Thermal Analysis 19 Feb 2023
Thermal Analysis 19 Feb 2023
Thermal Analysis 19 Feb 2023
ANALYSIS
Presented By:
Saadia Ashraf Qureshi 04
Sidra Shaukat 11
Samia Yousaf 22
Sanam Bahadur 40
Zunaira Tufail 18
Definition
Thermal Analysis is a branch of materials science by which the
physical, chemical , and mechanical properties of materials are
studied as a function of temperature. This measurement provides
information about physical phenomena, such as phase transitions,
absorption, adsorption and desorption; as well as chemical
phenomena including thermal decomposition, and solid-gas
reaction
Methods of Thermal Analysis
Thermo Gravimetric
Analysis (TGA)
Dynamic Mechanical
Thermal Analysis
(DMTA)
Thermo Gravimetric Analysis (TGA)
Principle
Upon heating a certain material, its weight increases or decreases due to certain
reactions like decomposition, oxidation and dehydration.
It measures the change in mass or weight in function with the temperature or
time with constant heating rate or constant time.
TGA is based on that the sample is continuously weighted as temperature is
elevated using an instrument called “thermo balance”.
Data is recorded in the form of curve called “thermo gram”.
Instruments which can quantify loss of water, loss of solvent, loss of plasticizer
are used and comparing weight loss of material is being followed
Thermo Gravimetric Analysis (TGA)
Types
Dynamic (scanning mode) TGA
This type of analysis the sample is subjected to conditions of continuous
increase in temperature usually linear with time.
Sample characteristics:
Weight of sample
Sample particle size
Thermo Gravimetric Analysis (TGA)
Applications
Useful Information
Decomposition temperatures
Quantitative weight losses
Compositional analysis
Long term stabilities
Flammability properties
Rates of degradation
Life time of a product
Effect of reactive or corrosive atmospheres
Oxidative stability of material
Dynamic Mechanical Analysis (DMA)
Principle
A sinusoidal strain (oscillating force) is applied to the material at a given
frequency, while the temperature is ramped up or down over a range and
deformation is recorded.
−50°C and 220°C for polymers
25°C and 600°C for glasses and ceramics
50°C and 600°C for metals
Sinusoidal motion is the repeated motion in which the dynamic clamp
repeated the same movement over and over with maximum and minimum
values of forces
Dynamic Mechanical Analysis (DMA)
Instrument DM Analyzer
Dynamic Mechanical Analysis (DMA)
Useful Information
Through DMA, some useful properties
of materials can be measured, such as
Viscoelasticity
Dynamic Elastic Modulus (E’)
Glass Transition Temperature (Tg)
Damping Behavior
Creep Recovery Behavior .
Dynamic Mechanical Analysis (DMA)
Dynamic Mechanical Analysis (DMA)
Principle
TSC studies are usually conducted to provide additional information about
molecular mobility in the solid state, and as a result characterize phase
transitions that are related to thermal transitions in the crystalline
(polymorphic) and amorphous phases
Instrument Spectrometer
A different model, Holmarc’s TSC spectrometer is
used to study energy levels in semiconductors or
insulators, especially solar cells. The sample energy
levels are first filled by exposing it to a halogen lamp
light source for a user specified time. The
temperature of the sample at this time can be set as
low as 70°C. The sample can then be heated
gradually up to 150°C at a specified ramping rate,
which causes emission of electrons and holes in the
sample.
Thermally Stimulated Current (TSC)
Example
Caffeine exists in two enantiotropic polymorphic forms (form I and form II)
implying that there is a clear transition point (temperature) at which one
polymorph converts into the other. The TSC data indicate clear differences
between the two forms.
Thermally Stimulated Current (TSC)
Application
TSC is a new tool that also can be used to analyze pharmaceutically important molecules.
TSC studies are usually conducted to provide additional information about molecular mobility
in the solid state.
Main use of TSC is to study relaxation processes such as glass transition.
TSC has been used to distinguish between two different polymorphic forms and amorphous
phase.
TSC is applicable to study various materials, such as :
Semiconductors
Semimetals
Polymers
Plastics
Biaxial films
Polymer-clay composites
Amorphous materials.
Dynamic Mechanical Thermal Analysis (DMTA)
Defination
Characterize Visco-Elastic properties.
Storage Modulus E’ (elastic response) and Loss Modulus E’’ (viscous response) of polymers are
measured as a function of T or time as the polymer is deformed under an oscillatory load
(stress) at a controlled (programmed) T in specified atmosphere.
DMTA can be applied to determine the glass transition of polymers or the response of a
material to application and removal of a loa
Dynamic Mechanical Thermal Analysis (DMTA)
Instrument
Dynamic Mechanical Thermal Analysis (DMTA)
Principle
DMA is based on two important concepts of stress and strain.
Stress σ = F/A
Stain γ = ∆Y/Y
The modulus (E), a measure of stiffness, can be calculated from the slope of the stress-
strain plot. This modulus is dependent on temperature and applied stress.
DMA instruments apply sinusoidally oscillating stress to samples and causes sinusoidal
deformation. The relationship between the oscillating stress and strain becomes
important in determining viscoelastic properties of the material.
Stress and strain can be expressed with:
Where, σo = maximum stress applied
ω = frequency of applied stress, and t =time
Dynamic Mechanical Thermal Analysis (DMTA)
Time Scans
The temperature of the sample is held constant, and properties are measured as functions of time.
This experiment is commonly used when studying curing of thermosets, materials that change chemically upon
heating.
Data is presented graphically using modulus as a function of time; curing profiles can be derived from this
information.
Dynamic Mechanical Thermal Analysis (DMTA)
Dynamic Mechanical Thermal Analysis (DMTA)
Advantages:
Dynamic mechanical analysis is an essential analytical technique for determining the
viscoelastic properties of polymers.
Due to its use of oscillating stress, this method is able to quickly scan and calculate the
modulus for a range of temperatures.
This analytical method is able to accurately predict the performance of materials in
use.
Fast analysis time (typically 30 minutes).
Easy sample preparation.
Dynamic Mechanical Thermal Analysis (DMTA)
Applications:
Characterization of printed circuit board materials by DMA.
It finds application in Research and Development for material lifetime predictions.
Limitations:
The modulus value is very dependent on sample dimensions, which means large
inaccuracies are introduced if dimensional measurements of samples are slightly
inaccurate.
Oscillating stress converts mechanical energy to heat and changes the temperature of
the sample.