Hi-Sincerity: Microelectronics Corp
Hi-Sincerity: Microelectronics Corp
Hi-Sincerity: Microelectronics Corp
MICROELECTRONICS CORP.
HBC327
PNP EPITAXIAL PLANAR TRANSISTOR
Description
This HBC327 is designed for driver and output-stages of audio
amplifiers.
Features
TO-92
Characteristics (Ta=25C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*hFE1
*hFE2
*VCE(sat)1
VBE(on)
fT
Cob
Min.
-50
-45
-5
100
40
-
Typ.
100
4
Max.
-100
-100
600
-0.7
-1.2
-
Unit
V
V
V
nA
nA
V
V
MHZ
PF
Test Conditions
IC=-100uA, IE=0
IC=-10mA, IB=0
IE=-100uA, IC=0
VCB=-30V, IE=0
VEB=-5V, IC=0
VCE=-1V, IC=-100Ma
VCE=-1V, IC=-300mA
IC=-500mA, IB=-50mA
VCE=-1V, IC=-300mA,
VCE=-5V, IC=-10mA, f=100MHZ
VCB=-10V, f=1MHZ, IC=0
Classification of hFE1
Rank
Range
HBC327
16
100-250
25
160-400
40
250-600
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
1000
VCE(sat) @ IC=10IB
hFE
125 C
100
25 C
75 C
100
125 C
o
25 C
hFE @ VCE=1V
75 C
10
10
1
10
100
0.1
1000
10
100
1000
1000
1000
o
ON Voltage (mV)
25 C
75 C
o
125 C
VCE=5V
100
VBE(ON) @ VCE=1V
10
100
0.1
10
100
1000
10
100
100
10000
PT=100ms
Capacitance (pF)
1000
Cob
10
PT=1ms
1000
PT=1s
100
10
1
0.1
10
HBC327
100
10
100
HI-SINCERITY
MICROELECTRONICS CORP.
PD-Ta
700
600
500
400
300
200
100
0
0
50
100
150
200
Ambient Temperature-Ta ( C)
HBC327
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
2
Marking:
H
BC
3 2 7
B
1
3
Date Code
Control Code
3
Style: Pin 1.Collector 2.Base 3.Emitter
H
I
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
1
2
3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5
*2
*2
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5
*2
*2
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBC327