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SEMICONDUCTOR TECHNICAL DATA by MOCZ500/D

GlobalOptoisolator
  
Motorola Preferred Device

  
This device consists of a gallium arsenide infrared emitting diode optically OPTOISOLATOR
coupled to a zero–cross triac circuit and a power triac. It is capable of driving ZERO CROSS
loads up to 500 mA rms on AC voltages from 20 to 280 V rms. TRIAC OUTPUT
• Provides Normally Open AC Output with 500 mA Rating @ 40_C
• Small Outline, Standard 6–PIN DIP Package
• Simplified Logic Control of 240 Vac Power
• High Input–Output Isolation of 7500 Vac (rms)
• 7 Amp Single Cycle Surge Capability
• Wide Load Power Factor Range 0.1–1
• Low Input/Output Capacitance

Applications:
CASE 730J–01
• Logic to AC Line Interface • Appliance Solenoids STYLE 1
• Microprocessor to AC Line Peripheral • Appliance Actuators
• Industrial Controls • Appliance Fan Motors
• EM Relays and Contactors • Appliance Lights
• Small AC Motor Drives
• Incandescent Lamp Drive
PINOUT
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
1 6 1. LED Anode
Rating Symbol Value Unit 2. LED Cathode
3. Not Connected
INPUT LED 2 4. MT2
MOCZ500 6. MT1
Reverse Voltage VR 6 V 3 4
Connected to
Forward Current — Continuous IF 50 mA Internal Triac
Heat Spreader
OUTPUT TRIAC
Off–State Output Terminal Voltage (1) VDRM 600 V
Peak Repetitive Surge Current (1 Cycle) ITSM 7 A
Main Terminal Fusing Current (t = 8.3 ms) I2T 0.4 A2sec
On–State Current Range IT(rms) 0.030 to 0.500 A COUPLER
SCHEMATIC
Load Power Factor Range pF 0.1 – 1.0 —
TOTAL DEVICE LED Drive Triac
6
Isolation Surge Voltage (2) VISO 7500 Vac(pk) 1 MT1
Anode
Total Power Dissipation @ TA = 40°C PD 600 mW
(Device Soldered on PCB) 2 4
Cathode *
MT2
Junction Temperature Range TJ – 40 to +125 °C
* ZERO VOLTAGE
Ambient Operating Temperature Range TA – 40 to +85 °C * ACTIVATION
Ambient Operating Relative Humidity @ TA = 85°C RHA 85 %
Storage Temperature Range Tstg – 40 to +125 °C
Soldering Temperature (10 sec) TL 260 °C
1. Test voltages must be applied within dv/dt rating.
2. Input–Output isolation voltage, VISO. is an internal device dielectric breakdown rating. For this test,
pins 1 and 2 are common and pins 4 and 6 are common.
Preferred devices are Motorola recommended choices for future use and best overall value.

REV 2

Motorola Optoelectronics
Motorola, Inc. 1997 Device Data 1
MOCZ500
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction to Air RθJA 130 _C/W
(Device Soldered on PCB)
Thermal Resistance, Junction to Case (Pin 4) RθJC 40 _C/W
(Device Soldered on PCB)

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit
INPUT LED
Reverse Leakage Current (VR = 6 V) IR — 0.05 100 µA
Forward Voltage (IF = 10 mA) VF — 1.2 1.5 V
OUTPUT TRIAC
Leakage with LED Off @ TA = 85°C IDRM — — 100 µA
(VDRM = 600 V)
Critical Rate of Rise of Off–State Voltage (Static) (1) dv/dt(s) — 2,000 — V/µs
(Vp = 400 V)
LED On, Driver Holding Current IH1 — 150 500 µA
COUPLED
LED Trigger Current Required to Latch Output (2) (3) IFT(on) — — 10 mA
(Main Terminal Voltage = 5 V)
On–State Voltage (IT = 500 mA) VTM — 1.2 1.5 V
Inhibit Voltage (IF = IFT) VINH — 10 20 V
Commutating dv/dt dv/dt (c) 10 — — V/µs
Common–Mode Input–Output dv/dt dv/dt (cm) 40,000 — — V/µs
Input–Output Capacitance CISO — — 1 pF
Isolation Resistance @ 500 Vdc RISO 1012 — — Ohms
1. Additional dv/dt information, including test methods, can be found in Motorola applications note AN1048/D, Figure 40.
2. All devices are guaranteed to trigger at as IF value less than or equal to the max IFT. Therefore, the recommended operating IF lies between
the device’s maximum IFT(on) limit and the Maximum Rating of 60 mA.
3. Current–limiting resistor required in series with LED.

ENVIRONMENTAL TEST REQUIREMENTS

Test Test Conditions
Autoclave TA = 121°C, RH = 100%, P = 15 PSIG, 48 Hr.
Moisture Resistance Mil–Std–883, Method 1004
Temp Cycle TA = –40/+125°C, Air to Air, Dwell w15 min., Transfer v5 min., 200 Cycles
Resistance to Solder Heat Mil–Std–750, Method 2031, 260°C followed by VISO
Lead Pull Mil–Std–750, Method 2036, Condition A, 2 lbs., 1 min.

LIFE TEST REQUIREMENTS

Test Conditions
Test Environment Bias Duration
High Temperature, Reverse Bias TA = +100°C VTM = 280 Vac 1000 Hr.
High Humidity, High Temperature, Reverse Bias TA = +85°C VTM = 100 Vdc 500 Hr.
RH = 85% Pin 4 = +
Pin 6 = –
Intermittent Operating Life ton = 2 min. IF = 50 mA 1000 Hr.
toff = 2 min. ITM = 60 mA
TA = +25°C
ESD Human Body Model & Machine Models 1 & 2 N/A N/A

2 Motorola Optoelectronics Device Data

 MOCZ500
TYPICAL ELECTRICAL CHARACTERISTICS

60 1.8
IF, FORWARD LED CURRENT (mA)

50
1.6

VF, FORWARD VOLTAGE (V)

40
1.4
30
TA = – 40°C
1.2 25°C
20

10 1 85°C

0 0.8
– 40 – 20 0 20 40 60 80 100 1 10
TA, AMBIENT TEMPERATURE (°C) IF, FORWARD CURRENT (mA)

Figure 1. Maximum Allowable Forward LED Figure 2. LED Forward Voltage versus LED
Current versus Ambient Temperature Forward Current
IT = IT Max

14 500
IFT, FORWARD TRIGGER CURRENT (mA)

12
IT, TERMINAL CURRENT (mA) 400
GUARANTEED
10
300
8
200
6
TYPICAL
100
4

2 0
– 40 – 20 0 20 40 60 80 100 – 40 – 20 0 20 40 60 80 100
TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)

Figure 3. Forward Trigger Current versus Figure 4. RMS ON–State Current versus
Ambient Temperature Ambient Temperature

1.4 10
V TM, MAIN TERMINAL VOLTAGE (V)

1.3
IDRM , LEAKAGE CURRENT (µA)

1
1.2

1.1 TA = – 40°C 0.1

1
25°C 0.01
0.9 85°C

0.8 0.001
0.01 0.1 1 – 40 – 20 0 20 40 60 80 100
ITM, MAIN TERMINAL CURRENT (A) TA, AMBIENT TEMPERATURE (°C)

Figure 5. Main Terminal Voltage versus Main Figure 6. Typical Leakage Current versus
Terminal Current Ambient Temperature

Motorola Optoelectronics Device Data 3

MOCZ500
TYPICAL ELECTRICAL CHARACTERISTICS (continued)
300 11.5

250 11
IH, HOLDING CURRENT (µA)

VIH, INHIBIT VOLTAGE (V)

200 10.5

150 10

100 9.5

50 9
– 40 – 20 0 20 40 60 80 100 – 40 – 20 0 20 40 60 80 100
TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)

Figure 7. Holding Current versus Figure 8. Inhibit Voltage versus

Ambient Temperature Ambient Temperature

APPLICATION CONSIDERATIONS
Input Drive Circuit
The MOCZ500 SSR is guaranteed to trigger with an input VCC
current of 10 mA at 25°C. This trigger current increases with
lower ambient temperatures as shown on Figure 3 Forward
Trigger Current (IFT) versus Ambient Temperature. R1
When the input drive circuit is capable to supply the MOCZ500
MOCZ500 input LED trigger current, only a current limiting
resistor in series with the LED is required. TTL, DTL and
microcontrollers with enhanced current capability output
ports are able to meet this requirement.
Most CMOS logic circuits and Microcontroller output R2
Vin Q1
ports are not rated to sink or source currents required to
trigger the MOCZ500. In this case a drive circuit is required
as shown in Figure 10 or a TTL buffer interface circuit as
shown in Figure 9.
Figure 10. Noninverting Discrete NPN Buffer
VCC and Level Shifter
VCC
R1

R1
LOAD
MOCZ500
TTI/DTL
µP
R1 for VCC (low) 4.5 V, IFT = 10 mA, VF LED = 1.2 V, VOL = 0.5 V Rs
R1 = (4.5 V – 1.2 V – 0.5 V): 10 mA = 280 Ω AC LINE
Choose 270 Ω Cs
Figure 9. Input Drive Circuit R2
Q1

Snubber Circuit
Snubberless operation of resistive loads is possible, but
snubbers are recommended for all applications. A typical ap-
plication is shown in Figure 11. The snubber attenuates the
Buffer Circuit
high kickback voltages and commutating dv/dt generated by R1 = (VCC – VFLED – Vsat Q1): IF MOCZ500
inductive loads during the turn off of the SSR. It also protects R2 = 10 kΩ
the SSR from line transients generated elsewhere within the Q1 = General Purpose Trans. NPN
equipment (for example inductive loads switched by me- Typical Snubber circuit:
chanical contacts such as relays manual on/off switches etc.) For inductive and resistive loads Rs = 45 Ω Cs = 0.01 µF
or outside the equipment such as air conditioners, electrical
heaters and motors. Figure 11. Typical Application with an µP Output Buffer

4 Motorola Optoelectronics Device Data

 MOCZ500
Snubbers are also necessary to pass noise immunity tests At operating currents below the minimum specified value
such as IEC1000 4–4 for fast transients. In this test fast rising the Power triac remains in the off state and the triac driver
high voltage spikes are superimposed onto the line voltage carries the current. This may cause a problem, because the
to simulate AC line transients. triac driver has a significant lower commutating dv/dt than
Switching Loads with Currents Below the Minimum the power triac. For loads below 30 mA AC rms a snubber is
Current Rating mandatory. Evaluations with various low current inductive
The MOCZ500 is capable to switch any inductive or resis- and resistive loads concluded that a snubber of R = 100 Ω
tive load within its rating of minimum 30 mA and a maximum and C = 10 nF is sufficient.
of 500 mA RMS.

PAD FOR POWER

DISSIPATION

ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
CREEPAGE AND CLEARANCE
DISTANCE FOR SAFE ISOLATION

ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
(8mm FOR APPLIANCES)

ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓ
ENLARGED PAD FOR
IMPROVED POWER

ÓÓÓÓÓÓÓÓ
DISSIPATION

ÓÓÓÓÓÓÓÓ
ÓÓÓÓÓÓÓÓ CREEPAGE AND CLEARANCE
DISTANCE FOR FUNCTIONAL
ISOLATION
(3.5mm APPLIANCES JAPAN)

Figure 12.

Motorola Optoelectronics Device Data 5

MOCZ500
Thermal Considerations between input and output and functional isolation creepage
Heat generated inside the MOCZ500’s power triac is and clearance distances between the AC output pins.
transferred through the leads to the circuit board where it is Many equipment standards demand a creepage and clear-
dissipated. It is therefore important to solder all leads to the ance distance between input and output circuit of 8mm and a
circuit board. Pin 4 is thermally and electrically direct con- thickness through insulation of 0.4mm (16 mil). All Motorola
nected to the Power triac and carries the highest amount of Optocouplers do meet the thickness through insulation re-
thermal energy. For loads which approach the maximum cur- quirement. Product with lead bend option “T” meets the
rent rating of the SSR it is advisable to layout the pad size for creepage path requirement. The most stringent requirement
pin 4 as large as possible. See Figure 12 which considers for creepage and clearance between the AC output pins is
thermal and Regulatory requirements on a PCB. 3.5mm. Figure 12 shows a PCB pattern layout which meets
Regulatory Safety Considerations the regulatory requirements for 115 Vrms and 240 Vrms sup-
The MOCZ500 is designed to meet the National and ply line applications.
International Regulatory requirements for safe isolation

OUTLINE DIMENSIONS

NOTES:
–A– 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
6 4 3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–B–
INCHES MILLIMETERS
1 3 DIM MIN MAX MIN MAX
A 0.320 0.350 8.13 8.89
C B 0.240 0.260 6.10 6.60
F 4 PL N L C 0.115 0.200 2.93 5.08
D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
F 0.010 0.014 0.25 0.36
G 0.100 BSC 2.54 BSC
J 0.008 0.012 0.21 0.30
–T– SEATING K K 0.100 0.150 2.54 3.81
PLANE
L 0.300 BSC 7.62 BSC
J 5 PL M 0_ 15 _ 0_ 15_
G N 0.015 0.100 0.38 2.54
M 0.13 (0.005) M T B M A M
E 5 PL
D 5 PL STYLE 1:
PIN 1. LED ANODE
0.13 (0.005) M T A M B M 2. LED CATHODE
3. NC
4. MAIN TERMINAL
5. ABSENT
6. MAIN TERMINAL

CASE 730J–01
ISSUE O

6 Motorola Optoelectronics Device Data

 MOCZ500
OUTLINE DIMENSIONS (continued)

–A– NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
6 4 3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–B–
1 3 INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 8.13 8.89 0.320 0.350
B 6.10 6.60 0.240 0.260
C 2.93 5.08 0.115 0.200
D 0.41 0.50 0.016 0.020
E 1.02 1.77 0.040 0.070
F 4 PL
N L
F 0.25 0.36 0.010 0.014
C G 2.54 BSC 0.100 BSC
J 0.21 0.30 0.008 0.012
K 2.54 3.81 0.100 0.150
L 10.16 10.80 0.400 0.425
N 0.38 1.02 0.015 0.040
–T– SEATING
PLANE K STYLE 1:
PIN 1. LED ANODE
G 2. LED CATHODE
E 5 PL 3. NC
D 5 PL J 4. MAIN TERMINAL
5. ABSENT
0.13 (0.005) M T A M B M 6. MAIN TERMINAL

CASE 730K–01
ISSUE O

–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
6 4 Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
–B– S
INCHES MILLIMETERS
1 3 DIM MIN MAX MIN MAX
A 0.320 0.350 8.13 8.89
B 0.240 0.260 6.10 6.60
C 0.115 0.200 2.93 5.08
D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
F 0.010 0.014 0.25 0.36
F 4 PL
H L G 0.100 BSC 2.54 BSC
C H 0.020 0.025 0.51 0.63
J 0.008 0.012 0.20 0.30
K 0.006 0.035 0.16 0.88
L 0.320 BSC 8.13 BSC
S 0.332 0.390 8.43 9.90
–T–
G
E 5 PL
J SEATING
PLANE STYLE 1:
K 5 PL PIN 1. LED ANODE
0.13 (0.005) M T B M A M 2. LED CATHODE
D 5 PL 3. NC
4. MAIN TERMINAL
0.13 (0.005) M T A M B M 5. ABSENT
6. MAIN TERMINAL

CASE 730L–01
ISSUE A

Motorola Optoelectronics Device Data 7

MOCZ500

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8 ◊ MOCZ500/D
Motorola Optoelectronics Device Data
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