SR latch is enabled
0 = SR latch is disabled
bit 6-4 SRCLK<2:0>: SR Latch Clock Divider Bits
000 = Generates a 2 TOSC wide pulse on DIVSRCLK every 4 peripheral clock cycles
001 = Generates a 2 TOSC wide pulse on DIVSRCLK every 8 peripheral clock cycles
010 = Generates a 2 TOSC wide pulse on DIVSRCLK every 16 peripheral clock cycles
011 = Generates a 2 TOSC wide pulse on DIVSRCLK every 32 peripheral clock cycles
100 = Generates a 2 TOSC wide pulse on DIVSRCLK every 64 peripheral clock cycles
101 = Generates a 2 TOSC wide pulse on DIVSRCLK every 128 peripheral clock cycles
110 = Generates a 2 TOSC wide pulse on DIVSRCLK every 256 peripheral clock cycles
111 = Generates a 2 TOSC wide pulse on DIVSRCLK every 512 peripheral clock cycles
bit 3 SRQEN: SR Latch Q Output Enable bit
1 = Q is present on the SRQ pin
0 = Q is internal only
bit 2 SRNQEN: SR Latch Q Output Enable bit
1 = Q is present on the SRNQ pin
0 = Q is internal only
bit 1 SRPS: Pulse Set Input of the SR Latch bit
(2)
1 = Pulse set input for 2 TOSC clock cycles
0 = No effect on set input
bit 0 SRPR: Pulse Reset Input of the SR Latch bit
(2)
1 = Pulse reset input for 2 TOSC clock cycles
0 = No effect on Reset input
Note 1: Changing the SRCLK bits while the SR latch is enabled may cause false triggers to the set and Reset
inputs of the latch.
2: Set only, always reads back 0.
PIC18(L)F2X/4XK22
DS41412A-page 338 Preliminary 2010 Microchip Technology Inc.
REGISTER 20-2: SRCON1: SR LATCH CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented C = Clearable only bit
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 SRSPE: SR Latch Peripheral Set Enable bit
1 = SRI pin status sets SR Latch
0 = SRI pin status has no effect on SR Latch
bit 6 SRSCKE: SR Latch Set Clock Enable bit
1 = Set input of SR latch is pulsed with DIVSRCLK
0 = Set input of SR latch is not pulsed with DIVSRCLK
bit 5 SRSC2E: SR Latch C2 Set Enable bit
1 = C2 Comparator output sets SR Latch
0 = C2 Comparator output has no effect on SR Latch
bit 4 SRSC1E: SR Latch C1 Set Enable bit
1 = C1 Comparator output sets SR Latch
0 = C1 Comparator output has no effect on SR Latch
bit 3 SRRPE: SR Latch Peripheral Reset Enable bit
1 = SRI pin resets SR Latch
0 = SRI pin has no effect on SR Latch
bit 2 SRRCKE: SR Latch Reset Clock Enable bit
1 = Reset input of SR latch is pulsed with DIVSRCLK
0 = Reset input of SR latch is not pulsed with DIVSRCLK
bit 1 SRRC2E: SR Latch C2 Reset Enable bit
1 = C2 Comparator output resets SR Latch
0 = C2 Comparator output has no effect on SR Latch
bit 0 SRRC1E: SR Latch C1 Reset Enable bit
1 = C1 Comparator output resets SR Latch
0 = C1 Comparator output has no effect on SR Latch
TABLE 20-2: REGISTERS ASSOCIATED WITH THE SR LATCH
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
SRCON0 SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR 337
SRCON1 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E 338
TRISA
TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0
155
TRISB
TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
155
WPUB
WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0
156
Legend: Shaded bits are not used with this module.
2010 Microchip Technology Inc. Preliminary DS41412A-page 339
PIC18(L)F2X/4XK22
21.0 FIXED VOLTAGE REFERENCE
(FVR)
The Fixed Voltage Reference, or FVR, is a stable
voltage reference, independent of VDD, with 1.024V,
2.048V or 4.096V selectable output levels. The output
of the FVR can be configured to supply a reference
voltage to the following:
ADC input channel
ADC positive reference
Comparator positive input
Digital-to-Analog Converter (DAC)
The FVR can be enabled by setting the FVREN bit of
the VREFCON0 register.
21.1 Independent Gain Amplifiers
The output of the FVR supplied to the ADC,
Comparators and DAC is routed through an
independent programmable gain amplifier. The
amplifier can be configured to amplify the 1.024V
reference voltage by 1x, 2x or 4x, to produce the three
possible voltage levels.
The FVRS<1:0> bits of the VREFCON0 register are
used to enable and configure the gain amplifier settings
for the reference supplied to the DAC and Comparator
modules. When the ADC module is configured to use
the FVR output, (FVR BUF2) the reference is buffered
through an additional unity gain amplifier. This buffer is
disabled if the ADC is not configured to use the FVR.
For specific use of the FVR, refer to the specific module
sections: Section 17.0 Analog-to-Digital Converter
(ADC) Module, Section 22.0 Digital-to-Analog
Converter (DAC) Module and Section 18.0 Com-
parator Module.
21.2 FVR Stabilization Period
When the Fixed Voltage Reference module is enabled, it
requires time for the reference and amplifier circuits to
stabilize. Once the circuits stabilize and are ready for use,
the FVRST bit of the VREFCON0 register will be set. See
Section 27.0 Electrical Characteristics for the
minimum delay requirement.
FIGURE 21-1: VOLTAGE REFERENCE BLOCK DIAGRAM
FVRS<1:0>
X1
X1
X2
X4
2
FVR BUF2
(To ADC Module)
FVR BUF1
(To Comparators, DAC)
+
_
FVREN
FVRST
1.024V Fixed
Reference
PIC18(L)F2X/4XK22
DS41412A-page 340 Preliminary 2010 Microchip Technology Inc.
REGISTER 21-1: VREFCON0: FIXED VOLTAGE REFERENCE CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-1 U-0 U-0 U-0 U-0
FVREN FVRST FVRS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
1 = Bit is set 0 = Bit is cleared
bit 7 FVREN: Fixed Voltage Reference Enable bit
0 = Fixed Voltage Reference is disabled
1 = Fixed Voltage Reference is enabled
bit 6 FVRST: Fixed Voltage Reference Ready Flag bit
0 = Fixed Voltage Reference output is not ready or not enabled
1 = Fixed Voltage Reference output is ready for use
bit 5-4 FVRS<1:0>: Fixed Voltage Reference Selection bits
00 = Fixed Voltage Reference Peripheral output is off
01 = Fixed Voltage Reference Peripheral output is 1x (1.024V)
10 = Fixed Voltage Reference Peripheral output is 2x (2.048V)
(1)
11 = Fixed Voltage Reference Peripheral output is 4x (4.096V)
(1)
bit 3-2 Reserved: Read as 0. Maintain these bits clear.
bit 1-0 Unimplemented: Read as 0.
Note 1: Fixed Voltage Reference output cannot exceed VDD.
TABLE 21-1: SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
VREFCON0 FVREN FVRST FVRS<1:0> 340
Legend: = unimplemented locations, read as 0. Shaded bits are not used by the FVR module.
2010 Microchip Technology Inc. Preliminary DS41412A-page 341
PIC18(L)F2X/4XK22
22.0 DIGITAL-TO-ANALOG
CONVERTER (DAC) MODULE
The Digital-to-Analog Converter supplies a variable
voltage reference, ratiometric with the input source,
with 32 selectable output levels.
The input of the DAC can be connected to:
External VREF pins
VDD supply voltage
FVR (Fixed Voltage Reference)
The output of the DAC can be configured to supply a
reference voltage to the following:
Comparator positive input
ADC input channel
DACOUT pin
The Digital-to-Analog Converter (DAC) can be enabled
by setting the DACEN bit of the VREFCON1 register.
22.1 Output Voltage Selection
The DAC has 32 voltage level ranges. The 32 levels
are set with the DACR<4:0> bits of the VREFCON2
register.
The DAC output voltage is determined by the following
equations:
EQUATION 22-1: DAC OUTPUT VOLTAGE
22.2 Ratiometric Output Level
The DAC output value is derived using a resistor ladder
with each end of the ladder tied to a positive and
negative voltage reference input source. If the voltage
of either input source fluctuates, a similar fluctuation will
result in the DAC output value.
The value of the individual resistors within the ladder
can be found in Section 27.0 Electrical
Characteristics.
22.3 Low-Power Voltage State
In order for the DAC module to consume the least
amount of power, one of the two voltage reference input
sources to the resistor ladder must be disconnected.
Either the positive voltage source, (VSRC+), or the
negative voltage source, (VSRC-) can be disabled.
The negative voltage source is disabled by setting the
DACLPS bit in the VREFCON1 register. Clearing the
DACLPS bit in the VREFCON1 register disables the
positive voltage source.
22.4 Output Clamped to Positive
Voltage Source
The DAC output voltage can be set to VSRC+ with the
least amount of power consumption by performing the
following:
Clearing the DACEN bit in the VREFCON1
register.
Setting the DACLPS bit in the VREFCON1
register.
Configuring the DACPSS bits to the proper
positive source.
Configuring the DACRx bits to 11111 in the
VREFCON2 register.
This is also the method used to output the voltage level
from the FVR to an output pin. See Section 22.6 DAC
Voltage Reference Output for more information.
22.5 Output Clamped to Negative
Voltage Source
The DAC output voltage can be set to VSRC- with the
least amount of power consumption by performing the
following:
Clearing the DACEN bit in the VREFCON1
register.
Clearing the DACLPS bit in the VREFCON1
register.
Configuring the DACPSS bits to the proper
negative source.
Configuring the DACRx bits to 00000 in the
VREFCON2 register.
This allows the comparator to detect a zero-crossing
while not consuming additional current through the DAC
module.
22.6 DAC Voltage Reference Output
The DAC can be output to the DACOUT pin by setting
the DACOE bit of the VREFCON1 register to 1.
Selecting the DAC reference voltage for output on the
DACOUT pin automatically overrides the digital output
buffer and digital input threshold detector functions of
that pin. Reading the DACOUT pin when it has been
configured for DAC reference voltage output will always
return a 0.
Due to the limited current drive capability, a buffer must
be used on the DAC voltage reference output for
external connections to DACOUT. Figure 22-2 shows
an example buffering technique.
VOUT VSRC+ VSRC- ( )
DACR<4:0>
2
5
-------------------------------
\ .
| |
=
+ VSRC-
VSRC+ = VDD, VREF+ or FVR1
VSRC- = VSS or VREF-
PIC18(L)F2X/4XK22
DS41412A-page 342 Preliminary 2010 Microchip Technology Inc.
FIGURE 22-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM
FIGURE 22-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE
3
2
-
t
o
-
1
M
U
X
DACR<4:0>
R
VREF-
DACNSS
R
R
R
R
R
R
32
DAC
DACOUT
5
(To Comparator, CSM and
ADC Modules)
DACOE
VDD
VREF+
DACPSS<1:0>
2
DACEN
Steps
Digital-to-Analog Converter (DAC)
FVR BUF1
R
VSRC-
VSRC+
VSS
DACLPS
11111
11110
00001
00000
1
0
Reserved 11
10
01
00
DACOUT
Buffered DAC Output
+
DAC
Module
Voltage
Reference
Output
Impedance
R
PIC
MCU
2010 Microchip Technology Inc. Preliminary DS41412A-page 343
PIC18(L)F2X/4XK22
22.7 Operation During Sleep
When the device wakes up from Sleep through an
interrupt or a Watchdog Timer time-out, the contents of
the VREFCON1 register are not affected. To minimize
current consumption in Sleep mode, the voltage
reference should be disabled.
22.8 Effects of a Reset
A device Reset affects the following:
DAC is disabled
DAC output voltage is removed from the
DACOUT pin
The DAC1R<4:0> range select bits are cleared
REGISTER 22-1: VREFCON1: VOLTAGE REFERENCE CONTROL REGISTER 0
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0
DACEN DACLPS DACOE DACPSS<1:0> DACNSS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
1 = Bit is set 0 = Bit is cleared
bit 7 DACEN: DAC Enable bit
1 = DAC is enabled
0 = DAC is disabled
bit 6 DACLPS: DAC Low-Power Voltage Source Select bit
1 = DAC Positive reference source selected
0 = DAC Negative reference source selected
bit 5 DACOE: DAC Voltage Output Enable bit
1 = DAC voltage level is also an output on the DACOUT pin
0 = DAC voltage level is disconnected from the DACOUT pin
bit 4 Unimplemented: Read as 0
bit 3-2 DACPSS<1:0>: DAC Positive Source Select bits
00 = VDD
01 = VREF+
10 = FVR BUF1 output
11 = Reserved, do not use
bit 1 Unimplemented: Read as 0
bit 0 DACNSS: DAC Negative Source Select bits
1 = VREF-
0 = VSS
PIC18(L)F2X/4XK22
DS41412A-page 344 Preliminary 2010 Microchip Technology Inc.
REGISTER 22-2: VREFCON2: VOLTAGE REFERENCE CONTROL REGISTER 1
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DACR<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
1 = Bit is set 0 = Bit is cleared
bit 7-5 Unimplemented: Read as 0
bit 4-0 DACR<4:0>: DAC Voltage Output Select bits
VOUT = ((VSRC+) - (VSRC-))*(DACR<4:0>/(2
5
)) + VSRC-
TABLE 22-1: REGISTERS ASSOCIATED WITH DAC MODULE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
on Page
VREFCON0 FVREN FVRST FVRS<1:0> 340
VREFCON1 DACEN DACLPS DACOE DACPSS<1:0> DACNSS 343
VREFCON2 DACR<4:0> 344
Legend: = Unimplemented locations, read as 0. Shaded bits are not used by the DAC module.
2010 Microchip Technology Inc. Preliminary DS41412A-page 345
PIC18(L)F2X/4XK22
23.0 HIGH/LOW-VOLTAGE DETECT
(HLVD)
The PIC18(L)F2X/4XK22 devices have a High/Low-Volt-
age Detect module (HLVD). This is a programmable cir-
cuit that sets both a device voltage trip point and the
direction of change from that point. If the device experi-
ences an excursion past the trip point in that direction, an
interrupt flag is set. If the interrupt is enabled, the pro-
gram execution branches to the interrupt vector address
and the software responds to the interrupt.
The High/Low-Voltage Detect Control register
(Register 23-1) completely controls the operation of the
HLVD module. This allows the circuitry to be turned
off by the user under software control, which
minimizes the current consumption for the device.
The modules block diagram is shown in Figure 23-1.
REGISTER 23-1: HLVDCON: HIGH/LOW-VOLTAGE DETECT CONTROL REGISTER
R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1
VDIRMAG BGVST IRVST HLVDEN HLVDL<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7 VDIRMAG: Voltage Direction Magnitude Select bit
1 = Event occurs when voltage equals or exceeds trip point (HLVDL<3:0>)
0 = Event occurs when voltage equals or falls below trip point (HLVDL<3:0>)
bit 6 BGVST: Band Gap Reference Voltages Stable Status Flag bit
1 = Internal band gap voltage references are stable
0 = Internal band gap voltage reference is not stable
bit 5 IRVST: Internal Reference Voltage Stable Flag bit
1 = Indicates that the voltage detect logic will generate the interrupt flag at the specified voltage range
0 = Indicates that the voltage detect logic will not generate the interrupt flag at the specified voltage
range and the HLVD interrupt should not be enabled
bit 4 HLVDEN: High/Low-Voltage Detect Power Enable bit
1 = HLVD enabled
0 = HLVD disabled
bit 3-0 HLVDL<3:0>: Voltage Detection Level bits
(1)
1111 = External analog input is used (input comes from the HLVDIN pin)
1110 = Maximum setting
.
.
.
0000 = Minimum setting
Note 1: See Table 27-4 for specifications.
PIC18(L)F2X/4XK22
DS41412A-page 346 Preliminary 2010 Microchip Technology Inc.
The module is enabled by setting the HLVDEN bit
(HLVDCON<4>). Each time the HLVD module is
enabled, the circuitry requires some time to stabilize.
The IRVST bit (HLVDCON<5>) is a read-only bit used
to indicate when the circuit is stable. The module can
only generate an interrupt after the circuit is stable and
IRVST is set.
The VDIRMAG bit (HLVDCON<7>) determines the
overall operation of the module. When VDIRMAG is
cleared, the module monitors for drops in VDD below a
predetermined set point. When the bit is set, the
module monitors for rises in VDD above the set point.
23.1 Operation
When the HLVD module is enabled, a comparator uses
an internally generated reference voltage as the set
point. The set point is compared with the trip point,
where each node in the resistor divider represents a
trip point voltage. The trip point voltage is the voltage
level at which the device detects a high or low-voltage
event, depending on the configuration of the module.
When the supply voltage is equal to the trip point, the
voltage tapped off of the resistor array is equal to the
internal reference voltage generated by the voltage
reference module. The comparator then generates an
interrupt signal by setting the HLVDIF bit.
The trip point voltage is software programmable to any of
16 values. The trip point is selected by programming the
HLVDL<3:0> bits (HLVDCON<3:0>).
The HLVD module has an additional feature that allows
the user to supply the trip voltage to the module from an
external source. This mode is enabled when bits,
HLVDL<3:0>, are set to 1111. In this state, the
comparator input is multiplexed from the external input
pin, HLVDIN. This gives users the flexibility of configur-
ing the High/Low-Voltage Detect interrupt to occur at
any voltage in the valid operating range.
FIGURE 23-1: HLVD MODULE BLOCK DIAGRAM (WITH EXTERNAL INPUT)
Set
VDD
1
6
-
t
o
-
1
M
U
X
HLVDEN
HLVDCON
HLVDL<3:0>
Register
HLVDIN
VDD
Externally Generated
Trip Point
HLVDIF
HLVDEN
BOREN
Internal Voltage
Reference
VDIRMAG
1.024V Typical
2010 Microchip Technology Inc. Preliminary DS41412A-page 347
PIC18(L)F2X/4XK22
23.2 HLVD Setup
To set up the HLVD module:
1. Select the desired HLVD trip point by writing the
value to the HLVDL<3:0> bits.
2. Set the VDIRMAG bit to detect high voltage
(VDIRMAG = 1) or low voltage (VDIRMAG = 0).
3. Enable the HLVD module by setting the
HLVDEN bit.
4. Clear the HLVD interrupt flag (PIR2<2>), which
may have been set from a previous interrupt.
5. If interrupts are desired, enable the HLVD
interrupt by setting the HLVDIE and GIE/GIEH
bits (PIE2<2> and INTCON<7>, respectively).
An interrupt will not be generated until the
IRVST bit is set.
23.3 Current Consumption
When the module is enabled, the HLVD comparator
and voltage divider are enabled and consume static
current. The total current consumption, when enabled,
is specified in Section 27.0 Electrical Characteris-
tics. Depending on the application, the HLVD module
does not need to operate constantly. To reduce current
requirements, the HLVD circuitry may only need to be
enabled for short periods where the voltage is checked.
After such a check, the module could be disabled.
23.4 HLVD Start-up Time
The internal reference voltage of the HLVD module,
specified in Section 27.0 Electrical
Characteristics, may be used by other internal
circuitry, such as the programmable Brown-out Reset.
If the HLVD or other circuits using the voltage reference
are disabled to lower the devices current consumption,
the reference voltage circuit will require time to become
stable before a low or high-voltage condition can be
reliably detected. This start-up time, TIRVST, is an
interval that is independent of device clock speed.
The HLVD interrupt flag is not enabled until TIRVST has
expired and a stable reference voltage is reached. For
this reason, brief excursions beyond the set point may
not be detected during this interval (see Figure 23-2 or
Figure 23-3).
FIGURE 23-2: LOW-VOLTAGE DETECT OPERATION (VDIRMAG = 0)
Note: Before changing any module settings
(VDIRMAG, HLVDL<3:0>), first disable the
module (HLVDEN = 0), make the changes
and re-enable the module. This prevents
the generation of false HLVD events.
VHLVD
VDD
HLVDIF
VHLVD
VDD
Enable HLVD
TIRVST
HLVDIF may not be set
Enable HLVD
HLVDIF
HLVDIF cleared in software
HLVDIF cleared in software
HLVDIF cleared in software,
CASE 1:
CASE 2:
HLVDIF remains set since HLVD condition still exists
TIRVST
Internal Reference is stable
Internal Reference is stable
IRVST
IRVST
PIC18(L)F2X/4XK22
DS41412A-page 348 Preliminary 2010 Microchip Technology Inc.
FIGURE 23-3: HIGH-VOLTAGE DETECT OPERATION (VDIRMAG = 1)
23.5 Applications
In many applications, it is desirable to detect a drop
below, or rise above, a particular voltage threshold. For
example, the HLVD module could be periodically
enabled to detect Universal Serial Bus (USB) attach or
detach. This assumes the device is powered by a lower
voltage source than the USB when detached. An attach
would indicate a high-voltage detect from, for example,
3.3V to 5V (the voltage on USB) and vice versa for a
detach. This feature could save a design a few extra
components and an attach signal (input pin).
For general battery applications, Figure 23-4 shows a
possible voltage curve. Over time, the device voltage
decreases. When the device voltage reaches voltage
VA, the HLVD logic generates an interrupt at time, TA.
The interrupt could cause the execution of an ISR,
which would allow the application to perform house-
keeping tasks and a controlled shutdown before the
device voltage exits the valid operating range at TB.
This would give the application a time window,
represented by the difference between TA and TB, to
safely exit.
FIGURE 23-4: TYPICAL LOW-VOLTAGE
DETECT APPLICATION
VHLVD
VDD
HLVDIF
VHLVD
VDD
Enable HLVD
TIRVST
HLVDIF may not be set
Enable HLVD
HLVDIF
HLVDIF cleared in software
HLVDIF cleared in software
HLVDIF cleared in software,
CASE 1:
CASE 2:
HLVDIF remains set since HLVD condition still exists
TIRVST
IRVST
Internal Reference is stable
Internal Reference is stable
IRVST
Time
V
o
l
t
a
g
e
VA
VB
TA TB
VA = HLVD trip point
VB = Minimum valid device
operating voltage
Legend:
2010 Microchip Technology Inc. Preliminary DS41412A-page 349
PIC18(L)F2X/4XK22
23.6 Operation During Sleep
When enabled, the HLVD circuitry continues to operate
during Sleep. If the device voltage crosses the trip
point, the HLVDIF bit will be set and the device will
wake-up from Sleep. Device execution will continue
from the interrupt vector address if interrupts have
been globally enabled.
23.7 Effects of a Reset
A device Reset forces all registers to their Reset state.
This forces the HLVD module to be turned off.
TABLE 23-1: REGISTERS ASSOCIATED WITH HIGH/LOW-VOLTAGE DETECT MODULE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on page
HLVDCON VDIRMAG BGVST IRVST HLVDEN HLVDL<3:0> 345
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 115
IPR2 OSCFIP C1IP C2IP EEIP BCL1IP HLVDIP TMR3IP CCP2IP 128
PIE2 OSCFIE C1IE C2IE EEIE BCL1IE HLVDIE TMR3IE CCP2IE 124
PIR2 OSCFIF C1IF C2IF EEIF BCL1IF HLVDIF TMR3IF CCP2IF 119
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 155
Legend: = unimplemented locations, read as 0. Shaded bits are unused by the HLVD module.
PIC18(L)F2X/4XK22
DS41412A-page 350 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS41412A-page 351
PIC18(L)F2X/4XK22
24.0 SPECIAL FEATURES OF
THE CPU
PIC18(L)F2X/4XK22 devices include several features
intended to maximize reliability and minimize cost through
elimination of external components. These are:
Oscillator Selection
Resets:
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
Interrupts
Watchdog Timer (WDT)
Code Protection
ID Locations
In-Circuit Serial Programming
The oscillator can be configured for the application
depending on frequency, power, accuracy and cost. All
of the options are discussed in detail in Section 2.0
Oscillator Module (With Fail-Safe Clock Monitor).
A complete discussion of device Resets and interrupts
is available in previous sections of this data sheet.
In addition to their Power-up and Oscillator Start-up
Timers provided for Resets, PIC18(L)F2X/4XK22
devices have a Watchdog Timer, which is either
permanently enabled via the Configuration bits or
software controlled (if configured as disabled).
The inclusion of an internal RC oscillator also provides
the additional benefits of a Fail-Safe Clock Monitor
(FSCM) and Two-Speed Start-up. FSCM provides for
background monitoring of the peripheral clock and
automatic switchover in the event of its failure. Two-
Speed Start-up enables code to be executed almost
immediately on start-up, while the primary clock source
completes its start-up delays.
All of these features are enabled and configured by
setting the appropriate Configuration register bits.
24.1 Configuration Bits
The Configuration bits can be programmed (read as
0) or left unprogrammed (read as 1) to select various
device configurations. These bits are mapped starting
at program memory location 300000h.
The user will note that address 300000h is beyond the
user program memory space. In fact, it belongs to the
configuration memory space (300000h-3FFFFFh), which
can only be accessed using table reads and table writes.
Programming the Configuration registers is done in a
manner similar to programming the Flash memory. The
WR bit in the EECON1 register starts a self-timed write
to the Configuration register. In normal operation mode,
a TBLWT instruction with the TBLPTR pointing to the
Configuration register sets up the address and the data
for the Configuration register write. Setting the WR bit
starts a long write to the Configuration register. The
Configuration registers are written a byte at a time. To
write or erase a configuration cell, a TBLWT instruction
can write a 1 or a 0 into the cell. For additional details
on Flash programming, refer to Section 6.5 Writing
to Flash Program Memory.
PIC18(L)F2X/4XK22
DS41412A-page 352 Preliminary 2010 Microchip Technology Inc.
TABLE 24-1: CONFIGURATION BITS AND DEVICE IDs
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Default/
Unprogrammed
Value
300000h CONFIG1L 0000 0000
300001h CONFIG1H IESO FCMEN PRICLKEN PLLCFG FOSC<3:0> 0010 0101
300002h CONFIG2L BORV<1:0> BOREN<1:0> PWRTEN 0001 1111
300003h CONFIG2H WDPS<3:0> WDTEN<1:0> 0011 1111
300004h CONFIG3L 0000 0000
300005h CONFIG3H MCLRE P2BMX T3CMX HFOFST CCP3MX PBADEN CCP2MX 1011 1111
300006h CONFIG4L DEBUG XINST LVP
(1)
STRVEN 1000 0101
300007h CONFIG4H 1111 1111
300008h CONFIG5L CP3
(2)
CP2
(2)
CP1 CP0 0000 1111
300009h CONFIG5H CPD CPB 1100 0000
30000Ah CONFIG6L WRT3
(2)
WRT2
(2)
WRT1 WRT0 0000 1111
30000Bh CONFIG6H WRTD WRTB WRTC
(3)
1110 0000
30000Ch CONFIG7L EBTR3
(2)
EBTR2
(2)
EBTR1 EBTR0 0000 1111
30000Dh CONFIG7H EBTRB 0100 0000
3FFFFEh DEVID1
(4)
DEV<2:0> REV<4:0> qqqq qqqq
3FFFFFh DEVID2
(4)
DEV<10:3> 0101 qqqq
Legend: = unimplemented, q = value depends on condition. Shaded bits are unimplemented, read as '0'.
Note 1: Can only be changed when in high voltage programming mode.
2: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices only.
3: In user mode, this bit is read-only and cannot be self-programmed.
4: See Register 24-12 and Register 24-13 for DEVID values. DEVID registers are read-only and cannot be programmed by the
user.
2010 Microchip Technology Inc. Preliminary DS41412A-page 353
PIC18(L)F2X/4XK22
REGISTER 24-1: CONFIG1H: CONFIGURATION REGISTER 1 HIGH
R/P-0 R/P-0 R/P-1 R/P-0 R/P-0 R/P-1 R/P-0 R/P-1
IESO FCMEN PRICLKEN PLLCFG FOSC<3:0>
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed x = Bit is unknown
bit 7 IESO
(1)
: Internal/External Oscillator Switchover bit
1 = Oscillator Switchover mode enabled
0 = Oscillator Switchover mode disabled
bit 6 FCMEN
(1)
: Fail-Safe Clock Monitor Enable bit
1 = Fail-Safe Clock Monitor enabled
0 = Fail-Safe Clock Monitor disabled
bit 5 PRICLKEN: Primary Clock Enable bit
1 = Primary Clock is always enabled
0 = Primary Clock can be disabled by software
bit 4 PLLCFG: 4 x PLL Enable bit
1 = 4 x PLL always enabled, Oscillator multiplied by 4
0 = 4 x PLL is under software control, PLLEN (OSCTUNE<6>)
bit 3-0 FOSC<3:0>: Oscillator Selection bits
1111 = External RC oscillator, CLKOUT function on RA6
1110 = External RC oscillator, CLKOUT function on RA6
1101 = EC oscillator (low power)
1100 = EC oscillator, CLKOUT function on OSC2 (low power)
1011 = EC oscillator (medium power, 4 MHz-16 MHz)
1010 = EC oscillator, CLKOUT function on OSC2 (medium power, 4 MHz-16 MHz)
1001 = Internal oscillator block, CLKOUT function on OSC2
1000 = Internal oscillator block
0111 = External RC oscillator
0110 = External RC oscillator, CLKOUT function on OSC2
0101 = EC oscillator (high power, >16 MHz)
0100 = EC oscillator, CLKOUT function on OSC2 (high power, >16 MHz)
0011= HS oscillator (medium power, 4 MHz - 16 MHz)
0010= HS oscillator (high power, >16 MHz)
0001= XT oscillator
0000= LP oscillator
Note 1: When FOSC<3:0> is configured for HS, XT, or LS oscillator and FCMEN bit is set, then the IESO bit
should also be set to prevent a false failed clock indication and to enable automatic clock switch over from
the internal oscillator block to the external oscillator when the OST times out.
PIC18(L)F2X/4XK22
DS41412A-page 354 Preliminary 2010 Microchip Technology Inc.
REGISTER 24-2: CONFIG2L: CONFIGURATION REGISTER 2 LOW
U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
BORV<1:0>
(1)
BOREN<1:0>
(2)
PWRTEN
(2)
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed x = Bit is unknown
bit 7-5 Unimplemented: Read as 0
bit 4-3 BORV<1:0>: Brown-out Reset Voltage bits
(1)
11 = VBOR set to 1.9V nominal
10 = VBOR set to 2.2V nominal
01 = VBOR set to 2.5V nominal
00 = VBOR set to 2.85V nominal
bit 2-1 BOREN<1:0>: Brown-out Reset Enable bits
(2)
11 = Brown-out Reset enabled in hardware only (SBOREN is disabled)
10 = Brown-out Reset enabled in hardware only and disabled in Sleep mode
(SBOREN is disabled)
01 = Brown-out Reset enabled and controlled by software (SBOREN is enabled)
00 = Brown-out Reset disabled in hardware and software
bit 0 PWRTEN: Power-up Timer Enable bit
(2)
1 = PWRT disabled
0 = PWRT enabled
Note 1: See Section 27.1 DC Characteristics: Supply Voltage, PIC18(L)F2X/4XK22 for specifications.
2: The Power-up Timer is decoupled from Brown-out Reset, allowing these features to be independently controlled.
2010 Microchip Technology Inc. Preliminary DS41412A-page 355
PIC18(L)F2X/4XK22
REGISTER 24-3: CONFIG2H: CONFIGURATION REGISTER 2 HIGH
U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
WDTPS<3:0> WDTEN<1:0>
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed x = Bit is unknown
bit 7-6 Unimplemented: Read as 0
bit 5-2 WDTPS<3:0>: Watchdog Timer Postscale Select bits
1111 = 1:32,768
1110 = 1:16,384
1101 = 1:8,192
1100 = 1:4,096
1011 = 1:2,048
1010 = 1:1,024
1001 = 1:512
1000 = 1:256
0111 = 1:128
0110 = 1:64
0101 = 1:32
0100 = 1:16
0011 = 1:8
0010 = 1:4
0001 = 1:2
0000 = 1:1
bit 1-0 WDTEN<1:0>: Watchdog Timer Enable bits
11 = WDT enabled in hardware; SWDTEN bit disabled
10 = WDT controlled by the SWDTEN bit
01 = WDT enabled when device is active, disabled when device is in Sleep; SWDTEN bit disabled
00 = WDT disabled in hardware; SWDTEN bit disabled
PIC18(L)F2X/4XK22
DS41412A-page 356 Preliminary 2010 Microchip Technology Inc.
REGISTER 24-4: CONFIG3H: CONFIGURATION REGISTER 3 HIGH
R/P-1 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
MCLRE P2BMX T3CMX HFOFST CCP3MX PBADEN CCP2MX
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed x = Bit is unknown
bit 7 MCLRE: MCLR Pin Enable bit
1 = MCLR pin enabled; RE3 input pin disabled
0 = RE3 input pin enabled; MCLR disabled
bit 6 Unimplemented: Read as 0
bit 5 P2BMX: P2B Input MUX bit
1 = P2B is on RB5
(1)
P2B is on RD2
(2)
0 = P2B is on RC0
bit 4 T3CMX: Timer3 Clock Input MUX bit
1 = T3CKI is on RC0
0 = T3CKI is on RB5
bit 3 HFOFST: HFINTOSC Fast Start-up bit
1 = HFINTOSC starts clocking the CPU without waiting for the oscillator to stabilize
0 = The system clock is held off until the HFINTOSC is stable
bit 2 CCP3MX: CCP3 MUX bit
1 = CCP3 input/output is multiplexed with RB5
0 = CCP3 input/output is multiplexed with RC6
(1)
CCP3 input/output is multiplexed with RE0
(2)
bit 1 PBADEN: PORTB A/D Enable bit
1 = ANSELB<5:0> resets to 1, PORTB<5:0> pins are configured as analog inputs on Reset
0 = ANSELB<5:0> resets to 0, PORTB<4:0> pins are configured as digital I/O on Reset
bit 0 CCP2MX: CCP2 MUX bit
1 = CCP2 input/output is multiplexed with RC1
0 = CCP2 input/output is multiplexed with RB3
Note 1: PIC18(L)F2XK22 devices only.
2: PIC18(L)F4XK22 devices only.
2010 Microchip Technology Inc. Preliminary DS41412A-page 357
PIC18(L)F2X/4XK22
REGISTER 24-5: CONFIG4L: CONFIGURATION REGISTER 4 LOW
R/P-1 R/P-0 U-0 U-0 U-0 R/P-1 U-0 R/P-1
DEBUG XINST LVP
(1)
STVREN
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed x = Bit is unknown
bit 7 DEBUG: Background Debugger Enable bit
1 = Background debugger disabled, RB6 and RB7 configured as general purpose I/O pins
0 = Background debugger enabled, RB6 and RB7 are dedicated to In-Circuit Debug
bit 6 XINST: Extended Instruction Set Enable bit
1 = Instruction set extension and Indexed Addressing mode enabled
0 = Instruction set extension and Indexed Addressing mode disabled (Legacy mode)
bit 5-3 Unimplemented: Read as 0
bit 2 LVP: Single-Supply ICSP Enable bit
1 = Single-Supply ICSP enabled
0 = Single-Supply ICSP disabled
bit 1 Unimplemented: Read as 0
bit 0 STVREN: Stack Full/Underflow Reset Enable bit
1 = Stack full/underflow will cause Reset
0 = Stack full/underflow will not cause Reset
Note 1: Can only be changed by a programmer in high-voltage programming mode.
REGISTER 24-6: CONFIG5L: CONFIGURATION REGISTER 5 LOW
U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1
CP3
(1)
CP2
(1)
CP1 CP0
bit 7 bit 0
Legend:
R = Readable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed C = Clearable only bit
bit 7-4 Unimplemented: Read as 0
bit 3 CP3: Code Protection bit
(1)
1 = Block 3 not code-protected
0 = Block 3 code-protected
bit 2 CP2: Code Protection bit
(1)
1 = Block 2 not code-protected
0 = Block 2 code-protected
bit 1 CP1: Code Protection bit
1 = Block 1 not code-protected
0 = Block 1 code-protected
bit 0 CP0: Code Protection bit
1 = Block 0 not code-protected
0 = Block 0 code-protected
Note 1: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices.
PIC18(L)F2X/4XK22
DS41412A-page 358 Preliminary 2010 Microchip Technology Inc.
REGISTER 24-7: CONFIG5H: CONFIGURATION REGISTER 5 HIGH
R/C-1 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0
CPD CPB
bit 7 bit 0
Legend:
R = Readable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed C = Clearable only bit
bit 7 CPD: Data EEPROM Code Protection bit
1 = Data EEPROM not code-protected
0 = Data EEPROM code-protected
bit 6 CPB: Boot Block Code Protection bit
1 = Boot Block not code-protected
0 = Boot Block code-protected
bit 5-0 Unimplemented: Read as 0
REGISTER 24-8: CONFIG6L: CONFIGURATION REGISTER 6 LOW
U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1
WRT3
(1)
WRT2
(1)
WRT1 WRT0
bit 7 bit 0
Legend:
R = Readable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed C = Clearable only bit
bit 7-4 Unimplemented: Read as 0
bit 3 WRT3: Write Protection bit
(1)
1 = Block 3 not write-protected
0 = Block 3 write-protected
bit 2 WRT2: Write Protection bit
(1)
1 = Block 2 not write-protected
0 = Block 2 write-protected
bit 1 WRT1: Write Protection bit
1 = Block 1 not write-protected
0 = Block 1 write-protected
bit 0 WRT0: Write Protection bit
1 = Block 0 not write-protected
0 = Block 0 write-protected
Note 1: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices.
2010 Microchip Technology Inc. Preliminary DS41412A-page 359
PIC18(L)F2X/4XK22
REGISTER 24-9: CONFIG6H: CONFIGURATION REGISTER 6 HIGH
R/C-1 R/C-1 R-1 U-0 U-0 U-0 U-0 U-0
WRTD WRTB WRTC
(1)
bit 7 bit 0
Legend:
R = Readable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed C = Clearable only bit
bit 7 WRTD: Data EEPROM Write Protection bit
1 = Data EEPROM not write-protected
0 = Data EEPROM write-protected
bit 6 WRTB: Boot Block Write Protection bit
1 = Boot Block not write-protected
0 = Boot Block write-protected
bit 5 WRTC: Configuration Register Write Protection bit
(1)
1 = Configuration registers not write-protected
0 = Configuration registers write-protected
bit 4-0 Unimplemented: Read as 0
Note 1: This bit is read-only in normal execution mode; it can be written only in Program mode.
REGISTER 24-10: CONFIG7L: CONFIGURATION REGISTER 7 LOW
U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1
EBTR3
(1)
EBTR2
(1)
EBTR1 EBTR0
bit 7 bit 0
Legend:
R = Readable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed C = Clearable only bit
bit 7-4 Unimplemented: Read as 0
bit 3 EBTR3: Table Read Protection bit
(1)
1 = Block 3 not protected from table reads executed in other blocks
0 = Block 3 protected from table reads executed in other blocks
bit 2 EBTR2: Table Read Protection bit
(1)
1 = Block 2 not protected from table reads executed in other blocks
0 = Block 2 protected from table reads executed in other blocks
bit 1 EBTR1: Table Read Protection bit
1 = Block 1 not protected from table reads executed in other blocks
0 = Block 1 protected from table reads executed in other blocks
bit 0 EBTR0: Table Read Protection bit
1 = Block 0 not protected from table reads executed in other blocks
0 = Block 0 protected from table reads executed in other blocks
Note 1: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices.
PIC18(L)F2X/4XK22
DS41412A-page 360 Preliminary 2010 Microchip Technology Inc.
REGISTER 24-11: CONFIG7H: CONFIGURATION REGISTER 7 HIGH
U-0 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0
EBTRB
bit 7 bit 0
Legend:
R = Readable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed C = Clearable only bit
bit 7 Unimplemented: Read as 0
bit 6 EBTRB: Boot Block Table Read Protection bit
1 = Boot Block not protected from table reads executed in other blocks
0 = Boot Block protected from table reads executed in other blocks
bit 5-0 Unimplemented: Read as 0
REGISTER 24-12: DEVID1: DEVICE ID REGISTER 1
R R R R R R R R
DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0
bit 7 bit 0
Legend:
R = Readable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed C = Clearable only bit
bit 7-5 DEV<2:0>: Device ID bits
These bits, together with DEV<10:3> in DEVID2, determine the device ID.
See Table 24-2 for complete Device ID list.
bit 4-0 REV<4:0>: Revision ID bits
These bits indicate the device revision.
REGISTER 24-13: DEVID2: DEVICE ID REGISTER 2
R R R R R R R R
DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3
bit 7 bit 0
Legend:
R = Readable bit U = Unimplemented bit, read as 0
-n = Value when device is unprogrammed C = Clearable only bit
bit 7-0 DEV<10:3>: Device ID bits
These bits, together with DEV<2:0> in DEVID1, determine the device ID.
See Table 24-2 for complete Device ID list.
2010 Microchip Technology Inc. Preliminary DS41412A-page 361
PIC18(L)F2X/4XK22
TABLE 24-2: DEVICE ID TABLE FOR THE PIC18(L)F2X/4XK22 FAMILY
DEV<10:3> DEV<2:0> Part Number
0101 0100
000 PIC18F46K22
001 PIC18LF46K22
010 PIC18F26K22
011 PIC18LF26K22
0101 0101
000 PIC18F45K22
001 PIC18LF45K22
010 PIC18F25K22
011 PIC18LF25K22
0101 0110
000 PIC18F44K22
001 PIC18LF44K22
010 PIC18F24K22
011 PIC18LF24K22
0101 0111
000 PIC18F43K22
001 PIC18LF43K22
010 PIC18F23K22
011 PIC18LF23K22
PIC18(L)F2X/4XK22
DS41412A-page 362 Preliminary 2010 Microchip Technology Inc.
24.2 Watchdog Timer (WDT)
For PIC18(L)F2X/4XK22 devices, the WDT is driven by
the LFINTOSC source. When the WDT is enabled, the
clock source is also enabled. The nominal WDT period
is 4 ms and has the same stability as the LFINTOSC
oscillator.
The 4 ms period of the WDT is multiplied by a 16-bit
postscaler. Any output of the WDT postscaler is
selected by a multiplexer, controlled by bits in Configu-
ration Register 2H. Available periods range from 4 ms
to 131.072 seconds (2.18 minutes). The WDT and
postscaler are cleared when any of the following events
occur: a SLEEP or CLRWDT instruction is executed, the
IRCF bits of the OSCCON register are changed or a
clock failure has occurred.
FIGURE 24-1: WDT BLOCK DIAGRAM
Note 1: The CLRWDT and SLEEP instructions
clear the WDT and postscaler counts
when executed.
2: Changing the setting of the IRCF bits of
the OSCCON register clears the WDT
and postscaler counts.
3: When a CLRWDT instruction is executed,
the postscaler count will be cleared.
LFINTOSC Source
WDT
Wake-up
Reset
WDT Counter
Programmable Postscaler
1:1 to 1:32,768
Enable WDT
WDTPS<3:0>
SWDTEN
WDTEN
CLRWDT
4
from Power
Reset
All Device Resets
Sleep
128
Change on IRCF bits
Managed Modes
2010 Microchip Technology Inc. Preliminary DS41412A-page 363
PIC18(L)F2X/4XK22
24.2.1 CONTROL REGISTER
Register 24-14 shows the WDTCON register. This is a
readable and writable register which contains a control
bit that allows software to override the WDT enable
Configuration bit, but only if the Configuration bit has
disabled the WDT.
TABLE 24-4: CONFIGURATION REGISTERS ASSOCIATED WITH WATCHDOG TIMER
REGISTER 24-14: WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
SWDTEN
(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
bit 7-1 Unimplemented: Read as 0
bit 0 SWDTEN: Software Enable or Disable the Watchdog Timer bit
(1)
1 = WDT is turned on
0 = WDT is turned off (Reset value)
Note 1: This bit has no effect if the Configuration bit, WDTEN, is enabled.
TABLE 24-3: REGISTERS ASSOCIATED WITH WATCHDOG TIMER
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
RCON IPEN SBOREN RI TO PD POR BOR 60
WDTCON SWDTEN 363
Legend: = unimplemented, read as 0. Shaded bits are not used by the Watchdog Timer.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values
on Page
CONFIG2H WDPS<3:0> WDTEN<1:0> 355
Legend: = unimplemented, read as 0. Shaded bits are not used by the Watchdog Timer.
PIC18(L)F2X/4XK22
DS41412A-page 364 Preliminary 2010 Microchip Technology Inc.
24.3 Program Verification and
Code Protection
The overall structure of the code protection on the
PIC18 Flash devices differs significantly from other
PIC
microcontroller devices.
The user program memory is divided into three or five
blocks, depending on the device. One of these is a
Boot Block of 0.5K or 2K bytes, depending on the
device. The remainder of the memory is divided into
individual blocks on binary boundaries.
Each of the blocks has three code protection bits asso-
ciated with them. They are:
Code-Protect bit (CPn)
Write-Protect bit (WRTn)
External Block Table Read bit (EBTRn)
Figure 24-2 shows the program memory organization
for 8, 16 and 32-Kbyte devices and the specific code
protection bit associated with each block. The actual
locations of the bits are summarized in Table .
FIGURE 24-2: CODE-PROTECTED PROGRAM MEMORY FOR PIC18(L)F2X/4XK22
MEMORY SIZE/DEVICE
Block Code Protection
Controlled By: 8 Kbytes
(PIC18(L)FX3K22)
16 Kbytes
(PIC18(L)FX4K22)
32 Kbytes
(PIC18(L)FX5K22)
64 Kbytes
(PIC18(L)FX6K22)
Boot Block
(000h-1FFh)
Boot Block
(000h-7FFh)
Boot Block
(000h-7FFh)
Boot Block
(000h-7FFh)
CPB, WRTB, EBTRB
Block 0
(200h-FFFh)
Block 0
(800h-1FFFh)
Block 0
(800h-1FFFh)
Block 0
(800h-3FFFh)
CP0, WRT0, EBTR0
Block 1
(1000h-1FFFh)
Block 1
(2000h-3FFFh)
Block 1
(2000h-3FFFh)
Block 1
(4000h-7FFFh)
CP1, WRT1, EBTR1
Unimplemented
Read 0s
(2000h-1FFFFFh)
Unimplemented
Read 0s
(4000h-1FFFFFh)
Block 2
(4000h-5FFFh)
Block 2
(8000h-BFFFh)
CP2, WRT2, EBTR2
Block 3
(6000h-7FFFh)
Block 3
(C000h-FFFFh)
CP3, WRT3, EBTR3
Unimplemented
Read 0s
(8000h-1FFFFFh)
Unimplemented
Read 0s
(10000h-1FFFFFh)
(Unimplemented
Memory Space)
TABLE 24-5: CONFIGURATION REGISTERS ASSOCIATED WITH CODE PROTECTION
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
300008h CONFIG5L CP3
(1)
CP2
(1)
CP1 CP0
300009h CONFIG5H CPD CPB
30000Ah CONFIG6L WRT3
(1)
WRT2
(1)
WRT1 WRT0
30000Bh CONFIG6H WRTD WRTB WRTC
(2)
30000Ch CONFIG7L EBTR3
(1)
EBTR2
(1)
EBTR1 EBTR0
30000Dh CONFIG7H EBTRB
Legend: Shaded bits are unimplemented.
Note 1: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices only.
2: In user mode, this bit is read-only and cannot be self-programmed.
2010 Microchip Technology Inc. Preliminary DS41412A-page 365
PIC18(L)F2X/4XK22
24.3.1 PROGRAM MEMORY
CODE PROTECTION
The program memory may be read to or written from
any location using the table read and table write
instructions. The device ID may be read with table
reads. The Configuration registers may be read and
written with the table read and table write instructions.
In normal execution mode, the CPn bits have no direct
effect. CPn bits inhibit external reads and writes. A block
of user memory may be protected from table writes if the
WRTn Configuration bit is 0. The EBTRn bits control
table reads. For a block of user memory with the EBTRn
bit cleared to 0, a table READ instruction that executes
from within that block is allowed to read. A table read
instruction that executes from a location outside of that
block is not allowed to read and will result in reading 0s.
Figures 24-3 through 24-5 illustrate table write and table
read protection.
FIGURE 24-3: TABLE WRITE (WRTn) DISALLOWED
Note: Code protection bits may only be written to
a 0 from a 1 state. It is not possible to
write a 1 to a bit in the 0 state. Code pro-
tection bits are only set to 1 by a full chip
erase or block erase function. The full chip
erase and block erase functions can only
be initiated via ICSP or an external
programmer.
000000h
0007FFh
000800h
001FFFh
002000h
003FFFh
004000h
005FFFh
006000h
007FFFh
WRTB, EBTRB = 11
WRT0, EBTR0 = 01
WRT1, EBTR1 = 11
WRT2, EBTR2 = 11
WRT3, EBTR3 = 11
TBLWT*
TBLPTR = 0008FFh
PC = 001FFEh
TBLWT* PC = 005FFEh
Register Values Program Memory Configuration Bit Settings
Results: All table writes disabled to Blockn whenever WRTn = 0.
PIC18(L)F2X/4XK22
DS41412A-page 366 Preliminary 2010 Microchip Technology Inc.
FIGURE 24-4: EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED
FIGURE 24-5: EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED
WRTB, EBTRB = 11
WRT0, EBTR0 = 10
WRT1, EBTR1 = 11
WRT2, EBTR2 = 11
WRT3, EBTR3 = 11
TBLRD*
TBLPTR = 0008FFh
PC = 003FFEh
Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0.
TABLAT register returns a value of 0.
Register Values Program Memory Configuration Bit Settings
000000h
0007FFh
000800h
001FFFh
002000h
003FFFh
004000h
005FFFh
006000h
007FFFh
WRTB, EBTRB = 11
WRT0, EBTR0 = 10
WRT1, EBTR1 = 11
WRT2, EBTR2 = 11
WRT3, EBTR3 = 11
TBLRD*
TBLPTR = 0008FFh
PC = 001FFEh
Register Values Program Memory Configuration Bit Settings
Results: Table reads permitted within Blockn, even when EBTRBn = 0.
TABLAT register returns the value of the data at the location TBLPTR.
000000h
0007FFh
000800h
001FFFh
002000h
003FFFh
004000h
005FFFh
006000h
007FFFh
2010 Microchip Technology Inc. Preliminary DS41412A-page 367
PIC18(L)F2X/4XK22
24.3.2 DATA EEPROM
CODE PROTECTION
The entire data EEPROM is protected from external
reads and writes by two bits: CPD and WRTD. CPD
inhibits external reads and writes of data EEPROM.
WRTD inhibits internal and external writes to data
EEPROM. The CPU can always read data EEPROM
under normal operation, regardless of the protection bit
settings.
24.3.3 CONFIGURATION REGISTER
PROTECTION
The Configuration registers can be write-protected.
The WRTC bit controls protection of the Configuration
registers. In normal execution mode, the WRTC bit is
readable only. WRTC can only be written via ICSP or
an external programmer.
24.4 ID Locations
Eight memory locations (200000h-200007h) are
designated as ID locations, where the user can store
checksum or other code identification numbers. These
locations are both readable and writable during normal
execution through the TBLRD and TBLWT instructions
or during program/verify. The ID locations can be read
when the device is code-protected.
24.5 In-Circuit Serial Programming
PIC18(L)F2X/4XK22 devices can be serially
programmed while in the end application circuit. This is
simply done with two lines for clock and data and three
other lines for power, ground and the programming
voltage. This allows customers to manufacture boards
with unprogrammed devices and then program the
microcontroller just before shipping the product. This
also allows the most recent firmware or a custom
firmware to be programmed.
24.6 In-Circuit Debugger
When the DEBUG Configuration bit is programmed to
a 0, the In-Circuit Debugger functionality is enabled.
This function allows simple debugging functions when
used with MPLAB
MCU instruction
sets, while maintaining an easy migration from these
PIC
n
s
k
s
Branch if Carry
Branch if Negative
Branch if Not Carry
Branch if Not Negative
Branch if Not Overflow
Branch if Not Zero
Branch if Overflow
Branch Unconditionally
Branch if Zero
Call subroutine 1st word
2nd word
Clear Watchdog Timer
Decimal Adjust WREG
Go to address 1st word
2nd word
No Operation
No Operation
Pop top of return stack (TOS)
Push top of return stack (TOS)
Relative Call
Software device Reset
Return from interrupt enable
Return with literal in WREG
Return from Subroutine
Go into Standby mode
1 (2)
1 (2)
1 (2)
1 (2)
1 (2)
1 (2)
1 (2)
2
1 (2)
2
1
1
2
1
1
1
1
2
1
2
2
2
1
1110
1110
1110
1110
1110
1110
1110
1101
1110
1110
1111
0000
0000
1110
1111
0000
1111
0000
0000
1101
0000
0000
0000
0000
0000
0010
0110
0011
0111
0101
0001
0100
0nnn
0000
110s
kkkk
0000
0000
1111
kkkk
0000
xxxx
0000
0000
1nnn
0000
0000
1100
0000
0000
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
kkkk
kkkk
0000
0000
kkkk
kkkk
0000
xxxx
0000
0000
nnnn
1111
0001
kkkk
0001
0000
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
kkkk
kkkk
0100
0111
kkkk
kkkk
0000
xxxx
0110
0101
nnnn
1111
000s
kkkk
001s
0011
None
None
None
None
None
None
None
None
None
None
TO, PD
C
None
None
None
None
None
None
All
GIE/GIEH,
PEIE/GIEL
None
None
TO, PD
4
TABLE 25-2: PIC18(L)F2X/4XK22 INSTRUCTION SET (CONTINUED)
Mnemonic,
Operands
Description Cycles
16-Bit Instruction Word
Status
Affected
Notes
MSb LSb
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value
present on the pins themselves. For example, if the data latch is 1 for a pin configured as input and is driven low by an
external device, the data will be written back with a 0.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if
assigned.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the
first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory
locations have a valid instruction.
PIC18(L)F2X/4XK22
DS41412A-page 374 Preliminary 2010 Microchip Technology Inc.
LITERAL OPERATIONS
ADDLW
ANDLW
IORLW
LFSR
MOVLB
MOVLW
MULLW
RETLW
SUBLW
XORLW
k
k
k
f, k
k
k
k
k
k
k
Add literal and WREG
AND literal with WREG
Inclusive OR literal with WREG
Move literal (12-bit) 2nd word
to FSR(f) 1st word
Move literal to BSR<3:0>
Move literal to WREG
Multiply literal with WREG
Return with literal in WREG
Subtract WREG from literal
Exclusive OR literal with WREG
1
1
1
2
1
1
1
2
1
1
0000
0000
0000
1110
1111
0000
0000
0000
0000
0000
0000
1111
1011
1001
1110
0000
0001
1110
1101
1100
1000
1010
kkkk
kkkk
kkkk
00ff
kkkk
0000
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
C, DC, Z, OV, N
Z, N
Z, N
None
None
None
None
None
C, DC, Z, OV, N
Z, N
DATA MEMORY PROGRAM MEMORY OPERATIONS
TBLRD*
TBLRD*+
TBLRD*-
TBLRD+*
TBLWT*
TBLWT*+
TBLWT*-
TBLWT+*
Table Read
Table Read with post-increment
Table Read with post-decrement
Table Read with pre-increment
Table Write
Table Write with post-increment
Table Write with post-decrement
Table Write with pre-increment
2
2
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
1000
1001
1010
1011
1100
1101
1110
1111
None
None
None
None
None
None
None
None
TABLE 25-2: PIC18(L)F2X/4XK22 INSTRUCTION SET (CONTINUED)
Mnemonic,
Operands
Description Cycles
16-Bit Instruction Word
Status
Affected
Notes
MSb LSb
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value
present on the pins themselves. For example, if the data latch is 1 for a pin configured as input and is driven low by an
external device, the data will be written back with a 0.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if
assigned.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the
first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory
locations have a valid instruction.
2010 Microchip Technology Inc. Preliminary DS41412A-page 375
PIC18(L)F2X/4XK22
25.1.1 STANDARD INSTRUCTION SET
ADDLW ADD literal to W
Syntax: ADDLW k
Operands: 0 s k s 255
Operation: (W) + k W
Status Affected: N, OV, C, DC, Z
Encoding: 0000 1111 kkkk kkkk
Description: The contents of W are added to the
8-bit literal k and the result is placed in
W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
Write to W
Example: ADDLW 15h
Before Instruction
W = 10h
After Instruction
W = 25h
ADDWF ADD W to f
Syntax: ADDWF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (W) + (f) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0010 01da ffff ffff
Description: Add W to register f. If d is 0, the
result is stored in W. If d is 1, the
result is stored back in register f
(default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: ADDWF REG, 0, 0
Before Instruction
W = 17h
REG = 0C2h
After Instruction
W = 0D9h
REG = 0C2h
Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in
symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s).
PIC18(L)F2X/4XK22
DS41412A-page 376 Preliminary 2010 Microchip Technology Inc.
ADDWFC ADD W and CARRY bit to f
Syntax: ADDWFC f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (W) + (f) + (C) dest
Status Affected: N,OV, C, DC, Z
Encoding: 0010 00da ffff ffff
Description: Add W, the CARRY flag and data mem-
ory location f. If d is 0, the result is
placed in W. If d is 1, the result is
placed in data memory location f.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: ADDWFC REG, 0, 1
Before Instruction
CARRY bit = 1
REG = 02h
W = 4Dh
After Instruction
CARRY bit = 0
REG = 02h
W = 50h
ANDLW AND literal with W
Syntax: ANDLW k
Operands: 0 s k s 255
Operation: (W) .AND. k W
Status Affected: N, Z
Encoding: 0000 1011 kkkk kkkk
Description: The contents of W are ANDed with the
8-bit literal k. The result is placed in W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
k
Process
Data
Write to W
Example: ANDLW 05Fh
Before Instruction
W = A3h
After Instruction
W = 03h
2010 Microchip Technology Inc. Preliminary DS41412A-page 377
PIC18(L)F2X/4XK22
ANDWF AND W with f
Syntax: ANDWF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (W) .AND. (f) dest
Status Affected: N, Z
Encoding: 0001 01da ffff ffff
Description: The contents of W are ANDed with
register f. If d is 0, the result is stored
in W. If d is 1, the result is stored back
in register f (default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: ANDWF REG, 0, 0
Before Instruction
W = 17h
REG = C2h
After Instruction
W = 02h
REG = C2h
BC Branch if Carry
Syntax: BC n
Operands: -128 s n s 127
Operation: if CARRY bit is 1
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0010 nnnn nnnn
Description: If the CARRY bit is 1, then the program
will branch.
The 2s complement number 2n is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
No
operation
Example: HERE BC 5
Before Instruction
PC = address (HERE)
After Instruction
If CARRY = 1;
PC = address (HERE + 12)
If CARRY = 0;
PC = address (HERE + 2)
PIC18(L)F2X/4XK22
DS41412A-page 378 Preliminary 2010 Microchip Technology Inc.
BCF Bit Clear f
Syntax: BCF f, b {,a}
Operands: 0 s f s 255
0 s b s 7
a e [0,1]
Operation: 0 f<b>
Status Affected: None
Encoding: 1001 bbba ffff ffff
Description: Bit b in register f is cleared.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write
register f
Example: BCF FLAG_REG, 7, 0
Before Instruction
FLAG_REG = C7h
After Instruction
FLAG_REG = 47h
BN Branch if Negative
Syntax: BN n
Operands: -128 s n s 127
Operation: if NEGATIVE bit is 1
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0110 nnnn nnnn
Description: If the NEGATIVE bit is 1, then the
program will branch.
The 2s complement number 2n is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
No
operation
Example: HERE BN Jump
Before Instruction
PC = address (HERE)
After Instruction
If NEGATIVE = 1;
PC = address (Jump)
If NEGATIVE = 0;
PC = address (HERE + 2)
2010 Microchip Technology Inc. Preliminary DS41412A-page 379
PIC18(L)F2X/4XK22
BNC Branch if Not Carry
Syntax: BNC n
Operands: -128 s n s 127
Operation: if CARRY bit is 0
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0011 nnnn nnnn
Description: If the CARRY bit is 0, then the program
will branch.
The 2s complement number 2n is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
No
operation
Example: HERE BNC Jump
Before Instruction
PC = address (HERE)
After Instruction
If CARRY = 0;
PC = address (Jump)
If CARRY = 1;
PC = address (HERE + 2)
BNN Branch if Not Negative
Syntax: BNN n
Operands: -128 s n s 127
Operation: if NEGATIVE bit is 0
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0111 nnnn nnnn
Description: If the NEGATIVE bit is 0, then the
program will branch.
The 2s complement number 2n is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
No
operation
Example: HERE BNN Jump
Before Instruction
PC = address (HERE)
After Instruction
If NEGATIVE = 0;
PC = address (Jump)
If NEGATIVE = 1;
PC = address (HERE + 2)
PIC18(L)F2X/4XK22
DS41412A-page 380 Preliminary 2010 Microchip Technology Inc.
BNOV Branch if Not Overflow
Syntax: BNOV n
Operands: -128 s n s 127
Operation: if OVERFLOW bit is 0
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0101 nnnn nnnn
Description: If the OVERFLOW bit is 0, then the
program will branch.
The 2s complement number 2n is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
No
operation
Example: HERE BNOV Jump
Before Instruction
PC = address (HERE)
After Instruction
If OVERFLOW= 0;
PC = address (Jump)
If OVERFLOW= 1;
PC = address (HERE + 2)
BNZ Branch if Not Zero
Syntax: BNZ n
Operands: -128 s n s 127
Operation: if ZERO bit is 0
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0001 nnnn nnnn
Description: If the ZERO bit is 0, then the program
will branch.
The 2s complement number 2n is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
No
operation
Example: HERE BNZ Jump
Before Instruction
PC = address (HERE)
After Instruction
If ZERO = 0;
PC = address (Jump)
If ZERO = 1;
PC = address (HERE + 2)
2010 Microchip Technology Inc. Preliminary DS41412A-page 381
PIC18(L)F2X/4XK22
BRA Unconditional Branch
Syntax: BRA n
Operands: -1024 s n s 1023
Operation: (PC) + 2 + 2n PC
Status Affected: None
Encoding: 1101 0nnn nnnn nnnn
Description: Add the 2s complement number 2n to
the PC. Since the PC will have incre-
mented to fetch the next instruction, the
new address will be PC + 2 + 2n. This
instruction is a two-cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
Example: HERE BRA Jump
Before Instruction
PC = address (HERE)
After Instruction
PC = address (Jump)
BSF Bit Set f
Syntax: BSF f, b {,a}
Operands: 0 s f s 255
0 s b s 7
a e [0,1]
Operation: 1 f<b>
Status Affected: None
Encoding: 1000 bbba ffff ffff
Description: Bit b in register f is set.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write
register f
Example: BSF FLAG_REG, 7, 1
Before Instruction
FLAG_REG = 0Ah
After Instruction
FLAG_REG = 8Ah
PIC18(L)F2X/4XK22
DS41412A-page 382 Preliminary 2010 Microchip Technology Inc.
BTFSC Bit Test File, Skip if Clear
Syntax: BTFSC f, b {,a}
Operands: 0 s f s 255
0 s b s 7
a e [0,1]
Operation: skip if (f<b>) = 0
Status Affected: None
Encoding: 1011 bbba ffff ffff
Description: If bit b in register f is 0, then the next
instruction is skipped. If bit b is 0, then
the next instruction fetched during the
current instruction execution is discarded
and a NOP is executed instead, making
this a two-cycle instruction.
If a is 0, the Access Bank is selected. If
a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates in
Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh).
See Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE
FALSE
TRUE
BTFSC
:
:
FLAG, 1, 0
Before Instruction
PC = address (HERE)
After Instruction
If FLAG<1> = 0;
PC = address (TRUE)
If FLAG<1> = 1;
PC = address (FALSE)
BTFSS Bit Test File, Skip if Set
Syntax: BTFSS f, b {,a}
Operands: 0 s f s 255
0 s b < 7
a e [0,1]
Operation: skip if (f<b>) = 1
Status Affected: None
Encoding: 1010 bbba ffff ffff
Description: If bit b in register f is 1, then the next
instruction is skipped. If bit b is 1, then
the next instruction fetched during the
current instruction execution is discarded
and a NOP is executed instead, making
this a two-cycle instruction.
If a is 0, the Access Bank is selected. If
a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh).
See Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE
FALSE
TRUE
BTFSS
:
:
FLAG, 1, 0
Before Instruction
PC = address (HERE)
After Instruction
If FLAG<1> = 0;
PC = address (FALSE)
If FLAG<1> = 1;
PC = address (TRUE)
2010 Microchip Technology Inc. Preliminary DS41412A-page 383
PIC18(L)F2X/4XK22
BTG Bit Toggle f
Syntax: BTG f, b {,a}
Operands: 0 s f s 255
0 s b < 7
a e [0,1]
Operation: (f<b>) f<b>
Status Affected: None
Encoding: 0111 bbba ffff ffff
Description: Bit b in data memory location f is
inverted.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write
register f
Example: BTG PORTC, 4, 0
Before Instruction:
PORTC = 0111 0101 [75h]
After Instruction:
PORTC = 0110 0101 [65h]
BOV Branch if Overflow
Syntax: BOV n
Operands: -128 s n s 127
Operation: if OVERFLOW bit is 1
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0100 nnnn nnnn
Description: If the OVERFLOW bit is 1, then the
program will branch.
The 2s complement number 2n is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
No
operation
Example: HERE BOV Jump
Before Instruction
PC = address (HERE)
After Instruction
If OVERFLOW= 1;
PC = address (Jump)
If OVERFLOW= 0;
PC = address (HERE + 2)
PIC18(L)F2X/4XK22
DS41412A-page 384 Preliminary 2010 Microchip Technology Inc.
BZ Branch if Zero
Syntax: BZ n
Operands: -128 s n s 127
Operation: if ZERO bit is 1
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1110 0000 nnnn nnnn
Description: If the ZERO bit is 1, then the program
will branch.
The 2s complement number 2n is
added to the PC. Since the PC will
have incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity:
If Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
If No Jump:
Q1 Q2 Q3 Q4
Decode Read literal
n
Process
Data
No
operation
Example: HERE BZ Jump
Before Instruction
PC = address (HERE)
After Instruction
If ZERO = 1;
PC = address (Jump)
If ZERO = 0;
PC = address (HERE + 2)
CALL Subroutine Call
Syntax: CALL k {,s}
Operands: 0 s k s 1048575
s e [0,1]
Operation: (PC) + 4 TOS,
k PC<20:1>,
if s = 1
(W) WS,
(Status) STATUSS,
(BSR) BSRS
Status Affected: None
Encoding:
1st word (k<7:0>)
2nd word(k<19:8>)
1110
1111
110s
k
19
kkk
k
7
kkk
kkkk
kkkk
0
kkkk
8
Description: Subroutine call of entire 2-Mbyte
memory range. First, return address
(PC + 4) is pushed onto the return
stack. If s = 1, the W, Status and BSR
registers are also pushed into their
respective shadow registers, WS,
STATUSS and BSRS. If s = 0, no
update occurs (default). Then, the
20-bit value k is loaded into PC<20:1>.
CALL is a two-cycle instruction.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
k<7:0>,
PUSH PC to
stack
Read literal
k<19:8>,
Write to PC
No
operation
No
operation
No
operation
No
operation
Example: HERE CALL THERE, 1
Before Instruction
PC = address (HERE)
After Instruction
PC = address (THERE)
TOS = address (HERE + 4)
WS = W
BSRS = BSR
STATUSS= Status
2010 Microchip Technology Inc. Preliminary DS41412A-page 385
PIC18(L)F2X/4XK22
CLRF Clear f
Syntax: CLRF f {,a}
Operands: 0 s f s 255
a e [0,1]
Operation: 000h f
1 Z
Status Affected: Z
Encoding: 0110 101a ffff ffff
Description: Clears the contents of the specified
register.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write
register f
Example: CLRF FLAG_REG, 1
Before Instruction
FLAG_REG = 5Ah
After Instruction
FLAG_REG = 00h
CLRWDT Clear Watchdog Timer
Syntax: CLRWDT
Operands: None
Operation: 000h WDT,
000h WDT postscaler,
1 TO,
1 PD
Status Affected: TO, PD
Encoding: 0000 0000 0000 0100
Description: CLRWDT instruction resets the
Watchdog Timer. It also resets the
postscaler of the WDT. Status bits, TO
and PD, are set.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
Process
Data
No
operation
Example: CLRWDT
Before Instruction
WDT Counter = ?
After Instruction
WDT Counter = 00h
WDT Postscaler = 0
TO = 1
PD = 1
PIC18(L)F2X/4XK22
DS41412A-page 386 Preliminary 2010 Microchip Technology Inc.
COMF Complement f
Syntax: COMF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f) dest
Status Affected: N, Z
Encoding: 0001 11da ffff ffff
Description: The contents of register f are
complemented. If d is 0, the result is
stored in W. If d is 1, the result is
stored back in register f (default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: COMF REG, 0, 0
Before Instruction
REG = 13h
After Instruction
REG = 13h
W = ECh
CPFSEQ Compare f with W, skip if f = W
Syntax: CPFSEQ f {,a}
Operands: 0 s f s 255
a e [0,1]
Operation: (f) (W),
skip if (f) = (W)
(unsigned comparison)
Status Affected: None
Encoding: 0110 001a ffff ffff
Description: Compares the contents of data memory
location f to the contents of W by
performing an unsigned subtraction.
If f = W, then the fetched instruction is
discarded and a NOP is executed
instead, making this a two-cycle
instruction.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE CPFSEQ REG, 0
NEQUAL :
EQUAL :
Before Instruction
PC Address = HERE
W = ?
REG = ?
After Instruction
If REG = W;
PC = Address (EQUAL)
If REG = W;
PC = Address (NEQUAL)
2010 Microchip Technology Inc. Preliminary DS41412A-page 387
PIC18(L)F2X/4XK22
CPFSGT Compare f with W, skip if f > W
Syntax: CPFSGT f {,a}
Operands: 0 s f s 255
a e [0,1]
Operation: (f) (W),
skip if (f) > (W)
(unsigned comparison)
Status Affected: None
Encoding: 0110 010a ffff ffff
Description: Compares the contents of data memory
location f to the contents of the W by
performing an unsigned subtraction.
If the contents of f are greater than the
contents of WREG, then the fetched
instruction is discarded and a NOP is
executed instead, making this a
two-cycle instruction.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE CPFSGT REG, 0
NGREATER :
GREATER :
Before Instruction
PC = Address (HERE)
W = ?
After Instruction
If REG > W;
PC = Address (GREATER)
If REG s W;
PC = Address (NGREATER)
CPFSLT Compare f with W, skip if f < W
Syntax: CPFSLT f {,a}
Operands: 0 s f s 255
a e [0,1]
Operation: (f) (W),
skip if (f) < (W)
(unsigned comparison)
Status Affected: None
Encoding: 0110 000a ffff ffff
Description: Compares the contents of data memory
location f to the contents of W by
performing an unsigned subtraction.
If the contents of f are less than the
contents of W, then the fetched
instruction is discarded and a NOP is
executed instead, making this a
two-cycle instruction.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE CPFSLT REG, 1
NLESS :
LESS :
Before Instruction
PC = Address (HERE)
W = ?
After Instruction
If REG < W;
PC = Address (LESS)
If REG > W;
PC = Address (NLESS)
PIC18(L)F2X/4XK22
DS41412A-page 388 Preliminary 2010 Microchip Technology Inc.
DAW Decimal Adjust W Register
Syntax: DAW
Operands: None
Operation: If [W<3:0> > 9] or [DC = 1] then
(W<3:0>) + 6 W<3:0>;
else
(W<3:0>) W<3:0>;
If [W<7:4> + DC > 9] or [C = 1] then
(W<7:4>) + 6 + DC W<7:4> ;
else
(W<7:4>) + DC W<7:4>
Status Affected: C
Encoding: 0000 0000 0000 0111
Description: DAW adjusts the eight-bit value in W,
resulting from the earlier addition of two
variables (each in packed BCD format)
and produces a correct packed BCD
result.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register W
Process
Data
Write
W
Example1:
DAW
Before Instruction
W = A5h
C = 0
DC = 0
After Instruction
W = 05h
C = 1
DC = 0
Example 2:
Before Instruction
W = CEh
C = 0
DC = 0
After Instruction
W = 34h
C = 1
DC = 0
DECF Decrement f
Syntax: DECF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f) 1 dest
Status Affected: C, DC, N, OV, Z
Encoding: 0000 01da ffff ffff
Description: Decrement register f. If d is 0, the
result is stored in W. If d is 1, the
result is stored back in register f
(default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: DECF CNT, 1, 0
Before Instruction
CNT = 01h
Z = 0
After Instruction
CNT = 00h
Z = 1
2010 Microchip Technology Inc. Preliminary DS41412A-page 389
PIC18(L)F2X/4XK22
DECFSZ Decrement f, skip if 0
Syntax: DECFSZ f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f) 1 dest,
skip if result = 0
Status Affected: None
Encoding: 0010 11da ffff ffff
Description: The contents of register f are
decremented. If d is 0, the result is
placed in W. If d is 1, the result is
placed back in register f (default).
If the result is 0, the next instruction,
which is already fetched, is discarded
and a NOP is executed instead, making
it a two-cycle instruction.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE DECFSZ CNT, 1, 1
GOTO LOOP
CONTINUE
Before Instruction
PC = Address (HERE)
After Instruction
CNT = CNT - 1
If CNT = 0;
PC = Address (CONTINUE)
If CNT = 0;
PC = Address (HERE + 2)
DCFSNZ Decrement f, skip if not 0
Syntax: DCFSNZ f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f) 1 dest,
skip if result = 0
Status Affected: None
Encoding: 0100 11da ffff ffff
Description: The contents of register f are
decremented. If d is 0, the result is
placed in W. If d is 1, the result is
placed back in register f (default).
If the result is not 0, the next
instruction, which is already fetched, is
discarded and a NOP is executed
instead, making it a two-cycle
instruction.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE DCFSNZ TEMP, 1, 0
ZERO :
NZERO :
Before Instruction
TEMP = ?
After Instruction
TEMP = TEMP 1,
If TEMP = 0;
PC = Address (ZERO)
If TEMP = 0;
PC = Address (NZERO)
PIC18(L)F2X/4XK22
DS41412A-page 390 Preliminary 2010 Microchip Technology Inc.
GOTO Unconditional Branch
Syntax: GOTO k
Operands: 0 s k s 1048575
Operation: k PC<20:1>
Status Affected: None
Encoding:
1st word (k<7:0>)
2nd word(k<19:8>)
1110
1111
1111
k
19
kkk
k
7
kkk
kkkk
kkkk
0
kkkk
8
Description: GOTO allows an unconditional branch
anywhere within entire
2-Mbyte memory range. The 20-bit
value k is loaded into PC<20:1>.
GOTO is always a two-cycle
instruction.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
k<7:0>,
No
operation
Read literal
k<19:8>,
Write to PC
No
operation
No
operation
No
operation
No
operation
Example: GOTO THERE
After Instruction
PC = Address (THERE)
INCF Increment f
Syntax: INCF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f) + 1 dest
Status Affected: C, DC, N, OV, Z
Encoding: 0010 10da ffff ffff
Description: The contents of register f are
incremented. If d is 0, the result is
placed in W. If d is 1, the result is
placed back in register f (default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: INCF CNT, 1, 0
Before Instruction
CNT = FFh
Z = 0
C = ?
DC = ?
After Instruction
CNT = 00h
Z = 1
C = 1
DC = 1
2010 Microchip Technology Inc. Preliminary DS41412A-page 391
PIC18(L)F2X/4XK22
INCFSZ Increment f, skip if 0
Syntax: INCFSZ f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f) + 1 dest,
skip if result = 0
Status Affected: None
Encoding: 0011 11da ffff ffff
Description: The contents of register f are
incremented. If d is 0, the result is
placed in W. If d is 1, the result is
placed back in register f (default).
If the result is 0, the next instruction,
which is already fetched, is discarded
and a NOP is executed instead, making
it a two-cycle instruction.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE INCFSZ CNT, 1, 0
NZERO :
ZERO :
Before Instruction
PC = Address (HERE)
After Instruction
CNT = CNT + 1
If CNT = 0;
PC = Address (ZERO)
If CNT = 0;
PC = Address (NZERO)
INFSNZ Increment f, skip if not 0
Syntax: INFSNZ f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f) + 1 dest,
skip if result = 0
Status Affected: None
Encoding: 0100 10da ffff ffff
Description: The contents of register f are
incremented. If d is 0, the result is
placed in W. If d is 1, the result is
placed back in register f (default).
If the result is not 0, the next
instruction, which is already fetched, is
discarded and a NOP is executed
instead, making it a two-cycle
instruction.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE INFSNZ REG, 1, 0
ZERO
NZERO
Before Instruction
PC = Address (HERE)
After Instruction
REG = REG + 1
If REG = 0;
PC = Address (NZERO)
If REG = 0;
PC = Address (ZERO)
PIC18(L)F2X/4XK22
DS41412A-page 392 Preliminary 2010 Microchip Technology Inc.
IORLW Inclusive OR literal with W
Syntax: IORLW k
Operands: 0 s k s 255
Operation: (W) .OR. k W
Status Affected: N, Z
Encoding: 0000 1001 kkkk kkkk
Description: The contents of W are ORed with the
eight-bit literal k. The result is placed in
W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
Write to W
Example: IORLW 35h
Before Instruction
W = 9Ah
After Instruction
W = BFh
IORWF Inclusive OR W with f
Syntax: IORWF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (W) .OR. (f) dest
Status Affected: N, Z
Encoding: 0001 00da ffff ffff
Description: Inclusive OR W with register f. If d is
0, the result is placed in W. If d is 1,
the result is placed back in register f
(default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: IORWF RESULT, 0, 1
Before Instruction
RESULT = 13h
W = 91h
After Instruction
RESULT = 13h
W = 93h
2010 Microchip Technology Inc. Preliminary DS41412A-page 393
PIC18(L)F2X/4XK22
LFSR Load FSR
Syntax: LFSR f, k
Operands: 0 s f s 2
0 s k s 4095
Operation: k FSRf
Status Affected: None
Encoding: 1110
1111
1110
0000
00ff
k
7
kkk
k
11
kkk
kkkk
Description: The 12-bit literal k is loaded into the
File Select Register pointed to by f.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
k MSB
Process
Data
Write
literal k
MSB to
FSRfH
Decode Read literal
k LSB
Process
Data
Write literal
k to FSRfL
Example: LFSR 2, 3ABh
After Instruction
FSR2H = 03h
FSR2L = ABh
MOVF Move f
Syntax: MOVF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: f dest
Status Affected: N, Z
Encoding: 0101 00da ffff ffff
Description: The contents of register f are moved to
a destination dependent upon the
status of d. If d is 0, the result is
placed in W. If d is 1, the result is
placed back in register f (default).
Location f can be anywhere in the
256-byte bank.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write W
Example: MOVF REG, 0, 0
Before Instruction
REG = 22h
W = FFh
After Instruction
REG = 22h
W = 22h
PIC18(L)F2X/4XK22
DS41412A-page 394 Preliminary 2010 Microchip Technology Inc.
MOVFF Move f to f
Syntax: MOVFF f
s
,f
d
Operands: 0 s f
s
s 4095
0 s f
d
s 4095
Operation: (f
s
) f
d
Status Affected: None
Encoding:
1st word (source)
2nd word (destin.)
1100
1111
ffff
ffff
ffff
ffff
ffff
s
ffff
d
Description: The contents of source register f
s
are
moved to destination register f
d
.
Location of source f
s
can be anywhere
in the 4096-byte data space (000h to
FFFh) and location of destination f
d
can also be anywhere from 000h to
FFFh.
Either source or destination can be W
(a useful special situation).
MOVFF is particularly useful for
transferring a data memory location to a
peripheral register (such as the transmit
buffer or an I/O port).
The MOVFF instruction cannot use the
PCL, TOSU, TOSH or TOSL as the
destination register.
Words: 2
Cycles: 2 (3)
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
(src)
Process
Data
No
operation
Decode No
operation
No dummy
read
No
operation
Write
register f
(dest)
Example: MOVFF REG1, REG2
Before Instruction
REG1 = 33h
REG2 = 11h
After Instruction
REG1 = 33h
REG2 = 33h
MOVLB Move literal to low nibble in BSR
Syntax: MOVLW k
Operands: 0 s k s 255
Operation: k BSR
Status Affected: None
Encoding: 0000 0001 kkkk kkkk
Description: The eight-bit literal k is loaded into the
Bank Select Register (BSR). The value
of BSR<7:4> always remains 0,
regardless of the value of k
7
:k
4
.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
Write literal
k to BSR
Example: MOVLB 5
Before Instruction
BSR Register = 02h
After Instruction
BSR Register = 05h
2010 Microchip Technology Inc. Preliminary DS41412A-page 395
PIC18(L)F2X/4XK22
MOVLW Move literal to W
Syntax: MOVLW k
Operands: 0 s k s 255
Operation: k W
Status Affected: None
Encoding: 0000 1110 kkkk kkkk
Description: The eight-bit literal k is loaded into W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
Write to W
Example: MOVLW 5Ah
After Instruction
W = 5Ah
MOVWF Move W to f
Syntax: MOVWF f {,a}
Operands: 0 s f s 255
a e [0,1]
Operation: (W) f
Status Affected: None
Encoding: 0110 111a ffff ffff
Description: Move data from W to register f.
Location f can be anywhere in the
256-byte bank.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write
register f
Example: MOVWF REG, 0
Before Instruction
W = 4Fh
REG = FFh
After Instruction
W = 4Fh
REG = 4Fh
PIC18(L)F2X/4XK22
DS41412A-page 396 Preliminary 2010 Microchip Technology Inc.
MULLW Multiply literal with W
Syntax: MULLW k
Operands: 0 s k s 255
Operation: (W) x k PRODH:PRODL
Status Affected: None
Encoding: 0000 1101 kkkk kkkk
Description: An unsigned multiplication is carried
out between the contents of W and the
8-bit literal k. The 16-bit result is
placed in the PRODH:PRODL register
pair. PRODH contains the high byte.
W is unchanged.
None of the Status flags are affected.
Note that neither overflow nor carry is
possible in this operation. A zero result
is possible but not detected.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
Write
registers
PRODH:
PRODL
Example: MULLW 0C4h
Before Instruction
W = E2h
PRODH = ?
PRODL = ?
After Instruction
W = E2h
PRODH = ADh
PRODL = 08h
MULWF Multiply W with f
Syntax: MULWF f {,a}
Operands: 0 s f s 255
a e [0,1]
Operation: (W) x (f) PRODH:PRODL
Status Affected: None
Encoding: 0000 001a ffff ffff
Description: An unsigned multiplication is carried
out between the contents of W and the
register file location f. The 16-bit
result is stored in the PRODH:PRODL
register pair. PRODH contains the
high byte. Both W and f are
unchanged.
None of the Status flags are affected.
Note that neither overflow nor carry is
possible in this operation. A zero
result is possible but not detected.
If a is 0, the Access Bank is
selected. If a is 1, the BSR is used
to select the GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction
operates in Indexed Literal Offset
Addressing mode whenever
f s 95 (5Fh). See Section 25.2.3
Byte-Oriented and Bit-Oriented
Instructions in Indexed Literal Offset
Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write
registers
PRODH:
PRODL
Example: MULWF REG, 1
Before Instruction
W = C4h
REG = B5h
PRODH = ?
PRODL = ?
After Instruction
W = C4h
REG = B5h
PRODH = 8Ah
PRODL = 94h
2010 Microchip Technology Inc. Preliminary DS41412A-page 397
PIC18(L)F2X/4XK22
NEGF Negate f
Syntax: NEGF f {,a}
Operands: 0 s f s 255
a e [0,1]
Operation: ( f ) + 1 f
Status Affected: N, OV, C, DC, Z
Encoding: 0110 110a ffff ffff
Description: Location f is negated using twos
complement. The result is placed in the
data memory location f.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write
register f
Example: NEGF REG, 1
Before Instruction
REG = 0011 1010 [3Ah]
After Instruction
REG = 1100 0110 [C6h]
NOP No Operation
Syntax: NOP
Operands: None
Operation: No operation
Status Affected: None
Encoding: 0000
1111
0000
xxxx
0000
xxxx
0000
xxxx
Description: No operation.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
No
operation
No
operation
Example:
None.
PIC18(L)F2X/4XK22
DS41412A-page 398 Preliminary 2010 Microchip Technology Inc.
POP Pop Top of Return Stack
Syntax: POP
Operands: None
Operation: (TOS) bit bucket
Status Affected: None
Encoding: 0000 0000 0000 0110
Description: The TOS value is pulled off the return
stack and is discarded. The TOS value
then becomes the previous value that
was pushed onto the return stack.
This instruction is provided to enable
the user to properly manage the return
stack to incorporate a software stack.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
POP TOS
value
No
operation
Example: POP
GOTO NEW
Before Instruction
TOS = 0031A2h
Stack (1 level down) = 014332h
After Instruction
TOS = 014332h
PC = NEW
PUSH Push Top of Return Stack
Syntax: PUSH
Operands: None
Operation: (PC + 2) TOS
Status Affected: None
Encoding: 0000 0000 0000 0101
Description: The PC + 2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows implementing a
software stack by modifying TOS and
then pushing it onto the return stack.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode PUSH
PC + 2 onto
return stack
No
operation
No
operation
Example: PUSH
Before Instruction
TOS = 345Ah
PC = 0124h
After Instruction
PC = 0126h
TOS = 0126h
Stack (1 level down) = 345Ah
2010 Microchip Technology Inc. Preliminary DS41412A-page 399
PIC18(L)F2X/4XK22
RCALL Relative Call
Syntax: RCALL n
Operands: -1024 s n s 1023
Operation: (PC) + 2 TOS,
(PC) + 2 + 2n PC
Status Affected: None
Encoding: 1101 1nnn nnnn nnnn
Description: Subroutine call with a jump up to 1K
from the current location. First, return
address (PC + 2) is pushed onto the
stack. Then, add the 2s complement
number 2n to the PC. Since the PC will
have incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is a
two-cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read literal
n
PUSH PC to
stack
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
Example: HERE RCALL Jump
Before Instruction
PC = Address (HERE)
After Instruction
PC = Address (Jump)
TOS = Address (HERE + 2)
RESET Reset
Syntax: RESET
Operands: None
Operation: Reset all registers and flags that are
affected by a MCLR Reset.
Status Affected: All
Encoding: 0000 0000 1111 1111
Description: This instruction provides a way to
execute a MCLR Reset by software.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Start
Reset
No
operation
No
operation
Example: RESET
After Instruction
Registers = Reset Value
Flags* = Reset Value
PIC18(L)F2X/4XK22
DS41412A-page 400 Preliminary 2010 Microchip Technology Inc.
RETFIE Return from Interrupt
Syntax: RETFIE {s}
Operands: s e [0,1]
Operation: (TOS) PC,
1 GIE/GIEH or PEIE/GIEL,
if s = 1
(WS) W,
(STATUSS) Status,
(BSRS) BSR,
PCLATU, PCLATH are unchanged.
Status Affected: GIE/GIEH, PEIE/GIEL.
Encoding: 0000 0000 0001 000s
Description: Return from interrupt. Stack is popped
and Top-of-Stack (TOS) is loaded into
the PC. Interrupts are enabled by
setting either the high or low priority
global interrupt enable bit. If s = 1, the
contents of the shadow registers, WS,
STATUSS and BSRS, are loaded into
their corresponding registers, W,
Status and BSR. If s = 0, no update of
these registers occurs (default).
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
No
operation
POP PC
from stack
Set GIEH or
GIEL
No
operation
No
operation
No
operation
No
operation
Example: RETFIE 1
After Interrupt
PC = TOS
W = WS
BSR = BSRS
Status = STATUSS
GIE/GIEH, PEIE/GIEL = 1
RETLW Return literal to W
Syntax: RETLW k
Operands: 0 s k s 255
Operation: k W,
(TOS) PC,
PCLATU, PCLATH are unchanged
Status Affected: None
Encoding: 0000 1100 kkkk kkkk
Description: W is loaded with the eight-bit literal k.
The program counter is loaded from the
top of the stack (the return address).
The high address latch (PCLATH)
remains unchanged.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
POP PC
from stack,
Write to W
No
operation
No
operation
No
operation
No
operation
Example:
CALL TABLE ; W contains table
; offset value
; W now has
; table value
:
TABLE
ADDWF PCL ; W = offset
RETLW k0 ; Begin table
RETLW k1 ;
:
:
RETLW kn ; End of table
Before Instruction
W = 07h
After Instruction
W = value of kn
2010 Microchip Technology Inc. Preliminary DS41412A-page 401
PIC18(L)F2X/4XK22
RETURN Return from Subroutine
Syntax: RETURN {s}
Operands: s e [0,1]
Operation: (TOS) PC,
if s = 1
(WS) W,
(STATUSS) Status,
(BSRS) BSR,
PCLATU, PCLATH are unchanged
Status Affected: None
Encoding: 0000 0000 0001 001s
Description: Return from subroutine. The stack is
popped and the top of the stack (TOS)
is loaded into the program counter. If
s= 1, the contents of the shadow
registers, WS, STATUSS and BSRS,
are loaded into their corresponding
registers, W, Status and BSR. If
s = 0, no update of these registers
occurs (default).
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
Process
Data
POP PC
from stack
No
operation
No
operation
No
operation
No
operation
Example: RETURN
After Instruction:
PC = TOS
RLCF Rotate Left f through Carry
Syntax: RLCF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f<n>) dest<n + 1>,
(f<7>) C,
(C) dest<0>
Status Affected: C, N, Z
Encoding: 0011 01da ffff ffff
Description: The contents of register f are rotated
one bit to the left through the CARRY
flag. If d is 0, the result is placed in
W. If d is 1, the result is stored back
in register f (default).
If a is 0, the Access Bank is
selected. If a is 1, the BSR is used to
select the GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction
operates in Indexed Literal Offset
Addressing mode whenever
f s 95 (5Fh). See Section 25.2.3
Byte-Oriented and Bit-Oriented
Instructions in Indexed Literal Offset
Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: RLCF REG, 0, 0
Before Instruction
REG = 1110 0110
C = 0
After Instruction
REG = 1110 0110
W = 1100 1100
C = 1
C register f
PIC18(L)F2X/4XK22
DS41412A-page 402 Preliminary 2010 Microchip Technology Inc.
RLNCF Rotate Left f (No Carry)
Syntax: RLNCF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f<n>) dest<n + 1>,
(f<7>) dest<0>
Status Affected: N, Z
Encoding: 0100 01da ffff ffff
Description: The contents of register f are rotated
one bit to the left. If d is 0, the result
is placed in W. If d is 1, the result is
stored back in register f (default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: RLNCF REG, 1, 0
Before Instruction
REG = 1010 1011
After Instruction
REG = 0101 0111
register f
RRCF Rotate Right f through Carry
Syntax: RRCF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f<n>) dest<n 1>,
(f<0>) C,
(C) dest<7>
Status Affected: C, N, Z
Encoding: 0011 00da ffff ffff
Description: The contents of register f are rotated
one bit to the right through the CARRY
flag. If d is 0, the result is placed in W.
If d is 1, the result is placed back in
register f (default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: RRCF REG, 0, 0
Before Instruction
REG = 1110 0110
C = 0
After Instruction
REG = 1110 0110
W = 0111 0011
C = 0
C register f
2010 Microchip Technology Inc. Preliminary DS41412A-page 403
PIC18(L)F2X/4XK22
RRNCF Rotate Right f (No Carry)
Syntax: RRNCF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f<n>) dest<n 1>,
(f<0>) dest<7>
Status Affected: N, Z
Encoding: 0100 00da ffff ffff
Description: The contents of register f are rotated
one bit to the right. If d is 0, the result
is placed in W. If d is 1, the result is
placed back in register f (default).
If a is 0, the Access Bank will be
selected (default), overriding the BSR
value. If a is 1, then the bank will be
selected as per the BSR value.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example 1: RRNCF REG, 1, 0
Before Instruction
REG = 1101 0111
After Instruction
REG = 1110 1011
Example 2: RRNCF REG, 0, 0
Before Instruction
W = ?
REG = 1101 0111
After Instruction
W = 1110 1011
REG = 1101 0111
register f
SETF Set f
Syntax: SETF f {,a}
Operands: 0 s f s 255
a e [0,1]
Operation: FFh f
Status Affected: None
Encoding: 0110 100a ffff ffff
Description: The contents of the specified register
are set to FFh.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write
register f
Example: SETF REG, 1
Before Instruction
REG = 5Ah
After Instruction
REG = FFh
PIC18(L)F2X/4XK22
DS41412A-page 404 Preliminary 2010 Microchip Technology Inc.
SLEEP Enter Sleep mode
Syntax: SLEEP
Operands: None
Operation: 00h WDT,
0 WDT postscaler,
1 TO,
0 PD
Status Affected: TO, PD
Encoding: 0000 0000 0000 0011
Description: The Power-down Status bit (PD) is
cleared. The Time-out Status bit (TO)
is set. Watchdog Timer and its
postscaler are cleared.
The processor is put into Sleep mode
with the oscillator stopped.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
Process
Data
Go to
Sleep
Example: SLEEP
Before Instruction
TO = ?
PD = ?
After Instruction
TO = 1
PD = 0
If WDT causes wake-up, this bit is cleared.
SUBFWB Subtract f from W with borrow
Syntax: SUBFWB f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (W) (f) (C) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0101 01da ffff ffff
Description: Subtract register f and CARRY flag
(borrow) from W (2s complement
method). If d is 0, the result is stored
in W. If d is 1, the result is stored in
register f (default).
If a is 0, the Access Bank is
selected. If a is 1, the BSR is used
to select the GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction
operates in Indexed Literal Offset
Addressing mode whenever
f s 95 (5Fh). See Section 25.2.3
Byte-Oriented and Bit-Oriented
Instructions in Indexed Literal Offset
Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example 1: SUBFWB REG, 1, 0
Before Instruction
REG = 3
W = 2
C = 1
After Instruction
REG = FF
W = 2
C = 0
Z = 0
N = 1 ; result is negative
Example 2: SUBFWB REG, 0, 0
Before Instruction
REG = 2
W = 5
C = 1
After Instruction
REG = 2
W = 3
C = 1
Z = 0
N = 0 ; result is positive
Example 3: SUBFWB REG, 1, 0
Before Instruction
REG = 1
W = 2
C = 0
After Instruction
REG = 0
W = 2
C = 1
Z = 1 ; result is zero
N = 0
2010 Microchip Technology Inc. Preliminary DS41412A-page 405
PIC18(L)F2X/4XK22
SUBLW Subtract W from literal
Syntax: SUBLW k
Operands: 0 s k s 255
Operation: k (W) W
Status Affected: N, OV, C, DC, Z
Encoding: 0000 1000 kkkk kkkk
Description W is subtracted from the eight-bit
literal k. The result is placed in W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
Write to W
Example 1: SUBLW 02h
Before Instruction
W = 01h
C = ?
After Instruction
W = 01h
C = 1 ; result is positive
Z = 0
N = 0
Example 2: SUBLW 02h
Before Instruction
W = 02h
C = ?
After Instruction
W = 00h
C = 1 ; result is zero
Z = 1
N = 0
Example 3: SUBLW 02h
Before Instruction
W = 03h
C = ?
After Instruction
W = FFh ; (2s complement)
C = 0 ; result is negative
Z = 0
N = 1
SUBWF Subtract W from f
Syntax: SUBWF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f) (W) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0101 11da ffff ffff
Description: Subtract W from register f (2s
complement method). If d is 0, the
result is stored in W. If d is 1, the
result is stored back in register f
(default).
If a is 0, the Access Bank is
selected. If a is 1, the BSR is used
to select the GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction
operates in Indexed Literal Offset
Addressing mode whenever
f s 95 (5Fh). See Section 25.2.3
Byte-Oriented and Bit-Oriented
Instructions in Indexed Literal Offset
Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example 1: SUBWF REG, 1, 0
Before Instruction
REG = 3
W = 2
C = ?
After Instruction
REG = 1
W = 2
C = 1 ; result is positive
Z = 0
N = 0
Example 2: SUBWF REG, 0, 0
Before Instruction
REG = 2
W = 2
C = ?
After Instruction
REG = 2
W = 0
C = 1 ; result is zero
Z = 1
N = 0
Example 3: SUBWF REG, 1, 0
Before Instruction
REG = 1
W = 2
C = ?
After Instruction
REG = FFh ;(2s complement)
W = 2
C = 0 ; result is negative
Z = 0
N = 1
PIC18(L)F2X/4XK22
DS41412A-page 406 Preliminary 2010 Microchip Technology Inc.
SUBWFB Subtract W from f with Borrow
Syntax: SUBWFB f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f) (W) (C) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0101 10da ffff ffff
Description: Subtract W and the CARRY flag
(borrow) from register f (2s comple-
ment method). If d is 0, the result is
stored in W. If d is 1, the result is
stored back in register f (default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example 1: SUBWFB REG, 1, 0
Before Instruction
REG = 19h (0001 1001)
W = 0Dh (0000 1101)
C = 1
After Instruction
REG = 0Ch (0000 1100)
W = 0Dh (0000 1101)
C = 1
Z = 0
N = 0 ; result is positive
Example 2: SUBWFB REG, 0, 0
Before Instruction
REG = 1Bh (0001 1011)
W = 1Ah (0001 1010)
C = 0
After Instruction
REG = 1Bh (0001 1011)
W = 00h
C = 1
Z = 1 ; result is zero
N = 0
Example 3: SUBWFB REG, 1, 0
Before Instruction
REG = 03h (0000 0011)
W = 0Eh (0000 1110)
C = 1
After Instruction
REG = F5h (1111 0101)
; [2s comp]
W = 0Eh (0000 1110)
C = 0
Z = 0
N = 1 ; result is negative
SWAPF Swap f
Syntax: SWAPF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (f<3:0>) dest<7:4>,
(f<7:4>) dest<3:0>
Status Affected: None
Encoding: 0011 10da ffff ffff
Description: The upper and lower nibbles of register
f are exchanged. If d is 0, the result
is placed in W. If d is 1, the result is
placed in register f (default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: SWAPF REG, 1, 0
Before Instruction
REG = 53h
After Instruction
REG = 35h
2010 Microchip Technology Inc. Preliminary DS41412A-page 407
PIC18(L)F2X/4XK22
TBLRD Table Read
Syntax: TBLRD ( *; *+; *-; +*)
Operands: None
Operation: if TBLRD *,
(Prog Mem (TBLPTR)) TABLAT;
TBLPTR No Change;
if TBLRD *+,
(Prog Mem (TBLPTR)) TABLAT;
(TBLPTR) + 1 TBLPTR;
if TBLRD *-,
(Prog Mem (TBLPTR)) TABLAT;
(TBLPTR) 1 TBLPTR;
if TBLRD +*,
(TBLPTR) + 1 TBLPTR;
(Prog Mem (TBLPTR)) TABLAT;
Status Affected: None
Encoding: 0000 0000 0000 10nn
nn=0 *
=1 *+
=2 *-
=3 +*
Description: This instruction is used to read the contents
of Program Memory (P.M.). To address the
program memory, a pointer called Table
Pointer (TBLPTR) is used.
The TBLPTR (a 21-bit pointer) points to
each byte in the program memory. TBLPTR
has a 2-Mbyte address range.
TBLPTR[0] = 0: Least Significant Byte
of Program Memory
Word
TBLPTR[0] = 1: Most Significant Byte
of Program Memory
Word
The TBLRD instruction can modify the value
of TBLPTR as follows:
no change
post-increment
post-decrement
pre-increment
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
No
operation
No
operation
No
operation
No operation
(Read Program
Memory)
No
operation
No operation
(Write TABLAT)
TBLRD Table Read (Continued)
Example1: TBLRD *+ ;
Before Instruction
TABLAT = 55h
TBLPTR = 00A356h
MEMORY (00A356h) = 34h
After Instruction
TABLAT = 34h
TBLPTR = 00A357h
Example2: TBLRD +* ;
Before Instruction
TABLAT = AAh
TBLPTR = 01A357h
MEMORY (01A357h) = 12h
MEMORY (01A358h) = 34h
After Instruction
TABLAT = 34h
TBLPTR = 01A358h
PIC18(L)F2X/4XK22
DS41412A-page 408 Preliminary 2010 Microchip Technology Inc.
TBLWT Table Write
Syntax: TBLWT ( *; *+; *-; +*)
Operands: None
Operation: if TBLWT*,
(TABLAT) Holding Register;
TBLPTR No Change;
if TBLWT*+,
(TABLAT) Holding Register;
(TBLPTR) + 1 TBLPTR;
if TBLWT*-,
(TABLAT) Holding Register;
(TBLPTR) 1 TBLPTR;
if TBLWT+*,
(TBLPTR) + 1 TBLPTR;
(TABLAT) Holding Register;
Status Affected: None
Encoding: 0000 0000 0000 11nn
nn=0 *
=1 *+
=2 *-
=3 +*
Description: This instruction uses the 3 LSBs of
TBLPTR to determine which of the
8 holding registers the TABLAT is written
to. The holding registers are used to
program the contents of Program
Memory (P.M.). (Refer to Section 6.0
Flash Program Memory for additional
details on programming Flash memory.)
The TBLPTR (a 21-bit pointer) points to
each byte in the program memory.
TBLPTR has a 2-MByte address range.
The LSb of the TBLPTR selects which
byte of the program memory location to
access.
TBLPTR[0] = 0: Least Significant
Byte of Program
Memory Word
TBLPTR[0] = 1: Most Significant
Byte of Program
Memory Word
The TBLWT instruction can modify the
value of TBLPTR as follows:
no change
post-increment
post-decrement
pre-increment
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No
operation
No
operation
No
operation
No
operation
No
operation
(Read
TABLAT)
No
operation
No
operation
(Write to
Holding
Register )
TBLWT Table Write (Continued)
Example1: TBLWT *+;
Before Instruction
TABLAT = 55h
TBLPTR = 00A356h
HOLDING REGISTER
(00A356h) = FFh
After Instructions (table write completion)
TABLAT = 55h
TBLPTR = 00A357h
HOLDING REGISTER
(00A356h) = 55h
Example 2: TBLWT +*;
Before Instruction
TABLAT = 34h
TBLPTR = 01389Ah
HOLDING REGISTER
(01389Ah) = FFh
HOLDING REGISTER
(01389Bh) = FFh
After Instruction (table write completion)
TABLAT = 34h
TBLPTR = 01389Bh
HOLDING REGISTER
(01389Ah) = FFh
HOLDING REGISTER
(01389Bh) = 34h
2010 Microchip Technology Inc. Preliminary DS41412A-page 409
PIC18(L)F2X/4XK22
TSTFSZ Test f, skip if 0
Syntax: TSTFSZ f {,a}
Operands: 0 s f s 255
a e [0,1]
Operation: skip if f = 0
Status Affected: None
Encoding: 0110 011a ffff ffff
Description: If f = 0, the next instruction fetched
during the current instruction execution
is discarded and a NOP is executed,
making this a two-cycle instruction.
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
No
operation
If skip:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE TSTFSZ CNT, 1
NZERO :
ZERO :
Before Instruction
PC = Address (HERE)
After Instruction
If CNT = 00h,
PC = Address (ZERO)
If CNT = 00h,
PC = Address (NZERO)
XORLW Exclusive OR literal with W
Syntax: XORLW k
Operands: 0 s k s 255
Operation: (W) .XOR. k W
Status Affected: N, Z
Encoding: 0000 1010 kkkk kkkk
Description: The contents of W are XORed with
the 8-bit literal k. The result is placed
in W.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
Write to W
Example: XORLW 0AFh
Before Instruction
W = B5h
After Instruction
W = 1Ah
PIC18(L)F2X/4XK22
DS41412A-page 410 Preliminary 2010 Microchip Technology Inc.
XORWF Exclusive OR W with f
Syntax: XORWF f {,d {,a}}
Operands: 0 s f s 255
d e [0,1]
a e [0,1]
Operation: (W) .XOR. (f) dest
Status Affected: N, Z
Encoding: 0001 10da ffff ffff
Description: Exclusive OR the contents of W with
register f. If d is 0, the result is stored
in W. If d is 1, the result is stored back
in the register f (default).
If a is 0, the Access Bank is selected.
If a is 1, the BSR is used to select the
GPR bank.
If a is 0 and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f s 95 (5Fh). See
Section 25.2.3 Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode for details.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: XORWF REG, 1, 0
Before Instruction
REG = AFh
W = B5h
After Instruction
REG = 1Ah
W = B5h
2010 Microchip Technology Inc. Preliminary DS41412A-page 411
PIC18(L)F2X/4XK22
25.2 Extended Instruction Set
In addition to the standard 75 instructions of the PIC18
instruction set, PIC18(L)F2X/4XK22 devices also
provide an optional extension to the core CPU
functionality. The added features include eight
additional instructions that augment indirect and
indexed addressing operations and the implementation
of Indexed Literal Offset Addressing mode for many of
the standard PIC18 instructions.
The additional features of the extended instruction set
are disabled by default. To enable them, users must set
the XINST Configuration bit.
The instructions in the extended set can all be
classified as literal operations, which either manipulate
the File Select Registers, or use them for indexed
addressing. Two of the instructions, ADDFSR and
SUBFSR, each have an additional special instantiation
for using FSR2. These versions (ADDULNK and
SUBULNK) allow for automatic return after execution.
The extended instructions are specifically implemented
to optimize re-entrant program code (that is, code that
is recursive or that uses a software stack) written in
high-level languages, particularly C. Among other
things, they allow users working in high-level
languages to perform certain operations on data
structures more efficiently. These include:
dynamic allocation and deallocation of software
stack space when entering and leaving
subroutines
function pointer invocation
software Stack Pointer manipulation
manipulation of variables located in a software
stack
A summary of the instructions in the extended instruc-
tion set is provided in Table 25-3. Detailed descriptions
are provided in Section 25.2.2 Extended Instruction
Set. The opcode field descriptions in Table 25-1 apply
to both the standard and extended PIC18 instruction
sets.
25.2.1 EXTENDED INSTRUCTION SYNTAX
Most of the extended instructions use indexed
arguments, using one of the File Select Registers and
some offset to specify a source or destination register.
When an argument for an instruction serves as part of
indexed addressing, it is enclosed in square brackets
([ ]). This is done to indicate that the argument is used
as an index or offset. MPASM Assembler will flag an
error if it determines that an index or offset value is not
bracketed.
When the extended instruction set is enabled, brackets
are also used to indicate index arguments in byte-
oriented and bit-oriented instructions. This is in addition
to other changes in their syntax. For more details, see
Section 25.2.3.1 Extended Instruction Syntax with
Standard PIC18 Commands.
TABLE 25-3: EXTENSIONS TO THE PIC18 INSTRUCTION SET
Note: The instruction set extension and the
Indexed Literal Offset Addressing mode
were designed for optimizing applications
written in C; the user may likely never use
these instructions directly in assembler.
The syntax for these commands is pro-
vided as a reference for users who may be
reviewing code that has been generated
by a compiler.
Note: In the past, square brackets have been
used to denote optional arguments in the
PIC18 and earlier instruction sets. In this
text and going forward, optional
arguments are denoted by braces ({ }).
Mnemonic,
Operands
Description Cycles
16-Bit Instruction Word
Status
Affected
MSb LSb
ADDFSR
ADDULNK
CALLW
MOVSF
MOVSS
PUSHL
SUBFSR
SUBULNK
f, k
k
z
s
, f
d
z
s
, z
d
k
f, k
k
Add literal to FSR
Add literal to FSR2 and return
Call subroutine using WREG
Move z
s
(source) to 1st word
f
d
(destination) 2nd word
Move z
s
(source) to 1st word
z
d
(destination) 2nd word
Store literal at FSR2,
decrement FSR2
Subtract literal from FSR
Subtract literal from FSR2 and
return
1
2
2
2
2
1
1
2
1110
1110
0000
1110
1111
1110
1111
1110
1110
1110
1000
1000
0000
1011
ffff
1011
xxxx
1010
1001
1001
ffkk
11kk
0001
0zzz
ffff
1zzz
xzzz
kkkk
ffkk
11kk
kkkk
kkkk
0100
zzzz
ffff
zzzz
zzzz
kkkk
kkkk
kkkk
None
None
None
None
None
None
None
None
PIC18(L)F2X/4XK22
DS41412A-page 412 Preliminary 2010 Microchip Technology Inc.
25.2.2 EXTENDED INSTRUCTION SET
ADDFSR Add Literal to FSR
Syntax: ADDFSR f, k
Operands: 0 s k s 63
f e [ 0, 1, 2 ]
Operation: FSR(f) + k FSR(f)
Status Affected: None
Encoding: 1110 1000 ffkk kkkk
Description: The 6-bit literal k is added to the
contents of the FSR specified by f.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
Write to
FSR
Example: ADDFSR 2, 23h
Before Instruction
FSR2 = 03FFh
After Instruction
FSR2 = 0422h
ADDULNK Add Literal to FSR2 and Return
Syntax: ADDULNK k
Operands: 0 s k s 63
Operation: FSR2 + k FSR2,
(TOS) PC
Status Affected: None
Encoding: 1110 1000 11kk kkkk
Description: The 6-bit literal k is added to the
contents of FSR2. A RETURN is then
executed by loading the PC with the
TOS.
The instruction takes two cycles to
execute; a NOP is performed during
the second cycle.
This may be thought of as a special
case of the ADDFSR instruction,
where f = 3 (binary 11); it operates
only on FSR2.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
literal k
Process
Data
Write to
FSR
No
Operation
No
Operation
No
Operation
No
Operation
Example: ADDULNK 23h
Before Instruction
FSR2 = 03FFh
PC = 0100h
After Instruction
FSR2 = 0422h
PC = (TOS)
Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in
symbolic addressing. If a label is used, the instruction syntax then becomes: {label} instruction argument(s).
2010 Microchip Technology Inc. Preliminary DS41412A-page 413
PIC18(L)F2X/4XK22
CALLW Subroutine Call Using WREG
Syntax: CALLW
Operands: None
Operation: (PC + 2) TOS,
(W) PCL,
(PCLATH) PCH,
(PCLATU) PCU
Status Affected: None
Encoding: 0000 0000 0001 0100
Description First, the return address (PC + 2) is
pushed onto the return stack. Next, the
contents of W are written to PCL; the
existing value is discarded. Then, the
contents of PCLATH and PCLATU are
latched into PCH and PCU,
respectively. The second cycle is
executed as a NOP instruction while the
new next instruction is fetched.
Unlike CALL, there is no option to
update W, Status or BSR.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
WREG
PUSH PC to
stack
No
operation
No
operation
No
operation
No
operation
No
operation
Example: HERE CALLW
Before Instruction
PC = address (HERE)
PCLATH = 10h
PCLATU = 00h
W = 06h
After Instruction
PC = 001006h
TOS = address (HERE + 2)
PCLATH = 10h
PCLATU = 00h
W = 06h
MOVSF Move Indexed to f
Syntax: MOVSF [z
s
], f
d
Operands: 0 s z
s
s 127
0 s f
d
s 4095
Operation: ((FSR2) + z
s
) f
d
Status Affected: None
Encoding:
1st word (source)
2nd word (destin.)
1110
1111
1011
ffff
0zzz
ffff
zzzz
s
ffff
d
Description: The contents of the source register are
moved to destination register f
d
. The
actual address of the source register is
determined by adding the 7-bit literal
offset z
s
in the first word to the value of
FSR2. The address of the destination
register is specified by the 12-bit literal
f
d
in the second word. Both addresses
can be anywhere in the 4096-byte data
space (000h to FFFh).
The MOVSF instruction cannot use the
PCL, TOSU, TOSH or TOSL as the
destination register.
If the resultant source address points to
an indirect addressing register, the
value returned will be 00h.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Determine
source addr
Determine
source addr
Read
source reg
Decode No
operation
No dummy
read
No
operation
Write
register f
(dest)
Example: MOVSF [05h], REG2
Before Instruction
FSR2 = 80h
Contents
of 85h = 33h
REG2 = 11h
After Instruction
FSR2 = 80h
Contents
of 85h = 33h
REG2 = 33h
PIC18(L)F2X/4XK22
DS41412A-page 414 Preliminary 2010 Microchip Technology Inc.
MOVSS Move Indexed to Indexed
Syntax: MOVSS [z
s
], [z
d
]
Operands: 0 s z
s
s 127
0 s z
d
s 127
Operation: ((FSR2) + z
s
) ((FSR2) + z
d
)
Status Affected: None
Encoding:
1st word (source)
2nd word (dest.)
1110
1111
1011
xxxx
1zzz
xzzz
zzzz
s
zzzz
d
Description The contents of the source register are
moved to the destination register. The
addresses of the source and destination
registers are determined by adding the
7-bit literal offsets z
s
or z
d
,
respectively, to the value of FSR2. Both
registers can be located anywhere in
the 4096-byte data memory space
(000h to FFFh).
The MOVSS instruction cannot use the
PCL, TOSU, TOSH or TOSL as the
destination register.
If the resultant source address points to
an indirect addressing register, the
value returned will be 00h. If the
resultant destination address points to
an indirect addressing register, the
instruction will execute as a NOP.
Words: 2
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Determine
source addr
Determine
source addr
Read
source reg
Decode Determine
dest addr
Determine
dest addr
Write
to dest reg
Example: MOVSS [05h], [06h]
Before Instruction
FSR2 = 80h
Contents
of 85h = 33h
Contents
of 86h = 11h
After Instruction
FSR2 = 80h
Contents
of 85h = 33h
Contents
of 86h = 33h
PUSHL Store Literal at FSR2, Decrement FSR2
Syntax: PUSHL k
Operands: 0 s k s 255
Operation: k (FSR2),
FSR2 1 FSR2
Status Affected: None
Encoding: 1111 1010 kkkk kkkk
Description: The 8-bit literal k is written to the data
memory address specified by FSR2. FSR2
is decremented by 1 after the operation.
This instruction allows users to push values
onto a software stack.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read k Process
data
Write to
destination
Example: PUSHL 08h
Before Instruction
FSR2H:FSR2L = 01ECh
Memory (01ECh) = 00h
After Instruction
FSR2H:FSR2L = 01EBh
Memory (01ECh) = 08h
2010 Microchip Technology Inc. Preliminary DS41412A-page 415
PIC18(L)F2X/4XK22
SUBFSR Subtract Literal from FSR
Syntax: SUBFSR f, k
Operands: 0 s k s 63
f e [ 0, 1, 2 ]
Operation: FSR(f) k FSRf
Status Affected: None
Encoding: 1110 1001 ffkk kkkk
Description: The 6-bit literal k is subtracted from
the contents of the FSR specified by
f.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: SUBFSR 2, 23h
Before Instruction
FSR2 = 03FFh
After Instruction
FSR2 = 03DCh
SUBULNK Subtract Literal from FSR2 and Return
Syntax: SUBULNK k
Operands: 0 s k s 63
Operation: FSR2 k FSR2
(TOS) PC
Status Affected: None
Encoding: 1110 1001 11kk kkkk
Description: The 6-bit literal k is subtracted from the
contents of the FSR2. A RETURN is then
executed by loading the PC with the TOS.
The instruction takes two cycles to
execute; a NOP is performed during the
second cycle.
This may be thought of as a special case of
the SUBFSR instruction, where f = 3 (binary
11); it operates only on FSR2.
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
No
Operation
No
Operation
No
Operation
No
Operation
Example: SUBULNK 23h
Before Instruction
FSR2 = 03FFh
PC = 0100h
After Instruction
FSR2 = 03DCh
PC = (TOS)
PIC18(L)F2X/4XK22
DS41412A-page 416 Preliminary 2010 Microchip Technology Inc.
25.2.3 BYTE-ORIENTED AND
BIT-ORIENTED INSTRUCTIONS IN
INDEXED LITERAL OFFSET MODE
In addition to eight new commands in the extended set,
enabling the extended instruction set also enables
Indexed Literal Offset Addressing mode (Section 5.5.1
Indexed Addressing with Literal Offset). This has
a significant impact on the way that many commands of
the standard PIC18 instruction set are interpreted.
When the extended set is disabled, addresses
embedded in opcodes are treated as literal memory
locations: either as a location in the Access Bank (a =
0), or in a GPR bank designated by the BSR (a = 1).
When the extended instruction set is enabled and a =
0, however, a file register argument of 5Fh or less is
interpreted as an offset from the pointer value in FSR2
and not as a literal address. For practical purposes, this
means that all instructions that use the Access RAM bit
as an argument that is, all byte-oriented and bit-
oriented instructions, or almost half of the core PIC18
instructions may behave differently when the
extended instruction set is enabled.
When the content of FSR2 is 00h, the boundaries of the
Access RAM are essentially remapped to their original
values. This may be useful in creating backward
compatible code. If this technique is used, it may be
necessary to save the value of FSR2 and restore it
when moving back and forth between C and assembly
routines in order to preserve the Stack Pointer. Users
must also keep in mind the syntax requirements of the
extended instruction set (see Section 25.2.3.1
Extended Instruction Syntax with Standard PIC18
Commands).
Although the Indexed Literal Offset Addressing mode
can be very useful for dynamic stack and pointer
manipulation, it can also be very annoying if a simple
arithmetic operation is carried out on the wrong
register. Users who are accustomed to the PIC18
programming must keep in mind that, when the
extended instruction set is enabled, register addresses
of 5Fh or less are used for Indexed Literal Offset
Addressing.
Representative examples of typical byte-oriented and
bit-oriented instructions in the Indexed Literal Offset
Addressing mode are provided on the following page to
show how execution is affected. The operand condi-
tions shown in the examples are applicable to all
instructions of these types.
25.2.3.1 Extended Instruction Syntax with
Standard PIC18 Commands
When the extended instruction set is enabled, the file
register argument, f, in the standard byte-oriented and
bit-oriented commands is replaced with the literal offset
value, k. As already noted, this occurs only when f is
less than or equal to 5Fh. When an offset value is used,
it must be indicated by square brackets ([ ]). As with
the extended instructions, the use of brackets indicates
to the compiler that the value is to be interpreted as an
index or an offset. Omitting the brackets, or using a
value greater than 5Fh within brackets, will generate an
error in the MPASM assembler.
If the index argument is properly bracketed for Indexed
Literal Offset Addressing, the Access RAM argument is
never specified; it will automatically be assumed to be
0. This is in contrast to standard operation (extended
instruction set disabled) when a is set on the basis of
the target address. Declaring the Access RAM bit in
this mode will also generate an error in the MPASM
assembler.
The destination argument, d, functions as before.
In the latest versions of the MPASM assembler,
language support for the extended instruction set must
be explicitly invoked. This is done with either the
command line option, /y, or the PE directive in the
source listing.
25.2.4 CONSIDERATIONS WHEN
ENABLING THE EXTENDED
INSTRUCTION SET
It is important to note that the extensions to the instruc-
tion set may not be beneficial to all users. In particular,
users who are not writing code that uses a software
stack may not benefit from using the extensions to the
instruction set.
Additionally, the Indexed Literal Offset Addressing
mode may create issues with legacy applications
written to the PIC18 assembler. This is because
instructions in the legacy code may attempt to address
registers in the Access Bank below 5Fh. Since these
addresses are interpreted as literal offsets to FSR2
when the instruction set extension is enabled, the
application may read or write to the wrong data
addresses.
When porting an application to the PIC18(L)F2X/
4XK22, it is very important to consider the type of code.
A large, re-entrant application that is written in C and
would benefit from efficient compilation will do well
when using the instruction set extensions. Legacy
applications that heavily use the Access Bank will most
likely not benefit from using the extended instruction
set.
Note: Enabling the PIC18 instruction set
extension may cause legacy applications
to behave erratically or fail entirely.
2010 Microchip Technology Inc. Preliminary DS41412A-page 417
PIC18(L)F2X/4XK22
ADDWF
ADD W to Indexed
(Indexed Literal Offset mode)
Syntax: ADDWF [k] {,d}
Operands: 0 s k s 95
d e [0,1]
Operation: (W) + ((FSR2) + k) dest
Status Affected: N, OV, C, DC, Z
Encoding: 0010 01d0 kkkk kkkk
Description: The contents of W are added to the
contents of the register indicated by
FSR2, offset by the value k.
If d is 0, the result is stored in W. If d
is 1, the result is stored back in
register f (default).
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read k Process
Data
Write to
destination
Example: ADDWF [OFST] , 0
Before Instruction
W = 17h
OFST = 2Ch
FSR2 = 0A00h
Contents
of 0A2Ch = 20h
After Instruction
W = 37h
Contents
of 0A2Ch = 20h
BSF
Bit Set Indexed
(Indexed Literal Offset mode)
Syntax: BSF [k], b
Operands: 0 s f s 95
0 s b s 7
Operation: 1 ((FSR2) + k)<b>
Status Affected: None
Encoding: 1000 bbb0 kkkk kkkk
Description: Bit b of the register indicated by FSR2,
offset by the value k, is set.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read
register f
Process
Data
Write to
destination
Example: BSF [FLAG_OFST], 7
Before Instruction
FLAG_OFST = 0Ah
FSR2 = 0A00h
Contents
of 0A0Ah = 55h
After Instruction
Contents
of 0A0Ah = D5h
SETF
Set Indexed
(Indexed Literal Offset mode)
Syntax: SETF [k]
Operands: 0 s k s 95
Operation: FFh ((FSR2) + k)
Status Affected: None
Encoding: 0110 1000 kkkk kkkk
Description: The contents of the register indicated by
FSR2, offset by k, are set to FFh.
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read k Process
Data
Write
register
Example: SETF [OFST]
Before Instruction
OFST = 2Ch
FSR2 = 0A00h
Contents
of 0A2Ch = 00h
After Instruction
Contents
of 0A2Ch = FFh
PIC18(L)F2X/4XK22
DS41412A-page 418 Preliminary 2010 Microchip Technology Inc.
25.2.5 SPECIAL CONSIDERATIONS WITH
MICROCHIP MPLAB
IDE TOOLS
The latest versions of Microchips software tools have
been designed to fully support the extended instruction
set of the PIC18(L)F2X/4XK22 family of devices. This
includes the MPLAB C18 C compiler, MPASM
assembly language and MPLAB Integrated
Development Environment (IDE).
When selecting a target device for software
development, MPLAB IDE will automatically set default
Configuration bits for that device. The default setting for
the XINST Configuration bit is 0, disabling the
extended instruction set and Indexed Literal Offset
Addressing mode. For proper execution of applications
developed to take advantage of the extended
instruction set, XINST must be set during
programming.
To develop software for the extended instruction set,
the user must enable support for the instructions and
the Indexed Addressing mode in their language tool(s).
Depending on the environment being used, this may be
done in several ways:
A menu option, or dialog box within the
environment, that allows the user to configure the
language tool and its settings for the project
A command line option
A directive in the source code
These options vary between different compilers,
assemblers and development environments. Users are
encouraged to review the documentation accompanying
their development systems for the appropriate
information.
2010 Microchip Technology Inc. Preliminary DS41412A-page 419
PIC18(L)F2X/4XK22
26.0 DEVELOPMENT SUPPORT
The PIC
digital signal
controllers are supported with a full range of software
and hardware development tools:
Integrated Development Environment
- MPLAB
IDE Software
Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C for Various Device Families
- MPASM
TM
Assembler
- MPLINK
TM
Object Linker/
MPLIB
TM
Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
Simulators
- MPLAB SIM Software Simulator
Emulators
- MPLAB REAL ICE In-Circuit Emulator
In-Circuit Debuggers
- MPLAB ICD 3
- PICkit 3 Debug Express
Device Programmers
- PICkit 2 Programmer
- MPLAB PM3 Device Programmer
Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
26.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows
standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
Integration into MPLAB IDE projects
User-defined macros to streamline
assembly code
Conditional assembly for multi-purpose
source files
Directives that allow complete control over the
assembly process
26.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
26.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
2010 Microchip Technology Inc. Preliminary DS41412A-page 421
PIC18(L)F2X/4XK22
26.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC
DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
26.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchips next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC
Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineers PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with in-
circuit debugger systems (RJ11) or with the new high-
speed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers signifi-
cant advantages over competitive emulators including
low-cost, full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, a rugge-
dized probe interface and long (up to three meters) inter-
connection cables.
26.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Micro-
chip's most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Sig-
nal Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC
Flash microcon-
trollers and dsPIC
and dsPIC
Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to imple-
ment in-circuit debugging and In-Circuit Serial Pro-
gramming.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller, hookup cables and CDROM
with users guide, lessons, tutorial, compiler and
MPLAB IDE software.
PIC18(L)F2X/4XK22
DS41412A-page 422 Preliminary 2010 Microchip Technology Inc.
26.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The PICkit 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use inter-
face for programming and debugging Microchips Flash
families of microcontrollers. The full featured
Windows
microcon-
trollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a break-
point, the file registers can be examined and modified.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with users guide, lessons, tutorial, compiler and
MPLAB IDE software.
26.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modu-
lar, detachable socket assembly to support various
package types. The ICSP cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
26.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM and dsPICDEM demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ
security ICs, CAN,
IrDA
V
V
V
RC, EC modes
(1)
XT, LP modes
VIH Input High Voltage
I/O ports:
D147 with TTL buffer V
D148 VIH with Schmitt Trigger:
V
V
2.4V < VDD < 3.6V
VDD < 2.4V
D149 VIH MCLR
V
V
2.4V < VDD < 3.6V
VDD < 2.4V
D150 OSC1 V HS, HSPLL modes
D151
D152
D153
D154
OSC1
OSC1
OSC1
TXCKI
V
V
V
V
EC mode
RC mode
(1)
XT, LP modes
IIL Input Leakage I/O and
MCLR
(2,3)
VSS s VPIN s VDD,
Pin at high-
impedance
D155
D156
D157
IIL
IIL
I/O ports
Input Leakage RA2
Input Leakage RA3
5
10
30
100
10
35
200
400
10
25
70
300
nA
nA
nA
nA
nA
nA
nA
nA
nA
nA
nA
nA
s +25C
+60C
+85C
+125C
s +25C
+60C
+85C
+125C
s +25C
+60C
+85C
+125C
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that
the PIC
VDD/24
VDD/32
V
V
CV02* CACC Absolute Accuracy 1/2 LSb
CV03* CR Unit Resistor Value (R) 3k O
CV04* CST Settling Time
(1)
10 s
* These parameters are characterized but not tested.
Note 1: Settling time measured while CVRR = 1 and CVR3:CVR0 transitions from 0000 to 1111.
2: See Section 22.0 Digital-to-Analog Converter (DAC) Module for more information.
TABLE 27-3: FIXED VOLTAGE REFERENCE (FVR) SPECIFICATIONS
Operating Conditions: 1.8V < VDD < 3.6V, -40C < TA < +125C (unless otherwise stated)
VR Voltage Reference Specifications
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C s TA s +125C
Param
No.
Sym Characteristics Min Typ Max Units Comments
VR01 VROUT VR voltage output 1.15 1.024 1.25 V -40C to +85C
1.10 1.024 1.30 V +85C to +125C
VR02* TCVOUT Voltage drift temperature
coefficient
<50 ppm/C -40C to +40C
VR03* AVROUT/
AVDD
Voltage drift with respect to
VDD regulation
<2000 V/V 25C, 2.0 to 3.3V
VR04* TSTABLE Settling Time 25 100 s 0 to 125C
* These parameters are characterized but not tested.
PIC18(L)F2X/4XK22
DS41412A-page 442 Preliminary 2010 Microchip Technology Inc.
FIGURE 27-2: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS
VHLVD
HLVDIF
VDD
(HLVDIF set by hardware)
(HLVDIF can be
cleared by software)
TABLE 27-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C s TA s +125C
Param
No.
Symbol Characteristic HLVDL<3:0> Min Typ Max Units Conditions
HLVD Voltage on VDD
Transition High-to-
Low
0000 V
0001 V
0010 V
0011 V
0100 V
0101 V
0110 V
0111 V
1000 V
1001 V
1010 V
1011 V
1100 V
1101 V
1110 V
1111 V(HLVDIN pin) v
Production tested at TAMB = 25C. Specifications over temperature limits ensured by characterization.
2010 Microchip Technology Inc. Preliminary DS41412A-page 443
PIC18(L)F2X/4XK22
27.11 AC (Timing) Characteristics
27.11.1 TIMING PARAMETER SYMBOLOGY
The timing parameter symbols have been created
using one of the following formats:
1. TppS2ppS 3. TCC:ST (I
2
C specifications only)
2. TppS 4. Ts (I
2
C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T13CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
H High R Rise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
I
2
C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I
2
C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO Stop condition
STA Start condition
PIC18(L)F2X/4XK22
DS41412A-page 444 Preliminary 2010 Microchip Technology Inc.
27.11.2 TIMING CONDITIONS
The temperature and voltages specified in Table 27-5
apply to all timing specifications unless otherwise
noted. Figure 27-3 specifies the load conditions for the
timing specifications.
TABLE 27-5: TEMPERATURE AND VOLTAGE SPECIFICATIONS AC
FIGURE 27-3: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C s TA s +125C
Operating voltage VDD range as described in DC spec Section 27.1 and
Section 27.9.
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL = 464O
CL = 50 pF for all pins except OSC2/CLKOUT
and including D and E outputs as ports
Load Condition 1 Load Condition 2
Legend:
2010 Microchip Technology Inc. Preliminary DS41412A-page 445
PIC18(L)F2X/4XK22
27.11.3 TIMING DIAGRAMS AND SPECIFICATIONS
FIGURE 27-4: EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL)
OSC1
CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
1
2
3 3 4 4
TABLE 27-6: EXTERNAL CLOCK TIMING REQUIREMENTS
Param.
No.
Symbol Characteristic Min Max Units Conditions
1A FOSC External CLKIN
Frequency
(1)
DC 64 MHz EC, ECIO Oscillator mode
Oscillator Frequency
(1)
DC 4 MHz RC Oscillator mode
0.1 4 MHz XT Oscillator mode
4 25 MHz HS Oscillator mode
4 16 MHz HS + PLL Oscillator mode
5 200 kHz LP Oscillator mode
1 TOSC External CLKIN Period
(1)
15.6 ns EC, ECIO Oscillator mode
Oscillator Period
(1)
250 ns RC Oscillator mode
250 10,000 ns XT Oscillator mode
40
62.5
250
250
ns
ns
HS Oscillator mode
HS + PLL Oscillator mode,
5 200 s LP Oscillator mode
2 TCY Instruction Cycle Time
(1)
62.5 ns TCY = 4/FOSC
3 TOSL,
TOSH
External Clock in (OSC1)
High or Low Time
30 ns XT Oscillator mode
2.5 s LP Oscillator mode
10 ns HS Oscillator mode
4 TOSR,
TOSF
External Clock in (OSC1)
Rise or Fall Time
20 ns XT Oscillator mode
50 ns LP Oscillator mode
7.5 ns HS Oscillator mode
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations
except PLL. All specified values are based on characterization data for that particular oscillator type under
standard operating conditions with the device executing code. Exceeding these specified limits may result
in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested
to operate at min. values with an external clock applied to the OSC1/CLKIN pin. When an external clock
input is used, the max. cycle time limit is DC (no clock) for all devices.
PIC18(L)F2X/4XK22
DS41412A-page 446 Preliminary 2010 Microchip Technology Inc.
TABLE 27-7: PLL CLOCK TIMING SPECIFICATIONS (VDD = 1.8V TO 5.5V)
Param
No.
Sym Characteristic Min Typ Max Units Conditions
F10 FOSC Oscillator Frequency Range 4 5 MHz VDD = 1.8-3.0V
4 16 MHz VDD = 3.0-3.6V,
-40C to +125C
PIC16LF2X/4XK22
4 16 MHz VDD = 3.0-5.5V,
-40C to +125C
PIC16F2X/4XK22
F11 FSYS On-Chip VCO System Frequency 16 20 MHz VDD = 1.8-3.0V
16 64 MHz VDD = 3.0-3.6V,
-40C to +125C
PIC16LF2X/4XK22
16 64 MHz VDD = 3.0-5.5V,
-40C to +125C
PIC16F2X/4XK22
F12 t
rc
PLL Start-up Time (Lock Time) 2 ms
F13 ACLK CLKOUT Stability (Jitter) -2 +2 %
Data in Typ column is at 3V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
TABLE 27-8: AC CHARACTERISTICS:INTERNAL OSCILLATORS ACCURACY PIC18(L)F46K22
PIC18(L)F46K22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C s TA s +125C
Param
No.
Min Typ Max Units Conditions
OA1 HFINTOSC Accuracy @ Freq = 16 MHz, 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz
(1)
-2 0 +2 % +0C to +70C
-3 +2 % +70C to +85C
-5 +5 % -40C to 0C and
+85C to 125C
OA2 LFINTOSC Accuracy @ Freq = 31 kHz
26.562 35.938 kHz -40C to +125C
Legend: Shading of rows is to assist in readability of the table.
Note 1: Frequency calibrated at 25C. OSCTUNE register can be used to compensate for temperature drift.
2010 Microchip Technology Inc. Preliminary DS41412A-page 447
PIC18(L)F2X/4XK22
FIGURE 27-5: CLKOUT AND I/O TIMING
Note: Refer to Figure 27-3 for load conditions.
OSC1
CLKOUT
I/O pin
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
10
13
14
17
20, 21
19
18
15
11
12
16
Old Value New Value
TABLE 27-9: CLKOUT AND I/O TIMING REQUIREMENTS
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
10 TosH2ckL OSC1 | to CLKOUT + 75 200 ns (Note 1)
11 TosH2ckH OSC1 | to CLKOUT | 75 200 ns (Note 1)
12 TckR CLKOUT Rise Time 35 100 ns (Note 1)
13 TckF CLKOUT Fall Time 35 100 ns (Note 1)
14 TckL2ioV CLKOUT + to Port Out Valid 0.5 TCY + 20 ns (Note 1)
15 TioV2ckH Port In Valid before CLKOUT | 0.25 TCY + 25 ns (Note 1)
16 TckH2ioI Port In Hold after CLKOUT | 0 ns (Note 1)
17 TosH2ioV OSC1 | (Q1 cycle) to Port Out Valid 50 150 ns
18 TosH2ioI OSC1 | (Q2 cycle) to Port Input Invalid
(I/O in hold time)
100 ns
19 TioV2osH Port Input Valid to OSC1 | (I/O in setup time) 0 ns
20 TioR Port Output Rise Time 10 25 ns
21 TioF Port Output Fall Time 10 25 ns
22 TINP INTx pin High or Low Time 20 ns
23 TRBP RB<7:4> Change KBIx High or Low Time TCY ns
These parameters are asynchronous events not related to any internal clock edges.
Note 1: Measurements are taken in RC mode, where CLKOUT output is 4 x TOSC.
PIC18(L)F2X/4XK22
DS41412A-page 448 Preliminary 2010 Microchip Technology Inc.
FIGURE 27-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
FIGURE 27-7: BROWN-OUT RESET TIMING
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
Reset
Watchdog
Timer
Reset
33
32
30
31
34
I/O pins
34
Note: Refer to Figure 27-3 for load conditions.
VDD
BVDD
35
VBGAP = 1.2V
VIVRST
Enable Internal
Internal Reference
36
Reference Voltage
Voltage Stable
TABLE 27-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET REQUIREMENTS
Param.
No.
Symbol Characteristic Min Typ Max Units Conditions
30 TmcL MCLR Pulse Width (low) 2 s
31 TWDT Watchdog Timer Time-out Period
(no postscaler)
3.5 4.1 4.7 ms 1:1 prescaler
32 TOST Oscillation Start-up Timer Period 1024
TOSC
1024 TOSC TOSC = OSC1 period
33 TPWRT Power-up Timer Period 54.8 64.4 74.1 ms
34 TIOZ I/O High-Impedance from MCLR
Low or Watchdog Timer Reset
2 s
35 TBOR Brown-out Reset Pulse Width 200 s VDD s BVDD (see
D005)
36 TIVRST Internal Reference Voltage Stable 25 35 s
37 THLVD High/Low-Voltage Detect Pulse
Width
200 s VDD s VHLVD
2010 Microchip Technology Inc. Preliminary DS41412A-page 449
PIC18(L)F2X/4XK22
FIGURE 27-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
38 TCSD CPU Start-up Time 5 10 s
39 TIOBST Time for HF-INTOSC to Stabilize 0.25 1 ms
TABLE 27-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET REQUIREMENTS
Param.
No.
Symbol Characteristic Min Typ Max Units Conditions
Note: Refer to Figure 27-3 for load conditions.
46
47
45
48
41
42
40
T0CKI
T1OSO/T13CKI
TMR0 or
TMR1
TABLE 27-11: TIMER0 AND TIMER1/3/5 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Symbol Characteristic Min Max Units Conditions
40 Tt0H T0CKI High Pulse Width No prescaler 0.5 TCY + 20 ns
With prescaler 10 ns
41 Tt0L T0CKI Low Pulse Width No prescaler 0.5 TCY + 20 ns
With prescaler 10 ns
42 Tt0P T0CKI Period No prescaler TCY + 10 ns
With prescaler Greater of:
20 ns or
(TCY + 40)/N
ns N = prescale
value
(1, 2, 4,..., 256)
45 Tt1H TxCKI High
Time
Synchronous, no prescaler 0.5 TCY + 20 ns
Synchronous,
with prescaler
10 ns
Asynchronous 30 ns
46 Tt1L TxCKI Low
Time
Synchronous, no prescaler 0.5 TCY + 5 ns
Synchronous,
with prescaler
10 ns
Asynchronous 30 ns
47 Tt1P TxCKI Input
Period
Synchronous Greater of:
20 ns or
(TCY + 40)/N
ns N = prescale
value (1, 2, 4, 8)
Asynchronous 60 ns
Ft1 TxCKI Clock Input Frequency Range DC 50 kHz
PIC18(L)F2X/4XK22
DS41412A-page 450 Preliminary 2010 Microchip Technology Inc.
FIGURE 27-9: CAPTURE/COMPARE/PWM TIMINGS (ALL CCP MODULES)
48 Tcke2tmrI Delay from External TxCKI Clock Edge to Timer
Increment
2 TOSC 7 TOSC
TABLE 27-11: TIMER0 AND TIMER1/3/5 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Symbol Characteristic Min Max Units Conditions
Note: Refer to Figure 27-3 for load conditions.
CCPx
(Capture Mode)
50 51
52
CCPx
53 54
(Compare or PWM Mode)
2010 Microchip Technology Inc. Preliminary DS41412A-page 451
PIC18(L)F2X/4XK22
FIGURE 27-10: EXAMPLE SPI MASTER MODE TIMING (CKE = 0)
TABLE 27-12: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES)
Param
No.
Symbol Characteristic Min Max Units Conditions
50 TccL CCPx Input Low
Time
No prescaler 0.5 TCY + 20 ns
With
prescaler
10 ns
51 TccH CCPx Input
High Time
No prescaler 0.5 TCY + 20 ns
With
prescaler
10 ns
52 TccP CCPx Input Period 3 TCY + 40
N
ns N = prescale
value (1, 4 or
16)
53 TccR CCPx Output Fall Time 25 ns
54 TccF CCPx Output Fall Time 25 ns
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76
78 79
80
79 78
MSb LSb bit 6 - - - - - -1
MSb In
LSb In
bit 6 - - - -1
Note: Refer to Figure 27-3 for load conditions.
PIC18(L)F2X/4XK22
DS41412A-page 452 Preliminary 2010 Microchip Technology Inc.
FIGURE 27-11: EXAMPLE SPI MASTER MODE TIMING (CKE = 1)
TABLE 27-13: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)
Param
No.
Symbol Characteristic Min Max Units Conditions
70 TssL2scH,
TssL2scL
SS + to SCK + or SCK | Input TCY ns
71 TscH SCK Input High Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
71A Single Byte 40 ns (Note 1)
72 TscL SCK Input Low Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
72A Single Byte 40 ns (Note 1)
73 TdiV2scH,
TdiV2scL
Setup Time of SDI Data Input to SCK Edge 100 ns
73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge
of Byte 2
1.5 TCY + 40 ns (Note 2)
74 TscH2diL,
TscL2diL
Hold Time of SDI Data Input to SCK Edge 100 ns
75 TdoR SDO Data Output Rise Time 25 ns
76 TdoF SDO Data Output Fall Time 25 ns
78 TscR SCK Output Rise Time
(Master mode)
25 ns
79 TscF SCK Output Fall Time (Master mode) 25 ns
80 TscH2doV,
TscL2doV
SDO Data Output Valid after SCK Edge 50 ns
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
81
71 72
74
75, 76
78
80
MSb
79
73
MSb In
bit 6 - - - - - -1
LSb In
bit 6 - - - -1
LSb
Note: Refer to Figure 27-3 for load conditions.
2010 Microchip Technology Inc. Preliminary DS41412A-page 453
PIC18(L)F2X/4XK22
FIGURE 27-12: EXAMPLE SPI SLAVE MODE TIMING (CKE = 0)
TABLE 27-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)
Param.
No.
Symbol Characteristic Min Max Units Conditions
71 TscH SCK Input High Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
71A Single Byte 40 ns (Note 1)
72 TscL SCK Input Low Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
72A Single Byte 40 ns (Note 1)
73 TdiV2scH,
TdiV2scL
Setup Time of SDI Data Input to SCK Edge 100 ns
73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge
of Byte 2
1.5 TCY + 40 ns (Note 2)
74 TscH2diL,
TscL2diL
Hold Time of SDI Data Input to SCK Edge 100 ns
75 TdoR SDO Data Output Rise Time 25 ns
76 TdoF SDO Data Output Fall Time 25 ns
78 TscR SCK Output Rise Time
(Master mode)
25 ns
79 TscF SCK Output Fall Time (Master mode) 25 ns
80 TscH2doV,
TscL2doV
SDO Data Output Valid after SCK Edge 50 ns
81 TdoV2scH,
TdoV2scL
SDO Data Output Setup to SCK Edge TCY ns
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76
77
78 79
80
79 78
SDI
MSb LSb bit 6 - - - - - -1
MSb In
bit 6 - - - -1 LSb In
83
Note: Refer to Figure 27-3 for load conditions.
PIC18(L)F2X/4XK22
DS41412A-page 454 Preliminary 2010 Microchip Technology Inc.
FIGURE 27-13: EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)
TABLE 27-15: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0)
Param
No.
Symbol Characteristic Min Max Units Conditions
70 TssL2scH,
TssL2scL
SS + to SCK + or SCK | Input TCY ns
71 TscH SCK Input High Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
71A Single Byte 40 ns (Note 1)
72 TscL SCK Input Low Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
72A Single Byte 40 ns (Note 1)
73 TdiV2scH,
TdiV2scL
Setup Time of SDI Data Input to SCK Edge 100 ns
73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 ns (Note 2)
74 TscH2diL,
TscL2diL
Hold Time of SDI Data Input to SCK Edge 100 ns
75 TdoR SDO Data Output Rise Time 25 ns
76 TdoF SDO Data Output Fall Time 25 ns
77 TssH2doZ SS| to SDO Output High-Impedance 10 50 ns
78 TscR SCK Output Rise Time (Master mode) 25 ns
79 TscF SCK Output Fall Time (Master mode) 25 ns
80 TscH2doV,
TscL2doV
SDO Data Output Valid after SCK Edge 50 ns
83 TscH2ssH,
TscL2ssH
SS | after SCK edge 1.5 TCY + 40 ns
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
82
SDI
74
75, 76
MSb bit 6 - - - - - -1 LSb
77
MSb In bit 6 - - - -1 LSb In
80
83
Note: Refer to Figure 27-3 for load conditions.
2010 Microchip Technology Inc. Preliminary DS41412A-page 455
PIC18(L)F2X/4XK22
FIGURE 27-14: I
2
C BUS START/STOP BITS TIMING
TABLE 27-16: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)
Param
No.
Symbol Characteristic Min Max Units Conditions
70 TssL2scH,
TssL2scL
SS + to SCK + or SCK | Input TCY ns
71 TscH SCK Input High Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
71A Single Byte 40 ns (Note 1)
72 TscL SCK Input Low Time
(Slave mode)
Continuous 1.25 TCY + 30 ns
72A Single Byte 40 ns (Note 1)
73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 ns (Note 2)
74 TscH2diL,
TscL2diL
Hold Time of SDI Data Input to SCK Edge 100 ns
75 TdoR SDO Data Output Rise Time 25 ns
76 TdoF SDO Data Output Fall Time 25 ns
77 TssH2doZ SS| to SDO Output High-Impedance 10 50 ns
78 TscR SCK Output Rise Time
(Master mode)
25 ns
79 TscF SCK Output Fall Time (Master mode) 25 ns
80 TscH2doV,
TscL2doV
SDO Data Output Valid after SCK Edge 50 ns
82 TssL2doV SDO Data Output Valid after SS + Edge 50 ns
83 TscH2ssH,
TscL2ssH
SS | after SCK Edge 1.5 TCY + 40 ns
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
Note: Refer to Figure 27-3 for load conditions.
91
92
93
SCL
SDA
Start
Condition
Stop
Condition
90
PIC18(L)F2X/4XK22
DS41412A-page 456 Preliminary 2010 Microchip Technology Inc.
FIGURE 27-15: I
2
C BUS DATA TIMING
TABLE 27-17: I
2
C BUS START/STOP BITS REQUIREMENTS (SLAVE MODE)
Param.
No.
Symbol Characteristic Min Max Units Conditions
90 TSU:STA Start Condition 100 kHz mode 4700 ns Only relevant for Repeated
Start condition
Setup Time 400 kHz mode 600
91 THD:STA Start Condition 100 kHz mode 4000 ns After this period, the first
clock pulse is generated
Hold Time 400 kHz mode 600
92 TSU:STO Stop Condition 100 kHz mode 4700 ns
Setup Time 400 kHz mode 600
93 THD:STO Stop Condition 100 kHz mode 4000 ns
Hold Time 400 kHz mode 600
Note: Refer to Figure 27-3 for load conditions.
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
2010 Microchip Technology Inc. Preliminary DS41412A-page 457
PIC18(L)F2X/4XK22
TABLE 27-18: I
2
C BUS DATA REQUIREMENTS (SLAVE MODE)
Param.
No.
Symbo
l
Characteristic Min Max Units Conditions
100 THIGH Clock High Time 100 kHz mode 4.0 s Must operate at a minimum
of 1.5 MHz
400 kHz mode 0.6 s Must operate at a minimum
of 10 MHz
SSP Module 1.5 TCY
101 TLOW Clock Low Time 100 kHz mode 4.7 s Must operate at a minimum
of 1.5 MHz
400 kHz mode 1.3 s Must operate at a minimum
of 10 MHz
SSP Module 1.5 TCY
102 TR SDA and SCL Rise
Time
100 kHz mode 1000 ns
400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from
10 to 400 pF
103 TF SDA and SCL Fall
Time
100 kHz mode 300 ns
400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from
10 to 400 pF
90 TSU:ST
A
Start Condition
Setup Time
100 kHz mode 4.7 s Only relevant for Repeated
Start condition
400 kHz mode 0.6 s
91 THD:ST
A
Start Condition
Hold Time
100 kHz mode 4.0 s After this period, the first
clock pulse is generated
400 kHz mode 0.6 s
106 THD:DA
T
Data Input Hold
Time
100 kHz mode 0 ns
400 kHz mode 0 0.9 s
107 TSU:DA
T
Data Input Setup
Time
100 kHz mode 250 ns (Note 2)
400 kHz mode 100 ns
92 TSU:ST
O
Stop Condition
Setup Time
100 kHz mode 4.7 s
400 kHz mode 0.6 s
109 TAA Output Valid from
Clock
100 kHz mode 3500 ns (Note 1)
400 kHz mode ns
110 TBUF Bus Free Time 100 kHz mode 4.7 s Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 s
D102 CB Bus Capacitive Loading 400 pF
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
2: A fast mode I
2
C bus device can be used in a standard mode I
2
C bus system but the requirement,
TSU:DAT > 250 ns, must then be met. This will automatically be the case if the device does not stretch the
LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must
output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the
standard mode I
2
C bus specification), before the SCL line is released.
PIC18(L)F2X/4XK22
DS41412A-page 458 Preliminary 2010 Microchip Technology Inc.
FIGURE 27-16: MASTER SSP I
2
C BUS START/STOP BITS TIMING WAVEFORMS
FIGURE 27-17: MASTER SSP I
2
C BUS DATA TIMING
Note: Refer to Figure 27-3 for load conditions.
91
93
SCL
SDA
Start
Condition
Stop
Condition
90 92
TABLE 27-19: MASTER SSP I
2
C BUS START/STOP BITS REQUIREMENTS
Param
.
No.
Symbol Characteristic Min Max
Unit
s
Conditions
90 TSU:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1) ns Only relevant for
Repeated Start
condition
Setup Time 400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode
(1)
2(TOSC)(BRG + 1)
91 THD:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1) ns After this period, the
first clock pulse is
generated
Hold Time 400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode
(1)
2(TOSC)(BRG + 1)
92 TSU:STO Stop Condition 100 kHz mode 2(TOSC)(BRG + 1) ns
Setup Time 400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode
(1)
2(TOSC)(BRG + 1)
93 THD:STO Stop Condition 100 kHz mode 2(TOSC)(BRG + 1) ns
Hold Time 400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode
(1)
2(TOSC)(BRG + 1)
Note 1: Maximum pin capacitance = 10 pF for all I
2
C pins.
Note: Refer to Figure 27-3 for load conditions.
90
91 92
100
101
103
106
107
109 109 110
102
SCL
SDA
In
SDA
Out
2010 Microchip Technology Inc. Preliminary DS41412A-page 459
PIC18(L)F2X/4XK22
TABLE 27-20: MASTER SSP I
2
C BUS DATA REQUIREMENTS
Param.
No.
Symbol Characteristic Min Max Units Conditions
100 THIGH Clock High Time 100 kHz mode 2(TOSC)(BRG + 1) ms
400 kHz mode 2(TOSC)(BRG + 1) ms
1 MHz mode
(1)
2(TOSC)(BRG + 1) ms
101 TLOW Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1) ms
400 kHz mode 2(TOSC)(BRG + 1) ms
1 MHz mode
(1)
2(TOSC)(BRG + 1) ms
102 TR SDA and SCL
Rise Time
100 kHz mode 1000 ns CB is specified to be
from
10 to 400 pF
400 kHz mode 20 + 0.1 CB 300 ns
1 MHz mode
(1)
300 ns
103 TF SDA and SCL
Fall Time
100 kHz mode 300 ns CB is specified to be
from
10 to 400 pF
400 kHz mode 20 + 0.1 CB 300 ns
1 MHz mode
(1)
100 ns
90 TSU:STA Start Condition
Setup Time
100 kHz mode 2(TOSC)(BRG + 1) ms Only relevant for
Repeated Start
condition
400 kHz mode 2(TOSC)(BRG + 1) ms
1 MHz mode
(1)
2(TOSC)(BRG + 1) ms
91 THD:STA Start Condition
Hold Time
100 kHz mode 2(TOSC)(BRG + 1) ms After this period, the first
clock pulse is generated
400 kHz mode 2(TOSC)(BRG + 1) ms
1 MHz mode
(1)
2(TOSC)(BRG + 1) ms
106 THD:DAT Data Input
Hold Time
100 kHz mode 0 ns
400 kHz mode 0 0.9 ms
107 TSU:DAT Data Input
Setup Time
100 kHz mode 250 ns (Note 2)
400 kHz mode 100 ns
92 TSU:STO Stop Condition
Setup Time
100 kHz mode 2(TOSC)(BRG + 1) ms
400 kHz mode 2(TOSC)(BRG + 1) ms
1 MHz mode
(1)
2(TOSC)(BRG + 1) ms
109 TAA Output Valid
from Clock
100 kHz mode 3500 ns
400 kHz mode 1000 ns
1 MHz mode
(1)
ns
110 TBUF Bus Free Time 100 kHz mode 4.7 ms Time the bus must be
free before a new trans-
mission can start
400 kHz mode 1.3 ms
D102 CB Bus Capacitive Loading 400 pF
Note 1: Maximum pin capacitance = 10 pF for all I
2
C pins.
2: A fast mode I
2
C bus device can be used in a standard mode I
2
C bus system, but parameter 107 > 250 ns
must then be met. This will automatically be the case if the device does not stretch the LOW period of the
SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit
to the SDA line, parameter 102 + parameter 107 = 1000 + 250 = 1250 ns (for 100 kHz mode), before the
SCL line is released.
PIC18(L)F2X/4XK22
DS41412A-page 460 Preliminary 2010 Microchip Technology Inc.
FIGURE 27-18: EUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
FIGURE 27-19: EUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
121
121
120
122
TXx/CKx
RXx/DTx
pin
pin
Note: Refer to Figure 27-3 for load conditions.
TABLE 27-21: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS
Param
No.
Symbol Characteristic Min Max Units Conditions
120 TckH2dtV SYNC XMIT (MASTER & SLAVE)
Clock High to Data Out Valid 40 ns
121 Tckrf Clock Out Rise Time and Fall Time
(Master mode)
20 ns
122 Tdtrf Data Out Rise Time and Fall Time 20 ns
125
126
TXx/CKx
RXx/DTx
pin
pin
Note: Refer to Figure 27-3 for load conditions.
TABLE 27-22: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS
Param.
No.
Symbol Characteristic Min Max Units Conditions
125 TdtV2ckl SYNC RCV (MASTER & SLAVE)
Data Setup before CK + (DT setup time) 10 ns
126 TckL2dtl Data Hold after CK + (DT hold time) 15 ns
2010 Microchip Technology Inc. Preliminary DS41412A-page 461
PIC18(L)F2X/4XK22
FIGURE 27-20: A/D CONVERSION TIMING
TABLE 27-23: A/D CONVERTER CHARACTERISTICS:PIC18(L)F2X/4XK22
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
A01 NR Resolution 10 bits -40C to +85C,
AVREF > 2.0V
A03 EIL Integral Linearity Error 0.5 LSb -40C to +85C,
AVREF > 2.0V
A04 EDL Differential Linearity Error 0.4 LSb -40C to +85C,
AVREF > 2.0V
A06 EOFF Offset Error 0.4 LSb -40C to +85C,
AVREF > 2.0V
A07 EGN Gain Error 0.3 LSb -40C to +85C,
AVREF > 2.0V
A08 ETOTL Total Error 1 LSb -40C to +85C,
AVREF > 2.0V
A20 AVREF Reference Voltage Range
(VREFH VREFL)
1.8
2.0
V
V
ABsolute Minimum
Minimum for 1LSb
Accuracy
A21 VREFH Reference Voltage High VDD/2 VDD + 0.3 V
A22 VREFL Reference Voltage Low VSS 0.3V VDD/2 V
A25 VAIN Analog Input Voltage VREFL VREFH V
A30 ZAIN Recommended Impedance of
Analog Voltage Source
3 kO -40C to +85C
Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
2: VREFH current is from RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source.
VREFL current is from RA2/AN2/VREF-/CVREF pin or VSS, whichever is selected as the VREFL source.
131
130
132
BSF ADCON0, GO
Q4
A/D CLK
A/D DATA
ADRES
ADIF
GO
SAMPLE
OLD_DATA
SAMPLING STOPPED
DONE
NEW_DATA
(Note 2)
9 8 7 2 1 0
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts.
This allows the SLEEP instruction to be executed.
2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.
.. . . . .
TCY
PIC18(L)F2X/4XK22
DS41412A-page 462 Preliminary 2010 Microchip Technology Inc.
TABLE 27-24: A/D CONVERSION REQUIREMENTS
Param
No.
Symbol Characteristic Min Max Units Conditions
130 TAD A/D Clock Period 0.7 25.0
(1)
s TOSC based,
-40C to +85C
0.7 4.0
(1)
s TOSC based,
+85C to +125C
1.0 4.0 s FRC mode, VDD>2.0V
131 TCNV Conversion Time
(not including acquisition time) (Note 2)
12 12 TAD
132 TACQ Acquisition Time (Note 3) 1.4 s VDD = 3V, Rs = 50O
135 TSWC Switching Time from Convert Sample (Note 4)
136 TDIS Discharge Time 2 2 TAD
Legend: TBD = To Be Determined
Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider.
2: ADRES register may be read on the following TCY cycle.
3: The time for the holding capacitor to acquire the New input voltage when the voltage changes full scale
after the conversion (VDD to VSS or VSS to VDD). The source impedance (RS) on the input channels is 50 O.
4: On the following cycle of the device clock.
2010 Microchip Technology Inc. Preliminary DS41412A-page 463
PIC18(L)F2X/4XK22
28.0 DC AND AC
CHARACTERISTICS GRAPHS
AND TABLES
Graphs and tables are not available at this time.
PIC18(L)F2X/4XK22
DS41412A-page 464 Preliminary 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. Preliminary DS41412A-page 465
PIC18(L)F2X/4XK22
29.0 PACKAGING INFORMATION
29.1 Package Marking Information
28-Lead SOIC (7.50 mm)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC18F25K22-E/SO
0810017
28-Lead PDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC18F25K22-E/SP
0810017
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week 01)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3 e
3 e
3 e
3 e
28-Lead SSOP
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
YYWWNNN
Example
PIC18F25K22-E/SS
0810017
3 e
PIC18(L)F2X/4XK22
DS41412A-page 466 Preliminary 2010 Microchip Technology Inc.
Package Marking Information (Continued)
44-Lead TQFP
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
PIC18F44K22
-E/PT
0810017
XXXXXXXXXX
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
PIC18F45K22
Example
-E/ML
0810017
28-Lead QFN
XXXXXXXX
XXXXXXXX
YYWWNNN
Example
18F24K22
-E/ML
0810017
3 e
3 e
3 e
40-Lead PDIP
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC18F45K22-E/P
0810017
3 e
XXXXX
28-Lead UQFN
XXXXXX
XXXXXX
YWWNNN
PIC18
F23K22
Example
-E/MV
810017
3 e
2010 Microchip Technology Inc. Preliminary DS41412A-page 467
PIC18(L)F2X/4XK22
29.2 Package Details
The following sections give the technical details of the packages.
28-Lead Skinny PIastic DuaI In-Line (SP) - 300 miI Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units NCHES
Dimension Limits MN NOM MAX
Number of Pins N 28
Pitch e .100 BSC
Top to Seating Plane A .200
Molded Package Thickness A2 .120 .135 .150
Base to Seating Plane A1 .015
Shoulder to Shoulder Width E .290 .310 .335
Molded Package Width E1 .240 .285 .295
Overall Length D 1.345 1.365 1.400
Tip to Seating Plane L .110 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .050 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing eB .430
NOTE 1
N
1 2
D
E1
eB
c
E
L
A2
e b
b1
A1
A
3
Microchip Technology Drawing C04-070B
PIC18(L)F2X/4XK22
DS41412A-page 468 Preliminary 2010 Microchip Technology Inc.
28-Lead PIastic SmaII OutIine (SO) - Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MLLMETERS
Dimension Limits MN NOM MAX
Number of Pins N 28
Pitch e 1.27 BSC
Overall Height A 2.65
Molded Package Thickness A2 2.05
Standoff A1 0.10 0.30
Overall Width E 10.30 BSC
Molded Package Width E1 7.50 BSC
Overall Length D 17.90 BSC
Chamfer (optional) h 0.25 0.75
Foot Length L 0.40 1.27
Footprint L1 1.40 REF
Foot Angle Top I 0 8
Lead Thickness c 0.18 0.33
Lead Width b 0.31 0.51
Mold Draft Angle Top D 5 15
Mold Draft Angle Bottom E 5 15
c
h
h
L
L1
A2
A1
A
NOTE 1
1 2 3
b
e
E
E1
D
N
Microchip Technology Drawing C04-052B
2010 Microchip Technology Inc. Preliminary DS41412A-page 469
PIC18(L)F2X/4XK22
28-Lead PIastic Shrink SmaII OutIine (SS) - 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MLLMETERS
Dimension Limits MN NOM MAX
Number of Pins N 28
Pitch e 0.65 BSC
Overall Height A 2.00
Molded Package Thickness A2 1.65 1.75 1.85
Standoff A1 0.05
Overall Width E 7.40 7.80 8.20
Molded Package Width E1 5.00 5.30 5.60
Overall Length D 9.90 10.20 10.50
Foot Length L 0.55 0.75 0.95
Footprint L1 1.25 REF
Lead Thickness c 0.09 0.25
Foot Angle I 0 4 8
Lead Width b 0.22 0.38
L L1
c
A2
A1
A
E
E1
D
N
1 2
NOTE 1
b
e