Hi-Sincerity: Microelectronics Corp

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HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6413


Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 1/4

HBC327
PNP EPITAXIAL PLANAR TRANSISTOR

Description
This HBC327 is designed for driver and output-stages of audio
amplifiers.

Features

TO-92

High DC Current Gain: 100-600 at IC=100mA,VCE=1V


Complementary to HBC337

Absolute Maximum Ratings


Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 C
Junction Temperature .................................................................................... +150 C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25C) ................................................................................ 625 mW
Maximum Voltages and Currents (Ta=25C)
VCBO Collector to Base Voltage ........................................................................................ -50 V
VCEO Collector to Emitter Voltage ..................................................................................... -45 V
VEBO Emitter to Base Voltage ............................................................................................. -5 V
IC Collector Current ...................................................................................................... -500 mA

Characteristics (Ta=25C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*hFE1
*hFE2
*VCE(sat)1
VBE(on)
fT
Cob

Min.
-50
-45
-5
100
40
-

Typ.
100
4

Max.
-100
-100
600
-0.7
-1.2
-

Unit
V
V
V
nA
nA

V
V
MHZ
PF

Test Conditions
IC=-100uA, IE=0
IC=-10mA, IB=0
IE=-100uA, IC=0
VCB=-30V, IE=0
VEB=-5V, IC=0
VCE=-1V, IC=-100Ma
VCE=-1V, IC=-300mA
IC=-500mA, IB=-50mA
VCE=-1V, IC=-300mA,
VCE=-5V, IC=-10mA, f=100MHZ
VCB=-10V, f=1MHZ, IC=0

*Pulse Test: Pulse Width 380us, Duty Cycle2%

Classification of hFE1
Rank
Range

HBC327

16
100-250

25
160-400

40
250-600

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6413


Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 2/4

MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current

Saturation Voltage & Collector Current

1000

1000

Saturation Voltage (mV)

VCE(sat) @ IC=10IB

hFE

125 C

100

25 C

75 C

100

125 C
o

25 C

hFE @ VCE=1V

75 C
10

10
1

10

100

0.1

1000

10

100

1000

Collector Current-IC (mA)

Collector Current-IC (mA)

ON Voltage & Collector Current

Cutoff Frequency & Collector Current

1000

1000
o

Cutoff Frequency (MHz)...

ON Voltage (mV)

25 C

75 C
o

125 C

VCE=5V
100

VBE(ON) @ VCE=1V

10

100
0.1

10

100

1000

10

Collector Current-IC (mA)

100

Capacitance & Reverse-Biased Voltage

Safe Operating Area

100

10000

Collector Current-IC (mA)

PT=100ms

Capacitance (pF)

1000

Collector Current (mA)

Cob
10

PT=1ms

1000
PT=1s

100

10

1
0.1

10

Reverse Biased Voltage (V)

HBC327

100

10

100

Forward Voltage-VCE (V)

HSMC Product Specification

HI-SINCERITY
MICROELECTRONICS CORP.

Spec. No. : HE6413


Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 3/4

PD-Ta
700

Power Dissipation-PD (mW)

600
500
400
300
200
100
0
0

50

100

150

200

Ambient Temperature-Ta ( C)

HBC327

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6413


Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 4/4

MICROELECTRONICS CORP.
TO-92 Dimension
2

Marking:
H
BC
3 2 7

B
1

3
Date Code

Control Code

3
Style: Pin 1.Collector 2.Base 3.Emitter

H
I

E
F

3-Lead TO-92 Plastic Package


HSMC Package Code: A
*: Typical

Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480

DIM
A
B
C
D
E
F

Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76

DIM
G
H
I
1
2
3

Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5
*2
*2

Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5
*2
*2

Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:


Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931

HBC327

HSMC Product Specification

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