LM193, LM293, LM293A

LM393, LM393A, LM2903, LM2903V

DUAL DIFFERENTIAL COMPARATORS
SLCS005W JUNE 1976 REVISED JULY 2010
1 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Single Supply or Dual Supplies
D Wide Range of Supply Voltage
Max Rating . . . 2 V to 36 V
Tested to 30 V . . . Non-V Devices
Tested to 32 V . . . V-Suffix Devices
D Low Supply-Current Drain Independent of
Supply Voltage . . . 0.4 mA Typ Per
Comparator
D Low Input Bias Current . . . 25 nA Typ
D Low Input Offset Current . . . 3 nA Typ
(LM193)
D Low Input Offset Voltage . . . 2 mV Typ
D Common-Mode Input Voltage Range
Includes Ground
D Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . 36 V
D Low Output Saturation Voltage
D Output Compatible With TTL, MOS, and
CMOS
description/ordering information
These devices consist of two independent voltage
comparators that are designed to operate from a
single power supply over a wide range of voltages.
Operation from dual supplies also is possible as
long as the difference between the two supplies is
2 V to 36 V, and V
CC
is at least 1.5 V more positive than the input common-mode voltage. Current drain is
independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve
wired-AND relationships.
The LM193 is characterized for operation from 55C to 125C. The LM293 and LM293A are characterized for
operation from 25C to 85C. The LM393 and LM393A are characterized for operation from 0C to 70C. The
LM2903 is characterized for operation from 40C to 125C.
Copyright 2010, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
1OUT
1IN
1IN+
GND
V
CC
2OUT
2IN
2IN+
LM193 . . . D OR JG PACKAGE
LM293 . . . D, DGK, OR P PACKAGE
LM293A . . . D OR DGK PACKAGE
LM393, LM393A . . . D, DGK, P, PS, OR PW PACKAGE
LM2903 . . . D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN
NC
NC
1IN
NC
1IN+
NC
LM193 . . . FK PACKAGE
(TOP VIEW)
N
C
1
O
U
T
N
C
2
I
N
+
N
C
VN
C
N
C
G
N
D
N
C
C
C
NC No internal connection
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W JUNE 1976 REVISED JULY 2010
2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
ORDERING INFORMATION
{
T
A
V
IOmax
AT 25C
MAX V
CC
PACKAGE}
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (P) Tube of 50 LM393P LM393P
Tube of 75 LM393D
SOIC (D) Reel of 2500 LM393DR LM393 SOIC (D)
Reel of 2500 LM393DRG3
LM393
5 mV 30 V SOP (PS) Reel of 2000 LM393PSR L393 5 mV 30 V
Tube of 150 LM393PW
TSSOP (PW) Reel of 2000 LM393PWR L393
0C to 70C
TSSOP (PW)
Reel of 2000 LM393PWRG3
L393
0 C to 70 C
MSOP/VSSOP (DGK) Reel of 2500 LM393DGKR M9_

PDIP (P) Tube of 50 LM393AP LM393AP

SOIC (D)
Tube of 75 LM393AD
LM393A
2 mV 30 V
SOIC (D)
Reel of 2500 LM393ADR
LM393A
2 mV 30 V
SOP (PS) Reel of 2000 LM393APSR L393A
TSSOP (PW) Reel of 2000 LM393APWR L393A
MSOP/VSSOP (DGK) Reel of 2500 LM393ADGKR M8_

PDIP (P) Tube of 50 LM293P LM293P

Tube of 75 LM293D
5 mV 30 V SOIC (D) Reel of 2500 LM293DR LM293
25C to 85C
5 mV 30 V SOIC (D)
Reel of 2500 LM293DRG3
LM293
25C to 85C
MSOP/VSSOP (DGK) Reel of 2500 LM293DGKR MC_

SOIC (D)
Tube of 75 LM293AD
LM293A
2 mV 30 V
SOIC (D)
Reel of 2500 LM293ADR
LM293A
2 mV 30 V
MSOP/VSSOP (DGK) Reel of 2500 LM293ADGKR MD_

PDIP (P) Tube of 50 LM2903P LM2903P

Tube of 75 LM2903D
SOIC (D) Reel of 2500 LM2903DR LM2903
7 V 30 V
SOIC (D)
Reel of 2500 LM2903DRG3
LM2903
7 mV 30 V
SOP (PS) Reel of 2000 LM2903PSR L2903
40C to 125C TSSOP (PW)
Reel of 2000 LM2903PWR
L2903 40C to 125C TSSOP (PW)
Reel of 2000 LM2903PWRG3
L2903
MSOP/VSSOP (DGK) Reel of 2500 LM2903DGKR MA_

7 mV 32 V
SOIC (D) Reel of 2500 LM2903VQDR L2903V
7 mV 32 V
TSSOP (PW) Reel of 2000 LM2903VQPWR L2903V
2 mV 32 V
SOIC (D) Reel of 2500 LM2903AVQDR L2903AV
2 mV 32 V
TSSOP (PW) Reel of 2000 LM2903AVQPWR L2903AV
CDIP (JG) Tube of 50 LM193JG LM193JG
55C to 125C 5 mV 30 V LCCC (FK) Tube of 55 LM193FK LM193FK
SOIC (D) Reel of 2500 LM193DR LM193

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web
site at www.ti.com.

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

The actual top-side marking has one additional character that designates the wafer fab/assembly site.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W JUNE 1976 REVISED JULY 2010
3 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
symbol (each comparator)
IN+
IN
OUT
schematic (each comparator)
80-A
Current Regulator
80 A 60 A 10 A
V
CC
10 A
OUT
GND
IN+
IN
Epi-FET
Diodes
Resistors
Transistors
Current values shown are nominal.
COMPONENT COUNT
1
2
2
30
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage, V
CC
(see Note 1) 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, V
ID
(see Note 2) 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
(either input) 0.3 V to 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, V
O
36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, I
O
20 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short-circuit to ground (see Note 3) Unlimited . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
JA
(see Notes 4 and 5): D package 97C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGK package 172C/W . . . . . . . . . . . . . . . . . . . . . . . .
P package 85C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package 95C/W . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 149C/W . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
JC
(see Notes 6 and 7): FK package 5.61C/W . . . . . . . . . . . . . . . . . . . . . . . . .
JG package 14.5C/W . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, T
J
150C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds: FK package 260C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package 300C . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
65C to 150C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to GND.
2. Differential voltages are at IN+, with respect to IN.
3. Short circuits from outputs to V
CC
can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of T
J
(max),
JA
, and T
A
. The maximum allowable power dissipation at any allowable
ambient temperature is P
D
= (T
J
(max) T
A
)/
JA
. Operating at the absolute maximum T
J
of 150C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. Maximum power dissipation is a function of T
J
(max),
JC
, and T
C
. The maximum allowable power dissipation at any allowable case
temperature is P
D
= (T
J
(max) T
C
)/
JC
. Operating at the absolute maximum T
J
of 150C can affect reliability.
7. The package thermal impedance is calculated in accordance with MIL-STD-883.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W JUNE 1976 REVISED JULY 2010
4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, V
CC
= 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T
A

LM193
LM293
LM393
UNIT PARAMETER TEST CONDITIONS T
A

MIN TYP MAX MIN TYP MAX

UNIT
V Input offset voltage
V
CC
= 5 V to 30 V,
V 1 4 V
25C 2 5 2 5
mV V
IO
Input offset voltage V
O
= 1.4 V,
V
IC
= V
IC(min)
Full range 9 9
mV
I Input offset current V 1 4 V
25C 3 25 5 50
nA I
IO
Input offset current V
O
= 1.4 V
Full range 100 250
nA
I Input bias current V 1 4 V
25C 25 100 25 250
nA I
IB
Input bias current V
O
= 1.4 V
Full range 300 400
nA
V
Common-mode
25C
0 to
V
CC
1.5
0 to
V
CC
1.5
V V
ICR
Common mode
input voltage range

Full range
0 to
V
CC
2
0 to
V
CC
2
V
A
VD
Large-signal
differential-voltage
amplification
V
CC
= 15 V,
V
O
= 1.4 V to 11.4 V,
R
L
15 k to V
CC
25C 50 200 50 200 V/mV
I
High-level
V
OH
= 5 V, V
ID
= 1 V 25C 0.1 0.1 50 nA
I
OH
High level
output current
V
OH
= 30 V, V
ID
= 1 V Full range 1 1 A
V
Low-level
I 4 mA V 1 V
25C 150 400 150 400
mV V
OL
Low level
output voltage
I
OL
= 4 mA, V
ID
= 1 V
Full range 700 700
mV
I
OL
Low-level
output current
V
OL
= 1.5 V, V
ID
= 1 V 25C 6 6 mA
I Supply current R =
V
CC
= 5 V 25C 0.8 1 0.8 1
mA I
CC
Supply current R
L
=
V
CC
= 30 V Full range 2.5 2.5
mA

Full range (MIN or MAX) for LM193 is 55C to 125C, for LM293 is 25C to 85C, and for LM393 is 0C to 70C. All characteristics are measured
with zero common-mode input voltage, unless otherwise specified.

The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is V
CC
+ 1.5 V for the inverting input (), and the non-inverting input (+) can exceed the V
CC
level; the comparator provides a proper output
state. Either or both inputs can go to 30 V without damage.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W JUNE 1976 REVISED JULY 2010
5 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, V
CC
= 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T
A

LM293A
LM393A
UNIT PARAMETER TEST CONDITIONS T
A

MIN TYP MAX

UNIT
V Input offset voltage
V
CC
= 5 V to 30 V, V
O
= 1.4 V,
25C 1 2
mV V
IO
Input offset voltage
V
CC
= 5 V to 30 V, V
O
= 1.4 V,
V
IC
= V
IC(min) Full range 4
mV
I Input offset current V 1 4 V
25C 5 50
nA I
IO
Input offset current V
O
= 1.4 V
Full range 150
nA
I Input bias current V 1 4 V
25C 25 250
nA I
IB
Input bias current V
O
= 1.4 V
Full range 400
nA
V
Common-mode input voltage
25C
0 to
V
CC
1.5
V V
ICR
Common mode input voltage
range

Full range
0 to
V
CC
2
V
A
VD
Large-signal differential-voltage
amplification
V
CC
= 15 V, V
O
= 1.4 V to 11.4 V,
R
L
15 k to V
CC
25C 50 200 V/mV
I High level output current
V
OH
= 5 V, V
ID
= 1 V 25C 0.1 50 nA
I
OH
High-level output current
V
OH
= 30 V, V
ID
= 1 V Full range 1 A
V Low level output voltage I 4 mA V 1 V
25C 150 400
mV V
OL
Low-level output voltage I
OL
= 4 mA, V
ID
= 1 V
Full range 700
mV
I
OL
Low-level output current V
OL
= 1.5 V, V
ID
= 1 V 25C 6 mA
I Supply current R =
V
CC
= 5 V 25C 0.8 1
mA I
CC
Supply current R
L
=
V
CC
= 30 V Full range 2.5
mA

Full range (MIN or MAX) for LM293A is 25C to 85C, and for LM393A is 0C to 70C. All characteristics are measured with zero common-mode
input voltage, unless otherwise specified.

The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is V
CC+
1.5 V, but either or both inputs can go to 30 V without damage.
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W JUNE 1976 REVISED JULY 2010
6 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, V
CC
= 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T

LM2903 LM2903A
UNIT PARAMETER TEST CONDITIONS T
A

MIN TYP MAX MIN TYP MAX

UNIT
V Input offset voltage
V
CC
= 5 V to MAX

,
V 1 4 V
25C 2 7 1 2
mV V
IO
Input offset voltage V
O
= 1.4 V,
V
IC
= V
IC(min)
Full range 15 4
mV
I Input offset current V 1 4 V
25C 5 50 5 50
nA I
IO
Input offset current V
O
= 1.4 V
Full range 200 200
nA
I Input bias current V 1 4 V
25C 25 250 25 250
nA I
IB
Input bias current V
O
= 1.4 V
Full range 500 500
nA
V
Common-mode
25C
0 to
V
CC
1.5
0 to
V
CC
1.5
V V
ICR
Common mode
input voltage range

Full range
0 to
V
CC
2
0 to
V
CC
2
V
A
VD
Large-signal
differential-voltage
amplification
V
CC
= 15 V,
V
O
= 1.4 V to 11.4 V,
R
L
15 k to V
CC
25C 25 100 25 100 V/mV
I
High-level
V
OH
= 5 V, V
ID
= 1 V 25C 0.1 50 0.1 50 nA
I
OH
High level
output current
V
OH
= V
CC
MAX, V
ID
= 1 V Full range 1 1 A
V
Low-level
I 4 mA V 1 V
25C 150 400 150 400
mV V
OL
Low level
output voltage
I
OL
= 4 mA, V
ID
= 1 V
Full range 700 700
mV
I
OL
Low-level
output current
V
OL
= 1.5 V, V
ID
= 1 V 25C 6 6 mA
I Supply current R =
V
CC
= 5 V 25C 0.8 1 0.8 1
mA I
CC
Supply current R
L
=
V
CC
= MAX Full range 2.5 2.5
mA

Full range (MIN or MAX) for LM2903 is 40C to 125C. All characteristics are measured with zero common-mode input voltage, unless otherwise
specified.

V
CC
MAX = 30 V for non-V devices and 32 V for V-suffix devices.

The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is V
CC+
1.5 V, but either or both inputs can go to 30 V (32 V for V-suffix devices) without damage.
switching characteristics, V
CC
= 5 V, T
A
= 25C
PARAMETER TEST CONDITIONS
LM193
LM293, LM293A
LM393, LM393A
LM2903
UNIT
TYP
Response time
R
L
connected to 5 V through 5.1 k,
100-mV input step with 5-mV overdrive 1.3
s Response time
R
L
connected to 5 V through 5.1 k,
C
L
= 15 pF

, See Note 8
TTL-level input step 0.3
s

C
L
includes probe and jig capacitance.
NOTE 8: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
5962-9452601Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 5962-
9452601Q2A
LM193FKB
5962-9452601QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI -55 to 125 9452601QPA
LM193
JM38510/11202BPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510
/11202BPA
LM193DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM193
LM193DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -55 to 125 LM193
LM193FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9452601Q2A
LM193FKB
LM193JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM193JG
LM193JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9452601QPA
LM193
LM2903AVQDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV
LM2903AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV
LM2903AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV
LM2903AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903AV
LM2903D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MAP ~ MAS ~ MAU)
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
LM2903DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MAP ~ MAS ~ MAU)
LM2903DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU
CU SN
Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LM2903
LM2903DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2903
LM2903P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 LM2903P
LM2903PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 LM2903P
LM2903PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125
LM2903PWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 L2903
LM2903PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903
LM2903QD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q
LM2903QDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q
LM2903QDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q
LM2903QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q
LM2903QP OBSOLETE PDIP P 8 TBD Call TI Call TI -40 to 125
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
LM2903VQDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V
LM2903VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V
LM2903VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V
LM2903VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2903V
LM293AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MDP ~ MDS ~ MDU)
LM293ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MDP ~ MDS ~ MDU)
LM293ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293A
LM293D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MCP ~ MCS ~ MCU)
LM293DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 (MCP ~ MCS ~ MCU)
LM293DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
LM293DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -25 to 85 LM293
LM293DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM293
LM293P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -25 to 85 LM293P
LM293PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -25 to 85 LM293P
LM393AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M8P ~ M8S ~ M8U)
LM393ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M8P ~ M8S ~ M8U)
LM393ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393A
LM393AP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 LM393AP
LM393APE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 LM393AP
LM393APSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393APSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393APSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 5
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
LM393APWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70
LM393APWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393APWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393APWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393A
LM393D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M9P ~ M9S ~ M9U)
LM393DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M9P ~ M9S ~ M9U)
LM393DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM 0 to 70 LM393
LM393DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM393
LM393P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 LM393P
LM393PE3 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU SN N / A for Pkg Type 0 to 70 LM393P
LM393PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 LM393P
LM393PSLE OBSOLETE SO PS 8 TBD Call TI Call TI 0 to 70
LM393PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 6
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
LM393PW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70
LM393PWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
LM393PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM 0 to 70 L393
LM393PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 L393
M38510/11202BPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510
/11202BPA

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 7
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.


OTHER QUALIFIED VERSIONS OF LM2903, LM293 :

Automotive: LM2903-Q1

Enhanced Product: LM293-EP

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Enhanced Product - Supports Defense, Aerospace and Medical Applications

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM193DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903QDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM293ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2013
Pack Materials-Page 1
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393APSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM393APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM393PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2013
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM193DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2903DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DR SOIC D 8 2500 340.5 338.1 20.6
LM2903DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2903DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903PSR SO PS 8 2000 367.0 367.0 38.0
LM2903PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM2903PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2903QDR SOIC D 8 2500 367.0 367.0 35.0
LM2903QDRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM293ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293ADR SOIC D 8 2500 340.5 338.1 20.6
LM293ADR SOIC D 8 2500 367.0 367.0 35.0
LM293ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM293ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM293DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293DR SOIC D 8 2500 340.5 338.1 20.6
LM293DR SOIC D 8 2500 367.0 367.0 35.0
LM293DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM293DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM393ADR SOIC D 8 2500 340.5 338.1 20.6
LM393ADR SOIC D 8 2500 367.0 367.0 35.0
LM393ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM393APSR SO PS 8 2000 367.0 367.0 38.0
LM393APWR TSSOP PW 8 2000 364.0 364.0 27.0
LM393DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM393DR SOIC D 8 2500 340.5 338.1 20.6
LM393DR SOIC D 8 2500 367.0 367.0 35.0
LM393DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM393PSR SO PS 8 2000 367.0 367.0 38.0
LM393PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM393PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2013
Pack Materials-Page 3
MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
015
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM193DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2903QDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2903VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM293ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Oct-2013
Pack Materials-Page 1
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM293DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM293DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393APSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM393APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM393PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM393PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM393PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Oct-2013
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM193DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2903DR SOIC D 8 2500 340.5 338.1 20.6
LM2903DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM2903DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2903DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903PSR SO PS 8 2000 367.0 367.0 38.0
LM2903PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM2903PWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2903PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2903QDRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM293ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293ADR SOIC D 8 2500 367.0 367.0 35.0
LM293ADR SOIC D 8 2500 340.5 338.1 20.6
LM293ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM293ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM293DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Oct-2013
Pack Materials-Page 3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM293DR SOIC D 8 2500 367.0 367.0 35.0
LM293DR SOIC D 8 2500 364.0 364.0 27.0
LM293DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM293DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM293DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM393ADR SOIC D 8 2500 367.0 367.0 35.0
LM393ADR SOIC D 8 2500 340.5 338.1 20.6
LM393ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM393ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393APSR SO PS 8 2000 367.0 367.0 38.0
LM393APWR TSSOP PW 8 2000 364.0 364.0 27.0
LM393DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM393DR SOIC D 8 2500 340.5 338.1 20.6
LM393DR SOIC D 8 2500 367.0 367.0 35.0
LM393DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM393DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM393DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM393PSR SO PS 8 2000 367.0 367.0 38.0
LM393PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM393PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Oct-2013
Pack Materials-Page 4
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