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    INSIGHTPPT

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    A Gentlemen
    The document summarizes a modified heat sink design proposed by the "INSIGHT" team. [1] The original design used square IC pads that did not maintain close contact with ICs due to manufacturing tolerances, potentially causing overheating. [2] The modified design uses circular IC pads, slots for upward/downward motion, and an hourglass spring behind each pad to maintain contact. [3] This design aims to improve heat transfer and reduce manufacturing defects in a cost-effective manner.

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    Download as PPTX, PDF, TXT or read online from Scribd

    INSIGHTPPT

    Uploaded by

    A Gentlemen
    12 views15 pages
    The document summarizes a modified heat sink design proposed by the "INSIGHT" team. [1] The original design used square IC pads that did not maintain close contact with ICs due to manufacturing tolerances, potentially causing overheating. [2] The modified design uses circular IC pads, slots for upward/downward motion, and an hourglass spring behind each pad to maintain contact. [3] This design aims to improve heat transfer and reduce manufacturing defects in a cost-effective manner.

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    The document summarizes a modified heat sink design proposed by the "INSIGHT" team. [1] The original design used square IC pads that did not maintain close contact with ICs due to manufacturing tolerances, potentially causing overheating. [2] The modified design uses circular IC pads, slots for upward/downward motion, and an hourglass spring behind each pad to maintain contact. [3] This design aims to improve heat transfer and reduce manufacturing defects in a cost-effective manner.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    12 views15 pages

    INSIGHTPPT

    Uploaded by

    A Gentlemen
    The document summarizes a modified heat sink design proposed by the "INSIGHT" team. [1] The original design used square IC pads that did not maintain close contact with ICs due to manufacturing tolerances, potentially causing overheating. [2] The modified design uses circular IC pads, slots for upward/downward motion, and an hourglass spring behind each pad to maintain contact. [3] This design aims to improve heat transfer and reduce manufacturing defects in a cost-effective manner.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    of 15

    “INSIGHT”

    TEAM- ZHCET

    TEAM MEMBERS

    PRATEEK RAKESH SINGH [email protected] 8791432018


    SONAM AGARWAL [email protected] 9045430915
    INTRODUCTION
    A simple heat sink assembly consist
    of 3 parts –
    1-pcb
    2-casing
    3-cover
    Pcb (printed circuit board ) contains
    electronics and the function of casing
    and the cover is to hold the pcb in
    place.
    Casing caries away the heat produce
    by the pcb by the ic pad through
    fabricated on it .
    Problem
    Due to non-accurate nature
    of design (manufacturing
    tolerances ) it is likely that
    ic’s don’t remain in contact
    with the ic pad and thus
    leads to serious
    consequences such as
    overheating and failure .
    Flaws in given design
    The main flaw in the given design of IC pads is
    that this design is not compact.
    Absence of any attaching material like nails may
    be the reason due to which IC pads do not remain
    intact.
    Further, there are chances of error or non
    accuracy in the dimensions of IC pads while
    manufacturing.
    Modified design
    In our design we have changed the square shaped IC pads to
    circular. As in the manufacturing of a square we have to set four
    dimensions. So the error in manufacturing will be four times.
    However if we make the IC pads circular then we have to set only
    the radius of the circle. Thus whatever error will be caused that
    will only be due to the error in the radius.

    To minimize the chances of misplace of IC pads we have


    fabricated slots in our design and attached a nail at the bottom
    so as to restrict the movement of IC pads in the horizontal
    direction.

    (cond.)
    We have changed the design of
    the square ic pad
    Slots are made to make the
    upward and downward
    motion of ic pad easy as we
    were using spring at it’s back
    and to make design more
    compact
    Initially our design of ic pad
    was circular as shown in
    picture .

    Further we have make the edges of circular ic pad


    and cut out rectangular small block so that they
    cut the air when they will move upward and
    downward and thus make the upward and
    downward motion easy .
    Spring at the back of ic’s pad
    To make our design more
    efficient we have attached an
    hourglass spring to IC’s pad.

    The use of hourglass springs


    helps the IC pads to remain
    intact with the IC’S on PCB .

    How good the manufacturing be


    there always remain defect and
    we never have the accurate size
    of ic pad so there is gap b/w the
    ic and ic pad the and thus
    reducing the heat transfer.
    (Cond.)
    (cond.)

    This manufacturing defect can be reduce by using spring .


    This spring will push the ic pad if there a gap b/w ic and ic pad
    occur . Thus the contact b/w ic and ic pad will maintain and
    proper heat transfer will occur.

    Further , We have used hourglass


    spring instead of normal spring so
    as to increase the contact surface
    area which ensures maximum heat
    transfer.
    PURPOSE OF MAKING SLOTS

    The purpose of making semi


    circular slots in the design is
    to make the upward and
    downward motion of the ic
    pad easy as it will easily cut
    air .
    PURPOSE OF MAKING SLOTS(cond.)

    R
    TE D THE
    BE INSER
    AIL CAN
    E D HERE N
    T
    I L IS INSER
    AS NA

    Hole to insert the nail can be made on the depth of each ic pad in the slots
    made which will make structure more compact and pcb will remain intact
    because of the nail . Nail will restrict the downward motion of the pcb the
    reducing chance of gap contact b/w ic’s and ic pad
    PORPOSE OF MAIKING THE RECTANGULAR BLOCK IM IC PAD

    THE RECTANGULAR
    BLOCK CUT OUT WILL CUT
    THE AIR THUS THE
    MOTION GIVEN TO IC PAD
    BY COMPRESSION AND
    EXTENSION OF SPRING
    WILL BE EASY AND FAST
    COSTEFFECTIVE

    WE HAVE JUST MODIFY THE DESIGN OF THE IC PAD


    WITHOUT ADDIND ANY OTHER DEVICE THUS THE PRICE OF
    OUR NEW DESIGN WILL NOT BE MUCH , AND WE HAVE
    USED THE SIMPLE AND CHEP THINGH LIKE SPRING TO
    REDUCE THE MANUFACTURING COST . THUS OUR
    PURPOSED DESIGN IS COSTEFFECTIVE .
    “THANK YOU”

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