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    Analog and Digital VLSI Design: Lecture 6: Manufacturing Process

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    Yash Gupta
    The document summarizes the key steps in the CMOS manufacturing process, including p-well formation using a photolithography process with a p-well mask, deposition of polysilicon and oxide layers, ion implantation, and formation of transistors and contacts using multiple photolithography steps with different masks. It concludes by showing the layout of a CMOS inverter with polysilicon, diffusion regions, metal, and vias.

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    Analog and Digital VLSI Design: Lecture 6: Manufacturing Process

    Uploaded by

    Yash Gupta
    11 views37 pages
    The document summarizes the key steps in the CMOS manufacturing process, including p-well formation using a photolithography process with a p-well mask, deposition of polysilicon and oxide layers, ion implantation, and formation of transistors and contacts using multiple photolithography steps with different masks. It concludes by showing the layout of a CMOS inverter with polysilicon, diffusion regions, metal, and vias.

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    Lect 6

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    The document summarizes the key steps in the CMOS manufacturing process, including p-well formation using a photolithography process with a p-well mask, deposition of polysilicon and oxide layers, ion implantation, and formation of transistors and contacts using multiple photolithography steps with different masks. It concludes by showing the layout of a CMOS inverter with polysilicon, diffusion regions, metal, and vias.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    11 views37 pages

    Analog and Digital VLSI Design: Lecture 6: Manufacturing Process

    Uploaded by

    Yash Gupta
    The document summarizes the key steps in the CMOS manufacturing process, including p-well formation using a photolithography process with a p-well mask, deposition of polysilicon and oxide layers, ion implantation, and formation of transistors and contacts using multiple photolithography steps with different masks. It concludes by showing the layout of a CMOS inverter with polysilicon, diffusion regions, metal, and vias.

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    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
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    Analog and Digital VLSI Design

    EEE F313/INSTR F313

    Lecture 6: Manufacturing Process


    Simplified CMOS Process Flow

    N-Substrate P-well
    P-well Process
    N-well Process ? Dual Well Process ?
    Layout

    p well Cross Section

    Layout
    Layouts
    Layout of an inverter
    Layouts
    Stick Diagram
    Polysilicon
    P diffusion
    n diffusion
    Metal 1
    Metal Via
    Layouts
    Stick Diagram
    Polysilicon
    P diffusion
    n diffusion
    Metal 1
    Metal Via
    Photolithography
    optical
    oxidation mask

    stepper
    exposure
    photoresist photoresist coating
    removal (ashing)

    photoresist
    development

    process
    step

    spin, rinse, acid etch


    dry
    P- Well Mask
    Light Exposure
    Photoresist Development
    Acid Etching
    Photo Resist Removal
    Ion implantation and diffusion
    Active Mask
    Thin oxide layer
    Poly silicon layer deposition
    Transistor Formation
    N+ select mask
    P+ select mask
    Contact mask
    Metal mask
    CMOS inverter

    Via

    p well

    Layout
    CMOS inverter

    P Diffusion Region N Diffusion Region

    p well

    Layout

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